Good Display GDON0129RGW User Manual

1.29 inch
GOOD DISPLAY
OLED Display Series
GDON0129RGW
Dalian Good Display Co., Ltd.
GDON0129RGW
GOOD DISPLAY
RReevviisseedd HHiissttoorryy
Part Number Revision Revision Content Revised on
GDON0129RGW 1.0 New 20190902
www.good-display.com 1.29 inch Series
i
GDON0129RGW
GOOD DISPLAY
CCoonntteenntts
RReevviissiioonn HHiissttoorry CCoonntteenntts
11.. BBaassiicc SSppeecciiffiiccaattiioonns
1.1 Display Specifications .................................................................................................................... 1
1.2 Mechanical Specifications ............................................................................................................... 1
1.3 Active Area / Memory Mapping & Pixel Construction ........................................................................ 1
1.4 Mechanical Drawing ....................................................................................................................... 2
1.5 Pin Definition ................................................................................................................................ 3
1.6 Block Diagram ............................................................................................................................... 5
22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggs
Optics & EElleeccttrriiccaall CChhaarraacctteerriissttiiccss ....................................................................................... 8~16
33..
3.1 Optics Characteristics .................................................................................................................... 8
3.2 DC Characteristics ......................................................................................................................... 8
3.3 AC Characteristics ................................................................................................................... 9~16
44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioon
4.1 Commands ................................................................................................................................. 17
4.2 Power down and Power up Sequence ........................................................................................... 17
4.3 Reset Circuit ............................................................................................................................... 17
4.4 Actual Application Example .................................................................................................... 18~27
55.. RReelliiaabbiilliitty
5.1 Contents of Reliability Tests ......................................................................................................... 26
5.2 Failure Check Standard ................................................................................................................ 26
66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonns
6.1 Environment Required ................................................................................................................. 27
6.2 Sampling Plan ............................................................................................................................. 27
6.3 Criteria & Acceptable Quality Level ......................................................................................... 27~30
77.. PPaacckkaaggee SSppeecciiffiiccaattiioonns
88.. PPrreeccaauuttiioonnss WWhheenn UUssiinngg TThheessee OOEELL DDiissppllaayy MMoodduullees
8.1 Handling Precautions ................................................................................................................... 32
8.2 Storage Precautions..................................................................................................................... 33
8.3 Designing Precautions ................................................................................................................. 33
8.4 Precautions when disposing of the OEL display modules ................................................................ 33
8.5 Other Precautions.................................................................................................................. 33~34
s
y ................................................................................................................................ i
s ..................................................................................................................................... ii~iii
s ................................................................................................................ 1~6
1.6.1 VCC Supplied Externally ........................................................................................................ 5
1.6.2 VCC Generated by Internal DC/DC Circuit ............................................................................... 6
s ........................................................................................................ 7
3.3.1 68XX-Series MPU Parallel Interface Characteristics .......................................................... 9~10
3.3.2 80XX-Series MPU Parallel Interface Characteristics ........................................................ 11~12
3.3.3 Serial Interface Characteristics (4-wire SPI) .................................................................. 13~14
3.3.4 I2C Interface Characteristics ......................................................................................... 15~16
n ......................................................................................................
4.2.1 Power up Sequence ........................................................................................................... 17
4.2.2 Power down Sequence ...................................................................................................... 17
4.4.1 VCC Supplied Externally ............................................................................................... 18~21
4.4.2 VCC Generated by Internal DC/DC Circuit ..................................................................... 22~25
y ..................................................................................................................................
s ............................................................................ 27~30
6.3.1 Cosmetic Check (Display Off) in Non-Active Area ........................................................... 27~28
6.3.2 Cosmetic Check (Display Off) in Active Area ........................................................................ 29
6.3.3 Pattern Check (Display On) in Active Area ........................................................................... 30
s .............................................................................................................. 31
s ....................................................... 32~34
17~25
26
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GDON0129RGW
GOOD DISPLAY
WWaarrrraanntty NNoottiicce
y ........................................................................................................................................ 34
e ............................................................................................................................................. 34
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GDON0129RGW
GOOD DISPLAY
11.. BBaassiicc SSppeecciiffiiccaattiioonnss
1.1 Display Specifications
1) Display Mode: Passive Matrix
2) Display Color: Monochrome (White)
3) Drive Duty: 1/64 Duty
1.2 Mechanical Specifications
1) Outline Drawing: According to the annexed outline drawing
2) Number of Pixels: 128 64
3) Panel Size: 32.42 21.36 1.427 (mm)
4) Active Area: 29.42 14.7 (mm)
5) Pixel Pitch: 0.23 0.23 (mm)
6) Pixel Size: 0.21 0.21 (mm)
7) Weight: 2.1 (g)
1.3 Active Area / Memory Mapping & Pixel Construction
3 C32 S12
C6
7 S0 C0 C31
3
0.2
2
0.0
tail Dots size
De
Sc
ale 10/1
23
0. 02
0.
1
0.2
21
0.
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134
1.4 Mechanical Drawing
GOOD DISPLAY
ginal Drawing Ori
DateItem Remark
20190428
A
GDON0129RGW
v.
A
Re
D1
D0
D2D3D4D5D6
D7
NC
BS1
C1P
C2P
C1N
C2N
Symbol
N.C. (GND)
BS2
CS#
VSS
VSS
VBAT
D/C#
VDD
RES#
R/W#
E/RD#
NC
VCC
IREF
VCOMH
N.C. (GND)
Material
8
2
576
431
9
11
13
10
Pin
1215171614
.02 0
.23 0
21
23
20
18
19
0
.21
2225272624
.21 0
28
29
30
GDON0129RGW
Drawing Number
Dots size
0
32 S127 S0 C0 C31
63 C C
0
.23
.02
etail D
Scale 10/1
A3
Size
Sheet
1 of 1
me / Polyimide
i
1:1
Soda L
Scale
P.M.
Panel / E.
E.E.
GDON0129RGWFolding Type OEL Display Module
Drawn
Pixel Number: 128 x 64, Monochrome, COG Package
20190428
DALIAN GOOD DISPLAY CO., LTD.
7±0.1
.7
.42
0
1
t=0.15mm Max Re
move Tape
t=0.2mm Po
larizer
G
lue
Contact Side
15x8x0.05mm
Pr
otective Tape
03 .1±0.
0
Co
ct Side
nta
Unless Otherwise Specified
Title
mm
Unit
By
Date
±1
±0.3
Tolerance
Angle
Dimension
General Roughness
6
0.3 .5)
)
.3± 0
(1
(1
10 5
2±0.2
2 (V/A)
2.4
0.4
3
3
2±0.3 (Polarizer)
1.8
3x128-0.02=29.42 (A/A)
3
0.2 P
Dots (1.29")
28x64
1
2
4±0.05
-R0.
0.2 12±
N
.C.
(GND)
30
NC
VCC
VCOMH
IREF
D7
D6
D5
D4
D3
D2
D1
D0
E/RD#
R/W#
D/C#
RES#
CS#
BS2
BS
1
NC
VDD
VSS
VSS
AT
VB
C1N
C1P
C2P
C2N
N.C. (GND)
1
1 (Alignment Mark) 6±0.
1
=20.3±0.05(W0.40±0.03)
1
.85±0.
0.70x(30-1)
0
P
0.2 22±
Signature
Customer Approval
(1.5
(1)
0.3
±0.3
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P0.
)
23x64-0.02=14.7 (A/A)
15.
7 (V/A)
17.
1±0.3 (Polarizer)
17.
7±0.2 (cover glass)
21.
36±0.2
(34.
2±0.3
4±0
.2
4.7
5±0.2
(6.89)
(12.04)
13.
04±0.3
4)
: otes
N
8-bit 68XX/80XX Parallel, 4-wire SPI, I2C
2. Driver IC: SSD1315
4. Interface:
3. FPC Number: NFP1315-10
1. Color: White
5. General Tolerance: ±0.30
234
1.5 Pin Definition
It
GOOD DISPLAY
Pin Number Symbol I/O Function
GDON0129RGW
PPoowweerr SSuuppppllyy
9 VDD P
8 VSS P
28 VCC P
DDrriivveerr
26 IREF I
27 VCOMH O
DDCC//DDCC CCoonnvveerrtteerr
6 VBAT P
4 / 5 2 / 3
IInntteerrffaaccee
11 12
C1P / C1N C2P / C2N
BS1 BS2
14 RES# I
13 CS# I
15 D/C# I
17 E/RD# I
PPoowweerr SSuuppppllyy ffoorr LLooggiicc
This is a voltage supply pin. It must be connected to external source.
GGrroouunndd ooff LLooggiicc CCiirrccuuiitt
This is a ground pin. It acts as a reference for the logic pins. It must be connected to external ground.
PPoowweerr SSuuppppllyy ffoorr OOEELL PPaanneell
This is the most positive voltage supply pin of the chip. A stabilization capacitor should be connected between this pin and VSS when the converter is used. must be connected to external source when the converter is not used.
CCuurrrreenntt RReeffeerreennccee ffoorr BBrriigghhttnneessss AAddjjuussttmmeenntt
This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 12.5A maximum.
VVoollttaaggee OOuuttppuutt HHiigghh LLeevveell ffoorr CCOOMM SSiiggnnaal
This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS.
PPoowweerr SSuuppppllyy ffoorr DDCC//DDCC CCoonnvveerrtteerr CCiirrccuuiitt
This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to external source when the converter is used. It should be connected to VDD when the converter is not used.
PPoossiittiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg IInnvveerrttiinngg CCaappaacciittoorr NNeeggaattiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg BBoooosstt CCaappaacciittoorr
I
The charge-pump capacitors are required between the terminals. They must be floated when the converter is not used.
CCoommmmuunniiccaattiinngg PPrroottooccooll SSeelleecctt
These pins are MCU interface selection input. See the following table:
I
I2C 1 0 4-wire SPI 0 0 8-bit 68XX Parallel 0 1 8-bit 80XX Parallel 1 1
PPoowweerr RReesseett ffoorr CCoonnttrroolllleerr aanndd DDrriivveerr
This pin is reset signal input. When the pin is low, initialization of the chip is executed. Keep this pin pull high during normal operation.
CChhiipp SSeelleecctt
This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.
DDaattaa//CCoommmmaanndd CCoonnttrrooll
This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. When the pin is pulled high and serial interface mode is selected, the data at SDIN will be interpreted as data. When it is pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams.
RReeaadd//WWrriittee EEnnaabbllee oorr RReeaadd
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. When serial or I2C mode is selected, this pin must be connected to VSS.
l
BS1 BS2
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1.5 Pin Definition (Continued)
GOOD DISPLAY
Pin Number Symbol I/O Function
GDON0129RGW
IInntteerrffaaccee ((CCoonnttiinnuueedd))
16 R/W# I
18~25 D0~D7 I/O
130
N.C. -
N.C. (GND) -
RReesseerrvvee
71029
RReeaadd//WWrriittee SSeelleecctt oorr WWrriittee
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. When serial or I2C mode is selected, this pin must be connected to VSS.
HHoosstt DDaattaa IInnppuutt//OOuuttppuutt BBuuss
These pins are 8-bit bi-directional data bus to be connected to the
microprocessor’s data bus. When serial mode is selected, D1 will be the serial
data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is selected, D2 & D1 should be tired together and serve as SDA application and D0 is the serial clock input SCL. Unused pins must be connected to VSS except for D2 in serial mode.
RReesseerrvveedd PPiinn
The N.C. pin between function pins are reserved for compatible and flexible design.
RReesseerrvveedd PPiinn ((SSuuppppoorrttiinngg PPiinn))
The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground as the ESD protection circuit.
& SDAin in
out
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434
1.6 Block Diagram
GOOD DISPLAY
1.6.1 VCC Supplied Externally
A
ctive Are
a 0.96"
128 x 64 Pixels
GDON0129RGW
32
127
S
SD13
# S1 B
BS0
BS2
CS
~
~ ~ ~
06
#
C#
ES# R
~
D0
D/
R/W
D7
E/RD#
~
ommon 63 C
Common
Segment
P
1P
VSS
VDDB
C
C1N
C2N
C2
VDD
C1
C2
0
Common 31
Common
Segment 0
EF
VCC
VCOMH
IR
VLSS
C5
R1
C3
C4
MCU Interface Selection: BS0, BS1 and BS2 Pins connected to MCU interface: CS#, RES#, D/C#, R/W#, E/RD#, and D0~D7
C1, C3: 0.1μF C2: 4.7μF C4, C5: 4.7μF / 16V X7R R1: 620kΩ, R1 = (Voltage at IREF - VSS) / IREF
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1.6.2 VCC Generated by Internal DC/DC Circuit
GOOD DISPLAY
GDON0129RGW
ctive A
A
rea 0.96"
128 x 64 Pixels
27
mon 63
~
Common 32
Com
Segment 1
SS
VSS
VDDB
C1P
C1N
C2N
C2P
C6
MCU Interface Selection: BS0, BS1 and BS2 Pins connected to MCU interface: CS#, RES#, D/C#, R/W#, E/RD#, and D0~D7
C2
~ ~ ~
~
D1306
1
VDD
C1
ES#
R/W#
BS2
BS0
BS
R
D/C#
CS#
#
E/RD
D0
Segment 0
~
Common 0
Common 31
EF
VCOMH
VLSS
VCC
D7
IR
C3C5
C4
R1
C1, C2: 1μF C3: 2.2μF C4: 4.7μF / 16V X7R C5, C6: 1μF / 16V X5R R1: 620kΩ, R1 = (Voltage at IREF - VSS) / IREF
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Min
GDON0129RGW
GOOD DISPLAY
22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss
Parameter Symbol
Supply Voltage for Logic VDD -0.3 4 V 1, 2
Supply Voltage for Display VCC 0 16.5 V 1, 2
Supply Voltage for DC/DC V
Operating Temperature TOP -40 85
Storage Temperature T
Life Time (120 cd/m2) 10,000 - hour 4
Life Time (80 cd/m2) 24,000 - hour 4 Life Time (60 cd/m2) 32,000 - hour 4
Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the
module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Optics & Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
Note 3: The defined temperature ranges do not include the polarizer. The maximum withstood
temperature of the polarizer should be 80C.
Note 4: VCC = 9.0V, Ta = 25°C, 50% Checkerboard.
Software configuration follows Section 4.4 Initialization. End of lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.
Max Unit Notes
-0.3 4.5 V 1, 2
BAT
C
-40 85
STG
C
3
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nerated by Internal DC/DC)
GDON0129RGW
GOOD DISPLAY
33.. OOppttiiccss && EElleeccttrriiccaall CChhaarraacctteerriissttiiccss
3.1 Optics Characteristics
Characteristics Symbol Conditions Min Typ Max Unit
Brightness
(VCC Supplied Externally)
Brightness
(VCC Generated by Internal DC/DC)
C.I.E. (White)
Dark Room Contrast CR -
Viewing Angle - Free - degree
*Optical measurement taken at VDD = 2.8V, VCC = 9V & 12V.
Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics Characteristics
Supply Voltage for Logic VDD 1.65 2.8 3.5 V
Supply Voltage for Display
(Supplied Externally)
Supply Voltage for DC/DC
Supply Voltage for Display
(Ge
High Level Input VIH I
Lbr Note 5 120 - - cd/m2
Lbr Note 6 90 110 - cd/m2
(x) (y)
Symbol Conditions Min Typ Max Unit
VCC
V VCC
(Internal DC/DC Disable)
BAT
C.I.E. 1931
Note 5
Internal DC/DC Enable
Note 6
(Internal DC/DC Enable)
= 100μA, 3.3MHz
OUT
0.25
0.27
11.5 12.0 12.5 V
3.6 - 4.5 V
- 9.0 - V
0.8VDD
0.29
0.31
2000:1
- VDD V
0.33
0.35
-
Low Level Input VIL I
High Level Output VOH I
Low Level Output VOL I
Operating Current for VDD IDD - 180 300 μA
Operating Current for VCC
(VCC Supplied Externally)
Operating Current for V
(VCC Generated by Internal DC/DC)
Sleep Mode Current for VDD I
Sleep Mode Current for VCC I
Note 5 & 6: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel
characteristics and the customer’s request.
Note 7: VDD = 2.8V, VCC = 12V, 100% Display Area Turn on.
Note 8: VDD = 2.8V, VCC = 9V
V, 100% Display Area Turn on.
*Software configuration follows Section 4.4 Initialization.
BAT
ICC Note 7 - 21 28 mA
I
BAT
DD, SLEEP
CC, SLEEP
= 100μA, 3.3MHz 0 -
OUT
= 100μA, 3.3MHz
OUT
= 100μA, 3.3MHz 0 -
OUT
Note 8 - 41 46 mA
- - 10 μA
- - 10 μA
0.9VDD
0.2VDD
- VDD V
0.1VDD
V
V
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834
3.3 AC Characteristics
GOOD DISPLAY
3.3.1.1 68XX-Series MPU Parallel Interface Timing Characteristics:
Symbol Description Min Max Unit
t
Clock Cycle Time 300 - ns
cycle
tAS Address Setup Time 5 - ns
tAH Address Hold Time 0 - ns
t
Write Data Setup Time 40 - ns
DSW
GDON0129RGW
t
DHW
t
DHR
tOH Output Disable Time - 70 ns
t
ACC
PW
PW
tR Rise Time - 40 ns tF Fall Time - 40 ns
* (VDD - VSS = 1.65V to 3.5V, Ta = 25°C)
Write Data Hold Time 20 - ns
Read Data Hold Time 20 - ns
Access Time - 180 ns
Chip Select Low Pulse Width (Read) 180
CSL
Chip Select Low Pulse width (Write) 60 Chip Select High Pulse Width (Read) 60
CSH
Chip Select High Pulse Width (Write) 60
- ns
- ns
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GDON0129RGW
GOOD DISPLAY
3.3.1.2 68XX-Series MPU Parallel Interface wwiitthh IInntteerrnnaall CChhaarrggee PPuummpp
(When design main board, Please add Electronic Switch circuit, otherwise, will be caused leak current)
Recommended Components:
C1: 0.1μF / 6.3V, X5R C1: 4.7μF / 6.3V, X5R C3: 2.2Μf/16v C4: 4.7μF / 16V, X7R C5: 0.1μF / 16V, X7R C6,C7: 1μF / 16V, X7R R3: 620kΩ, R3 = (Voltage at IREF - VSS) / IREF R1, R2: 47kΩ Q1: FDN338P Q2: FDN335N
Notes:
VDD: 1.65~3.5V, it should be equal to MPU I/O voltage. Vin: 3.6~4.5V * VBAT will be connected to VDD when VCC be connected to external source (12V), R3 should be
replaced as 910 kΩ.
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1034
GDON0129RGW
GOOD DISPLAY
3.3.2.1 80XX-Series MPU Parallel Interface Timing Characteristics:
Symbol Description Min Max Unit
t
Clock Cycle Time 300 - ns
cycle
tAS Address Setup Time 10 - ns
tAH Address Hold Time 0 - ns
t
Write Data Setup Time 40 - ns
DSW
t
Write Data Hold Time 20 - ns
DHW
t
Read Data Hold Time 20 - ns
DHR
tOH Output Disable Time - 70 ns
t
Access Time - 180 ns
ACC
t
Read Low Time 180 - ns
PWLR
t
Write Low Time 60 - ns
PWLW
t
Read High Time 60 - ns
PWHR
t
Write High Time 60 - ns
PWHW
tCS Chip Select Setup Time 0 - ns
t
Chip Select Hold Time to Read Signal 0 - ns
CSH
t
Chip Select Hold Time 20 - ns
CSF
tR Rise Time - 40 ns tF Fall Time - 40 ns
* (VDD - VSS = 1.65V to 3.5V, Ta = 25°C)
(
Read Timing
)
(
Write Timing
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)
1134
GDON0129RGW
GOOD DISPLAY
3.3.2.2 80XX-Series MPU Parallel Interface wwiitthh IInntteerrnnaall CChhaarrggee PPuummpp
(When design main board, Please add Electronic Switch circuit, otherwise, will be caused leak current)
Recommended Components:
C1: 0.1μF / 6.3V, X5R C1: 4.7μF / 6.3V, X5R C3: 2.2Μf/16v C4: 4.7μF / 16V, X7R C5: 0.1μF / 16V, X7R C6,C7: 1μF / 16V, X7R R3: 620kΩ, R3 = (Voltage at IREF - VSS) / IREF R1, R2: 47kΩ Q1: FDN338P Q2: FDN335N
Notes:
VDD: 1.65~3.5V, it should be equal to MPU I/O voltage. Vin: 3.6~4.5V * VBAT will be connected to VDD when VCC be connected to external source (12V), R3 should be
replaced as 910 kΩ.
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1234
GDON0129RGW
GOOD DISPLAY
3.3.3.1 Serial Interface Timing Characteristics: (4-wire SPI)
Symbol Description Min Max Unit
t
Clock Cycle Time 100 - ns
cycle
tAS Address Setup Time 15 - ns
tAH Address Hold Time 15 - ns
t
Chip Select Setup Time 20 - ns
CSS
t
Chip Select Hold Time 20 - ns
CSH
t
Write Data Setup Time 15 - ns
DSW
t
Write Data Hold Time 25 - ns
DHW
t
Clock Low Time 30 - ns
CLKL
t
Clock High Time 30 - ns
CLKH
tR Rise Time - 40 ns tF Fall Time - 40 ns
* (VDD - VSS = 1.65V to 3.5V, Ta = 25°C)
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1334
GDON0129RGW
GOOD DISPLAY
4-wire Serial Interface wwiitthh IInntteerrnnaall CChhaarrggee PPuummpp
33..33..33..22
(When design main board, Please add Electronic Switch circuit, otherwise, will be caused leak current)
Recommended Components:
C1: 0.1μF / 6.3V, X5R C1: 4.7μF / 6.3V, X5R C3: 2.2Μf/16v C4: 4.7μF / 16V, X7R C5: 0.1μF / 16V, X7R C6,C7: 1μF / 16V, X7R R3: 620kΩ, R3 = (Voltage at IREF - VSS) / IREF R1, R2: 47kΩ Q1: FDN338P Q2: FDN335N
Notes:
VDD: 1.65~3.5V, it should be equal to MPU I/O voltage. Vin: 3.6~4.5V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R3 should be replaced as 910 kΩ.
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3.3.4.1 I2C Interface Timing Characteristics:
GOOD DISPLAY
Symbol Description Min Max Unit
t
Clock Cycle Time 2.5 - μs
cycle
t
Start Condition Hold Time 0.6 - μs
HSTART
GDON0129RGW
tHD
tSD Data Setup Time 100 - ns
t
SSTART
t
SSTOP
tR Rise Time for Data and Clock Pin 300 ns tF Fall Time for Data and Clock Pin 300 ns
t
IDLE
* (VDD - VSS = 1.65V to 3.5V, Ta = 25°C)
Data Hold Time (for “SDA
Data Hold Time (for “SDA
Start Condition Setup Time (Only relevant for a repeated Start condition)
Stop Condition Setup Time 0.6 - μs
Idle Time before a New Transmission can Start 1.3 - μs
” Pin) 0
OUT
” Pin) 300
IN
- ns
0.6 - μs
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GOOD DISPLAY
3.3.4.2 I2C Interface wwiitthh IInntteerrnnaall CChhaarrggee PPuummpp
(When design main board, Please add Electronic Switch circuit, otherwise, will be caused leak current)
Recommended Components:
C1: 0.1μF / 6.3V, X5R C1: 4.7μF / 6.3V, X5R C3: 2.2Μf/16v C4: 4.7μF / 16V, X7R C5: 0.1μF / 16V, X7R C6,C7: 1μF / 16V, X7R R3: 620kΩ, R3 = (Voltage at IREF - VSS) / IREF R1, R2: 47kΩ R4, R5: 4.7kΩ Q1: FDN338P Q2: FDN335N
Notes:
VDD: 1.65~3.5V, it should be equal to MPU I/O voltage. Vin: 3.6~4.5V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R3 should be
replaced as 910 kΩ.
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p
p
y
y
V
V
B
B
// V
V
B
ooffff
p
p
y
y
V
V
B
CCC
C
B
// V
V
B
BBAAT
T
oonn
GDON0129RGW
GOOD DISPLAY
44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioonn
4.1 Commands
Refer to the Technical Manual for the SSD1315
4.2 Power down and Power up Sequence
To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation.
V
B
B
4.2.1 Power up Sequence:
1. Power up V
DD
V
oonn
D
DDD
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up VCC/ V
BAT
6. Delay 100ms (When VCC is stable)
7. Send Display on command
s
a
DDiis
lla
ooffff
4.2.2 Power down Sequence:
1. Send Display off command
2. Power down VCC / V
BAT
3. Delay 100ms (When VCC / V
is reach 0 and panel is
BAT
completely discharges)
4. Power down V
DD
DDiis
V
V
s
a
lla
oonn
B
B
ooffff
D
D
Note 13:
1) Since an ESD protection circuit is connected between VDD and VCC inside the driver IC, V becomes lower than VDD whenever VDD is ON and VCC is OFF.
2) VCC / V
3) Power Pins (VDD, VCC, V
4) VDD should not be power down before VCC / V
should be kept float (disable) when it is OFF.
BAT
) can never be pulled to ground under any circumstance.
BAT
BAT
power down.
4.3 Reset Circuit
When RES# input is low, the chip is initialized with the following status:
1. Display is OFF
2. 12864 Display Mode
3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9. Normal display mode (Equivalent to A4h command)
CC
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4.4 Actual Application Example
Initial Settings
Configuration
Set Contrast Control
0x81, 0Xb0
GOOD DISPLAY
Command usage and explanation of an actual example
4.4.1 VCC Supplied Externally
<Power up Sequence>
GDON0129RGW
VDD/VCC off State
Power up VDD
(RES# as Low State)
Power Stabilized
(Delay Recommended)
Set RES# as High
(3μs Delay Minimum)
Initialized State
(Parameters as Default)
Set Display Off
0xAE
Set Display Offset
0xD3, 0x00
Set Display Start Line
0x40
Set Charge Pump
0x8D, 0x10
Set Segment Re-Map
0xA1
Set COM Output Scan Direction
0xC8
Set COM Pins Hardware Configuration
0xDA, 0x12
Set Entire Display On/Off
Set Normal/Inverse Display
Power up VCC & Stabilized
(Delay Recommended)
(100ms Delay Recommended)
0xA4
0xA6
Clear Screen
Set Display On
0xAF
Display Data Sent
Set Display Clock Divide Ratio/Oscillator Frequency
0xD5, 0xF0
Set Multiplex Ratio
0xA8, 0x3F
Set Pre-Charge Period
0xD9, 0Xf1
Set VCOMH Deselect Level
0xDB, 0x30
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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<Power down Sequence>
Power down VCC
GOOD DISPLAY
GDON0129RGW
Normal Operation
Set Display Off
0xAE
<Entering Sleep Mode>
Normal Operation
Set Display Off
0xAE
<Exiting Sleep Mode>
Power down VB
(100ms Delay Recommended)
Power down V
Sleep Mode
B
CC
DD
VDD/VCC off State
External setting
{
RES=1; delay(1000); RES=0; delay(1000); RES=1; delay(1000);
write_i(0xAE); /*display off*/ write_i(0x00); /*set lower column address*/
write_i(0x10); /*set higher column address*/ write_i(0x40); /*set display start line*/
Sleep Mode
Power up VCC & Stabilized
(Delay Recommended)
Set Display On
0xAF
(100ms Delay Recommended)
Normal Operation
write_i(0xB0); /*set page address*/
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write_i(0x81); /*contract control*/
GOOD DISPLAY
write_i(0xB0); /*128*/ write_i(0xA1); /*set segment remap*/ write_i(0xa4); /*Resume to RAM content display*/ write_i(0xA6); /*normal / reverse*/ write_i(0xA8); /*multiplex ratio*/
write_i(0x3F); /*duty = 1/64*/ write_i(0xC8); /*Com scan direction*/ write_i(0xD3); /*set display offset*/
write_i(0x00);
GDON0129RGW
write_i(0xD5); /*set osc division*/ write_i(0xF0);
write_i(0xD9); /*set pre-charge period*/ write_i(0Xf1);
write_i(0xDA); /*set COM pins*/ write_i(0x12);
write_i(0xdb); /*set vcomh*/ write_i(0x30);
write_i(0x8d); /*set charge pump disable*/ write_i(0x10);
write_i(0xAF); /*display ON*/ } void write_i(unsigned char ins)
{ DC=0;
CS=0; WR=1; P1=ins; /*inst*/ WR=0; WR=1; CS=1; }
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void write_d(unsigned char dat)
GOOD DISPLAY
{ DC=1; CS=0; WR=1; P1=dat; /*data*/ WR=0; WR=1; CS=1; }
void delay(unsigned int i) {
while(i>0) { i--; }
}
GDON0129RGW
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4.4.2 VCC Generated by Internal DC/DC Circuit
GOOD DISPLAY
<Power up Sequence>
GDON0129RGW
VDD/V
(RES# as Low State)
(Delay Recommended)
(100ms Delay Recommended)
(3μs Delay Minimum)
(Parameters as Default)
off State
BAT
Power up VDD
Power Stabilized
Power up V
Set RES# as High
Initialized State
Set Display Off
0xAE
DDB
Set Multiplex Ratio
0xA8, 0x3F
Set Display Offset
0xD3, 0x00
Set Display Start Line
0x40
Set Segment Re-Map
0xA1
Set COM Output Scan Direction
0xC8
Set COM Pins Hardware Configuration
0xDA, 0x12
Set Contrast Control
0x81, 0Xb0
Set Entire Display On/Off
Set Normal/Inverse Display
(100ms Delay Recommended)
0xA4
0xA6
Clear Screen
Set Charge Pump
0x8D,
Set Display On
0xAF
Power Stabilized
Display Data Sent
0x95
Initial Settings
Configuration
Set Display Clock Divide Ratio/Oscillator Frequency
0xD5, 0xF0
Set Pre-Charge Period
0xD9, 0xF1
Set VCOMH Deselect Level
0xDB, 0x30
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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<Power down Sequence>
GOOD DISPLAY
GDON0129RGW
Normal Operation
Set Display Off
0xAE
Set Charge Pump
0x8D, 0x10
<Entering Sleep Mode>
Normal Operation
Set Display Off
0xAE
Power Stabilized
(100ms Delay Recommended)
Power down VB
(50ms Delay Recommended)
Power down V
Set Charge Pump
0x8D, 0x10
Power down V
BAT
DD
BAT
VDD/V
off State
BAT
Sleep Mode
<Exiting Sleep Mode>
Sleep Mode
Power up V
(100ms Delay Recommended)
BAT
Internal settingCharge pump
{
RES=1; delay(1000); RES=0;
delay(1000); RES=1; delay(1000);
write_i(0xAE); /*display off*/
Set Charge Pump
0x8D,
0x95
Set Display On
0xAF
Power Stabilized
(100ms Delay Recommended)
Normal Operation
write_i(0x00); /*set lower column address*/ write_i(0x10); /*set higher column address*/
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write_i(0x40); /*set display start line*/
GOOD DISPLAY
write_i(0xB0); /*set page address*/ write_i(0x81); /*contract control*/
write_i(0xB0); /*128*/ write_i(0xA1); /*set segment remap*/ write_i(0xa4); /*Resume to RAM content display*/ write_i(0xA6); /*normal / reverse*/ write_i(0xA8); /*multiplex ratio*/
write_i(0x3F); /*duty = 1/64*/
GDON0129RGW
write_i(0xC8); /*Com scan direction*/ write_i(0xD3); /*set display offset*/
write_i(0x00); write_i(0xD5); /*set osc division*/
write_i(0xF0); write_i(0xD9); /*set pre-charge period*/
write_i(0Xf1);
write_i(0xDA); /*set COM pins*/ write_i(0x12);
write_i(0xdb); /*set vcomh*/ write_i(0x30);
write_i(0x8d); /*set charge pump disable*/ write_i(0x95);
write_i(0xAF); /*display ON*/ } void write_i(unsigned char ins)
{ DC=0;
CS=0; WR=1; P1=ins; /*inst*/
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WR=0;
GOOD DISPLAY
WR=1; CS=1; }
void write_d(unsigned char dat) { DC=1; CS=0; WR=1; P1=dat; /*data*/ WR=0; WR=1; CS=1; }
GDON0129RGW
void delay(unsigned int i) {
while(i>0) { i--; }
}
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GDON0129RGW
GOOD DISPLAY
55.. RReelliiaabbiilliittyy
5.1 Contents of Reliability Tests
High Temperature Operation 70C, 240 hrs Low Temperature Operation -40C, 240 hrs High Temperature Storage Low Temperature Storage High Temperature/Humidity Operation
Thermal Shock
* The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests.
5.2 Failure Check Standard
After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 235C; 5515% RH.
Item Conditions Criteria
85C, 240 hrs
-40C, 240 hrs 60C, 90% RH, 120 hrs
-40C 85C, 24 cycles 60 mins dwell
The operational functions work.
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Y
GDON0129RGW
GOOD DISPLAY
66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonnss
6.1 Environment Required
Customer’s test & measurement are required to be conducted under the following conditions:
Temperature: 23 5C Humidity: 55 15% RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: 50cm Distance between the Panel & Eyes of the Inspector: 30cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic.
6.2 Sampling Plan
Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level
Partition AQL Definition
Major 0.65 Defects in Pattern Check (Display On) Minor 1.0 Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area
Check Item
Panel General Chipping Minor
Classification
Criteria
X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge)
X
Y
X
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued)
GOOD DISPLAY
GDON0129RGW
Check Item
Panel Crack Minor
Copper Exposed
(Even Pin or Film)
Film or Trace Damage Minor
Classification
Minor Not Allowable by Naked Eye Inspection
Criteria
Any crack is not allowable.
Terminal Lead Prober Mark Acceptable
Glue or Contamination on Pin
(Couldn’t Be Removed by Alcohol)
Ink Marking on Back Side of panel
(Exclude on Film)
Minor
Acceptable Ignore for Any
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W
a: Major Axis
GDON0129RGW
GOOD DISPLAY
6.3.2 Cosmetic Check (Display Off) in Active Area It is recommended to execute in clear room environment (class 10k) if actual in necessary.
Check Item
Any Dirt & Scratch on Polarizer’s
Protective Film
Scratches, Fiber, Line-Shape Defect
(On Polarizer)
Dirt, Black Spot, Foreign Material,
(On Polarizer)
Dent, Bubbles, White spot
(Any Transparent Spot on Polarizer)
Fingerprint, Flow Mark
(On Polarizer)
* Protective film should not be tear off when cosmetic check. ** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2
Classification
Acceptable Ignore for not Affect the Polarizer
W 0.1 Ignore
Minor
Minor
Minor
Minor Not Allowable
W > 0.1
L 2 n 1 L > 2 n = 0
Φ 0.1 Ignore
0.1 < Φ 0.25 n 1
0.25 < Φ n = 0 Φ 0.5 Ignore if no Influence on Display
0.5 < Φ n = 0
Criteria
L
b: Minor Axis
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6.3.3 Pattern Check (Display On) in Active Area
GOOD DISPLAY
GDON0129RGW
Check Item
No Display Major
Missing Line Major
Pixel Short Major
Classification
Criteria
Darker Pixel Major
Wrong Display Major
Un-uniform Major
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Primary Box C SET
C
GDON0129RGW
GOOD DISPLAY
77.. PPaacckkaaggee SSppeecciiffiiccaattiioonnss
EPE C O VE R FO A M 351x212x1, A N T ISTA TIC x 1 Pcs
od
ule
M
ra
y 420x285 T=0.8m m
T
mm
1
pcs (Em pty)
x
1
5 pcs
x
A
ta
ggered Stacking
S
iccator x 2 pcs
xs
E
W rapped w ith adhesive tape
6 pcs
1
x
B
uum packing bag
ac
V
PE
PR O TEC T TIVE
E
70
m m x 280m m x 20m m
3
PR O TEC T TIVE
PE
E
16 Pcs Tray V acuum packing
B
ri
m ary B ox 4 SET
B
C A R TO N B O X
Label
m ary L450m m x W 296 x H 110, B w ave
ri
P
Label
x 4Pcs
C arton B ox L 464m m x W 313m m x H 472m m , A B w ave
(Major / Maximum)
ni
vision T echnology Inc.
U
Part ID :
Lot ID :
Q 'ty :
Q C :
Item Quantity
Module 810 per Primary Box
Holding Trays (A) 15 per Primary Box
Total Trays (B) 16 per Primary Box (Including 1 Empty Tray)
Primary Box (C) 1~4 per Carton (4 as Major / Maximum)
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88.. PPrreeccaauuttiioonnss WWhheenn UUssiinngg TThheessee OOEELL DDiissppllaayy MMoodduulleess
8.1 Handling Precautions
1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping
from a high position.
2) If the display panel is broken by some accident and the internal organic substance leaks out, be
careful not to inhale nor lick the organic substance.
3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell
structure may be damaged and be careful not to apply pressure to these sections.
4) The polarizer covering the surface of the OEL display module is soft and easily scratched. Please
be careful when handling the OEL display module.
5) When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes
advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents
6) Hold OEL display module very carefully when placing OEL display module into the system housing.
Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
7) Do not apply stress to the driver IC and the surrounding molded sections.
8) Do not disassemble nor modify the OEL display module.
9) Do not apply input signals while the logic power is off.
10) Pay sufficient attention to the working environments when handing OEL display modules to prevent
occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OEL display module. Be
careful since static electricity may be generated when exfoliating the protective film.
11) Protection film is being applied to the surface of the display panel and removes the protection film
before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5).
12) If electric current is applied when the OEL display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful to avoid the above.
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GOOD DISPLAY
8.2 Storage Precautions
1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure
to direct sun light nor to lights of fluorescent lamps. and, also, avoiding high temperature and high humidity environment or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Dalian Good Display Co., Ltd.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them.
2) If electric current is applied when water drops are adhering to the surface of the OEL display
module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.
8.3 Designing Precautions
1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module,
and if these values are exceeded, panel damage may be happen.
2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and V
specifications and, at the same time, to make the signal line cable as short as possible.
3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD).
(Recommend value: 0.5A)
4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring
devices.
5) As for EMI, take necessary measures on the equipment side basically.
6) When fastening the OEL display module, fasten the external plastic housing section.
7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the
main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module.
8) The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1315
* Connection (contact) to any other potential than the above may lead to rupture of the IC.
IH
8.4 Precautions when disposing of the OEL display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OEL display
modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
8.5 Other Precautions
1) When an OEL display module is operated for a long of time with fixed pattern may remain as an
after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.
2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not
touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the FPC
3) With this OEL display module, the OEL driver is being exposed. Generally speaking,
semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in
actual usage.
* Design the product and installation method so that the OEL driver may be shielded from light
during the inspection processes.
4) Although this OEL display module stores the operation state data by the commands and the
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GDON0129RGW
GOOD DISPLAY
indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design.
5) We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
WWaarrrraannttyy::
The warranty period shall last twelve (12) months from the date of delivery. Buyer shall be completed to assemble all the processes within the effective twelve (12) months. Dalian Good Display Co., Ltd. shall be liable for replacing any products which contain defective material or process which do not conform to the product specification, applicable drawings and specifications during the warranty period. All products must be preserved, handled and appearance to permit efficient handling during warranty period. The warranty coverage would be exclusive while the returned goods are out of the terms above.
NNoottiiccee::
No part of this material may be reproduces or duplicated in any form or by any means without the written permission of Dalian Good Display Co., Ltd. Dalian Good Display Co., Ltd. reserves the right to make changes to this material without notice. Dalian Good Display Co., Ltd. does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency.
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