Gemalto M2M MC75 Users Manual

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Function Signal name IO Signal form and level Comment

Analog
Audio
interface

VMIC O VOmin = 2.4V

typ = 2.5V

V

O

max = 2.6V

V

O

= 2mA

I

max

EPP2 O

EPN2 O

1.0954Vpp (differential) typical

3.4Vpp differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single
ended load 27 Ohms

EPP1 O

EPN1 O

1.0954Vpp (differential) typical

6.0 Vp-p differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single
ended load 7.5 Ohms

MICP1 I

MICN1 I

MICP2 I

MICN2 I

AGND Analog Ground GND level for external audio

Full Scale Input Voltage 1.578 Vpp

0dBm0 Input Voltage 1.0954 Vpp

At MICNx, apply external bias from 1.0V to

1.6V.

Audio mode TBD

Measurement conditions TBD

Microphone supply for
customer feeding circuits

The audio output can directly
operate a 32-Ohm­loudspeaker.

If unused keep pins open.

The audio output can directly
operate an 8-Ohm­loudspeaker.

If unused keep pins open.

Balanced or single ended
microphone or line inputs with
external feeding circuit (using
VMIC and AGND).

If unused keep pins open.

circuits

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5.4 Electrostatic Discharge

The GSM engine is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive
components. Proper ESD handling and packaging procedures must be applied throughout
the processing, handling and operation of any application that incorporates a MC75 module.

Special ESD protection provided on MC75:

Antenna interface: one spark discharge line (spark gap)
SIM interface: clamp diodes for protection against overvoltage.
The remaining ports of MC75 are not accessible to the user of the final product (since they
are installed within the device) and therefore, are only protected according to the “Human
Body Model” requirements.

MC75 has been tested according to the EN 61000-4-2 standard. The measured values can
be gathered from the following table.

Table 17: Measured electrostatic values

Specification / Requirements Contact discharge Air discharge

ETSI EN 301 489-7

ESD at SIM port

ESD at antenna port

Human Body Model (Test conditions: 1.5 kΩ, 100 pF)

ESD at USB interface

ESD at SD card interface

ESD at all other interfaces

± 4kV ± 8kV

± 4kV ± 8kV

± 1kV ± 1kV

± 1kV ± 1kV

± 1kV ± 1kV

Note: Please note that the values may vary with the individual application design. For

example, it matters whether or not the application platform is grounded over external
devices like a computer or other equipment, such as the Siemens reference
application described in Chapter 8.

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5.5 Reliability Characteristics

The test conditions stated below are an extract of the complete test specifications.

Table 18: Summary of reliability test conditions

Type of test Conditions Standard

Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm

amplitude
Frequency range: 20-500 Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes

Shock half-sinus Acceleration: 500g

Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)

Dry heat Temperature: +70 ±2°C

Test duration: 16 h
Humidity in the test chamber: < 50%

Temperature
change (shock)

Damp heat cyclic High temperature: +55°C ±2°C

Cold (constant
exposure)

Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1 h
Number of repetitions: 100

Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h

Temperature: -40 ±2°C
Test duration: 16 h

DIN IEC 68-2-6

DIN IEC 68-2-27

EN 60068-2-2 Bb ETS
300019-2-7

DIN IEC 68-2-14 Na

ETS 300019-2-7

DIN IEC 68-2-30 Db

ETS 300019-2-5

DIN IEC 68-2-1

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6 Mechanics

6.1 Mechanical Dimensions of MC75

Figure 35 shows the top view of MC75 and provides an overview of the board's mechanical
dimensions. For further details see Figure 36.

Pin 1

Pin 80

Figure 35: MC75 – top view

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All dimensions in mm

Figure 36: Dimensions of MC75

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6.2 Mounting MC75 to the Application Platform

There are many ways to properly install MC75 in the host device. An efficient approach is to
mount the MC75 PCB to a frame, plate, rack or chassis.

Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized
to achieve better support. To help you find appropriate spacers a list of selected screws and
distance sleeves for 3mm stacking height can be found in Section 9.2.

When using the two small holes take care that the screws are inserted with the screw head
on the bottom of the MC75 PCB. Screws for the large holes can be inserted from top or
bottom.

For proper grounding it is strongly recommended to use large ground plane on the bottom of
board in addition to the five GND pins of the board-to-board connector. The ground plane
may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.

To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it
is positioned flat against the host device.

All the information you need to install an antenna is summarized in Chapter 4. Note that the
antenna pad on the bottom of the MC75 PCB must not be influenced by any other PCBs,
components or by the housing of the host device. It needs to be surrounded by a restricted
space as described in Section 4.1.

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6.3 Board-to-Board Application Connector

This section provides the specifications of the 80-pin board-to-board connector used to
connect MC75 to the external application.

Connector mounted on the MC75 module:
Type: 52991-0808 SlimStack Receptacle
80 pins, 0.50mm pitch,
for stacking heights from 3.0 to 4.0mm,
see Figure 37 for details.
Supplier: Molex
www.molex.com

Table 19: Technical specifications of Molex board-to-board connector

Parameter Specification (80-pin B2B connector)

Electrical

Number of Contacts 80

Contact spacing 0.5mm (.020")

Voltage 50V

Rated current 0.5 A max per contact

Contact resistance 50mΩ max per contact

Insulation resistance > 100 MΩ

Dielectric Withstanding Voltage 500 V AC (for 1 minute)

Physical

Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0

Contact material Plating: Gold over nickel

Insertion force 1st < 74.4 N

Insertion force 30th < 65.6 N

Withdrawal force 1st > 10.8 N

Maximum connection cycles 30 (@ 70mΩ max per contact)

Mating connector types for the customer's application
offered by Molex:

• 53748-0808 SlimStack Plug, 3mm stacking height,
see Figure 38 for details.

• 53916-0808 SlimStack Plug, 4mm stacking height

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Figure 37: Molex board-to-board connector 52991-0808 on MC75

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Figure 38: Mating board-to-board connector 53748-0808 on application

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7 Sample Application

Figure 39 shows a typical example of how to integrate a MC75 module into the GSM part of
a mobile application. Usage of the various host interfaces depends on the desired features of
the application.

Audio interface 1 demonstrates the balanced connection of microphone and earpiece. This
solution is particularly well suited for internal transducers. Audio interface 2 uses an
unbalanced microphone and earpiece connection typically found in headset applications.

The charging circuit is optimized for the charging stages (trickle charging and software
controlled charging) as well as the battery and charger specifications described in Section

3.4.

The PWR_IND line is an open collector that needs an external pull-up resistor which
connects to the voltage supply of the microcontroller VCC µC. Low state of the open collector
pulls the PWR_IND signal low and indicates that the MC75 module is active, high level
notifies the Power-down mode.

If the module is in Power-down mode avoid current flowing from any other source into the
module circuit, for example reverse current from high state external control lines. Therefore,
the controlling application must be designed to prevent reverse or return flow. This is not
necessary for the USB interface.

The SD memory card interface can be powered from an external supply or via the VEXT line
of MC75. Figure 39 uses the VEXT line. The advantage of this solution is that when the
module enters the Power-down mode, the SD memory card interface is shut down as well. If
you prefer to connect an SD card to an external power supply, take care that the interface is
shut down when the PWR_IND signal goes high in Power-down mode. The same applies to

2

the I

C interface.

The EMC measures are best practice recommendations. In fact, an adequate EMC strategy
for an individual application is very much determined by the overall layout and, especially,
the position of components. For example, mounting the internal acoustic transducers directly
on the PCB eliminates the need to use the ferrite beads shown in the sample schematic.
However, when connecting cables to the module’s interfaces it is strongly recommended to
add appropriate ferrite beads for reducing RF radiation.

Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 39 and the information detailed in this section. As functionality and compliance with
national regulations depend to a great amount on the used electronic components and the
individual application layout manufacturers are required to ensure adequate design and
operating safeguards for their products using MC75 modules.

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MC75 Application

*)

(Draft)

*)

*)

BC847

BC847

8

4

2

P

8

3

27pF

47k

47k

VCC µC

SIM

All SIM components shall be close to card holder.

100k

Serial Interface

ASC0

Serial Interface

ASC1

*)

I2C

SD m emory
card

USB

(Slave)

200nF

2 x R

1nF

Rechargeable

IGT

VCHARGE

EMERG_RST

PWR_IND

BATT+

BATTEMP

VSENSE

ISENSE

CHARGEGATE

VMIC (2.5V)

MICP1

Lithium battery

NTC

470R

MC75

MICN1

VEXT (2.9V)

MICP2

MICN2

SYNC

CCIN
CCVCC
CCRST
CCIO
CCCLK
CCGND

0R (not mounted)

GND AGND

EPN1
EPP1

EPP2
EPN2

Figure 39: MC75 sample application (draft)

100nF

100µF

1k

1k

100nF

>8R

>32R

0.3R

SI3441DV

2.2k2.2k

5.6k

ESD

protection

CRS04

2.7k

7

22µF

*)

depends on final specification

V 5.2V 0.2V

ch ar ge

Digital Audio

Charger

+

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8 Reference Approval

8.1 Reference Equipment for Type Approval

The Siemens reference setup submitted to type approve MC75 consists of the following
components:

• Siemens MC75 cellular engine

• Development Support Box DSB75

• SIM card reader integrated on DSB75

• U.FL-R-SMT antenna connector and U.FL-LP antenna cable

• Handset type Votronic HH-SI-30.3/V1.1/0

• Li-Ion battery

• PC as MMI

50 Ω antenna

PC

Power supply

RS-232

Figure 40: Reference equipment for Type Approval

Li-Ion

battery

DSB75

GSM engine

B2B

SIM

Handset

connector (ARP)

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8.2 Compliance with FCC Rules and Regulations

The FCC Equipment Authorization Certification for the MC75 reference application described
in Section 8.1 is listed under the

FCC identifier QIPMC75
IC: 267W-MC75
granted to Siemens AG.

The MC75 reference application registered under the above identifier is certified to be in
accordance with the following Rules and Regulations of the Federal Communications
Commission (FCC).
Power listed is ERP for Part 22 and EIRP for Part 24
“This device contains GSM, GPRS Class12 and EGPRS Class 10 functions in the 900

and 1800MHz Band which are not operational in U.S. Territories.
This device is to be used only for mobile and fixed applications. The antenna(s) used

for this transmitter must be installed to provide a separation distance of at least 20cm

from all persons and must not be co-located or operating in conjunction with any other

antenna or transmitter. Users and installers must be provided with antenna installation

instructions and transmitter operating conditions for satisfying RF exposure com-

pliance. Antennas used for this OEM module must not exceed 8.4dBi gain (GSM 1900)

and 2.9dBi (GSM 850) for mobile and fixed operating configurations. This device is

approved as a module to be installed in other devices.

The FCC label of the module must be visible from the outside. If not, the host device is
required to bear a second label stating, “Contains FCC ID QIPMC75”.

IMPORTANT: Manufacturers of mobile or fixed devices incorporating MC75 modules are
advised to

• clarify any regulatory questions,

• have their completed product tested,

• have product approved for FCC compliance, and

• include instructions according to above mentioned RF exposure statements in end

product user manual.

Please note that changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate the equipment.

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9 Appendix

9.1 List of Parts and Accessories

Table 20: List of parts and accessories

Description Supplier Ordering information

MC75 Siemens Siemens ordering number: L36880-N8810-N100

Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117

DSB75 Support Box Siemens Siemens ordering number:

Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0

VOTRONIC
Entwicklungs- und Produktionsgesellschaft für
elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: [phone] / 92 55-0
Fax: [phone] / 92 55-88
e-mail: [e-mail]

SIM card holder incl. push
button ejector and slide-in
tray

Board-to-board connector Molex Sales contacts are listed in Table 21.

U.FL-R-SMT antenna
connector

Molex Ordering numbers: 91228

91236
Sales contacts are listed in Table 21.

Hirose See Section 4.3 for details on U.FL-R-SMT

connector, mating plugs and cables.
Sales contacts are listed in Table 22.

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Table 21: Molex sales contacts (subject to change)

s

Molex
For further information
please click:

http://www.molex.com/

Molex China Distributors
Beijing,
Room 1319, Tower B,
COFCO Plaza
No. 8, Jian Guo Men Nei
Street, 100005
Beijing
P.R. China
Phone: [phone]
Phone: [phone]
Phone: [phone]
Fax: [phone]

Molex Deutschland GmbH
Felix-Wankel-Str. 11
4078 Heilbronn-Biberach
Germany
Phone: [phone]
Fax: [phone]
Email: [e-mail]

Molex Singapore Pte. Ltd.
Jurong, Singapore
Phone: [phone]
Fax: [phone]

Table 22: Hirose sales contacts (subject to change)

American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: [phone]

Molex Japan Co. Ltd.
Yamato, Kanagawa, Japan
Phone: [phone]
Fax: [phone]

Hirose Ltd.
For further information
please click:

http://www.hirose.com

Hirose Electric UK, Ltd
Crownhill Business Centre
22 Vincent Avenue,
Crownhill
Milton Keynes, MK8 OAB
Great Britain
Phone: [phone]
Fax: [phone]

Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
U.S.A.
Phone: [phone]
Fax: [phone]

Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141
Japan
Phone: [phone]
Fax: [phone]

Hirose Electric GmbH
Zeppelinstrasse 42
73760 Ostfildern
Kemnat 4
Germany
Phone: [phone]
Fax [phone]
E-mail [e-mail]

Hirose Electric Co., Ltd.
European Branche
First class Building 4F
Beechavenue 46
1119PV Schiphol-Rijk
Netherlands
Phone: [phone]
Fax: [phone]

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9.2 Fasteners and Fixings for Electronic Equipment

This section provides a list of suppliers and manufacturers offering fasteners and fixings for
electronic equipment and PCB mounting. The content of this section is designed to offer
basic guidance to various mounting solutions with no warranty on the accuracy and
sufficiency of the information supplied. Please note that the list remains preliminary although
it is going to be updated in later versions of this document.

9.2.1 Fasteners from German Supplier ETTINGER GmbH

Sales contact: ETTINGER GmbH
http://www.ettinger.de/main.cfm
Phone: [phone] – 0
Fax: [phone] – 0

The following tables contain only article numbers and basic parameters of the listed
components. For further detail and ordering information please contact Ettinger GmbH.

Please note that some of the listed screws, spacers and nuts are delivered with the DSB75
Support Board. See comments below.

Article number: 05.71.038

Length 3.0 mm

Material AlMgSi-0,5

For internal diameter M2=2.0-2.3

Internal diameter d = 2.4 mm

External diameter 4.0 mm

Vogt AG No. x40030080.10

Spacer - Aluminum /
Wall thickness = 0.8mm

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Article number: 07.51.403

Insulating Spacer for M2
Self-gripping

*)

Length 3.0 mm

Material Polyamide 6.6

Surface Black

Internal diameter 2.2 mm

External diameter 4.0 mm

Flammability rating UL94-HB

*)

2 spacers are delivered with DSB75 Support Board

Article number: 05.11.209

Threaded Stud M2.5 - M2 Type E /
External thread at both ends

Length 3.0 mm

Material Stainless steel X12CrMoS17

Thread 1 / Length M2.5 / 6.0 mm

Thread 2 / Length M2 / 8.0 mm

Width across flats 5

Recess yes

Type External / External

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Article number: 01.14.131

Length 8.0 mm

Material Steel 4.8

Surface Zinced A2K

Thread M2

Head diameter D = 3.8 mm

Head height 1.30 mm

Type Slotted cheese head screw

Screw M2 *)
DIN 84 - ISO 1207

Article number: 01.14.141

Length 10.0 mm

Material Steel 4.8

Surface Zinced A2K

Thread M2

Head diameter D = 3.8 mm

Head height 1.30 mm

Type Slotted cheese head screw

*)

2 screws are delivered with DSB75 Support Board

Screw M2
DIN 84 - ISO 1207

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Article number: 02.10.011

Material Steel 4.8

Surface Zinced A2K

Thread M2

Wrench size / Ø 4

Thickness / L 1.6 mm

Type Nut DIN/UNC, DIN934

Hexagon Nut *)
DIN 934 - ISO 4032

*)

2 nuts are delivered with DSB75 Support Board

9.3 Data Sheets of Recommended Batteries

The following two data sheets have been provided by VARTA Microbattery GmbH.

Click here for sales contacts and further information: http://www.varta-microbattery.com

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Figure 41: Lithium

Ion battery from

VARTA

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Figure 42: Lithium

Polymer battery

from VARTA

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