Gemalto M2M TC63 Users Manual

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TC63 Siemens Cellular Engine

Version: 00.432 DocID: TC63_HD_V00.432

Hardware Interface Descri

TC63 Hardware Interface Description

Strictly confidential / Draft

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TC63 Hardware Interface Description

00.432

May 11, 2005

TC63_HD_V00.432

Strictly confidential / Draft

General note

Product is deemed accepted by Recipient and is provided without interface to Recipient´s products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time.

Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.

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Contents

0 Document History.........................................................................................................7

1 Introduction...................................................................................................................8

1.1 Related Documents ...............................................................................................8

1.2 Terms and Abbreviations.......................................................................................9

1.3 Type Approval......................................................................................................12

1.4 Safety Precautions...............................................................................................14

2 Product Concept.........................................................................................................16

2.1 Key Features at a Glance ....................................................................................16

2.2 TC63 System Overview .......................................................................................19

2.3 Circuit Concept ....................................................................................................20

3 Application Interface...................................................................................................21

3.1 Operating Modes .................................................................................................22

3.2 Power Supply.......................................................................................................24

3.2.1 Minimizing Power Losses ......................................................................24

3.2.2 Measuring the Supply Voltage V

....................................................25

BATT+

3.2.3 Monitoring Power Supply by AT Command ...........................................25

3.3 Power Up / Power Down Scenarios.....................................................................26

3.3.1 Turn on TC63......................................................................................... 26

3.3.1.1 Turn on TC63 Using Ignition Line IGT ...................................................26

3.3.1.2 Turn on TC63 Using the VCHARGE Signal...........................................28

3.3.1.3 Reset TC63 via AT+CFUN Command ................................................... 29

3.3.1.4 Reset or Turn off TC63 in Case of Emergency......................................29

3.3.2 Turn off TC63......................................................................................... 30

3.3.2.1 Turn off TC63 Using AT Command .......................................................30

3.3.2.2 Leakage Current in Power Down Mode .................................................31

3.3.3 Automatic Shutdown .............................................................................. 32

3.3.3.1 Temperature Dependent Shutdown.......................................................32

3.3.3.2 Temperature Control during Emergency call .........................................33

3.3.3.3 Undervoltage Shutdown if Battery NTC is Present ................................33

3.3.3.4 Undervoltage Shutdown if no Battery NTC is Present ...........................34

3.3.3.5 Overvoltage Shutdown...........................................................................34

3.4 Automatic GPRS Multislot Class Change............................................................35

3.5 Charging Control..................................................................................................36

3.5.1 Hardware Requirements ........................................................................36

3.5.2 Software Requirements .........................................................................36

3.5.3 Battery Pack Requirements ...................................................................36

3.5.4 Batteries Recommended for Use with TC63..........................................38

3.5.5 Charger Requirements...........................................................................38

3.5.6 Implemented Charging Technique.........................................................38

3.5.7 Operating Modes during Charging.........................................................39

3.6 Summary of State Transitions (Except SLEEP Mode).........................................41

3.7 RTC Backup ........................................................................................................42

3.8 SIM Interface .......................................................................................................43

3.9 Serial Interface ASC0 ..........................................................................................44

3.10 Serial Interface ASC1 ..........................................................................................46

3.11 USB Interface ......................................................................................................47

3.11.1 Installing the USB Modem Driver...........................................................48

3.12 I2C Interface ......................................................................................................... 50

3.13 Audio Interfaces...................................................................................................52

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3.13.1 Speech Processing................................................................................53

3.13.2 Microphone Circuit.................................................................................53

3.13.2.1 Single-ended Microphone Input.............................................................53

3.13.2.2 Differential Microphone Input.................................................................54

3.13.2.3 Line Input Configuration with OpAmp ....................................................55

3.13.3 Loudspeaker Circuit...............................................................................56

3.13.4 Digital Audio Interface DAI..................................................................... 57

3.14 Control Signals ....................................................................................................59

3.14.1 Synchronization Signal ..........................................................................59

3.14.2 Using the SYNC Pin to Control a Status LED........................................60

4 Antenna Interface........................................................................................................61

4.1 Antenna Installation .............................................................................................61

4.2 Antenna Pad ........................................................................................................63

4.2.1 Suitable Cable Types.............................................................................63

4.3 Antenna Connector..............................................................................................64

5 Electrical, Reliability and Radio Characteristics......................................................68

5.1 Absolute Maximum Ratings .................................................................................68

5.2 Operating Temperatures......................................................................................68

5.3 Pin Assignment and Signal Description...............................................................69

5.4 Power Supply Ratings .........................................................................................75

5.5 Electrostatic Discharge ........................................................................................78

5.6 Reliability Characteristics.....................................................................................79

6 Mechanics....................................................................................................................80

6.1 Mechanical Dimensions of TC63 .........................................................................80

6.2 Mounting TC63 to the Application Platform .........................................................82

6.3 Board-to-Board Application Connector ................................................................83

7 Sample Application.....................................................................................................86

8 Reference Approval....................................................................................................88

8.1 Reference Equipment for Type Approval.............................................................88

8.2 Compliance with FCC Rules and Regulations.....................................................89

9 Appendix......................................................................................................................90

9.1 List of Parts and Accessories ..............................................................................90

9.2 Fasteners and Fixings for Electronic Equipment .................................................92

9.2.1 Fasteners from German Supplier ETTINGER GmbH ............................92

9.3 Data Sheets of Recommended Batteries ............................................................95

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Tables

Table 1: Overview of operating modes................................................................................... 22

Table 2: Temperature dependent behavior ............................................................................33

Table 3: Specifications of battery packs suitable for use with TC63 ...................................... 37

Table 4: Comparison Charge-only and Charge mode............................................................ 40

Table 5: AT commands available in Charge-only mode......................................................... 40

Table 6: State transitions of TC63 (except SLEEP mode) ..................................................... 41

Table 7: Signals of the SIM interface (board-to-board connector) .........................................43

Table 8: DCE-DTE wiring of ASC0......................................................................................... 45

Table 9: DCE-DTE wiring of ASC1......................................................................................... 46

Table 10: Overview of DAI pin functions ................................................................................ 57

Table 11: Return loss in the active band ................................................................................ 61

Table 12: Product specifications of U.FL-R-SMT connector .................................................. 64

Table 13: Material and finish of U.FL-R-SMT connector and recommended plugs ...............65

Table 14: Ordering information for Hirose U.FL Series ..........................................................67

Table 15: Absolute maximum ratings under non-operating conditions ..................................68

Table 16: Operating temperatures .........................................................................................68

Table 17: Signal description................................................................................................... 70

Table 18: Power supply ratings ..............................................................................................75

Table 19: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz..........76

Table 20: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz......77

Table 21: Measured electrostatic values................................................................................78

Table 22: Summary of reliability test conditions .....................................................................79

Table 23: Technical specifications of Molex board-to-board connector .................................83

Table 24: List of parts and accessories.................................................................................. 90

Table 25: Molex sales contacts (subject to change) ..............................................................91

Table 26: Hirose sales contacts (subject to change)..............................................................91

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Figures

Figure 1: TC63 system overview............................................................................................ 19

Figure 2: TC63 block diagram ................................................................................................ 20

Figure 3: Power supply limits during transmit burst................................................................ 25

Figure 4: Position of the reference points BATT+ and GND .................................................. 25

Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT.............. 27

Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+ .......28

Figure 7: Signal states during turn-off procedure ................................................................... 31

Figure 8: Battery pack circuit diagram....................................................................................37

Figure 9: RTC supply from capacitor...................................................................................... 42

Figure 10: RTC supply from rechargeable battery ................................................................. 42

Figure 11: RTC supply from non-chargeable battery ............................................................. 42

Figure 12: Serial interface ASC0............................................................................................ 44

Figure 13: Serial interface ASC1............................................................................................ 46

Figure 14: USB circuit ............................................................................................................47

Figure 15: I2C interface connected to VCC of application .....................................................50

Figure 16: I2C interface connected to VEXT line of TC63 .....................................................51

Figure 17: Audio block diagram.............................................................................................. 52

Figure 18: Single ended microphone input............................................................................. 53

Figure 19: Differential microphone input ................................................................................54

Figure 20: Line input configuration with OpAmp ....................................................................55

Figure 21: Differential loudspeaker configuration................................................................... 56

Figure 22: Single ended loudspeaker configuration............................................................... 56

Figure 23: PCM interface application ..................................................................................... 57

Figure 24: PCM timing............................................................................................................ 58

Figure 25: SYNC signal during transmit burst ........................................................................59

Figure 26: LED Circuit (Example)........................................................................................... 60

Figure 27: Never use antenna connector and antenna pad at the same time .......................62

Figure 28: Restricted area around antenna pad..................................................................... 62

Figure 29: Mechanical dimensions of U.FL-R-SMT connector............................................... 64

Figure 30: U.FL-R-SMT connector with U.FL-LP-040 plug .................................................... 65

Figure 31: U.FL-R-SMT connector with U.FL-LP-066 plug .................................................... 65

Figure 32: Specifications of U.FL-LP-(V)-040(01) plug .......................................................... 66

Figure 33: Pin assignment (component side of TC63) ...........................................................69

Figure 34: TC63 – top view .................................................................................................... 80

Figure 35: Dimensions of TC63.............................................................................................. 81

Figure 36: Molex board-to-board connector 52991-0808 on TC63 ........................................84

Figure 37: Mating board-to-board connector 53748-0808 on application ..............................85

Figure 38: TC63 sample application (draft) ............................................................................ 87

Figure 39: Reference equipment for Type Approval ..............................................................88

Figure 40: Lithium Ion battery from VARTA ...........................................................................96

Figure 41: Lithium Polymer battery from VARTA ................................................................... 97

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0 Document History

Preceding document: "TC63 Hardware Interface Description" Version 00.192 New document: "TC63 Hardware Interface Description" Version 00.432

Chapter What is new

Throughout manual

2.1, 3.3.1.4,

3.6 5.3

2.1 Added 7-bit addressing to list of I2C features.

3.1 New chapter: Operating Modes

3.2.1 Added description for undervoltage shutdown in IDLE and SLEEP mode.

3.3.1 Added remarks on different operating modes.

3.3.3.3 Added remark on shutdown threshold in IDLE mode.

3.3.3.5 Orderly shutdown in case of overvoltage - added maximum voltage value.

3.5.2 New chapter to describe requirements to control end of charging.

3.5.4 Updated recommended battery specifications.

3.5.6 Corrected current value in case of undervoltage charging.

3.5.7 Added remarks on how to switch the module off when in Charging-only mode and how

IGT line needs to be driven low for at least 400ms

Modified description of EMERG_RST line: EMERG_RST and additional activation of IGT will reset TC63. EMERG_RST without activation of IGT will switch TC63 off.

Corrected module’s weight.

Further details on overvoltage shutdown.

to switch to other operating modes. No automatic shutdown in Charge-only mode. Updated list of AT commands. Removed AT^SMSO from list of AT commands supported in Charge-only mode.

3.6 New chapter: Summary of State Transitions (Except SLEEP Mode)

3.12 Added 7-bit addressing and remark on AT^SSPI command.

3.13 Corrected figure “Audio block diagram”.

3.13.4 Updated description of the DAI.

3.14.1 Updated forward time of SYNC signal during transmit burst.

4.1 Corrected figure “Never use antenna connector and antenna pad at the same time”.

5.1 Added conditions for absolute maximum ratings.

5.2 Added remark on temperature tolerances.

5.4 New chapter: Power Supply Ratings

6.1 Updated Figure 35.

8.1 Changed figure “Reference equipment for type approval”

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1 Introduction

This document describes the hardware of the Siemens TC63 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.

1.1 Related Documents

[1] TC63 AT Command Set [2] TC63 Release Notes 00.432 [3] DSB75 Support Box - Evaluation Kit for Siemens Cellular Engines [4] Application 07: Rechargeable Lithium Batteries in GSM Applications [5] Multiplexer User's Guide (not yet available)

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1.2 Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AGC Automatic Gain Control

ANSI American National Standards Institute

ARFCN Absolute Radio Frequency Channel Number

ARP Antenna Reference Point

ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of

TC63

B Thermistor Constant

B2B Board-to-board connector

BER Bit Error Rate

BTS Base Transceiver Station

CB or CBM Cell Broadcast Message

CE Conformité Européene (European Conformity)

CHAP Challenge Handshake Authentication Protocol

CPU Central Processing Unit

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DAC Digital-to-Analog Converter

DAI Digital Audio Interface

dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law

DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)

DCS 1800 Digital Cellular System, also referred to as PCN

DRX Discontinuous Reception

DSB Development Support Box

DSP Digital Signal Processor

DSR Data Set Ready

DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM

application)

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

EGSM Enhanced GSM

EIRP Equivalent Isotropic Radiated Power

EMC Electromagnetic Compatibility

ERP Effective Radiated Power

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Abbreviation Description

ESD Electrostatic Discharge

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)

FDMA Frequency Division Multiple Access

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

HiZ High Impedance

HR Half Rate

I/O Input/Output

IC Integrated Circuit

IMEI International Mobile Equipment Identity

ISO International Standards Organization

ITU International Telecommunications Union

kbps kbits per second

LED Light Emitting Diode

Li-Ion / Li+ Lithium-Ion

Li battery Rechargeable Lithium Ion or Lithium Polymer battery

Mbps Mbits per second

MMI Man Machine Interface

MO Mobile Originated

MS Mobile Station (GSM engine), also referred to as TE

MSISDN Mobile Station International ISDN number

MT Mobile Terminated

NTC Negative Temperature Coefficient

OEM Original Equipment Manufacturer

PA Power Amplifier

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PCL Power Control Level

PCM Pulse Code Modulation

PCN Personal Communications Network, also referred to as DCS 1800

PCS Personal Communication System, also referred to as GSM 1900

PDU Protocol Data Unit

PLL Phase Locked Loop

PPP Point-to-point protocol

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Abbreviation Description

PSK Phase Shift Keying

PSU Power Supply Unit

R&TTE Radio and Telecommunication Terminal Equipment

RAM Random Access Memory

RF Radio Frequency

RMS Root Mean Square (value)

ROM Read-only Memory

RTC Real Time Clock

RTS Request to Send

Rx Receive Direction

SAR Specific Absorption Rate

SD Secure Digital

SELV Safety Extra Low Voltage

SIM Subscriber Identification Module

SMS Short Message Service

SRAM Static Random Access Memory

TA Terminal adapter (e.g. GSM engine)

TDMA Time Division Multiple Access

TE Terminal Equipment, also referred to as DTE

Tx Transmit Direction

UART Universal asynchronous receiver-transmitter

URC Unsolicited Result Code

USB Universal Serial Bus

USSD Unstructured Supplementary Service Data

VSWR Voltage Standing Wave Ratio

Phonebook abbreviations

FD SIM fixdialing phonebook

LD SIM last dialing phonebook (list of numbers most recently dialed)

MC Mobile Equipment list of unanswered MT calls (missed calls)

ME Mobile Equipment phonebook

ON Own numbers (MSISDNs) stored on SIM or ME

RC Mobile Equipment list of received calls

SM SIM phonebook

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1.3 Type Approval

TC63 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed.

European directives

99/05/EC “Directive of the European Parliament and of the council of 9 March

1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity”, in short

89/336/EC Directive on electromagnetic compatibility

73/23/EC Directive on electrical equipment designed for use within certain

Standards of North American Type Approval

CFR Title 47 “Code of Federal Regulations, Part 22 and Part 24 (Telecommuni-

UL 60 950 “Product Safety Certification” (Safety requirements)

NAPRD.03 “Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control” PCS Type Certification Review board (PTCRB), Version 3.1.0

RSS133 (Issue2) Canadian Standard

Standards of European Type Approval

3GPP TS 51.010-1 “Digital cellular telecommunications system (Phase 2); Mobile

ETSI EN 301 511 “V7.0.1 (2000-12) Candidate Harmonized European Standard

GCF-CC “Global Certification Forum - Certification Criteria” V3.16.0

ETSI EN 301 489-1 “V1.2.1 Candidate Harmonized European Standard

ETSI EN 301 489-7 “V1.1.1 Candidate Harmonized European Standard

EN 60 950 Safety of information technology equipment (2000)

referred to as R&TTE Directive 1999/5/EC

voltage limits (Low Voltage Directive)

cations, PCS)”; US Equipment Authorization FCC

Station (MS) conformance specification”

(Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)”

(Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)”

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Requirements of quality

IEC 60068 Environmental testing

DIN EN 60529 IP codes

Compliance with international rules and regulations

Manufacturers of mobile or fixed devices incorporating TC63 modules are advised to have their completed product tested and approved for compliance with all applicable national and international regulations. As a quad-band GSM/GPRS engine designed for use on any GSM network in the world, TC63 is required to pass all approvals relevant to operation on the European and North American markets. For the North American market this includes the Rules and Regulations of the Federal Communications Commission (FCC) and PTCRB, for the European market the R&TTE Directives and GCF Certification Criteria must be fully satisfied.

The FCC Equipment Authorization granted to the TC63 Siemens reference application is valid only for the equipment described in Section 8.1.

SAR requirements specific to portable mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable TC63 based applications to be evaluated and approved for compliance with national and/or international regulations.

Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.

Products intended for sale on US markets

ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to

Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz

Products intended for sale on European markets

EN 50360 Product standard to demonstrate the compliance of mobile phones

with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)

Note: Usage of TC63 in a fixed, mobile or portable application is not allowed without a new FCC certification.

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1.4 Safety Precautions

The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TC63. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer’s failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions on the

use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.

The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.

Switch off the cellular terminal or mobile before boarding an aircraft. Make

sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable

gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency

energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.

Road safety comes first! Do not use a hand-held cellular terminal or mobile

when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.

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IMPORTANT!

SOS

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.

Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.

Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

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2 Product Concept

2.1 Key Features at a Glance

Feature Implementation

General

Frequency bands Quad band: GSM 850/900/1800/1900MHz

GSM class Small MS

Output power (according to Release 99, V5)

Power supply 3.2V to 4.5V

Power consumption Sleep mode: max. TBD

Operating temperature -30°C to +65°C ambient temperature

Physical Dimensions: 33.9mm x 44.6mm x max. 3.5mm

GSM / GPRS features

Data transfer GPRS

Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900

The values stated above are maximum limits. According to Release 99, Version 5, the maximum output power in a multislot configuration may be lower. The nominal reduction of maximum output power varies with the number of uplink timeslots used and amounts to 3.0dB for 2Tx, 4.8dB for 3Tx and 6.0dB for 4Tx.

Power down mode: typically 50µA

Auto switch-off at +90°C board temperature (preliminary)

Weight: approx. 7.5g

• Multislot Class 12

• Full PBCCH support

• Mobile Station Class B

• Coding Scheme 1 – 4

CSD

• V.110, RLP, non-transparent

• 2.4, 4.8, 9.6, 14.4kbps

• USSD

PPP-stack for GPRS data transfer

SMS

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• Point-to-point MT and MO

• Cell broadcast

• Text and PDU mode

• Storage: SIM card plus 25 SMS locations in mobile equipment

• Transmission of SMS alternatively over CSD or GPRS.

Preferred mode can be user defined.

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Feature Implementation

Fax Group 3; Class 1

Audio Speech codecs:

• Half rate HR (ETS 06.20)

• Full rate FR (ETS 06.10)

• Enhanced full rate EFR (ETS 06.50/06.60/06.80)

• Adaptive Multi Rate AMR

Speakerphone operation Echo cancellation, noise suppression DTMF 7 ringing tones

Software

AT commands AT-Hayes GSM 07.05 and 07.07, Siemens

AT commands for RIL compatibility (NDIS/RIL)

MicrosoftTM compatibility RIL / NDIS for Pocket PC and Smartphone

SIM Application Toolkit SAT Release 99

TCP/IP stack Access by AT commands

IP addresses IP version 6

Remote SIM Access TC63 supports Remote SIM Access. RSA enables TC63 to use a

remote SIM card via its serial interface, in addition to the SIM card locally attached to the dedicated lines of the application interface. In a vehicle mounted scenario, for example, this allows the driver to access a mobile phone brought into the car from a carembedded phone. The connection between both phones can be a Bluetooth wireless link or a serial link, e.g. via the car cradle. The necessary protocols and procedures are implemented according to the “SIM Access Profile Interoperability Specification of the Bluetooth Special Interest Group”.

Firmware update Download over serial interface ASC0

Download over SIM interface Download over USB

Interfaces

2 serial interfaces

ASC0

• 8-wire modem interface with status and control lines, unbalanced, asynchronous

• 1.2kbps to 460kbps

• Autobauding TBD

• Supports RTS0/CTS0 hardware handshake and software

XON/XOFF flow control.

• Multiplex ability according to GSM 07.10 Multiplexer Protocol.

ASC1

• 4-wire, unbalanced asynchronous interface

• 1.2kbps to 460kbps

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Feature Implementation

• Autobauding TBD

• Supports RTS1/CTS1 hardware handshake and software

XON/XOFF flow control

USB Supports a USB 2.0 Full Speed (12Mbit/s) slave interface.

I2C I2C bus for 7-bit addressing and transmission rates up to 400kbps.

Programmable with AT^SSPI command.

Audio

SIM interface Supported SIM cards: 3V, 1.8V

Antenna 50Ohms. External antenna can be connected via antenna

Module interface 80-pin board-to-board connector

Power on/off, Reset

Power on/off

Reset

Special features

Charging Supports management of rechargeable Lithium Ion and Lithium

Real time clock Timer functions via AT commands

• 2 analog interfaces

• 1 digital interface (PCM)

connector or solderable pad.

• Switch-on by hardware pin IGT

• Switch-off by AT command (AT^SMSO)

• Automatic switch-off in case of critical temperature and

voltage conditions.

• Orderly shutdown and reset by AT command

• Emergency reset by hardware pins EMERG_RST and IGT.

Polymer batteries

Phonebook SIM and phone

Evaluation kit

DSB75 DSB75 Evaluation Board designed to test and type approve

Siemens cellular engines and provide a sample configuration for application engineering.

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2.2 TC63 System Overview

TC63

Antenna

Interface

Application Interface

USB SIM

USB

Host

I2C

Slave

Serial 1

Modem)

(

SIM card

Serial 2

UART

Digital

Audio

Codec

Analog

Audio

Headphones

or Headset

User Application

Figure 1: TC63 system overview

Charge

Charging

circuit

Charger

Power

Supply

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2.3 Circuit Concept

Figure 2 shows a block diagram of the TC63 module and illustrates the major functional components:

Baseband block:

• Digital baseband processor with DSP

• Analog processor with power supply unit (PSU)

• Flash / SRAM (stacked)

• Application interface (board-to-board connector)

RF section:

• RF transceiver

• RF power amplifier

• RF front end

• Antenna connector

Front End

r a

RF Powe r

Amplifier

F R

Transceiver

TC63

NTC

Measuring Network

26MHz

32.768kHz

Interface RF - Baseband

RF Control Bus

I / Q

Digital Baseband Processor with DSP

RTC

CCIN CCRST CCIO

CCCLK CCVCC

Analog Controller

wi t h PSU

REFCHG

TEM P2

BATTYPE

D(0:15)

SRAM

A(0:24)

RD; WR; CS; WAIT

t e s e R

RESET

Flash

VEX T

EM ERG_RS T

Au dio a nalog

IGT

VDDL P

CHARGEGATE

VCHA RGE

ISEN SE

VSE NSE

BATT_TEM P

BATT +

GND

ASC(0 )

ASC(1 )4

I2C

USB

SD Ca rd

DAI

SYNC

SIM Interface

PWR _IND

Application Interface (80 pins)

Figure 2: TC63 block diagram

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3 Application Interface

TC63 is equipped with an 80-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces described in the following chapters:

• Power supply - see Section 3.2

• Charger interface – Section 3.5

• SIM interface - see Section 3.8

• Serial interface ASC0 - see Section 3.9

• Serial interface ASC1 - see Section 3.10

• Serial interface USB - see Section 3.11.

• Serial interface I²C - see Section 3.12

• Two analog audio interfaces - see Section 3.13

• Digital audio interface (DAI) - see Section 3.13 and 3.13.4

• Status and control lines: IGT, EMERG_RST, PWR_IND, SYNC - see Table 17

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3.1 Operating Modes

The table below briefly summarizes the various operating modes referred to in the following chapters.

Table 1: Overview of operating modes

Normal operation

GSM / GPRS SLEEP Various power save modes set with AT+CFUN

command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=7 and 9 alternatively activate and deactivate the AT interfaces to allow permanent access to all AT commands.

GSM IDLE Software is active. Once registered to the GSM

network, paging with BTS is carried out. The module is ready to send and receive.

GSM TALK Connection between two subscribers is in progress.

Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna.

GPRS IDLE Module is ready for GPRS data transfer, but no data is

currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings).

GPRS DATA GPRS data transfer in progress. Power consumption

depends on network settings (e.g. power control level), uplink / downlink data rates, GPRS configuration (e.g. used multislot settings) and reduction of maximum output power.

POWER DOWN Normal shutdown after sending the AT^SMSO command.

The Power Supply disconnects the supply voltage from the baseband part of the circuit. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.

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Airplane mode Airplane mode shuts down the radio part of the module, causes the module to

log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by using the AT commands AT^SCFG and AT+CALA:

• With AT^SCFG=MEopMode/Airplane/OnStart the module can be configured to enter the Airplane mode each time when switched on or reset.

• The parameter AT^SCFG=MEopMode/Airplane can be used to switch back and forth between Normal mode and Airplane mode any time during operation.

• Setting an alarm time with AT+CALA followed by AT^SMSO wakes the module up into Airplane mode at the scheduled time.

Charge-only mode Limited operation for battery powered applications. Enables charging while

module is detached from GSM network. Limited number of AT commands is accessible. Charge-only mode applies when the charger is connected if the module was powered down with AT^SMSO.

Charge mode during normal operation

See Table 6 for the various options proceeding from one mode to another.

Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and charging running in parallel. Charge mode changes to Charge-only mode when the module is powered down before charging has been completed.

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3.2 Power Supply

TC63 needs to be connected to a power supply at the B2B connector (5 pins each BATT+ and GND).

The power supply of TC63 has to be a single voltage source at BATT+. It must be able to provide the peak current during the uplink transmission.

All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

• Stabilizes the supply voltages for the GSM baseband using low drop linear voltage

regulators.

• Switches the module's power voltages for the power up and down procedures.

• Delivers, across the VEXT pin, a regulated voltage for an external application. This

voltage is not available in Power-down mode.

• SIM switch to provide SIM power supply.

3.2.1 Minimizing Power Losses

When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage V even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that TC63 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV.

The measurement network monitors outburst and inburst values. The drop is the difference of both values. The maximum drop (Dmax) since the last start of the module will be saved. In IDLE and SLEEP mode, the module switches off if the minimum battery voltage (V reached.

Example: V

min = 3.2V

Dmax = 0.35V

min = VImin + Dmax

batt

min = 3.2V + 0.35V = 3.55V

batt

The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered.

Note: If the application design requires an adapter cable between both board-to-board

connectors, use a flex cable as short as possible in order to minimize power losses.

never drops below 3.2V on the TC63 board, not

BATT+

min) is

batt

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Example: If the length of the flex cable reaches the maximum length of 100mm, this

connection may cause, for example, a resistance of 30m in the BATT+ line and 30m in the GND line. As a result, a 2A transmit burst would add up to a total voltage drop of 120mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery including its protection circuit.

BATT+

min. 3.2V

Figure 3: Power supply limits during transmit burst

Transmit

burst 2A

Transmit

burst 2A

Ripple

Drop

3.2.2 Measuring the Supply Voltage V

The reference points for measuring the supply voltage V GND, both accessible at a capacitor located close to the board-to-board connector of the module.

Reference point BATT+

Figure 4: Position of the reference points BATT+ and GND

Reference point GND

BATT+

on the module are BATT+ and

3.2.3 Monitoring Power Supply by AT Command

To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND.

The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when TC63 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.

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3.3 Power Up / Power Down Scenarios

In general, be sure not to turn on TC63 while it is beyond the safety limits of voltage and temperature stated in Chapter 5. TC63 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module.

3.3.1 Turn on TC63

TC63 can be started in a variety of ways as described in the following sections:

• Hardware driven start-up by IGT line: starts Normal mode or Airplane mode (see Section

3.3.1.1)

• Software controlled reset by AT+CFUN command: starts Normal or Airplane mode (see Section 3.3.1.3)

• Hardware driven start-up by VCHARGE line: starts charging algorithm and Charge-only mode (see Section 3.3.1.2)

• Wake-up from Power-down mode by using RTC interrupt: starts Airplane mode

The option whether to start into Normal mode or Airplane mode depends on the settings made with the AT^SCFG command or AT+CALA. With AT+CALA, followed by AT^SMSO the module can be configured to restart into Airplane mode at a scheduled alarm time. Switching back and forth between Normal mode and Airplane mode is possible any time during operation by using the AT^SCFG command.

After startup or mode change the following URCs indicate the module’s ready state:

• “SYSSTART” indicates that the module has entered Normal mode.

• “^SYSSTART AIRPLANE MODE” indicates that the module has entered Airplane mode.

• “^SYSSTART CHARGE ONLY MODE” indicates that the module has entered the

Charge-only mode.

Detailed explanations on AT^SCFG, AT+CFUN, AT+CALA and Airplane mode can be found in [1].

3.3.1.1 Turn on TC63 Using Ignition Line IGT

When the TC63 module is in Power-down mode, it can be started to Normal mode or Airplane mode by driving the IGT (ignition) line to ground. This must be accomplished with an open drain/collector driver to avoid current flowing into this pin.

The module will start up when both of the following two conditions are met:

• The supply voltage applied at BATT+ must be in the operating range.

• The IGT line needs to be driven low for at least 400ms.

Considering different strategies of host application design the figures below show two approaches to meet this requirement: The example in Figure 5 assumes that IGT is activated after BATT+ has already been applied. The example in Figure 6 assumes that IGT is held low before BATT+ is switched on. In either case, to power on the module, ensure that low state of IGT takes at least 400ms from the moment the voltage at BATT+ is available.

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If configured to a fix baud rate (AT+IPR0), the module will send the URC “^SYSSTART” or “^SYSSTART AIRPLANE MODE” to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification.

BATT+

t = 400ms

min

IGT

HiZ

PWR_IND

120ms

EMERG_RST

VEXT

TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)

CTS0/CTS1/DSR0/DCD0

Undefined

Serial interfaces

ca. 500 ms

ASC0 and ASC1

Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT

Active

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BATT+

t = 400ms

min

IGT

PWR_IND

120ms

EMERG_RST

VEXT

HiZ

TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)

CTS0/CTS1/DSR0/DCD0

Active

Serial interfaces

Undefined

ca. 500 ms

ASC0 and ASC1

Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+

3.3.1.2 Turn on TC63 Using the VCHARGE Signal

As detailed in Section 3.5.7, the charging adapter can be connected regardless of the module’s operating mode.

If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE pin while TC63 is off, and the battery voltage is above the undervoltage lockout threshold, processor controlled fast charging starts (see Section 3.5.6). TC63 enters a restricted mode, referred to as Charge-only mode where only the charging algorithm will be launched.

During the Charge-only mode TC63 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch to normal operation and log on to the GSM network, the IGT line needs to be activated as described in Section 3.3.1.

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3.3.1.3 Reset TC63 via AT+CFUN Command

To reset and restart the TC63 module use the command AT+CFUN. You can enter AT+CFUN=,1 or AT+CFUN=x,1, where x may be in the range from 0 to 9. See [1] for details.

If configured to a fix baud rate (AT+IPR0), the module will send the URC “^SYSSTART” or “^SYSSTART AIRPLANE MODE to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart.

3.3.1.4 Reset or Turn off TC63 in Case of Emergency

Caution: Use the EMERG_RST pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST pin causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if TC63 does not respond, if reset or shutdown via AT command fails.

The EMERG_RST signal is available on the application interface. To control the EMERG_RST line it is recommended to use an open drain / collector driver.

The EMERG_RST line can be used to switch off or to reset the module. In any case the EMERG_RST line must be pulled to ground for ≥10ms. Then, after releasing the EMERG_RST line additional activation of IGT for 400 ms will reset the module. If IGT is not activated for 400 ms the module switches off. In this case, it can be restarted any time as described in section 3.3.1.1.

After hardware driven restart, notification via “^SYSSTART” or “^SYSSTART AIRPLANE” URC is the same as in case of restart by IGT or AT command. To register to the network SIM PIN authentication is necessary after restart.

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3.3.2 Turn off TC63

TC63 can be turned off as follows:

• Normal shutdown: Software controlled by AT^SMSO command

• Automatic shutdown: Takes effect if board or battery temperature is out of range or if

undervoltage or overvoltage conditions occur.

3.3.2.1 Turn off TC63 Using AT Command

The best and safest approach to powering down TC63 is to issue the AT^SMSO command. This procedure lets TC63 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode. In this mode, only the RTC stays active.

Before switching off the device sends the following response: ^SMSO: MS OFF

OK ^SHUTDOWN

After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off:

• Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile and the module turns off in less than 1 second.

• Also, you can monitor the PWR_IND pin. High state of PWR_IND definitely indicates that the module is switched off.

Be sure not to disconnect the supply voltage V been issued and the PWR_IND signal has gone high. Otherwise you run the risk of losing data. Signal states during turn-off are shown in Figure 7.

While TC63 is in Power-down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface, especially of the serial interfaces. No special care is required for the USB interface which is protected from reverse current.

before the URC “^SHUTDOWN” has

BATT+

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PWR_IND

VEXT

CTS0/CTS1/DSR0/DTR0

TXD0/TXD1/RTS0/RTS1/DTR0 (driven by the application)

Active

Serial interfaces ASC0 and ASC1

Figure 7: Signal states during turn-off procedure

Note 1: Depending on capacitance load from host application

See note 1

Undefined

3.3.2.2 Leakage Current in Power Down Mode

The leakage current in Power Down mode varies depending on the following conditions:

• If the supply voltage at BATT+ was disconnected and then applied again without starting up the TC63 module, the leakage current ranges between 90µA and 100µA.

• If the TC63 module is started and afterwards powered down with AT^SMSO, then the leakage current is only 50µA.

Therefore, in order to minimize the leakage current take care to start up the module at least once before it is powered down.

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3.3.3 Automatic Shutdown

Automatic shutdown takes effect if

• the TC63 board is exceeding the critical limits of overtemperature or undertemperature

• the battery is exceeding the critical limits of overtemperature or undertemperature

• undervoltage or overvoltage is detected

See Charge-only mode described in section 3.5.7 for exceptions.

The automatic shutdown procedure is equivalent to the Power-down initiated with the AT^SMSO command, i.e. TC63 logs off from the network and the software enters a secure state avoiding loss of data.

Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of these URCs can be enabled or disabled with the two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the condition, please see Chapters 3.3.3.1 to 3.3.3.4 for details. For further instructions on AT commands refer to [1].

3.3.3.1 Temperature Dependent Shutdown

The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The NTC that detects the battery temperature must be part of the battery pack circuit as described in 3.5.3 The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature.

Each time the board or battery temperature goes out of range or back to normal, TC63 instantly displays an alert (if enabled).

• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command: AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after

start-up of TC63. After 15 seconds operation, the presentation will be disabled, i.e. no alert messages can be generated.

• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed.

The maximum temperature ratings are stated in Table 16. Refer to Table 2 for the associated URCs. All statements are based on test conditions according to IEC 60068-2-2 (still air).

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Table 2: Temperature dependent behavior

Sending temperature alert (15s after TC63 start-up, otherwise only if URC presentation enabled)

^SCTM_A: 1 Caution: T

^SCTM_B: 1 Caution: T

^SCTM_A: -1 Caution: T

^SCTM_B: -1 Caution: T

^SCTM_A: 0 Battery back to uncritical temperature range.

^SCTM_B: 0 Board back to uncritical temperature range.

Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_A: 2 Alert: T

^SCTM_B: 2 Alert: T

^SCTM_A: -2 Alert: T

^SCTM_B: -2 Alert: T

of battery close to overtemperature limit.

amb

of board close to overtemperature limit.

amb

of battery close to undertemperature limit.

amb

of board close to undertemperature limit.

amb

of battery equal or beyond overtemperature limit. TC63 switches off.

amb

of board equal or beyond overtemperature limit. TC63 switches off.

amb

of battery equal or below undertemperature limit. TC63 switches off.

amb

of board equal or below undertemperature limit. TC63 switches off.

amb

3.3.3.2 Temperature Control during Emergency call

If the temperature limit is exceeded while an emergency call is in progress the engine continues to measure the temperature, but deactivates the shutdown functionality. If the temperature is still out of range when the call ends, the module switches off immediately (without another alert message).

3.3.3.3 Undervoltage Shutdown if Battery NTC is Present

In applications where the module’s charging technique is used and an NTC is connected to the BATT_TEMP terminal, the software constantly monitors the applied voltage. If the measured battery voltage is no more sufficient to set up a call the following URC will be presented: ^SBC: Undervoltage.

The message will be reported, for example, when the user attempts to make a call while the voltage is close to the shutdown threshold of 3.2V and further power loss is caused during the transmit burst. In IDLE mode, the shutdown threshold is the sum of the module’s minimum supply voltage (3.2V) and the value of the maximum voltage drop resulting from earlier calls. This means that in IDLE mode the actual shutdown threshold may be higher than 3.2V. Therefore, to properly calculate the actual shutdown threshold application manufacturers are advised to measure the maximum voltage drops that may occur during transmit bursts.

To remind the user that the battery needs to be charged soon, the URC appears several times before the module switches off.

To enable or disable the URC use the AT^SBC command. The URC will be enabled when you enter the write command and specify the current consumption of your host application. Step by step instructions are provided in [1].

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3.3.3.4 Undervoltage Shutdown if no Battery NTC is Present

The undervoltage protection is also effective in applications, where no NTC connects to the BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or TC63 is fed by a fixed supply voltage. All you need to do is executing the write command AT^SBC=<current> which automatically enables the presentation of URCs. You do not need to specify <current>.

Whenever the supply voltage falls below the value of 3.2V the URC ^SBC: Undervoltage appears several times before the module switches off.

3.3.3.5 Overvoltage Shutdown

The overvoltage shutdown threshold is 100mV above the maximum supply voltage V specified in Table 18.

When the supply voltage approaches the overvoltage shutdown threshold the module will send the following URC ^SBC: Overvoltage warning This alert is sent once.

When the overvoltage shutdown threshold is exceeded the module will send the URC ^SBC: Overvoltage shutdown before it shuts down cleanly.

Keep in mind that several TC63 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of TC63, even if the module is switched off. Especially the power amplifier is very sensitive to high voltage and might even be destroyed.

BATT+

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3.4 Automatic GPRS Multislot Class Change

Temperature control is also effective for operation in GPRS Multislot Class 10 and GPRS Multislot Class 12. If the board temperature increases to the limit specified for restricted operation

• from GPRS Multislot Class 12 (4Tx slots) to GPRS Multislot Class 8 (1Tx)

• from GPRS Multislot Class 10 (2Tx slots) to GPRS Multislot Class 8 (1Tx)

This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted operation, TC63 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, TC63 will not switch back to the higher class.

After a transition from GPRS Multislot Class 12 or 10 to GPRS Multislot Class 8 a possible switchback to GPRS Multislot Class 12 or 10 is blocked for one minute.

Please note that there is not one single cause of switching over to a lower Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in Section 3.3.3.1.

See Table 16 for temperature limits known as restricted operation.

while data are transmitted over GPRS, the module automatically reverts:

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3.5 Charging Control

TC63 integrates a charging management for rechargeable Lithium Ion and Lithium Polymer batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm.

The following sections contain an overview of charging and battery specifications. Please refer to [4] for greater detail, especially regarding requirements for batteries and chargers, appropriate charging circuits, recommended batteries and an analysis of operational issues typical of battery powered GSM/GPRS applications.

3.5.1 Hardware Requirements

TC63 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application according to the Figure 38.

3.5.2 Software Requirements

Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the TC63 module to correctly determine the end of charging and terminate charging automatically when the battery is fully charged. If the <current> value is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage. Therefore, the termination condition is defined as: final charge current (50mA) plus current consumption of the external application. If used the current flowing over the VEXT pin of the application interface (typically 2.9V) must be added, too.

The parameter <current> is volatile, meaning that the factory default (0mA) is restored each time the module is powered down or reset. Therefore, for better control of charging, it is recommended to enter the value every time the module is started.

See [1] for details on AT^SBC.

3.5.3 Battery Pack Requirements

The charging algorithm has been optimized for rechargeable Lithium batteries that meet the characteristics listed below and in Table 3. It is recommended that the battery pack you want to integrate into your TC63 application is compliant with these specifications. This ensures reliable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.

• Li-Ion or Lithium Polymer battery pack specified for a maximum charging voltage of 4.2V and a recommended capacity of 1000 to 1200mAh.

• Since charging and discharging largely depend on the battery temperature, the battery pack should include an NTC resistor. If the NTC is not inside the battery it must be in thermal contact with the battery. The NTC resistor must be connected between BATT_TEMP and GND. The B value of the NTC should be in the range: 10kΩ + =3435K ± 3% (alternatively acceptable: 10kΩ + note that the NTC is indispensable for proper charging, i.e. the charging process will not

2% @ 25°C, B

5% @ 25°C, B

= 3370K +3%). Please

25/50

= 3423K to B

25/85

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start if no NTC is present.

• Ensure that the pack incorporates a protection circuit capable of detecting overvoltage (protection against overcharging), undervoltage (protection against deep discharging) and overcurrent. Due to the discharge current profile typical of GSM applications, the circuit must be insensitive to pulsed current.

• On the TC63 module, a built-in measuring circuit constantly monitors the supply voltage. In the event of undervoltage, it causes TC63 to power down. Undervoltage thresholds are specific to the battery pack and must be evaluated for the intended model. When you evaluate undervoltage thresholds, consider both the current consumption of TC63 and

the application circuit.

• The internal resistance of the battery and the protection should be as low as possible. It is recommended not to exceed 150m, even in extreme conditions at low temperature. The battery cell must be insensitive to rupture, fire and gassing under extreme conditions of temperature and charging (voltage, current).

• The battery pack must be protected from reverse pole connection. For example, the casing should be designed to prevent the user from mounting the battery in reverse orientation.

• It is recommended that the battery pack be approved to satisfy the requirements of CE conformity.

Figure 8 shows the circuit diagram of a typical battery

to BATT+

to BATT_TEMP to GND

pack design that includes the protection elements described above.

NTC

Protection Circuit

Figure 8: Battery pack circuit diagram

Table 3: Specifications of battery packs suitable for use with TC63

Battery cell

Polyfuse

Battery type Rechargeable Lithium Ion or Lithium Polymer battery

Nominal voltage 3.6V / 3.7V

Capacity Recommended: 1000mAh to 1200mAh

Minimum: 500mAh

NTC 10k ± 5% @ 25°C

approx. 5k @ 45°C approx. 26.2k @ 0°C B value range: B (25/85)=3423K to B =3435K ± 3%

Overcharge detection voltage 4.325 ± 0.025V

Overdischarge detection voltage 2.5 ± 0.05V

Overcurrent detection 3 ± 0.5A

Overcurrent detection delay time 4 ~ 16ms

Short detection delay time 50µs

Internal resistance <130m

Note: A maximum internal resistance of 150m should not be exceeded even after 500 cycles and under extreme conditions.

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3.5.4 Batteries Recommended for Use with TC63

When you choose a battery for your TC63 application you can take advantage of one of the following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all requirements listed above. They have been thoroughly tested by Siemens, proved to be suited for TC63, and are CE approved.

• LIP 633450A1B PCM.STB, type Lithium Ion This battery is listed in the standard product range of VARTA. It is incorporated in a shrink sleeve and has been chosen for integration into the reference setup submitted for Type Approval of Siemens GSM modules.

• LPP 503759CA PCM.NTC.LT50, type Lithium Polymer This battery has been especially designed by VARTA for use with Siemens GSM modules. It has the same properties as the above Li-Ion battery, except that it is type Polymer, is smaller and comes without casing.

Specifications, construction drawings and sales contacts for both VARTA batteries can be found in Section 9.3.

3.5.5 Charger Requirements

For using the implemented charging algorithm and the reference charging circuit recommended in [4] and in Figure 38, the charger has to meet the following requirements: Output voltage: 5.2Volts ±0.2V (stabilized voltage) Output current: 500mA Chargers with a higher output current are acceptable, but please

consider that only 500mA will be applied when a 0.3Ohms shunt resistor is connected between VSENSE and ISENSE. See [4] for further details.

3.5.6 Implemented Charging Technique

If all requirements listed above are met (appropriate external charging circuit of application, battery pack, charger, AT^SBC settings) then charging is enabled in various stages depending on the battery condition:

Trickle charging:

• Trickle charge current flows over the VCHARGE line.

• Trickle charging is done when a charger is present (connected to VCHARGE) and the

battery is deeply discharged or has undervoltage. If deeply discharged (Deep Discharge Lockout at V (Undervoltage Lockout at V

Software controlled charging:

• Controlled over the CHARGEGATE.

• Temperature conditions: 0°C to 45°C

• Software controlled charging is done when the charger is present (connected to

VCHARGE) and the battery voltage is at least above the undervoltage threshold. Software controlled charging passes the following stages:

- Power ramp: Depending on the discharge level of the battery (i.e. the measured battery

voltage V battery. The duration of power ramp charging is very short (less than 30 seconds).

= 0…2.5V) the battery is charged with 5mA, in case of undervoltage

BATT+

= 2.5…3.2V) it is charged with 30mA

BATT+

) the software adjusts the maximum charge current for charging the

BATT+

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- Fast charging: Battery is charged with constant current (approx. 500mA) until the

battery voltage reaches 4.2V (approx. 80% of the battery capacity).

- Top-up charging: The battery is charged with constant voltage of 4.2V at stepwise

reducing charge current until full battery capacity is reached.

• The duration of software controlled charging depends on the battery capacity and the level of discharge.

3.5.7 Operating Modes during Charging

Of course, the battery can be charged regardless of the engine's operating mode. When the GSM module is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remains operational while charging is in progress (provided that sufficient voltage is applied). The charging process during the Normal mode is referred to as Charge mode.

If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE pin while TC63 is in Power-down mode, TC63 goes into Charge-only mode.

While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism. Instead the following applies:

• If the module is in Normal mode and the charger is connected (Charge mode) the AT^SMSO command causes the module to shut down shortly and then start into the Charge-only mode.

• In Charge-only mode the AT^SMSO command is not usable.

• In Charge-only mode the module neither switches off when the battery or the module

exceeds the critical limits of overtemperature or undertemperature.

In these cases you can only switch the module off by disconnecting the charger.

To proceed from Charge-only mode to another operating mode you have the following options:

• To switch from Charge-only mode to Normal mode drive the ignition line (IGT) to ground for 1 second.

• To switch from Charge-only mode to Airplane mode enter the command AT^SCFG=MEopMode/Airplane,on.

• If AT^SCFG=MEopMode/Airplane/OnStart,on is set, driving the ignition line (IGT) activates the Airplane mode.

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Table 4: Comparison Charge-only and Charge mode

How to activate mode

Connect charger to charger input of host application charging circuit and module’s VCHARGE pin while TC63 is

• operating, e.g. in IDLE or TALK mode

• in SLEEP mode

Charge mode

Connect charger to charger input of host application charging circuit and module’s VCHARGE pin while TC63 is

• in Power-down mode

• in Normal mode: Connect charger to

the VCHARGE pin, then enter AT^SMSO.

NOTE: While trickle charging is in progress, be sure that the host application is switched off. If the

Charge-only mode

application is fed from the trickle charge current the module might be prevented from proceeding to software controlled charging since the current would not be sufficient.

Description of mode

• Battery can be charged while GSM module remains operational and registered to the GSM network.

• In IDLE and TALK mode, the serial interfaces are accessible. All AT commands can be used to full extent.

NOTE: If the module operates at maximum power level (PCL5) and GPRS Class 12 at the same time the current consumption is higher than the current supplied by the charger.

• Battery can be charged while GSM engine is deregistered from GSM network.

• Charging runs smoothly due to constant current consumption.

• The AT interface is accessible and allows to use the commands listed below.

Table 5: AT commands available in Charge-only mode

AT command Use

AT+CALA Set alarm time, configure Airplane mode.

AT+CCLK Set date and time of RTC.

AT^SBC Query status of charger connection. Enable / disable “^SBC” URCs.

AT^SBV Monitor supply voltage.

AT^SCTM Query temperature range, enable/disable URCs to report critical temperature

ranges

AT^SCFG Enable/disable parameters MEopMode/Airplane or MEopMode/Airplane/OnStart

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3.6 Summary of State Transitions (Except SLEEP Mode)

Table 6: State transitions of TC63 (except SLEEP mode) The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes)

Further mode ÎÎÎ

Present mode

POWER DOWN Normal mode

**)

Charge-only mode*) Airplane mode

POWER DOWN mode

--- If AT^SCFG=MeOpMode/ Airplane/OnStart,off: IGT >400 ms at low level

Normal mode

**)

AT^SMSO --- AT^SMSO if charger is

Charge-only mode *) Disconnect charger If AT^SCFG=MeOpMode/

Airplane/OnStart,off: IGT >1s at low level

Airplane mode AT^SMSO AT^SCFG=MeOpMode/

Airplane,off

See section 3.5.7 for details on the charging mode

**)

Normal mode covers TALK, DATA, GPRS, IDLE and SLEEP modes

Connect charger to VCHARGE If AT^SCFG=MeOpMode/

Airplane/OnStart,on: IGT >400 ms at low level Regardless of AT^SCFG configuration: scheduled wake-up set with AT+CALA.

AT^SCFG=MeOpMode/

connected

Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: AT+CFUN=x,1 or EMERG_RST + IGT >400 ms.

--- AT^SCFG=MeOpMode/ Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: IGT >1s at low level

AT^SMSO if charger is

---

connected

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3.7 RTC Backup

The internal Real Time Clock of TC63 is supplied from a separate voltage regulator in the analog controller which is also active when TC63 is in POWER DOWN status. An alarm function is provided that allows to wake up TC63 to Airplane mode without logging on to the GSM network.

In addition, you can use the VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged by the BATT+ line of TC63. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to TC63, i.e. the larger the capacitor the longer TC63 will save the date and time.

A serial 1k resistor placed on the board next to VDDLP limits the charge current of an empty capacitor or battery.

The following figures show various sample configurations. Please refer to Table 17 for the parameters required.

Baseband processor

RTC

PSU

B2B

BATT+

VDDLP

Figure 9: RTC supply from capacitor

BATT+

Baseband processor

RTC

PSU

B2B

VDDLP

Figure 10: RTC supply from rechargeable battery

BATT+

Baseband processor

RTC

PSU

B2B

VDDLP

Figure 11: RTC supply from non-chargeable battery

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3.8 SIM Interface

The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface.

The SIM interface supports 3V and 1.8V SIM cards. Please refer to Table 17 for electrical specifications of the SIM interface lines depending on whether a 3V or 1.8V SIM card is used.

The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with TC63 and is part of the Siemens reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers.

Table 7: Signals of the SIM interface (board-to-board connector)

Signal Description

CCGND Separate ground connection for SIM card to improve EMC.

Be sure to use this ground line for the SIM interface rather than any other ground pin or plane on the module. A design example for grounding the SIM interface is shown in Figure 38.

CCCLK Chipcard clock, various clock rates can be set in the baseband processor.

CCVCC SIM supply voltage.

CCIO Serial data line, input and output.

CCRST Chipcard reset, provided by baseband processor.

CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is

removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN pin is active low. The CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN pin is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of TC63.

The total cable length between the board-to-board connector pins on TC63 and the pins of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.

To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using the CCGND line to shield the CCIO line from the CCCLK line.

Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered

after removing the SIM card during operation.

Also, no guarantee can be given for properly initializing any SIM card that the user

inserts after having removed a SIM card during operation. In this case, the application must restart TC63.

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3.9 Serial Interface ASC0

TC63 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table 17.

TC63 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to the module’s TXD0 signal line

• Port RXD @ application receives data from the module’s RXD0 signal line

GSM module (DCE)

TXD0

RXD0

RTS0

CTS0

DTR0

DSR0

DCD0

RING0

Figure 12: Serial interface ASC0

Features

• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0.

• ASC0 is primarily designed for controlling voice calls, transferring CSD, fax and GPRS data and for controlling the GSM engine with AT commands.

• Full Multiplex capability allows the interface to be partitioned into three virtual channels, yet with CSD and fax services only available on the first logical channel. Please note that when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more details on Multiplex mode see [5].

• The DTR0 signal will only be polled once per second from the internal firmware of TC63.

• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited

Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG.

• By default, configured for 8 data bits, no parity and 1 stop bit. The setting can be changed using the AT command AT+ICF and, if required, AT^STPB. For details see [1].

• ASC0 can be operated at bit rates from 300bps to 460800bps.

• Autobauding supports the following bit rates: TBD.

• Autobauding is not compatible with multiplex mode.

• Supports RTS0/CTS0 hardware flow control and XON/XOFF software flow control.

Application (DTE)

TXD

RXD

RTS

CTS

DTR

DSR

DCD

RING

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Table 8: DCE-DTE wiring of ASC0

DCE DTE V.24

circuit

103 TXD0 Input TXD Output

104 RXD0 Output RXD Input

105 RTS0 Input RTS Output

106 CTS0 Output CTS Input

108/2 DTR0 Input DTR Output

107 DSR0 Output DSR Input

109 DCD0 Output DCD Input

125 RING0 Output /RING Input

Pin function Signal direction Pin function Signal direction

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3.10 Serial Interface ASC1

TC63 offers a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table 17.

TC63 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to module’s TXD1 signal line

• Port RXD @ application receives data from the module’s RXD1 signal line

GSM module (DCE)

TXD1

RXD1

RTS1

CTS1

Figure 13: Serial interface ASC1

Features

• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.

• On ASC1 no RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1].

• Configured for 8 data bits, no parity and 1 or 2 stop bits.

• ASC1 can be operated at bit rates from 300bps to 460800bps.

• Autobauding TBD.

• Supports RTS1/CTS1 hardware flow control and XON/XOFF software flow control.

Application (DTE)

TXD

RXD

RTS

CTS

Table 9: DCE-DTE wiring of ASC1

DCE DTE V.24

circuit

103 TXD1 Input TXD Output

104 RXD1 Output RXD Input

105 RTS1 Input RTS Output

106 CTS1 Output CTS Input

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3.11 USB Interface

TC63 supports a USB 2.0 Full Speed (12Mbit/s) device interface. It is primarily intended for use as command and data interface and for downloading firmware.

The USB I/O-pins are capable of driving the signal at min 3.0V. They are 5V I/O compliant.

To properly connect the module’s USB interface to the host a USB 2.0 compatible connector is required. Furthermore, the USB modem driver delivered with TC63 must be installed as described below.

The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s USB interface, but not to other TC63 interfaces. This is because TC63 is designed as a selfpowered device compliant with the “Universal Serial Bus Specification Revision 2.0”

VUSB_IN

USB_DP

USB_DN

GSM module

VBUS

GND

D+

D-

80 pole b oard-to-board connector

Host

MCU

Bas eband controller

USB

Transceiver

lin.

Regulator

PSU

5V3V

1.5kOhms

22Ohms

Figure 14: USB circuit

The specification is ready for download on http://www.usb.org/developers/docs/

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3.11.1 Installing the USB Modem Driver

This section assumes you are familiar with installing and configuring a modem under Windows 2000 and Windows XP. As both operating systems use multiple methods to access modem settings this section provides only a brief summary of the most important steps.

Take care that the “usbmodem.inf” file delivered with TC63 is at hand. Connect the USB cable to the TC63 host application (for example the evaluation board DSB75) and the PC. Windows detects TC63 as a new USB modem, opens the Found New Hardware Wizard and reports that it is searching for the “Siemens AG WM USB Modem” driver. Follow the instructions on the screen and specify the path where the “usbmodem.inf” file is located. Windows will copy the required software to your computer and configure the modem by assigning a free COM port. If you are already using more than one COM port then the next free one will be allocated. Click Finish to complete the installation.

Notes for Windows 2000 only:

• During the installation procedure you will be prompted for the “usbser.sys” driver. Make sure the file is present before you start installing the above inf file. The “usbser.sys” file is not delivered as a single file, but must be extracted from a Windows 2000 cabinet file. This is either the file “driver.cab” located in the “I386” folder of the original Windows 2000 CD or a later cabinet file inside the Service Pack. SP4 for example includes the “sp4.cab” file which can be found in its “I386” folder. The “usbser.sys” driver from the Service Pack has priority over one provided with the standard Windows 2000 install CD.

• It is necessary to restart Windows 2000 to make the changes take effect.

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You can find the “Siemens AG WM USB Modem” listed under Control

Panel | Phone and Modem Options | Modems.

Troubleshooting for installation problems

If Windows fails to assign the next free COM port to TC63 and, for example, allocates a COM port already used by another modem you can manually select a free port as follows:

Open the Windows Device Manager, select the installed “Siemens AG WM USB Modem”, click Properties, select the Advanced tab and click Advanced Port settings. From the listbox COM Port Number choose a free port. To make the changes take effect disconnect and reconnect the USB cable. If not yet successful, also restart Windows.

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3.12 I2C Interface

I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK.

The TC63 module acts as a single master device, e.g. the clock I2CCLK is driven by module. I2CDAT is a bi-directional line.

Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as mastertransmitter or as master-receiver. The customer application transmits or receives data only on request of the module. To configure and activate the I command described in [1].

To configure and activate the I

C bus use the AT^SSPI command. Detailed information on the AT^SSPI command as well explanations on the protocol and syntax required for data transmission can be found in [1].

The I

C interface can be powered from an external supply or via the VEXT line of TC63. If

connected to the VEXT line the I

C interface will be properly shut down when the module enters the Power-down mode. If you prefer to connect the I supply, take care that VCC of the application is in the range of V shut down when the PWR_IND signal goes high. See figures below as well as Section 7 and Figure 38.

In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor.

For electrical characteristics please refer to Table 17.

C interface use the AT^SSPI

C interface to an external power

and that the interface is

VEXT

GSM module

I2CDAT I2CCLK GND

Application

VCC

Figure 15: I2C interface connected to VCC of application

I2CDAT I2CCLK GND

VEXT

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GSM module

VEXT

I2CDAT I2CCLK GND

Application

I2CDAT I2CCLK GND

Figure 16: I2C interface connected to VEXT line of TC63

Note: Good care should be taken when creating the PCB layout of the host application: The

traces of I2CCLK and I2CDAT should be equal in length and as short as possible.

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3.13 Audio Interfaces

TC63 comprises three audio interfaces available on the board-to-board connector:

• Two analog audio interfaces, both with balanced or single-ended inputs/outputs.

• Serial digital audio interface (DAI) designed for PCM (Pulse Code Modulation).

This means you can connect up to three different audio devices, although only one interface can be operated at a time. Using the AT^SAIC command you can easily switch back and forth.

MICP1

MICN1

MUX

VMIC

AGND

USC0 USC1 USC2

USC3 USC4

USC5 USC6

MICP2

MICN2

EPP1

EPN1

EPP2

EPN2

MUX

Digital Audio Interface

Analog switch

Figure 17: Audio block diagram

DSP

Ai Interface

To suit different types of accessories the audio interfaces can be configured for different audio modes via the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands (except for mode 1).

Both analog audio interfaces can be used to connect headsets with microphones or speakerphones. Headsets can be operated in audio mode 3, speakerphones in audio mode 2. Audio mode 5 can be used for a speech coder without signal pre or post processing.

When shipped from factory, all audio parameters of TC63 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode.

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3.13.1 Speech Processing

The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder. Received samples from the speech decoder are passed to the DAC or DAI after post processing (frequency response correction, adding sidetone etc.).

Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are also performed on the GSM baseband processor.

3.13.2 Microphone Circuit

TC63 has two identical analog microphone inputs. There is no on-board microphone supply circuit, except for the internal voltage supply VMIC and the dedicated audio ground line AGND. Both lines are well suited to feed a balanced audio application or a single-ended audio application.

The AGND line on the TC63 board is especially provided to achieve best grounding conditions for your audio application. As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems.

3.13.2.1 Single-ended Microphone Input

Figure 18 as well as Figure 38 show an example of how to integrate a single-ended microphone input.

VMIC

Bias

VMIC

MICPx

GSM module

MICNx

AGND

Figure 18: Single ended microphone input

has to be chosen so that the DC voltage across the microphone falls into the bias voltage

range of 1.0V to 1.6V and the microphone feeding current meets its specification.

The MICNx input is automatically self biased to the MICPx DC level. It is AC coupled via C to a resistive divider which is used to optimize supply noise cancellation by the differential microphone amplifier in the module.

RA = typ. 2k R

= typ. 5k

= typ. 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= 1.0V … 1.6V, typ. 1.5V

bias

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The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (R

and CF).

VMIC

This circuit is well suited if the distance between microphone and module is kept short. Due to good grounding the microphone can be easily ESD protected as its housing usually connects to the negative terminal.

3.13.2.2 Differential Microphone Input

Figure 19 shows a differential solution for connecting an electret microphone.

VMIC

MICPx

GSM module

RA = typ. 1k R

= 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= 1.0V … 1.6V, typ. 1.5V

bias

MICNx

Bias

AGND

Figure 19: Differential microphone input

The resulting DC voltage between MICPx and AGND should be in the range of 1.0V to 1.6V to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level. The resulting AC differential voltage is then amplified in the GSM module.

The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (R

and CF).

VMIC

The advantage of this circuit is that it can be used if the application involves longer lines between microphone and module.

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3.13.2.3 Line Input Configuration with OpAmp

Figure 20 shows an example of how to connect an opamp into the microphone circuit.

VMIC

MICPx

MICNx

Bias

GSM module

AGND

Figure 20: Line input configuration with OpAmp

RA = typ. 47k R

= 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= typ. ½ V

bias

= 1.25V

MIC

The AC source (e.g. an opamp) and its reference potential have to be AC coupled to the MICPx resp. MICNx input terminals. The voltage divider between VMIC and AGND is necessary to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level.

The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (R

and CF). If a high input level and a lower

VMIC

gain are applied the filter is not necessary.

If desired, MICNx via C

can also be connected to the inverse output of the AC source

instead of connecting it to the reference potential for differential line input.

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3.13.3 Loudspeaker Circuit

The GSM module comprises two analog speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Each interface can be connected in differential and in single ended configuration. See examples in Figure 21 and Figure 22.

Loudspeaker impedance

EPP1/EPN1

= typ. 8Ohm

EPPx

GSM module

EPNx

EPP2/EPN2 Z

= typ. 32Ohm

AGND

Figure 21: Differential loudspeaker configuration

EPPx

GSM module

EPNx

AGND

Loudspeaker impedance

EPP1/EPN1 Z

= typ. 8Ohm

= 220µF

EPP2/EPN2

= typ. 32Ohm

= 47µF

Figure 22: Single ended loudspeaker configuration

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3.13.4 Digital Audio Interface DAI

The DAI can be used to connect audio devices capable of PCM (Pulse Code Modulation), for example a codec.

Table 10: Overview of DAI pin functions

Signal name on B2B connector

DAI0 TXDAI O

DAI1 RXDAI I

DAI2 FS (Frame sync) O

DAI3 BITCLK O

DAI4 nc I

DAI5 nc I

DAI6 nc I

Function for PCM Interface Input/Output

To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK) which is synchronous to the GSM system clock. The frequency of the bit clock is 128±1kHz. The frame sync signal (FS) has a frequency of 8kHz and is high for one BITCLK period. The PCM interface is master for the bit clock and the frame sync signals.

PCM interface of the GSM module

Codec

BITCLK

TXDAI

RXDAI

Figure 23: PCM interface application

bitclk

frame sync

RX_data

TX_data

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The timing of a PCM short frame is shown in Figure 24. In PCM mode, 16-bit data are transferred in both directions at the same time. The duration of a frame sync pulse is one BITCLK period, starting at the rising edge of BITCLK. TXDAI data is shifted out at the next rising edge of BITCLK. The most significant bit is transferred first. Data transmitted from RXDAI of the internal application is sampled at the falling edge of BITCLK.

125µs

BITCLK

TXDAI

RXDAI

MSB

LSB1

LSB

MSB

14 13

LSB

MSB 14

Figure 24: PCM timing

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3.14 Control Signals

3.14.1 Synchronization Signal

The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the SYNC pin (pin number 32). Please note that this pin can adopt three different operating modes which you can select by using the AT^SSYNC command: the mode AT^SSYNC=0 described below, and the two LED modes AT^SSYNC=1 or AT^SSYNC=2 described in [1] and Section 3.14.2.

The first function (factory default AT^SSYNC=0) is recommended if you want your application to use the synchronization signal for better power supply control. Your platform design must be such that the incoming signal accommodates sufficient power supply to the TC63 module if required. This can be achieved by lowering the current drawn from other components installed in your application.

The timing of the synchronization signal is shown below. High level of the SYNC pin indicates increased power consumption during transmission.

1 Tx 577 µs every 4.616 ms 2 Tx 1154 µs every 4.616 ms

Transmit burst

SYNC signal

The duration of the SYNC signal is always equal, no matter whether the traffic or the

t = 180 sµ

Figure 25: SYNC signal during transmit burst

access burst are active.

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3.14.2 Using the SYNC Pin to Control a Status LED

As an alternative to generating the synchronization signal, the SYNC pin can be configured to drive a status LED that indicates different operating modes of the TC63 module. To take advantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application. The connected LED can be operated in two different display modes (AT^SSYNC=1 or AT^SSYNC=2). For details please refer to [1].

Especially in the development and test phase of an application, system integrators are advised to use the LED mode of the SYNC pin in order to evaluate their product design and identify the source of errors.

To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample circuit is shown in Figure 26. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 17, SYNC pin.

Figure 26: LED Circuit (Example)

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4 Antenna Interface

The RF interface has an impedance of 50. TC63 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power.

The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the TC63 PCB and should be placed in the host application.

Regarding the return loss TC63 provides the following values in the active band:

Table 11: Return loss in the active band

State of module Return loss of module Recommended return loss of application

Receive > 8dB > 12dB

Transmit not applicable > 12dB

The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection.

4.1 Antenna Installation

To suit the physical design of individual applications TC63 offers two alternative approaches to connecting the antenna:

• Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on

the component side of the PCB (top view on TC63). See Section 4.3 for details.

• Antenna pad and grounding plane placed on the bottom side. See Section 4.2.

The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve TC63. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the Siemens type approval you are advised to give priority to the connector, rather than using the antenna pad.

IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty.

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Antenna connected to Hirose connector:

Module

Antenna or measurement

PAD

50Ohm

U.FL

equipment

50Ohm

Antenna connected to pad:

Module

PAD

50Ohm

U.FL

50Ohm

Figure 27: Never use antenna connector and antenna pad at the same time

ntenna

No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 0.8mm in height.

U.FL antenna connector

RF section

PCB

ntenna pad

Restricted area

Figure 28: Restricted area around antenna pad

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4.2 Antenna Pad

The antenna can be soldered to the pad, or attached via contact springs. For proper grounding connect the antenna to the ground plane on the bottom of TC63 which must be connected to the ground plane of the application.

When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens TC63 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design.

Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50 connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter.

Notes on soldering:

• To prevent damage to the module and to obtain long-term solder joint properties you are

advised to maintain the standards of good engineering practice for soldering.

• Be sure to solder the antenna core to the pad and the shielding of the coax cable to the

ground plane of the module next to the antenna pad. The direction of the cable is not relevant from the electrical point of view.

TC63 material properties: TC63 PCB: FR4 Antenna pad: Gold plated pad

4.2.1 Suitable Cable Types

For direct solder attachment, we suggest to use the following cable types:

• RG316/U 50Ohm coaxial cable

• 1671A 50Ohm coaxial cable

Suitable cables are offered, for example, by IMS Connector Systems. For further details and other cable types please contact http://www.imscs.com

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4.3 Antenna Connector

TC63 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is:

U.FL-R-SMT

The position of the antenna connector on the TC63 board can be seen in Figure 35.

Figure 29: Mechanical dimensions of U.FL-R-SMT connector

Table 12: Product specifications of U.FL-R-SMT connector

Item Specification Conditions

Ratings

Nominal impedance

Rated frequency DC to 3GHz

Mechanical characteristics

Female contact holding force

Repetitive operation Contact resistance:

Vibration No momentary disconnections of

Shock No momentary disconnections of

Environmental characteristics

Humidity resistance No damage, cracks and looseness

50Ω

0.15N min

Center 25mΩ Outside 15mΩ

1µs; No damage, cracks and looseness of parts

1µs. No damage, cracks and looseness of parts.

of parts. Insulation resistance: 100MΩ min. at high humidity 500MΩ min. when dry

Operating temp:-40°C to + 90°C Operating humidity: max. 90%

Measured with a ∅ 0.475 pin gauge

30 cycles of insertion and disengagement

Frequency of 10 to 100Hz, single amplitude of 1.5mm, acceleration of 59m/s direction of each of the 3 axes

Acceleration of 735m/s2, 11ms duration for 6 cycles in the direction of each of the 3 axes

Exposure to 40°C, humidity of 95% for a total of 96 hours

, for 5 cycles in the

Temperature cycle No damage, cracks and looseness

of parts. Contact resistance: Center 25mΩ Outside 15mΩ

Salt spray test No excessive corrosion 48 hours continuous exposure to

Temperature: +40°C → 5 to 35°C → +90°C → 5 to 35°C Time: 30min → within 5min → 30min within 5min

5% salt water

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Table 13: Material and finish of U.FL-R-SMT connector and recommended plugs

Part Material Finish

Shell Phosphor bronze Silver plating

Male center contact Brass Gold plating

Female center contact Phosphor bronze Gold plating

Insulator Plug: PBT

Receptacle: LCP

Black Beige

Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 14. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com

Figure 30: U.FL-R-SMT connector with U.FL-LP-040 plug

Figure 31: U.FL-R-SMT connector with U.FL-LP-066 plug

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In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to ∅ 0.81mm) and minimizes the mating height to 2mm. See Figure 32 which shows the Hirose datasheet.

Figure 32: Specifications of U.FL-LP-(V)-040(01) plug

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Table 14: Ordering information for Hirose U.FL Series

Item Part number HRS number

Connector on TC63 U.FL-R-SMT CL331-0471-0-10

Right-angle plug shell for ∅ 0.81mm cable

Right-angle plug for ∅ 0.81mm cable

Right-angle plug for ∅ 1.13mm cable

Right-angle plug for ∅ 1.32mm cable

Extraction jig E.FL-LP-N CL331-04441-9

U.FL-LP-040 CL331-0451-2

U.FL-LP(V)-040 (01) CL331-053-8-01

U.FL-LP-068 CL331-0452-5

U.FL-LP-066 CL331-0452-5

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5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

The absolute maximum ratings stated in Table 15 are stress ratings under non-operating conditions. Stresses beyond any of these limits will cause permanent damage to TC63.

Table 15: Absolute maximum ratings under non-operating conditions

Parameter Min Max Unit

Supply voltage BATT+ -0.3 5.5 V

Voltage at digital pins -0.3 3.05 V

Voltage at analog pins -0.3 3.0 V

Voltage at VCHARGE pin -0.3 5.5 V

Voltage at CHARGEGATE pin -0.3 5.5 V

VUSB_IN -0.3 5.5

VSENSE 5.5

ISENSE 5.5

5.2 Operating Temperatures

Test conditions were specified in accordance with IEC 60068-2 (still air). The values stated below are in compliance with GSM recommendation TS 51.010-01.

Table 16: Operating temperatures

Parameter Min Typ Max Unit

Ambient temperature (according to GSM 11.10) -30 +25 +65*) °C

Automatic shutdown TC63 board temperature Battery temperature

Ambient temperature for charging (software controlled fast charging)

-30

-20

0 --- +45 °C

---

+90 +60

°C

Due to temperature measurement uncertainty, a tolerance on these switching off thresholds may occur. The possible deviation is in a range of:

• ± 3°C at the overtemperature limit

• ± 5°C at the undertemperature limit

On TC63 the automatic overtemperature shutdown threshold is set to 90°C board temperature. This prevents permanent damage to components on the board. Consider the ratio of output power, supply voltage and operating temperature: to achieve T

amb max

= 65°C in GPRS Class 8 (GSM900/ GSM850) with 2W RF power the supply voltage must not be higher than 4.2V.

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5.3 Pin Assignment and Signal Description

The Molex board-to-board connector on TC63 is an 80-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 1 which shows the top view of TC63.

1 GND GND 80

4 GND

11 I2CCLK I2CDAT 70

12 VUSB_IN USB_DP 69

13 DAI5 USB_DN 68

14 ISENSE VSENSE 67

15 DAI6 VMIC 66

16 CCCLK EPN2 65

17 CCVCC EPP2 64

18 CCIO EPP1 63

19 CCRST EPN1 62

20 CCIN MICN2 61

21 CCGND MICP2 60

22 DAI4 MICP1 59

23 DAI3 MICN1 58

24 DAI2 AGND 57

25 DAI1 IGT 56

26 DAI0 EMERG_RST 55

27 BATT_TEMP DCD0 54

28 SYNC CTS1 53

29 RXD1 CTS0 52

30 RXD0 RTS1 51

31 TXD1 DTR0 50

32 TXD0 RTS0 49

33 VDDLP DSR0 48

34 VCHARGE RING0 47

35 CHARGEGATE VEXT 46

36 GND BATT+ 45

37 GND BATT+ 44

38 GND BATT+ 43

39 GND BATT+ 42

40 GND BATT+ 41

nc Do not use

Do not use Do not use

Do not use Do not use Do not use nc

nc nc

PWR_IND 78

Do not use

Figure 33: Pin assignment (component side of TC63)

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Please note that the reference voltages listed in Table 17 are the values measured directly on the TC63 module. They do not apply to the accessories connected.

Table 17: Signal description

Function Signal name IO Signal form and level Comment

Power supply

Charge Interface

External supply voltage

BATT+ I

GND Ground Application Ground

VCHARGE I

BATT_TEMP I

ISENSE I

VSENSE I

CHARGEGATE O

VEXT O

VImax = 4.5V

typ = 3.8V

min = 3.2V during Tx burst on board

I  2A, during Tx burst

n Tx = n x 577µs peak current every

4.616ms

min = 1.015 * V

max = 5.45V

Connect NTC with R

BATT+

 10kΩ @ 25°C to

NTC

ground. See Section 3.5.3 for B value of NTC.

max = 4.65V

∆VImax to V

= +0.3V at normal

BATT+

condition

max = 4.5V

VOmax = 5.5V I

max = 1mA

Normal mode:

min = 2.75V

typ = 2.93V

max = 3.05V

max = -50mA

Five pins of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur.

Minimum voltage must not fall below 3.2V including drop, ripple, spikes.

This line signalizes to the processor that the charger is connected.

If unused keep pin open.

Battery temperature measurement via NTC resistance.

NTC should be installed inside or near battery pack to enable proper charging and deliver temperature values.

If unused keep pin open.

ISENSE is required for measuring the charge current. For this purpose, a shunt resistor for current measurement needs to be connected between ISENSE and VSENSE.

If unused connect pin to VSENSE.

VSENSE must be directly connected to BATT+ at battery connector or external power supply.

Control line to the gate of charge FET

If unused keep pin open.

VEXT may be used for application circuits, for example to supply power for an I2C interface

If unused keep pin open. Not available in Power-down

mode. The external digital logic must not cause any spikes or glitches on voltage VEXT.

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Function Signal name IO Signal form and level Comment

Power indicator

Ignition IGT I

Emergency reset

PWR_IND O VIHmax = 10V

max = 0.4V at Imax = 2mA

 30kΩ, CI  10nF

max = 0.8V at Imax = -150µA

max = 4.5V (V

~~~

EMERG_RST I

 5kΩ

max = 0.2V at Imax = -0.5mA

min = 1.75V

max = 3.05V

Signal

Synchronization

SYNC O

VOLmax = 0.3V at I = 0.1mA

min = 2.3V at I = -0.1mA

max = 0.05V

n Tx = n x 577µs impulse each 4.616ms, with ___µs forward time.

RTC backup VDDLP I/O RI  1k

max = 4.5V

= 4.3V:

BATT+

= 3.2V at IO = -500µA

= 0V:

BATT+

= 2.7V…4.5V at I

|____|

~~~

|______|

)

BATT+

~~~

Active Low ≥ 400ms

~~~

Pull down ≥ 10ms

= 15µA

max

PWR_IND (Power Indicator) notifies the module’s on/off state.

PWR_IND is an open collector that needs to be connected to an external pullup resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Powerdown mode.

Therefore, the pin may be used to enable external voltage regulators which supply an external logic for communication with the module, e.g. level converters.

This signal switches the mobile on.

This line must be driven low by an open drain or open collector driver.

Reset or turn-off in case of emergency: Pull down and release EMERG_RST. Then, activating IGT for 400ms will reset TC63. If IGT is not activated for 400ms, TC63 switches off.

Data stored in the volatile memory will be lost. For orderly software controlled reset rather use the AT+CFUN command (e.g. AT+CFUN=,1).

This line must be driven by open drain or open collector.

If unused keep pin open.

There are two alternative options for using the SYNC pin:

a) Indicating increased current consumption during uplink transmission burst. Note that the timing of the signal is different during handover.

b) Driving a status LED to indicate different operating modes of TC63. The LED must be installed in the host application.

If unused keep pin open.

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Function Signal name IO Signal form and level Comment

SIM interface specified for use with 3V SIM card

SIM interface specified for use with

1.8V SIM card

ASC0

Serial interface

CCIN I

CCRST O

CCIO I/O

 100kΩ

max = 0.6V at I = -25µA

min = 2.1V at I = -10µA

max= 3.05V

 47Ω

max = 0.25V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

 4.7kΩ

max = 0.75V

min = -0.3V

min = 2.1V

max = CCVCCmin + 0.3V = 3.05V

RO  100Ω V

max = 0.3V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

CCCLK O

 100Ω

max = 0.3V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

CCVCC O VOmin = 2.75V

typ = 2.85V

max = 2.95V

max = -20mA

CCGND Ground

CCIN I

CCRST O

CCIO I/O

CCCLK O

 100kΩ

max = 0.6V at I = -25µA

min = 2.1V at I = -10µA

max= 3.05V

 47Ω

max = 0.25V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

 4.7kΩ

max = 0.45V

min = 1.35V

max = CCVCCmin + 0.3V = 2.00V

 100Ω

max = 0.3V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

 100Ω

max = 0.3V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

CCVCC O VOmin = 1.70V,

typ = 1.80V

max = 1.90V

max = -20mA

CCGND Ground

RXD0

TXD0

CTS0

RTS0

DTR0

DCD0

DSR0

RING0

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

max = 0.8V

min = 2.0V

max = VEXTmin + 0.3V = 3.05V

CCIN = Low, SIM card holder closed

Maximum cable length or copper track 100mm to SIM card holder.

All signals of SIM interface are protected against ESD with a special diode array.

Usage of CCGND is mandatory.

CCIN = Low, SIM card holder closed

Maximum cable length or copper track 100mm to SIM card holder.

All signals of SIM interface are protected against ESD with a special diode array.

Usage of CCGND is mandatory.

Serial interface for AT commands or data stream.

If lines are unused keep pins open.

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Function Signal name IO Signal form and level Comment

ASC1

Serial interface

RXD1

TXD1

CTS1

RTS1

VILmax = 0.8V V

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA max = 3.05V

min = 2.0V

max = VEXTmin + 0.3V = 3.05V

Serial interface for AT commands or data stream.

If lines are unused keep pins open.

I2C interface

USB

Digital Audio interface

I2CCLK O VOLmax = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

I2CDAT I/O V

max = 0.2V at I = 2mA

max = 0.8V

min = 2.0V

VIHmax = VEXTmin + 0.3V = 3.05V

VUSB_IN I VINmin = 4.0V

max = 5.25V

USB_DN I/O

USB_DP I/O

DAI0

DAI1

DAI2

DAI3

DAI4 DAI5 I

DAI6 I

Differential Output Crossover voltage Range V

min = 1.5V, V

CRS

max = 2.0V

CRS

Driver Output Resistance Z

typ = 32Ohm

DRV

VOLmax = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

VILmax = 0.8V V

min = 2.0V

max = VEXTmin + 0.3V = 3.05V

I2CDAT is configured as Open Drain and needs a pullup resistor in the host application.

According to the I2C Bus Specification Version 2.1 for the fast mode a rise time of max. 300ns is permitted. There is also a maximum V

=0.4V at 3mA specified.

The value of the pull-up depends on the capacitive load of the whole system (I2C Slave + lines). The maximum sink current of I2CDAT and I2CCLK is 4mA.

If lines are unused keep pins open.

See Table 10 for details.

If unused keep pins open.

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Function Signal name IO Signal form and level Comment

Analog Audio interface

VMIC O VOmin = 2.4V

typ = 2.5V

max = 2.6V

= 2mA

max

EPP2 O

EPN2 O

EPP1 O

EPN1 O

MICP1 I

MICN1 I

MICP2 I

MICN2 I

AGND Analog Ground GND level for external audio

1.0954Vpp (differential) typical

3.4Vpp differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single ended load 27Ohms

1.0954Vpp (differential) typical

6.0Vp-p differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single ended load 7.5Ohms

Full Scale Input Voltage 1.578Vpp

0dBm0 Input Voltage 1.0954Vpp

At MICNx, apply external bias from 1.0V to

1.6V.

Audio mode TBD

Measurement conditions TBD

Microphone supply for customer feeding circuits

The audio output can directly operate a 32-Ohmloudspeaker.

If unused keep pins open.

The audio output can directly operate an 8-Ohmloudspeaker.

If unused keep pins open.

Balanced or single ended microphone or line inputs with external feeding circuit (using VMIC and AGND).

If unused keep pins open.

circuits

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5.4 Power Supply Ratings

Table 18: Power supply ratings

Parameter Description Conditions Min Typ Max Unit

BATT+

RTC Backup @ BATT+ = 0V 25 µA OFF State

VDDLP

BATT+

Measured after module INIT (switch ON the module and following switch OFF);

applied voltage on BATT+ (w/o INIT) show increased POWER DOWN supply current.

Additional conditions:

SLEEP mode measurements started 3 minutes after switch ON the module

Averaging times: SLEEP mode - 3 minutes; IDLE mode - 1.5 minutes Communication tester settings: no neighbor cells, no cell reselection etc. USB interface disabled

Supply voltage Directly measured at reference points

Voltage drop during transmit burst

Voltage ripple Normal condition, power control level

supply current

Average standby supply current2)

BATT+ and GND, see chapter 3.2.2

Voltage must stay within the min/max values, including voltage drop, ripple, spikes.

Normal condition, power control level for P

for P

@ f<200kHz

@ f>200kHz

POWER DOWN mode

SLEEP mode @ DRX = 9 TBD mA

SLEEP mode @ DRX = 5 TBD mA

SLEEP mode @ DRX = 2 TBD mA

IDLE mode @ DRX = 2 TBD mA

out max

50 100 µA

3.2 3.8 4.5 V

400 mV

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Table 19: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz

Mode GSM call GPRS Class 8 GPRS Class10 GPRS Class 12

Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx

Maximum possible power (RF power nominal)

Radio output power reduction with AT^SCFG, parameter <ropr>

Current characteristics

2W (33dBm)

<ropr> = 1 ... 3

2W (33dBm)

<ropr> = 1 ... 3

2W (33dBm)

<ropr> = 1

1W (30dBm)

<ropr> = 2 or 3

1W (30dBm)

<ropr> = 1

0.5W (27dBm)

<ropr> = 2 or 3

Burst current @ 50 antenna (typ.)

Burst current @ total mismatch

Average current @ 50 antenna (typ.)

Average current @ total mismatch

AT parameters are given in brackets <...> and marked italic.

2.0A 2.0A 2.0A 1.5A 1.5A 1.3A

3.2A 3.2A 3.2A 2.3A 2.3A 1.9A

335mA 385mA 610mA 485mA 810mA 710mA

485mA 535mA 910mA 685mA 1210mA 1010mA

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Table 20: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz

Mode GSM call GPRS Class 8 GPRS Class10 GPRS Class 12

Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx

Maximum possible power (RF power nominal)

Radio output power reduction with AT^SCFG, parameter <ropr>

Current characteristics

1W (30dBm)

<ropr> = 1 ... 3

1W (30dBm)

<ropr> = 1 ... 3

1W (30dBm)

<ropr> = 1

0.5W (27dBm)

<ropr> = 2 or 3

0.5W (27dBm)

<ropr> = 1

0.25W (24dBm)

<ropr> = 2 or 3

Burst current @ 50 antenna (typ.)

Burst current @ total mismatch

Average current @ 50 antenna (typ.)

Average current @ total mismatch

AT parameters are given in brackets <...> and marked italic.

1.6A 1.6A 1.6A 1.4A 1.4A 1.2A

2.1A 2.1A 2.1A 1.75A 1.75A 1.5A

285mA 335mA 510mA 460mA 760mA 660mA

350mA 400mA 635mA 550mA 940mA 810mA

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5.5 Electrostatic Discharge

The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TC63 module.

Special ESD protection provided on TC63:

Antenna interface: one spark discharge line (spark gap) SIM interface: clamp diodes for protection against overvoltage. The remaining ports of TC63 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the “Human Body Model” requirements.

TC63 has been tested according to the EN 61000-4-2 standard. The measured values can be gathered from the following table.

Table 21: Measured electrostatic values

Specification / Requirements Contact discharge Air discharge ETSI EN 301 489-7

ESD at SIM port

ESD at antenna port

Human Body Model (Test conditions: 1.5kΩ, 100pF)

ESD at USB interface

ESD at all other interfaces

± 4kV ± 8kV

± 1kV ± 1kV

Note: Please note that the values may vary with the individual application design. For

example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Siemens reference application described in Chapter 8.

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5.6 Reliability Characteristics

The test conditions stated below are an extract of the complete test specifications.

Table 22: Summary of reliability test conditions

Type of test Conditions Standard

Vibration Frequency range: 10-20Hz; acceleration: 3.1mm

amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes

Shock half-sinus Acceleration: 500g

Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z)

Dry heat Temperature: +70 ±2°C

Test duration: 16h Humidity in the test chamber: < 50%

Temperature change (shock)

Damp heat cyclic High temperature: +55°C ±2°C

Cold (constant exposure)

Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100

Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h

Temperature: -40 ±2°C Test duration: 16h

DIN IEC 68-2-6

DIN IEC 68-2-27

EN 60068-2-2 Bb ETS 300019-2-7

DIN IEC 68-2-14 Na

ETS 300019-2-7

DIN IEC 68-2-30 Db

ETS 300019-2-5

DIN IEC 68-2-1

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6 Mechanics

6.1 Mechanical Dimensions of TC63

Figure 34 shows the top view of TC63 and provides an overview of the board's mechanical dimensions. For further details see Figure 35.

Pin 1

Pin 80

Figure 34: TC63 – top view

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All dimensions in mm

Figure 35: Dimensions of TC63

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6.2 Mounting TC63 to the Application Platform

There are many ways to properly install TC63 in the host device. An efficient approach is to mount the TC63 PCB to a frame, plate, rack or chassis.

Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to achieve better support. To help you find appropriate spacers a list of selected screws and distance sleeves for 3mm stacking height can be found in Section 9.2.

When using the two small holes take care that the screws are inserted with the screw head on the bottom of the TC63 PCB. Screws for the large holes can be inserted from top or bottom.

For proper grounding it is strongly recommended to use large ground plane on the bottom of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.

To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device.

All the information you need to install an antenna is summarized in Chapter 4. Note that the antenna pad on the bottom of the TC63 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Section 4.1.

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6.3 Board-to-Board Application Connector

This section provides the specifications of the 80-pin board-to-board connector used to connect TC63 to the external application.

Connector mounted on the TC63 module: Type: 52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm, see Figure 36 for details. Supplier: Molex www.molex.com

Table 23: Technical specifications of Molex board-to-board connector

Parameter Specification (80-pin B2B connector)

Electrical

Number of Contacts 80

Contact spacing 0.5mm (.020")

Voltage 50V

Rated current 0.5A max per contact

Contact resistance 50m max per contact

Insulation resistance > 100M

Dielectric Withstanding Voltage 500V AC (for 1 minute)

Physical

Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0

Contact material Plating: Gold over nickel

Insertion force 1st < 74.4N

Insertion force 30th < 65.6N

Withdrawal force 1st > 10.8N

Maximum connection cycles 30 (@ 70m max per contact)

Mating connector types for the customer's application offered by Molex:

• 53748-0808 SlimStack Plug, 3mm stacking height,

see Figure 37 for details.

• 53916-0808 SlimStack Plug, 4mm stacking height

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Figure 36: Molex board-to-board connector 52991-0808 on TC63

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Figure 37: Mating board-to-board connector 53748-0808 on application

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7 Sample Application

Figure 38 shows a typical example of how to integrate a TC63 module into the GSM part of a mobile application. Usage of the various host interfaces depends on the desired features of the application.

Audio interface 1 demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers. Audio interface 2 uses an unbalanced microphone and earpiece connection typically found in headset applications.

The charging circuit is optimized for the charging stages (trickle charging and software controlled charging) as well as the battery and charger specifications described in Section

3.5.

The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the TC63 module is active, high level notifies the Power-down mode.

If the module is in Power-down mode avoid current flowing from any other source into the module circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow.

The internal pull-up resistors (Rp) of the I supply or to the VEXT line of TC63. The advantage of this solution is that when the module enters the Power-down mode, the I

an I

C interface to an external power supply, take care that the interface is shut down when

the PWR_IND signal goes high in Power-down mode.

The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. However, when connecting cables to the module’s interfaces it is strongly recommended to add appropriate ferrite beads for reducing RF radiation.

Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 38 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using TC63 modules.

C interface can be connected to an external power

C interface is shut down as well. If you prefer to connect

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TC63 Application

(Draft)

BC847

27pF

47k

VCC µC

SIM

All SIM c omponents shall be close to card holder.

100k

Serial Interface

ASC0

Serial Interface

ASC1

I2C

USB

(Slave)

200nF

2 x R

1nF

Rechargeable

IGT

VCHARGE

EMERG_RST

PWR_IND

TC63

VEXT (2.9V)

SYNC

CCIN CCVCC CCRST CCIO CCCLK CCGND

0R (not mounted)

BATT+

BAT TEMP

VSENSE

ISENSE

CHARGEGATE

VMIC (2. 5V)

MICP1

MICN1

MICP2

MICN2

EPN1 EPP1

EPP2 EPN2

GND

AGND

Lithium battery

NTC

470R

100nF

100µF

Figure 38: TC63 sample application (draft)

100nF

>8R

>32R

0.3R

SI3441DV

2.2k2. 2k

5.6k

ESD

protection

CRS04

2.7k

22µF

depends on final specification

V 5.2V 0.2V

ch ar ge

Digital Audio

Charger

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8 Reference Approval

8.1 Reference Equipment for Type Approval

The Siemens reference setup submitted to type approve TC63 consists of the following components:

• Siemens TC63 cellular engine

• Development Support Box DSB75

• SIM card reader integrated on DSB75

• U.FL-R-SMT antenna connector and U.FL-LP antenna cable

• Handset type Votronic HH-SI-30.3/V1.1/0

• Li-Ion battery

• PC as MMI

Antenna or 50 Ω cable to system simulator

Antenna

GSM module

Flex cable

100mm

SIM

Handset

Power supply

RS-232

Figure 39: Reference equipment for Type Approval

Li-Ion

battery

DSB75

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8.2 Compliance with FCC Rules and Regulations

The FCC Equipment Authorization Certification for the TC63 reference application described in Section 8.1 is listed under the FCC identifier QIPTC63

IC: 267W-TC63 granted to Siemens AG.

The TC63 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). Power listed is ERP for Part 22 and EIRP for Part 24 “This device contains GSM and GPRS Class12 functions in the 900 and 1800MHz

Band which are not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used

for this transmitter must be installed to provide a separation distance of at least 20cm

from all persons and must not be co-located or operating in conjunction with any other

antenna or transmitter. Users and installers must be provided with antenna installation

instructions and transmitter operating conditions for satisfying RF exposure com-

pliance. Antennas used for this OEM module must not exceed 8.4dBi gain (GSM 1900)

and 2.9dBi (GSM 850) for mobile and fixed operating configurations. This device is

approved as a module to be installed in other devices.”

The FCC label of the module must be visible from the outside. If not, the host device is required to bear a second label stating, “Contains FCC ID QIPTC63”.

IMPORTANT: Manufacturers of mobile or fixed devices incorporating TC63 modules are advised to

• clarify any regulatory questions,

• have their completed product tested,

• have product approved for FCC compliance, and

• include instructions according to above mentioned RF exposure statements in end

product user manual.

Please note that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

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9 Appendix

9.1 List of Parts and Accessories

Table 24: List of parts and accessories

Description Supplier Ordering information

TC63 Siemens Siemens ordering number: L36880-N8160-A100

Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117

DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100

Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0

VOTRONIC Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 e-mail: contact@votronic.com

SIM card holder incl. push button ejector and slide-in tray

Board-to-board connector Molex Sales contacts are listed in Table 25.

U.FL-R-SMT antenna connector

Molex Ordering numbers: 91228

91236 Sales contacts are listed in Table 25.

Hirose See Section 4.3 for details on U.FL-R-SMT

connector, mating plugs and cables. Sales contacts are listed in Table 26.

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Table 25: Molex sales contacts (subject to change)

Molex For further information please click:

http://www.molex.com/

Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730

Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com

Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044

Table 26: Hirose sales contacts (subject to change)

American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352

Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366

Hirose Ltd. For further information please click:

http://www.hirose.com

Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401

Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217

Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933

Hirose Electric GmbH Zeppelinstrasse 42 73760 Ostfildern Kemnat 4 Germany Phone: +49-711-4560-021 Fax +49-711-4560-729 E-mail info@hirose.de

Hirose Electric Co., Ltd. European Branche First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469

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9.2 Fasteners and Fixings for Electronic Equipment

This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document.

9.2.1 Fasteners from German Supplier ETTINGER GmbH

Sales contact: ETTINGER GmbH http://www.ettinger.de/main.cfm Phone: +4981 04 66 23 – 0 Fax: +4981 04 66 23 – 0

The following tables contain only article numbers and basic parameters of the listed components. For further detail and ordering information please contact Ettinger GmbH.

Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below.

Article number: 05.71.038

Length 3.0mm

Material AlMgSi-0,5

For internal diameter M2=2.0-2.3

Internal diameter d = 2.4mm

External diameter 4.0mm

Vogt AG No. x40030080.10

Spacer - Aluminum / Wall thickness = 0.8mm

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Article number: 07.51.403

Insulating Spacer for M2 Self-gripping

Length 3.0mm

Material Polyamide 6.6

Surface Black

Internal diameter 2.2mm

External diameter 4.0mm

Flammability rating UL94-HB

2 spacers are delivered with DSB75 Support Board

Article number: 05.11.209

Threaded Stud M2.5 - M2 Type E / External thread at both ends

Length 3.0mm

Material Stainless steel X12CrMoS17

Thread 1 / Length M2.5 / 6.0mm

Thread 2 / Length M2 / 8.0mm

Width across flats 5

Recess yes

Type External / External

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Article number: 01.14.131

Screw M2

DIN 84 - ISO 1207

Length 8.0mm

Material Steel 4.8

Surface Zinced A2K

Thread M2

Head diameter D = 3.8mm

Head height 1.30mm

Type Slotted cheese head screw

2 screws are delivered with DSB75 Support Board

Article number: 01.14.141

Screw M2 DIN 84 - ISO 1207

Length 10.0mm

Material Steel 4.8

Surface Zinced A2K

Thread M2

Head diameter D = 3.8mm

Head height 1.30mm

Type Slotted cheese head screw

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Article number: 02.10.011

Material Steel 4.8

Surface Zinced A2K

Thread M2

Wrench size / Ø 4

Thickness / L 1.6mm

Type Nut DIN/UNC, DIN934

Hexagon Nut DIN 934 - ISO 4032

2 nuts are delivered with DSB75 Support Board

9.3 Data Sheets of Recommended Batteries

The following two data sheets have been provided by VARTA Microbattery GmbH.

Click here for sales contacts and further information: http://www.varta-microbattery.com

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Figure 40: Lithium

Ion battery from

VARTA

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Figure 41: Lithium

Polymer battery

from VARTA

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Gemalto M2M TC63 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1.2 Terms and Abbreviations

2.1 Key Features at a Glance

2.2 TC63 System Overview

3.2.1 Minimizing Power Losses

3.2.3 Monitoring Power Supply by AT Command

3.3 Power Up / Power Down Scenarios

3.3.1 Turn on TC63

3.3.1.1 Turn on TC63 Using Ignition Line IGT

3.3.1.2 Turn on TC63 Using the VCHARGE Signal

3.3.1.3 Reset TC63 via AT+CFUN Command

3.3.1.4 Reset or Turn off TC63 in Case of Emergency

3.3.2 Turn off TC63

3.3.2.1 Turn off TC63 Using AT Command

3.3.2.2 Leakage Current in Power Down Mode

3.3.3.1 Temperature Dependent Shutdown

3.3.3.2 Temperature Control during Emergency call

3.3.3.3 Undervoltage Shutdown if Battery NTC is Present

3.3.3.4 Undervoltage Shutdown if no Battery NTC is Present

3.4 Automatic GPRS Multislot Class Change

3.5.3 Battery Pack Requirements

3.5.4 Batteries Recommended for Use with TC63

3.5.6 Implemented Charging Technique

3.5.7 Operating Modes during Charging

3.6 Summary of State Transitions (Except SLEEP Mode)

3.9 Serial Interface ASC0

3.10 Serial Interface ASC1

3.11.1 Installing the USB Modem Driver

3.13.2.2 Differential Microphone Input

3.13.2.3 Line Input Configuration with OpAmp

3.13.4 Digital Audio Interface DAI

3.14.2 Using the SYNC Pin to Control a Status LED

4.2.1 Suitable Cable Types

4.3 Antenna Connector

5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

5.3 Pin Assignment and Signal Description

5.4 Power Supply Ratings

6.1 Mechanical Dimensions of TC63

6.2 Mounting TC63 to the Application Platform

6.3 Board-to-Board Application Connector

8.1 Reference Equipment for Type Approval

8.2 Compliance with FCC Rules and Regulations

9.1 List of Parts and Accessories

9.2 Fasteners and Fixings for Electronic Equipment

9.2.1 Fasteners from German Supplier ETTINGER GmbH

9.3 Data Sheets of Recommended Batteries