Siemens Cellular Engine
Version 00.02
DocID: MC45_HD_01_V00.02a
Hardware
Interface
Description
MC45 Hardware Interface Description
P R E L I M I N A R Y
Document Name:
MC45 Hardware Interface Description
Version: 00.02
Date: August 12, 2002
DocId: MC45_HD_01_V00.02a
Status:
PRELIMINARY
General notes
With respect to any damages arising in connection with the described product or this document,
Siemens shall be liable according to the General Conditions on which the delivery of the described
product and this document are based.
This product is not intended for use in life support appliances, devices or systems where a malfunction
of the product can reasonably be expected to result in personal injury. Siemens AG customers using or
selling this product for use in such applications do so at their own risk and agree to fully indemnify
Siemens for any damages resulting from illegal use or resale.
Applications incorporating the described product must be designed to be in accordance with the
technical specifications provided in these guidelines. Failure to comply with any of the required
procedures can result in malfunctions or serious discrepancies in results.
Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM
products, which also apply to cellular phones must be followed.
Handheld applications such as mobile phones or PDAs incorporating the described product must be in
accordance with the guidelines for human exposure to radio frequency energy. The Specific Absorption
Rate (SAR) of the application must be evaluated and approved to be compliant with national and
international safety standards or directives.
Subject to change without notice at any time.
Copyright notice
Copying of this document and giving it to others and the use or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design.
Copyright © Siemens AG 2002
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Contents
0 Version History........................................................................................................... 7
1 Introduction ................................................................................................................ 9
1.1 Related documents ............................................................................................. 9
1.2 Terms and abbreviations....................................................................................10
1.3 Type approval ....................................................................................................13
1.4 Safety precautions .............................................................................................15
2 Product concept........................................................................................................17
2.1 MC45 key features at a glance...........................................................................18
2.2 Circuit concept ...................................................................................................21
3 Application Interface.................................................................................................22
3.1 Operating modes ...............................................................................................23
3.2 Power supply .....................................................................................................25
3.2.1 Power supply pins on the board-to-board connector.............................25
3.2.2 Minimizing power losses.......................................................................26
3.2.3 Charging control...................................................................................27
3.2.3.1 Battery pack characteristics ......................................................28
3.2.3.2 Recommended battery pack .....................................................29
3.2.3.3 Implemented charging technique ..............................................30
3.2.3.4 Operating modes during charging.............................................31
3.2.3.5 Charger requirements...............................................................32
3.3 Power up / down scenarios ................................................................................33
3.3.1 Turn on MC45 ......................................................................................33
3.3.1.1 Turn on MC45 using the ignition line /IGT (Power on)...............33
3.3.1.2 Timing of the ignition process ...................................................34
3.3.1.3 Turn on MC45 using the POWER signal...................................35
3.3.1.4 Turn on MC45 using the RTC (Alarm mode).............................35
3.3.2 Power saving........................................................................................36
3.3.2.1 No power saving (AT+CFUN=1)................................................36
3.3.2.2 NON-CYCLIC SLEEP mode (AT+CFUN=0)..............................36
3.3.2.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7 and 8).....................36
3.3.2.4 Timing of the /CTS signal in CYCLIC SLEEP modes ................37
3.3.2.5 Wake up MC45 from SLEEP mode...........................................39
3.3.3 Turn off MC45 ......................................................................................40
3.3.3.1 Turn off MC45 using AT command ...........................................40
3.3.3.2 Emergency shutdown using /EMERGOFF pin...........................41
3.3.4 Automatic shutdown .............................................................................42
3.3.4.1 Temperature dependent shutdown............................................42
3.3.4.2 Undervoltage shutdown if battery NTC is present .....................43
3.3.4.3 Undervoltage shutdown if no battery NTC is present ................43
3.3.4.4 Shutdown in the event of overvoltage .......................................44
3.3.5 Summary of state transitions................................................................45
3.4 RTC backup.......................................................................................................46
3.5 Serial interfaces .................................................................................................47
3.6 Audio interfaces .................................................................................................49
3.6.1 Microphone circuit ................................................................................50
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3.6.2 Speech processing...............................................................................51
3.6.3 DAI timing.............................................................................................51
3.7 SIM interface......................................................................................................53
3.7.1 Requirements for using the CCIN pin ...................................................54
3.7.2 Design considerations for SIM card holder...........................................55
3.7.3 Grounding the SIM interface.................................................................56
3.8 Control signals ...................................................................................................57
3.8.1 Inputs ...................................................................................................57
3.8.2 Outputs.................................................................................................58
3.8.2.1 Synchronization signal ..............................................................58
3.8.2.2 Using the SYNC pin to control a status LED .............................59
3.8.2.3 Behaviour of the /RING0 line (RS-232(0) interface only)...........60
3.9 Electrical specifications of the application interface............................................61
4 Antenna interface (antenna reference point – ARP) ...............................................65
5 Physical characteristics ...........................................................................................66
5.1 Mechanical dimensions of MC45........................................................................66
5.2 Mounting MC45 onto the application platform ....................................................69
5.3 Board-to-board connector ..................................................................................70
5.3.1 Mechanical dimensions of the Hirose DF12 connector .........................71
5.3.2 Adapter cabling ....................................................................................71
5.4 Antenna design ..................................................................................................72
5.4.1 Hirose antenna connector ....................................................................72
5.4.2 Antenna pad.........................................................................................75
6 Electrical, reliability and radio characteristics .......................................................76
6.1 Absolute maximum ratings.................................................................................76
6.2 Operating temperatures .....................................................................................76
6.3 Reliability characteristics ....................................................................................77
6.4 Power supply ratings..........................................................................................78
6.4.1 Current consumption during transmit burst...........................................79
6.5 Electrical characteristics of the voiceband part...................................................81
6.5.1 Setting audio parameters by AT commands.........................................81
6.5.2 Audio programming model ...................................................................82
6.5.3 Characteristics of audio modes ............................................................83
6.5.4 Voiceband receive path ........................................................................84
6.5.5 Voiceband transmit path.......................................................................85
6.6 Air interface........................................................................................................86
6.7 Electrostatic discharge.......................................................................................87
7 Reference Approval ..................................................................................................88
7.1 Reference Equipment ........................................................................................88
8 List of parts and accessories...................................................................................89
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Figures
Figure 1: MC45 block diagram .............................................................................................21
Figure 2: Power supply limits during transmit burst ..............................................................26
Figure 3: Schematic of approved charging transistor, trickle charging and ESD protection ..27
Figure 4: Battery pack circuit diagram ..................................................................................28
Figure 5: Charging process..................................................................................................30
Figure 6: Power-on by ignition signal....................................................................................33
Figure 7: Timing of power-on process if VDDLP is not used ................................................34
Figure 8: Timing of power-on process if VDDLP is fed from external source........................34
Figure 9: Timing of /CTS signal (example for a 2.12 s paging cycle)....................................37
Figure 10: Beginning of power saving if CFUN=5.................................................................38
Figure 11: Deactivating GSM engine by /EMERGOFF signal...............................................41
Figure 12: RTC supply from capacitor..................................................................................46
Figure 13: RTC supply from rechargeable battery................................................................46
Figure 14: RTC supply from non-chargeable battery............................................................46
Figure 15: RS-232 interfaces ...............................................................................................47
Figure 16: Audio block diagram............................................................................................49
Figure 17: Schematic of microphone inputs .........................................................................50
Figure 18: DAI timing on transmit path .................................................................................52
Figure 19: DAI timing on receive path ..................................................................................52
Figure 20: SIM card holder of DSB45 Support Box ..............................................................55
Figure 21: Connecting a separate ground for SIM interface .................................................56
Figure 22: SYNC signal during transmit burst ......................................................................58
Figure 23: LED Circuit (Example).........................................................................................59
Figure 24: Incoming voice call ..............................................................................................60
Figure 25: Incoming data call ...............................................................................................60
Figure 26: Pin assignment (top view on MC45) ....................................................................61
Figure 27: MC45 – top view..................................................................................................66
Figure 28: Mechanical dimensions of MC45.........................................................................67
Figure 29: MC45 bottom view...............................................................................................68
Figure 30: Hirose DF12C receptacle on MC45.....................................................................70
Figure 31: Header Hirose DF12 series.................................................................................70
Figure 32: Mechanical dimensions of Hirose DF12 connector..............................................71
Figure 33: Mechanical dimensions of U.FL-R-SMT connector..............................................72
Figure 34: U.FL-R-SMT connector with U.FL-LP-040 plug ...................................................73
Figure 35: U.FL-R-SMT connector with U.FL-LP-066 plug ...................................................73
Figure 36: Specifications of U.FL-LP-(V)-040(01) plug.........................................................74
Figure 37: Restricted area around antenna pad ...................................................................75
Figure 38: Typical current consumption vs. power level .......................................................79
Figure 39: Typical current consumption vs. return loss.........................................................80
Figure 40: AT audio programming model .............................................................................82
Figure 41: Reference equipment for approval ......................................................................88
Tables
Table 1: MC45 key features .................................................................................................18
Table 2: Coding schemes and maximum net data rates over air interface ...........................20
Table 3: Overview of operating modes.................................................................................23
Table 4: Power supply pins of board-to-board connector .....................................................25
Table 5: Bill of material for external charging circuit .............................................................27
Table 6: Specifications of XWODA battery pack ..................................................................29
Table 7: Comparison Charge-only and Charge mode ..........................................................31
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Table 8: AT commands available in Charge-only mode .......................................................32
Table 9: AT commands available in Alarm mode .................................................................35
Table 10: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes............................39
Table 11: Temperature dependent behaviour.......................................................................43
Table 12: State transitions of MC45 .....................................................................................45
Table 13: Signals of the SIM interface (board-to-board connector) ......................................53
Table 14 : Pin assignment of Molex SIM card holder on DSB45 Support Box ......................55
Table 15: Input control signals of the MC45 module.............................................................57
Table 16: MC45 synchronization signal (if SYNC pin is set to mode 0 via AT^SSYNC)........58
Table 17: Coding of the status LED......................................................................................59
Table 18: MC45 ring signal...................................................................................................60
Table 19: Pin assignment and electrical description of application interface ........................62
Table 20: Return loss ...........................................................................................................65
Table 21: Ordering information DF12 series.........................................................................70
Table 22: Electrical and mechanical characteristics of the Hirose DF12C connector............70
Table 23: Product specifications of U.FL-R-SMT connector .................................................72
Table 24: Material and finish of U.FL-R-SMT connector and recommended plugs...............73
Table 25: Ordering information for Hirose U.FL Series.........................................................75
Table 26: Absolute maximum ratings ...................................................................................76
Table 27: Operating temperatures........................................................................................76
Table 28: Summary of reliability test conditions....................................................................77
Table 29: Power supply ratings ............................................................................................78
Table 30: Audio parameters adjustable by AT command .....................................................81
Table 31: Voiceband characteristics (typical), all values preliminary.....................................83
Table 32: Voiceband receive path ........................................................................................84
Table 33: Voiceband transmit path.......................................................................................85
Table 34: Air Interface..........................................................................................................86
Table 35: Measured electrostatic values ..............................................................................87
Table 36: List of parts and accessories ................................................................................89
Table 37: Molex sales contacts (subject to change) .............................................................90
Table 38: Hirose sales contacts (subject to change) ............................................................90
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0 Version History
Preceding document: "MC45 Hardware Interface Description" Version 00.02
New document: "MC45 Hardware Interface Description" Version 00.02a
Chapter Page What is new
Throughout this manual: Replaced product photo of MC45.
1.4 15f Added notes regarding compliance with FCC guidelines
Preceding document: "MC45 Hardware Interface Description" Version 00.01
New document: "MC45 Hardware Interface Description" Version 00.02
Chapter Page What is new
Throughout this manual: All RS-232 signals, /IGT signal and /EMERGOFF are now preceded by “/” to
indicate that the signals are active low.
2.1
3.5
2.1 18ff Deleted statements on current consumption and storage temperature
2.2 21 Modified block diagram.
3.2
3.9
3.2.1 25 Deleted parameter of CHARGE pin.
3.2.3 27 Revised description of trickle and fast charging.
3.3.2 36 Revised information on power saving.
3.7.2 55 Figure 20 updated. Note regarding capacitors C1205 and C1206 added.
3.9 61ff Changed numbering of pins.
4 65 Removed introduction.
5.1 66ff Updated MC45 drawings. Added bottom view and information about test
18ff
47
25
61
Deleted CMOS. The RS-232 interface operates at 2.65V.
Serial interfaces: Autobauding also supported at 230kbps
VDD pin recommended, for example, for LED or level shifter.
Corrected comments on BATT+ pin, VDD pin, VDDLP pin.
Corrected signal parameters of RS-232 interfaces and associated comments
(no more necessary to connect unused input pins to VDD).
Corrected input voltage (peak to peak).
points and ground pad.
5.2 69 Added recommendations for installation.
5.3 70 Table 21: Corrected HRS number of DF12C receptacle.
Table 22: Added insertion and withdrawal force.
5.4.1 72ff Added specifications of U.FL-LP-(V)-040(01
6.1 76 Table 26: Added differential load resistance between EPN and EPP
6.2 76 Corrected description (without modifying operating temperatures).
6.3 77 Added information about reliability characteristics and temperature.
6.5 81 Added test points
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6.4.1 79ff Added current consumption during transmit burst.
6.5 81ff Added notes on AT commands where applicable.
Table 31: Modified MIC input signal in modes 5 and 6.
Table 32: Added Differential load capacitance 1000pF.
Table 33: Voiceband transmit path: Corrected input voltage (peak to peak).
6.6 86 Updated Table 34: Air Interface
8 89 Added ordering information for VOTRONIC handset
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1 Introduction
This document describes the hardware interface of the Siemens MC45 module that connects
to the cellular device application and the air interface. As MC45 is intended to integrate with
a wide range of application platforms, all functional components are described in great detail.
So this guide covers all information you need to design and set up cellular applications
incorporating the MC45 module. It helps you quickly retrieve interface specifications,
electrical and mechanical details and, last but not least, information on the requirements to
be considered for integrating further components.
1.1 Related documents
[1] MC45 AT Command Set for Version 00.02
[2] MC45 GPRS Startup User's Guide (in preparation)
[3] MC45 Remote-SAT User's Guide, as of Version 00.02 (in preparation)
[4] DSB45 Support Box - Evaluation Kit for Siemens Cellular Engines
[5] Application Note 16: Upgrading MC45 Firmware (in preparation)
[6] Application Note 14: Audio and Battery Parameter Download
[7] MC45 Multiplexer User's Guide, as of Version 00.02 (in preparation)
Prior to using the MC45 engines be sure to carefully read and understand the latest product
information provided in the Release Notes (not available for release 00.02.)
To visit the Siemens Website you can use the following link:
http://www.siemens.com/wm
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1.2 Terms and abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
B Thermistor Constant
B2B Board-to-board connector
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
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Abbreviation Description
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion Lithium-Ion
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSU Power Supply Unit
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
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Abbreviation Description
RMS Root Mean Square (value)
ROM Read-only Memory
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMS Short Message Service
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM engine)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Phonebook abbreviations
FD SIM fixdialling phonebook
LD SIM last dialling phonebook (list of numbers most recently dialled)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ME Mobile Equipment phonebook
ON Own numbers (MSISDNs) stored on SIM or ME
RC Mobile Equipment list of received calls
SM SIM phonebook
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1.3 Type approval
MC45 is designed to comply with the directives and standards listed below. Please note that
the product is still in a pre-release state and, therefore, type approval and testing procedures
have not yet been completed.
European Directives
99/05/EC Directive of the European Parliament and of the council of 9 March
1999 on radio equipment and telecommunications terminal
equipment and the mutual recognition of their conformity, in short
referred to as R&TTE Directive 1999/5/EC
89/336/EC Directive on electromagnetic compatibility
73/23/EC Directive on electrical equipment designed for use within certain
voltage limits (Low Voltage Directive)
North American Approval
FCC US Equipment Authorization
UL Product Safety Certification
Standards of type approval
ETS 300 607-1 Digital cellular telecommunications system (Phase 2);
Mobile Station (MS) conformance specification;
(equal GSM 11.10-1=>equal 3GPP51.010-1)
ETSI EN 301 511 V7.0.1 (2000-12) Candidate Harmonized European Standard
(Telecommunications series) Global System for Mobile
communications (GSM); Harmonized standard for mobile stations in
the GSM 900 and DCS 1800 bands covering essential requirements
under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11
version 7.0.1 Release 1998)
ETSI EN 301 489-7 V1.1.1 (2000-09) Candidate Harmonized European Standard
(Telecommunications series) Electro Magnetic Compatibility and
Radio spectrum Matters (ERM); Electro Magnetic Compatibility
(EMC) standard for radio equipment and services; Part 7: Specific
conditions for mobile and portable radio and ancillary equipment of
digital cellular radio telecommunications systems (GSM and DCS)
EN 60 950 Safety of information technology equipment (2000)
UL 60 950 Safety requirements
CFR Title 47 Code of Federal Regulations, Part 2 and Part 15
(Telecommunications, PCS)
Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
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SAR requirements specific to handheld mobiles
Mobile phones, PDAs or other handheld transmitters and receivers incorporating a GSM
module must be in accordance with the guidelines for human exposure to radio frequency
energy. This requires the Specific Absorption Rate (SAR) of handheld MC45 based
applications to be evaluated and approved for compliance with national and/or international
regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for handheld operation. For
European and US markets the relevant directives are mentioned below. It is the
responsibility of the manufacturer of the final product to verify whether or not further
standards, recommendations of directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to
Electromagnetic Fields (EMFs) from Mobile Telecommunication
Equipment (MTE) in the frequency range 30MHz-6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to
electromagnetic fields (300 MHz - 3 GHz)
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1.4 Safety precautions
The following safety precautions must be observed during all phases of the operation,
usage, service or repair of any cellular terminal or mobile incorporating MC45. Manufacturers
of the cellular terminal are advised to convey the following safety information to users and
operating personnel and to incorporate these guidelines into all manuals supplied with the
product. Failure to comply with these precautions violates safety standards of design,
manufacture and intended use of the product. Siemens AG assumes no liability for customer
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the
use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so
by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment
and hearing aids can be affected by interference from cellular terminals or
mobiles placed close to the device. If in doubt about potential danger, contact
the physician or the manufacturer of the device to verify that the equipment is
properly shielded. Pacemaker patients are advised to keep their hand-held
mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless
appliances in an aircraft is forbidden to prevent interference with
communications systems. Failure to observe these instructions may lead to
the suspension or denial of cellular services to the offender, legal action, or
both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol
stations, fuel depots, chemical plants or where blasting operations are in
progress. Operation of any electrical equipment in potentially explosive
atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency
energy while switched on. Remember that interference can occur if it is used
close to TV sets, radios, computers or inadequately shielded equipment.
Follow any special regulations and always switch off the cellular terminal or
mobile wherever forbidden, or when you suspect that it may cause
interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for handsfree
operation. Before making a call with a hand-held terminal or mobile, park the
vehicle.
Handsfree devices must be installed by qualified personnel. Faulty installation
or operation can constitute a safety hazard.
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IMPORTANT!
SOS
Compliance with FCC guidelines
Cellular terminals or mobiles operate using radio signals and cellular
networks cannot be guaranteed to connect in all conditions. Therefore, you
should never rely solely upon any wireless device for essential
communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services
or phone features are in use (e.g. lock functions, fixed dialling etc.). You may
need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the
cellular terminal or mobile.
Fix-mount and mobile devices incorporating MC45 modules must be designed to maintain a
minimum separation distance of 20 cm between the antenna and the end user to satisfy RF
exposure requirements for mobile transmitting devices.
For portable devices incorporating MC45 modules the manufacturer of the final device is
responsible to perform SAR measurements.
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2 Product concept
Designed for use on any GSM network in the world, Siemens MC45 is a tri-band GSM/GPRS
engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM
1900 MHz. MC45 features GPRS multislot class 10 and supports the GPRS coding schemes
CS-1, CS-2, CS-3 and CS-4.
To save space on the application platform, MC45 comes as an extremely slim and compact
module. This makes it ideally suited for a broad range of mobile computing devices, such as
laptops, notebooks, multimedia appliances, and particularly offers easy integration with
PDAs, pocket organizers or miniature mobile phones.
The tiny MC45 module incorporates all you need to create high-performance GSM/GPRS
solutions: baseband processor, power supply ASIC, complete radio frequency circuit
including a power amplifier and antenna interface. The power amplifier is directly fed from
the supply voltage BATT+. The MC45 software is residing in a flash memory device. An
additional SRAM enables MC45 to meet the demanding requirements of GPRS connectivity.
The physical interface to the cellular application is made through a board-to-board
connector. It consists of 50 pins, required for controlling the unit, transferring data and audio
signals and providing power supply lines.
MC45 comprises two serial (RS-232) interfaces giving you maximum flexibility for easy
integration with the Man-Machine Interface (MMI).
An extremely versatile audio concept offers various audio interfaces, each available on the
board-to-board connector: a digital audio interface (DAI) and two analog audio interfaces.
This allows you to connect up to three audio devices in any combination, all at the same
time. Using AT commands you can easily switch back and forth and select different audio
modes.
The external dual-band or triple-band antenna can be connected optionally to a connector on
the top side or to a pad on the bottom side.
For battery powered applications, MC45 features a charging control which can be used to
charge a Li-Ion battery. The charging circuit must be implemented outside the module on the
application platform.
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2.1 MC45 key features at a glance
Table 1: MC45 key features
Feature Implementation
Power supply Single supply voltage 3.3V – 4.5V
GSM class Small MS
Frequency bands
Transmit power
GPRS connectivity
Temperature range
Temperature control
and auto switch-off
DATA GPRS:
CSD:
WAP:
· Tri-band EGSM 900, GSM 1800, GSM 1900
· Compliant to GSM Phase 2/2+
· Class 4 (2W) at EGSM900
· Class 1 (1W) at GSM1800 and GSM 1900
· GPRS multi-slot class 10
· GPRS mobile station class B
· Normal operation: -20°C to +55°C
· Restricted operation: -25°C to -20°C and +55°C to +70°C
· Constant temperature control prevents damage from the module when
the specified temperature is exceeded.
· GPRS data downlink transfer: max. 85.6 kbps (see Table 2)
· GPRS data uplink transfer: max. 21.4 kbps (see Table 2)
· Coding scheme: CS-1, CS-2, CS-3 and CS-4
· MC45 supports the two protocols PAP (Password Authentication
Protocol) and CHAP (Challenge Handshake Authentication Protocol)
commonly used for PPP connections.
· Support of Packet Switched Broadcast Control Channel (PBCCH) allows
you to benefit from enhanced GPRS performance when offered by the
network operators.
· CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent, V.110
· Unstructured Supplementary Services Data (USSD) support
· WAP compliant
SMS
FAX Group 3: Class 1, Class 2
MC45_HD_01_V00.02a Page 18 of 90 12.08.2002
· MT, MO, CB, Text and PDU mode
· SMS storage: SIM card plus 25 SMS locations in the mobile equipment
· Transmission of SMS alternatively over CSD or GPRS. Preferred mode
can be user-defined.
MC45 Hardware Interface Description
P R E L I M I N A R Y
Feature Implementation
SIM interface
External antenna Connected via 50 Ohm antenna connector or antenna pad
Audio interfaces Two analog audio interfaces, one digital audio interface (DAI)
Speech codec
Two serial interfaces:
RS-232(0), RS-232(1)
· Supported SIM card: 3V
· External SIM card reader has to be connected via interface connector
(note that card reader is not part of MC45)
· Half Rate (ETS 06.20)
· Full Rate (ETS 06.10)
· Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
· 2.65V level, bi-directional bus for AT commands and data
· RS-232(0) – full-featured RS-232 interface. Supports RTS0/CTS0
hardware handshake and software XON/XOFF flow control. Multiplex
ability according to GSM 07.10 Multiplexer Protocol.
· RS-232(1) - 4-wire RS-232 interface. Supports RTS1/CTS1 hardware
handshake.
· Baud rate: 300bps ... 230kbps on RS-232(0), RS-232(1)
· Autobauding: RS-232(0) only: Supported baud rates are 1200, 2400,
4800, 9600, 19200, 38400, 57600, 115200, 230400 bps
Phonebook
management
SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98
Real time clock Implemented
Timer function Programmable via AT command
Physical characteristics Size: 53 +0.2 x 34 +0.2 x 3.5+0.3 mm
Firmware upgrade Firmware upgradable over serial interface and SIM interface
Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type
Supported phonebook types: SM, FD, LD, MC, RC, ON, ME
Weight: 10g
approve Siemens cellular engines and provide a sample configuration for
application engineering. See Chapter 8 for ordering information.
MC45_HD_01_V00.02a Page 19 of 90 12.08.2002
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P R E L I M I N A R Y
Table 2: Coding schemes and maximum net data rates over air interface
Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots
CS-1: 9.05 kbps 18.1 kbps 36.2 kbps
CS-2: 13.4 kbps 26.8 kbps 53.6 kbps
CS-3: 15.6 kbps 31.2 kbps 62.4 kbps
CS-4: 21.4 kbps 42.8 kbps 85.6 kbps
Please note that the values stated above are maximum ratings which, in practice, are influenced by a
great variety of factors, primarily, for example, traffic variations and network coverage.
MC45_HD_01_V00.02a Page 20 of 90 12.08.2002
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P R E L I M I N A R Y
2.2 Circuit concept
Figure 1 shows a block diagram of the MC45 module and illustrates the major functional
components:
· GSM / GPRS baseband processor
· Power supply ASIC
· Flash
· SRAM
· GSM RF section incl. transceiver and RF power amplifier
· Antenna interface
· Application interface (board-to-board connector)
RF Power
Amplifier
RF Part
Measuring
Network
MC45
Interface
RF - Baseband
Send
Receive
Control
GSM Controller
CCRST
CCCLK
CCIO
5
CCIN
(GND)
6
Power
Supply
ASIC
Figure 1: MC45 block diagram
Data
Adr
Control
Data
Control
Adr
5
9
8
RS232(0)
4
RS232(1)
6
SIM Interface
EMERGOFF
POWER
CHARGE
5
5
BATT_TEMP
DAI
2x Audio
SYNC
VDD
VDDLP
IGT
BATT+
GND
SRAM
Flash
CCIN
CCVCC
4
SIM
(50 pins)
Application Interface
Ext.
Charging
Circuit
POWER
NTC
+
MC45_HD_01_V00.02a Page 21 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3 Application Interface
MC45 is equipped with a 50-pin 0.5mm pitch board-to-board connector that connects to the
cellular application platform. The host interface incorporates several sub-interfaces
described in the following chapters:
· Power supply and charging control (see Chapters 3.2 and 3.3)
· Dual serial interface (see Chapter 3.5)
· Two analog audio interfaces and a digital audio interface (see Chapter 3.6)
· SIM interface (see Chapter 3.7)
Electrical and mechanical characteristics of the board-to-board connector are specified in
Chapter 5.3. Ordering information for mating connectors and cables are included.
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3.1 Operating modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 3: Overview of operating modes
Mode Function
Normal operation
GSM / GPRS SLEEP Various powersave modes set with AT+CFUN
command.
Software is active to minimum extent. If the module was
registered to the GSM network in IDLE mode, it is
registered and paging with the BTS in SLEEP mode,
too. Power saving can be chosen at different levels: The
NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the
AT interface. The CYCLIC SLEEP modes AT+CFUN=5,
6, 7 and 8 alternatingly activate and deactivate the AT
interfaces to allow permanent access to all AT
commands.
GSM IDLE Software is active. Once registered to the GSM network,
paging with BTS is carried out. The module is ready to
send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage
individual settings, such as DTX off/on, FR/EFR/HR,
hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data is
currently sent or received. Power consumption depends
on network settings and GPRS configuration (e.g.
multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level),
uplink / downlink data rates and GPRS configuration
(e.g. used multislot settings).
POWER DOWN Normal shutdown after sending the AT^SMSO command.
The Power Supply ASIC (PSU-ASIC) disconnects the supply voltage from the
baseband part of the circuit. Only a voltage regulator in the PSU-ASIC is active
for powering the RTC. Software is not active. The RS-232 interfaces are not
accessible.
Operating voltage (connected to BATT+) remains applied.
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Mode Function
Alarm mode Restricted operation launched by RTC alert function while the module is in
POWER DOWN mode. Module will not be registered to GSM network. Limited
number of AT commands is accessible.
If application is battery powered: No charging functionality in Alarm mode.
Charge-only mode Limited operation for battery powered applications. Enables charging while
module is detached from GSM network. Limited number of AT commands is
accessible. There are several ways to launch Charge-only mode:
· From POWER DOWN mode: Connect charger to the POWER pin of MC45
when engine was powered down by AT^SMSO.
· From Normal mode: Connect charger to the POWER pin of MC45, then
enter AT^SMSO.
Charge mode
during normal
operation
Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and
charging running in parallel. Charge mode changes to Charge-only mode when
the module is powered down before charging has been completed.
See Table 10 and Table 12 for the various options of waking up MC45 and proceeding from one mode
to another.
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3.2 Power supply
The power supply of MC45 has to be a single voltage source of V
= 3.3V...4.5V. It must
BATT+
be able to provide sufficient current in a transmit burst which typically rises to 2A. Beyond
that, the power supply must be able to account for increased current consumption if the
module is exposed to inappropriate conditions, for example antenna mismatch. For further
details see Chapters 3.2.2 and 6.4.1.
All the key functions for supplying power to the device are handled by an ASIC power
supply. The ASIC provides the following features:
· Stabilizes the supply voltages for the GSM baseband using low drop linear voltage
regulators.
· Controls the module's power up and s procedures.
A watchdog logic implemented in the baseband processor periodically sends signals to
the ASIC, allowing it to maintain the supply voltage for all digital MC45 components.
Whenever the watchdog pulses fail to arrive constantly, the module is turned off.
· Delivers, across the VDD pin, a regulated voltage of 2.9V. The output voltage VDD may
be used to supply, for example, an external LED or a level shifter. However, the external
circuitry must not cause any spikes or glitches on voltage VDD. This voltage is not
available in POWER DOWN mode. Therefore, the VDD pin can be used to indicate
whether or not MC45 is in POWER DOWN mode.
· Includes a switch to provide power to the SIM interface.
The RF power amplifier is driven directly from BATT+.
3.2.1 Power supply pins on the board-to-board connector
Five BATT+ pins of the board-to-board connector are dedicated to connect the supply
voltage, five GND pins are recommended for grounding. The POWER and CHARGE pins
serve as control signals for charging a Li-Ion battery. VDDLP can be used to back up the
RTC.
Table 4: Power supply pins of board-to-board connector
Signal name I/O Description Parameter
BATT+ I/O Positive operating voltage
GND - Ground 0 V
POWER I This line signalizes to the
processor that the charger
is connected.
CHARGE O Control signal for external
charging transistor
VDDLP I/O Can be used to back up the
RTC when V
applied.
See Chapter 3.4
BATT+
is not
3.3 V...4.5 V, I
The minimum operating voltage must not fall
below 3.3 V, not even in case of voltage drop.
U
UIN = 2.0 V...5.5 V
Ri = 1kW
I
in,max
OUT,max
= 30µA
< V
£ 2 A during transmit burst
typ
BATT+
MC45_HD_01_V00.02a Page 25 of 90 12.08.2002
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P R E L I M I N A R Y
3.2.2 Minimizing power losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage V
even in a transmit burst where current consumption can rise to peaks of 2A. It should be
noted that MC45 switches off when exceeding these limits. Any voltage drops that may occur
in a transmit burst should not exceed 400mV. For further details see Chapter 6.4.
The best approach to reducing voltage drops is to use a board-to-board connection as
recommended, and a low impedance power source. The resistance of the power supply lines
on the host board and of a battery pack should also be considered.
Note: If the application design requires an adapter cable between both board-to-board
connectors, use a flex cable as short as possible in order to minimize power
losses.
Example: If the length of the flex cable reaches the maximum length of 200mm, this
connection may cause, for example, a resistance of 50m! in the BATT+ line and
50m! in the GND line. As a result, a 2A transmit burst would add up to a total
voltage drop of 200mV. Plus, if a battery pack is involved, further losses may
occur due to the resistance across the battery lines and the internal resistance of
the battery.
never drops below 3.3 V on the MC45 board, not
BATT+
BATT+
min. 3.3V
Transmit
burst 2A
Figure 2: Power supply limits during transmit burst
Transmit
burst 2A
max. 400mV
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3.2.3 Charging control
MC45 integrates a charging management for Li-Ion batteries. You can skip this chapter if
charging is not your concern, or if you are not using the implemented charging algorithm.
MC45 has no on-board charging circuit. To benefit from the implemented charging
management you are required to install a charging circuit within your application. In this
case, MC45 needs to be powered from a Li-Ion battery pack, e.g. as specified in Table 6.
The module only delivers, via its POWER line and CHARGE line, the control signals needed
to start and stop the charging process. The charging circuit should include a transistor and
should be designed as illustrated in Figure 3. A list of parts recommended for the external
circuit is given in Table 5.
BATT_TEMP
1
/5 ESDA6V1-5W6
470R
1SS355
BATT+POWER
pcb spark
gap
100nF 10k
4V3
SI3441DV
CRS04
3k3
1
/5 ESDA6V1-5W6
CHARGE
Figure 3: Schematic of approved charging transistor, trickle charging and ESD protection
Table 5: Bill of material for external charging circuit
Part Description First supplier Second supplier
SI3441DV
1SS355 100mA Si-diode (UMD2) ROHM: 1SS355TE-18 Toshiba: 1SS352TPH3
p-chan 2.5V (G-S) MOSFET
(TSOP-6)
VISHAY: SI3441DV-T1 NEC: UPA1911TE-T1
CRS04 1A Shottky diode Toshiba: CRS04 -
4V3
250mW; 200mA;
4.3V Z-Diode (SOD323)
Philips: PDZ4.3B
ROHM: UDZS4.3B
UDZ4.3B
ESDA6V1-5W6 ESD protection transil array STM: ESDA6V1-5W6 -
470R, 3k3, 10k Resistor, e.g. 0805 or 0603 - -
100nF Ceramic capacitor 50V - -
PCB spark gap 0.2mm spark gap on PCB - -
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3.2.3.1 Battery pack characteristics
The charging algorithm has been optimized for a Li-Ion battery pack that meets the
characteristics listed below. It is recommended that the battery pack you want to integrate
into your MC45 application is compliant with these specifications. This ensures reliable
operation, proper charging and, particularly, allows you to monitor the battery capacity using
the AT^SBC command (see [1] for details). Failure to comply with these specifications might
cause AT^SBC to deliver incorrect battery capacity values. A battery pack especially
designed to operate with MC45 modules is specified in Chapter 3.2.3.2.
· Li-Ion battery pack specified for a maximum charging voltage of 4.2 V and a capacity of
800 mAh. Battery packs with a capacity down to 600 mAh or more than 800 mAh are
allowed, too.
· Since charging and discharging largely depend on the battery temperature, the battery
pack should include an NTC resistor. If the NTC is not inside the battery it must be in
thermal contact with the battery. The NTC resistor must be connected between
BATT_TEMP and GND. Required NTC characteristics are: 10 kΩ +
3435K +
3% (alternatively acceptable: 10 kΩ +2% @ 25°C, B
25/50
5% @ 25°C, B
= 3370K +3%). Please
note that the NTC is indispensable for proper charging, i.e. the charging process will not
start if no NTC is present.
· Ensure that the pack incorporates a protection circuit capable of detecting overvoltage
(protection against overcharging), undervoltage (protection against deep discharging)
and overcurrent. The circuit must be insensitive to pulsed current.
· On the MC45 module, a built-in measuring circuit constantly monitors the supply voltage.
In the event of undervoltage, it causes MC45 to power down. Undervoltage thresholds
are specific to the battery pack and must be evaluated for the intended model. When you
evaluate undervoltage thresholds, consider both the current consumption of MC45 and
the application circuit.
· The internal resistance of the battery and the protection should be as low as possible. It
is recommended not to exceed 150m", even in extreme conditions at low temperature.
The battery cell must be insensitive to rupture, fire and gasing under extreme conditions
of temperature and charging (voltage, current).
· The battery pack must be protected from reverse pole connection. For example, the
casing should be designed to prevent the user from mounting the battery in reverse
orientation.
· The battery pack must be approved to satisfy the requirements of CE conformity.
Figure 4 shows the circuit diagram of a typical
to BATT+
to BATT_TEMP to GND
battery pack design that includes the
protection elements described above.
J
25/85
=
of
NTC
Protection Circuit
-
+
Figure 4: Battery pack circuit diagram
MC45_HD_01_V00.02a Page 28 of 90 12.08.2002
Battery cell
Polyfuse
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.2.3.2 Recommended battery pack
The following battery pack has been especially designed for use with MC45 modules.
Table 6: Specifications of XWODA battery pack
Product name, type XWODA, Li-Ion, 3.6V, 800mAh
Vendor
To place orders or obtain more
information please contact:
Shenzhen Xwoda Electronic Co., Ltd
Unit 3003, Yingjingyuan,Zhongdian Garden,
Shenzhen 518032
P.R.China
Contact:
Edward Lau or Andy Zhao
Phone: +86-755-7623789 ext. 314
Fax: +86-755-7623078
Email: Edward-lau@xwoda.com.cn
Email: Andy-zhao@Xwoda.com.cn
Nominal voltage 3.6V
Capacity 800mAh
NTC 10k" ± 5% @ 25°C, B (25/85)=3435K ± 3%
Overcharge detection voltage 4.325 ± 0.025V
Overcharge release voltage 4.075 ± 0.025V
Overdischarge detection voltage 2.5 ± 0.05V
Overdischarge release voltage 2.9 ± 0.5V
Overcurrent detection 3 ± 0.5A
Nominal working current <5µA
Current of low voltage detection 0.5µA
Overcurrent detection delay time 8~16ms
Short detection delay time 50µs
Overdischarge detection delay time 31~125ms
Overcharge detection delay time 1s
Internal resistance <130m"
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3.2.3.3 Implemented charging technique
If the external charging circuit follows the recommendation of Figure 3, the charging process
consists of trickle charging and processor controlled fast charging. For this solution, the fast
charging current provided by the charger or any other external source must be limited to
500mA.
Trickle charging
· Trickle charging starts when the charger is connected to the POWER pin of the external
charging circuit. The charging current depends on the voltage difference between the
pins POWER and BATT+ of the external charging circuit.
· Trickle charging stops when the battery voltage reaches 3.6V.
Fast charging
· After trickle charging has raised the battery voltage to 3.2V within 60 minutes +
connecting the charger, the power ASIC turns on and wakes up the baseband processor.
Now, processor controlled fast charging begins.
If the battery voltage was already above 3.2V, processor controlled fast charging starts
just after the charger was connected to the POWER pins of the external charging circuit
and of the module. If MC45 was in POWER DOWN mode, it turns on and enters the
Charge-only mode along with fast charging (see also Chapter 3.3.1.3).
· Fast charging delivers a constant current until the battery voltage reaches 4.2V and then
proceeds with varying charge pulses. As shown in Figure 5, the pulse duty cycle is
reduced to adjust the charging procedure and prevent the voltage from overshooting
beyond 4.2V. Once the pulse width reaches the minimum of 100ms and the duty cycle
does not change for 2 minutes, fast charging is completed.
· Fast charging can only be accomplished in a temperature range from 0°C to +45°C.
Voltage
10% from
4.3
4.2
3.8
3.4
3.0
Constant current
100ms 2 ... 0.1s
t
= 100 ms
OFF
100ms 0.1 ... 2s
t
= 100 ms
ON
Time
Figure 5: Charging process
Note: Do not connect the charger to the BATT+ lines. Only the POWER input of the
charging circuit is intended as input for charging current! The POWER pin of MC45
is the input only for indicating a connected charger!
The battery manufacturer must guarantee that the battery complies with the
described charging technique.
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What to do if software controlled charging does not start up?
If trickle charging fails to raise the battery voltage to 3.2V within 60 minutes +
10%, processor
controlled charging does not begin. To start fast charging you can do one of the following:
· Once the voltage has risen above its minimum of 3V, you can try to start software
controlled charging by pulling the /IGT line to ground.
· If the voltage is still below 3V, driving the /IGT line to ground switches the timer off.
Without the timer running, MC45 will not proceed to software controlled charging. To
restart the timer you are required to shortly disconnect and reconnect the charger.
3.2.3.4 Operating modes during charging
Of course, the battery can be charged regardless of the engine's operating mode. When the
GSM engine is in Normal mode (SLEEP, IDLE, TALK GPRS IDLE or GPRS DATA mode), it
remains operational while charging is in progress (provided that sufficient voltage is applied).
The charging process during the Normal mode is referred to as Charge mode.
If the charger is connected to the POWER pin while MC45 is in POWER DOWN mode,
MC45 goes into Charge-only mode.
Table 7: Comparison Charge-only and Charge mode
How to activate mode Features
Connecting charger to the POWER pin of
MC45 while MC45 is
· operating, e.g. in IDLE or TALK mode
· in SLEEP mode
Charge mode
Connecting charger to the POWER pin of
MC45 while MC45 is
· in POWER DOWN mode
· in Normal mode: Connect charger to
the POWER pin of MC45, then enter
AT^SMSO.
IMPORTANT: While trickle charging is in
progress, be sure that the application is
switched off. If the application is fed from
the trickle charge current the module
Charge-only mode
might be prevented from proceeding to
software controlled charging since the
current would not be sufficient.
· Battery can be charged while GSM engine
remains operational and registered to the
GSM network.
· In IDLE and TALK mode, the RS-232 interface
is accessible. AT command set can be used
to full extent.
· In the NON-CYCLIC SLEEP mode, the RS-
232 interface is not accessible at all. During
the CYCLIC SLEEP mode it can be used as
described in Chapter 3.3.2.3.
· Battery can be charged while GSM engine is
deregistered from GSM network.
· Charging runs smoothly due to constant
current consumption.
· The AT interface is accessible and allows to
use the commands listed below.
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Features of Charge-only mode
Once the GSM engine enters the Charge-only mode, the AT command interface presents an
Unsolicited Result Code (URC) which reads:
^SYSSTART CHARGE-ONLY MODE
Note that this URC will not appear when autobauding was activated (due to the missing
synchronization between DTE and DCE upon start-up). Therefore, it is recommended to
select a fixed baudrate before using the Charge-only mode.
While the Charge-only mode is in progress, you can only use the AT commands listed in
Table 8. For further instructions refer to the AT Command Set supplied with your GSM
engine.
Table 8: AT commands available in Charge-only mode
AT command Use
AT+CALA Set alarm time
AT+CCLK Set date and time of RTC
AT^SBC Monitor charging process
Note: While charging is in progress, no battery capacity value is available. To query
the battery capacity disconnect the charger.
If the charger connects externally to the host device no charging parameters are
transferred to the module. In this case, the command cannot be used.
AT^SCTM Query temperature range, enable/disable URCs to report critical temperature ranges
AT^SMSO Power down GSM engine
To proceed from Charge-only mode to normal operation, it is necessary to drive the ignition
line to ground. This must be implemented in your host application as described in Chapter
3.3.1.1. When the engine is in Alarm mode there is no direct way to start charging, i.e.
charging will not begin even though the charger connects to the POWER pin of MC45. See
also Chapter 3.3.5 which summarizes the various options of changing the mode of
operation.
If your host application uses the SYNC pin to control a status LED as described in Chapter
3.8.2.2, please note that the LED is off while the GSM engine is in Charge-only mode.
3.2.3.5 Charger requirements
If you are using the implemented charging technique and the charging circuit recommended
in Figure 3, the charger must be designed to meet the following requirements:
a) Simple transformer power plug
- Output voltage: 5.5V...8V (under load)
- The charge current must be limited to 500mA
- Voltage spikes that may occur while you connect or disconnect the charger must be
limited to a maximum of 25V and must not exceed 1ms
- There must not be any capacitor on the secondary side of the power plug (avoidance of
current spikes at the beginning of charging)
b) Supplementary requirements for a) to ensure a regulated power supply
- When current is switched off a voltage peak of 10V is allowed for a maximum 1ms
- When current is switched on a spike of 1.6A for 1ms is allowed
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3.3 Power up / down scenarios
3.3.1 Turn on MC45
MC45 can be activated in a variety of ways, which are described in the following chapters:
· via ignition line /IGT: starts normal operating state (see Chapters 3.3.1.1 and 3.3.1.2)
· via POWER line: starts charging algorithm (see Chapters 3.2.3.4 and 3.3.1.3)
· via RTC interrupt: starts Alarm mode (see Chapter 3.3.1.4)
3.3.1.1 Turn on MC45 using the ignition line /IGT (Power on)
To switch on MC45 the /IGT (Ignition) signal needs to be driven to ground level for at least
100ms. This can be accomplished using an open drain/collector driver in order to avoid
current flowing into this pin.
BATT+
min. 10ms
min.
HiZ
100ms
HiZ
/IGT
50 to
100ms
VDD
ca. 180ms
Internal reset
max. 900ms
/EMERGOFF
RS-232
interface
generated by GSM engine
undefined
defined
For details please see Chapter 3.3.1.2
Figure 6: Power-on by ignition signal
If configured to a fix baud rate, MC45 will send the result code ^SYSSTART to indicate that it
is ready to operate. This result code does not appear when autobauding is active. See
Chapter AT+IPR in [1].
In a battery operated MC45 application, the duration of the /IGT signal must be 1s minimum
when the charger is connected and you may want to go from charging to Normal mode.
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3.3.1.2 Timing of the ignition process
When designing your application platform take into account that powering up MC45 requires
the following steps.
· The ignition line cannot be operated until V
· 10ms after V
has reached 3.0V the ignition line can be switched low. The duration of
BATT+
the falling edge must not exceed 1ms.
· Another 100ms are required to power up the module.
· Ensure that V
does not fall below 3.0V while the ignition line is driven. Otherwise the
BATT+
module cannot be activated.
· If the VDDLP line is fed from an external power supply as explained in Chapter 3.4, the
/IGT line is HiZ before the rising edge of BATT+.
3.0V
passes the level of 3.0V.
BATT+
VBATT+
/IGT
VBATT+
/IGT
0V
HiZ
10ms
min. 100ms
max. 1ms
Figure 7: Timing of power-on process if VDDLP is not used
3.0V
0V
HiZ
HiZ
HiZ
10ms
min. 100ms
max. 1ms
Figure 8: Timing of power-on process if VDDLP is fed from external source
MC45_HD_01_V00.02a Page 34 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.1.3 Turn on MC45 using the POWER signal
As detailed in Chapter 3.2.3.4, the charging adapter can be connected regardless of the
module’s operating mode (except for Alarm mode).
If the charger is connected to the POWER pins of the external charging circuit and of the
module while MC45 is off, processor controlled fast charging starts (see Chapter 3.2.3.3).
MC45 enters a restricted mode, referred to as Charge-only mode where only the charging
algorithm will be launched.
During the Charge-only mode MC45 is neither logged on to the GSM network nor is the RS232 interface fully accessible. To switch to normal operation and log on to the GSM network,
the /IGT line needs to be activated.
3.3.1.4 Turn on MC45 using the RTC (Alarm mode)
Another power-on approach is to use the RTC, which is constantly supplied with power from
a separate voltage regulator in the power supply ASIC. The RTC provides an alert function
which allows to wake up MC45 while power is off. To prevent the engine from unintentionally
logging into the GSM network, this procedure only enables restricted operation, referred to
as Alarm mode. It must not be confused with a wake-up or alarm call that can be activated
by using the same AT command, but without switching off power.
Use the AT+CALA command to set the alarm time. The RTC retains the alarm time if MC45
was powered down by AT^SMSO. Once the alarm is timed out and executed, MC45 enters
into the Alarm mode. This is indicated by an Unsolicited Result Code (URC) which reads:
^SYSSTART ALARM MODE
In Alarm mode only a limited number of AT commands is available. For further instructions
refer to the AT Command Set.
Table 9: AT commands available in Alarm mode
AT command Use
AT+CALA Set alarm time
AT+CCLK Set date and time of RTC
AT^SBC In Alarm mode, you can only query the present current consumption and check
whether or not a charger is connected. The battery capacity is returned as 0,
regardless of the actual voltage (since the values measured directly on the cell are
not delivered to the module).
AT^SCTM Query temperature range, enable/disable URCs to report critical temperature ranges
AT^SMSO Power down GSM engine
For the GSM engine to change from the Alarm mode to full operation (normal operating
mode) it is necessary to drive the ignition line to ground. This must be implemented in your
host application as described in Chapter 3.3.1.1. If your application is battery powered note
that charging cannot be started while the engine is in Alarm mode, i.e. charging will not
begin even though the charger connects to the POWER line. See also Chapter 3.3.5 which
summarizes the various options of changing the mode of operation.
If your host application uses the SYNC pin to control a status LED as described in Chapter
3.8.2.2, please note that the LED is off while the GSM engine is in Alarm mode.
MC45_HD_01_V00.02a Page 35 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.2 Power saving
SLEEP mode reduces the functionality of the MC45 module to a minimum and, thus,
minimizes the current consumption to the lowest level. SLEEP mode is set with the
AT+CFUN command which provides the choice of the functionality levels <fun>=0, 1, 5, 6, 7
or 8, all explained below. Further instructions of how to use AT+CFUN can be found in [1].
IMPORTANT: The AT+CFUN command can be executed before or after entering PIN1.
Nevertheless, please keep in mind that power saving works only while the module is
registered to the GSM network. If you attempt to activate power saving while the module is
detached, the selected <fun> level will be set, though power saving does not take effect.
To check whether power saving is on, you can query the status of AT+CFUN if you have
chosen CYCLIC SLEEP mode. If available, you can take advantage of the status LED
controlled by the SYNC pin (see Chapter 3.8.2.2). The LED stops flashing once the module
starts power saving.
The wake-up procedures are quite different depending on the selected SLEEP mode. Table
10 compares the wake-up events that can occur in NON-CYCLIC SLEEP mode and in the
four CYCLIC SLEEP modes.
3.3.2.1 No power saving (AT+CFUN=1)
The functionality level <fun>=1 is where power saving is switched off. This is the default after
startup.
3.3.2.2 NON-CYCLIC SLEEP mode (AT+CFUN=0)
If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module
shortly deactivates power saving to listen to a paging message sent from the base station
and then immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode,
since the serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode.
The first wake-up event fully activates the module, enables the serial interface and
terminates the power saving mode. In short, it takes MC45 back to the highest level of
functionality <fun>=1.
3.3.2.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7 and 8)
The functionality levels AT+CFUN=5, AT+CFUN=6, AT+CFUN=7 and AT+CFUN=8 are
referred to as CYCLIC SLEEP modes. The major benefit over the NON-CYCLIC SLEEP
mode is that the serial interface is not permanently blocked and that packet switched calls
may go on without terminating the selected CYCLIC SLEEP mode. This allows MC45 to
become active, for example to perform a GPRS data transfer, and to resume power saving
after the GPRS data transfer is completed.
The four CYCLIC SLEEP modes give you greater flexibility regarding the wake-procedures:
Basically, you can enter AT+CFUN=1 to permanently wake up the module. Also, MC45 can
automatically resume power saving, after you have sent or received a short message or
made a call. Please refer to Table 10 for more details.
MC45_HD_01_V00.02a Page 36 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables
the serial interface. The application must be configured to use hardware flow control. By
setting/resetting the /CTS signal, the module indicates to the application when the UART is
active. The application must wait until /CTS is set (i.e. is active low) on the physical UART
before data can be sent to the module.
The module starts or resumes power saving two seconds (AT+CFUN=5 or AT+CFUN=7) or
ten minutes (AT+CFUN=6 or AT+CFUN=8) after the last character was sent or received. It
resets the /CTS signal, and after additional 5ms, physically deactivates the UART to save
power. See Figure 10.
Note: If both serial interfaces RS-232(0) and RS-232(1) are connected, both are
synchronized. Although not explicitly stated, all explanations given in this chapter refer
equally to RS-232(0) and RS-232(1), and accordingly to /CTS0 and /CTS1.
3.3.2.4 Timing of the /CTS signal in CYCLIC SLEEP modes
The /CTS signal is enabled in synchrony with the module’s paging cycle. It goes active low
each time when the module starts listening to a paging message block from the base station.
The timing of the paging cycle varies with the base station and can be determined by the
following formula:
4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value.
DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from 0.47
to 2.12 seconds. The DRX value of the base station is assigned by the network operator.
If DRX >
period causes the /CTS signal to go active low. If DRX is 2, i.e. if paging is done every 0.47
seconds, the /CTS signal is activated with every 2
3, i.e. if paging is performed at intervals from 0.71 to 2.12 seconds, each listening
nd
listening period.
The /CTS signal stays active low for 20 ms. This is followed by another 5 ms UART activity.
Thus, once the /CTS signal goes active low, you have 25 ms to enter characters. In the
pauses between listening to paging messages, while /CTS is high, the module resumes
power saving and the AT interface is not accessible. See Figure 9.
Paging message
2.12 s
Paging message Paging message
2.12 s
Paging message
2.12 s
/CTS
AT interface disabled
20
ms
5 ms
Figure 9: Timing of /CTS signal (example for a 2.12 s paging cycle)
20
ms
5 ms
AT interface enabled
20
ms
5 ms
20
ms
5 ms
MC45_HD_01_V00.02a Page 37 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
Figure 10 illustrates the CFUN=5 mode, which resets the /CTS signal 2 seconds after the
last character was sent or received. The UART is kept active for another 5 ms before power
saving begins.
Paging message Paging message
2.12 s
/CTS
1 characterstLast character
AT interface disabled
Figure 10: Beginning of power saving if CFUN=5
2 s
AT interface enabled
2.12 s
Paging message
Beginning of power saving
20
ms
5 ms
5 ms
Paging message
2.12 s
20
ms
5 ms
MC45_HD_01_V00.02a Page 38 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.2.5 Wake up MC45 from SLEEP mode
A wake-up event is any event that switches off the SLEEP mode and causes MC45 to return
to full functionality. In short, it takes MC45 back to AT+CFUN=1.
Definitions of the state transitions described in Table 10:
Yes = MC45 exits SLEEP mode.
No = MC45 does not exit SLEEP mode.
Table 10: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes
Event From SLEEP mode
AT+CFUN=0 to
AT+CFUN=1
Ignition line No No No
/RTS0 or /RTS1 (falling edge) Yes No No
Unsolicited Result Code
(URC)
Incoming voice or data call Yes Yes No
Any AT command
(incl. outgoing voice or data
call, outgoing SMS)
Incoming SMS depending on
mode selected by AT+CNMI:
AT+CNMI=0,0 (= default, no
indication of received SMS)
AT+CNMI=1,1 (= displays
URC upon receipt of SMS)
GPRS data transfer Not possible
Yes Yes No
Not possible
(UART disabled)
No
Yes
(UART disabled)
From SLEEP mode
AT+CFUN=5 or 6 to
AT+CFUN=1
No No
No
Yes
No No
From SLEEP mode
AT+CFUN=7 or 8 to
AT+CFUN=1
No
No
RTC alarm Yes Yes No
AT+CFUN=1 Not possible
(UART disabled)
Yes Yes
Recommendation:
· In NON-CYCLIC SLEEP mode, you can set an RTC alarm to wake up MC45 and return
to full functionality. This is a useful approach because, in this mode, the AT interface is
not accessible.
MC45_HD_01_V00.02a Page 39 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.3 Turn off MC45
To switch the module off the following procedures may be used:
· Normal shutdown procedure: Software controlled by sending the AT^SMSO command
over the RS-232 application interface. See Chapter 3.3.3.1.
· Emergency shutdown: Hardware driven by switching the /EMERGOFF line of the board-
to-board connector to ground = immediate shutdown of supply voltages, only applicable
if the software controlled procedure fails! See Chapter 3.3.3.2.
· Automatic shutdown: Takes effect if undervoltage / overvoltage is detected or if battery
or board (engine) temperature exceeds critical limit. See Chapter 3.3.4.
3.3.3.1 Turn off MC45 using AT command
The best and safest approach to powering down MC45 is to issue the AT^SMSO command.
This procedure lets MC45 log off from the network and allows the software to enter into a
secure state and safe data before disconnecting the power supply.
Before switching off the device sends the result code
^SMSO: MS is OFF
From this moment on, no further AT commands can be executed. Only the RTC is still
active. The mode is referred to as POWER DOWN mode.
While MC45 is in POWER DOWN mode the application interface is switched off and must
not be fed from any other source. Therefore, your application must be designed to avoid any
current flow into any digital pins of the application interface. POWER DOWN is also
signalized by the VDD pin, which in this mode, is off.
MC45_HD_01_V00.02a Page 40 of 90 12.08.2002
MC45 Hardware Interface Description
r
r
P R E L I M I N A R Y
3.3.3.2 Emergency shutdown using /EMERGOFF pin
Caution: Use the /EMERGOFF pin only when, due to serious problems, the software is
not responding for more than 5 seconds. Pulling the /EMERGOFF pin causes
the loss of all information stored in the volatile memory since power is cut off
immediately. Therefore, this procedure is intended only for use in case of
emergency, e.g. if MC45 fails to shut down properly.
The /EMERGOFF signal is available on the board-to-board connector. To control the
/EMERGOFF line it is recommended to use an open drain / collector driver. To turn the GSM
engine off, the /EMERGOFF line has to be driven to ground for ³ 3.2s.
BATT+
/IGT
VDD
Internal reset
/EMERGOFF
generated by GSM engine
Figure 11: Deactivating GSM engine by /EMERGOFF signal
max. 3.2s
generated by external application
How does it work:
· Voltage V
· The module is active while the
is permanently
batt+
applied to the module.
internal reset signal is kept at
high level.
During operation of MC45 the
baseband controller generates
watchdog pulses at regula
intervals.
Once the EMERGOFF pin is
grounded these watchdog
pulses are cut off from the
power supply ASIC. The powe
supply ASIC shuts down the
internal supply voltages of MC45
after max. 3.2s and the module
turns off. Consequently, the
output voltage at VDD is
switched off.
MC45_HD_01_V00.02a Page 41 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.4 Automatic shutdown
To ensure proper operation of all assemblies under varying conditions, such as temperature,
input voltage, transmission power etc., MC45 features protection elements for automatic
shutdown.
Automatic shutdown takes effect if
· the MC45 board is exceeding the critical limits of overtemperature or undertemperature
· the battery is exceeding the critical limits of overtemperature or undertemperature
· undervoltage is detected
· overvoltage is detected.
The automatic shutdown procedure is equivalent to the power-down initiated with the
AT^SMSO command, i.e. MC45 logs off from the network and the software enters a secure
state avoiding loss of data. This is not applicable to overvoltage shutdown, where power is
cut off immediately.
Alert messages transmitted before the device switches off are implemented as Unsolicited
Result codes (URCs). The presentation of these URCs can be enabled or disabled with the
two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the
condition, please see Chapters 3.3.4.1 to 3.3.4.4 for details. For further instructions on AT
commands refer to [1].
3.3.4.1 Temperature dependent shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the
PCB. The NTC that detects the battery temperature must be part of the battery pack circuit
as described in Chapter 3.2.3. The values detected by either NTC resistor are measured
directly on the board or the battery and therefore, are not fully identical with the ambient
temperature.
Proceeding from the measured temperature, MC45 sends an alert in the form of a URC and
switches off when exceeding the critical limits:
· URCs indicating the alert level "1" or "-1" allow you to take appropriate precautions, such
as protect the module or battery from exposure to extreme conditions, or save or back up
data etc. The presentation of the URCs depends on the settings selected with the
AT^SCTM write command:
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after
start-up of MC45. After 15 seconds operation, the presentation will be disabled, i.e.
no alert messages can be generated.
· URCs indicating the alert level "2" or "-2" are followed by immediate shutdown. The
presentation of these URCs is always enabled, i.e. they will be output even though the
factory setting AT^SCTMC=0 was never changed.
· When the temperature is back to normal, again a message will be delivered. In this case,
the URC indicates level “0”.
Table 11 summarizes the maximum ratings and the associated URCs.
MC45_HD_01_V00.02a Page 42 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
Table 11: Temperature dependent behaviour
Sending temperature alert (15 s after start-up, otherwise only if URC presentation enabled)
^SCTM_A: 1 Caution: T
^SCTM_B: 1 Caution: T
^SCTM_A: -1 Caution: T
^SCTM_B: -1 Caution: T
of battery close to overtemperature limit.
amb
of board close to overtemperature limit.
amb
of battery close to undertemperature limit.
amb
of board close to undertemperature limit.
amb
^SCTM_A: 0 Battery back to uncritical temperature range.
^SBCTM_B: 0 Board back to uncritical temperature range.
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_A: 2 Alert: T
^SCTM_B: 2 Alert: T
^SCTM_A: -2 Alert: T
^SCTM_B: -2 Alert: T
of battery equal or beyond overtemperature limit. MC45 switches off.
amb
of board equal or beyond overtemperature limit. MC45 switches off.
amb
of battery equal or below undertemperature limit. MC45 switches off.
amb
of board equal or below undertemperature limit. MC45 switches off.
amb
The values stated in Table 11 are based on test conditions according to IEC 60068-2-2 (still
air).
3.3.4.2 Undervoltage shutdown if battery NTC is present
In applications where the module’s charging technique is used and an NTC is connected to
the BATT_TEMP terminal, the software constantly monitors the applied voltage to check that
the battery voltage is sufficient to set up a call. When the battery voltage decreases to
<3.6V, the following URC will be presented:
V
BATT+
^SBC: Undervoltage
To enable or disable the URC use the AT^SBC command. The URC will be enabled when
you enter the write command and specify the power consumption of your GSM application.
Step by step instructions are provided in [1].
The message will be reported, for example, when you attempt to set up a call while the
voltage is close to the critical limit and further power loss is caused during the transmit burst.
To remind you that the battery needs to be charged soon, the URC appears several times
before the module switches off.
3.3.4.3 Undervoltage shutdown if no battery NTC is present
The undervoltage protection is also effective in applications, where no NTC connects to the
BATT_TEMP terminal. Thus, you can take advantage of this feature even though the
application handles the charging process or MC45 is fed by a fixed supply voltage. All you
need to do is executing the write command AT^SBC=<current> which automatically enables
the presentation of URCs. You do not need to specify <current>.
Please note, that in contrast to applications with an NTC connected to BATT_TEMP, the
module will present the URC
^SBC: Undervoltage
only once
MC45_HD_01_V00.02a Page 43 of 90 12.08.2002
and will then switch off without sending any further messages.
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.4.4 Shutdown in the event of overvoltage
Overvoltage protection is implemented in the PSU-ASIC. If the supply voltage raises to
> 5.8V MC45 switches off automatically. In contrast to undervoltage shutdown
V
BATT+
· there is no URC function available
· and the module turns off immediately, i.e. loss of data cannot be avoided.
Remark: The PA is always connected to the supply voltage, also in case of an emergency
switch off. A higher supply voltage will destroy the PA.
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MC45 Hardware Interface Description
P R E L I M I N A R Y
3.3.5 Summary of state transitions
Table 12: State transitions of MC45
The table shows how to proceed from one mode to another (gray column = present mode, white columns = intended modes)
Further mode
Present mode
èèè
POWER DOWN Normal mode
**)
Charge-only mode*) Charging in normal
mode
*)**)
Alarm mode
POWER DOWN
mode without charger
POWER DOWN
mode with charger
(high level at POWER
pins of MC45)
--- /IGT >100 ms at low
level
--- /IGT (if supply voltage
is above 3.0V). No
automatic transition,
but via POWER
DOWN mode without
charger
Normal mode
**)
AT^SMSO
or
--- No automatic transition,
exceptionally /EMERGOFF
pin > 3.2s at low level
Charge-only mode *) Disconnect charger (MC45
POWER pin at low level)
AT^SMSO or
or
exceptionally /EMERGOFF
3.2s at low level
pin >
Charging in normal
mode*)
**)
Via “Charge-only mode”
exceptionally
or
/EMERGOFF pin >
3.2s at
No automatic
transition, but via
“Charge in Normal
mode”
Disconnect charger
from POWER pin at
MC45
low level
Alarm mode AT^SMSO or
exceptionally /EMERGOFF
3.2s at low level
*)
See Chapter 3.2.3.4 for details on the charging mode
pin >
/IGT >100ms at low
level
Connect charger to
POWER (high level at
POWER)
100ms < /IGT < 500ms
at low level
No direct transition, but
via “Charge-only mode” or
“Normal mode”
Wake-up from POWER
DOWN mode (if
activated with AT+CALA)
/IGT >1 s at low level Wake-up from POW ER
DOWN mode (if
activated with AT+CALA)
but via “POWER
DOWN”
Connect charger to
POWER pin at MC45
(high level at POWER)
AT+CALA followed by
AT^SMSO. MC45 enters
Alarm mode when
specified time is reached.
--- /IGT >1s at low level AT+CALA followed by
AT^SMSO. MC45 enters
Alarm mode when
specified time is reached
BATT+
<3.3V
and V
AT^SMSO --- No direct transition
No transition /IGT >100ms at low level ---
**)
Normal mode covers TALK, DATA, GPRS, IDLE and SLEEP modes
MC45_HD_01_V00.02a Page 45 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.4 RTC backup
The internal Real Time Clock of MC45 is supplied from a separate voltage regulator in the
power supply ASIC which is also active when MC45 is in POWER DOWN status. An alarm
function is provided for activating and deactivating MC45.
In addition, you can use the VDDLP pin on the board-to-board connector (pin no. 43) to
backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable).
The capacitor is charged by the BATT+ line of MC45. If the voltage supply at BATT+ is
disconnected the RTC can be powered by the capacitor. The size of the capacitor
determines the duration of buffering when no voltage is applied to MC45, i.e. the greater
capacitor the longer MC45 will save the date and time.
The following figures show various sample configurations. The voltage applied at VDDLP
can be in the range from 2 to 5.5V. Please refer to Table 19 for the parameters required.
Baseband
processor
RTC
PSU
1k
B2B
BATT+
VDDLP
+
Figure 12: RTC supply from capacitor
BATT+
Baseband
processor
RTC
PSU
B2B
1k
VDDLP
+
Figure 13: RTC supply from rechargeable battery
BATT+
Baseband
processor
PSU
RTC
B2B
1k
VDDLP
+
+
Figure 14: RTC supply from non-chargeable battery
MC45_HD_01_V00.02a Page 46 of 90 12.08.2002
MC45 Hardware Interface Description
P R E L I M I N A R Y
3.5 Serial interfaces
MC45 offers two serial interfaces, each operating at 2.65V level. All RS-232 signals on the
board-to-board connector are low active. Both interfaces are implemented as a serial
asynchronous transmitter and receiver conforming to ITU-T RS-232 Interchange Circuits
DCE.
The GSM engine is designed for use as a DCE. Based on the conventions for DCE-DTE
connections it communicates with the customer application (DTE) using the following
signals:
RS-232(0)
· Port /TXD @ application sends data to the module’s /TXD0 signal line
· Port /RXD @ application receives data from the module’s /RXD0 signal line
RS-232(1)
· Port /TXD1 @ application sends data to module’s /TXD1 signal line
· Port /RXD1 @ application receives data from the module’s /RXD1 signal line
MC45
(DCE)
/TXD0
/RXD0
/RTS0
/CTS0
/DTR0
/DSR0
RS-232(0) interface
/DCD0
/RING0
/TXD1
/RXD1
/RTS1
/TXD
/RXD
/RTS
/CTS
/DTR
/DSR
/DCD
/RING
/TXD1
/RXD1
/RTS1
Application
(DTE)
RS-232(0) interface
/CTS1
RS-232(1) interface
Figure 15: RS-232 interfaces
MC45_HD_01_V00.02a Page 47 of 90 12.08.2002
/CTS1
RS-232(1) interface
MC45 Hardware Interface Description
P R E L I M I N A R Y
RS-232(0)
Includes the data lines /TXD0 and /RXD0, the status lines /RTS0 and /CTS0 and, in addition,
the modem control lines /DTR0, /DSR0, /DCD0 and /RING0.
It is primarily designed for voice, CSD, fax and GPRS services and for controlling the GSM
engine with AT commands. Full Multiplex capability allows the interface to be partitioned into
three virtual channels, yet with CSD and fax services only available on the first logical
channel. Please note that when the RS-232(0) runs in Multiplex mode, the RS-232(1) cannot
be used.
The /DTR0 signal will only be polled once per second from the internal firmware of MC45.
The /RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code).
RS-232(1)
Includes only the data lines /TXD1 and /RXD1 plus /RTS1 and /CTS1 for hardware
handshake. This interface is intended for voice calls, GPRS services and for controlling the
GSM engine with AT commands. It is not suited for CSD call, fax calls and Multiplex mode.
When a PPP connection is in progress, no URCs can be displayed. As a result, an incoming
call or any other type of URC can only be indicated after the PPP connection was
terminated.
Both interfaces are configured for 8 data bits, no parity and 1 stop bit, and can be operated
at bit rates from 300bps to 230kbps. Autobauding is only selectable on RS-232(0) and
supports the following bit rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400 bps. XON/XOFF software flow control can be used on both interfaces.
MC45_HD_01_V00.02a Page 48 of 90 12.08.2002
MC45 Hardware Interface Description
Air
A
(
)
P R E L I M I N A R Y
3.6 Audio interfaces
MC45 comprises three audio interfaces available on the board-to-board connector:
· Two analog audio interfaces, each with a balanced analog microphone input and a
balanced analog earpiece output. The second analog interface provides a supply circuit
to feed an active microphone.
· Serial digital audio interface (DAI) using PCM (Pulse Code Modulation) to encode analog
voice signals into digital bit streams.
This means you can connect up to three audio devices in any combination, all at the same
time. Using the AT^SAIC command you can easily switch back and forth.
MICP1
MICN1
MICP2
MICN2
EPP1
M
U
X
ADC
EPN1
EPP2
DAC
DSP
Interface
EPN2
SCLK
RXDDAI
RFSDAI
TXDDAI
TFSDAI
MC45 offers six audio modes which can be selected with the AT^SNFS command, no matter
which of the three interfaces is currently active. The electrical characteristics of the
voiceband part vary with the audio mode. For example, sending and receiving amplification,
sidetone paths, noise suppression etc. depend on the selected mode and can be altered with
AT commands (except for mode 1).
On each audio interface you can use all audio AT commands specified in [1] to alter
parameters. The only exception are the DAC and ADC gain amplifier attenuation
<outBbcGain> and <inBbcGain> which cannot be modified when the digital audio interface is
used, since in this case the DAC and ADC are switched off.
Please refer to Chapter 6.5 for specifications of the audio interface and an overview of the
audio parameters. Detailed instructions on using AT commands are presented in the "MC45
AT Command Set" [1]. Table 31 on page 83 summarizes the characteristics of the various
audio modes and shows what parameters are supported in each mode.
Digital
udio
Interface
DAI
Figure 16: Audio block diagram
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When shipped from factory, all audio parameters of MC45 are set to interface 1 and audio
mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0
handset and used for type approving the Siemens reference configuration. Audio mode 1
has fix parameters which cannot be modified. To adjust the settings of the Votronic handset
simply change to another audio mode.
3.6.1 Microphone circuit
Interface 1
This interface has no microphone supply circuit and therefore, has an impedance of 50 k
When connecting a microphone or another signal source to interface 1 you are required to
add two 100 nF capacitors, one to each line.
Interface 2
This interface comes with a microphone supply circuit and can be used to feed an active
microphone. If you do not use it or if you want to connect another type of signal source, for
example, an op amp or a dynamic microphone, it needs to be decoupled with capacitors.
Figure 17 shows the microphone inputs at both analog interfaces of MC45.
2.65 V
W.
Power down
MICP1
MICN1
Ri=50k"
to ADC
1 k" 1 k"
MICP2
MICN2
10 µF
1 k" 1 k"
Figure 17: Schematic of microphone inputs
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3.6.2 Speech processing
The speech samples from the ADC or DAI are handled by the DSP of the baseband
controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression
depending on the configuration of the active audio mode. These processed samples are
passed to the speech encoder. Received samples from the speech decoder are passed to
the DAC or DAI after post processing (frequency response correction, adding sidetone etc.).
Full rate, half rate, enhanced full rate, speech and channel encoding including voice activity
detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are
also performed on the GSM baseband processor.
Customer specific audio parameters can be evaluated by Siemens on customer request.
These parameters can be downloaded to MC45 using an AT command. For further
information refer to [6] or contact your Siemens distributor.
3.6.3 DAI timing
To support the DAI function, MC45 integrates a simple five-line serial interface with one input
data clock line (SCLK) and input / output data and frame lines (TXDDAI, TFSDAI, RXDDAI,
RFSDAI).
The serial interface is always active if the external input data clock SLCK is present, i.e. the
serial interface is not clocked by the DSP of the MC45 baseband processor. SLCK must be
supplied from the application and can be in a frequency range between 0.2 and 10 MHz.
Serial transfer of 16-bit words is done in both directions.
Data transfer to the application is initiated by the module through a short pulse of TFSDAI.
The duration of the TFSDAI pulse is one SCLK period, starting at the rising edge of SLCK.
During the following 16 SLCK cycles, the 16-bit sample will be transferred on the TXDDAI
line. The next outgoing sample will be transferred after the next TFSDAI pulse which occurs
every 125 µs.
The TFSDAI pulse is the master clock of the sample transfer. From the rising edge of the
TFSDAI pulse, the application has 100 µs to transfer the 16-bit input sample on the RXDDAI
line. The rising edge of the RFSDAI pulse (supplied by the application) may coincide with the
falling edge of TFSDAI or occur slightly later - it is only significant that, in any case, the
transfer of the LSB input sample will be completed within the specified duration of 100 µs.
Audio samples are transferred from the module to the application in an average of 125µs.
This is determined by the 8kHz sampling rate, which is derived from and synchronized to the
GSM network. As SLCK is independent of the GSM network, the distance between two
succeeding sample transfers may vary about +
The application is required to adapt its sampling rate to the TFDSDAI rate. Failure to
synchronize the timing between the module and the application may cause audible pops and
clicks in a conversation The timing characteristics of both data transfer directions are shown
in Figure 18 and Figure 19.
1 SLCK period.
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Note: Before starting the data transfer the clock SCLK should be available for at least
three cycles.
After the transfer of the LSB0 the clock SCLK should be still available for at least
three cycles.
SLCK
(input)
Internal
signal
RFSDAI
(input)
RXDDAI
(input)
Flag
SLCK
(input)
Internal
signal
T = 100ns to 5,000 ns
Figure 18: DAI timing on transmit path
T = 100ns to 5,000 ns
TFSDAI
(output)
TXDDAI
(output)
Flag
Figure 19: DAI timing on receive path
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3.7 SIM interface
The baseband processor has an integrated SIM interface compatible with the ISO 7816-3 IC
Card standard. This is wired to the host interface (board-to-board connector) in order to be
adapted to an external SIM card holder. Six pins on the board-to-board connector are
reserved for the SIM interface. Further to the five wire SIM interface according to GSM
11.11, the CCIN pin has been added. The CCIN pin serves to detect mechanically whether
or not a card is present in the card holder.
To take advantage of this feature, an appropriate SIM card detect switch is required on the
card holder. For example, this is true for the model supplied by Molex Deutschland GmbH,
which has been tested to operate with MC45 and is part of the Siemens reference setup for
type approval (Molex ordering number 91228-0001).
It is recommended that the total cable length between the board-to-board connector pins on
MC45 and the pins of the card holder does not exceed 200 mm in order to meet the
specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
Note: Before removing the SIM card or inserting a new one be sure that the GSM engine
has been powered down as described in Chapter 3.3.3.1. Otherwise, you run the risk
of causing damage to the card, or losing data stored on the card.
Table 13: Signals of the SIM interface (board-to-board connector)
Signal name Description
CCCLK Chipcard clock, various clock rates can be set in the baseband processor.
CCVCC SIM supply voltage from PSU-ASIC
CCIO Serial data line, input and output.
CCRST Chipcard reset, provided by baseband processor.
CCIN Input on the baseband processor for detecting the SIM card in the holder; if the SIM
card is removed during operation the SIM interface shuts down immediately. This
function is implemented to prevent destruction of the SIM card. Nevertheless,
inserting or removing the SIM card during operation should be avoided (see Note
above).
IMPORTANT: The CCIN pin is solely intended for use with a SIM card. It must not
be used for any other purposes. Failure to comply with this requirement may
invalidate the type approval of MC45.
CCGND Separate ground connection for SIM card to improve EMC.
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3.7.1 Requirements for using the CCIN pin
The module’s startup procedure involves a SIM card initialization performed within 1 second
after getting started. A most important issue for reliable operation is whether the initialization
procedure ends up with a high or low level of the CCIN signal:
a) If, during startup of MC45, the CCIN signal on the SIM interface is high, then the status
of the SIM card holder can be recognized each time the card is inserted or ejected. This
can be easily achieved when the card holder comprises a card detect switch. The switch
causes CCIN to go and stay high when the card is present.
A low level of CCIN indicates that the holder is empty. In this case, the module keeps
searching, at regular intervals, for the SIM card. Once the card is inserted, CCIN is taken
high again.
b) If, during startup of MC45, the CCIN signal is low, the module will also attempt to
initialize the SIM card. In this case, the initialization will only be successful when the card
is present.
If the SIM card initialization has been done, but the card is no more operational or
removed, then the module will never search again for a SIM card and only emergency
calls can be made.
It is strongly recommended to connect the contacts of the SIM card detect switch to the
CCIN input and to the CCVCC output of the module as illustrated in the sample diagram in
Figure 20. The additional switch in the CCIN line shown in Figure 20 is intended for
debugging purposes only and is, normally, not required in your application.
In special cases, the CCIN signal might be controlled by the host application. If so, be sure
that the CCIN signal is low while the output voltage VDD is low, too. In particular, no voltage
may be applied at the CCIN input, when MC45 is in POWER DOWN mode. Otherwise,
proper operation of MC45 may be affected due to an electric leakage current flowing through
the CCIN pin into the module.
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3.7.2 Design considerations for SIM card holder
The schematic below is a sample configuration that illustrates the Molex SIM card holder
located on the DSB45 Support Box (evaluation kit used for type approval of the Siemens
MC45 reference setup, see [4]). X503 is the designation used for the SIM card holder in [4].
Molex card holder
Figure 20: SIM card holder of DSB45 Support Box
Table 14 : Pin assignment of Molex SIM card holder on DSB45 Support Box
Pin no. Signal name I/O Function
1 CCVCC I Supply voltage for SIM card, generated by the GSM engine
2 CCRST I Chip card reset, prompted by the GSM engine
3 CCCLK I Chip card clock
4 CCGND - Individual ground line for the SIM card to improve EMC
5 CCVPP - Not connected
6 CCIO I/O Serial data line, bi-directional
7 CCDET1 - Connect to CCVCC
8 CCDET2 Connects to the CCIN input of the GSM engine. Serves to
recognize whether a SIM card is in the holder. Removing the SIM
card during operation will immediately stop further transmission of
signals to the card to protect the card from damage.
GSM module
Pins 1 through 6 are the minimum requirement according to the GSM Recommendations,
while 7 and 8 are needed for the CCIN pin.
Place the capacitors C1205 and C1206 (or instead one capacitor of 200nF) as close as
possible to the pins 1 (CCVCC) and 4 (GND) of the card holder. Connect the capacitors to
the pins via low resistance tracks.
The X507 switch is not mandatory, but may be added to help the system integrator control
the CCIN signal, e.g. for designing and testing purposes. When the switch is pushed open (3
is switched to 2), the line simulates an empty SIM card holder although the SIM is inserted.
When closed (3 connected to 1), the line simulates that the SIM card is present.
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3.7.3 Grounding the SIM interface
To ground the SIM interface you can proceed from several approaches, depending on your
individual application design. The following information is just one of several options you can
apply:
Potential equalization can best be achieved by applying a separate ground for the SIM
interface. For example, the PCB of your application platform may be designed to include an
extra ground plane for the SIM card reader, rather than connecting the CCGND pin of the
board-to-board connector to the central ground on your application platform. For the SIM
card ground plane, you can choose a capacitive or inductive coupling or a zero Ohm bridge.
Often, a combination of capacitive and inductive coupling will yield best results.
It depends on your actual layout where to place these lines. For ease of planning and
designing, you can simply place the required footprints at each side of the ground plane.
This gives you the flexibility, when you test your equipment for ESD and EMC protection, to
decide which of them to use, if at all.
GSM engine
Customer
application
CCGND
B2B connector
CCGND
GND
CCGND
Insulation
Figure 21: Connecting a separate ground for SIM interface
GND
SIM card
reader
GND
Ground plane
GND
Notes:
This figure is only a
simplified example
to give you an idea
where to place the
lines.
One capacitive /
inductive coupling
will do, if needed at
all.
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3.8 Control signals
The following control signals are available (2.65V level).
3.8.1 Inputs
Table 15: Input control signals of the MC45 module
Signal Pin Pin status Function Remarks
Ignition
Emergency
shutdown
/IGT
/EMERGOFF
(HiZ = high impedance)
Falling edge Power up MC45
Left open or HiZ No operation
Low Power down MC45
Left open or HiZ No operation
Active low ³ 100ms (Open
drain/collector driver to GND
required in cellular device
application).
Note: If a charger and a
battery is connected to the
customer application the /IGT
signal must be 1s minimum.
Active low ³ 3.2s (Open
drain/collector driver required
in cellular device application).
At the /EMERGOFF signal the
watchdog signal of the GSM
engine can be traced (see
description in Table 19).
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3.8.2 Outputs
3.8.2.1 Synchronization signal
The synchronization signal serves to indicate growing power consumption during the
transmit burst. The signal is generated by the SYNC pin (pin number 32). Please note that
this pin can adopt two different operating modes which you can select by using the
AT^SSYNC command (mode 0
"AT Command Set".
To generate the synchronization signal the pin needs to be configured to mode 0
This setting is recommended if you want your application to use the synchronization signal
for better power supply control. Your platform design must be such that the incoming signal
accommodates sufficient power supply to the MC45 module if required. This can be
achieved by lowering the current drawn from other components installed in your application.
The characteristics of the synchronization signal are explained below.
and 1). For details refer to the following chapter and to the
(= default).
Table 16: MC45 synchronization signal (if SYNC pin is set to mode 0 via AT^SSYNC)
Function Pin Pin status Description
Low No operation Synchronization SYNC
High Indicates increased power consumption
during transmission.
1 Tx 577 µs every 4.616 ms
2 Tx 1154 µs every 4.616 ms
Transmit burst
SYNC signal
*)
300 µs
Figure 22: SYNC signal during transmit burst
*)
The duration of the SYNC signal is always equal, no matter whether the traffic or the
access burst are active.
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3.8.2.2 Using the SYNC pin to control a status LED
As an alternative to generating the synchronization signal, the SYNC pin can be used to
control a status LED on your application platform.
To avail of this feature you need to set the SYNC pin to mode 1 by using the AT^SSYNC
command. For details see the "AT Command Set".
When controlled from the SYNC pin the LED can display the functions listed in Table 17.
Table 17: Coding of the status LED
LED mode Operating status
Off MC45 is off or run in SLEEP, Alarm or Charge-only mode
600 ms On / 600ms Off No SIM card inserted or no PIN entered, or network search in
progress, or ongoing user authentication, or network login in
progress.
75 ms On / 3 s Off Logged to network (monitoring control channels and user
interactions). No call in progress.
75 ms on / 75 ms Off / 75 ms On /
3 s Off
Flashing Indicates GPRS data transfer: When a GPRS transfer is in
On Depending on type of call:
LED Off = SYNC pin low. LED On = SYNC pin high (if LED is connected as illustrated in Figure 23)
One or more GPRS contexts activated.
progress, the LED goes on within 1 second after data packets
were exchanged. Flash duration is approximately 0.5 s.
Voice call: Connected to remote party.
Data call: Connected to remote party or exchange of
parameters while setting up or disconnecting a call.
To operate the LED a buffer, e.g. a transistor or gate,
must be included in your application. A sample
configuration can be gathered from Figure 23. Power
consumption in the LED mode is the same as for the
synchronization signal mode. For details see Table
19, SYNC pin.
Figure 23: LED Circuit (Example)
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P R E L I M I N A R Y
3.8.2.3 Behaviour of the /RING0 line (RS-232(0) interface only)
The /RING0 line is available on the RS-232(0) interface. Its behaviour depends on the type
of the call received.
· When a voice call comes in the /RING0 line goes low for 1s and high for another 4s.
Every 5 seconds the ring string is generated and sent over the /RXD0 line.
If there is a call in progress and call waiting is activated for a connected handset or
handsfree device, the /RING0 line switches to ground in order to generate acoustic
signals that indicate the waiting call.
4s
4s
/RING0
1s
Ring
string
Figure 24: Incoming voice call
1s
Ring
string
1s
Ring
string
· Likewise, when a Fax or data call is received, /RING0 goes low. However, in contrast to
voice calls, the line remains low. Every 5 seconds the ring string is generated and sent
over the /RXD0 line.
/RING0
Ring
string
5s
Ring
string
Figure 25: Incoming data call
5s
Ring
string
· All types of unsolicited result codes (URCs) also cause the
/RING0 line to go low, however for 1 second only.
For example, the GSM engine may be configured to output
RING0
a URC upon the receipt of an SMS. As a result, if this URC
type was activated with AT+CNMI=1,1, each incoming
SMS causes the /RING0 line to go low.
1s
URC
For more detailed information on URCs please refer the
"MC45 AT Command Set".
Table 18: MC45 ring signal
Function Pin Status Description
Ring indication /RING0
0 Indicates an incoming call or URC. If in
SLEEP mode, the cellular device
application is caused to wake up.
1 No operation
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3.9 Electrical specifications of the application interface
Please note that the reference voltages listed in Table 14 are the values measured directly
on the MC45 module. They do not apply to the accessories connected.
If an input pin is specified for V
value 3.3V is an absolute maximum rating.
The Hirose DF12C board-to-board connector on MC45 is a 50-pin double-row receptacle.
The names and the positions of the pins can be seen from Figure 26 which shows the top
view of MC45.
26
50
BATT+ GND
BATT+ GND
BATT+ GND
BATT+ GND
BATT+ GND
VDD CHARGE
/RING0 POWER
/DSR0 VDDLP
/RTS0 /TXD0
/DTR0 /TXD1
/RTS1 RXD0
/CTS0 RXD1
/CTS1 SYNC
/DCD0 BATT_TEMP
/EMERGOFF RFSDAI
/IGT TXDDAI
GND SCLK
MICN1 TFSDAI
MICP1 RXDDAI
MICP2 CCGND
MICN2 CCIN
EPN1 CCRST
EPP1 CCIO
EPP2 CCVCC
EPN2 CCCLK
= 3.3V, be sure never to exceed the stated voltage. The
i,h,max
25
Figure 26: Pin assignment (top view on MC45)
1
Note: Pin numbers have changed since the first
release of this document (MC45_HD_01_v0001).
The positions of the pins are still the same.
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Table 19: Pin assignment and electrical description of application interface
Function Signal name IO Signal form and level Comments
Power
supply
Charge
interface
External
supply
voltage
VDD Low
Power
BATT+ I VI = 3.3V to 4.5V
VInorm = 4.1V
Inorm # 2A, Imax < 3A (during Tx burst)
GND
1 Tx, peak current 577µs every 4.616ms
2 Tx, peak current 1154µs every 4.616ms
POWER I
V
min = 3.0V
I
V
max = 15V
I
BATT_TEMP I
Connect NTC with R
to ground.
CHARGE O
VDD O
I
= -300µA ... -600µA
CHARGE
@ 3V < V
CHARGE
VDDmin = 2.84V, VDDmax = 2.96V
Imax = -10mA
C
max = 1µF
L
VDDLP I/O
RI =1kW
V
max # 4.0V
O
V
min = 2.2V, VImax = 5.5V
I
I
typ = 10µA at BATT+ = 0V
I
Mobile in POWER DOWN mode:
VImin = 1.2V
< V
# 10kW @ 25°C
NTC
LOAD
Power supply input.
5 BATT+ pins to be
connected in parallel.
5 GND pins to be
connected in parallel.
The power supply must be
able to meet the
requirements of current
consumption in a Tx burst
(up to 3A).
Sending with two timeslots
doubles the duration of
current pulses to 1154µs
(every 4.616ms)!
This line signalizes to the
processor that the charger
is connected.
If unused keep pin open.
Input to measure the
battery temperature over
NTC resistor.
NTC should be installed
inside or near battery pack
to enable the charging
algorithm and deliver
temperature values.
If unused keep pin open.
This line is a current
source for the charge FET
with a 10kW resistance
between gate and source.
If unused keep pin open.
Supply voltage, e.g. for an
external LED or level
shifter. The external digital
logic must not cause any
spikes or glitches on
voltage VDD.
Not available in POWER
DOWN mode.
VDD signalizes the “ON”
state of the module.
If unused VDD keep pin
open.
Supplies the RTC with
power via an external
capacitor or buffer battery
if no V
BATT+
If unused keep pin open.
is applied.
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Function Signal name IO Signal form and level Comments
Ignition /IGT I
RI # 100kW, CI # 1nF
V
IL
V
Open
ON
Emergency
shutdown
(Watchdog)
/EMERGOFF I
RI #22kW
V
V
IL
Open
Signal
Watchdog:
V
OL
V
OH
f
min = 0.16Hz
O
f
max = 1.55Hz
O
Synchronization
SYNC O
VOLmax = 0.2V at I = 1mA
V
OH
V
OH
1 Tx, 877µs impulse each 4.616ms and
2 Tx, 1454µs impulse each 4.616ms, with
300µs forward time.
SIM interface
CCIN I
CCRST O
CCIO IO
CCCLK O
CCVCC O
RI # 100kW
V
IL
V
IH
V
IH
RO #47W
V
OL
V
OH
V
OH
R
I
V
IL
V
IH
R
O
V
OL
V
OH
V
OH
V
OH
RO #220W
V
OL
V
OH
V
OH
ROmax = 5W
CCVCCmin = 2.84V,
CCVCCmax = 2.96V
Imax = -20mA
CCGND Ground
max = 0.5V at Imax = -20µA
max = 2.3V
~~~
|____|
~~~
Active Low ³ 100ms
max = 0.5V at Imax = -100µA
max = 2.73V
~~~
|______|
~~~
Active Low ³ 3.2s
max = 0.35V at I = 10µA
min= 2.25V at I = -10µA
min = 2.35V at I = -1mA
max = 2.73V
max = 0.5V
min = 2.15V at I = 20µA,
max=3.3V at I = 30µA
max = 0.25V at I = 1mA
min = 2.3V at I = -1mA
max = 2.73V
#10kW
max = 0.5V
min = 1.95V, VIHmax=3.3V
#220W
max = 0.4V at I = 1mA
min = 2.15V at I = -1mA
min = 2.55V at I = -20µA
max = 2.96V
max = 0.4V at I = 1mA
min = 2.15V at I = -1mA
max = 2.73V
Input to switch the mobile
ON.
The line must be driven
low by an Open Drain or
Open Collector driver.
This line must be driven by
an Open Drain or Open
Collector driver.
Emergency shutdown
deactivates the power
supply to the module.
The module can be reset if
/IGT is activated after
emergency shutdown.
To switch the mobile off
use the AT^SMSO
command.
/EMERGOFF also
indicates the internal
watchdog function.
If unused keep pin open.
Indicates increased current
consumption during uplink
transmission burst. Note
that timing is different
during handover.
Alternatively used to
control status LED.
If unused keep pin open.
CCIN = high, SIM card
holder closed (no card
recognition)
Maximum cable length
200mm to SIM card holder.
All signals of SIM interface
are protected against ESD
with a special diode array.
Usage of CCGND is
mandatory. See Chapter
3.7.3 for details on
grounding.
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Function Signal name IO Signal form and level Comments
RS-232 (0)
interface
/RXD0 O
/TXD0 I
/CTS0 O
/RTS0 I
/DTR0 I
/DCD0 O
VOLmax = 0.2V at I = 1mA
V
min = 2.35V at I = -1mA
OH
V
max = 2.73V
OH
VILmax = 0.5V
V
min = 1.95V, VIHmax=3.3V
IH
/DTR0, RTS0: Imax = -90µA at V
/TXD0: Imax = -260µA at V
/DSR0 O
= 0V
IN
= 0V
IN
First serial interface for AT
commands or data stream.
Please note that the /TXD0
pin draws, for 350ms, an
additional current of max.
60µA when MC45 is
activated. See timing
characteristics in Figure 6
If unused keep pins open.
/RING0 O
RS-232 (1)
interface
/RXD1 O
/TXD1 I
VOLmax = 0.2V at I = 1mA
V
min = 2.35V at I = -1mA
OH
V
max = 2.73V
OH
VILmax = 0.5V
V
min = 1.95V, VIHmax=3.3V
/CTS1 O
/RTS1 I
IH
max = -90µA at VIN = 0V
I
I
Second serial interface for
AT commands.
Please note that the /TXD1
pin draws, for 350ms, an
additional current of max.
60µA when MC45 is
activated. See timing
characteristics in Figure 6
If unused keep pins open.
Digital audio
interface
Analog audio
interfaces
Explanation of signal names:
P = positive, N = negative
RFSDAI I
RXDDAI I
SCLK I
TFSDAI O
TXDDAI O
EPP2 O
EPN2 O
VOLmax = 0.2V at I = 1mA
V
min = 2.35V at I = -1mA
OH
V
max = 2.73V
OH
VILmax = 0.5V
V
min = 1.95V, VIHmax=3.3V
IH
I
max = 330µA at VIN = 3.3V
I
VOmax = 3.7Vpp
See also Table 32.
If unused keep pins open.
The audio output is
balanced and can directly
operate an earpiece.
If unused keep pins open.
EPP1 O
EPN1 O
VOmax = 3.7Vpp
See also Table 32.
Balanced audio output.
Can be used to directly
operate an earpiece.
If unused keep pins open.
MICP1 I
MICN1 I
RI # 50kW differential
max = 1.03Vpp
V
I
See also Table 33.
Balanced microphone
input. To be decoupled
with 2 capacitors (C
=
K
100nF), if connected to a
microphone or another
device.
If unused keep pins open.
MICP2 I
MICN2 I
RI = 2kW differential
max = 1.03Vpp
V
I
See also Table 33.
Balanced microphone
input. Can be used to
directly feed an active
microphone.
If used for another signal
source, e.g. op amp, to be
decoupled with capacitors.
If unused keep pins open.
AGND Separate ground
connection for external
audio circuits.
MC45_HD_01_V00.02a Page 64 of 90 12.08.2002
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4 Antenna interface (antenna reference point – ARP)
To suit the physical design of individual applications MC45 offers two alternative approaches
to connecting the antenna:
The standard layout of MC45 comprises an antenna connector from Hirose assembled on
the component side of the PCB (top view on MC45) plus a antenna pad placed on the
bottom side. Both solutions can only be applied alternatively: Whenever an antenna is
plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is
soldered to the pad, then the Hirose connector must be left empty.
Both RF interfaces have an impedance of 50". MC45 is capable of sustaining a total
mismatch at the antenna connector or pad without any damage, even when transmitting at
maximum RF power.
To help you choose an appropriate antenna, Chapters 5.4 and 8 provide technical
specifications and ordering information. The external antenna must be matched properly to
achieve best performance regarding radiated power, DC-power consumption and harmonic
suppression. Matching networks are not included on the MC45 PCB and should be placed in
the host application.
Regarding the return loss MC45 provides the following values:
Table 20: Return loss
State of module Return loss of module Recommended return loss of application
Receive > 8dB > 12dB
Transmit not applicable > 12dB
Idle < 5dB not applicable
MC45_HD_01_V00.02a Page 65 of 90 12.08.2002
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5 Physical characteristics
5.1 Mechanical dimensions of MC45
Figure 27 shows the top view on MC45 and provides an overview of the mechanical
dimensions of the board. For further details see Figure 28.
Size: 53 +
Weight: 10g
0.2 x 34 +0.2 x 3.5+0.3 mm
Figure 27: MC45 – top view
MC45_HD_01_V00.02a Page 66 of 90 12.08.2002
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C
4
5
Board-to-board connector
M
All dimensions in millimeter
Figure 28: Mechanical dimensions of MC45
MC45_HD_01_V00.02a Page 67 of 90 12.08.2002
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Ground pad, e.g. for heat dissipator
or connection to host device
Ø
1
.
1
TP 402
14.42
4.75
0.00
10.60
TP GND
TP BATT+
0
0
9
4
.
.
6
4
2
2
0
5
.
5
1
0
0
.
0
Figure 29: MC45 bottom view
MC45_HD_01_V00.02a Page 68 of 90 12.08.2002
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5.2 Mounting MC45 onto the application platform
There are many ways to properly install MC45 in the host device. An efficient approach is to
mount the MC45 PCB to a frame, plate, rack or chassis. Fasteners can be M1.6 or M1.8
screws plus suitable washers, circuit board spacers, or customized screws, clamps, or
brackets. In addition, the board-to-board connection can also be utilized to achieve better
support.
If the bottom of MC45 faces the holding device, only use the ground pad for the connection.
To avoid short circuits ensure that the remaining sections of the MC45 PCB do not come into
contact with the host device since there are a number of test points. The ground pad can
also be used to attach cooling elements, e.g. a heat sink. Figure 29 shows the ground pad
on the bottom of MC45 and the positions of all test points.
Particular attention should be paid to the test point TP 402. Placed beneath the ground pad it
has been added for manufacturing only. When the pad is used for grounding the unit or
connecting a heat sink, extra care must be taken not to contact this test point.
The antenna pad on the bottom of the MC45 PCB must not be influenced by any other
PCBs, components or by the housing of the host device. It needs to be surrounded by a
restricted space as described in Chapter 5.4.2.
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it
is positioned flat against the host device.
Note: Detailed mounting instructions and recommendations for integrating MC45 into the
host application shall be provided in later releases of this document.
MC45_HD_01_V00.02a Page 69 of 90 12.08.2002
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5.3 Board-to-board connector
This chapter provides specifications for the 50-pin board-to-board connector which serves as
physical interface to the host application. The receptacle assembled on the MC45 PCB is
type Hirose DF12C. Mating headers from Hirose are available in different stacking heights.
Figure 30: Hirose DF12C receptacle on MC45
Table 21: Ordering information DF12 series
Figure 31: Header Hirose DF12 series
Item Part number Stacking
HRS number
height (mm)
Receptacle on MC45 DF12C(3.0)-50DS-0.5V(81) 3 - 5 537-0694-9-81
Headers DF12 series DF12E(3.0)-50DP-0.5V(81)
DF12E(3.5)-50DP-0.5V(81)
DF12E(4.0)-50DP-0.5V(81)
DF12E(5.0)-50DP-0.5V(81)
3.0
3.5
4.0
5.0
537-0834-6-**
537-0534-2-**
537-0559-3-**
537-0584-0-**
Notes: The headers listed above are without boss and metal fitting. Please contact Hirose for details on
other types of mating headers. Asterixed HRS numbers denote different types of packaging.
Table 22: Electrical and mechanical characteristics of the Hirose DF12C connector
Parameter Specification (50 pin Board to Board connector)
Number of Contacts 50
Quantity delivered 2000 Connectors per Tape & Reel
Voltage 50V
Current Rating 0.5A max per contact
Resistance 0.05 Ohm per contact
Dielectric Withstanding Voltage 500V RMS min
Operating Temperature -45°C...+125°C
Contact Material phosphor bronze (surface: gold plated)
Insulator Material PA , beige natural
Stacking height 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm
Insertion force 21.8N
Withdrawal force 1st 10N
Withdrawal force 50th 10N
Maximum connection cycles 50
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5.3.1 Mechanical dimensions of the Hirose DF12 connector
Figure 32: Mechanical dimensions of Hirose DF12 connector
5.3.2 Adapter cabling
The board-to-board connection is primarily intended for direct contact between both
connectors. If this assembly solution does not fit into your application design ensure that the
used adapter cable meets the following requirements:
· Maximum length: 200 mm
· Type of cable: Flexible cable or flexible printed circuit board designed to mate with the
Hirose receptacle and headers specified above.
The equipment submitted for type approving the Siemens reference setup of MC45 includes
a 160mm adapter cable. See Chapter 7.1.
MC45_HD_01_V00.02a Page 71 of 90 12.08.2002
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5.4 Antenna design
This chapter describes the various options of connecting an external antenna to MC45. Be
sure that all peripherals are applied according to the manufacturer’s antenna specifications.
For internal antenna equipment, you are advised to use the services of a consultant or fullservice house.
5.4.1 Hirose antenna connector
MC45 uses an ultra-miniature SMT antenna connector supplied
from Hirose Ltd. The product name is:
U.FL-R-SMT
The position of the antenna connector on the MC45 board can be
seen in Figure 28.
Figure 33: Mechanical dimensions of U.FL-R-SMT connector
Table 23: Product specifications of U.FL-R-SMT connector
Item Specification Conditions
Ratings
Nominal impedance
Rated frequency DC to 3 GHz
Mechanical characteristics
Female contact holding
force
Repetitive operation Contact resistance:
Vibration No momentary disconnections of
Shock No momentary disconnections of
50 W
0.15 N min
Center 25 mW
Outside 15mW
1 µs;
No damage, cracks and looseness
of parts
1 µs.
No damage, cracks and looseness
of parts.
Operating temp:-40°c to + 90°C
Operating humidity: max. 90%
Measured with a Æ 0.475 pin
gauge
30 cycles of insertion and
disengagement
Frequency of 10 to 100 Hz, single
amplitude of 1.5 mm,
acceleration of 59 m/s2, for 5
cycles in the direction of each of
the 3 axes
Acceleration of 735 m/s2, 11 ms
duration for 6 cycles in the
direction of each of the 3 axes
Environmental characteristics
Humidity resistance No damage, cracks and looseness
of parts.
Insulation resistance:
100 MW min. at high humidity
500 MW min when dry
MC45_HD_01_V00.02a Page 72 of 90 12.08.2002
Exposure to 40°C, humidity of
95% for a total of 96 hours
MC45 Hardware Interface Description
P R E L I M I N A R Y
Temperature cycle No damage, cracks and looseness
of parts.
Contact resistance:
Center 25 mW
Outside 15mW
Salt spray test No excessive corrosion 48 hours continuous exposure to
Temperature: +40°C ® 5 to 35°C
® +90°C ® 5 to 35°C
Time: 30 min. ® within 5 min. ®
30 min. within 5 min
5% salt water
Table 24: Material and finish of U.FL-R-SMT connector and recommended plugs
Part Material Finish
Shell Phosphor bronze Silver plating
Male center contact Brass Gold plating
Female center contact Phosphor bronze Gold plating
Insulator Plug: PBT
Receptacle: LCP
Black
Beige
Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown
below and listed in Table 25. For latest product information please contact your Hirose
dealer or visit the Hirose home page, for example http://www.hirose.com
.
Figure 34: U.FL-R-SMT connector with U.FL-LP-040 plug
Figure 35: U.FL-R-SMT connector with U.FL-LP-066 plug
MC45_HD_01_V00.02a Page 73 of 90 12.08.2002
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In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as
an extremely space saving solution. This plug is intended for use with extra fine cable (up to
Æ 0.81 mm) and minimizes the mating height to 2 mm. See Figure 36 which shows the
Hirose datasheet.
Figure 36: Specifications of U.FL-LP-(V)-040(01) plug
MC45_HD_01_V00.02a Page 74 of 90 12.08.2002
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Table 25: Ordering information for Hirose U.FL Series
Item Part number HRS number
Connector on MC45 U.FL-R-SMT CL331-0471-0-10
Right-angle plug shell for
Æ 0.81 mm cable
Right-angle plug for
Æ 0.81 mm cable
Right-angle plug for
Æ 1.13 mm cable
Right-angle plug for
Æ 1.32 mm cable
Extraction jig E.FL-LP-N CL331-04441-9
U.FL-LP-040 CL331-0451-2
U.FL-LP(V)-040 (01) CL331-053-8-01
U.FL-LP-066 CL331-0452-5
U.FL-LP-066 CL331-0452-5
5.4.2 Antenna pad
The antenna pad on the bottom of the MC45 PCB must not come into contact with the
holding device or any other components of the host application. The pad must be a
surrounded by a restricted area filled with air, which must also be reserved 0.8 mm in height.
Hirose antenna connector
RF section
MC45 PCB
Antenna pad
Restricted area
Figure 37: Restricted area around antenna pad
MC45_HD_01_V00.02a Page 75 of 90 12.08.2002
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6 Electrical, reliability and radio characteristics
6.1 Absolute maximum ratings
Absolute maximum ratings for supply voltage and voltages on digital and analog pins of
MC45 are listed in Table 26. Exceeding these values will cause permanent damage to
MC45.
The power supply shall be compliant with the SELV safety standard defined in EN60950.
The supply current must be limited according to Table 26.
Table 26: Absolute maximum ratings
Parameter Min Max Unit
Peak current of power supply 0 4.0 A
RMS current of power supply (during one TDMA-frame) 0 0.7 A
Voltage at digital pins -0.3 3.3 V
Voltage at analog pins -0.3 3.0 V
Voltage at digital / analog pins in POWER DOWN mode -0.25 +0.25 V
Voltage at POWER pin 15 V
Voltage at CHARGE pin 15 V
Differential load resistance between EPNx and EPPx 15
W
6.2 Operating temperatures
Test conditions were specified in accordance with IEC 60068-2 (still air).
Table 27: Operating temperatures
Parameter Min Typ Max Unit
Ambient temperature (according to GSM 11.10) -20 25 55 °C
Restricted operation *) -25 to -20 55 to 70 °C
Automatic shutdown
MC45 board temperature
Battery temperature
-29
-18
>70
>60
**)
°C
°C
Charging temperature (software controlled fast charging) 0 +45 °C
*)
MC45 works, but deviations from the GSM specification may occur.
**)
T
= 70°C, conditions: GSM 900 PCL and V
amb max
BATT+ max
<4.0V
MC45_HD_01_V00.02a Page 76 of 90 12.08.2002
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6.3 Reliability characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 28: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm
amplitude
Frequency range: 20-500 Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes
Shock half-sinus Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
Dry heat Temperature: +70 ±2°C
Test duration: 16 h
Humidity in the test chamber: < 50%
Temperature
change (shock)
Damp heat cyclic High temperature: +55°C ±2°C
Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1 h
Number of repetitions: 100
DIN IEC 68-2-6
DIN IEC 68-2-27
EN 60068-2-2 Bb ETS
300019-2-7
DIN IEC 68-2-14 Na
ETS 300019-2-7
DIN IEC 68-2-30 Db
Cold (constant
exposure)
Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
Temperature: -40 ±2°C
Test duration: 16 h
ETS 300019-2-5
DIN IEC 68-2-1
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6.4 Power supply ratings
Table 29: Power supply ratings
Parameter Description Conditions Min Typ Max Unit
BATT+
I
BATT+
Supply voltage Reference points on MC45:
TP BATT+ and TP GND
Voltage must stay within the
min/max values, including voltage
drop, ripple, spikes.
Voltage drop during
transmit burst
Normal condition, power control
level for P
out max
Voltage ripple Normal condition, power control
level for P
out max
@ f<200kHz
@ f>200kHz
Average supply
current3)
POWER DOWN mode 50 100 µA
SLEEP mode @ DRX = 6 TBD mA
IDLE mode EGSM 900
GSM 1800/1900
TALK mode EGSM 9001)
GSM 1800/19002)
IDLE GPRS EGSM 900
3.3 4.1 4.5 V
400 mV
mV
50
2
TBD
mA
TBD
300
400 mA
270
TBD
mA
Peak supply current
(during 577µs transmission slot every
4.6ms)
1)
Power control level PCL 5
2)
Power control level PCL 0
3)
All average supply current values @ I
GSM 1800/1900
TBD
DATA mode GPRS,
(4 Rx, 1 Tx) EGSM 9001)
GSM 1800/19002)
360
330
DATA mode GPRS,
(3 Rx, 2 Tx) EGSM 9001)
GSM 1800/19002)
TBD
TBD
Power level 1)
= 0mA
VDD
460 mA
mA
2 3 A
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6.4.1 Current consumption during transmit burst
The diagrams provided in Figure 38 and Figure 39 illustrate the typical current consumption
of the application caused during a transmit burst. The typical peak current is shown vs. the
power level for 900 MHz, 1800 MHz and 1900 MHz and vs. the return loss of the antenna.
Test conditions: All measurements have been performed at T
= 25°C, V
amb
BATT+ nom
The reference points used on MC45 are the BATT+ and GND contacts (test points are
shown in Figure 29). All curves are for one TX slot, that is, for example, a voice call, CSD
call or Class 8 GPRS. Figures for Class 10 GPRS activities will be published in later releases
of this document.
Changing the conditions, e.g. in terms of temperature or voltage, will cause different results.
The current will be maximized when the maximum supply voltage is used together with a
total reflection at the RF interface.
= 4.1V.
1200
1000
800
600
400
Burst Current (mA)
200
0
0246810121416
1400
1200
1000
800
600
400
Burst Current (mA)
200
0
0246810121416
1800
1600
1400
1200
1000
800
600
Burst Current (mA)
400
200
0
5 7 9 11 13 15 17 19 21
PCS
Power Lev el
PCN
Power Lev el
GSM
Power Lev el
200
180
160
140
120
100
80
60
Avg Current (mA)
40
20
0
0 2 4 6 8 10 12 14 16
250
200
150
100
Avg Current (mA)
50
0
0 2 4 6 8 10 12 14 16
300
250
200
150
100
Avg Current (mA)
50
0
5 7 9 111315171921
PCS
Power Leve l
PCN
Power Lev el
GSM
Power Lev el
Test conditions: T
MC45_HD_01_V00.02a Page 79 of 90 12.08.2002
= 25°C, V
amb
BATT+ nom
= 4.1V measured at TP BATT+ and GND, 1 TX slot
Figure 38: Typical current consumption vs. power level
MC45 Hardware Interface Description
P R E L I M I N A R Y
Burst Current : GSM Ch50
3500
3000
2500
2000
1500
Current (mA)
1000
500
0
0 10203040
Re t u r n L o s s ( dB)
Burst Current : PCN Ch711
1600
1400
1200
1000
800
600
Current (mA)
400
200
0
0 10203040
Re t u r n L o s s ( dB)
Pw rClass5
Pw rClass10
Pw rClass15
Pw rClass19
Pw rClass0
Pw rClass5
Pw rClass10
Pw rClass15
Aver age Cur re nt : GSM Ch50
500
450
400
350
300
250
200
Current (mA)
150
100
50
0
010203040
Re tu r n L o s s ( dB)
Average Curr ent : PCN Ch711
300
250
200
150
100
Current (mA)
50
0
010203040
Re tu r n L o s s ( dB)
Pw rClass5
Pw rClass10
Pw rClass15
Pw rClass19
Pw rClass0
Pw rClass5
Pw rClass10
Pw rClass15
1600
1400
1200
1000
800
600
Current (mA)
400
200
0
0 10203040
Test conditions: T
Burst Current : PCS Ch761
Re t u r n L o s s ( dB)
= 25°C, V
amb
Figure 39: Typical current consumption vs. return loss
Pw rClass0
Pw rClass5
Pw rClass10
Pw rClass15
BATT+ nom
Average Curr ent : PCS Ch761
250
200
150
100
Current (mA)
50
0
0 1020 3040
Re tu r n L o s s ( dB)
Pw r Cl a s s 0
Pw r Cl a s s 5
Pw r Cl a s s 10
Pw r Cl a s s 15
= 4.1V measured at TP BATT+ and GND, 1 TX slot
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6.5 Electrical characteristics of the voiceband part
6.5.1 Setting audio parameters by AT commands
The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each
audio mode is assigned a separate set of parameters.
Table 30: Audio parameters adjustable by AT command
Parameter Influence to Range Gain range Calculation
inBbcGain MICP/MICN analogue amplifier gain
of baseband controller before ADC
inCalibrate digital attenuation of input signal
after ADC
outBbcGain EPP/EPN analogue output gain of
baseband controller after DAC
outCalibrate[n]
n = 0...4
sideTone digital attenuation of sidetone
digital attenuation of output signal
after speech decoder, before
summation of sidetone and DAC
present for each volume step[n]
is corrected internally by outBbcGain
to obtain a constant sidetone
independent of output volume
0...7 0...42dB 6dB steps
0...32767 -$...0dB 20 * log
(inCalibrate/
32768)
0...3 0...-18dB 6dB steps
0...32767 -$...+6dB 20 * log (2 *
outCalibrate[n]/
32768)
0...32767 -$...0dB 20 * log
(sideTone/
32768)
Note: The parameters inCalibrate, outCalibrate and sideTone accept also values from 32768
to 65535. These values are internally truncated to 32767.
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p
A
P R E L I M I N A R Y
6.5.2 Audio programming model
The audio programming model shows how the signal path can be influenced by varying the
AT command parameters. The model is the same for all three interfaces, except for the
parameters <outBbcGain> and <inBbcGain> which cannot be modified on the digital audio
interface is being used, since in this case the DAC is switched off.
The parameters inBbcGain and inCalibrate can be set with AT^SNFI. All the other
parameters are adjusted with AT^SNFO.
2,65V
1k
MIC2
10uF
1k
1k
1k
+0..42dB in
6dB-ste
s
inBbcGain
A
inCalibrate
-¥...0dB
D
sideTone
speechcoder
(0dB; -6db, 12dB; -18dB)
outBbcGain
D
A
+
Figure 40: AT audio programming model
outCalibrate[n]
n = 0...4
T parameter
speechdecoder
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6.5.3 Characteristics of audio modes
The electrical characteristics of the voiceband part depend on the current audio mode set
with the AT^SNFS command.
Table 31: Voiceband characteristics (typical), all values preliminary
Audio mode no.
AT^SNFS=
1 (Default
settings, not
2 3 4 5 6
adjustable)
Name Default
Handset
Purpose DSB with
M20T handset
Gain setting via AT
command. Defaults:
inBbcGain
outBbcGain
Default audio
Fix
4 (24dB)
1 (-6dB)
1 2 2 1 1 2 4)
Basic
Handsfree
Siemens Car
Kit Portable
Adjustable
2 (12dB)
1 (-6dB)
Headset User
Handset
Siemens
Headset
DSB with
individual
handset
Adjustable
5 (30dB)
2 (-12dB)
Adjustable
4 (24dB)
1 (-6dB)
Plain
Codec 1
Direct
access to
speech
coder
Adjustable
0 (0dB)
0 (0dB)
Plain
Codec 2
Direct
access to
speech
coder
Adjustable
0 (0dB)
0 (0dB)
interface
Power supply ON ON ON ON OFF OFF
Sidetone ON --- Adjustable Adjustable Adjustable Adjustable
Volume control OFF Adjustable Adjustable Adjustable Adjustable Adjustable
Limiter (receive) ON ON ON ON --- ---
Compressor
--- ON1) --- --- --- ---
(receive)
AGC (send) --- --- ON --- --- ---
Echo control (send) Suppression Cancellation +
suppression
--- Suppression
--- ---
Noise suppression2) --- up to 10dB 10dB --- --- ---
MIC input signal for
0dBm0 @ 1024 Hz
(default gain)
EP output signal in
mV rms. @ 0dBm0,
1024 Hz, no load
(default gain);
@ 3.14 dBm0
Sidetone gain at
default settings
1)
Adaptive, receive volume increases with higher ambient noise level.
2)
In audio modes with noise reduction, the microphone input signal for 0dBm0 shall be measured
23mV 58mV 7.5mV @
-3dBm0 due
to AGC
284mV 120mV
default @
max volume
300mV
default @
max volume
22.8dB -$ dB Affected by
AGC, 13dB
@ 7.5mV
(MIC)
23mV 315mV 315mV
284mV
default @
max
volume
22.8dB 0dB
895mV
3.7Vpp
@
sideTone
= 81923)
895mV
3.7Vpp
0dB
@
sideTone
= 81923)
with a sine burst signal for a tone duration of 5 seconds and a pause of 2 sec. The sine signal
appears as noise and, after approx. 12 sec, is attenuated by the noise reduction by up to 10dB.
3)
See AT^SNFO command in [1].
4)
Audio mode 5 and 6 are identical. With AT^SAIC, you can easily switch mode 5 to the second
interface. Therefore, audio mode 6 is only kept for compatibility to earlier Siemens GSM products.
MC45_HD_01_V00.02a Page 83 of 90 12.08.2002
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Note: With regard to acoustic shock, the cellular application must be designed to avoid
sending false AT commands that might increase amplification, e.g. for a high
sensitive earpiece. A protection circuit should be implemented in the cellular
application.
6.5.4 Voiceband receive path
Test conditions:
· The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise
stated.
· Parameter setup: gs = 0dB means audio mode = 5 for EPP1 to EPN1 and 6 for EPP2 to
EPN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384,
sideTone = 0.
Table 32: Voiceband receive path
Parameter Min Typ Max Unit Test condition / remark
Differential output
voltage (peak to peak)
Differential output gain
settings (gs) at 6dB
stages (outBbcGain)
Fine scaling by DSP
(outCalibrate)
Output differential
DC offset
Differential output
resistance
Differential load
capacitance
Absolute gain accuracy 0.8 dB Variation due to change in
Attenuation distortion
3.33 3.7 4.07 V from EPPx to EPNx
gs = 0dB @ 3.14 dBm0
no load
-18 0 dB Set with AT^SNFO
-$ 0 dB Set with AT^SNFO
100 mV gs = 0dB, outBbcGain = 0 and -6dB
2 " from EPPx to EPNx
1000 pF from EPPx to EPNx
temperature and life time
1 dB for 300...3900Hz,
@ EPPx/EPNx (333Hz) /
@ EPPx/EPNx (3.66kHz)
Out-of-band
discrimination
60 dB for f > 4kHz with in-band test
signal@ 1kHz and 1kHz RBW
gs = gain setting
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6.5.5 Voiceband transmit path
Test conditions:
· The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise
stated.
· Parameter setup: Audio mode = 5 for MICP1 to MICN1 and 6 for MICP2 to MICN2,
inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0
Table 33: Voiceband transmit path
Parameter Min Typ Max Unit Test condition/Remark
Input voltage (peak to peak)
MICP1 to MICN1, MICP2 to
MICN2
Input amplifier gain in 6dB steps
(inBbcGain)
Fine scaling by DSP (inCalibrate) -$ 0 dB Set with AT^SNFI
Input impedance MIC1 50 k"
Input impedance MIC2 2.0 k"
Microphone supply voltage ON
Ri = 4k"
Microphone supply voltage OFF ;
Ri = 4k"
Microphone supply in POWER
DOWN mode
1.03 V
0 42 dB Set with AT^SNFI
2.57
2.17
1.77
0 V
See Figure 17
2.65
2.25
1.85
2.73
2.33
1.93
V
V
V
no supply current
@ 100µA
@ 200µA
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6.6 Air interface
Test conditions: All measurements have been performed at T
= 25°C, V
amb
BATT+ nom
= 4.1V.
The reference points used on MC45 are the BATT+ and GND contacts (test points are
shown in Figure 29).
Table 34: Air Interface
Parameter Min Typ Max Unit
E-GSM 900 880 915 MHz Frequency range
Uplink (MS ® BTS)
GSM 1900 1850 1910 MHz
Downlink (BTS ® MS)
GSM 1900 1930 1990 MHz
GSM 1900 28 30 32
GSM 1800 1710 1785 MHz
E-GSM 900 925 960 MHz Frequency range
GSM 1800 1805 1880 MHz
E-GSM 900 31 33 35 dBm RF power @ ARP with 50" load
GSM 1800 28 30 32 dBm
E-GSM 900 174 Number of carriers
GSM 1800 374
GSM 1900 299
E-GSM 900 45 MHz Duplex spacing
GSM 1800 95 MHz
GSM 1900 80
Carrier spacing 200 kHz
Multiplex, Duplex TDMA / FDMA, FDD
Time slots per TDMA frame 8
Frame duration 4.615 ms
Time slot duration 577 µs
Modulation GMSK
Receiver input sensitivity @ ARP
BER Class II < 2.4%
E-GSM 900 -102 -105 dBm
GSM 1800 -102 -105 dBm
GSM 1900 -102 -105 dBm
MC45_HD_01_V00.02a Page 86 of 90 12.08.2002
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6.7 Electrostatic discharge
The GSM engine is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive
components. Proper ESD handling and packaging procedures must be applied throughout
the processing, handling and operation of any application that incorporates a MC45 module.
Special ESD protection provided on MC45:
Antenna interface: one spark discharge line (spark gap)
SIM interface: clamp diodes for protection against overvoltage.
The remaining ports of MC45 are not accessible to the user of the final product (since they
are installed within the device) and therefore, are only protected according to the “Human
Body Model” requirements.
MC45 has been tested and found to comply with the EN 61000-4-2 standard. The measured
values can be gathered from the following table.
Table 35: Measured electrostatic values
Specification / Requirements Contact discharge Air discharge
ETSI EN 301 489-7
ESD at SIM port
ESD at antenna port
Human Body Model (Test conditions: 1.5 kW, 100 pF)
ESD at the module
± 4kV ± 8kV
± 4kV ± 8kV
± 1kV
Note: Please note that the values may vary with the individual application design. For
example, it matters whether or not the application platform is grounded over
external devices like a computer or other equipment, such as the Siemens
reference application described in Chapter 7.
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7 Reference Approval
7.1 Reference Equipment
The Siemens reference setup that will be submitted to type approve MC45 consists of the
following components:
· Siemens MC45 cellular engine
· Development Support Box (DSB45)
· Flex cable (160 mm) from Hirose DF12C receptacle on MC45 to Hirose DF12 connector
on DSB45. Please note that this cable is not included in the scope of delivery of DSB45.
· SIM card reader integrated on the DSB45
· Handset type Votronic HH-SI-30.3/V1.1/0
· PC as MMI
Antenna or 50 W
cable to system
simulator
Antenna
PC
Power supply
RS-232
Figure 41: Reference equipment for approval
DSB45
Flex cable
160mm
DAI cable for
acoustic measuring
SIM
Handset
GSM engine
DAI Box
Acoustic tester
MC45_HD_01_V00.02a Page 88 of 90 12.08.2002
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8 List of parts and accessories
Table 36: List of parts and accessories
Description Supplier Ordering information
MC45 Siemens Siemens ordering number L36880-N8300-A100
Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117
DSB45 Support Box Siemens Siemens ordering number: LS36880-N8301-A100
Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für
elektronische Geräte mbH
Saarbrücker Str. 8
D-66386 St. Ingbert
SIM card holder incl. push
button ejector and slide-in
tray
Battery cell XWODA Shenzhen
DF12C board-to-board
connector
Molex Ordering numbers: 91228
Xwoda
Electronic Co.,
Ltd
Hirose See Chapter 5.3 for details on receptacle on MC45
Phone: 06 89 4 / 92 55-0
Fax: 06 89 4 / 92 55-88
e-mail: contact@votronic.com
91236
Sales contacts are listed in Table 37.
To place orders or obtain more information please
contact:
Shenzhen Xwoda Electronic Co., Ltd
Unit 3003, Yingjingyuan,Zhongdian Garden,
Shenzhen 518032
P.R.China
Contact:
Edward Lau or Andy Zhao
Phone: +86-755-7623789 ext. 314
Fax: +86-755-7623078
Email: Edward-lau@xwoda.com.cn
Email: Andy-zhao@Xwoda.com.cn
Info:
Http://xwoda.com.cn
and mating headers
U.FL-R-SMT antenna
connector
Hirose See Chapter 5.4 for details on U.FL-R-SMT
Sales contacts are listed in Table 38.
connector, mating plugs and cables
Sales contacts are listed in Table 38.
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Table 37: Molex sales contacts (subject to change)
Molex
For further information
please click:
http://www.molex.com/
Molex China Distributors
Beijing,
Room 1319, Tower B,
COFCO Plaza
No. 8, Jian Guo Men Nei
Street, 100005
Beijing People's Republic of
China
Phone: 86-10-6526-9628
Phone: 86-10-6526-9728
Phone: 86-10-6526-9731
Fax: 86-10-6526-9730
Molex Deutschland GmbH
Felix-Wankel-Str. 11
D-74078 Heilbronn-Biberach
Phone: +49(7066)9555 0
Fax: +49(7066)9555 29
Email: mxgermany@molex.com
Molex Singapore Pte. Ltd.
Jurong, Singapore
Phone: 65-268-6868
Fax: 65-265-6044
Table 38: Hirose sales contacts (subject to change)
American Headquarters
Lisle, Illinois 60532 U.S.A.
Phone: 1-800-78MOLEX
Fax: 630-969-1352
Molex Japan Co. Ltd.
Yamato, Kanagawa, Japan
Phone: 81-462-65-2324
Fax: 81-462-65-2366
Hirose Ltd.
For further information
please click:
http://www.hirose.com
Hirose Electric UK, Ltd
Crownhill Business Centre
22 Vincent Avenue,
Crownhill
Milton Keynes, MK8 OAB
Phone: 44-1908-305400
Fax: 44-1908-305401
Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
Phone: 805-522-7958
Fax: 805-522-3217
Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141, Japan
Phone: 03-3491-9741
Fax: 03-3493-2933
Hirose Electric GmbH
Zeppelinstrasse 42
73760 Ostfildern
Kemnat 4
Phone: +49 711 4560-021
Fax +49 711 4560-729
E-mail info@hirose.de
Hirose Electric Co., Ltd.
Eroupean Brance
First class Building 4F
Beechavenue 46, 1119PV
Schiphol-Rijk, Netherlands
Phone: 31-20-6557-460
Fax: 31-20-6557-469
MC45_HD_01_V00.02a Page 90 of 90 12.08.2002
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