Gemalto M2M MC75 Users Manual

MC75 Hardware Interface Description

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Function Signal name IO Signal form and level Comment

Analog
Audio
interface

VMIC O VOmin = 2.4V

typ = 2.5V

V

O

max = 2.6V

V

O

= 2mA

I

max

EPP2 O

EPN2 O

1.0954Vpp (differential) typical

3.4Vpp differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single
ended load 27 Ohms

EPP1 O

EPN1 O

1.0954Vpp (differential) typical

6.0 Vp-p differential maximal

Audio mode TBD

Measurement conditions TBD

Minimum differential resp. single
ended load 7.5 Ohms

MICP1 I

MICN1 I

MICP2 I

MICN2 I

AGND Analog Ground GND level for external audio

Full Scale Input Voltage 1.578 Vpp

0dBm0 Input Voltage 1.0954 Vpp

At MICNx, apply external bias from 1.0V to

1.6V.

Audio mode TBD

Measurement conditions TBD

Microphone supply for
customer feeding circuits

The audio output can directly
operate a 32-Ohm­loudspeaker.

If unused keep pins open.

The audio output can directly
operate an 8-Ohm­loudspeaker.

If unused keep pins open.

Balanced or single ended
microphone or line inputs with
external feeding circuit (using
VMIC and AGND).

If unused keep pins open.

circuits

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5.4 Electrostatic Discharge

The GSM engine is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive
components. Proper ESD handling and packaging procedures must be applied throughout
the processing, handling and operation of any application that incorporates a MC75 module.

Special ESD protection provided on MC75:

Antenna interface: one spark discharge line (spark gap)
SIM interface: clamp diodes for protection against overvoltage.
The remaining ports of MC75 are not accessible to the user of the final product (since they
are installed within the device) and therefore, are only protected according to the “Human
Body Model” requirements.

MC75 has been tested according to the EN 61000-4-2 standard. The measured values can
be gathered from the following table.

Table 17: Measured electrostatic values

Specification / Requirements Contact discharge Air discharge

ETSI EN 301 489-7

ESD at SIM port

ESD at antenna port

Human Body Model (Test conditions: 1.5 kΩ, 100 pF)

ESD at USB interface

ESD at SD card interface

ESD at all other interfaces

± 4kV ± 8kV

± 4kV ± 8kV

± 1kV ± 1kV

± 1kV ± 1kV

± 1kV ± 1kV

Note: Please note that the values may vary with the individual application design. For

example, it matters whether or not the application platform is grounded over external
devices like a computer or other equipment, such as the Siemens reference
application described in Chapter 8.

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5.5 Reliability Characteristics

The test conditions stated below are an extract of the complete test specifications.

Table 18: Summary of reliability test conditions

Type of test Conditions Standard

Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm

amplitude
Frequency range: 20-500 Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes

Shock half-sinus Acceleration: 500g

Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)

Dry heat Temperature: +70 ±2°C

Test duration: 16 h
Humidity in the test chamber: < 50%

Temperature
change (shock)

Damp heat cyclic High temperature: +55°C ±2°C

Cold (constant
exposure)

Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1 h
Number of repetitions: 100

Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h

Temperature: -40 ±2°C
Test duration: 16 h

DIN IEC 68-2-6

DIN IEC 68-2-27

EN 60068-2-2 Bb ETS
300019-2-7

DIN IEC 68-2-14 Na

ETS 300019-2-7

DIN IEC 68-2-30 Db

ETS 300019-2-5

DIN IEC 68-2-1

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6 Mechanics

6.1 Mechanical Dimensions of MC75

Figure 35 shows the top view of MC75 and provides an overview of the board's mechanical
dimensions. For further details see Figure 36.

Pin 1

Pin 80

Figure 35: MC75 – top view

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All dimensions in mm

Figure 36: Dimensions of MC75

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6.2 Mounting MC75 to the Application Platform

There are many ways to properly install MC75 in the host device. An efficient approach is to
mount the MC75 PCB to a frame, plate, rack or chassis.

Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized
to achieve better support. To help you find appropriate spacers a list of selected screws and
distance sleeves for 3mm stacking height can be found in Section 9.2.

When using the two small holes take care that the screws are inserted with the screw head
on the bottom of the MC75 PCB. Screws for the large holes can be inserted from top or
bottom.

For proper grounding it is strongly recommended to use large ground plane on the bottom of
board in addition to the five GND pins of the board-to-board connector. The ground plane
may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.

To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it
is positioned flat against the host device.

All the information you need to install an antenna is summarized in Chapter 4. Note that the
antenna pad on the bottom of the MC75 PCB must not be influenced by any other PCBs,
components or by the housing of the host device. It needs to be surrounded by a restricted
space as described in Section 4.1.

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6.3 Board-to-Board Application Connector

This section provides the specifications of the 80-pin board-to-board connector used to
connect MC75 to the external application.

Connector mounted on the MC75 module:
Type: 52991-0808 SlimStack Receptacle
80 pins, 0.50mm pitch,
for stacking heights from 3.0 to 4.0mm,
see Figure 37 for details.
Supplier: Molex
www.molex.com

Table 19: Technical specifications of Molex board-to-board connector

Parameter Specification (80-pin B2B connector)

Electrical

Number of Contacts 80

Contact spacing 0.5mm (.020")

Voltage 50V

Rated current 0.5 A max per contact

Contact resistance 50mΩ max per contact

Insulation resistance > 100 MΩ

Dielectric Withstanding Voltage 500 V AC (for 1 minute)

Physical

Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0

Contact material Plating: Gold over nickel

Insertion force 1st < 74.4 N

Insertion force 30th < 65.6 N

Withdrawal force 1st > 10.8 N

Maximum connection cycles 30 (@ 70mΩ max per contact)

Mating connector types for the customer's application
offered by Molex:

• 53748-0808 SlimStack Plug, 3mm stacking height,
see Figure 38 for details.

• 53916-0808 SlimStack Plug, 4mm stacking height

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