Ver: 1.6
Nov 18, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G960
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage……………………….……………..……10V
Power Dissipation Internally Limited . (Note 2)
Maximum Junction Temperature.…..………………...150°C
Storage Temperature Range….…...-65°C ≤ T
J
≤+150°C
Lead Temperature, Time for Wave Soldering
TO 220, TO 263 Package…………..………..260°C, 10s
TO 252, SOT 223 Package……………………260°C, 4s
Continuous Power Dissipation (T
A
= +25°C)
SOT 223
(1)
………………………….………………....0.8W
TO 252
(1)
………………………….………………..….1.0W
TO 263
(1)
………………………….………………..….1.6W
TO 220
(1)
………………………….………………..….2.0W
Note
(1)
: See Recommended Minimum Footprint
Operating Conditions
(Note 1)
Input Voltage……………………………………….4V~7V
Temperature Range………….………-40°C ≤ T
J
≤125°C
Electrical Characteristics
VIN =5V, IO = 1A, CIN = 1µF, C
OUT
=10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage 50mA < IO <1A 3.234 3.3 3.366 V
Line Regulation 4V < VIN < 7V, IO = 10mA 20 30 mV
Load Regulation 50mA < IO < 1A 30 50 mV
Output Impedance 200mA DC and 100mA AC, fo = 120Hz 100
mΩ
Quiescent Current V
IN
= 5V 0.6 mA
Ripple Rejection fi = 120Hz, 1V
P-P,
Io = 100mA 42 dB
IO = 1A 0.8 V
Dropout Voltage
I
O
= 100mA 200 mV
Short Circuit Current 1.6 1.9 A
Over Temperature 125 °C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating
Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal resis-
tance,
θ
JA
, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature
is T
jmax-TA
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into ther-
mal shutdown. For the G960 in the SOT 223 package,
θ
JA
is 156°C/W; in the TO 252 package,
θ
JA
is 125°C/W;
in the TO 263 package,
θ
JA
is 75°C/W, and in the TO 220 package,
θ
JA
is 60°C/W (No heat sink). [See Recom-
mended Minimum Footprint] If the TO 220 package is used with a heat sink,
θ
JA
is the sum of the package
thermal resistance junction-to-case (
θ
JC
) of 3°C/W and the thermal resistance added by the heat sink and thermal interface the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package. The safe operation area of SOT 223, TO 252, TO 263 or TO 220 package, it can see
“Typical Performance Characteristics” (Safe Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load current and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions of
low dissipation or by using pulse techniques such that
average chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measurement is made under conditions of low dissipation or
by using pulse techniques such that average chip
temperature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.