General Semiconductor ES3G, ES3F Datasheet

0.006 (0.152)
0.012 (0.305)
0.030 (0.76)
0.060 (1.52)
0.008 (0.203)
0.305 (7.75)
0.320 (8.13)
0.260 (6.60)
0.280 (7.11)
0.079 (2.06)
0.103 (2.62)
0.220 (5.59)
0.245 (6.22)
0.126 (3.20)
0.114 (2.90)
MAX.
NEW PRODUCT NEW PRODUCT NEW PRODUCT
ES3F AND ES3G
SURFACE MOUNT ULTRAFAST EFFICIENT PLASTIC RECTIFIER
Reverse Voltage - 300 to 400 Volts Forward Current - 3.0 Amperes
DO-214AB
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
For surface mount applicationsLow profile package Built-in strain relief Ideal for automated placementEasy pick and placeSuperfast recover y time for high efficiencyGlass passivated chip junctionHigh temperature soldering:
250°C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AB molded plastic body over
passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end
Dimensions in inches and (millimeters)
Weight: 0.007 ounces, 0.21 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Device marking code EF EG Maximum repetitive peak reverse voltage V Working peak reverse voltage V Maximum RMS voltage V Maximum DC blocking voltage V Maximum average forward rectified current at T
=100°C I
L
Peak forward surge current
8.3ms single half sine-wave superimposed on I rated load (JEDEC Method) at T
=100°C
L
Maximum instantaneous forward voltage at 3.0A V Maximum DC reverse current T
at working peak reverse voltage T Maximum reverse recovery time Maximum reverse recovery time Maximum reverse recovery current Maximum stored charge
(NOTE 2)
Typical junction capacitance Typical thermal resistance
(NOTE 4)
(NOTE 1) (NOTE 2)
(NOTE 3)
(NOTE 2)
=25°C 10.0
A
=100°C
A
Operating junction and storage temperature range T
SYMBOLS ES3F ES3G UNITS
300 400 Volts 225 300 Volts 210 280 Volts 300 400 Volts
3.0 Amps
100 Amps
1.10 Volts
350
35 ns 50 ns
3.0 Amps 50 ns 30 pF 50
15
-55 to +150 °C
R R
, T
J
RRM
RWM
RMS
DC
(AV)
FSM
F
I
R
t
rr
t
rr
I
RM
Q
rr
C
J
ΘJA ΘJL
STG
µA
°C/W
NOTES: (1) Reverse recovery test conditions:IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at I (3) Measured at 1.0 MHZand applied reverse voltage of 4.0 Volts (4) Units mounted on P.C.B. with 0.31 x 0.31” (8.0 x 8.0mm) copper pad areas
NOTICE: Advanced product information is subject to change without notice
4/98
=1.0A, di/dt=100A/µs, VR=30V, Irr=0.1I
F
RM
50
100
150
0
40
80
120
160
200
80 90 100 110 120 130 140 150
0
1.0
2.0
3.0
1
10
100
25
50
75
100
125
150
0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0.1
1
10
100
0.1
1
10
100
1
175
100
0
20
40
60
80
100
0.01
0.1
1
10
100
1,000
125
25
75
RATING AND CHARACTERISTIC CURVES ES3F AND ES3G
FIG. 1 - MAXIMUM FORWARD CURRENT
DERATING CURVE
RESISTIVE OR INDUCTIVE LOAD
CURRENT, AMPERES
AVERAGE FORWARD RECTIFIED
LEAD TEMPERATURE, °C
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
TJ=25°C PULSE WIDTH=300µs 1% DUTY CYCLE
PEAK FORWARD SURGE CURRENT,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) at TL=100°C
NUMBER OF CYCLES AT 60 H
FIG. 4 - TYPICAL REVERSE
Z
CHARACTERISTICS
TJ=125°C
TJ=100°C
AMPERES
INSTANTANEOUS FORWARD CURRENT,
RECOVER Y TIME nC/ns
RECOVERED STORED CHARGE/REVERSE
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 5 - REVERSE SWITCHING
CHARACTERISTICS
@5A,50A/µs
@2A,20A/µs
@5A,50A/µs
@2A,20A/µs
@1A,100A/µs
@1A,100A/µs
MICROAMPERES
TJ=25°C
INSTANTANEOUS REVERSE LEAKAGE CURRENT,
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 6 - TYPICAL JUNCTION CAPACITANCE
TJ=25°C f=1.0 MH
Z
Vsig=50mVp-p
t
rr
Q
rr
JUNCTION CAPACITANCE, pF
JUNCTION TEMPERATURE, °C
REVERSE VOLT AGE, VOL TS
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