Gemalto M2M MC56, MC55 User Manual
MC55/56 Hardware Interface Description
p
Confidential / Preliminary
s
tion
MC55/56
Siemens Cellular Engine
Version: 03.00
DocID: MC55/56_hd_v03.00
MC55/56_hd_v03.00 Page 1 of 104 16.08.2005
Hardware Interface Descri
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Document Name:
Version:
Date:
DocId:
Status:
MC55/56 Hardware Interface Description
03.00
August 16, 2005
MC55/56_hd_v03.00
Confidential / Preliminary
General Notes
Product is deemed accepted by Recipient and is provided without interface to Recipient’s products.
The documentation and/or Product are provided for testing, evaluation, integration and information
purposes. The documentation and/or Product are provided on an “as is” basis only and may contain
deficiencies or inadequacies. The Documentation and/or Product are provided without warranty of any
kind, express or implied. To the maximum extent permitted by applicable law, Siemens further
disclaims all warranties, including without limitation any implied warranties of merchantability,
completeness, fitness for a particular purpose and non-infringement of third-party rights. The entire
risk arising out of the use or performance of the Product and documentation remains with Recipient.
This Product is not intended for use in life support appliances, devices or systems where a
malfunction of the product can reasonably be expected to result in personal injury. Applications
incorporating the described product must be designed to be in accordance with the technical
specifications provided in these guidelines. Failure to comply with any of the required procedures can
result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding
the use of mobile technical systems, including GSM products, which also apply to cellular phones
must be followed. Siemens or its suppliers shall, regardless of any legal theory upon which the claim
is based, not be liable for any consequential, incidental, direct, indirect, punitive or other damages
whatsoever (including, without limitation, damages for loss of business profits, business interruption,
loss of business information or data, or other pecuniary loss) arising out the use of or inability to use
the Documentation and/or Product, even if Siemens has been advised of the possibility of such
damages. The foregoing limitations of liability shall not apply in case of mandatory liability, e.g. under
the German Product Liability Act, in case of intent, gross negligence, injury of life, body or health, or
breach of a condition which goes to the root of the contract. However, Claims for Damages arising
from a breach of a condition which goes to the root of the contract shall be limited to the foreseeable
damage which is intrinsic to the contract, unless caused by intent or gross negligence or based on
liability for injury of life, body or health. The above provision does not imply a change on the burden of
proof to the detriment of the Recipient. Subject to change without notice at any time. The interpretation
of this general note shall be governed and construed according to German law without reference to
any other substantive law.
Copyright
Copying of this document and giving it to others and the use or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design.
Copyright © Siemens AG 2005
MC55/56_hd_v03.00 Page 2 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
Contents
0 Document history..........................................................................................................7
1 Introduction ...................................................................................................................9
1.1 Related documents................................................................................................9
1.2 Terms and abbreviations .....................................................................................10
1.3 Type approval ......................................................................................................13
1.4 Safety precautions ...............................................................................................15
2 Product concept.......................................................................................................... 17
2.1 MC55/56 key features at a glance .......................................................................18
2.2 Circuit concept .....................................................................................................21
3 Application Interface...................................................................................................22
3.1 Operating modes .................................................................................................23
3.2 Power supply .......................................................................................................25
3.2.1 Power supply pins on the board-to-board connector .............................25
3.2.2 Minimizing power losses........................................................................26
3.2.3 Monitoring power supply........................................................................26
3.3 Power up / down scenarios..................................................................................27
3.3.1 Turn on MC55/56 ................................................................................... 27
3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on)......................28
3.3.1.2 Timing of the ignition process ................................................................29
3.3.1.3 Turn on MC55/56 using the POWER signal ..........................................30
3.3.1.4 Turn on MC55/56 using the RTC (Alarm mode) ....................................30
3.3.2 Turn off MC55/56 ................................................................................... 32
3.3.2.1 Turn off MC55/56 using AT command ...................................................32
3.3.2.2 Emergency shutdown using /EMERGOFF pin.......................................33
3.3.3 Automatic shutdown...............................................................................34
3.3.3.1 Temperature dependent shutdown ........................................................ 34
3.3.3.2 Temperature control during emergency call ..........................................35
3.3.3.3 Undervoltage shutdown if battery NTC is present .................................35
3.3.3.4 Undervoltage shutdown if no battery NTC is present ............................36
3.3.3.5 Overvoltage shutdown ...........................................................................36
3.4 Automatic GPRS Multislot Class change.............................................................37
3.5 Charging control ..................................................................................................38
3.5.1 Battery pack characteristics...................................................................39
3.5.2 Implemented charging technique........................................................... 41
3.5.3 Operating modes during charging..........................................................42
3.5.4 Charger requirements ............................................................................ 43
3.6 Power saving .......................................................................................................44
3.6.1 No power saving (AT+CFUN=1) ............................................................44
3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0)..........................................44
3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7, 8) .......................................45
3.6.4 CYCLIC SLEEP mode AT+CFUN=9 .....................................................45
3.6.5 Timing of the /CTS signal in CYCLIC SLEEP modes ............................45
3.6.6 Wake up MC55/56 from SLEEP mode ..................................................47
3.6.6.1 Wake-up via /RTS0 and RTS1 (if AT+CFUN=0 or AT+CFUN=9)..........48
3.7 Summary of state transitions (except SLEEP mode)........................................... 49
3.8 RTC backup.........................................................................................................50
3.9 Serial interfaces ...................................................................................................51
3.9.1 Features supported on first and second serial interface........................52
s
MC55/56_hd_v03.00 Page 3 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
3.10 Audio interfaces ...................................................................................................54
3.10.1 Microphone circuit.................................................................................. 55
3.10.2 Speech processing ................................................................................56
3.10.3 DAI timing ..............................................................................................56
3.11 SIM interface........................................................................................................58
3.11.1 Requirements for using the CCIN pin ....................................................59
3.11.2 Design considerations for SIM card holder............................................60
3.12 Control signals .....................................................................................................61
3.12.1 Inputs .....................................................................................................61
3.12.2 Outputs ..................................................................................................62
3.12.2.1 Synchronization signal...........................................................................62
3.12.2.2 Using the SYNC pin to control a status LED..........................................63
3.12.2.3 Behavior of the /RING0 line (ASC0 interface only)................................65
4 Antenna interface........................................................................................................ 66
4.1 Antenna installation .............................................................................................66
4.1.1 Antenna pad...........................................................................................68
4.1.1.1 Suitable cable types............................................................................... 68
4.1.2 Hirose antenna connector...................................................................... 69
s
5 Electrical, reliability and radio characteristics.........................................................73
5.1 Absolute maximum ratings ..................................................................................73
5.2 Operating temperatures.......................................................................................73
5.3 Electrical specifications of the application interface.............................................74
5.4 Power supply ratings ...........................................................................................79
5.4.1 Current consumption during transmit burst............................................80
5.5 Electrical characteristics of the voiceband part....................................................85
5.5.1 Setting audio parameters by AT commands..........................................85
5.5.2 Audio programming model.....................................................................86
5.5.3 Characteristics of audio modes..............................................................87
5.5.4 Voiceband receive path .........................................................................88
5.5.5 Voiceband transmit path ........................................................................89
5.6 Air interface..........................................................................................................90
5.7 Electrostatic discharge.........................................................................................91
5.8 Reliability characteristics .....................................................................................92
6 Mechanics....................................................................................................................93
6.1 Mechanical dimensions of MC55/56....................................................................93
6.2 Mounting MC55/56 onto the application platform ................................................95
6.3 Board-to-board connector....................................................................................96
6.3.1 Mechanical dimensions of the Hirose DF12 connector..........................97
6.3.2 Adapter cabling......................................................................................97
7 Reference Approval ....................................................................................................98
7.1 Reference Equipment for Type Approval.............................................................98
7.2 Compliance with FCC Rules and Regulations (MC55 only) ................................99
7.3 Compliance with FCC Rules and Regulations (MC56 only) ..............................100
8 Design example.........................................................................................................101
9 List of parts and accessories...................................................................................103
MC55/56_hd_v03.00 Page 4 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
Figures
Figure 1: MC55/56 block diagram .......................................................................................... 21
Figure 2: Power supply limits during transmit burst................................................................ 26
Figure 3: Power-on by ignition signal ..................................................................................... 28
Figure 4: Timing of power-on process if VDDLP is not used.................................................. 29
Figure 5: Timing of power-on process if VDDLP is fed from external source......................... 30
Figure 6: Deactivating GSM engine by /EMERGOFF signal.................................................. 33
Figure 7: Schematic of approved charging transistor, trickle charging and ESD protection ..38
Figure 8: Battery pack circuit diagram....................................................................................39
Figure 9: Charging process .................................................................................................... 41
Figure 10: Timing of /CTS signal (example for a 2.12 s paging cycle)................................... 46
Figure 11: Beginning of power saving if CFUN=5 or 7........................................................... 46
Figure 12: RTC supply from capacitor.................................................................................... 50
Figure 13: RTC supply from rechargeable battery ................................................................. 50
Figure 14: RTC supply from non-chargeable battery ............................................................. 50
Figure 15: Serial interfaces ....................................................................................................51
Figure 16: Audio block diagram.............................................................................................. 54
Figure 17: Schematic of microphone inputs ...........................................................................55
Figure 18: DAI timing on transmit path................................................................................... 57
Figure 19: DAI timing on receive path ....................................................................................57
Figure 20: SIM card holder of DSB45 Support Box................................................................ 60
Figure 21: Pin numbers of Molex SIM card holder on DSB45 Support Box........................... 60
Figure 22: SYNC signal during transmit burst ........................................................................62
Figure 23: LED Circuit (Example)........................................................................................... 64
Figure 24: Incoming voice call................................................................................................65
Figure 25: URC transmission ................................................................................................. 65
Figure 26: U.FL-R-SMT connector .........................................................................................66
Figure 27: Antenna pad and GND plane ................................................................................66
Figure 28: Never use antenna connector and antenna pad at the same time .......................67
Figure 29: Restricted area around antenna pad..................................................................... 67
Figure 30: Mechanical dimensions of U.FL-R-SMT connector............................................... 69
Figure 31: U.FL-R-SMT connector with U.FL-LP-040 plug .................................................... 70
Figure 32: U.FL-R-SMT connector with U.FL-LP-066 plug .................................................... 70
Figure 33: Specifications of U.FL-LP-(V)-040(01) plug .......................................................... 71
Figure 34: Pin assignment (top view on MC55/56) ................................................................74
Figure 35: Typical current consumption vs. power control level............................................. 83
Figure 36: Typical current consumption vs. return loss.......................................................... 84
Figure 37: Audio programming model ....................................................................................86
Figure 38: MC55/56 – top view ..............................................................................................93
Figure 39: MC55/56 bottom view ...........................................................................................93
Figure 40: Mechanical dimensions of MC55/56 ..................................................................... 94
Figure 41: Hirose DF12C receptacle on MC55/56 ................................................................. 96
Figure 42: Header Hirose DF12 series................................................................................... 96
Figure 43: Mechanical dimensions of Hirose DF12 connector............................................... 97
Figure 44: Reference equipment for approval........................................................................ 98
Figure 45: Schematic diagram of MC55/56 sample application ...........................................102
MC55/56_hd_v03.00 Page 5 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
Tables
Table 1: MC55/56 key features .............................................................................................. 18
Table 2: Coding schemes and maximum net data rates over air interface ............................ 20
Table 3: Overview of operating modes................................................................................... 23
Table 4: Power supply pins of board-to-board connector....................................................... 25
Table 5: AT commands available in Alarm mode................................................................... 31
Table 6: Temperature dependent behaviour ..........................................................................35
Table 7: Bill of material for external charging circuit............................................................... 38
Table 8: Specifications of recommended battery pack........................................................... 40
Table 9: Comparison Charge-only and Charge mode............................................................ 42
Table 10: AT commands available in Charge-only mode....................................................... 43
Table 11: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes.............................47
Table 12: State transitions of MC55/56 (except SLEEP mode) .............................................49
Table 13: DCE-DTE wiring of 1st serial interface................................................................... 52
Table 14: DCE-DTE wiring of 2nd serial interface.................................................................. 53
Table 15: Signals of the SIM interface (board-to-board connector) .......................................58
Table 16: Pin assignment of Molex SIM card holder on DSB45 Support Box........................ 60
Table 17: Input control signals of the MC55/56 module ......................................................... 61
Table 18: Coding of the status LED .......................................................................................63
Table 19: ASC0 ring signal.....................................................................................................65
Table 20: Return loss .............................................................................................................66
Table 21: Product specifications of U.FL-R-SMT connector .................................................. 69
Table 22: Material and finish of U.FL-R-SMT connector and recommended plugs ...............70
Table 23: Ordering information for Hirose U.FL Series ..........................................................72
Table 24: Absolute maximum ratings .....................................................................................73
Table 25: Operating temperatures .........................................................................................73
Table 26: Electrical description of application interface .........................................................75
Table 27: Power supply ratings ..............................................................................................79
Table 28: Audio parameters adjustable by AT command ......................................................85
Table 29: Voiceband characteristics (typical)......................................................................... 87
Table 30: Voiceband receive path..........................................................................................88
Table 31: Voiceband transmit path......................................................................................... 89
Table 32: Air Interface ............................................................................................................ 90
Table 33: Measured electrostatic values................................................................................91
Table 34: Summary of reliability test conditions .....................................................................92
Table 35: Ordering information DF12 series .......................................................................... 96
Table 36: Electrical and mechanical characteristics of the Hirose DF12C connector ............ 96
Table 37: List of parts and accessories................................................................................ 103
Table 38: Molex sales contacts (subject to change) ............................................................104
Table 39: Hirose sales contacts (subject to change)............................................................104
MC55/56_hd_v03.00 Page 6 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
0 Document history
Preceding document: "MC55/56 Hardware Interface Description" Version 02.90
New document: "MC55/56 Hardware Interface Description" Version 03.00
Chapter What is new
1.3 Deleted section “Compliance with international rules and regulations”.
3.3.1.1 Added further details of timing after power-up.
3.6.2, 3.6.6,
3.6.6.1
3.12.2.2 Some text changes related to LED behavior in CYCLIC SLEEP mode.
7.2, 7.3 Deleted note on extra FCC certification for OEM products. Changed note on
More detailed description of RTS wake-up.
recommendations for mobile and fixed devices. Added FCC labeling requirements.
Preceding document: "MC55/56 Hardware Interface Description" Version 02.06
New document: "MC55/56 Hardware Interface Description" Version 02.90
Chapter What is new
Throughout
document
1.3 Added European Directives related to RoHS and WEEE.
3.5.2 Described charging procedure if battery was deeply discharged.
3.12.2.3 Same description of RING line behavior for voice, data, fax.
6.2 Deleted screw and washer restrictions for mounting holes of MC55/56.
6.1 Updated figure “Mechanical dimensions of MC55/56”
9 Siemens ordering numbers changed.
Updated module images.
Preceding document: "MC55/56 Hardware Interface Description" Version 01.95
New document: "MC55/56 Hardware Interface Description" Version 02.06
Chapter What is new
5.5.3 Table 29: Sidetone gain at default settings for audio mode 5 and 6 set to - dB
9 Added new Siemens ordering numbers
Preceding document: "MC55/56 Hardware Interface Description" Version 01.05
New document: "MC55/56 Hardware Interface Description" Version 01.95
Chapter What is new
Throughout
document
1.3 Updated list of standards.
3.6, 3.12.2.2 More detailed description of status LED patterns.
3.5.1 Deleted vendor XWODA, battery pack can be obtained from various dealers.
3.11 Use CCGND line to shield CCIO line from CCCLK line.
5.2 Added footnote regarding heat sink.
5.4 Typical value for supply voltage has been changed from 4.1V to 4.2V
MC55/56_hd_v03.00 Page 7 of 104 16.08.2005
Maximum temperature has been changed from +65°C to +70°C.
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Chapter What is new
7.2, 7.3 Added IC: 267W-MC55 and IC: IC: 267W-MC56
8 New chapter: Design example
---- Deleted chapter “Maximum number of turn-on / turn-off cycles”
Preceding document: "MC55/56 Hardware Interface Description" Version 01.03a
New document: "MC55/56 Hardware Interface Description" Version 01.05
Chapter What is new
1.3 Updated list of standards, MC55/56 now fully type approved and labeled with CE mark
2.2 New block diagram.
3.2.2, 5.3 All statements relating to typical peak current now 1.6 A.
3.2.3 More detailed description of measuring periods for BATT+.
3.1, 3.5.3 Removed remarks about charging during Alarm mode
3.3.1.4 Battery can be charged while module is in Alarm mode.
3.3.2.1 To keep /EMERGOFF pin and output pins of the serial interfaces from floating when in
high impedance state use additional resistors.
3.3.3.5 Modified description of overvoltage conditions.
3.5 Improved Figure 7.
3.6 Added SLEEP mode 9, added information on RTS, revised Table 11.
3.12.2.3 Advantages of the /RING0 line usage explained in more detail.
4.1 Marked antenna pad and ground pad.
4.1.2 Rated frequency changed from 3 to 6 GHz
5.3 Table 26 - /EMERGOFF pin and output pins of serial interface: To keep output pins
from floating when in high impedance state use additional resistors.
5.4
5.4.1 Revised introduction.
5.5.2 Improved Figure 37: Audio programming model
6.1
6.2 Revised mounting instructions.
9 Siemens ordering numbers added.
--- Deleted chapter on cooling elements.
Added test conditions for TALK and DATA GPRS: 50 Ω
New drawing in Figure 40. Corrected height from 2.8 ±0.2 to 2.95 ±0.2 mm
Preceding document: "MC55/56 Hardware Interface Description" Version 01.03
New document: "MC55/56 Hardware Interface Description" Version 01.03a
Chapter What is new
7.2, 7.3 Corrected MC55 and MC56 specific information on FFC compliance
Preceding document: "MC55/56 Hardware Interface Description" Version 01.02
New document: "MC55/56 Hardware Interface Description" Version 01.03
Chapter What is new
1.3 Note on necessary FCC certification added.
MC55/56_hd_v03.00 Page 8 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
1 Introduction
This document describes the hardware interface of the Siemens MC55/56 module that
connects to the cellular device application and the air interface. As MC55/56 is intended to
integrate with a wide range of application platforms, all functional components are described
in great detail.
This guide therefore covers all information needed to design and set up cellular applications
incorporating the MC55/56 module. It aids rapid retrieval of interface specifications, electrical
and mechanical details and information on the requirements to be considered for integration
of further components.
1.1 Related documents
[1] MC55 AT Command, Version 03.00
MC56 AT Command, Version 03.00
[2] MC55/56 Release Notes, Version 03.00
[3] GPRS Startup User's Guide
[4] Remote-SAT User's Guide
[5] DSB45 Support Box - Evaluation Kit for Siemens Cellular Engines
[6] Application Note 23: Installing MC55/56 on DSB45
[7] Application Note 07: Li-Ion Batteries in GSM Applications
[8] Application Note 16: Upgrading MC5x Firmware, Version 06
[9] Application Note 14: Audio and Battery Parameter Download
[10] Application Note 02: Audio Interface Design
[11] Multiplexer User's Guide
[12] Multiplex Driver Developer’s Guide for Windows 2000 and Windows XP
[13] Multiplex Driver Installation Guide for Windows 2000 and Windows XP
[14] Application Note 22: Using TTY / CTM equipment
[15] Application Note 24: Application Developer’s Guide
[16] Application Note 28: Customer SIM Lock
Prior to using the MC55/56 engines or upgrading to a new firmware release, be sure to
carefully read the latest product information.
To visit the Siemens Website you can use the following link:
http://www.siemens.com/wm
MC55/56_hd_v03.00 Page 9 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
1.2 Terms and abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0 / ASC1 Asynchronous Serial Controller. Abbreviations used for first and second serial
interface of MC55/56
ASIC Application Specific Integrated Circuit
B Thermistor Constant
B2B Board-to-board connector
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
MC55/56_hd_v03.00 Page 10 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
Abbreviation Description
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
s
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion Lithium-Ion
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
MC55/56_hd_v03.00 Page 11 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
Abbreviation Description
PPP Point-to-point protocol
PSU Power Supply Unit
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
ROM Read-only Memory
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMS Short Message Service
s
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM engine)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Phonebook abbreviations
FD SIM fixdialing phonebook
LD SIM last dialling phonebook (list of numbers most recently dialled)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ME Mobile Equipment phonebook
ON Own numbers (MSISDNs) stored on SIM or ME
RC Mobile Equipment list of received calls
SM SIM phonebook
MC55/56_hd_v03.00 Page 12 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
1.3 Type approval
MC55/56 has been approved to comply with the directives and standards listed below and is
labeled with the CE conformity mark.
European directives
99/05/EC “Directive of the European Parliament and of the Council of 9 March
1999 on radio equipment and telecommunications terminal equipment
and the mutual recognition of their conformity”, in short referred to as
89/336/EC Directive on electromagnetic compatibility
73/23/EC Directive on electrical equipment designed for use within certain
2002/95/EC Directive of the European Parliament and of the Council of 27
2002/96/EC Directive of the European Parliament and of the Council on waste
2003/108/EC Directive of the European Parliament and of the Council of 8
Standards of North American Type Approval
CFR Title 47 “Code of Federal Regulations, Part 22 and Part 24
UL 60 950 “Product Safety Certification” (Safety requirements)
NAPRD.03 “Overview of PCS Type certification review board
Mobile Equipment Type Certification and IMEI control”
PCS Type Certification Review board (PTCRB), Version 3.00
RSS133 (Issue2) Canadian Standard
Standards of European Type Approval
3GPP TS 51.010-1 “Digital cellular telecommunications system (Phase 2); Mobile Station
ETSI EN 301 511 “V7.0.1 (2000-12) Candidate Harmonized European Standard (Tele-
GCF-CC “Global Certification Forum - Certification Criteria” V3.18.0
R&TTE Directive 1999/5/EC
voltage limits (Low Voltage Directive)
January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)
electrical and electronic equipment (WEEE)
December 2003 amending directive 2002/96/ec on waste electrical
and electronic equipment (WEEE)
(Telecommunications, PCS)”; US Equipment Authorization FCC
(MS) conformance specification”
communications
series) Global System for Mobile communications
(GSM); Harmonized standard for mobile stations in the GSM 900 and
DCS 1800 bands covering essential requirements under article 3.2 of
the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release
1998)”
MC55/56_hd_v03.00 Page 13 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
ETSI EN 301 489-1 “V1.2.1 Candidate Harmonized European Standard (Tele-
communications
series) Electro Magnetic Compatibility and Radio
spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard
for radio equipment and services; Part 1: Common Technical
Requirements”
ETSI EN 301 489-07 “V1.1.1 Electro Magnetic Compatibility and Radio spectrum Matters
(ERM); Electro Magnetic Compatibility (EMC) standard for radio
equipment and services; Part 7: Specific conditions for mobile and
portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)”
EN 60 950 Safety of information technology equipment (2000)
Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
SAR requirements specific to handheld mobiles
Mobile phones, PDAs or other handheld transmitters and receivers incorporating a GSM
module must be in accordance with the guidelines for human exposure to radio frequency
energy. This requires the Specific Absorption Rate (SAR) of handheld MC55/56 based
applications to be evaluated and approved for compliance with national and/or international
regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for handheld operation. For
European and US markets the relevant directives are mentioned below. It is the responsibility
of the manufacturer of the final product to verify whether or not further standards,
recommendations or directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in
the frequency range 30MHz-6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to
electromagnetic fields (300 MHz - 3 GHz)
MC55/56_hd_v03.00 Page 14 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
1.4 Safety precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating MC55/56. Manufacturers of
the cellular terminal are advised to convey the following safety information to users and
operating personnel and to incorporate these guidelines into all manuals supplied with the
product. Failure to comply with these precautions violates safety standards of design,
manufacture and intended use of the product. Siemens AG assumes no liability for customer
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the
use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so
by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment
and hearing aids can be affected by interference from cellular terminals or
mobiles placed close to the device. If in doubt about potential danger, contact
the physician or the manufacturer of the device to verify that the equipment is
properly shielded. Pacemaker patients are advised to keep their hand-held
mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless
appliances in an aircraft is forbidden to prevent interference with
communications systems. Failure to observe these instructions may lead to
the suspension or denial of cellular services to the offender, legal action, or
both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol
stations, fuel depots, chemical plants or where blasting operations are in
progress. Operation of any electrical equipment in potentially explosive
atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency
energy while switched on. Remember that interference can occur if it is used
close to TV sets, radios, computers or inadequately shielded equipment.
Follow any special regulations and always switch off the cellular terminal or
mobile wherever forbidden, or when you suspect that it may cause
interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for handsfree
operation. Before making a call with a hand-held terminal or mobile, park the
vehicle.
Handsfree devices must be installed by qualified personnel. Faulty installation
or operation can constitute a safety hazard.
MC55/56_hd_v03.00 Page 15 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
IMPORTANT!
SOS
Cellular terminals or mobiles operate using radio signals and cellular
networks. Because of this connection cannot be guaranteed at all times under
all conditions. Therefore, you should never rely solely upon any wireless
device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services or
phone features are in use (e.g. lock functions, fixed dialling etc.). You may
need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the
cellular terminal or mobile.
s
MC55/56_hd_v03.00 Page 16 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
2 Product concept
Designed for use on any GSM network in the world, Siemens MC55 is a tri-band GSM/GPRS
engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM
1900 MHz. MC56 is a tri-band GSM/GPRS engine that works on the three frequencies GSM
850MHz, GSM 1800 MHz and GSM 1900 MHz. MC55/56 features GPRS multislot class 10
and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.
To save space on the application platform, MC55/56 comes as an extremely slim and
compact module. This makes it ideally suited for a broad range of mobile computing devices,
and particularly offers easy integration with smart phones, PDAs, and other handhelds.
The tiny MC55/56 module incorporates all you need to create high-performance GSM/GPRS
solutions: baseband processor, power supply ASIC, complete radio frequency circuit
including a power amplifier and antenna interface. The power amplifier is directly fed from the
supply voltage BATT+. A compact “stacked FLASH / SRAM” device stores the MC55/56
software in the flash memory section, and static RAM section provides the additional storage
capacity required by GPRS connectivity.
The physical interface to the cellular application is made through a board-to-board connector.
It consists of 50 pins, required for controlling the unit, transferring data and audio signals and
providing power supply lines.
MC55/56 comprises two serial interfaces (ASC0 and ASC1) giving you maximum flexibility
for easy integration with the Man-Machine Interface (MMI).
An extremely versatile audio concept offers various audio interfaces, each available on the
board-to-board connector: a digital audio interface (DAI) and two analog audio interfaces.
Using AT commands you can easily switch back and forth and select different audio modes.
The external dual-band or triple-band antenna can be connected optionally to a connector on
the top side or to a pad on the bottom side.
The power saving technique minimizes current consumption to as low as 3mA. In SLEEP
mode, MC55/56 is able to wake up on demand and to resume power saving automatically if
no activity is required.
For battery powered applications, MC55/56 features a charging control which can be used to
charge a Li-Ion battery. The charging circuit must be implemented outside the module on the
application platform.
MC55/56_hd_v03.00 Page 17 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
2.1 MC55/56 key features at a glance
Table 1: MC55/56 key features
Feature Implementation
Power supply Single supply voltage 3.3V – 4.8V
Power saving Minimizes power consumption in SLEEP mode to 3mA
Charging Supports charging control for Li-Ion battery
s
Frequency bands
GSM class Small MS
Transmit power
GPRS connectivity
Temperature range
Temperature control
and auto switch-off
DATA GPRS:
CSD:
WAP:
• MC55 Tri-band: EGSM 900, GSM 1800, GSM 1900
• MC56 Tri-band: GSM 850, GSM 1800, GSM 1900
• Compliant to GSM Phase 2/2+
• Class 4 (2W) at EGSM 900 and GSM 850
• Class 1 (1W) at GSM 1800 and GSM 1900
• GPRS multi-slot class 10
• GPRS mobile station class B
• Normal operation: -20°C to +55°C
• Restricted operation: -25°C to -20°C and +55°C to +70°C
• Constant temperature control prevents damage to MC55/56 when the
specified temperature is exceeded. When an emergency call is in
progress the automatic temperature shutdown functionality is
deactivated.
• GPRS data downlink transfer: max. 85.6 kbps (see Table 2)
• GPRS data uplink transfer: max. 42.8 kbps (see Table 2)
• Coding scheme: CS-1, CS-2, CS-3 and CS-4
• MC55/56 supports the two protocols PAP (Password Authentication
Protocol) and CHAP (Challenge Handshake Authentication Protocol)
commonly used for PPP connections.
• Support of Packet Switched Broadcast Control Channel (PBCCH) allows
you to benefit from enhanced GPRS performance when offered by the
network operators.
• CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent, V.110
• Unstructured Supplementary Services Data (USSD) support
• WAP compliant
SMS
MMS MMS compliant
FAX Group 3: Class 1, Class 2
SIM interface
MC55/56_hd_v03.00 Page 18 of 104 16.08.2005
• MT, MO, CB, Text and PDU mode
• SMS storage: SIM card plus 25 SMS locations in the mobile equipment
• Transmission of SMS alternatively over CSD or GPRS. Preferred mode
can be user-defined.
• Supported SIM card: 3V
• External SIM card reader has to be connected via interface connector
(note that card reader is not part of MC55/56)
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Feature Implementation
External antenna Connected via 50 Ohm antenna connector or antenna pad
Audio interfaces Two analog audio interfaces, one digital audio interface (DAI)
Audio features Speech codec modes:
• Half Rate (ETS 06.20)
• Full Rate (ETS 06.10)
• Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
• Adaptive Multi Rate (AMR)
Handsfree operation
• Echo cancellation
• Noise reduction
Two serial interfaces:
ASC0, ASC1
Phonebook
management
SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98, support of letter class “c”
Ringing tones Offers a choice of 7 different ringing tones / melodies, easily selectable with
Real time clock Implemented
Timer function Programmable via AT command
Support of TTY/CTM To benefit from TTY communication via GSM, CTM equipment can be
Physical characteristics Size: 35+0.15 x 32.5+0.15 x 3.1+0.3 mm (including
• 2.65V level, bi-directional bus for AT commands and data
• ASC0 – full-featured 8-wire serial interface. Supports RTS0/CTS0
hardware handshake and software XON/XOFF flow control. Multiplex
ability according to GSM 07.10 Multiplexer Protocol.
• ASC1 - 4-wire serial interface. Supports RTS1/CTS1 hardware
handshake and software XON/XOFF flow control.
• Baud rate: 300bps ... 230kbps on ASC0 and ASC1
• Autobauding (on ASC0 only) detects 1200, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400 bps
Supported phonebook types: SM, FD, LD, MC, RC, ON, ME
AT command
connected to one of the three audio interfaces.
application connector)
35+0.15 x 32.5+0.15 x 2.95+0.2 mm (excluding
application connector)
Weight: 5.5g
RoHS, WEEE All hardware components are fully compliant with the EU RoHS and WEEE
Directives
Firmware upgrade Firmware upgradable over serial interface and SIM interface
Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type
approve Siemens cellular engines and provide a sample configuration for
application engineering. See Chapter 9 for ordering information.
MC55/56_hd_v03.00 Page 19 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Table 2: Coding schemes and maximum net data rates over air interface
Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots
CS-1: 9.05 kbps 18.1 kbps 36.2 kbps
CS-2: 13.4 kbps 26.8 kbps 53.6 kbps
CS-3: 15.6 kbps 31.2 kbps 62.4 kbps
CS-4: 21.4 kbps 42.8 kbps 85.6 kbps
Please note that the values stated above are maximum ratings which, in practice, are influenced by a
great variety of factors, primarily, for example, traffic variations and network coverage.
MC55/56_hd_v03.00 Page 20 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
2.2 Circuit concept
Figure 1 shows a block diagram of the MC55/56 module and illustrates the major functional
components:
GSM / GPRS baseband block:
• Baseband controller operating at 26MHz
• Power supply ASIC
• Stacked Flash / SRAM
• Application interface (board-to-board connector)
GSM RF block:
• Skyworks RF transceiver
• Skyworks RF power amplifier / FEM
• RF front end (antenna connector)
MC5x
RF Power
Amplifi er
RF Section
Measuring
Network
Interface
RF - Baseband
Send
Receive
Control
CCRST
CCCLK
CCIO
CCIN
CCVCC
(GND)
Power
Supply
ASIC
Baseband
Controller
4
2
Data
Adr
Control
Data
Adr
Control
5
9
8
4
6
SIM Interface
/EMERGOFF
POWER
CHARGE
5
5
BATT_TEMP
DAI
2x Audio
ASC0
ASC1
SYNC
VDD
VDDLP
/IGT
BATT+
GND
SRAM
Flash
CCIN
CCVCC
4
(50 pins)
Application Interface
Ext.
Charging
Circuit
+
SIM
Charger
input
NTC
Figure 1: MC55/56 block diagram
MC55/56_hd_v03.00 Page 21 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
3 Application Interface
MC55/56 is equipped with a 50-pin 0.5mm pitch board-to-board connector that connects to
the cellular application platform. The host interface incorporates several sub-interfaces
described in the following chapters:
• Power supply and charging control (see Chapters 3.2 and 3.3)
• Dual serial interface (see Chapter 3.9)
• Two analog audio interfaces and a digital audio interface (see Chapter 3.10)
• SIM interface (see Chapter 3.11)
Electrical and mechanical characteristics of the board-to-board connector are specified in
Chapter 6.3. Ordering information for mating connectors and cables are included.
MC55/56_hd_v03.00 Page 22 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
3.1 Operating modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 3: Overview of operating modes
Mode Function
Normal operation
GSM / GPRS SLEEP Various powersave modes set with AT+CFUN
command.
Software is active to minimum extent. If the module was
registered to the GSM network in IDLE mode, it is
registered and paging with the BTS in SLEEP mode,
too. Power saving can be chosen at different levels:
The NON-CYCLIC SLEEP mode (AT+CFUN=0)
disables the AT interface. The CYCLIC SLEEP modes
AT+CFUN=5, 6, 7, 8 and 9 alternatively activate and
deactivate the AT interfaces to allow permanent access
to all AT commands.
GSM IDLE Software is active. Once registered to the GSM
network, paging with BTS is carried out. The module is
ready to send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage
individual settings, such as DTX off/on, FR/EFR/HR,
hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data is
currently sent or received. Power consumption depends
on network settings and GPRS configuration (e.g.
multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level),
uplink / downlink data rates and GPRS configuration
(e.g. used multislot settings).
POWER DOWN Normal shutdown after sending the AT^SMSO command.
The Power Supply ASIC (PSU-ASIC) disconnects the supply voltage from the
baseband part of the circuit. Only a voltage regulator in the PSU-ASIC is active
for powering the RTC. Software is not active. The serial interfaces are not
accessible.
Operating voltage (connected to BATT+) remains applied.
Alarm mode Restricted operation launched by RTC alert function while the module is in
POWER DOWN mode. Module will not be registered to GSM network. Limited
number of AT commands is accessible.
MC55/56_hd_v03.00 Page 23 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Mode Function
Charge-only mode Limited operation for battery powered applications. Enables charging while
module is detached from GSM network. Limited number of AT commands is
accessible. There are several ways to launch Charge-only mode:
• From POWER DOWN mode: Connect charger to the charger input pin of the
external charging circuit and the module’s POWER pin when MC55/56 was
powered down by AT^SMSO.
• From Normal mode: Connect charger to the charger input pin of the external
charging circuit and the module’s POWER pin, then enter AT^SMSO.
Charge mode
during normal
operation
See Table 11 and Table 12 for the various options of waking up MC55/56 and proceeding from one
mode to another.
Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and
charging running in parallel. Charge mode changes to Charge-only mode when
the module is powered down before charging has been completed.
MC55/56_hd_v03.00 Page 24 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
3.2 Power supply
s
The power supply of MC55/56 has to be a single voltage source of V
+= 3.3V...4.8V. It
BATT
must be able to provide sufficient current in a transmit burst which typically rises to 2A.
Beyond that, the power supply must be able to account for increased current consumption if
the module is exposed to inappropriate conditions, for example antenna mismatch. For
further details see Chapters 3.2.2 and 5.4.1.
All the key functions for supplying power to the device are handled by an ASIC power supply.
The ASIC provides the following features:
• Stabilizes the supply voltages for the GSM baseband using low drop linear voltage
regulators.
• Controls the module's power up and power down procedures.
A watchdog logic implemented in the baseband processor periodically sends signals to
the ASIC, allowing it to maintain the supply voltage for all digital MC55/56 components.
Whenever the watchdog pulses fail to arrive constantly, the module is turned off.
• Delivers, across the VDD pin, a regulated voltage of 2.9V. The output voltage VDD may
be used to supply, for example, an external LED or a level shifter. However, the external
circuitry must not cause any spikes or glitches on voltage VDD. This voltage is not
available in POWER DOWN mode. Therefore, the VDD pin can be used to indicate
whether or not MC55/56 is in POWER DOWN mode.
• Provides power to the SIM interface.
The RF power amplifier is driven directly from BATT+.
3.2.1 Power supply pins on the board-to-board connector
Five BATT+ pins of the board-to-board connector are dedicated to connect the supply
voltage, five GND pins are recommended for grounding. The values stated below must be
measured directly at the reference points on the MC55/56 board (TP BATT+ and TP GND
illustrated in Figure 39).
The POWER and CHARGE pins serve as control signals for charging a Li-Ion battery.
VDDLP can be used to back up the RTC.
Table 4: Power supply pins of board-to-board connector
Signal name I/O Description Parameter
BATT+ I/O Positive operating voltage
Reference points are the
test points
GND - Ground 0 V
POWER I This line signals to the
processor that the charger
is connected.
CHARGE O Control signal for external
charging transistor
VDDLP I/O Can be used to back up
the RTC when V
applied.
See Chapter 3.8
BATT+
is not
3.3 V...4.8 V, I
The minimum operating voltage must not fall
below 3.3 V, not even in case of voltage drop.
U
UIN = 2.0 V...5.5 V
Ri = 1kΩ
I
in,max
OUT,max
= 30µA
< V
≤ 2 A during transmit burst
typ
BATT+
MC55/56_hd_v03.00 Page 25 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
3.2.2 Minimizing power losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage V
not even in a transmit burst where current consumption can rise to typical peaks of 1.6A. It
should be noted that MC55/56 switches off when exceeding these limits. Any voltage drops
that may occur in a transmit burst should not exceed 400mV. For further details see Chapter
5.4.
The best approach to reducing voltage drops is to use a board-to-board connection as
recommended, and a low impedance power source. The resistance of the power supply lines
on the host board and of a battery pack should also be considered.
Note: If the application design requires an adapter cable between both board-to-board
connectors, use a cable as short as possible in order to minimize power losses.
Example: If the length of the cable reaches the maximum length of 200mm, this connection
may cause, for example, a resistance of 50m in the BATT+ line and 50m in
the GND line. As a result, a 1.6A transmit burst would add up to a total voltage
drop of 160mV. Plus, if a battery pack is involved, further losses may occur due
to the resistance across the battery lines and the internal resistance of the battery
including its protective circuit.
never drops below 3.3V on the MC55/56 board,
BATT+
Transmit
burst 1.6A
BATT+
min. 3.3V
Figure 2: Power supply limits during transmit burst
Transmit
burst 1.6A
Ripple
Drop
The input voltage V
must be measured directly at the test points on the MC55/56 board
BATT+
(TP BATT+ and TP GND illustrated in Figure 39).
3.2.3 Monitoring power supply
To help you monitor the supply voltage you can use the AT^SBV command which returns the
voltage measured at TP BATT+ and GND.
The voltage is continuously measured at intervals depending on the operating mode on the
RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode up to 50s
when MC55/56 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in
mV) is averaged over the last measuring period before the AT^SBV command was executed.
For details please refer to [1].
MC55/56_hd_v03.00 Page 26 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
s
3.3 Power up / down scenarios
In general, be sure not to turn on MC55/56 while it is out of the operating range of voltage
and temperature stated in Chapters 5.2 and 5.3. MC55/56 would immediately switch off after
having started and detected these inappropriate conditions.
3.3.1 Turn on MC55/56
MC55/56 can be activated in a variety of ways, which are described in the following chapters:
• via ignition line /IGT: starts normal operating state (see Chapters 3.3.1.1 and 3.3.1.2)
• via POWER line: starts charging algorithm (see Chapters 3.5.3 and 0)
• via RTC interrupt: starts Alarm mode (see Chapter 3.3.1.4)
MC55/56_hd_v03.00 Page 27 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on)
To switch on MC55/56 the /IGT (Ignition) signal needs to be driven to ground level for at least
100ms and not earlier than 10ms after the last falling edge of VDD. This can be
accomplished using an open drain/collector driver in order to avoid current flowing into this
pin.
BATT+
min. 10ms
min.
/IGT
HiZ
ca. 60ms
100ms
HiZ
VDD
/TXD0
/TXD1
/DSR0
/EMERGOFF
Serial interfaces
ASC0 and ASC1
For details please see Chapter 3.3.1.2
Software
controlled
Undefined
ca. 300ms ca. 900ms
Inactive
Active
Figure 3: Power-on by ignition signal
In a battery operated MC55/56 application, the duration of the /IGT signal must be 1s
minimum when the charger is connected and you may want to go from Charge only mode to
Normal mode.
MC55/56_hd_v03.00 Page 28 of 104 16.08.2005
MC55/56 Hardware Interface Description
s
Confidential / Preliminary
Assertion of CTS indicates that the module is ready to receive data from the host application.
In addition, if configured to a fixed bit rate (AT+IPR0), the module will send the URC
“^SYSSTART” which notifies the host application that the first AT command can be sent to
the module. The duration until this URC is output varies with the SIM card and may take a
couple of seconds, particularly if the request for the SIM PIN is deactivated on the SIM card.
Please note that no “^SYSSTART” URC will be generated if autobauding (AT+IPR=0) is
enabled.
To allow the application to detect the ready state of the module we recommend using
hardware flow control which can be set with AT\Q or AT+ICF (see [1] for details). The default
setting of MC55/56 is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS
handshake). If the application design does not integrate RTS/CTS lines the host application
shall wait at least for the “^SYSSTART” URC. However, if the URCs are neither used (due to
autobauding) then the only way of checking the module’s ready state is polling. To do so, try
to send characters (e.g. “at”) until the module is responding.
3.3.1.2 Timing of the ignition process
When designing your application platform take into account that powering up MC55/56
requires the following steps.
• The ignition line cannot be operated until V
passes the level of 3.0V.
BATT+
• The ignition line shall not be operated earlier than 10ms after the last falling edge of VDD.
• 10ms after V
has reached 3.0V the ignition line can be switched low. The duration of
BATT+
the falling edge must not exceed 1ms.
• Another 100ms are required to power up the module.
• Ensure that V
does not fall below 3.0V while the ignition line is driven. Otherwise the
BATT+
module cannot be activated.
• If the VDDLP line is fed from an external power supply as explained in Chapter 3.8, the
/IGT line is HiZ before the rising edge of BATT+.
3.0V
BATT+
0V
HiZ
HiZ
/IGT
10ms
min. 100ms
max. 1ms
Figure 4: Timing of power-on process if VDDLP is not used
MC55/56_hd_v03.00 Page 29 of 104 16.08.2005
MC55/56 Hardware Interface Description
Confidential / Preliminary
3.0V
s
BATT+
0V
HiZ
HiZ
/IGT
10ms
min. 100ms
max. 1ms
Figure 5: Timing of power-on process if VDDLP is fed from external source
3.3.1.3 Turn on MC55/56 using the POWER signal
As detailed in Chapter 3.5.3, the charging adapter can be connected regardless of the
module’s operating mode.
If the charger is connected to the charger input of the external charging circuit and the
module’s POWER pin while MC55/56 is off, processor controlled fast charging starts (see
Chapter 3.5.2). MC55/56 enters a restricted mode, referred to as Charge-only mode where
only the charging algorithm will be launched.
During the Charge-only mode MC55/56 is neither logged on to the GSM network nor are the
serial interfaces fully accessible. To switch to normal operation and log on to the GSM
network, the /IGT line needs to be activated.
3.3.1.4 Turn on MC55/56 using the RTC (Alarm mode)
Another power-on approach is to use the RTC, which is constantly supplied with power from
a separate voltage regulator in the power supply ASIC. The RTC provides an alert function,
which allows the MC55/56 to wake up whilst the internal voltage regulators are off. To
prevent the engine from unintentionally logging into the GSM network, this procedure only
enables restricted operation, referred to as Alarm mode. It must not be confused with a
wake-up or alarm call that can be activated by using the same AT command, but without
switching off power.
Use the AT+CALA command to set the alarm time. The RTC retains the alarm time if
MC55/56 was powered down by AT^SMSO. Once the alarm is timed out and executed,
MC55/56 enters the Alarm mode. This is indicated by an Unsolicited Result Code (URC)
which reads:
^SYSSTART ALARM MODE
Note that this URC is the only indication of the Alarm mode and will not appear when
autobauding was activated (due to the missing synchronization between DTE and DCE upon
start-up). Therefore, it is recommended to select a fixed baudrate before using the Alarm
mode.
MC55/56_hd_v03.00 Page 30 of 104 16.08.2005
Loading...