∗ 1024 refresh cycles/16ms.
∗ Available in 28pin 400 mil SOJ
∗ Single +5.0V±10% Power Supply.
∗ All inputs and Outputs are TTL-
compatible.
∗Fast Page Mode supports sustained data
rates up to 50MHZ.
PIN CONFIGURATION :
The GLT44108 is a 524,288 x 8 bit highperformance CMOS dynamic random access
memory. The GLT44108 offers Fast Page mode with
asymmetric address and accepts 512-cycle refresh in
8ms interval.
All inputs are TTL compatible. Fast Page Mode
operation allows random access up to 512 x 8 bits
within a page, with cycle times as short as 22ns.
The GLT44108 is best suited for graphics, digital
signal processing and high performance peripherals.
GLT44108
28 Lead SOJ
G-Link Technology
2701 Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
Vcc
DQ0
DQ1
DQ2
DQ3
NC
WE
RAS
A9
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
- 1 -
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VSS
DQ
7
DQ6
DQ5
DQ4
CAS
OE
NC
A8
A7
A6
A5
A
4
VSS14
G-Link Technology Corporation,Taiwan
6F, No.24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
G-LINK
RAS
CAS
RAS
CAS
WE
OE
.
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GLT44108
512K X 8 CMOS DYNAMIC RAM WITH FAST PAGE MODE
Preliminary Aug 1999 (Rev.2.1)
HIGH PERFORMANCE-40-50-60
Max.
Access Time, (t
RAC
)
40 ns50 ns60 ns
Max. Column Address Access Time, (tAA)20 ns25 ns30 ns
Min. Fast Page Mode Cycle Time, (tPC)22 ns31 ns40 ns
Min. Read/Write Cycle Time, (tRC)75 ns90 ns110 ns
Max.
Access Time (t
CAC
)
12 ns13 ns15 ns
Pin Descriptions:
NameFunction
A0 – A
9
Address Inputs
Row Address Strobe
Column Address Strobe
Write Enable
Output Enable
DQ0 - DQ
V
CC
V
SS
7
Data Inputs / Outputs
+5V Power Supply
Ground
Block Diagram:
OE
WE
CAS
RAS
V
CC
V
SS
A
0
A
1
.
A
8
A
9
RAS
CLOCK
GENERATOR
REFRESH
COUNTER
9
ADDRESS BUFFERS
AND PREDECODERS
CAS
CLOCK
GENERATOR
Y0 - Y
8
DECODERS
X0 - x
9
WE
CLOCK
GENERATOR
Data I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
1024
ROW
MEMORY
ARRAY
OE
GENERATOR
512×8
CLOCK
I/O
BUFFER
G-Link Technology
2701 Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
6F, No.24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 2 -
G-LINK
RAS
CAS
WE ,OE
CAS
RAS
RAS
512K X 8 CMOS DYNAMIC RAM WITH FAST PAGE MODE
Absolute Maximum Ratings*Capacitance*
TA=25°C, VCC=5V±10%, VSS=0V
GLT44108
Preliminary Aug 1999 (Rev.2.1)
Operating Temperature, TA (ambient)
Symbol
......................................-10°C to +80°C
C
Storage Temperature(plastic)....-55°C to +150°C
Voltage Relative to VSS...............-1.0V to + 7.0V
IN1
C
IN2
Short Circuit Output Current......................50mA
C
Power Dissipation......................................1.0W
*Note:Operation above Absolute Maximum Ratings can
adversely affect device reliability.
OUT
*Note: Capacitance is sampled and not 100% tested
Electrical Specifications
l All voltages are referenced to GND.
l After power up, wait more than 200µs and then, execute eight
refresh cycles as dummy cycles to initialize internal circuit.
Parameter
Address Input
,
,
Data Input/Output
before
or
Max.
5
7
7
Unit
pF
pF
pF
only
G-Link Technology
2701 Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
6F, No.24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 3 -
G-LINK
RAC
RAC
RAC
RAS
CAS
RAS
RAS
CAS
RAC
RAC
RAC
RAS
CAS
RAC
RAC
RAC
CAS
RAS
RAS
CAS
RAC
RAC
RAC
RAS
CAS
512K X 8 CMOS DYNAMIC RAM WITH FAST PAGE MODE
DC and Operating Characteristics (1-2)
TA = 0°C to 70°C, VCC=5V±10%, VSS=0V, unless otherwise specified.
GLT44108
Preliminary Aug 1999 (Rev.2.1)
Sym.ParameterTest ConditionsAccess
Min.TypMax. Unit Notes
Time
I
I
I
I
I
I
I
I
V
V
V
V
Notes:
1.ICC is dependent on output loading when the device output is selected. Specified I
2.ICC is dependent upon the number of address transitions specified. I
3. Specified V
Input Leakage Current
LI
(any input pin)
0V ≤ VIN ≤ 5.5V
(All other pins not under
-10+10
test=0V)
Output Leakage Current
LO
(for High-Z State)
Operating Current,
CC1
0V ≤ V
Output is disabled (Hiz)
Random READ/WRITEtRC = tRC (min.)
Standby Current,(TTL)
CC2
other inputs ≥ V
Refresh Current,
CC3
-Only
≤ 5.5V
out
,
cycling,
at V
IH
, at V
SS
t
= 40ns
t
= 50ns
t
= 60ns
IH
t
= 40ns
t
= 50ns
t
= 60ns
-10+10
tRC = tRC (min.)
Operating Current,
CC4
FAST Page Mode
Refresh Current,
CC5
Before
Standby Current, (CMOS)
CC6
at V
,
IL
,address
cycling:tPC=tPC(min.)
,
,
address cycling:
tRC=tRC(min.)
≥ VCC-0.2V,
t
t
t
t
t
t
= 40ns
= 50ns
= 60ns
= 40ns
= 50ns
= 60ns
≥ VCC-0.2V,
All other inputs ≥V
Input Low Voltage-1+0.8V3
IL
Input High Voltage2.4VCC+1V3
IH
Output Low VoltageIOL = 4.2mA0.4V
OL
Output High VoltageIOH = -5mA2.4V
OH
open.
per address cycle in random Read/Write and Fast Page Mode.
is steady state operation. During transitions, V
IL(min.)
not to exceed 20ns.All AC parameters are measured with V
SS
IL(min.)
IL(min.)≥Vss
is measured with a maximum of one transition
CC(max.)
may undershoot to -1.0V for a period
and V
IH(max.)≤Vcc
150
140
120
2mA
150
140
120
150
140
120
150
140
120
1mA
is measured with the output
CC(max.)
.
µA
µA
mA1,2
mA2
mA1,2
mA1
G-Link Technology
2701 Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
6F, No.24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 4 -
G-LINK
RAS
CAS
CAS
CAS
RAS
RAS
RAS
CAS
CAS
RAS
RAS
CAS
RAS
RAS
RAS
RAS
CAS
WE
CAS
RAS
512K X 8 CMOS DYNAMIC RAM WITH FAST PAGE MODE
AC Characteristics (0°°C≤≤TA≤≤70°°C,See note 1,2)
Test condition:VCC=5.0V±10%, VIH/VIL=2.4V/0.8V,VOH/VOL=2.0V/0.8V
Parameter40 ns50 ns60 ns
SymbolMIN.MAX.MIN.MAX.MIN.MAX. UnitNotes
Read/Write Cycle Time t
Read Midify Write Cycle Time t
Access Time from
Access Time from
Access Time from Column Address t
to Output in Low-Z
Output Buffer Turn-off Delay from
Transition Time(Rise and Fall) t
Precharge Time
Pulse Width
Hold Time
Hold Time
Pulse Width
to CAS Delay Time
to Column Address Delay Time
to
Precharge Time
Row Address Setup Time t
Row Address Hold Time t
Column Address Setup Time t
Column Address Hold Time t
Column Address Hold Time Referenced
to
Column Address Lead Time Referenced
to
Read Command Setup Time t
Read Command Hold Time Referenced