Goodram IR-W2400D464L15S-16GDC Technical data

MEMORY MODULE

IR-W 2400 D4 64 L15 S 16GDC

GOODRAM IRDM WHITE

DDRIV MODULE PART
NUMBERING SYSTEM

SPEED / DATA TRANSFER 2400MHz / PC4-19200

MODULE TYPE DDR4 SDRAM DIMM

MODULE DATA WIDTH 64

CAS LATENCY 15

SINGLE RANK

MODULE DENSITY 16GB DUAL CHANNEL

PART NUMBER

IR-W2400D464L15S/16GDC

MODULE TYPE

DDR4 SDRAM DIMM

MODULE DENSITY

2x8GB

MODULE DATA WIDTH

64

DRAM COMPONENT ORAGNIZATION

1024Mx8

NUMBER OF DRAM COMPONENTS

8 NUMBER OF MODULE RANKS

1 NUMBER OF MODULE SIDES

1

REGISTERED

NO

ECC SUPPORT

NO

PIN COUNT

288 PIN

SUPPLY VOLTAGE

1,2V INTERFACE

PSEUDO OPEN DRAIN 1.2V (POD12)

CAS LATENCY

15 RAS# TO CAS# DELAY, tRCD

15 ROW PRECHARGE TIME, tRP

15 ACTIVE TO PRECHARGE TIME, tRAS

38

PCB TYPE

DDR4 SDRAM DIMM

BOARD DIMENSIONS

133,35 x 31,25mm ± 0,1mm

BOARD THICKNESS

1,4mm ± 0,1mm

DRAM PACKAGE INFORMATION

FBGA, x8bit

CONTACT PADS (PIN)

GOLD PLATED

GOODRAM may make changes to specifications and product descriptions at any time, without notice.
Product Sheet | IRDM | V0.1 | © Wilk Elektronik SA – GOODRAM

MEMORY MODULE

Byte

Description

HEX

DEC

0

Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage 1 2

0x23

35

1

SPD Revision

0x11

17

2

Key Byte / DRAM Device Type

0x0c

12 3 Key Byte / Module Type

0x02 2 4

SDRAM Density and Banks

0x85

133

5

SDRAM Addressing

0x21

33

6

SDRAM Package Type

0x00 0 7

SDRAM Optional Features

0x08 8 8

SDRAM Thermal and Refresh Options

0x00 0 9

Other SDRAM Optional Features

0x60

96

10

Reserved -- must be coded as 0x00

0x00 0 11

Module Nominal Voltage, VDD

0x03 3 12

Module Organization

0x01 1 13

Module Memory Bus Width

0x03 3 14

Module Thermal Sensor

0x00 0 15

Extended module type

0x00 0 16

Reserved -- must be coded as 0x00

0x00 0 17

Timebases

0x00 0 18

SDRAM Minimum Cycle Time (tCKAVGmin)

0x07 7 19

SDRAM Maximum Cycle Time (tCKAVGmax)

0x0c

12

20

CAS Latencies Supported, First Byte

0xfc

252

21

CAS Latencies Supported, Second Byte

0x03 3 22

CAS Latencies Supported, Third Byte

0x00 0 23

CAS Latencies Supported, Fourth Byte

0x00 0 24

Minimum CAS Latency Time (tAAmin)

0x64

100

25

Minimum RAS to CAS Delay Time (tRCDmin)

0x64

100

26

Minimum Row Precharge Delay Time (tRPmin)

0x64

100

27

Upper Nibbles for tRASmin and tRCmin

0x11

17

28

Minimum Active to Precharge Delay Time (tRASmin), Least Significant Byte

0x00 0 29

Minimum Active to Active/Refresh Delay Time (tRCmin), Least Significant Byte

0x64

100

30

Minimum Refresh Recovery Delay Time (tRFC1min), LSB

0xf0

240

31

Minimum Refresh Recovery Delay Time (tRFC1min), MSB

0x0a

10

32

Minimum Refresh Recovery Delay Time (tRFC2min), LSB

0x20

32

33

Minimum Refresh Recovery Delay Time (tRFC2min), MSB

0x08 8 34

Minimum Refresh Recovery Delay Time (tRFC4min), LSB

0x00 0 35

Minimum Refresh Recovery Delay Time (tRFC4min), MSB

0x05 5 36

Minimum Four Activate Window Time (tFAWmin), Most Significant Nibble

0x00 0 37

Minimum Four Activate Window Time (tFAWmin), Least Significant Byte

0xa8

168

38

Minimum Activate to Activate Delay Time (tRRD_Smin), different bank group

0x1e

30

39

Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank group

0x2b

43

40

Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group

0x2b

43

41-59

Reserved -- must be coded as 0x00

0x00

0

GOODRAM may make changes to specifications and product descriptions at any time, without notice.
Product Sheet | IRDM | V0.1 | © Wilk Elektronik SA – GOODRAM