Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G930/G931
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage…………………………..……….………10V
Power Dissipation Internally Limited (Note 2)
Maximum Junction Temperature……………....……..150°C
Storage Temperature Range…..…..-65°C ≤ T
J
≤+150°C
Lead Temperature, Time for Wave Soldering
SOT-89 Package……………..………………...260°C, 4s
Continuous Power Dissipation (T
A
= +25°C)
SOT89
(1)
:…………………………………..……..…0.42W
Note
(1)
:See Recommended Minimum Footprint.
Operating Conditions
(Note 1)
Input Voltage……………………………………….4V~7V
Temperature Range……………………0°C ≤ T
J
≤125°C
Electrical Characteristics
VIN =5V, IO = 400mA, CIN = 1µF, C
OUT
=10 µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage 5mA < IO <400mA 3.43 3.5 3.605 V
Line Regulation 4V < VIN < 7V, IO = 10mA 22 mV
Load Regulation 50mA < IO < 400mA 30 mV
Output Impedance 100mA DC and 100mA AC, fo = 120Hz 103 mΩ
Quiescent Current V
IN
= 5V 0.6 mA
Ripple Rejection fi = 120Hz, 1V
P-P,
Io = 100mA 42 dB
IO = 400mA 0.8 0.9 V
Dropout Voltage
I
O
= 100mA 125 150 mV
Short Circuit Current 0.77 A
Over Temperature 125
°C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating
Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal re-
sistance,
θ
JA
, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-
perature is T
jmax-TA
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 130°C and IC
will go into thermal shutdown. For the G930/G931 in SOT 89 package,
θ
JA
is 250°C/W. (See Recommended Minimum Footprint). The safe operation in SOT 89, it can see “Typical Performance Characteristics” (Safe Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load current and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measurement is made under conditions of low dissipation or by
using pulse techniques such that average chip temperature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.