Gemalto M2M MC45 User Manual

Siemens Cellular Engine
Version 00.02 DocID: MC45_HD_01_V00.02a
Hardware
Interface
Description
MC45 Hardware Interface Description
P R E L I M I N A R Y
Document Name:
MC45 Hardware Interface Description
Version: 00.02 Date: August 12, 2002 DocId: MC45_HD_01_V00.02a
Status:
PRELIMINARY
General notes
With respect to any damages arising in connection with the described product or this document, Siemens shall be liable according to the General Conditions on which the delivery of the described product and this document are based. This product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Siemens AG customers using or selling this product for use in such applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Handheld applications such as mobile phones or PDAs incorporating the described product must be in accordance with the guidelines for human exposure to radio frequency energy. The Specific Absorption Rate (SAR) of the application must be evaluated and approved to be compliant with national and international safety standards or directives.
Subject to change without notice at any time.
Copyright notice Copying of this document and giving it to others and the use or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design.
Copyright © Siemens AG 2002
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Contents
0 Version History........................................................................................................... 7
1 Introduction ................................................................................................................ 9
1.1 Related documents ............................................................................................. 9
1.2 Terms and abbreviations....................................................................................10
1.3 Type approval ....................................................................................................13
1.4 Safety precautions .............................................................................................15
2 Product concept........................................................................................................17
2.1 MC45 key features at a glance...........................................................................18
2.2 Circuit concept ...................................................................................................21
3 Application Interface.................................................................................................22
3.1 Operating modes ...............................................................................................23
3.2 Power supply .....................................................................................................25
3.2.1 Power supply pins on the board-to-board connector.............................25
3.2.2 Minimizing power losses.......................................................................26
3.2.3 Charging control...................................................................................27
3.2.3.1 Battery pack characteristics ......................................................28
3.2.3.2 Recommended battery pack .....................................................29
3.2.3.3 Implemented charging technique ..............................................30
3.2.3.4 Operating modes during charging.............................................31
3.2.3.5 Charger requirements...............................................................32
3.3 Power up / down scenarios ................................................................................33
3.3.1 Turn on MC45 ......................................................................................33
3.3.1.1 Turn on MC45 using the ignition line /IGT (Power on)...............33
3.3.1.2 Timing of the ignition process ...................................................34
3.3.1.3 Turn on MC45 using the POWER signal...................................35
3.3.1.4 Turn on MC45 using the RTC (Alarm mode).............................35
3.3.2 Power saving........................................................................................36
3.3.2.1 No power saving (AT+CFUN=1)................................................36
3.3.2.2 NON-CYCLIC SLEEP mode (AT+CFUN=0)..............................36
3.3.2.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7 and 8).....................36
3.3.2.4 Timing of the /CTS signal in CYCLIC SLEEP modes ................37
3.3.2.5 Wake up MC45 from SLEEP mode...........................................39
3.3.3 Turn off MC45 ......................................................................................40
3.3.3.1 Turn off MC45 using AT command ...........................................40
3.3.3.2 Emergency shutdown using /EMERGOFF pin...........................41
3.3.4 Automatic shutdown .............................................................................42
3.3.4.1 Temperature dependent shutdown............................................42
3.3.4.2 Undervoltage shutdown if battery NTC is present .....................43
3.3.4.3 Undervoltage shutdown if no battery NTC is present ................43
3.3.4.4 Shutdown in the event of overvoltage .......................................44
3.3.5 Summary of state transitions................................................................45
3.4 RTC backup.......................................................................................................46
3.5 Serial interfaces .................................................................................................47
3.6 Audio interfaces .................................................................................................49
3.6.1 Microphone circuit ................................................................................50
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3.6.2 Speech processing...............................................................................51
3.6.3 DAI timing.............................................................................................51
3.7 SIM interface......................................................................................................53
3.7.1 Requirements for using the CCIN pin ...................................................54
3.7.2 Design considerations for SIM card holder...........................................55
3.7.3 Grounding the SIM interface.................................................................56
3.8 Control signals ...................................................................................................57
3.8.1 Inputs ...................................................................................................57
3.8.2 Outputs.................................................................................................58
3.8.2.1 Synchronization signal ..............................................................58
3.8.2.2 Using the SYNC pin to control a status LED .............................59
3.8.2.3 Behaviour of the /RING0 line (RS-232(0) interface only)...........60
3.9 Electrical specifications of the application interface............................................61
4 Antenna interface (antenna reference point – ARP) ...............................................65
5 Physical characteristics ...........................................................................................66
5.1 Mechanical dimensions of MC45........................................................................66
5.2 Mounting MC45 onto the application platform ....................................................69
5.3 Board-to-board connector ..................................................................................70
5.3.1 Mechanical dimensions of the Hirose DF12 connector .........................71
5.3.2 Adapter cabling ....................................................................................71
5.4 Antenna design ..................................................................................................72
5.4.1 Hirose antenna connector ....................................................................72
5.4.2 Antenna pad.........................................................................................75
6 Electrical, reliability and radio characteristics .......................................................76
6.1 Absolute maximum ratings.................................................................................76
6.2 Operating temperatures .....................................................................................76
6.3 Reliability characteristics ....................................................................................77
6.4 Power supply ratings..........................................................................................78
6.4.1 Current consumption during transmit burst...........................................79
6.5 Electrical characteristics of the voiceband part...................................................81
6.5.1 Setting audio parameters by AT commands.........................................81
6.5.2 Audio programming model ...................................................................82
6.5.3 Characteristics of audio modes ............................................................83
6.5.4 Voiceband receive path ........................................................................84
6.5.5 Voiceband transmit path.......................................................................85
6.6 Air interface........................................................................................................86
6.7 Electrostatic discharge.......................................................................................87
7 Reference Approval ..................................................................................................88
7.1 Reference Equipment ........................................................................................88
8 List of parts and accessories...................................................................................89
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Figures
Figure 1: MC45 block diagram .............................................................................................21
Figure 2: Power supply limits during transmit burst ..............................................................26
Figure 3: Schematic of approved charging transistor, trickle charging and ESD protection ..27
Figure 4: Battery pack circuit diagram ..................................................................................28
Figure 5: Charging process..................................................................................................30
Figure 6: Power-on by ignition signal....................................................................................33
Figure 7: Timing of power-on process if VDDLP is not used ................................................34
Figure 8: Timing of power-on process if VDDLP is fed from external source........................34
Figure 9: Timing of /CTS signal (example for a 2.12 s paging cycle)....................................37
Figure 10: Beginning of power saving if CFUN=5.................................................................38
Figure 11: Deactivating GSM engine by /EMERGOFF signal...............................................41
Figure 12: RTC supply from capacitor..................................................................................46
Figure 13: RTC supply from rechargeable battery................................................................46
Figure 14: RTC supply from non-chargeable battery............................................................46
Figure 15: RS-232 interfaces ...............................................................................................47
Figure 16: Audio block diagram............................................................................................49
Figure 17: Schematic of microphone inputs .........................................................................50
Figure 18: DAI timing on transmit path .................................................................................52
Figure 19: DAI timing on receive path ..................................................................................52
Figure 20: SIM card holder of DSB45 Support Box ..............................................................55
Figure 21: Connecting a separate ground for SIM interface .................................................56
Figure 22: SYNC signal during transmit burst ......................................................................58
Figure 23: LED Circuit (Example).........................................................................................59
Figure 24: Incoming voice call ..............................................................................................60
Figure 25: Incoming data call ...............................................................................................60
Figure 26: Pin assignment (top view on MC45) ....................................................................61
Figure 27: MC45 – top view..................................................................................................66
Figure 28: Mechanical dimensions of MC45.........................................................................67
Figure 29: MC45 bottom view...............................................................................................68
Figure 30: Hirose DF12C receptacle on MC45.....................................................................70
Figure 31: Header Hirose DF12 series.................................................................................70
Figure 32: Mechanical dimensions of Hirose DF12 connector..............................................71
Figure 33: Mechanical dimensions of U.FL-R-SMT connector..............................................72
Figure 34: U.FL-R-SMT connector with U.FL-LP-040 plug ...................................................73
Figure 35: U.FL-R-SMT connector with U.FL-LP-066 plug ...................................................73
Figure 36: Specifications of U.FL-LP-(V)-040(01) plug.........................................................74
Figure 37: Restricted area around antenna pad ...................................................................75
Figure 38: Typical current consumption vs. power level .......................................................79
Figure 39: Typical current consumption vs. return loss.........................................................80
Figure 40: AT audio programming model .............................................................................82
Figure 41: Reference equipment for approval ......................................................................88

Tables

Table 1: MC45 key features .................................................................................................18
Table 2: Coding schemes and maximum net data rates over air interface ...........................20
Table 3: Overview of operating modes.................................................................................23
Table 4: Power supply pins of board-to-board connector .....................................................25
Table 5: Bill of material for external charging circuit .............................................................27
Table 6: Specifications of XWODA battery pack ..................................................................29
Table 7: Comparison Charge-only and Charge mode ..........................................................31
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Table 8: AT commands available in Charge-only mode .......................................................32
Table 9: AT commands available in Alarm mode .................................................................35
Table 10: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes............................39
Table 11: Temperature dependent behaviour.......................................................................43
Table 12: State transitions of MC45 .....................................................................................45
Table 13: Signals of the SIM interface (board-to-board connector) ......................................53
Table 14 : Pin assignment of Molex SIM card holder on DSB45 Support Box ......................55
Table 15: Input control signals of the MC45 module.............................................................57
Table 16: MC45 synchronization signal (if SYNC pin is set to mode 0 via AT^SSYNC)........58
Table 17: Coding of the status LED......................................................................................59
Table 18: MC45 ring signal...................................................................................................60
Table 19: Pin assignment and electrical description of application interface ........................62
Table 20: Return loss ...........................................................................................................65
Table 21: Ordering information DF12 series.........................................................................70
Table 22: Electrical and mechanical characteristics of the Hirose DF12C connector............70
Table 23: Product specifications of U.FL-R-SMT connector .................................................72
Table 24: Material and finish of U.FL-R-SMT connector and recommended plugs...............73
Table 25: Ordering information for Hirose U.FL Series.........................................................75
Table 26: Absolute maximum ratings ...................................................................................76
Table 27: Operating temperatures........................................................................................76
Table 28: Summary of reliability test conditions....................................................................77
Table 29: Power supply ratings ............................................................................................78
Table 30: Audio parameters adjustable by AT command .....................................................81
Table 31: Voiceband characteristics (typical), all values preliminary.....................................83
Table 32: Voiceband receive path ........................................................................................84
Table 33: Voiceband transmit path.......................................................................................85
Table 34: Air Interface..........................................................................................................86
Table 35: Measured electrostatic values ..............................................................................87
Table 36: List of parts and accessories ................................................................................89
Table 37: Molex sales contacts (subject to change) .............................................................90
Table 38: Hirose sales contacts (subject to change) ............................................................90
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0 Version History
Preceding document: "MC45 Hardware Interface Description" Version 00.02 New document: "MC45 Hardware Interface Description" Version 00.02a
Chapter Page What is new
Throughout this manual: Replaced product photo of MC45.
1.4 15f Added notes regarding compliance with FCC guidelines
Preceding document: "MC45 Hardware Interface Description" Version 00.01 New document: "MC45 Hardware Interface Description" Version 00.02
Chapter Page What is new
Throughout this manual: All RS-232 signals, /IGT signal and /EMERGOFF are now preceded by “/” to indicate that the signals are active low.
2.1
3.5
2.1 18ff Deleted statements on current consumption and storage temperature
2.2 21 Modified block diagram.
3.2
3.9
3.2.1 25 Deleted parameter of CHARGE pin.
3.2.3 27 Revised description of trickle and fast charging.
3.3.2 36 Revised information on power saving.
3.7.2 55 Figure 20 updated. Note regarding capacitors C1205 and C1206 added.
3.9 61ff Changed numbering of pins.
4 65 Removed introduction.
5.1 66ff Updated MC45 drawings. Added bottom view and information about test
18ff 47
25 61
Deleted CMOS. The RS-232 interface operates at 2.65V.
Serial interfaces: Autobauding also supported at 230kbps
VDD pin recommended, for example, for LED or level shifter.
Corrected comments on BATT+ pin, VDD pin, VDDLP pin.
Corrected signal parameters of RS-232 interfaces and associated comments (no more necessary to connect unused input pins to VDD).
Corrected input voltage (peak to peak).
points and ground pad.
5.2 69 Added recommendations for installation.
5.3 70 Table 21: Corrected HRS number of DF12C receptacle.
Table 22: Added insertion and withdrawal force.
5.4.1 72ff Added specifications of U.FL-LP-(V)-040(01
6.1 76 Table 26: Added differential load resistance between EPN and EPP
6.2 76 Corrected description (without modifying operating temperatures).
6.3 77 Added information about reliability characteristics and temperature.
6.5 81 Added test points
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6.4.1 79ff Added current consumption during transmit burst.
6.5 81ff Added notes on AT commands where applicable.
Table 31: Modified MIC input signal in modes 5 and 6.
Table 32: Added Differential load capacitance 1000pF.
Table 33: Voiceband transmit path: Corrected input voltage (peak to peak).
6.6 86 Updated Table 34: Air Interface
8 89 Added ordering information for VOTRONIC handset
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1 Introduction
This document describes the hardware interface of the Siemens MC45 module that connects to the cellular device application and the air interface. As MC45 is intended to integrate with a wide range of application platforms, all functional components are described in great detail.
So this guide covers all information you need to design and set up cellular applications incorporating the MC45 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and, last but not least, information on the requirements to be considered for integrating further components.
1.1 Related documents
[1] MC45 AT Command Set for Version 00.02 [2] MC45 GPRS Startup User's Guide (in preparation) [3] MC45 Remote-SAT User's Guide, as of Version 00.02 (in preparation) [4] DSB45 Support Box - Evaluation Kit for Siemens Cellular Engines [5] Application Note 16: Upgrading MC45 Firmware (in preparation) [6] Application Note 14: Audio and Battery Parameter Download [7] MC45 Multiplexer User's Guide, as of Version 00.02 (in preparation)
Prior to using the MC45 engines be sure to carefully read and understand the latest product information provided in the Release Notes (not available for release 00.02.)
To visit the Siemens Website you can use the following link:
http://www.siemens.com/wm
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1.2 Terms and abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
B Thermistor Constant
B2B Board-to-board connector
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
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Abbreviation Description
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion Lithium-Ion
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSU Power Supply Unit
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
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Abbreviation Description
RMS Root Mean Square (value)
ROM Read-only Memory
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMS Short Message Service
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM engine)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Phonebook abbreviations
FD SIM fixdialling phonebook
LD SIM last dialling phonebook (list of numbers most recently dialled)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ME Mobile Equipment phonebook
ON Own numbers (MSISDNs) stored on SIM or ME
RC Mobile Equipment list of received calls
SM SIM phonebook
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1.3 Type approval
MC45 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed.
European Directives
99/05/EC Directive of the European Parliament and of the council of 9 March
1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity, in short referred to as R&TTE Directive 1999/5/EC
89/336/EC Directive on electromagnetic compatibility
73/23/EC Directive on electrical equipment designed for use within certain
voltage limits (Low Voltage Directive)
North American Approval
FCC US Equipment Authorization
UL Product Safety Certification
Standards of type approval
ETS 300 607-1 Digital cellular telecommunications system (Phase 2);
Mobile Station (MS) conformance specification; (equal GSM 11.10-1=>equal 3GPP51.010-1)
ETSI EN 301 511 V7.0.1 (2000-12) Candidate Harmonized European Standard
(Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)
ETSI EN 301 489-7 V1.1.1 (2000-09) Candidate Harmonized European Standard
(Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)
EN 60 950 Safety of information technology equipment (2000)
UL 60 950 Safety requirements
CFR Title 47 Code of Federal Regulations, Part 2 and Part 15
(Telecommunications, PCS)
Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
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SAR requirements specific to handheld mobiles
Mobile phones, PDAs or other handheld transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of handheld MC45 based applications to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for handheld operation. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations of directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to
Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz-6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to electromagnetic fields (300 MHz - 3 GHz)
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1.4 Safety precautions
The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC45. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the
use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency
energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for handsfree operation. Before making a call with a hand-held terminal or mobile, park the vehicle.
Handsfree devices must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
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IMPORTANT!
SOS
Compliance with FCC guidelines
Cellular terminals or mobiles operate using radio signals and cellular networks cannot be guaranteed to connect in all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
Fix-mount and mobile devices incorporating MC45 modules must be designed to maintain a minimum separation distance of 20 cm between the antenna and the end user to satisfy RF exposure requirements for mobile transmitting devices.
For portable devices incorporating MC45 modules the manufacturer of the final device is responsible to perform SAR measurements.
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2 Product concept
Designed for use on any GSM network in the world, Siemens MC45 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM 1900 MHz. MC45 features GPRS multislot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.
To save space on the application platform, MC45 comes as an extremely slim and compact module. This makes it ideally suited for a broad range of mobile computing devices, such as laptops, notebooks, multimedia appliances, and particularly offers easy integration with PDAs, pocket organizers or miniature mobile phones.
The tiny MC45 module incorporates all you need to create high-performance GSM/GPRS solutions: baseband processor, power supply ASIC, complete radio frequency circuit including a power amplifier and antenna interface. The power amplifier is directly fed from the supply voltage BATT+. The MC45 software is residing in a flash memory device. An additional SRAM enables MC45 to meet the demanding requirements of GPRS connectivity.
The physical interface to the cellular application is made through a board-to-board connector. It consists of 50 pins, required for controlling the unit, transferring data and audio signals and providing power supply lines.
MC45 comprises two serial (RS-232) interfaces giving you maximum flexibility for easy integration with the Man-Machine Interface (MMI).
An extremely versatile audio concept offers various audio interfaces, each available on the board-to-board connector: a digital audio interface (DAI) and two analog audio interfaces. This allows you to connect up to three audio devices in any combination, all at the same time. Using AT commands you can easily switch back and forth and select different audio modes.
The external dual-band or triple-band antenna can be connected optionally to a connector on the top side or to a pad on the bottom side.
For battery powered applications, MC45 features a charging control which can be used to charge a Li-Ion battery. The charging circuit must be implemented outside the module on the application platform.
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2.1 MC45 key features at a glance
Table 1: MC45 key features
Feature Implementation
Power supply Single supply voltage 3.3V – 4.5V
GSM class Small MS
Frequency bands
Transmit power
GPRS connectivity
Temperature range
Temperature control and auto switch-off
DATA GPRS:
CSD:
WAP:
· Tri-band EGSM 900, GSM 1800, GSM 1900
· Compliant to GSM Phase 2/2+
· Class 4 (2W) at EGSM900
· Class 1 (1W) at GSM1800 and GSM 1900
· GPRS multi-slot class 10
· GPRS mobile station class B
· Normal operation: -20°C to +55°C
· Restricted operation: -25°C to -20°C and +55°C to +70°C
· Constant temperature control prevents damage from the module when
the specified temperature is exceeded.
· GPRS data downlink transfer: max. 85.6 kbps (see Table 2)
· GPRS data uplink transfer: max. 21.4 kbps (see Table 2)
· Coding scheme: CS-1, CS-2, CS-3 and CS-4
· MC45 supports the two protocols PAP (Password Authentication
Protocol) and CHAP (Challenge Handshake Authentication Protocol) commonly used for PPP connections.
· Support of Packet Switched Broadcast Control Channel (PBCCH) allows you to benefit from enhanced GPRS performance when offered by the network operators.
· CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent, V.110
· Unstructured Supplementary Services Data (USSD) support
· WAP compliant
SMS
FAX Group 3: Class 1, Class 2
MC45_HD_01_V00.02a Page 18 of 90 12.08.2002
· MT, MO, CB, Text and PDU mode
· SMS storage: SIM card plus 25 SMS locations in the mobile equipment
· Transmission of SMS alternatively over CSD or GPRS. Preferred mode
can be user-defined.
MC45 Hardware Interface Description
P R E L I M I N A R Y
Feature Implementation
SIM interface
External antenna Connected via 50 Ohm antenna connector or antenna pad
Audio interfaces Two analog audio interfaces, one digital audio interface (DAI)
Speech codec
Two serial interfaces: RS-232(0), RS-232(1)
· Supported SIM card: 3V
· External SIM card reader has to be connected via interface connector
(note that card reader is not part of MC45)
· Half Rate (ETS 06.20)
· Full Rate (ETS 06.10)
· Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
· 2.65V level, bi-directional bus for AT commands and data
· RS-232(0) – full-featured RS-232 interface. Supports RTS0/CTS0
hardware handshake and software XON/XOFF flow control. Multiplex ability according to GSM 07.10 Multiplexer Protocol.
· RS-232(1) - 4-wire RS-232 interface. Supports RTS1/CTS1 hardware handshake.
· Baud rate: 300bps ... 230kbps on RS-232(0), RS-232(1)
· Autobauding: RS-232(0) only: Supported baud rates are 1200, 2400,
4800, 9600, 19200, 38400, 57600, 115200, 230400 bps
Phonebook management
SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98
Real time clock Implemented
Timer function Programmable via AT command
Physical characteristics Size: 53 +0.2 x 34 +0.2 x 3.5+0.3 mm
Firmware upgrade Firmware upgradable over serial interface and SIM interface
Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type
Supported phonebook types: SM, FD, LD, MC, RC, ON, ME
Weight: 10g
approve Siemens cellular engines and provide a sample configuration for application engineering. See Chapter 8 for ordering information.
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Table 2: Coding schemes and maximum net data rates over air interface
Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots
CS-1: 9.05 kbps 18.1 kbps 36.2 kbps
CS-2: 13.4 kbps 26.8 kbps 53.6 kbps
CS-3: 15.6 kbps 31.2 kbps 62.4 kbps
CS-4: 21.4 kbps 42.8 kbps 85.6 kbps
Please note that the values stated above are maximum ratings which, in practice, are influenced by a great variety of factors, primarily, for example, traffic variations and network coverage.
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P R E L I M I N A R Y
2.2 Circuit concept
Figure 1 shows a block diagram of the MC45 module and illustrates the major functional components:
· GSM / GPRS baseband processor
· Power supply ASIC
· Flash
· SRAM
· GSM RF section incl. transceiver and RF power amplifier
· Antenna interface
· Application interface (board-to-board connector)
RF Power Amplifier
RF Part
Measuring Network
MC45
Interface RF - Baseband
Send
Receive
Control
GSM Controller
CCRST CCCLK CCIO
5
CCIN (GND)
6
Power Supply ASIC
Figure 1: MC45 block diagram
Data
Adr
Control
Data
Control
Adr
5
9
8
RS232(0)
4
RS232(1)
6
SIM Interface
EMERGOFF
POWER
CHARGE
5
5
BATT_TEMP
DAI
2x Audio
SYNC
VDD
VDDLP
IGT
BATT+
GND
SRAM
Flash
CCIN
CCVCC
4
SIM
(50 pins)
Application Interface
Ext.
Charging
Circuit
POWER
NTC
+
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3 Application Interface
MC45 is equipped with a 50-pin 0.5mm pitch board-to-board connector that connects to the cellular application platform. The host interface incorporates several sub-interfaces described in the following chapters:
· Power supply and charging control (see Chapters 3.2 and 3.3)
· Dual serial interface (see Chapter 3.5)
· Two analog audio interfaces and a digital audio interface (see Chapter 3.6)
· SIM interface (see Chapter 3.7)
Electrical and mechanical characteristics of the board-to-board connector are specified in Chapter 5.3. Ordering information for mating connectors and cables are included.
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3.1 Operating modes
The table below briefly summarizes the various operating modes referred to in the following chapters.
Table 3: Overview of operating modes
Mode Function
Normal operation
GSM / GPRS SLEEP Various powersave modes set with AT+CFUN
command.
Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=5, 6, 7 and 8 alternatingly activate and deactivate the AT interfaces to allow permanent access to all AT commands.
GSM IDLE Software is active. Once registered to the GSM network,
paging with BTS is carried out. The module is ready to send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data is
currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).
POWER DOWN Normal shutdown after sending the AT^SMSO command.
The Power Supply ASIC (PSU-ASIC) disconnects the supply voltage from the baseband part of the circuit. Only a voltage regulator in the PSU-ASIC is active for powering the RTC. Software is not active. The RS-232 interfaces are not accessible.
Operating voltage (connected to BATT+) remains applied.
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Mode Function
Alarm mode Restricted operation launched by RTC alert function while the module is in
POWER DOWN mode. Module will not be registered to GSM network. Limited number of AT commands is accessible.
If application is battery powered: No charging functionality in Alarm mode.
Charge-only mode Limited operation for battery powered applications. Enables charging while
module is detached from GSM network. Limited number of AT commands is accessible. There are several ways to launch Charge-only mode:
· From POWER DOWN mode: Connect charger to the POWER pin of MC45 when engine was powered down by AT^SMSO.
· From Normal mode: Connect charger to the POWER pin of MC45, then enter AT^SMSO.
Charge mode during normal operation
Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and charging running in parallel. Charge mode changes to Charge-only mode when the module is powered down before charging has been completed.
See Table 10 and Table 12 for the various options of waking up MC45 and proceeding from one mode to another.
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3.2 Power supply
The power supply of MC45 has to be a single voltage source of V
= 3.3V...4.5V. It must
BATT+
be able to provide sufficient current in a transmit burst which typically rises to 2A. Beyond that, the power supply must be able to account for increased current consumption if the module is exposed to inappropriate conditions, for example antenna mismatch. For further details see Chapters 3.2.2 and 6.4.1.
All the key functions for supplying power to the device are handled by an ASIC power supply. The ASIC provides the following features:
· Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators.
· Controls the module's power up and s procedures. A watchdog logic implemented in the baseband processor periodically sends signals to the ASIC, allowing it to maintain the supply voltage for all digital MC45 components. Whenever the watchdog pulses fail to arrive constantly, the module is turned off.
· Delivers, across the VDD pin, a regulated voltage of 2.9V. The output voltage VDD may be used to supply, for example, an external LED or a level shifter. However, the external circuitry must not cause any spikes or glitches on voltage VDD. This voltage is not available in POWER DOWN mode. Therefore, the VDD pin can be used to indicate whether or not MC45 is in POWER DOWN mode.
· Includes a switch to provide power to the SIM interface.
The RF power amplifier is driven directly from BATT+.
3.2.1 Power supply pins on the board-to-board connector
Five BATT+ pins of the board-to-board connector are dedicated to connect the supply voltage, five GND pins are recommended for grounding. The POWER and CHARGE pins serve as control signals for charging a Li-Ion battery. VDDLP can be used to back up the RTC.
Table 4: Power supply pins of board-to-board connector
Signal name I/O Description Parameter
BATT+ I/O Positive operating voltage
GND - Ground 0 V
POWER I This line signalizes to the
processor that the charger is connected.
CHARGE O Control signal for external
charging transistor
VDDLP I/O Can be used to back up the
RTC when V applied. See Chapter 3.4
BATT+
is not
3.3 V...4.5 V, I
The minimum operating voltage must not fall below 3.3 V, not even in case of voltage drop.
U UIN = 2.0 V...5.5 V Ri = 1kW I
in,max
OUT,max
= 30µA
< V
£ 2 A during transmit burst
typ
BATT+
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MC45 Hardware Interface Description
P R E L I M I N A R Y
3.2.2 Minimizing power losses
When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage V even in a transmit burst where current consumption can rise to peaks of 2A. It should be noted that MC45 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV. For further details see Chapter 6.4.
The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered.
Note: If the application design requires an adapter cable between both board-to-board
connectors, use a flex cable as short as possible in order to minimize power losses.
Example: If the length of the flex cable reaches the maximum length of 200mm, this
connection may cause, for example, a resistance of 50m! in the BATT+ line and 50m! in the GND line. As a result, a 2A transmit burst would add up to a total voltage drop of 200mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery.
never drops below 3.3 V on the MC45 board, not
BATT+
BATT+
min. 3.3V
Transmit
burst 2A
Figure 2: Power supply limits during transmit burst
Transmit
burst 2A
max. 400mV
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3.2.3 Charging control
MC45 integrates a charging management for Li-Ion batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm.
MC45 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application. In this case, MC45 needs to be powered from a Li-Ion battery pack, e.g. as specified in Table 6.
The module only delivers, via its POWER line and CHARGE line, the control signals needed to start and stop the charging process. The charging circuit should include a transistor and should be designed as illustrated in Figure 3. A list of parts recommended for the external circuit is given in Table 5.
BATT_TEMP
1
/5 ESDA6V1-5W6
470R
1SS355
BATT+POWER
pcb spark
gap
100nF 10k
4V3
SI3441DV
CRS04
3k3
1
/5 ESDA6V1-5W6
CHARGE
Figure 3: Schematic of approved charging transistor, trickle charging and ESD protection
Table 5: Bill of material for external charging circuit
Part Description First supplier Second supplier
SI3441DV
1SS355 100mA Si-diode (UMD2) ROHM: 1SS355TE-18 Toshiba: 1SS352TPH3
p-chan 2.5V (G-S) MOSFET (TSOP-6)
VISHAY: SI3441DV-T1 NEC: UPA1911TE-T1
CRS04 1A Shottky diode Toshiba: CRS04 -
4V3
250mW; 200mA;
4.3V Z-Diode (SOD323)
Philips: PDZ4.3B
ROHM: UDZS4.3B UDZ4.3B
ESDA6V1-5W6 ESD protection transil array STM: ESDA6V1-5W6 -
470R, 3k3, 10k Resistor, e.g. 0805 or 0603 - -
100nF Ceramic capacitor 50V - -
PCB spark gap 0.2mm spark gap on PCB - -
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