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PLAS9 X
User Manual
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Gemalto M2M PLAS9 X User Manual

Cinterion® PLAS9-X
Hardware Interface Overview Version: 00.044
DocId: PLAS9-X_HIO_v00.044
M2M.GEMALTO.COM
Cinterion® PLAS9-X Hardware Interface Overview
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Page 2 of 39
Document Name: Version:
Date: DocId: Status
Cinterion
®
PLAS9-X Hardware Interface Overview
00.044 2017-09-19 PLAS9-X_HIO_v00.044 Confidential / Preliminary
GENERAL NOTE
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con­tents and communication thereof to others without ex press autho rization are prohib ited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.
Copyright © 2017, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Win dows are e ither regis tered trademarks or trademarks of Microsoft Corpora­tion in the United States and/or other countries. All other register ed trademarks or trademarks mention ed in this document are property of their respective owners.
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Cinterion® PLAS9-X Hardware Interface Overview

Contents

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Contents
1 Introduction.................................................................................................................6
1.1 Key Features at a Glance..................................................................................6
1.2 PLAS9-X System Overview...............................................................................9
2 Interface Characteristics.......................................................................................... 10
2.1 Application Interface ........................................................................................10
2.1.1 USB Interface......................................................................................10
2.1.2 UICC/SIM/USIM Interface...................................................................11
2.1.3 Analog-to-Digital Converter (ADC)......................................................13
2.1.4 GPIO Interface....................................................................................13
2.1.5 Control Signals....................................................................................14
2.1.5.1 PWR_IND Signal.................................................................14
2.1.5.2 Behavior of the RING0 Line................................................14
2.1.5.3 Remote Wakeup..................................................................14
2.1.5.4 Low Current Indicator..........................................................14
2.2 GSM/UMTS/LTE Antenna Interface.................................................................15
2.2.1 Antenna Installation ............................................................................16
2.2.2 RF Line Routing Design......................................................................17
2.2.2.1 Line Arrangement Instructions ............................................17
2.2.2.2 Routing Examples...............................................................19
2.3 Sample Application..........................................................................................21
3 Operating Characteristics........................................................................................23
3.1 Operating Modes .............................................................................................23
3.2 Power Supply...................................................................................................24
4 Mechanical Dimensions ...........................................................................................25
4.1 Mechanical Dimensions of PLAS9-X...............................................................25
5 Regulatory and Type Approval Information........................................................... 27
5.1 Directives and Standards.................................................................................27
5.2 SAR requirements specific to portable mobiles............................................... 29
5.3 Reference Equipment for Type Approval.........................................................30
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 31
6 Document Information..............................................................................................33
6.1 Revision History...............................................................................................33
6.2 Related Documents .........................................................................................33
6.3 Terms and Abbreviations.................................................................................33
6.4 Safety Precaution Notes..................................................................................36
7 Appendix....................................................................................................................37
7.1 List of Parts and Accessories...........................................................................37
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Cinterion® PLAS9-X Hardware Interface Overview

Tables

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Tables
Table 1: Signals of the SIM interface (SMT application interface)............................... 11
Table 2: Return loss in the active band........................................................................ 15
Table 3: Overview of operating modes ........................................................................ 23
Table 4: Directives ....................................................................................................... 27
Table 5: Standards of North American type approval.................................................. 27
Table 6: Requirements of quality ................................................................................. 27
Table 7: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 28
Table 8: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 28
Table 9: Antenna gain limits for FCC and IC (TBD.).................................................... 31
Table 10: List of parts and accessories.......................................................................... 37
Table 11: Molex sales contacts (subject to change)...................................................... 38
Table 12: Hirose sales contacts (subject to change)..................................................... 38
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Cinterion® PLAS9-X Hardware Interface Overview

Figures

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Figures
Figure 1: PLAS9-X system overview............................................................................... 9
Figure 2: USB circuit ..................................................................................................... 10
Figure 3: First UICC/SIM/USIM interface...................................................................... 12
Figure 4: Second UICC/SIM/USIM interface................................................................. 12
Figure 5: Embedded Stripline line arrangement............................................................ 17
Figure 6: Micro-Stripline line arrangement samples...................................................... 18
Figure 7: Routing to application‘s RF connector ........................................................... 19
Figure 8: Routing to PLAS9-X evaluation module‘s RF connector................................ 20
Figure 9: PLAS9-X sample application.......................................................................... 22
Figure 10: Decoupling capacitor(s) for BATT+................................................................ 24
Figure 11: PLAS9-X – top and bottom view.................................................................... 25
Figure 12: Dimensions of PLAS9-X (all dimensions in mm)............................................ 26
Figure 13: Reference equipment for type approval......................................................... 30
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Cinterion® PLAS9-X Hardware Interface Overview

1 Introduction

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1 Introduction
This document1 describes the hardware of the Cinterion® PLAS9-X module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re­quirements to be considered for integrating further components.

1.1 Key Features at a Glance

Feature Implementation
General Frequency bands GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
UMTS/HSPA+: Triple band, 850 (BdV), 1700 (BdIV), 1900 (BdII) LTE (FDD): Six band, 700 (Bd12 <MFBI Bd17>, Bd13, Bd29 <supple men­tary downlink>), 850 (Bd5), 1700 (Bd4), 1900 (Bd2)
GSM class Small MS Output power
(according to Release 99)
Output power (according to Release 8)
Power supply 3.3V < Operating temperature
(board temperature) Physical Dimensions: 40mm x 32mm x 2.8mm
Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
LTE (FDD): Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17> Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm +-2dB) for LTE 1700, LTE FDD Bd4 Class 3 (+23dBm +-2dB) for LTE1900, LTE FDD Bd2
V
Normal operation: -30°C to +85°C Extended operation: -40°C to +95°C
Weight: approx. 6.5g
BATT+
< 4.2V
RoHS All hardware components fully compliant with EU RoHS Directive
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu­mentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
9
Feature Implementation
LTE features 3GPP Release 10 Downlink carrier aggregation (CA) to increase bandwidth, and thereby
increase bitrate:
• Maximum aggregated bandwidth: 40MHz
• Maximum number of component carriers: 2
• Inter-band FDD, non-contiguous
• Intra-band FDD, contiguous, non-contiguous
• Supported inter-band CA configurations: CA_2A-5A (with bandwidth combination set 0),
CA_2A-12A (with bandwidth combination sets 0 and 1), CA_2A-29A (with bandwidth combina tio n se ts 0, 1 and 2), CA_4A-5A (with bandwidth combination sets 0 and 1), CA_4A-12A (with bandwidth combination sets 0, 1, 2, 3 and 4), CA_4A-29A (with bandwidth combina tio n se ts 0, 1 and 2)
• Supported intra-band CA configurations: CA_4A-4A (with bandwidth combination set 0)
CAT 6 supported DL 300Mbps, UL 50Mbps 2x2 MIMO in DL direction
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HSPA features 3GPP Release 9 UE CAT. 14, 24
DC-HSPA+ – DL 42Mbps HSUPA – UL 5.76Mbps
Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features 3GPP Release 9 PS data rate – 384 kbps DL / 384 kbps UL GSM / GPRS / EGPRS features Data transfer GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
SMS Point-to-point MT and MO, Cell broadcast,
Text and PDU mode
Software AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-
mands
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1.1 Key Features at a Glance
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Feature Implementation
Firmware update Generic update from host application over USB 2.0 High Speed device
interface
Interfaces Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and app lication
layout issues as well as on additional SMT application development equip-
ment. Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna USB USB 2.0 High Speed (480Mbit/s) device interface or
USB 3.0 Super Speed (5Gbit/s) device interface UICC interface 2 UICC interfaces (switchable)
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
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RING0 Signal line to indicate URCs.
Power on/off, Reset Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO) or IGT (option)
Automatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT command Emergency-off Emergency-off by hardware signal EMERG_OFF
Special Features Antenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx Diversity (receiver type 3i - 64-QAM) / MIMO GPIO 10 I/O pins of the application interface programmable as GPIO.
Programming is done via AT commands. ADC inputs Analog-to-Digital Converter with two unbalanced analog inputs for (exter-
nal) antenna diagnosis Evaluation kit Evaluation module PLAS9-X module soldered onto a dedicated PCB that can be connected
to the ALAS6A-DSB75 adapter in order to be mounted onto the DSB75. ALAS6A-DSB75 adapter A special adapter required to connect the PLAS9-X evaluation module to
the DSB75. DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering.
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Cinterion® PLAS9-X Hardware Interface Overview
GPIO ADC UICC
Power supply
IGT,
Emergency Off
SIM
card
Hos t application
On/Off
Module
Application
Power indication
(PWR_IND)
GSM/UMTS/LTE
Power for application
(VEXT)
USB
GSM/UMTS/LTE Ant enna d iv ersi ty
12
Antenna
diagnostic
Antenna
switch
2x
GPIO
2x
ADC
SIM card
RING0

1.2 PLAS9-X System Overview

9
1.2 PLAS9-X System Overview
Page 9 of 39
Figure 1: PLAS9-X system overview
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Cinterion® PLAS9-X Hardware Interface Overview
VREG (3V075)
BATT+
USB_DP
3)
lin. reg.
GND
Module
Detection only
VUSB_IN
2)
USB part
1)
1)
All serial (including RS) and pull-up resistors for da ta lines are implemented.
USB_DN
3)
3)
If the USB interface is op erated in High Speed mode (480MHz), it is recommen ded to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differen tial impedance of 90 ohms for proper signal integrity.
VBUS
1µF
2)
Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on the VUSB_IN line.
Host wakeup
RING0
USB_SSRX_N USB_SSRX_P
USB_SSTX_N USB_SSTX_P
USB_SS
_PHY
USB_HS
_PHY
USB 2.0
Controller
USB 3.0
Controller
2.0
2.0
3.0
100nF
100nF
SMT
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2 Interface Characteristics

22
2 Interface Characteristics
PLAS9-X is equipped with an SMT application interface that connects to the external applica­tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface.

2.1 Application Interface

2.1.1 USB Interface

PLAS9-X supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.0 device interface that is High Speed and Full Speed compatible. The USB interface is primarily intended for use as command and data interface, and for downloading firmware
The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLAS9-X is designed as a self-powered device compliant with the “Universal Serial Bus Spec-
2
ification Revision 3.0”
.
1
.
To properly connect the module's USB interface to the external application, a USB 3.0 or 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with PLAS9-X needs to be installed.
1. Note: For firmware download, the module enumerates new as a USB 2.0 device. Also, it is not possible
Figure 2: USB circuit
to use the USB 2.0 High Speed device mode and the USB 3.0 Super speed device mode simultaneously.
2. The specification is ready for download on http://www.usb.org/developers/docs/
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Cinterion® PLAS9-X Hardware Interface Overview
2.1 Application Interface
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2.1.2 UICC/SIM/USIM Interface

PLAS9-X has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102
221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM inter­faces.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLAS9-X and is part of the Gemalto M2M reference equipment submit­ted for type approval. See Chapter 7 for Molex ordering numbers.
Table 1: Signals of the SIM interface (SMT application interface)
Signal Description
GND Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g.,
pad P12, may be used to improve EMC.
CCCLK1 CCCLK2
CCVCC1 CCVCC2
CCIO1 CCIO2
CCRST1 CCRST2
CCIN1 CCIN2
Chipcard clock lines for 1
SIM supply voltage lines for 1
Serial data lines for 1
Chipcard reset lines for 1
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc­tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may inva lidate the type approval of PLAS9-X.
st
and 2nd SIM interface.
st
and 2nd SIM interface.
st
and 2nd SIM interface, input and output.
st
and 2nd SIM interface.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ­ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLAS9-X.
By default, only the 1
st
SIM interface is available and can be used. Using the AT command AT^SCFG=”SIM/CS” it is possible to switch between the two SIM interfaces. Command set­tings are non-volatile - for details see [1].
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Cinterion® PLAS9-X Hardware Interface Overview
Module
open: Card removed closed: Card inserted
CCRST1
CCVCC1
CCIO1
CCCLK1
CCIN1
SIM / UICC
1n
220n
SMT application interface
GND
Module
Open: Card removed Closed: Card inserted
CCRST2
CCVCC2
CCIO2
CCCLK2
CCIN2
SIM /
UICC
1nF
220nF
SMT application interface
GND
VEXT
100pF
22k
2k2
10k
2.1 Application Interface
22
Figure 3: First UICC/SIM/USIM interface
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The total cable length between the SMT application interface pads on PLAS9-X and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line.
Note: Figure 3 shows how to connect a SIM card holder to the first SIM interface . With the sec­ond SIM interface some internally integrated components on the SIM circuit will have to be ex­ternally integrated as shown for the second SIM interface in Figure 4. The external co mponents at CCIN2 should be populated as close as possible to the signal‘s SMT pad
Figure 4: Second UICC/SIM/USIM interface
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