256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Features :Description :
GLT44016
Aug, 2000(Rev.3.1)
∗ 262,144 words by 16 bits organization.
∗ Fast access time and cycle time.
∗ Dual
Input.
∗ Low power dissipation.
∗ Read-Modify-Write,
-Before-
Refresh and Test Mode Capability.
Refresh, Hidden
-Only Refresh,
∗ 512 refresh cycles per 8ms.
∗ Available in 40-Pin 400 mil SOJ and 40/44
Pin TSOP(II)
∗ Single 5.0V±10% Power Supply.
∗ All inputs and Outputs are TTL
compatible.
∗Extended Data-Out(EDO) Page Mode
operation.
The GLT44016 is a 262,144 x 16 bit
high-performance CMOS dynamic random
access memory. The GLT44016 offers Fast
Page mode with Extended Data Output, and
has both BYTE WRITE and WORD WRITE
access cycles via two
pins. The
GLT44016 has symmetric address and
accepts 512-cycle refresh in 8ms interval.
All inputs are TTL compatible. EDO
Page Mode operation allows random access
up to 512 x 16 bits within a page, with cycle
times as short as 10ns.
The GLT44016 is best suited for
graphics, and DSP applications requiring
high performance memories.
HIGH PERFORMANCE252830354050
Max.
Access Time, (t
RAC
)
Max. Column Address Access Time, (t
)13 ns 13 ns 16 ns 18 ns 20 ns 25 ns
CAA
25 ns 28 ns 30 ns 35 ns 40 ns 50 ns
Min. Extended Data Out Page Mode Cycle Time, (tPC)10 ns 10 ns 12 ns 13 ns 15 ns 20 ns
Min. Read/Write Cycle Time, (tRC)45 ns 45 ns 60 ns 65 ns 70 ns 85 ns
Max.
G-Link Technology Corporation
2701Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
Access Time (t
CAC
)
8 ns8 ns10 ns 11 ns 12 ns 14 ns
G-Link Technology Corporation,Taiwan
6F, No. 24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 1 -
G-LINK
RAS
UCAS
LCAS
WE
OE
Pin Configuration :
GLT44016
256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Aug, 2000(Rev.3.1)
Pin Descriptions:
GLT44016
SOJ Top View
TSOP(Type II)
Top View
NameFunction
A0 - A
DQ1 - DQ
V
V
8
16
CC
SS
NCNo Connection
G-Link Technology Corporation
2701Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
Address Inputs
Row Address Strobe
Column Address Strobe/Upper Byte Control
Column Address Strobe/Lower Byte Control
Write Enable
Output Enable
Data Inputs / Outputs
+5V Power Supply
Ground
G-Link Technology Corporation,Taiwan
6F, No. 24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 2 -
G-LINK
RAS,LCAS
UCAS
OE
CAS
UCAS
LCAS
CAS
RAS
RAS
.
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
I/O8
I/O9
I/O12
I/O13
I/O16
256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Absolute Maximum Ratings*Capacitance*
TA=25°C, VCC=5V±10%, VSS=0V
GLT44016
Aug, 2000(Rev.3.1)
Operating Temperature, TA (ambient)
Symbol
.......................................-0°C to +70°C
C
Storage Temperature(plastic)....-55°C to +150°C
Voltage Relative to VSS...............-1.0V to + 7.0V
IN1
C
IN2
Short Circuit Output Current......................50mA
C
Power Dissipation......................................1.0W
*Note:Operation above Absolute Maximum Ratings can
OUT
*Note: Capacitance is sampled and not 100% tested
abversely affect device reliability.
Electrical Specifications
l
l All voltages are referenced to GND.
l After power up, wait more than 100µs and then, execute eight
means
and
.
refresh cycles as dummy cycles to initialize internal circuit.
Block Diagram :
OE
WE
UCAS
LCAS
RAS
RAS
CLOCK
GENERATOR
CAS
CLOCK
GENERATOR
WE
GENERATOR
Parameter
Address Input
,
Data Input/Output
-before-
CLOCK
OE
GENERATOR
,WE,
CLOCK
or
Max.
5
7
7
Unit
pF
pF
pF
-only
V
CC
V
SS
REFRESH
COUNTER
9
A
0
A
1
.
A
7
A
8
G-Link Technology Corporation
2701Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
ADDRESS BUFFERS
AND PREDECODERS
X0 - x
Y0 - Y
8
Data I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
8
DECODERS
ROW
512 × 16
MEMORY
512
G-Link Technology Corporation,Taiwan
6F, No. 24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 3 -
I/O
BUFFER
I/O10
ARRAY
G-LINK
RAS
UCAS
LCAS
UCAS
LCAS
UCAS
LCAS
Truth Table: GLT44016
GLT44016
256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Aug, 2000(Rev.3.1)
Function
RAS CASL CASHWE OE
StanbyH
H→XH→X
XXHigh-Z
ADDRESSDQsNotes
Read: WordLLLHLROW/COL Data Out
Read: Lower ByteLLHHLROW/COL Lower Byte,Data-Out
Upper Byte,High-Z
Read: Upper ByteLHLHLROW/COL Lower Byte,High-Z
Upper Byte,Data-Out
Write: Word(Early
LLLLXROW/COL Data-In
Write)
Write: Lower Byte
(Early)
Write: Upper Byte
(Early)
Read WriteLLL
EDO-PageMode Read
EDO-PageMode Write
1st Cycle
2nd Cycle
1st Cycle
2nd Cycle
LLHLXROW/COL Lower Byte,Data-In
Upper Byte,High-Z
LHLLXROW/COL Lower Byte,High-Z
Upper Byte,Data-In
H→LL→H
L
L
L
L
H→L
H→L
H→L
H→L
H→L
H→L
H→L
H→L
H
H
L
L
ROW/COL Data-Out,Data-In1,2
L
ROW/COL
L
COL
XXROW/COL
COL
Data-Out
Data-Out
Data-In
Data-In
1
1
2
2
EDO-Page-
1st Cycle
L
H→L
H→L
H→L
Mode ReadWrite
Hidden
2nd Cycle
Read
L
L→H→L
H→L
L
H→L
L
H→L
H
Refresh
-Only Refresh
CBR Refresh
Write
L→H→L
LHHXXROWHigh-Z
H→L
L
L
L
LLXXHigh-Z4
Notes:
1. These READ cycles may also be BYTE READ cycles (either
2. These WRITE cycles may also be BYTE READ cycles (either
3. EARLY WRITE only.
4. At least one of the two CAS signals must be active (
G-Link Technology Corporation
2701Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
- 4 -
L
X
ROW/COL
COL
ROW/COL
ROW/COL
L→H
L→H
or
or
or
G-Link Technology Corporation,Taiwan
6F, No. 24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
).
Data-Out,Data-In
Data-Out,Data-In
Data-Out
Data-In
active).
active).
1,2
1,2
1
2,3
G-LINK
RAS, UCAS
LCAS
RAS
RAS
UCAS
LCAS
RAS
UCAS
LCAS
CAS
RAS
RAS, UCAS
LCAS
RAS
UCAS
LCAS
256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
DC and Operating Characteristics (1-2)
TA = 0°C to 70°C, VCC=5V±10%, VSS=0V, unless otherwise specified.
1.ICC is dependent on output loading when the device output is selected. Specified ICC(max.) is measured with the output open.
2.ICC is dependent upon the number of address transitions specified ICC(max.) is measured with a maximum of one transition per address cycle in
random Read/Write and EDO Fast Page Mode.
3.Specified VIL(min.) is steady state operation. During transitions VIL(min.) may undershoot to -1.0V for a period not to exceed 20ns. All AC
parameters are measured with VIL(min.)≥VSS and VIH(max.)≤VCC.
G-Link Technology Corporation
2701Northwestern Parkway
Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
6F, No. 24-2, Industry E. RD. IV, Science Based
Industrial Park, Hsin Chu, Taiwan.
- 5 -
G-LINK
CAS
RAS
RAS
256K X 16 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
AC Characteristics
TA = 0°C to 70°C , VCC = 5 V ± 10%, VIH/VIL = 2.4/0.8 V, VOH/VOL = 2.0/0.8V
GLT44016
Aug, 2000(Rev.3.1)
An initial pause of 100 µs and 8
-before-
or
-only refresh cycles are required after power-up.
252830354050
ParameterSymbol Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes
Read or Write Cycle Timet
Read Modify Write Cycle Timet
RAS Precharge Time
RAS Pulse Width
Access Time from RAS
Access Time from CAS
Access Time from Column Addresst
CAS to Output Low-Z
CAS to Output High-Z
RAS Hold Time
RAS Hold Time Referenced to OE
CAS Hold Time
CAS Pulse Width
RAS to CAS Delay Time
RAS to Column Address Delay Time
CAS to RAS Precharge Time
Row Address Set-Up Timet
Row Address Hold Timet
Column Address Set-Up Timet
Column Address Hold Timet
Column Address to RAS Lead Timet
Column Address Hold Time Referenced to RAS
Read Command Set-Up Timet
Read Command Hold Time Referenced to CAS
Read Command Hold Time Referenced to RAS