G-LINK GLT41316 Service Manual

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G-LINK
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
Features : Description :
65,536 words by 16 bits organization.Fast access time and cycle time.
Dual
Input.
Low power dissipation.Read-Modify-Write,
-Before-
Refresh and Test Mode Capability.
Refresh, Hidden
-Only Refresh,
256 refresh cycles per 4ms.Available in 40-pin 400 mil SOJ,and 40/44
pin TSOP (II).
Single 5.0V±10% Power Supply.All inputs and Outputs are TTL
compatible. Fast Page Mode operation.
The GLT41316 is a 65,536 x 16 bit high­performance CMOS dynamic random access memory. The GLT41316 offers Fast Page mode ,and has both BYTE WRITE and
WORD WRITE access cycles via two pins. The GLT41316 has symmetric address and accepts 256-cycle refresh in 4ms interval.
All inputs are TTL compatible. Fast Page Mode operation allows random access up to 256x16 bits, within a page, with cycle times as short as 18ns.
The GLT41316 is best suited for graphics, and DSP applications requiring high performance memories.
GLT41316
June 1998 (Rev 2)
HIGH PERFORMANCE 30 35 40 45
Max.
Access Time, (t
RAC
)
30 ns 35 ns 40 ns 45 ns
Max. Column Address Access Time, (tAA) 15 ns 18 ns 20 ns 22 ns Min. Fast Page Mode Cycle Time, (tPC) 18 ns 21 ns 23 ns 25 ns Min. Read/Write Cycle Time, (tRC) 65 ns 70 ns 75 ns 80 ns
Max.
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
Access Time (t
CAC
)
10 ns 11 ns 12 ns 12 ns
G-Link Technology Corporation, Taiwan
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G-LINK
RAS
CAS
UW
LW
OE
Pin Configuration :
GLT41316
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
June 1998 (Rev 2)
Pin Descriptions:
GLT41316
SOJ Top View
TSOP(Type II)
Top View
Name Function
A0 - A
DQ0 - DQ V V
7
15 CC SS
NC No Connection
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
Address Inputs Row Address Strobe
Column Address Strobe Read / Upper Byte Write Enable Read / Lower Byte Write Enable Output Enable Data Inputs / Outputs
+5V Power Supply Ground
G-Link Technology Corporation, Taiwan
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G-LINK
RAS,CAS,UW,LW, OE
WE
UW
CAS
RAS
RAS
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
Absolute Maximum Ratings* Capacitance*
TA=25°C, VCC=5V±10%, VSS=0V
GLT41316
June 1998 (Rev 2)
Operating Temperature, TA (ambient)
Symbol
.......................................-0°C to +70°C
C
Storage Temperature(plastic)....-55°C to +150°C
Voltage Relative to VSS...............-1.0V to + 7.0V
IN1
C
IN2
Short Circuit Output Current......................50mA
C
Power Dissipation......................................1.0W
*Note: Operation above Absolute Maximum Ratings
can adversely affect device reliability.
OUT
*Note: Capacitance is sampled and not 100% tested
Electrical Specifications
l
l All voltages are referenced to GND. l After power up, wait more than 100µs and then, execute eight
means
and LW.
refresh cycles as dummy cycles to initialize internal circuit.
Block Diagram :
Parameter
Address Input
Data Input/Output
-before-
or
Max.
5 7 7
Unit
pF pF pF
-only
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation, Taiwan
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G-LINK
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CAS
UWLWOE
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UW
Truth Table: GLT41316
GLT41316
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
June 1998 (Rev 2)
Function
Standby H Read: Word L L H H L ROW/COL Data Out
Write: Word(Early Write) L L L L X ROW/COL Data-In Write: Lower Byte (Early) L L H L X ROW/COL Lower Byte,Data-In
Write: Upper Byte (Early) L L L H X ROW/COL Lower Byte,High-Z
Read Write L L Fast-Page­Mode Read
Fast-Page­Mode Write
Fast-Page­Mode Read­Write
1st Cycle 2nd Cycle
1st Cycle 2nd Cycle
1st Cycle
2nd Cycle
L L
L L
L
L
HX
HL HL HL HL HL
HL
X X X High-Z
HL HL LH
H H
H
L L
HL
HL
L L
HL
HL
LH
LH
ADDRESS DQs Note
Upper Byte,High-Z
Upper Byte,Data-In
ROW/COL Data-Out,Data-In 1,2 L L
X X
ROW/COL
COL
ROW/COL
COL
ROW/COL
COL
Data-Out Data-Out
Data-In Data-In
Data-Out,Data-In
Data-Out,Data-In
s
1 1
2 2
1,2
1,2
Hidden Refresh
-Only Refresh
CBR Refresh
Read
Write
LHL
LHL
L H X X X ROW High-Z
HL
L
L
L X X X High-Z
H
L
H
L
Notes:
1. These READ cycles are always WORD READ cycles .
2. These WRITE cycles may also be BYTE READ cycles (either
3. EARLY WRITE only.
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
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L
ROW/COL
X
ROW/COL
or LW active).
G-Link Technology Corporation, Taiwan
Data-Out
Data-In
1
2,3
G-LINK
RAC
RAC
RAC
RAC
RAS, CAS
RAS
CAS
RAC
RAC
RAC
RAC
RAS
CAS
RAC
RAC
RAC
RAC
RAS, CAS
RAC
RAC
RAC
RAC
RAS
CAS
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
DC and Operating Characteristics (1-2)
TA = 0°C to 70°C, VCC=5V±10%, VSS=0V, unless otherwise specified.
GLT41316
June 1998 (Rev 2)
Sym. Parameter Test Conditions Access
Time
I
I
I
I
I
I
I
I
V V V V
Input Leakage Current
LI
(any input pin)
0V V
5.5V
IN
(All other pins not under test=0V)
Output Leakage Current
LO
(for High-Z State) Operating Current,
CC1
Random READ/WRITE tRC = tRC (min.)
Standby Current,(TTL)
CC2
Refresh Current,
CC3
RAS-Only
Operating Current,
CC4
EDO Page Mode
Refresh Current,
CC5
CAS Before RAS
Standby Current, (CMOS)
CC6
0V ≤ V
out
5.5V
Output is disabled (Hiz)
at V
IH
other inputs ≥V
cycling,
V
IH
SS
at
tRC = tRC (min.)
at VIL,
address cycling: t
,
PC
=
tPC(min.)
, address cycling: t
= tRC (min.)
RC
VCC-0.2V,
t t t t
t t t t t t t t t t t t
= 30ns = 35ns = 40ns = 45ns
= 30ns = 35ns = 40ns = 45ns = 30ns = 35ns = 40ns = 45ns = 30ns = 35ns = 40ns = 45ns
VCC-0.2V,
All other inputs ≥V
Input Low Voltage -1 +0.8 V 3
IL
Input High Voltage 2.4 VCC+1 V 3
IH
Output Low Voltage IOL = 4.2mA 0.4 V
OL
Output High Voltage IOH = -5mA 2.4 V
OH
SS
Notes:
1. I
is dependent on output loading when the device output is selected. Specified I
CC
output open.
2. ICC is dependent upon the number of address transitions specified I one transition per address cycle in random Read/Write and Fast Page Mode.
3. Specified V to exceed 20ns. All AC parameters are measured with V
is steady state operation. During transitions V
IL(min.)
IL(min.)≥VSS
CC(max.)
may undershoot to -1.0V for a period not
IL(min.)
and V
Min. Typ Max. Unit Notes
-10 +10
-10 +10
180 170 160 150
180 170 160 150 180 170 160 150 180 170 160 150
is measured with the
CC(max.)
is measured with a maximum of
IH(max.)≤VCC
.
µA
µA
mA 1,2
4 mA
mA 2
mA 1,2
mA 1
2 mA
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation, Taiwan
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G-LINK
RAC
RAC
RAC
RAC
RAS
CAS
CAS
CAS
RAS
RAS
RAS
CAS
CAS
RAS
CAS
RAS
CAS
RAS
RAS
RAS
RAS
CAS
WE
CAS
RAS
WE
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
AC Characteristics (0°°C ≤≤ TA ≤≤ 70°°C, See note 1,2)
Test condition:VCC=5.0V±10%, VIH/VIL=2.4V/0.8V,VOH/VOL=2.4V/0.4V
Parameter t
SymbolMIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. Unit Notes
= 30 ns t
= 35 ns t
= 40 ns t
GLT41316
June 1998 (Rev 2)
= 45 ns
Read/Write Cycle Time t Read Midify Write Cycle Time t
Access Time from Access Time from
Access Time from Column Address t
to Output in Low-Z
Output Buffer Turn-off Delay from Transition Time(Rise and Fall) t
Precharge Time Pulse Width Hold Time Hold Time Pulse Width to
Delay Time to Column Address Delay Time to
Precharge Time
Row Address Setup Time t Row Address Hold Time t Column Address Setup Time t Column Address Hold Time t Column Address Hold Time Referenced
to Column Address Lead Time Referenced
to Read Command Setup Time t Read Command Hold Time Referenced
to Read Command Hold Time Referenced
to
Hold Time Referenced to
Write Command Hold Time Referenced to
Pulse Width
RC RWC
t
RAC
t
CAC
AA
t
CLZ
t
OFF
T
t
RP
t
RAS
t
RSH
t
CSH
t
CAS
t
RCD
t
RAD
t
CRP
ASR RAH ASC CAH
t
AR
t
RAL
RCS
t
RRH
t
RCH
t
WCH
t
WCR
t
WP
65 - 70 - 75 - 80 - ns 80 - 99 - 105 - 110 - ns
- 30 - 35 - 40 - 45 ns 3,4
- 10 - 11 - 12 - 12 ns 3,4
- 15 - 18 - 20 - 22 ns 3,4
0 0 - 0 - 0 - ns 3 3 8 3 8 3 8 3 8 ns 7 3 50 3 50 3 50 3 50 ns 2
25 - 25 - 25 - 25 - ns 30 100k 35 100k 40 100K 45 100K ns 10 - 12 - 12 - 13 - ns 30 - 36 - 40 - 46 - ns 10 10000 12 10000 12 10000 13 10000 ns 13 20 17 24 18 28 18 33 ns 4 10 15 12 17 13 20 13 23 ns 4
5 - 5 - 5 - 5 - ns 8 0 - 0 - 0 - 0 - ns
7 - 7 - 8 - 8 - ns 0 - 0 - 0 - 0 - ns 6 - 6 - 6 - 6 - ns
26 - 30 - 34 - 39 - ns
15 - 18 - 20 - 23 - ns
0 - 0 - 0 - 0 - ns 0 - 0 - 0 - 0 - ns 9
0 - 0 - 0 - 0 - ns 9
6 - 6 - 6 - 6 - ns 10
26 - 30 - 34 - 39 - ns 5
6 - 6 - 6 - 6 - ns 10
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation, Taiwan
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G-LINK
RAC
RAC
RAC
RAC
WE
RAS
WE
CAS
RAS
WE
RAS
CAS
CAS
CAS
RAS
CAS
CAS
RAS
RAS
CAS
CAS
CAS
CAS
RAS
RAS
CAS
OE
OE
OE
OE
WE
GLT41316
64K X 16 CMOS DYNAMIC RAM WITH FAST PAGE MODE
June 1998 (Rev 2)
Parameter t
Lead Time Referenced to
Lead Time Referenced to Data-In Setup Time t Data-In Hold Time t
Data Hold Time Referenced to
Setup Time
toWE Delay Time to WE Delay Time
Column Address to WE Delay Time
Setup Time(
Refresh)
Hold Time(
Refresh)
to
Precharge Time
Precharge Time(CBR Counter Test
Cycle) Access Time from
Fast Page mode Read/Write Cycle Time Fast Page mode Read Modify Write
Cycle Time
Precharge Time(Fast Page mode) Pulse Width(Fast Page mode) Hold Time from
Access Time from
to Delay Time
Output Buffer Turn-off Delay Time from
before
before
Precharge
Precharge
= 30 ns t
= 35 ns t
= 40 ns t
= 45 ns
SymbolMIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. Unit Notes
t
RWL
t
CWL
DS DH
t
DHR
t
WCS
t
RWD
t
CWD
t
AWD
t
CSR
t
CHR
t
RPC
t
CPT
t
CPA
t
PC
t
PRWC
t
CP
t
RASP
t
RHCP
t
OEA
t
OED
t
OEZ
10 - 11 - 12 - 12 - ns 10 - 11 - 12 - 12 - ns
0 - 0 - 0 - 0 - ns 11 7 - 7 - 8 - 8 - ns 11
27 - 31 - 36 - 41 - ns 6
0 - 0 - 0 - 0 - ns 5 47 - 58 - 63 - 68 - ns 5 24 - 29 - 30 - 30 - ns 5 29 - 36 - 38 - 40 - ns 5
5 - 5 - 5 - 5 - ns
10 - 10 - 10 - 10 - ns
5 - 5 - 5 - 5 - ns 20 - 20 - 20 - 20 - ns
- 18 - 21 - 23 - 25 ns 3
18 - 21 - 23 - 25 - ns 48 - 60 - 63 - 65 - ns
5.5 - 6 - 7 - 7 - ns 30 100k 35 100k 40
100K
45
100K
ns
25 - 25 - 25 - 30 - ns
- 10 - 11 - 12 - 12 ns 8 - 8 - 8 - 8 - ns 3 8 3 8 3 8 3 8 ns 7
Hold Time
Hold Time(Hidden Refresh Cycle)
Refresh Time(256cycles)
G-Link Technology Corporation
2701Northwestern Parkway Santa Clara, CA 95051, U.S.A.
t
OEH
t
WHR
t
REF
6 - 6 - 7 - 7 - ns
15 - 15 - 15 - 15 - ns
- 4 - 4 - 4 - 4 ms
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