Goodram IR-XR3000D464L16S-8G Service Manual

MEMORY MODULE

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Product Sheet | IRDM X | V1.0 | © Wilk Elektronik S.A. - GOODRAM

IR-XR 3000 D4 64 L16 S 8G

IRDM X RED

DDRIV MODULE
PART NUMBERING
SYSTEM

SPEED / DATA TRANSFER 3000Mhz / PC4-24000

MODULE TYPE DDR4 SDRAM DIMM

MODULE DATA WIDTH 64

CAS LATENCY 16

SINGLE RANK

MODULE DENSITY 8GB

PART NUMBER

IR-XR3000D464L16S/8G

MODULE TYPE

DDR4 SDRAM DIMM

MODULE DENSITY

8GB

MODULE DATA WIDTH

64

DRAM COMPONENT ORAGNIZATION

1024Mx8

NUMBER OF DRAM COMPONENTS

8 NUMBER OF MODULE RANKS

1 NUMBER OF MODULE SIDES

1

REGISTERED

NO

ECC SUPPORT

NO PIN COUNT

288 PIN

SUPPLY VOLTAGE

1,2V-1,35V

INTERFACE

PSEUDO OPEN DRAIN 1.2V (POD12)

CAS LATENCY

16 RAS# TO CAS# DELAY, tRCD

18 ROW PRECHARGE TIME, tRP

18 ACTIVE TO PRECHARGE TIME, tRAS

36

PCB TYPE

DDR4 SDRAM DIMM

BOARD DIMENSIONS

133,35 x 31,25mm ± 0,1mm

BOARD THICKNESS

1,4mm ± 0,1mm

DRAM PACKAGE INFORMATION

FBGA, x8bit

CONTACT PADS (PIN)

GOLD PLATED

MEMORY MODULE

GOODRAM zastrzega prawo do zmian w specyfikacji i opisach produktu w każdej chwili bez uprzedniej informacji.
Product Sheet | IRDM X | V1.0 | © Wilk Elektronik S.A. - GOODRAM

Byte

Description

HEX

DEC

0

Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage 1 2

0x23

35

1

SPD Revision

0x11

17

2

Key Byte / DRAM Device Type

0x0c

12 3 Key Byte / Module Type

0x02

2 4 SDRAM Density and Banks

0x85

133

5

SDRAM Addressing

0x21

33

6

SDRAM Package Type

0x00

0

7

SDRAM Optional Features

0x08

8 8 SDRAM Thermal and Refresh Options

0x00

0 9 Other SDRAM Optional Features

0x40

64

10

Reserved -- must be coded as 0x00

0x00

0

11

Module Nominal Voltage, VDD

0x03

3

12

Module Organization

0x01

1

13

Module Memory Bus Width

0x03

3

14

Module Thermal Sensor

0x00

0

15

Extended module type

0x00

0

16

Reserved -- must be coded as 0x00

0x00

0

17

Timebases

0x00

0

18

SDRAM Minimum Cycle Time (tCKAVGmin)

0x06

6

19

SDRAM Maximum Cycle Time (tCKAVGmax)

0x0d

13

20

CAS Latencies Supported, First Byte

0xf8

248

21

CAS Latencies Supported, Second Byte

0x3f

63

22

CAS Latencies Supported, Third Byte

0x00

0

23

CAS Latencies Supported, Fourth Byte

0x00

0

24

Minimum CAS Latency Time (tAAmin)

0x6e

110

25

Minimum RAS to CAS Delay Time (tRCDmin)

0x6e

110

26

Minimum Row Precharge Delay Time (tRPmin)

0x6e

110

27

Upper Nibbles for tRASmin and tRCmin

0x11

17

28

Minimum Active to Precharge Delay Time (tRASmin), Least Significant Byte

0x00

0

29

Minimum Active to Active/Refresh Delay Time (tRCmin), Least Significant Byte

0x6e

110

30

Minimum Refresh Recovery Delay Time (tRFC1min), LSB

0xf0

240

31

Minimum Refresh Recovery Delay Time (tRFC1min), MSB

0x0a

10

32

Minimum Refresh Recovery Delay Time (tRFC2min), LSB

0x20

32

33

Minimum Refresh Recovery Delay Time (tRFC2min), MSB

0x08

8

34

Minimum Refresh Recovery Delay Time (tRFC4min), LSB

0x00

0

35

Minimum Refresh Recovery Delay Time (tRFC4min), MSB

0x05

5

36

Minimum Four Activate Window Time (tFAWmin), Most Significant Nibble

0x00

0

37

Minimum Four Activate Window Time (tFAWmin), Least Significant Byte

0xa8

168

38

Minimum Activate to Activate Delay Time (tRRD_Smin), different bank group

0x18

24

39

Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank group

0x28

40

40

Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group

0x28

40

41-59

Reserved -- must be coded as 0x00

0x00

0