EDF1AM THRU EDF1DM
MINIATURE GLASS PASSIVATED FAST EFFICIENT BRIDGE RECTIFIER
Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦ This series is UL listed under Recognized Component Index,
file number E54214
♦ Glass passivated chip junctions
♦ High forward surge current capability
♦ Ideal for printed circuit boards
♦ Superfast recovery times for high efficiency
♦ High temperature soldering guaranteed:
260°C/10 seconds at 5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any
Weight: 0.04 ounce, 1.0 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS EDF1AM EDF1BM EDF1CM EDF1DM UNITS
Maximum repetitive peak reverse voltage V
RRM
50 100 150 200 Volts
Maximum RMS voltage V
RMS
35 70 106 140 Volts
Maximum DC blocking voltage V
DC
50 100 150 200 Volts
Maximum average forward output
rectified current at T
A
=40°C
I
(AV)
1.0 Amp
Peak forward surge current single half sine-wave superimposed on rated load (JEDEC Method) T
J
=150°C
I
FSM
50.0 Amps
Rating for fusing (t < 8.3ms) I
2
t 10.0 A2sec
Maximum instantaneous forward voltage drop
per leg at 1.0A
V
F
1.05 Volts
Maximum reverse current T
A
=25°C 5.0 µA
at rated DC blocking voltage T
A
=125°C
I
R
1.0 mA
Maximum reverse recovery time at
(NOTE 1)
t
rr
50.0 ns
Typical thermal resistanceper leg
(NOTE 2)
R
ΘJA
38.0
R
ΘJL
12.0
°C/W
Operating junction and storage temperature range T
J
, T
STG
-55 to +150 °C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.51 x 0.51" (13 x 13mm) copper pads