Geniatech D19EC5 UM

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Developer Board 8

Hardware UserGuide

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Contents

1 Introduction

2 Key features........................................................................................................................................................................ 7

3 What’s in the Box..............................................................................................................................................................10

4 Getting started

4.1 Prerequisites

4.2 Starting the board for the first time

5 DragonBoard Overview.................................................................................................................................................... 13

5.1 System Block diagram............................................................................................................................................13

5.2 Processor............................................................................................................................................................... 13

5.3 Memory................................................................................................................................................................. 13

5.4 MicroSD................................................................................................................................................................. 14

........................................................................................................................................................................ 6

..................................................................................................................................................................12

.......................................................................................................................................................... 12

......................................................................................................................12

5.5 WiFi/BT/RF.............................................................................................................................................................14

5.6 Display Interface.................................................................................................................................................... 14

5.6.1 HDMI...........................................................................................................................................................14

5.6.2 MIPI-DSI......................................................................................................................................................14

5.7 Camera Interfaces

5.8 USB Ports

5.8.1 USB-Host ports...........................................................................................................................................15

5.8.2 USB-Device port......................................................................................................................................... 15

5.9 Audio......................................................................................................................................................................15

5.9.1 BT Audio

5.9.2 HDMI Audio

............................................................................................................................................................... 15

..................................................................................................................................................14

..................................................................................................................................................... 15

................................................................................................................................................15

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5.10 Input DC-power

5.11 Measurements.................................................................................................................................................... 16

5.12 Buttons................................................................................................................................................................ 16

...................................................................................................................................................16

5.13 UART

5.14 System and user LEDs

5.15 Expansion Connector

5.16 Additional Functionality......................................................................................................................................17

6 Low speed Expansion connector......................................................................................................................................18

6.1 UART {0/1}............................................................................................................................................................. 19

6.2 I2C {0/1}.................................................................................................................................................................19

6.3 GPIO {A-L}.............................................................................................................................................................. 20

.................................................................................................................................................................... 16

..........................................................................................................................................16

...........................................................................................................................................17

5.16.1 GPS............................................................................................................................................................17

5.16.2 Ethernet Connector..................................................................................................................................17

5.16.3 Mini PCIE connector................................................................................................................................. 17

6.4 SPI 0....................................................................................................................................................................... 20

6.5 PCM/I2S

6.6 Power and Reset

6.7 Power Supplies...................................................................................................................................................... 21

7 High speed expansion connectors....................................................................................................................................22

7.1 Primary high speed expansion connector.............................................................................................................22

7.1.1 MIPI DSI 0

7.1.2 MIPI CSI {0/1}

7.1.3 I2C {2/3}

................................................................................................................................................................. 20

....................................................................................................................................................20

................................................................................................................................................... 23

............................................................................................................................................. 24

......................................................................................................................................................24

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7.1.4 HSIC

7.1.5 Reserved..................................................................................................................................................... 24

7.1.6 SD/SPI......................................................................................................................................................... 24

.............................................................................................................................................................24

7.1.7 Clocks

7.1.8 USB

7.2 Secondary High Speed Connector

7.2.1 Feature information................................................................................................................................... 28

7.2.2 MIPI DSI 1................................................................................................................................................... 28

7.2.3 I2C {CCI_0,CCI _1, SSC_2}...........................................................................................................................28

7.2.3 SPI {SSC_1}..................................................................................................................................................28

7.2.4 TSIF – Transport Stream Interface..............................................................................................................28

7.2.5 Other signals on Secondary High Speed Connector.................................................................................. 28

8 Analog Expansion Connectors.......................................................................................................................................... 29

8.1 16-pin Analog Connector...................................................................................................................................... 29

..........................................................................................................................................................24

............................................................................................................................................................. 25

.........................................................................................................................25

8.1.1Earpiece.......................................................................................................................................................29

8.1.2 Microphones

8.1.3 Headset

9 24 pin Audio Expansion....................................................................................................................................................31

9.1 Analog Microphones............................................................................................................................................. 31

9.2 Digital Microphones.............................................................................................................................................. 32

9.3 Line Out

10 Power management

10.1 DC Power Input

................................................................................................................................................................. 32

.............................................................................................................................................. 29

.......................................................................................................................................................30

....................................................................................................................................................... 33

....................................................................................................................................................33

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10.2 Power Source Selection

10.3 Power Consumption............................................................................................................................................33

10.4 Power Sequencing...............................................................................................................................................33

.......................................................................................................................................33

11 Buttons and status LED’s

11.1 Buttons

11.1.1 Volume up

11.1.2 Volume down........................................................................................................................................... 35

11.1.3 Power Button............................................................................................................................................35

11.1.4 Entering Fastboot..................................................................................................................................... 35

11.1.5 Hard Reset................................................................................................................................................36

11.2 LEDs..................................................................................................................................................................... 36

11.2.1 User LED 1-4.............................................................................................................................................36

11.2.2 Bluetooth status....................................................................................................................................... 36

11.2.3 WiFi status................................................................................................................................................ 36

................................................................................................................................................................ 35

................................................................................................................................................ 35

11.2.4 Power Indicator LED................................................................................................................................. 36

12 Boot configuration

13 Mechanical size marking

..........................................................................................................................................................37

................................................................................................................................................ 38

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1 Introduction

Acronym / Abbreviation

Definition

BOM

Bill Of Materials

Blue Tooth

CLK

Clock

CPU

Central Processing Unit

Chip Select

CSI

Camera Serial Interface

DSI

Display Serial Interface

EMC

Electro-Magnetic Compatibility

EMI

Electro-Magnetic Interference

ENable

ESD

Electro-Static Discharge

GND

GrouND

GPIO

General Purpose I/O

GPS

Global Positioning System

HDMI

High Definition Multimedia Interface

I2C

Inter-Integrated Circuit

I2S

Inter-IC Sound

INT

INTerrupt

ISP

Image Sensor Processor

LDO

Low Drop-Out

LRM

Linear Resonant Actuator

LTE

Long-Term Evolution

MDP

Mobile Display Port

MI2S

Mobile Inter-IC Sound

MIC

Microphone

MIPI

Mobile Industry Processor Interface

MPP

Multi-Purpose Pin

NFC

Near Field Communication

PCB

Printed Circuit Board

PCIE

Peripheral Component Interconnect Express

PWM

Pulse-Width Modulation

Radio Frequency

Receive

SCL

Serial CLock

SDA

Serial DAta

SDC

Secure Digital Interface

SOM

System On Module

SPI

Serial Peripheral Interface

SSC

Snapdragon™Sensor Core

Transmit

UART

Universal Asynchronous Receiver/Transmitter

UIM

User Interface Module

USB

Universal Serial Bus

WLAN

Wireless Local Area Network

Acronyms and abbreviation definitions

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2 Key features

Processor

Qualcomm Snapdragon 820

Quad-core Qualcomm® Kryo™at up to 2.15GHz per core

64-Bit capable

Qualcomm® Adreno™530 624MHz GPU for PC-class graphics with support for advanced

APIs, including OpenGL ES 3.1+, OpenCL, DirectX, and content security

Memory/

Storage

3GB LPDDR4 1866MHz

32GB UFS 2.0

SD 3.0 (UHS-I)

Video

4K UltraHD@30fps video playback and capture with H.264 (AVC) and H.265 (HEVC)

Camera Support

Integrated Dual ISP with support for 3 image sensors up to 28MP

Audio

PCM/AAC+/MP3/WMA, ECNS, Audio+ post-processing (optional)

Connectivity

WLAN 2x2 802.11 b/g/n/ac 2.4 and 5GHz with on-board dual band WLAN antennas

Bluetooth v4.1 with on-board antenna

GbE Ethernet connection

One USB 2.0 micro B (device mode only)

Two USB 3.0 (host mode only)

GPS with On-board GPS antenna

I/O Interfaces

MINI PCIe

One 40-pin Low Speed (LS) expansion connector

• UARTx2, SPI, I2S, I2C x2, GPIO x12, DC power

Primary 60-pin High Speed (HS) expansion connector

• 4L-MIPI DSI, USB, I2C x2, 2L+4L-MIPI CSI, SPI

Secondary 60-pin High Speed (HS) expansion connector

• 4L-MIPI DSI, DC power, 1.8V supply, I2C, Camera Flash control, Display control,

2 x GPIO,Sensor core SPI, 3 x UART, I2C

Audio support including:

• Stereo Speaker and Mono microphone via 3.5mm headset jack

•24 pin audio expansion connector

•3.3V supply, 2 x analog line in, 4 x analog line out, speaker amp control, 2 x

digital microphone links supporting a total of 4 microphones

•16 pin audio expansion connector

•stereo headset/line out, speaker and analog line in

Camera connector based upon 96boards camera interface addendum. 30 pin connector

The Developer Board 8 (hereinafter referred to as DB8) board is a 96Boards compliant community board based on

Qualcomm® Snapdragon™ 820 processor.

The following table lists its key features:

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ZIF connector with 4L-CSI, DC power, 5V and 3.3V supply, camera control signals, I2C.

The DB8 board can be made compatible with Arduino compatible shield using an add-on

mezzanine. Go to:

http://www.96boards.org/product/sensors-mezzanine/

For more information about compatible mezzanine cards

External Storage

Micro SD card slot

User Interface

Switches

• Power/Reset

• Volume Up

• Volume down

6 LED indicators

• 4 - user controllable

• 2 - for radios (BT and WLAN activity)

OS-support

Linux Debian

Android

Power,

Mechanical and

Environmental

Input voltage: +6.5V to +18V

Dimensions: 100mm by 85mm meeting 96Boards™ Consumer Edition ’extended’

dimensions specifications.

Operating Temp: 0°C to +40°C

RoHS and Reach compliant

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2.1 Board overview

(J11) Ethernet Connector

(J23) Power Jack

(J7) Analog Expansion Connector

(J15) MINI PCIE Connector

(J16) 3.5mm Headset Jack

(J20) Secondary High Speed Connector

(J21) 24 pin Audio Connector

(J8) Low Speed Connector

(LED1) Power up indicator

10.

(GPS)GPS Antenna

11.

(SH1)Shield Compartment containing

APQ8096/LPDDR4, PM8996, WGR7640

12.

(S6) Power Button

(S5 S7) Vol+/Vol- Buttons

13.

(J24) microSD connector

14.

(J9) Primary High Speed Connector

15.

(J6)HDMI Connector

16.

(J4) Micro USB Type B Connector

17.

Bluetooth/WLAN LED’s

18.

(J3) USB Host1 connector

19.

User LEDs 1-4

20.

(J2) USB Host2 connector

(J38)WLAN/BT Antenna

22.

(J40)WLAN Antenna2

23.

(S1) Boot Switches

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3 What’s in the Box

The box contains one DB8 development Core Board and one DB8 development Carrier Board.

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4 Getting started

● DB8 board

● A 96Boards compliant power supply (sold separately by Arrow) Input voltage range of 6.5-18V, recommended

● A HDMI or DVI LCD Monitor that supports a minimum resolution of 1080P/30Hz

● HDMI-HDMI cable or HDMI-DVI cable to connect the board to the Monitor

●

A computer keyboard with USB interface

● A computer mouse with USB interface

4.1 Prerequisites

Before you power up your DB8 for the first time you will need the following:

input current of 2A minimum.

4.2 Starting the board for the first time

To start the board, follow these simple steps:

step 1. Connect the HDMI cable to the DB8 HDMI connector (marked J6) and to the LCD Monitor.

step 2. Connect the mouse and keyboard to the DB8 USB connectors marked J2 and. (It doesn’t matter which order

you connect them in. You can also connect via an external USB Hub.)

step 3. Ensure that the boot switches S1 are set to ‘0000’, all in Off position.

step 4. Connect the power supply to power connector J23.

step 5.

The board will start the booting process, and you should see Linux or Android boot up. The ’power up’ Green LED

‘LED1’ should illuminate.

Please note that the first boot takes 3-4 minutes due to first time initialization. Subsequent boot times should be faster in

the range of 1-2 minutes.

Plug the power supply into a power outlet.

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5 DB8 Overview

●

The LPDDR4 interfaces directly to the APQ8096 built-in LPDDR controller. The maximum DDR clock is 1866 Mhz.

● The UFS flash memory interfaces with APQ8096 over a dedicated UFS/M-PHY bus supporting the UFS 2.0

5.1 System Block diagram

5.2 Processor

The Snapdragon 820 (APQ8096) processor has a quad 64-bit Qualcomm® Kryo™ CPU,supporting LPDDR4 SDRAM

interface, Hexagon 680 DSP, 28 MP camera input support, Adreno 530 GPU, 4K Ultra HD video encode/decode,

gpsOneGen 8C with GLONASS, Bluetooth 4.1, OpenGL ES 3.1+, DirectX, OpenCL, Renderscript Compute, FlexRender

support.

5.3 Memory

The DB8 uses a package on package (PoP) LPDDR4 RAM configuration and discrete UFS 2.0 flash memory

specification.

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5.4 MicroSD

● 4 lane CSI camera on camera connector J20

● 4 lane CSI camera on primary high speed connector J9

●

2 lane CSI camera on primary high speed connector J9

The 96Boards specification calls for a microSD socket to be present on the board.

The DB8 µSD slot (J24) signals are routed directly to the APQ8096 SDC2 interface. The slot is a push-push type with a

dedicated support for card detect signal (many µSD slots do not have a dedicated CD pins, they use DATA3 state as the card

detected signal). The DB8 uses APQ GPIO_38 as the SD_CARD_DET_N.

5.5 WiFi/BT/RF

The 96Boards specifications calls for a WiFi (minimally 802.11g/n) and Bluetooth 4.1

The DB8 uses Qualcomm QCA6174A module solution that integrates two wireless connectivity technologies into a single

device, the interfaces are:

● WLAN compliant with IEEE 802.11 b/g/n/ac specifications, exceeding 96Boards minimal requirements for WiFi.

● Bluetooth compliant with the BT specifications version 4.1 (BR/EDR), meeting the 96Boards requirements for

BT.

5.6 Display Interface

5.6.1 HDMI

The 96Boards specification calls for an HDMI port to be on the board. The DB8 provides native support for an HDMI

interface. It supports a resolution up to 4K Ultra HD resolution at 60Hz.

5.6.2 MIPI-DSI

The 96Boards specification calls for a MIPI-DSI implementation via the High Speed Expansion Connector.

The DB8 implements a four-lane MIPI_DSI on the primary high speed connector interface which meets the 96boards MIPI-DSI high

speed connector requirement. An additional four-lane MIPI_DSI bus is implemented on the secondary high speed connector. More

information about this implementation can be found in chapter7 High speed expansion connector.

5.7 Camera Interfaces

The 96Boards specification calls for two camera interfaces.

The DB8 implements three camera interfaces.

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The DB8 includes an on-board 4-lane MIPI-CSI camera bus, routed to a 30 pin ZIF connector.

More information about this implementation can be found in chapter 7 High speed expansion connector.

5.8 USB Ports

5.8.1 USB-Host ports

The 96Boards specification calls for three USB host ports.

The DB8 supports 3 USB Host ports as follows.

Port 1 of the USB HUB is routed to J2, a Type ‘A’ USB Host 3.0 (Superspeed) connector. A current limited controller (U23)

sets the Power Current limit to 1.0A. This port is named HOST1 in the board schematic.

Port 2 of the USB HUB is routed to J3, a Type ‘A’ USB Host 3.0 (Superspeed) connector. A current limited controller (U23)

sets the Power Current limit to 1.0A. This port is named HOST2 in the board schematic.

Port 3 of the USB HUB is routed to the High Speed Expansion connector. No current limited controller is implemented on

the board for this channel.

5.8.2 USB-Device port

The 96Boards specification calls for a USB port to be implemented as an OTG port or a device port.

The DB8 implements a USB device port. The port is located at J4, a MicroUSB type B. If an application requires the use of

the device port, USB HUB_SEL switch (S1-4) shall be set to ‘0’ which is the default setting. Setting USB_SEL switch S1-4 to

‘ON’ will put the DB8 into Emergency Download mode (EDL) which will render the device

unusable for all other functionality.

5.9 Audio

The 96Boards specifications calls for a minimum of single channel audio through two interfaces, BT and

HDMI/MHL/DisplayPort.

The DB8 meets this requirement with HDMI support and has additional audio channels, including support for headset

jack. More information about these additional channels can be found in sections 8 and 9.

Note that MHL is not supported.

5.9.1 BT Audio

The BT 4.1 implementation on the DB8 is via a MAC in the APQ8096 and an external modem, contained in the WIFI/BT

module.

5.9.2 HDMI Audio

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HDMI audio is carried over the HDMI signals to the HDMI connector (J6).

● 8V to 18V input voltage power supplied from a dedicated DC jack

● 8V to 18V input voltage power supplied from the SYS_DCIN pins on the Low Speed Expansion Connector

• WiFi activity LED – DB8 drives this Yellow LED via MPP_2, an IO from the PMIC.

• BT activity LED – DB8 drives this Blue LED via MPP_4 an IO from the PMIC.

5.10 Input DC-power

The 96Boards specification calls for power to be provided to the board in one of the following ways:

Please see section 10 for detailed information on DB8 implementation of DC Power. Note that the DB8 does not

support USB Type C.

5.11 Measurements

The 96Boards specification calls for support for measuring power consumptions of the board.

Please see the power measurement section for detailed information on DB8 power measurement

implementation.

5.12 Buttons

The 96Boards specification calls for the presence of two buttons, a Power on/sleep button and a Reset button.

This board meets these requirements. Please see section 11 for detailed information on the buttons of the DB8.

5.13 UART

The 96Boards specification calls for support for one SoC UART and an optional second UART both to be routed to the Low

Speed Expansion Connector.

The DB8 routes 2 UARTs to the low speed connector.

5.14 System and user LEDs

The 96Boards specifications calls for six LEDs to be implemented on the board. The specification defines the LEDs color

and mechanical location on the board.

Two activity LEDs:

Four User-LEDs:

The four user LEDs are surface mount Green in 0603 size located next to the two USB type A connector and labeled ‘USER

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LEDS 3 2 1 0’. The DB8 drives three LEDs from the red, green and blue LED drive from power management IC PMI8996. The

fourth User LEDs is driven by the PMI8996 via PM MPP2.

Power indicator LED:

A blue LED is included to indicate the presence of input power to the DB8.

5.15 Expansion Connector

The 96Boards specification calls for two Expansion Connectors, a Low Speed and a High Speed.

The DB8 meets this requirement for low speed and exceeds it by having two high speed connectors, please review section

6 for detailed information regarding the Low Speed Expansion Connector and section 7 for detailed information regarding

the High Speed Expansion Connectors.

5.16 Additional Functionality

The 96Boards specifications allows for additional functionality provided that all mandatory functionality is available and

there is no impact on the physical footprint specifications including height and do not prevent the use of the 96Boards CE

low speed and high speed expansion facilities

The DB8 implements additional functions, which are listed in the following sub-chapters.

5.16.1 GPS

The GPS implementation is based on Qualcomm WGR7640 GNSS RF receiver (U5) supporting GPS, GLONASS and

COMPASS. The APQ8096 communicates directly with the WGR7640.

5.16.2 Ethernet Connector

Gigabit Ethernet is supported by Qualcomm AR8151 controller and uses an RJ45 as the physical interface.

5.16.3 Mini PCIE connector

The DB8 includes a mini PCIE (PCI express) connector. This enables integration of HW peripherals which are compliant to

the PCIE mini specification.

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6 Low speed Expansion connector

96Boards Signals

DB8 Signals

Note

GND

UART0_CTS

BLSP9_UART_CTS_N(APQ GPIO_51)

UART0_TxD

BLSP9_UART_TX (APQ GPIO_49)

UART0_RxD

BLSP9_UART_RX (APQ GPIO_50)

UART0_RTS

BLSP9_UART_RFR_N (APQ GPIO_52)

UART1_TxD

BLSP8_UART_TX(APQ GPIO_4)

UART1_RxD

BLSP8_UART_RX (APQ GPIO_5)

I2C0_SCL

BLSP3_I2C_SCL (APQ GPIO_48)

I2C0_SDA

BLSP3_I2C_SDA(APQ GPIO_47)

I2C1_SCL

BLSP8_I2C_SCL (APQ GPIO_7)

I2C1_SDA

BLSP8_I2C_SDA (APQ GPIO_6)

GPIO-A

MEMS_RESET_N (APQ GPIO_80)

GPIO-C

TS_INT0 (APQ GPIO_124)

GPIO-E

APQ_GPIO62 (APQ GPIO_62)

GPIO-G

MDP_VSYNC_P (APQ GPIO_10)

GPIO-I

CAM0_RST_N(APQ GPIO_25)

GPIO-K

CAM2_RST_N(APQ GPIO_23)

+1V8

VREG_S4A_1P8

+5V

VREG_5P0

GND

The following tables show the Low Speed Expansion Connector pin out:

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96Boards

Signals

DB8 Signals

Note

GND

PWR_BTN_N

BTN_PHONE_ON_N

RST_BTN_N

BTN_RESIN_N

SPI0_SCLK

BLSP1_SPI_CLK (APQ GPIO_3)

SPI0_DIN

BLSP1_SPI_MISO (APQ GPIO_1)

SPI0_CS

BLSP1_SPI_CS_N (APQ GPIO_2)

SPI0_DOUT

BLSP1_SPI_MOSI (APQ GPIO_0)

PCM_FS

QUA_MI2S_WS (APQ GPIO_59)

PCM_CLK

QUA_MI2S_SCK (APQ GPIO_58)

PCM_DO

QUA_MI2S_DATA0 (APQ GPIO_60)

PCM_DI

QUA_MI2S_DATA1 (APQ GPIO61)

GPIO-B

TS0_RESET_N (APQ GPIO_29)

GPIO-D

APQ_GPIO24 (APQ GPIO_24)

GPIO-F

BL0_PWM (PM_GPIO_5)

Used GPIO from PMIC

GPIO-H

LCD0_RESET_N (APQ GPIO_8)

GPIO-J

CAM0_STANDBY_N (APQ GPIO_26)

GPIO-L

CAM2_STANDBY_N (APQ GPIO_133)

SYS_DCIN

DC_IN

SYC_DCIN

DC_IN

GND

6.1 UART {0/1}

The 96Boards specifications calls for a 4-wire UART implementation, UART0 and an optional second 2-wire UART, UART1

on the Low Speed Expansion Connector.

The DB8 implements UART0 as a 4-wire UART that connects directly to the APQ8096 SoC. These signals are driven at

1.8V.

The DB8 implements UART1 as a 2-wire UART that connects directly to the APQ8096 SoC. These signals are driven at

1.8V.

6.2 I2C {0/1}

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The 96Boards specification calls for two I2C interfaces to be implemented on the Low Speed Expansion Connector.

● Note: GPIO C - Connects to GPIO_125 of APQ8096 SoC, can serves as TS_INT0 supporting the

The DB8 implements both interfaces, I2C0 and I2C1 that connects directly to the APQ8096 SoC. A 2.2K resistor is

provided as pull-up for each of the I2C lines per the I2C specifications, these pull-ups are connected to the 1.8V voltage

rail.

6.3 GPIO {A-L}

The 96Boards specifications calls for 12 GPIO lines to be implemented on the Low Speed Expansion Connector. Some of

these GPIOs may support alternate functions for DSI/CSI control

The DB8 implements this requirement. 11 GPIOs are routed to the APQ8096 SoC and one GPIO is connected to the

on-board PMIC. All are 1.8V signals. Reference the connector pinout table for details regarding GPIO assignments

96Boards requirements to create a wake-up event for the SoC.

6.4 SPI 0

The 96Boards specification calls for one SPI bus master to be provided on the Low Speed Expansion Connector.

The DB8 implements a full SPI master with 4 wires, CLK, CS, MOSI and MISO all connect directly to the APQ8096 SoC.

These signals are driven at 1.8V.

6.5 PCM/I2S

The 96Boards specification calls for one PCM/I2S bus to be provided on the Low Speed Expansion Connector. The CLK, FS

and DO signals are required while the DI is optional.

The DB8 implements a PCM/I2S with 4 wires, CLK, FS, D0 and DI. The I2S signals are connected directly to the APQ8096

SoC. These signals are driven at 1.8V.

6.6 Power and Reset

The 96Boards specification calls for a signal on the Low Speed Expansion Connector that can power on/off the board and a

signal that serves as a board reset signal.

The DB8 routes the PWR_BTN_N (named PHONE_ON_N on DB8 schematic) signal to the KYPDPWR_N pin of the PMI8996

PMIC. This signal is driven by S2 as well, the on-board power on push-button switch. Please note that the push button only

provides an On/Sleep function and not OFF functionality.

A mezzanine implementation of this signals should not drive it with any voltage, the only allowed operation is to force it to

GND to start the board from a sleep mode. A board shutdown will occur when this signal is held to ground for more than

15 seconds.

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The DB8 routes the RST_BTN_N (named PM_RESIN_N on DB8 schematic) signal to the RESIN_N pin of the PMI8996 PMIC.

●

+1.8V

: Max of 100mA

● +5V: Able to provide a minimum of 5W of power (1A).

● SYS_DCIN : 9-18V input with enough current to support all the board functions or the output DCIN from

This signal is driven by S4, the on-board reset switch. This signals is a dual purpose, any press lasting less than 10 seconds

serves as Volume Down or Zoom out, a press longer than 10 seconds will reset the board.

6.7 Power Supplies

The 96Boards specification calls for three power rails to be present on the Low Speed Expansion Connector:

on-board DC Connector able to provide a minimum of 7W of power.

The DB8 supports these requirements as follows:

+1.8V

+5V : Driven by the 5A 5.0V DC to DC converter (on carrierboard-U37). This buck switcher powers both USB limit current

devices (each at 1.0A max). The remaining capacity provides a max current of 3A to the Low Speed Expansion Connector,

for a total of 8.2W which meets the 96Boards requirements.

SYS_DCIN: Can serves as the board’s main power source or can receive power from the board. It supports a minimum of

7W.

: Driven by PMIC LDO VREG_S4, which can provide 100mA.

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7 High speed expansion connectors

96Boards Signals

DB8 Signals

Note

SD_DAT0/SPI1_DOUT

BLSP12_SPI_MOSI (APQ GPIO_85)

This is a SPI implementation. not

an SD interface

No HSIC implementation

SD_DAT1

N.C.

SD_DAT2

N.C.

SD_DAT3/SPI1_CS

BLSP12_SPI_CS_N (APQ GPIO_87)

SD_SCLK/SPI1_SCLK

BLSP12_SPI_CLK (APQ GPIO_88)

SD_CMD/SPI1_DIN

BLSP12_SPI_MISO (APQ GPIO_86)

GND

CLK0/CSI0_MCLK

CAM_MCLK0 (APQ GPIO_13)

CLK1/CSI1_MCLK

CAM_MCLK2 (APQ GPIO_15)

GND

DSI_CLK+

MIPI_DSI0_CLK_P

DSI_CLK-

MIPI_DSI0_CLK_M

GND

DSI_D0+

MIPI_DSI0_LANE0_P

DSI_D0-

MIPI_DSI0_CLK_M

GND

DSI_D1+

MIPI_DSI0_LANE1_P

DSI_D1-

MIPI_DSI0_LANE1_M

GND

DSI_D2+

MIPI_DSI0_LANE2_P

DSI_D2-

MIPI_DSI0_LANE2_M

GND

DSI_D3+

MIPI_DSI0_LANE3_P

DSI_D3-

MIPI_DSI0_LANE3_M

GND

USB_D+

USB_HS_D_P_EXP

USB_D-

USB_HS_D_M_EXP

GND

HSIC_STR

N.C.

HSIC_DATA

N.C.

7.1 Primary high speed expansion connector

The following table shows the High Speed Expansion Connector pin out:

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96Boards Signals

820c Signals

Note

CSI0_C+

MIPI_CSI0_CLK_P

CSI0_C-

MIPI_CSI0_CLK_M

GND

CSI0_D0+

MIPI_CSI0_LANE0_P

CSI0_D0-

MIPI_CSI0_LANE0_M

GND

CSI0_D1+

MIPI_CSI0_LANE1_P

CCSI0_D1-

MIPI_CSI0_LANE1_M

GND

CSI0_D2+

MIPI_CSI0_LANE2_P

CSI0_D2-

MIPI_CSI0_LANE2_M

GND

CSI0_D3+

MIPI_CSI0_LANE3_P

CSI0_D3-

MIPI_CSI0_LANE3_M

GND

I2C2_SCL

CCI_I2C_SCL0 (APQ GPIO_18)

I2C2_SDA

CCI_I2C_SDA0 (APQ GPIO_17)

I2C3_SCL

BLSP7_I2C_SCL (APQ GPIO_56)

I2C3_SDA

BLSP7_I2C_SDA (APQ GPIO_55)

GND

CSI1_D0+

MIPI_CSI2_LANE0_P

CSI1_D0-

MIPI_CSI2_LANE0_M

GND

CSI1_D1+

MIPI_CSI2_LANE1_P

CSI1_D1-

MIPI_CSI2_LANE1_M

GND

CSI1_C+

MIPI_CSI2_CLK_P

CSI1_C-

MIPI_CSI2_CLK_M

GND

RESERVED

VREG_S4A_1P8

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7.1.1 MIPI DSI 0

The 96Boards specification calls for a MIPI-DSI to be present on the High Speed Expansion Connector. A minimum of one

lane is required and up to four lanes can be accommodated on the connector.

The DB8 implementation supports a full four lane MIPI-DSI interface that is routed to the Primary High Speed

Expansion Connector.

7.1.2 MIPI CSI {0/1}

The 96Boards specification calls for two MIPI-CSI interfaces to be present on the High Speed Expansion Connector. Both

interfaces are optional. CSI0 interface can be up to four lanes while CSI1 is up to two lanes.

The current DB8 implementation supports a full four lane MIPI-CSI interface on CSI0 and two lanes of MIPI-CSI on

CSI2. All MIPI-CSI signals are routed directly to/from the APQ8096.

7.1.3 I2C {2/3}

The 96Boards specification calls for two I2C interfaces to be present on the High Speed Expansion Connector. Both interfaces

are optional unless a MIPI-CSI interface has been implemented. Then an I2C interface shall be implemented.

The current DB8 implementation supports two MIPI-CSI interfaces and therefore must support two I2C interfaces.

For MIPI-CSI0 the companion I2C2 is routed directly from the APQ8096. For MIPI-CSI2, the companion I2C is I2C3.

7.1.4 HSIC

The 96Boards specification calls for an optional MIPI-HSIC interface to be present on the High Speed Expansion Connector.

The DB8 implementation doesn’t support this optional requirement.

7.1.5 Reserved

The 96Boards specification calls for a 100K pull-up to 1.8V to be connected to pin 60 of the High Speed Expansion

Connector.

The DB8 utilizes a 100K pull-up (R147) on pin 60.

7.1.6 SD/SPI

The 96Boards specification calls for an SD interface or a SPI port to be part of the High Speed Expansion Connector.

The DB8 implements a full SPI master with 4 wires (96Boards SPI Configuration), CLK, CS, MOSI and MISO all connect

directly to the APQ8096 SoC. These signals are driven at 1.8V.

7.1.7 Clocks

The 96Boards specification calls for one or two programmable clock interfaces to be provided on the High Speed

Expansion Connector. These clocks may have a secondary function of being CSI0_MCLK and CSI1_MCLK. If these clocks

Page 25

can’t be supported by the SoC than an alternative GPIO or No-Connect is allowed by the specifications.

The DB8 implements two CSI clocks, CAM_MCLK0 via APQ GPIO_13 for CSI0 and CAM_MCLK2via APQ GPIO_15 for

CSI1. These signals are driven at 1.8V.

7.1.8 USB

The 96Boards specification calls for a USB Data line interface to be present on the High Speed Expansion Connector.

The DB8 implements this requirement by routing USB channel 3 from the USB HUB to the High Speed Expansion

Connector.

7.2 Secondary High Speed Connector

Given the extensive I/O available on the APQ8096, a second high speed connector(on carrierboard-J20) has been added

to support additional interfaces for development and integration.

Currently, the SW supporting these features is pre-commercial and many features are not implemented. Refer to the

notes section in the table regarding SW support.

While there are functions assigned for primary usages such as I2C bus, SPI bus, etc., most pins can be repurposed as

GPIOs if needed and their GPIO # assignments are included for reference. The following table shows the Secondary

High Speed Expansion Connector pin out:

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DB8 Signals

Note

SSC_SPI_1_MOSI(APQ SSC10)

Currently not configured in SW

SSC_SPI_1_CS_N (APQ SSC8)

Currently not configured in SW

SSC_SPI_1_CLK (APQ SSC9)

Currently not configured in SW

SSC_SPI_1_MISO(APQ SSC11)

Currently not configured in SW

GND

CAM_MCLK1(APQ-GPIO14)

GND

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_M

GND

MIPI_DSI1_LANE0_P

MIPI_DSI1_LANE0_M

GND

MIPI_DSI1_LANE1_P

MIPI_DSI1_LANE1_M

GND

MIPI_DSI1_LANE2_P

MIPI_DSI1_LANE2_M

GND

MIPI_DSI1_LANE3_P

MIPI_DSI1_LANE3_M

GND

DC_IN

Page 27

DB8 Signals

Note

MIPI_CSI1_CLK_P

MIPI_CSI1_CLK_M

GND

MIPI_CSI1_LANE0_P

MIPI_CSI1_LANE0_M

GND

MIPI_CSI1_LANE1_P

MIPI_CSI1_LANE1_M

GND

MIPI_CSI1_LANE2_P

MIPI_CSI1_LANE2_M

GND

MIPI_CSI1_LANE3_P

MIPI_CSI1_LANE3_M

GND

CCI_I2C_SCL0 (APQ GPIO_18)

CCI_I2C_SDA0 (APQ GPIO_17)

CCI_I2C_SCL1 (APQ GPIO_20)

CCI_I2C_SDA1 (APQ GPIO_19)

GND

VREG_S4A_1P8

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7.2.1 Feature information

●

CCI_I2C_0

● CCI_I2C_1

●

1.8V supply

●

DC_IN 6.5V to 18V with up to 500mA maximum per pin on two pins

●

CAM_MCLK1(APQ-GPIO14)

Please refer to table notes column regarding which features are currently supported in SW.

7.2.2 MIPI DSI 1

The secondary high speed connector supports a 4-lane MIPI-DSI bus.

7.2.3 I2C {CCI_0,CCI _1, SSC_2}

The secondary high speed connector supports two I2C busses.

These busses can also be used as generic GPIOs.

7.2.3 SPI {SSC_1}

The secondary high speed connector supports one SPI bus- SSC_SPI_1.

This bus can also be used as generic GPIOs.

7.2.4 Other signals on Secondary High Speed Connector

Other signals include

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8 Analog Expansion Connectors

Function

Connect to

Note

CDC_EAR_M

CDC_EAR_P

VPH_PWR

GND

CDC_IN1_M

CDC_IN4_P

Mic 4 can be used for ANC headset

CDC_IN1_P

CDC_HPH_R

HPH_REF

CDC_HPH_L

MBHC_HS_DET_L

Mechanical insertion detection

MIC_BIAS2

CDC_IN4_M

Mic 4 can be used for ANC headset

CDC_IN3_M

Mic 3 can be used for ANC headset

N.C.

CDC_IN3_P

Mic 3 can be used for ANC headset

● CDC_EAR_M

●

CDC_EAR_P

● MIC1

● MIC3 Can be used as part of an active noise canceling (ANC) system

●

MIC4 Can be used as part of an active noise canceling (ANC) system

8.1 16-pin Analog Connector

Unless otherwise noted, these signals interface to the WCD9335 codec (U3).

8.1.1 Earpiece

The earpiece signals are routed from the WCD9335 codec, the two signals are:

8.1.2 Microphones

The 3 analog microphones are connected to the WCD9335 codec, the three mics are:

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● MIC_BIAS2 Ground reference

8.1.3 Headset

●

CDC_HPH_R

- Headphone PA right channel output

● CDC_HPH_L - Headphone PA left channel output

● HPH_REF - Headphone PA ground sensing

● MBHC_HS_DET_L - Headset detection

The headset signals are rounded from the WCD9335 codec, one signal is routed from the connector to the CODEC, the

singles are:

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9 24 pin Audio Expansion

Function

Connect to

Note

CDC_IN5_M

CDC_IN6_M

CDC_IN5_P

CDC_IN6_P

MIC_BIAS3

MIC_BIAS1

GND

SPKR_AMP_EN1

PMI8996 (U1)

CDC_SWR_CLK

CDC_SWR_DATA

SPKR_AMP_EN2

PMI8996 (U1)

GND

CDC_DMIC_CLK1

CDC_DMIC_CLK2

CDC_DMIC_DATA1

CDC_DMIC_DATA2

CDC_LINE_OUT2_M

CDC_LINE_OUT2_P

CDC_LINE_OUT1_M

CDC_LINE_OUT1_P

CDC_LINE_REF

VREG_3P3

3.3V from U20 buck switcher

CDC_LINE_OUT4

CDC_LINE_OUT3

●

MIC5

● MIC6

Unless otherwise noted, these signals interface to the WCD9335 codec (U3).

9.1 Analog Microphones

The 24 pin audio expansion connector supports 2 additional analog microphone inputs:

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● MIC_BIAS1, _BIAS3: Ground reference

9.2 Digital Microphones

●

DMIC_1

● DMIC_2

● Audio Amplifier interface. The 24 pin audio expansion connector supports the following interface and control of

● Amplifier control via SPKR_AMP_EN1, _EN2

The 24 pin audio expansion connector supports 2 additional analog microphone inputs:

9.3 Line Out

The 24 pin audio expansion connector supports 4 line outputs:

Line_Out1, Line_Out2: Differential drivenLine_Out3, Line_out4: Single ended with CDC_Line_Ref to use as a reference

ground.

audio amplifiers: Soundwire (CDC_SWR_CLK, SWR_DATA): Used and audio interface to Qualcomm WSA8810 or

8815 speaker amplifiers.

Page 33

10 Power management

●

An 8V to 18V power from a dedicated DC jack.

o The DB8 supports this requirement through the use of J23, ‘SYS_DCIN’ power connector. Please

●

Note that the DB8 operates from a ~24W supply such as a 12V/2A supply. An 8V to 18V power from the SYS_DCIN pins

The 96Boards specification defines how power arrives to the board and few supplies that the board needs to provide. The

on board power requirement for each 96Boards implementation depends on the SoC and the set of peripherals that are

specific to that implementation.

The DB8 uses three buck regulators,(carrierboard) U37, U38 and U35. U38 takes the power in to the board and generates

3.8V at 6A. This voltage serves as the power in voltage to the on-board PMI8996 IC. U37 takes the power in to the board

and generates 5V at 5A. This voltage feeds the USB HOST power limit switches, provides power to the Low Speed Expansion

port and other HW peripheral interfaces. U35 takes the power in to the board and generates 3.3V at 5A. 3.3V is used to

power HW peripherals as well as to expansion connectors.

10.1 DC Power Input

The 96Boards specification calls for a power to be provided to the board in one of the following ways:

note:the SYS_DCIN can be as low as 6.5V on the DB8.

on the Low Speed Expansion Connector.

Please note: the SYS_DCIN can be as low as 6.5V on the DB8. The DB8

supports incoming power through this connector.

10.2 Power Source Selection

Following the information in section 9.1, the DB8 has only two sources for board incoming power. The 96Boards

specification calls for only one power source to be applied to the board at any given time. Following this requirement,

the user of the DB8 should never apply power to the board from J1 and the Low Speed Expansion connector at the

same time.There is no active or passive mechanism on the DB8 to prioritize one source over the other.

10.3 Power Consumption

TBD

10.4 Power Sequencing

Upon applying power to the DB8 (either one of the two sources), both buck regulators will be enabled and will start

regulating their target voltages. When the output of U38 is on, it will power the on-board PMIC, the PMI8996. PMI8996

generates VPH_PWR which supplies the PM8996. The sequencing of all power rails is set within the PMIC configuration

Page 34

scheme during the production of this part. The user has no access to alter, modify or change the PMIC power up

sequencing.

Page 35

11 Buttons and status LED’s

●

You can put the device to sleep by pressing this button momentarily.

●

You can wake the device from sleep by pressing this button momentarily.

●

While the device is awake, pressing and holding the power button S6 for longer than 15 seconds will result in the

●

Once powered off, pressing and holding the power button S6 for longer than 15 seconds will result in the device

●

While the device is awake, pressing and holding the power button S6 for ~2-3 seconds seconds will result in the

●

Using a mouse, clicking on this notifier will cause the DB8 to power off.

●

Once powered off, pressing and holding the power button S6 for longer than 2-3 seconds will result in the device

11.1 Buttons

11.1.1 Volume up

The Volume UP button (S5) is used to control the audio volume of the DB8.

11.1.2 Volume down

The Volume Down button (S7) is used to control the audio volume of the DB8.

11.1.3 Power Button

The push-button S6 serves as the power-on/off/sleep button. Upon applying power to the board, the boot process will

start. Once the board is powered on and booted up:

Sleep/suspend

Power Off/On

Option 1: Long press/hold

device powering off.

powering on.

user interface displaying the ‘power off’ notifier:

powering on.

11.1.4 Entering Fastboot

Holding down power and volume down buttons at power of the DB8 will force the device to enter fastboot mode.

Page 36

11.1.5 Hard Reset

Holding power and volume down buttons for 15 seconds will force a hard reset of the DB8.

11.2 LEDs

There are two status LEDs and four User LEDs on the DB8. The Status LEDs report the status of the Bluetooth and

Wi-Fi devices onboard. The user LEDs are driven by the SoC directly.

11.2.1 User LED 1-4

The four user LEDs are surface mount Green LEDs, 0603 size, labeled ‘DS2 DS1 DS0 DS3’.

11.2.2 Bluetooth status

The BT LED on the carrierboard is located beside the WIFI LED; this LED reflects the status of the Bluetooth device.

11.2.3 WiFi status

The WIFI LED on the carrierboard is located next to the S1, this LED reflects the status of the Wi-Fi device.

11.2.4 Power Indicator LED

The DB8 contains a power indicato(carrierboard-LED1) to notify the user that power is applied.

Page 37

12 Boot configuration

There is a 4 switch Dip Switch marked S1 located at the carrierboard. For normal operation, all four switches need to be

set to the ‘off’ position.

Switch 1, ‘HUB_SEL’, when set to ‘on’ position, will force boot over USB connection with a PC. This is only required for

UFS boot image upgrade. Please review the proper OS User Guide for more information on this process.

Switch 2, SD BOOT’, when set to ‘on’ position, will force the µSD, J24, to serve as the boot source for the DB8. You can use

uSD as the main boot source or it can serve as a method for UFS boot image upgrade. Please review the proper OS User

Guide for more information on this process.

Switch 3, ‘SW Download Target Memory’, when set to ‘on’ position, will force SW download/flashing to the µSD card, J24

When set to ‘off’ position, SW download will route to the UFS memory.

Switch 4, ‘USB BOOT’, when set to ‘on’ position, selects USB Port 0 for EDL download mode. Please review the proper OS

User Guide for more information on this process.

Page 38

13 Mechanical size marking

Page 39

FCC warning

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC

Rules. These limits are designed to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in

accordance with the instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to

radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to

correct the interference by one or more of the following measures:

- —Reorient or relocate the receiving antenna.

- —Increase the separation between the equipment and receiver.

- —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- —Consult the dealer or an experienced radio/TV technician for help.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.

The distance between user and products should be no less than 20cm

Page 40