
正基科技股份有限公司
SPECIFICATION
SPEC. NO.
DATE
PRODUCT NAME
: REV: 1.4
: 10.12. 2013
: AP6234
APPROVED CHECKED PREPARED DCC ISSUE
NAME
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AMPAK
AP6234
WiFi 11a/b/g/n +Bluetooth 4.0
SIP Module Spec Sheet
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Revision History
Date Revision Content Revised By Version
2012/10/18 - Initial released Brian 1.0
2012/12/18 - Pin definition modify Joe 1.1
2013/01/23 - Pin definition modify Joe 1.2
2013/04/26 - Specification modify Joe 1.3
2013/10/12 - Block Diagram modify Brian 1.4
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AP6234 Datasheet
Contents
Contents ................................................................................................................... 2
1. Introduction ......................................................................................................... 3
2. Features ............................................................................................................... 4
3. Deliverables ........................................................................................................ 5
3.1 Deliverables .................................................................................................... 5
3.2 Regulatory certifications ................................................................................. 5
4. General Specification ......................................................................................... 6
4.1 General Specification ...................................................................................... 6
4.2 Voltages .......................................................................................................... 6
4.2.1 Absolute Maximum Ratings .................................................................... 6
4.2.2 Recommended Operating Rating ........................................................... 6
The module requires two power supplies: VBAT and VDDIO. ......................... 6
5. WiFi RF Specification ......................................................................................... 7
5.1 2.4GHz & 5GHz RF Specification ................................................................... 7
6. Bluetooth Specification ...................................................................................... 9
6.1 Bluetooth Specification ................................................................................... 9
7. Pin Assignments ............................................................................................... 10
7.1 Pin Outline .................................................................................................... 10
7.2 Pin Definition ................................................................................................ 10
8. Dimensions ....................................................................................................... 12
8.1 Physical Dimensions..................................................................................... 12
8.2 Layout Recommendation .............................................................................. 13
9. External clock reference .................................................................................. 14
9.1 SDIO Pin Description .................................................................................... 14
10.Host Interface Timing Diagram ........................................................................ 15
10.1 Power-up Sequence Timing Diagram ......................................................... 15
10.2 SDIO Default Mode Timing Diagram........................................................... 17
10.3 SDIO High Speed Mode Timing Diagram ................................................... 18
11.Recommended Reflow Profile ......................................................................... 19
12. Package Information ........................................................................................ 20
12.1Label ............................................................................................................ 20
Label C
Label D Carton box label . ................................................................................. 20
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Inner box label . .................................................................................... 20
12.2 Dimension ................................................................................................... 21
12.3 MSL Level / Storage Condition ................................................................... 23
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AP6234 Datasheet
1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module,
with integrated dual band (2.4GHz/5GHz) IEEE 802.11 a/b/g and single-stream IEEE
802.11n MAC/baseband/radio and Bluetooth 4.0.
The integrated module provides SDIO V2.0 Host interface for Wi-Fi, high-speed UART is
provided for the Bluetooth Host interface.
This compact module is a total solution for a combination of Wi-Fi dual mode + BT4.0
technologies. The module is specifically developed for mobiles, tablets or handheld wireless
system devices.
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2. Features
IEEE 802.11x Key Features
• Dual-band 2.4GHz/5GHz 802.11a/b/g/n.
• Single-stream IEEE 802.11n support for 20MHz and 40MHz channels
provides PHY layer rates up to 150Mbps.
• WLAN host interface options: SDIO v2.0 — up to 50 MHz clock rate
• Support a single antenna shared between WLAN and Bluetooth.
• Security: WEP, WPS, WPA, WPA2, WMM, WAPI, AES,…
Bluetooth Features
• Bluetooth V4.0(BLE) Low Energy with provisions for supporting future
specifications.
• Bluetooth Class1 or Class2 transmitter operation.
AP6234 Datasheet
• BT host digital interface UART(up to 4 Mbps) with support all Bluetooth4.0
package types
• Multipoint operation with up to seven active ACL links, three active SCO and
eSCO connections.
• Full support for power savings modes (standard sniff, deep sleep modes)
• ECI - enhanced coexistence support, ability to coordinate BT SCO
transmissions around WLAN receives
A simplified block diagram of the module is depicted in the figure below.
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AP6234 Datasheet
3. Deliverables
3.1 Deliverables
The following products and software will be part of the product.
Module with packaging
Evaluation Kits
Software utility for integration, performance test.
Product Datasheet.
Agency certified pre-tested report with the adapter board.
3.2 Regulatory certifications
The product delivery is a pre-tested module, without the module level certification. For
module approval, the platform’s antennas are required for the certification.
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4. General Specification
4.1 General Specification
AP6234 Datasheet
Model Name AP6234
Product Description Supports Wi-Fi dual mode /Bluetoothfunctionalities
Dimension
WiFi Interface
BT Interface UART/ PCM
Operating temperature -30°C to 85°C
Storage temperature -40°C to 85°C
Humidity
L x W x H: 12.0 x 12.0 x 1.5 (typical) mm
SDIOV2.0
Operating Humidity 10% to 95% Non-Condensing
4.2 Voltages
4.2.1 Absolute Maximum Ratings
Symbol Description Min. Max. Unit
VBAT Input supply Voltage -0.5 5 V
VDDIO Digital/Bluetooth/SDIO/ I/O Voltage -0.5 3.6 V
4.2.2 Recommended Operating Rating
The module requires two power supplies: VBAT and VDDIO.
Min. Typ. Max. Unit
Operating Temperature -30 25 85
VBAT 3.0 3.6 4.8 V
VDDIO 1.6 3.3 3.4 V
deg.C
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