Genesis Microchip Inc. reserves the right to change or modify the information contained herein without notice. It is
the customer’s responsibility to obtain the most recent revision of the document. Genesis Microchip Inc. makes no
warranty for the use of its products and bears no responsibility for any errors or omissions that may appear in this
document.
o Figure 2, gm2121 Pin out Diagram (Pin #102 to 116)
o Table 2, RCLK PLL pins
o Table 7, Power & Ground Pins for ADC Sampling Clock DDS
o Table 8, Power & Ground Pins for Display Clock DDS
o Table10, AVSS_OUT_LV_E pin
o Table 6, one RESERVED pin and two RESERVED Pin name change to
VCO_LV & VBUFC
• Corrected Pinout as follows:
• Pins 88 to 97 changed from RESERVED to GPO [0..7]
• Pins 38 and 39 changed to STI_TM1 and STI_TM2
• Table 3, added GPO [0..7]
• Table 6, removed RESERVED pins 88 to 97
• Table 6, renamed pins 38 and 39 to STI_TM1 and STI_TM2 and added a clause that
these pins MUST be tied to GND.
• Updated 4.14.4. with TCLK_SEL0, TCLK_SEL1 and DDC_PORT_SEL information.
These signals are new bootstrap configuration pins in gm2121
• Updated 4.14.5 with the newly added GPO’s [0..7]
• Updated 4.15 with the new bootstrap configuration pins
• Table 20, updated DC Characteristics
• Updated 4.14.4 and 4.15 with clarifications for the UART baud rates and DDC2Bi pin
selection options in standalone configuration
• Changed Pin names:
o RVDD to RVDD_3.3
o CVDD to CVDD_2.5
o AVDD_OUT_LV_E to AVDD_OUT_LV_E_2.5
o AVDD_LV_E_ to AVDD_LV_E_2.5
o AVDD_OUT_LV_O to AVDD_OUT_LV_O_2.5
o AVDD_LV_O to AVDD_LV_O_2.5
o AVDD_RPLL to AVDD_RPLL_3.3
o VDD_DPLL to VDD_DPLL_3.3
o AVDD_DDDS to AVDD_DDDS_3.3
o VDD_DDDS to VDD_DDDS_3.3
o AVDD_SSDS to AVDD_SSDS_3.3
o VDD_SSDS to VDD_SSDS_3.3
o VDD2_ADC to VDD2_ADC_2.5
o VDD1_ADC to VDD1_ADC_2.5
o AVDD_ADC to AVDD_ADC_3.3
o AVDD_BLUE to AVDD_BLUE_3.3
o AVDD_GREEN to AVDD_GREEN_3.3
o AVDD_RED to AVDD_RED_3.3
May 2002
Jun 2002
Aug 2002
C2121-DAT-01D
C2121-DAT-01E
C2121-DAT-01F
C2121-DAT-01F 7 December 2002
• Added Section 4.2.2 – Correct Power Sequencing
•
Added the following note to Table 3 System Interface/GPIO signals GPIO4/UART_DI
and GPIO5/UART_DO: Add 10K Pull-up to VDD_3.3
• Added note to Table 17 bootstrap signal HOST_PORT_EN (ROM_ADDR8)
• Added note to Table 17 bootstrap signal OCM_ROM_CNFG(1) (ROM_ADDR14)
• Updated Table 17 bootstrap signal DDC_PORT_SEL (ROM_ADDR12)
• Documentation Fix: Pin Name Change GPIO16/HFS to GPIO16/HFSn
• Added section 5.3 External ROM Interface Timing Requirements
http://www.genesis-microchip.com
Sep 2002
Oct 2002
Dec 2002
p
gm2121 Preliminary Data Sheet
1 Overview
The gm2121 is a graphics processing IC for Liquid Crystal Display (LCD) monitors at SXGA resolution.
It provides all key IC functions required for the highest quality LCD monitors. On-chip functions include
a high-speed triple-ADC and PLL, a high quality zoom and shrink scaling engine, an on-screen display
(OSD) controller, digital color controls, an on-chip micro-controller (OCM) and industry standard dual
four channel LVDS transmitter for direct connect to LCD panels with LVDS interface. With this level of
integration, the gm2121 devices simplify and reduce the cost of LCD monitors while maintaining a highdegree of flexibility and quality.
1.1 gm2121 System Design Example
Figure 1 below shows a typical dual interface LCD monitor system based on the gm2121. Designs based
on the gm2121 have reduced system cost, simplified hardware and firmware design and increased
reliability because only a minimal number of components are required in the system.
Analog
RGB
gm2121
Direct
Connect to
LVDS IF
Panels
LCD Module
Back-light
NVRAM
Figure 1. gm2121 System Design Example
EEPROM
(o
tional)
C2121-DAT-01F 8 December 2002
http://www.genesis-microchip.com
1.2 gm2121 Features
gm2121 Preliminary Data Sheet
FEATURES
• Zoom (from VGA) and shrink (from UXGA) scaling
• Integrated 8-bit triple-channel ADC / PLL
• Embedded microcontroller with parallel ROM interface
• On-chip versatile OSD engine
• All system clocks synthesized from a single external crystal
• Programmable gamma correction (CLUT)
• RealColor controls provide sRGB compliance
• PWM back light intensity control
• 5-Volt tolerant inputs
• Low EMI and power saving features
High-Quality Advanced Scaling
• Fully programmable zoom ratios
• High-quality shrink capability from UXGA resolution
• Real Recovery function provides full color recovery image
for refresh rates higher than those supported by the LCD
panel
Analog RGB Input Port
• Supports up to 162MHz (SXGA 75Hz / UXGA 60Hz)
• On-chip high-performance PLLs
(only a single reference crystal required)
On-chip Microcontroller
• Requires no external micro-controller
• External parallel ROM interface allows
firmware customization with little additional
cost
• 21 general-purpose inputs/outputs (GPIO's)
and 8 general-purpose outputs (GPO’s)
available for managing system devices
(keypad, back-light, NVRAM, etc)
• Industry-standard firmware embedded onchip, requires no external ROM (configuration
settings stored in NVRAM)
• Low power mode (,0.15W) when no inputs are
active
• Support for DDC2Bi based In-systemProgramming of Flash ROM
Built in Flexible LVDS Transmitter
• Dual four channel 6/8-bit LVDS transmitter
(with high-quality dithering)
• Programmable channel swapping
• Programmable channel polarity
• Support up to SXGA 75Hz output
Highly Integrated System-on-a-Chip
Reduces Component Count for
Highly Cost Effective Solution
Auto-Configuration / Auto-Detection
• Automatic input format detection
• Robust phase and image positioning
RealColor Technology
• Digital brightness and contrast controls
• TV color controls including hue and saturation controls
• Flesh-tone adjustment
• Full color matrix allows end-users to experience the same
colors as viewed on CRTs and other displays (e.g. sRGB
compliance)
On-chip OSD Controller
• On-chip RAM for downloadable menus
• 1, 2 and 4-bit per pixel character cells
• Horizontal and vertical stretch of OSD menus
• Blinking, transparency and blending
Built in Test Pattern Generator
Stand-alone operation requires no
external ROM and no firmware
development for Fast Time to
Market
Firmware compatible Family of
Products:
- gm2110/20 Analog-Interface XGA/SXGA
- gm3110/gm3120 Digital-Interface XGA/SXGA
- gm5110/gm5120 Dual-Interface XGA/SXGA
C2121-DAT-01F 9 December 2002
http://www.genesis-microchip.com
gm2121 Preliminary Data Sheet
2 GM2121 Pinout
The gm2121 is available in a 160-pin Plastic Quad Flat Pack (PQFP) package. Figure 2 provides the pin
locations for all signals.
I/O Legend: A = Analog, I = Input, O = Output, P = Power, G= Ground
Table 1. Analog Input Port
Pin Name No. I/O Description
AVDD_RED_3.3 136 AP Analog power (3.3V) for the red channel. Must be bypassed with decoupling capacitor to
AGND_RED pin on system board (as close as possible to the pin).
RED+ 135 AI Positive analog input for Red channel.
RED- 134 AI Negative analog input for Red channel.
AGND_RED 133 AG Analog ground for the red channel.
Must be directly connected to the system ground plane.
AVDD_GREEN_3.3 132 AP Analog power (3.3V) for the green channel. Must be bypassed with decoupling capacitor to
AGND_GREEN pin on system board (as close as possible to the pin).
GREEN+ 131 AI Positive analog input for Green channel.
GREEN- 130 AI Negative analog input for Green channel.
AGND_GREEN 129 AG Analog ground for the green channel.
Must be directly connected to the system ground plane.
AVDD_BLUE_3.3 128 AP Analog power (3.3V) for the blue channel. Must be bypassed with decoupling capacitor to
AGND_BLUE pin on system board (as close as possible to the pin).
BLUE+ 127 AI Positive analog input for Blue channel.
BLUE- 126 AI Negative analog input for Blue channel.
AGND_BLUE 125 AG Analog ground for the blue channel.
Must be directly connected to the system ground plane.
AVDD_ADC_3.3 124 AP Analog power (3.3V) for ADC analog blocks that are shared by all three channels. Includes
band gap reference, master biasing and full-scale adjust. Must be bypassed with
decoupling capacitor to AGND_ADC pin on system board (as close as possible to the pin).
ADC_TEST 123 AO Analog test output for ADC Do not connect.
AGND_ADC 122 AG Analog ground for ADC analog blocks that are shared by all three channels. Includes band
gap reference, master biasing and full-scale adjust.
Must be directly connected to system ground plane.
SGND_ADC 121 AG Dedicated pad for substrate guard ring that protects the ADC reference system.
Must be directly connected to the system ground plane.
GND1_ADC 120 G Digital GND for ADC clocking circuit.
Must be directly connected to the system ground plane
VDD1_ADC_2.5 119 P Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to
GND1_ADC pin on system board (as close as possible to the pin).
GND2_ADC 118 G Digital GND for ADC clocking circuit.
Must be directly connected to the system ground plane.
VDD2_ADC_2.5 117 P Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to
GND2_ADC pin on system board (as close as possible to the pin).
HSYNC 101 I ADC input horizontal sync input.
AVDD_RPLL_3.3 104 AP Analog power for the Reference DDS PLL. Connect to 3.3V supply. Must be bypassed with a
AVSS_RPLL 105 AG Analog ground for the Reference DDS PLL.
TCLK 102 AI Reference clock (TCLK) from the 20.0MHz crystal oscillator (see Figure 4), or from single-
XTAL 103 AO Crystal oscillator output.
VDD_DPLL_3.3 106 P Digital power for FCLK and RCLK PLLs. Connect to 3.3V supply.
VSS_DPLL 107 G Digital ground for FCLK and RCLK PLLs.
C2121-DAT-01F 11 December 2002
0.1uF capacitor to pin AVSS_RPLL (as close to the pin as possible).
Must be directly connected to the system ground plane.
ended CMOS/TTL clock oscillator (see Figure 7). This is a 5V-tolerant input. See Table 12.
http://www.genesis-microchip.com
gm2121 Preliminary Data Sheet
Table 3. System Interface and GPIO Signals
Pin Name No I/O Description
RESETn 17 I
GPIO0/PWM0 23 IO General-purpose input/output signal or PWM0. Open drain option via register setting.
GPIO1/PWM1 24 IO General-purpose input/output signal or PWM1. Open drain option via register setting.
GPIO2/PWM2 25 IO General-purpose input/output signal or PWM2. Open drain option via register setting.
GPIO3/TIMER1 26 IO General-purpose input/output signal. Open drain option via register setting. This pin is also
GPIO4/UART_DI 27 IO General-purpose input/output signal. Open drain option via register setting. This pin is also
GPIO5/UART_DO 28 IO General-purpose input/output signal. Open drain option via register setting. This pin is also
GPIO6 29 IO General-purpose input/output signal.
GPIO7 32 IO General-purpose input/output signal.
GPIO8/IRQINn 22 IO General-purpose input/output signal. This is also active-low interrupt input to OCM and is
GPIO9 33 IO General-purpose input/output signal. Open drain option via register setting.
GPIO10 34 IO General-purpose input/output signal. Open drain option via register setting.
GPIO11/ROM_WEn 35 IO General-purpose input/output signal, or ROM write enable if a programmable FLASH
GPIO12/NVRAM_SDA
GPIO13/NVRAM_SCL
GPIO14/DDC_SCL
GPIO15/DDC_SDA
GPIO16/HFSn 9 IO General-purpose input/output signal when host port is disabled, or data signal for 2-wire
GPIO17/HDATA0
GPIO18/HDATA1
GPIO19/HDATA2
GPIO20/HDATA3
GPIO21/IRQn 16 IO General-purpose input/output signal when host port is disabled, or active-low and open-
GPIO22/HCLK 8 IO General-purpose input/output signal when host port is disabled, or clock for 2-wire serial
GPO 0 88 O General-purpose output signal.
GPO 1 89 O General-purpose output signal
GPO 2 92 O General-purpose output signal
GPO 3 93 O General-purpose output signal
GPO 4 94 O General-purpose output signal
GPO 5 95 O General-purpose output signal
GPO 6 96 O General-purpose output signal
GPO 7 97 O General-purpose output signal
36
37
18
19
13
12
11
10
Active-low hardware reset signal. The reset signal must be held low for at least 1µS.
[Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant]
connected to Timer 1 clock input of the OCM.
[Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant]
connected to the OCM UART data input signal by programming an OCM register. Add
10K Pull-up to VDD_3.3.
[Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant]
connected to the OCM UART data output signal by programming an OCM register. Add
10K Pull-up to VDD_3.3.
[Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant]
ROM address output. These pins also serve as 5V-tolerant bootstrap inputs on power up.
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
I
5V-tolerant external PROM data input
I
I
I
I
I
I
I
C2121-DAT-01F 13 December 2002
http://www.genesis-microchip.com
Table 6. Reserved Pins
Pin Name No I/O Description
Reserved 80 O For test purposes only. Do not connect
Reserved 81 O For test purposes only. Do not connect
Reserved 82 O For test purposes only. Do not connect
Reserved 83 O For test purposes only. Do not connect
Reserved 84 O For test purposes only. Do not connect
Reserved 85 O For test purposes only. Do not connect
Reserved 86 O For test purposes only. Do not connect
Reserved 87 O For test purposes only. Do not connect
VBUFC 112 O For test purposes only. Do not connect
VCO_LV 45 O For test purposes only. Do not connect
STI_TM1 38 I For test purposes only. MUST be tied to GND
STI_TM2 39 I For test purposes only. MUST be tied to GND
Table 7. Power and Ground Pins for ADC Sampling Clock DDS
Pin Name No I/O Description
AVDD_SDDS_3.3 113 AP Analog power for the Source DDS. Connect to 3.3V supply.
Must be bypassed with a 0.1uF capacitor to AVSS_SDDS pin
(as close to the pin as possible).
AVSS_SDDS 114 AG Analog ground for the Source DDS.
Must be directly connected to the system ground.
VDD_SDDS_3.3 115 P Digital power for the Source DDS. Connect to 3.3V supply.
VSS_SDDS 116 G Digital ground for the Source DDS.
gm2121 Preliminary Data Sheet
Table 8. Power and Ground Pins for Display Clock DDS
Pin Name No I/O Description
AVDD_DDDS_3.3 108 AP Analog power for Destination DDS. Connect to 3.3V supply.
AVSS_DDDS 109 AG Analog ground for Destination DDS.
VDD_DDDS_3.3 110 P Digital power for the Destination DDS. Connect to 3.3V supply.
VSS_DDDS 111 G Digital ground for the Destination DDS.
Must be bypassed with a 0.1uF capacitor to AVSS_DDDS pin
(as close to the pin as possible).
Must be directly connected to the system ground plane.
C2121-DAT-01F 14 December 2002
http://www.genesis-microchip.com
gm2121 Preliminary Data Sheet
Table 9. I/O Power and Ground Pins
Pin Name No I/O Description
RVDD_3.3 14
143
157
CRVSS 15
137
144
158
CVDD_2.5 20
138
Note, “AP” indicates a power supply that is analog in nature and does not have large switching currents.
These should be isolated from other digital supplies that do have large switching currents.
30
90
21
31
42
44
78
91
99
43
79
98
P
Connect to 3.3V digital supply.
P
Must be bypassed with a 0.1uF capacitor to CRVSS (as close to the pin as possible).
P
P
P
G
Connect to digital ground.
G
G
G
G
G
G
G
G
G
G
P
Connect to 2.5V digital supply.
P
Must be bypassed with a 0.1uF capacitor to CRVSS (as close to the pin as possible).
P
P
P
Table 10.
Power and Ground Pins for LVDS Transmitter
Pin Name No I/O Description
AVDD_OUT_LV_E_
2.5
AVDD_LV_E_2.5 61 AP Analog power for on-chip LVDS transmitter. Connect to 2.5V supply
AVSS_OUT_LV_E 47
AVSS_LV_E 60 G Analog ground for on-chip LVDS transmitter.
AVDD_OUT_LV_O_
2.5
AVDD_LV_O_2.5 77 AP Analog power for on-chip LVDS transmitter. Connect to 2.5V supply.
AVSS_OUT_LV_O 62
AVSS_LV_O 76 G Analog ground for on-chip LVDS transmitter.
46
AP Analog power for on-chip LVDS output buffer. Connect to 2.5V supply.
59
58
63
74
75
G Analog ground for on-chip LVDS output buffer.
Must be directly connected to the system ground plane
Must be directly connected to the system ground plane
AP Analog power for on-chip LVDS output buffer. Connect to 2.5V supply.
G Analog ground for on-chip LVDS output buffer.
Must be directly connected to the system ground plane.
Must be directly connected to the system ground plane.
C2121-DAT-01F 15 December 2002
http://www.genesis-microchip.com
gm2121 Preliminary Data Sheet
4 Functional Description
A functional block diagram is illustrated below. Each of the functional units shown is described in the
following sections.
NVRAM
Serial I/F
Serial Host I/F
GPIO
Parallel
ROM IF
Crystal
Reference
Host
Interface
8051-style
Micro-
controller
MCU
RAM
External
ROM I/F
Internal
ROM
Clock
Generation
OSD
Controller
OSD
RAMs
Analog
RGB
Triple
ADC
Image
Capture /
Measure-
ment
Figure 3. gm2121 Functional Block Diagram
Brightness /
Contrast /
Hue / Sat /
RealColor /
Moire
Zoom /
Shrink /
Filter
Gamma
Control
Output
Data
Path
Dual LVDS
Transmitter
Panel Data
and Control
4.1 Clock Generation
The gm2121 features two clock inputs. All additional clocks are internal clocks derived from one or more
of these:
1. Crystal Input Clock (TCLK and XTAL). This is the input pair to an internal crystal oscillator and
corresponding logic. A 20.0 MHz crystal is recommended. Other crystal frequencies may be used, but
require custom programming. This is illustrated in Figure 4 below. Alternatively, a single-ended
TTL/CMOS clock oscillator can be driven into the TCLK pin (leave XTAL as N/C in this case). This
is illustrated in Figure 7 below. This option is selected by connecting a 10KΩ pull-up to
ROM_ADDR13 (refer to Table 17). See also Table 12.
2. Host Interface Transfer Clock (HCLK)
The gm2121 TCLK oscillator circuitry is a custom designed circuit to support the use of an external
oscillator or a crystal resonator to generate a reference frequency source for the gm2121 device.
C2121-DAT-01F 16 December 2002
http://www.genesis-microchip.com
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