Genesis Microchip Inc. reserves the right to change or modify the information contained herein without
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
1. OVERVIEW
The gm2115/25 is a graphics processing IC for Liquid Crystal Display (LCD) monitors at
XGA/SXGA resolution. The gm2115/25 are pin compatible and firmware compatible to
gm5115/25 and gm3115/25. It provides all key IC functions required for image capture,
processing and timing control for direct interface to the row and column drivers of the LCD
panel. On-chip functions include a high-speed triple-ADC and PLL, a high quality zoom and
shrink scaling engine, an on-screen display (OSD) controller, an on-chip microcontroller
(OCM), and a programmable panel timing controller (TCON). With all these functions
integrated onto a single device, the gm2115/25 eliminates the need for a separate LCD
monitor controller printed circuit board (PCB) from the system along with the associated
connectors and cables. Therefore, the gm2115/25 simplifies the design and reduces the cost
of LCD monitors while maintaining a high-degree of flexibility and quality.
Figure 1 below shows a typical dual interface LCD monitor system based on the gm2115/25.
Designs based on the gm2115/25 have reduced system cost, simplified hardware and
firmware design and increased reliability because only a minimal number of components are
required in the system.
Analog
RGB
gm2115/25
Row
Driver
ICs
Column
Driver
ICs
LCD
Panel
Back-light
NVRAM
ROM
(optional)
Figure 1. gm2115/25 System Design Example
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
11..22 ggmm22111155//2255 FFeeaattuurreess
FEATURES
• Zoom (from VGA) and shrink (from UXGA) scaling
• Integrated 8-bit triple-channel ADC / PLL
• On-chip programmable OnPanel timing controller
• Embedded microcontroller with parallel ROM interface
• On-chip versatile OSD engine
• All system clocks synthesized from a single external crystal
• Programmable gamma correction (CLUT)
• RealColor™ controls provide sRGB compliance
• PWM back light intensity control
• 5 Volt tolerant inputs
• Low EMI and power saving features
• High-Quality Advanced Scaling
• Fully programmable zoom ratios
• High-quality shrink capability from UXGA resolution
• Real Recovery™ function provides full color recovery
image for refresh rates higher than those supported by
the LCD panel
• Moire cancellation
• Analog RGB Input Port
• Supports up to 162.5MHz (SXGA 75Hz / UXGA 60Hz)
• On-chip high-performance PLLs
(only a single reference crystal required)
• Auto-Configuration / Auto-Detection
• Input format detection
• Phase and image positioning
• RealColor Technology
• Digital brightness and contrast controls
• TV color controls including hue and saturation controls
• Flesh-tone adjustment
• Full color matrix allows end-users to experience the
same colors as viewed on CRTs and other displays
(e.g. sRGB compliance)
• On-chip OSD Controller
• On-chip RAM for downloadable menus
• 1, 2 and 4-bit per pixel character cells
• Horizontal and vertical stretch of OSD menus
• Blinking, transparency and blending
• On-chip Microcontroller
• Requires no external micro-controller
• External parallel ROM interface allows firmware customization
with little additional cost
• 23 general-purpose inputs/outputs (GPIOs) available for
managing system devices (keypad, back-light, NVRAM, etc)
• Industry-standard firmware embedded on-chip, requires no
external ROM (configuration settings stored in NVRAM)
• Built-in OnPanel Timing Controller
• Eliminates the need for an external panel timing controller
(TCON) device, thereby reducing system cost
• Direct connect to commercial row/column driver ICs (supports
dual-bus / dual-port and dual-bus / single-port)
• Low EMI and power saving features include frame, line and in-line
inversion, blanking, data staggering and slew rate control.
• Programmable Output Format
• Single / double wide up to XGA/SXGA 75Hz output
• Pin swap, odd / even swap and red / blue group swap of
RGB outputs for flexibility in board layout
• Support for 8 or 6-bit panels (with high-quality dithering)
• Highly Integrated System-on-a-Chip
Reduces Component Count for Highly Cost
Effective Solution
• Standalone operation requires no external
ROM and no firmware development for Fast
Time to Market
• Pin and register compatible OnPanel Family:
- gm5115/gm5125 Dual-Interface XGA/SXGA
- gm3115/gm3125 Digital-Interface XGA/SXGA
- gm2115/gm2125 Analog-Interface XGA/SXGA
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
2. GM2115/25 PINOUT
The gm2115/25 is available in a 208-pin Plastic Quad Flat Pack (PQFP) package. Figure 2
provides the pin locations for all signals.
*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
3. GM2115/25 PIN LIST
I/O Legend: A = Analog, I = Input, O = Output, P = Power, G= Ground
Table 1. Analog Input Port
Pin Name No. I/O Description
AVDD_RED 172 AP Analog power (3.3V) for the red channel. Must be bypassed with decoupling capacitor to
RED+ 171 AI Positive analog input for Red channel.
RED- 170 AI Negative analog input for Red channel.
AGND_RED 169 AG Analog ground for the red channel.
AVDD_GREEN 168 AP Analog power (3.3V) for the green channel. Must be bypassed with decoupling capacitor to
GREEN+ 167 AI Positive analog input for Green channel.
GREEN- 166 AI Negative analog input for Green channel.
AGND_GREEN 165 AG Analog ground for the green channel.
AVDD_BLUE 164 AP Analog power (3.3V) for the blue channel. Must be bypassed with decoupling capacitor to
BLUE+ 163 AI Positive analog input for Blue channel.
BLUE- 162 AI Negative analog input for Blue channel.
AGND_BLUE 161 AG Analog ground for the blue channel.
AVDD_ADC 160 AP Analog power (3.3V) for ADC analog blocks that are shared by all three channels. Includes
ADC_TEST 159 AO Analog test output for ADC Do not connect.
AGND_ADC 158 AG Analog ground for ADC analog blocks that are shared by all three channels. Includes band
SGND_ADC 157 AG Dedicated pad for substrate guard ring that protects the ADC reference system.
GND1_ADC 156 G Digital GND for ADC clocking circuit.
VDD1_ADC_2.5 155 P Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to
GND2_ADC 154 G Digital GND for ADC clocking circuit.
VDD2_ADC_2.5 153 P Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to
HSYNC 137 I ADC input horizontal sync input.
VSYNC 136 I ADC input vertical sync input.
AGND_RED pin on system board (as close as possible to the pin).
Must be directly connected to the analog system ground plane.
AGND_GREEN pin on system board (as close as possible to the pin).
Must be directly connected to the analog system ground plane.
AGND_BLUE pin on system board (as close as possible to the pin).
Must be directly connected to the analog system ground plane.
band gap reference, master biasing and full-scale adjust. Must be bypassed with
decoupling capacitor to AGND_ADC pin on system board (as close as possible to the pin).
gap reference, master biasing and full-scale adjust.
Must be directly connected to analog system ground plane.
Must be directly connected to the analog system ground plane.
Must be directly connected to the digital system ground plane
GND1_ADC pin on system board (as close as possible to the pin).
Must be directly connected to the digital system ground plane.
GND2_ADC pin on system board (as close as possible to the pin).
ROM address output. These pins also serve as 5V-tolerant bootstrap inputs on power up.
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
I
5V-tolerant external PROM data input
I
I
I
I
I
I
I
Table 6. TCON Output Port
Pin Name No I/O Description
TCON_OSP 119 O Odd Starting Pulse
TCON_OPOL 120 O Odd Polarity
TCON_OINV 121 O Odd Data Transmission Inversion
TCON_ESP 122 O Even Starting Pulse
TCON_EPOL 123 O Even Polarity
TCON_EINV 124 O Even Data Transmission Inversion
TCON_RSP2 125 O Row Starting Pulse for 2-Voltage Row Driver
TCON_RSP3 126 O Row Starting Pulse for 3-Voltage Row Driver
TCON_RCLK 127 O Row Shift Clock
TCON_ROE 128 O Row Output Enable
Table 7. Reserved Pins
Pin Name No I/O Description
Reserved 131 I Tie to GND.
Reserved 132 I Tie to GND.
N/C 142 O No connect.
Reserved 173 N/C No connect.
Reserved 174 N/C No connect.
Reserved 175 N/C No connect.
Reserved 176 N/C No connect.
Reserved 177 N/C No connect.
Reserved 178 N/C No connect.
Reserved 179 N/C No connect.
Reserved 180 N/C No connect.
Reserved 181 N/C No connect.
Reserved 182 N/C No connect.
Reserved 183 N/C No connect.
Reserved 184 N/C No connect.
Reserved 185 N/C No connect.
Reserved 186 N/C No connect.
Reserved 187 N/C No connect.
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
Reserved 188 N/C No connect.
Reserved 189 N/C No connect.
Reserved 190 N/C No connect.
Reserved 191 N/C No connect.
Reserved 192 N/C No connect.
Reserved 193 N/C No connect.
Reserved 194 N/C No connect.
Reserved 195 N/C No connect.
Reserved 196 N/C No connect.
Reserved 197 N/C No connect.
Reserved 198 N/C No connect.
Reserved 199 N/C No connect.
N/C 200 O No connect.
CLKOUT 201 AO For test purposes only. Do not connect.
Note: For PCB compatibility with gm5115/25 and gm3115/25 input pins 173-199 should be
connected as described in the gm5115 data sheet C5115-DAT-01.
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
Note that VDD pins having "_2.5" in their names should be connected to 2.5V power supplies. All
other VDD pins should be connected to 3.3V power supplies.
Table 8. Power Pins for ADC Sampling Clock DDS
Pin Name No I/O Description
AVDD_DDDS 146 AP Analog power for the Destination DDS. Connect to 3.3V supply.
AVSS_DDDS 145 AG Analog ground for the Destination DDS.
VDD_DDDS 144 P Digital power for the Destination DDS. Connect to 3.3V supply.
VSS_DDDS 143 G Digital ground for the Destination DDS.
Must be bypassed with a 0.1uF capacitor to AVSS_DDDS pin
(as close to the pin as possible).
Must be directly connected to the analog system ground.
Table 9. Power Pins for Display Clock DDS
Pin Name No I/O Description
AVDD_SDDS 141 AP Analog power for Source DDS. Connect to 3.3V supply.
AVSS_SDDS 140 AG Analog ground for Source DDS.
VDD_SDDS 139 P Digital power for the Source DDS. Connect to 3.3V supply.
VSS_SDDS 138 G Digital ground for the Source DDS.
Must be bypassed with a 0.1uF capacitor to AVSS_SDDS pin
(as close to the pin as possible).
Must be directly connected to the analog system ground plane.
Table 10. I/O Power and Ground Pins
Pin Name No I/O Description
RVDD 2
111
129
RVSS 3
112
130
20
37
53
67
81
97
21
38
54
68
82
98
P
Connect to 3.3V supply.
P
Must be bypassed with a 0.1uF capacitor to RVSS (as close to the pin as possible).
P
P
P
P
P
P
P
G
Connect to digital ground.
G
G
G
G
G
G
G
G
Table 11. Core Power and Ground Pins
Pin Name No I/O Description
CVDD_2.5 26
134
203
CVSS 27
133
135
202
Note, “AP” indicates a power supply that is analog in nature and does not have large switching
currents. These should be isolated from other digital supplies that do have large switching currents.
88
89
P
Connect to 2.5V supply.
P
Must be bypassed with a 0.1uF capacitor to CVSS (as close to the pin as possible).
P
P
G
Connect to digital ground.
G
G
G
G
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
4. FUNCTIONAL DESCRIPTION
A functional block diagram is illustrated below. Each of the functional units shown is
described in the following sections.
Analog RGB
Input
NVRAM
Serial I/F
Serial Host I/F
Parallel
ROM IF
Crystal
Reference
Host
Interface
8051-style
Micro-
controller
MCU
RAM
External
ROM I/F
Internal
ROM
Triple ADC
and PLL
Test Pattern
Generator
Image
Capture /
Measure-
ment
Brightness /
Contrast /
Hue / Sat /
RealColor /
Moire
Zoom /
Shrink /
Filter
Controller
OSD
OSD
RAMs
Gamma
Control
Clock
Generation
Panel
Timing
Controller
Output
Data
Path
Timing
Control
Signals
Panel Data
Figure 3. gm2115/25 Functional Block Diagram
44..11 CClloocckk GGeenneerraattiioonn
The gm2115/25 features two clock inputs. All additional clocks are internal clocks derived
from one or both of these:
1. Crystal Input Clock (TCLK and XTAL). This is the input pair to an internal crystal
oscillator and corresponding logic. A 14.3 MHz TV crystal is recommended. Other
crystal frequencies may be used, but require custom programming. This is illustrated in
Figure 4 below. Alternatively, a single-ended TTL/CMOS clock oscillator can be driven
into the TCLK pin (leave XTAL as N/C in this case). This is illustrated in Figure 7
below. This option is selected by connecting a 10KΩ pull-up to ROM_ADDR13 (refer to
Table 16). See also Table 13.
June 2002 C2115-DAT-01B
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*** Genesis Microchip Confidential ***gm2115/25 Preliminary Data Sheet
2. Host Interface Transfer Clock (HCLK)
The gm2115 TCLK oscillator circuitry is a custom designed circuit to support the use of an
external oscillator or a crystal resonator to generate a reference frequency source for the
gm2115 device.
4.1.1 Using the Internal Oscillator with External Crystal
The first option for providing a clock reference is to use the internal oscillator with an
external crystal. The oscillator circuit is designed to provide a very low jitter and very low
harmonic clock to the internal circuitry of the gm2115. An Automatic Gain Control (AGC) is
used to insure startup and operation over a wide range of conditions. The oscillator circuit
also minimizes the overdrive of the crystal, which reduces the aging of the crystal.
When the gm2115/25 is in reset, the state of the ROM_ADDR13 pin (pin number 10) is
sampled. If the pin is left unconnected (internal pull-down) then internal oscillator is enabled.
In this mode a crystal resonator is connected between TCLK (pin 152) and the XTAL (pin
151) with the appropriately sized loading capacitors CL1 and CL2. The size of CL1 and CL2 are
determined from the crystal manufacturer’s specification and by compensating for the
parasitic capacitance of the gm2115/25 device and the printed circuit board traces. The
loading capacitors are terminated to the analog VDD power supply. This connection
increases the power supply rejection ratio when compared to terminating the loading
capacitors to ground.
Vdda
CL1
152
TCLK
gm2115/25
Vdd
Vdda
CL2
151
XTAL
100 K
180 uA
OSC_OUT
TCLK Distribution
N/C
ROM_ADDR13
10
Reset State Logic
Internal Pull Down
Resistor
~ 60K
Internal Oscillator Enable
Figure 4. Using the Internal Oscillator with External Crystal
June 2002 C2115-DAT-01B
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