Gemalto M2M HC25 User Manual

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HC25 Siemens Cellular Engine

Version: 00.220 DocId: HC25_HO_v00.220

Hardware Interface Overview

HC25 Hardware Interface Overview

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Date: DocId: Status: Supported Products:

General Notes

Product is deemed accepted by Recipient and is pr ovided without interface to Recipient´s products. The Product constitutes pre-release version and code and ma y be changed substantially befor e commercial release. The Product is provided on an “as is” basis only and m ay contain deficiencies o r inadequ acies. The Product is provided without warranty of any kind, express or implied. To the maximum exten t permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to re sult in per sona l injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required pr ocedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time.

HC25 Hardware Interface Overview

00.220 2007-03-20 HC25_HO_v00.220 Confidential / Preliminary HC25

Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.

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HC25 Hardware Interface Overview

Contents

1 Introduction.................................................................................................................6

1.1 Related Documents ...........................................................................................6

1.2 Terms and Abbreviations...................................................................................6

1.3 Regulatory and Type Approval Information .......................................................9

1.3.1 Directives and Standards......................................................................9

1.4 SAR requirements specific to portable mobiles............................................... 11

1.4.1 SELV Requirements ...........................................................................11

1.5 Safety Precautions...........................................................................................12

2 Product Concept.......................................................................................................13

2.1 Key Features at a Glance................................................................................13

3 Application Interface.................................................................................................16

3.1 Operating Modes .............................................................................................16

4 Antenna Interface......................................................................................................17

4.1 Antenna Installation .........................................................................................17

4.2 Antenna Pad....................................................................................................18

4.3 Antenna Connector..........................................................................................19

5 Electrical, Reliability and Radio Characteristics....................................................23

5.1 Absolute Maximum Ratings.............................................................................23

5.2 Operating Temperatures..................................................................................24

5.3 Storage Conditions ..........................................................................................25

5.4 Reliability Characteristics.................................................................................26

6 Mechanics..................................................................................................................27

6.1 Mechanical Dimensions of HC25.....................................................................27

6.2 Mounting HC25 to the Application Platform.....................................................29

6.3 Board-to-Board Application Connector............................................................29

7 Reference Approval..................................................................................................31

7.1 Reference Equipment for Type Approval.........................................................31

7.2 Compliance with FCC Rules and Regulations.................................................32

8 Appendix....................................................................................................................33

8.1 List of Parts and Accessories...........................................................................33

8.2 Fasteners and Fixings for Electronic Equipment .............................................35

8.2.1 Fasteners from German Supplier ETTINGER GmbH.........................35

8.3 Mounting Advice Sheet....................................................................................38

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HC25 Hardware Interface Overview

Tables

Table 1: Directives ......................................................................................................... 9

Table 2: Standards of North American type approval.................................................... 9

Table 3: Standards of European type approval.............................................................. 9

Table 4: Requirements of quality ................................................................................. 10

Table 5: Overview of operating modes ........................................................................ 16

Table 6: Return loss in the active band........................................................................ 17

Table 7: Product specifications of U.FL-R-SMT connector.......................................... 19

Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs....... 20

Table 9: Ordering information for Hirose U.FL Series.................................................. 22

Table 10: Absolute maximum ratings............................................................................. 23

Table 11: Board temperature......................................................................................... 24

Table 12: Sample operating conditions without forced air circulation

(according to IEC 60068-2)............................................................................ 24

Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s)... 24

Table 14: Storage conditions......................................................................................... 25

Table 15: Summary of reliability test conditions............................................................. 26

Table 16: Electrical and mechanical characteristics of the board-to-board connector... 29

Table 17: List of parts and accessories.......................................................................... 33

Table 18: Molex sales contacts (subject to change)...................................................... 34

Table 19: Hirose sales contacts (subject to change)..................................................... 34

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HC25 Hardware Interface Overview

Figures

Figure 1: Restricted area around antenna pad (side and bottom view)......................... 18

Figure 2: Mechanical dimensions of U.FL-R-SMT connector.........................................19

Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug..............................................20

Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug..............................................20

Figure 5: Specifications of U.FL-LP-(V)-040(01) plug....................................................21

Figure 6: HC25 – Top and bottom view..........................................................................27

Figure 7: Dimensions of HC25 (all dimensions in mm)..................................................28

Figure 8: Mechanical dimensions of the board-to-board connector...............................30

Figure 9: Reference equipment for Type Approval........................................................ 31

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HC25 Hardware Interface Overview

1 Introduction

This document describes the hardware of the Siemens HC25 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.

1.1 Related Documents

[1] HC25 AT Command Set 00.220 [2] HC25 Release Notes 00.220

1.2 Terms and Abbreviations

Abbreviation Description

ANSI American National Standards Institute AMR Adaptive Multirate ARP Antenna Reference Point B2B Board-to-board connector BB Baseband BEP Bit Error Probability BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CS Coding Scheme CS Circuit Switched CSD Circuit Switched Data DAC Digital-to-Analog Converter dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCS Digital Cellular System DL Download DRX Discontinuous Reception DSB Development Support Board DSP Digital Signal Processor DTMF Dual Tone Multi Frequency DTX Discontinuous Transmission EDGE Enhanced Data rates for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM

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HC25 Hardware Interface Overview

1.2 Terms and Abbreviations

Abbreviation Description

EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard ETSI European Telecommunications Standards Institute FCC Federal Communications Commission (U.S.) FDD Frequency Division Duplex FDMA Frequency Division Multiple Access FR Full Rate GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance

HSDPA High Speed Downlink Packed Access HR Half Rate I/O Input/Output IF Intermediate Frequency IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Mbps Mbits per second MCS Modulation and Coding Scheme MO Mobile Originated MS Mobile Station, also referred to as TE MT Mobile Terminated NTC Negative Temperature Coefficient PBCCH Packet Switched Broadcast Contro l Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCS Personal Communication System, also referred to as GSM 1900 PS Packet Switched PDU Protocol Data Unit PSK Phase Shift Keying R&TTE Radio and Telecommunication Terminal Equipment

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HC25 Hardware Interface Overview

1.2 Terms and Abbreviations

Abbreviation Description

RACH Random Access Channel RF Radio Frequency RTC Real Time Clock Rx Receive Direction SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscri ber Identification Module SLIC Subscriber Line Interface Circuit SMS Short Message Service SRAM Static Random Access Memory SRB Signalling Radio Bearer TA Terminal adapter (e.g. GSM engine)

TDMA Time Division Multiple Access TE Terminal Equipment TS Technical Specification Tx Transmit Direction UL Upload UMTS Universal Mobile Telecommunications System URC Unsolicited Res ult Code USB Universal Serial Bus UICC USIM Integrated Circuit Card USIM UMTS Subscriber Identification Module WCDMA Wideband Code Division Multiple Access

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HC25 Hardware Interface Overview

1.3 Regulatory and Type Approval Information

1.3.1 Directives and Standards

HC25 has been designed to comply with the directives and standards listed below.

Table 1: Directives

99/05/EC Directive of the European Parliament and of the council of 9 March 1999

on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC). The product is labeled with the CE conformity mark

2002/95/EC Directive of the European Parliament and of the Council of

27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

Table 2: Standards of North American type approval

CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,

PCS); US Equipment Authorization FCC

UL 60 950 Product Safety Certification (Safety requirements)

NAPRD.03 V3.9.1 Overview of PCS Type certification review board Mobile Equipment Type

Certification and IMEI control PCS Type Certification Review board (PTCRB)

RSS132, RSS133 Canadian Standard

Table 3: Standards of European type approval

3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station

(MS) conformance specification

ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series)

Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC)

(GSM 13.11 version 7.0.1 Release 1998) GCF-CC V3.23.1 Global Certification Forum - Certification Criteria ETSI EN 301 489-1

V1.4.1

Candidate Harmonized European Standard (Telecom munications serie s)

Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-

tro Magnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common Technical Requirements ETSI EN 301 489-7

V1.2.1 (2000-09)

IEC/EN 60950-1 (2001) Safety of information technology equipment (2000)

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Candidate Harmonized European Standard (Telecom munications serie s)

Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-

tro Magnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 7: Specific conditions for mobile and portable radio and

ancillary equipment of digital cellular radio telecommunications systems

(GSM and DCS)

HC25 Hardware Interface Overview

1.3 Regulatory and Type Approval Information

Table 3: Standards of European type approval

EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Elec-

tromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread

(UTRA) for Mobile and portable (UE) radio and ancillary equipment EN 301 908-01 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base

Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation

cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and

common requirements of article 3.2 of the R&T TE Direc tive EN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base

Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation

cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct

Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of

the R&TTE Directive 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary

equipment. 3GPP TS 34.121 Technical Specification Group Radio Access Network; Terminal conform-

ance specification; Radio transmission and reception (FDD)

3GPP TS 34.123-1 User Equipment (UE) conformance specification; Part 1: Protocol con-

formance specification. 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test

Suites.

Table 4: Requirements of quality

IEC 60068 Environmental te stin g DIN EN 60529 IP codes

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HC25 Hardware Interface Overview

1.4 SAR requirements specific to portable mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable HC25 based applications to be evaluated and approved for compliance with national and/or international regulations.

Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.

Products intended for sale on US markets

ES 59005/ANSI C95.1Considerations for evaluation of human exposure to Electromagnetic

Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz

Products intended for sale on European markets

EN 50360 Product standard to demonstrate the compliance of mobile phones with

the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)

IMPORTANT: Manufacturers of portable applications based on HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. See also Section 7.2.

1.4.1 SELV Requirements

The power supply connected to the HC25 module shall be in compliance with the SELV requirements defined in EN 60950-1.

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HC25 Hardware Interface Overview

1.5 Safety Precautions

The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating HC25. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer’s failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.

The operation of cardiac pacemakers, other implanted med ical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their h and-held mobile away from the pacemaker, while it is on.

Switch off the cellular terminal or mobile before boarding an aircraft. Make su re it cannot be switched on inadvertently. The operation of wirele ss appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel d epots, chemical plants or where blasting operations are in progress. Oper ation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special re gulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.

IMPORTANT! Cellular terminals or mobiles operate using radio signals an d cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.

Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellu lar terminal or mobile.

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HC25 Hardware Interface Overview

2 Product Concept

2.1 Key Features at a Glance

Feature Implementation

General Frequency bands UMTS/HSDPA: Triple band, 850//1900/2100MHz

GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz

GSM class Small MS

Output power (according to Release 99)

Power supply 3.2V < Physical Dimensions: 50mm x 34mm x 4.5mm

RoHS All hardware components fully compliant with EU RoHS Directive

HSDPA features 3GPP Release 5 3.6 Mb p s, UL 38 4 kb ps

Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV

< 4.2V

BATT+

Weight: approx. 10g

UE CAT. [1-6], 11, 12 supported Compressed mode (CM) supported according to 3GPP TS25.212

UMTS features Release 99, June 2004, W-

CDMA FDD standard

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PS data rate – 384 kbps DL / 384 kbps UL CS data rate – 64 kbps DL / 64 kbps UL

HC25 Hardware Interface Overview

2.1 Key Features at a Glance

Feature Implementation

GSM / GPRS / EGPRS features Data transfer GPRS

• Multislot Class 10

• Full PBCCH support

• Mobile Station Class B

• Coding Scheme 1 – 4

EGPRS

• Multislot Class 10

• EDGE E2 power class for 8 PSK

• Downlink coding schemes – CS 1-4, MCS 1-9

• Uplink coding schemes – CS 1-4, MCS 1-9

• BEP reporting

• SRB loopback and test mode B

• 8-bit, 11-bit RACH

• PBCCH support

• 1 phase/2 phase access procedures

• Link adaptation and IR

• NACC, extended UL TBF

• Mobile Station Class B

CSD

• V.110, RLP, non-transparent

• 9.6 kbps

SMS Point-to-point MT and MO

Cell broadcast

Text and PDU mode Fax Group 3; Class 1 Audio Audio speech codecs

GSM: AMR, EFR, FR, HR

3GPP: AMR

One ringing melody supported

CEPT supervisory tones supported

DTMF supported

6 audio modes: Approval, Router, Handset, Headset, Speakerphone an d

Transparent mode

TTY support selecting a dedicated audio mode

Download of audio parameters

Gains and volumes can be controlled by AT commands

Several additional ringing melodies

CEPT and ANSI supervisory tones supported

Software AT commands AT-Hayes GSM 07.05 and 07.07, Siemens

AT commands for RIL compatibility (NDIS/RIL)

Microsoft

compatibility RIL / NDIS for Windows MobileTM SIM Application Toolkit SAT Class C Firmware update Firmware update from host application over USB.

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HC25 Hardware Interface Overview

2.1 Key Features at a Glance

Feature Implementation

Interfaces USB Supports a USB 2.0 Full Speed (12Mbit/s) device interface. Wakeup Control Signal pin to wake up an inactive USB Host into an active state. Status Signal pins to indicate network connectivity status. Audio 1 analog interface UICC interface Supported chip cards: SIM / UICC 3V, 1.8V Antenna 50Ohms. External antenna can be connected via antenna connector or

antenna pad (spring contact). Module interface 50-pin board-to-board connector Power on/off, Reset Power on/off Switch-on by hardware pin IGT

Switch-off by hardware pin IGT

Switch-off by AT command

Reset Orderly shutdown and reset by AT command

Emergency off by hardware pin EMERG_OFF and re start with hardware

pin IGT Emergency off Emergency off by hardware pin EMERG_OFF Evaluation kit DSB DSB75 Evaluation Board designed to test and type approve Siemens cel-

lular engines and provide a sample configura tion for application engineer-

ing. A special adapter is required to connect the module to the DSB75.

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HC25 Hardware Interface Overview

3 Application Interface

HC25 is equipped with a 50-pin board-to-board connector that connects to the external application and incorporates several sub-interfaces: power supply, USB interface, UICC/SIM interface, analog audio interface, as well as various status and control lines (see also Chapter 2).

3.1 Operating Modes

The table below briefly summarizes the various operating modes referred to in the following chapters.

Table 5: Overview of operating modes

Mode Function

Normal operation

GSM / GPRS / UMTS / HSDPA SLEEP

GSM IDLE Software is active. Once registered to the GSM network, paging with

GSM TALK/ GSM DATA

GPRS IDLE Module is attached and ready for GPRS data transfer, but no data is

GPRS DATA GPRS data transfer in progress. Power consumption depends on net-

EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-

UMTS / HSDPA IDLE

Power saving mode set automatically when no call is in progress and the USB connection is suspended by host or not present.

BTS is carried out in order to achieve synchrony with the GSM network. The repetition rate depends on the parameter BSPA_Multiframe. The module is ready to send and receive.

Connection between two subscribers is in progress. Power consumption depends on the GSM network coverage and several connectio n settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be measured in TALK_GSM mode: DTX off, FR and no frequency hopping, otherwise same as for IDLE measurements.

currently sent or received.

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings).

Module is attached and ready for UMTS / HSDPA data transfer, but no data is currently sent or received.

UMTS TALK/ UMTS DATA

HSDPA DATA HSDPA data transfer in progress. Power consumption depends on net-

Power Down

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The internal power section is shut down. The SW on the module is not active. The interfaces are not accessible.

UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.

work settings (e.g. TPC Pattern) and data transfer rate.

HC25 Hardware Interface Overview

4 Antenna Interface

The RF interface has an impedance of 50Ω. HC25 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power.

The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the HC25 PCB and should be placed in the host application.

Regarding the return loss HC25 provides the following values in the active band:

Table 6: Return loss in the active band

State of module Return loss of module Recommended return loss of application

Receive > Transmit not applicable > Idle <

The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to groun d via an in ductor for ESD protection.

Note: The antenna must be isolated for ESD protection (to withstand a voltage resistance up to 8kV air discharge).

8dB > 12dB

12dB

5dB not applicable

4.1 Antenna Installation

To suit the physical design of individual applications HC25 offers two alternative approaches to connecting the antenna:

• Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the top side of the PCB. See Section 4.3 for connector details.

• Antenna pad and grounding plane placed on the bottom side. See Section 4.2.

The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve HC25. All RF data specified throughout this manual are related to the ARP.

IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty.

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HC25 Hardware Interface Overview

4.2 Antenna Pad

No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 1.4mm in height.

Figure 1: Restricted area around antenna pad (side and bottom view)

4.2 Antenna Pad

The antenna can be attached via contact springs. If you decide to use the antenna pad take into account that the pad has not been intended as

antenna reference point (ARP) for the Siemens HC25 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design.

Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50Ω connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter.

HC25 material properties: HC25 PCB: FR4 Antenna pad: Gold plated pad

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HC25 Hardware Interface Overview

4.3 Antenna Connector

HC25 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is:

• U.FL-R-SMT

Figure 2: Mechanical dimensions of U.FL-R-SMT connector

Table 7: Product specifications of U.FL-R-SMT connector

Item Specification Conditions

Ratings Nominal impedance 50Ω Operating temp:-40°C to + 90°C

Operating humidity: max. 90% Rated frequency DC to 3GHz Mechanical characteristics Female contact

holding force Repetitive operation Contact resistance:

Vibration No momentary disconnectio ns of 1µs;

Shock No momentary disconnections of 1µs.

0.15N min Measured with a Ø 0.475 pin gauge

30 cycles of insertion and disengage-

Center 25mΩ Outside 15mΩ

No damage, cracks and looseness of parts

No damage, cracks and looseness of parts.

ment

Frequency of 10 to 100Hz, single

amplitude of 1.5mm, acceleration of

59m/s

each of the 3 axes

Acceleration of 735m/s

for 6 cycles in the direction of each of

the 3 axes

, for 5 cycles in the direction of

, 11ms duration

Environmental characteristics Humidity resistance No damage, cracks a nd looseness of

parts. Insulation resistance: 100MΩ min. at high humidity 500MΩ min. when dry

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Exposure to 40°C, humidity of 95% for

a total of 96 hours

HC25 Hardware Interface Overview

4.3 Antenna Connector

Table 7: Product specifications of U.FL-R-SMT connector

Item Specification Conditions

Temperature cycle No damage, cracks and looseness of

parts. Contact resistance: Center 25mΩ Outside 15mΩ

Salt spray test No excessive corrosion 48 hours continuous exposure to 5%

Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs

Part Material Finish

Shell Phosphor bronze Silver plating Male center contact Brass Gold plating Female center con-

tact Insulator Plug: PBT

Phosphor bronze Gold plating

Receptacle: LCP

Temperature: +40°C → 5 to 35°C →

+90°C → 5 to 35°C

Time: 30min → within 5min → 30min

within 5min

salt water

Black

Beige

Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 9. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com.

Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug

Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug

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HC25 Hardware Interface Overview

4.3 Antenna Connector

In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to Ø 0.81mm) and minimizes the mating height to 2mm. See Figure 5 which shows the Hirose datasheet.

Figure 5: Specifications of U.FL-LP-(V)-040(01) plug

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4.3 Antenna Connector

Table 9: Ordering information for Hirose U.FL Series

Item Part number HRS number

Connector on HC25 U.FL-R-SMT CL331-0471-0-10

Right-angle plug shell for Ø 0.81mm cable

Right-angle plug for Ø 0.81mm cable

Right-angle plug for Ø 1.13mm cable

Right-angle plug for Ø 1.32mm cable

Extraction jig E.FL-LP-N CL331-04441-9

U.FL-LP-040 CL331-0451-2

U.FL-LP(V)-040 (01) CL331-053-8-01

U.FL-LP-068 CL331-0452-5

U.FL-LP-066 CL331-0452-5

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5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

The absolute maximum ratings stated in Table 10 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to HC25.

Table 10: Absolute maximum ratings

Parameter Min Max Unit

Supply voltage BATT+ -0.3 4.5 V Voltage at digital pins in POWER DOWN mode -0.3 0.3 V Voltage at digital pins in normal operation -0.3 2.8 V Voltage at analog pins in POWER DOWN mode -0.3 0.3 V Voltage at analog pins in normal operation -0.3 2.5 V Voltage at STATSUSx pins -0.5 7.5 V VUSB -0.3 7.5 V USB_DP, USB_DN -0.3 7.5 V PWR_IND -0.3 10 V VDDLP -0.3 3.25 V

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5.2 Operating Temperatures

The values stated below are in compliance with GSM recommendation TS 51.010-01.

Table 11: Board temperature

Parameter Min Typ Max Unit

Operating temperature range -20 +25 +85 °C Automatic shutdown

Temperature measured on HC25 board

Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of ± 3°C at the overtemperature limit and ± 5°C at the undertemperature limit.

Table 11 shows the temperatures for automatic shutdown as measured by the on-board mea-

suring element NTC. The maximum allowable ambient temperature that causes the module to shut down depends on various conditions. The following tables Table 12 and Table 13 show sample lab environment conditions. Please be aware that the operating duration an d the maximum ambient temperature will vary significantly for your application.

< -30 --- >+85 °C

Table 12: Sample operating conditions without forced air circulation (according to IEC 60068-2)

Mode Ambient

Voltage RF Power Operating

Temperature

GSM,

+65°C V

< 3.8V Max. ∞

BATT+

GPRS/EDGE Class 8 WCDMA +55°C V WCDMA +65°C V GRPS/EDGE Class10 +65°C V WCDMA +65°C V

Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s)

Mode Ambient

< 3.4V < 10dBm ∞

BATT+

< 3.4V < 0dBm ∞

BATT+

< 3.8V Max. < 2min

BATT+

< 3.8V Max. < 2min

BATT+

Voltage RF Power Operating

Temperature

GSM,

+75°C V

< 3.8V Max. ∞

BATT+

GPRS/EDGE Class 8 WCDMA +60°C V WCDMA +70°C V GRPS/EDGE Class 10 +65°C V WCDMA +60°C V

< 3.4V < 10dBm ∞

BATT+

< 3.4V < 0dBm ∞

BATT+

< 3.8V Max. ∞

BATT+

< 3.4V Max. ∞

BATT+

Duration

Note: Generally it is strongly recommended to implement additional measures to lead the heat out of the application, especially at maximum transmission power levels of WCDMA (24dBm), e.g. use of ground area for a heat sink or convection (see Section 6.1 for the ground area that may be used for a heat sink).

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5.3 Storage Conditions

The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.

Table 14: Storage conditions

Type Condition Unit Reference

Air temperature: Low

High

Humidity relative: Low

High Condens.

Air pressure: Low

High Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4 Water: rain, dripping, icing and

frosting Radiation: Solar

Heat Chemically active substances Not recom-

Mechanically active substances Not recom-

Vibration sinusoidal:

Displacement Acceleration Frequency range

Shocks:

Shock spectrum Duration Acceleration

-40 +85

10 90 at 30°C 90-100 at 30°C

70 106

Not allowed --- ---

1120 600

mended

1.5 5 2-9 9-200

semi-sinusoidal 1 50

°C ETS 300 019-2-1: T1.2, IEC 68-2-1 Ab

ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

%---

ETS 300 019-2-1: T1.2, IEC 68-2-56 Cb ETS 300 019-2-1: T1.2, IEC 68-2-30 Db

kPa IEC TR 60271-3-1: 1K4

IEC TR 60271-3-1: 1K4

W/m

mm m/s Hz

ms m/s

ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

IEC TR 60271-3-1: 1C1L

IEC TR 60271-3-1: 1S1

IEC TR 60271-3-1: 1M2

IEC 68-2-27 Ea

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5.4 Reliability Characteristics

The test conditions stated below are an extract of the complete test specifications.

Table 15: Summary of reliability test conditions

Type of test Conditions Standard

Vibration Frequency range: 10-20Hz; acceleration: 3.1mm

amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes

Shock half-sinus Acceleration: 500g

Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z)

Dry heat Temperature: +70 ±2×C

Test duration: 16h Humidity in the test chamber: < 50%

Temperature change (shock)

Damp heat cyclic High temperature: +55×C ±2×C

Cold (constant exposure)

Low temperature: -40×C ±2×C High temperature: +85×C ±2×C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100

Low temperature: +25×C ±2×C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h

Temperature: -40 ±2×C Test duration: 16h

DIN IEC 68-2-6

DIN IEC 68-2-27

EN 60068-2-2 Bb ETS 300 019-2-7

DIN IEC 68-2-14 Na ETS 300 019-2-7

DIN IEC 68-2-30 Db ETS 300 019-2-5

DIN IEC 68-2-1

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6 Mechanics

6.1 Mechanical Dimensions of HC25

Length:50.00mm Width: 34.00mm Height:4.5mm

RF Antenna

Connector

Ground

Pin 1

Pin 25

Pin 50

Pin 26

Ground (for Heat Sink)

Figure 6: HC25 – Top and bottom view

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6.1 Mechanical Dimensions of HC25

Figure 7: Dimensions of HC25 (all dimensions in mm)

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6.2 Mounting HC25 to the Application Platform

There are many ways to properly install HC25 in the host device. An efficient approach is to mount the HC25 PCB to a frame, plate, rack or chassis.

Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized t o achieve better support. To help you find appropriate spacers a list of selected screws and distance sleeves for 3mm stacking height can be found in Section 8.2.

When using the holes the screws can be inserted from top or bottom. For proper grounding it is strongly recommended to use the large ground plane on the bottom

of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape. Please take care that attached cooling elements do not touch the antenna pads on the module’s bottom side, as this may lead a short-circuit.

To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device (see also Section 8.3 with mounting advice sheet).

6.3 Board-to-Board Application Connector

This section provides specifications for the 50-pin board-to-board (B2B) connector used to connect HC25 to the host application.

For the module’s external interface the following connector series has been chosen: Supplier: Hirose ( www.hirose.com Type: DF12C (3.0)-50DS-0.5V (SlimStack Receptacle) Height: 3.0 mm

Table 16: Electrical and mechanical characteristics of the board-to-board connector

Parameter Specification (50-way connector)

Number of Contacts 50 Quantity delivered 2000 Connectors per Tape & Reel Voltage 50V Current Rating 0.4A max per contact Resistance 0.05 Ohm per contact

)

Dielectric Withstanding Voltage 150V RMS AC for 1min Operating Temperature -40°C...+85°C Contact Material phosphor bronze finish: solder plating Insulator Material PPS, deep brown / Polyamide, beige FFC/FPC Thickness 0.3mm ±0.05mm (0.012" ±0.002") Maximum connection cycles 20 (@ 50mOhm max) Cable FFC (Flat Flexible Cable), max. length 150mm from SIM

interface

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6.3 Board-to-Board Application Connector

A recommended corresponding board-to-board connector series for external applications is: Supplier: Hirose ( www.hirose.com Type: DF12x-50DP-0.5V (SlimStack Header) Height: 3.0 – 5.0 mm

For Hirose sales contacts see Chapter 8. Note: There is no inverse polarity protection for the board-to-board connector. It is therefore

very important that the board-to-board connector is connected correctly to the host application, i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section

5.5, pin locations are shown in Figure 6.

)

Figure 8: Mechanical dimensions of the board-to-board connector

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7 Reference Approval

7.1 Reference Equipment for Type Approval

The Siemens reference setup submitted to type approve HC25 consists of the following components:

• Siemens HC25 cellular engine

• Development Support Box DSB75 and HC15/HC25-DSB75-Adapter for mounting the HC25 module

• SIM card reader integrated on DSB75

• U.FL-LP antenna cable

• Handset type Votronic HH-SI-30.3/V1.1/0

•PC as MMI

Figure 9: Reference equipment for Type Approval

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7.2 Compliance with FCC Rules and Regulations

The Equipment Authorization Certification for the Siemens reference application described in

Section 7.1 will be registered under the following identifiers:

FCC Identifier: QIPHC25 Industry Canada Certification Number: 267W-HC25 Granted to Siemens AG

Manufacturers of mobile or fixed devices incorporating HC25 modules are authorized to use the FCC Grants and Industry Canada Certificates of the HC25 modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID QIPHC25".

IMPORTANT: Manufacturers of portable applications incorporating HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 1.4 for detail).

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to wh ich the rece iver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

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8 Appendix

8.1 List of Parts and Accessories

Table 17: List of parts and accessories

Description Supplier Ordering information

HC25 Siemens Standard module (Siemens IMEI)

Siemens ordering number: L30960-N1050-A100 Customer IMEI mode:

Siemens Ordering number: L30960-N1060-A100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100 HC15/HC25-DSB75-Adapter Siemens Siemens ordering number: L30960-N1001-A100 Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0

VOTRONIC

Entwicklungs- und Produktionsgesellschaft für elek-

tronische Geräte mbH

Saarbrücker Str. 8

66386 St. Ingbert

Germany

Phone: +49-(0)6 89 4 / 92 55-0

Fax: +49-(0)6 89 4 / 92 55-88

e-mail: contact@votronic.com SIM card holder incl. push

button ejector and slide-in tray

Board-to-board connector Molex Sales contacts are listed in Table 18. Antenna connector Hirose Sales contacts are listed in Table 19.

Molex Ordering numbers: 91228

91236

Sales contacts are listed in Table 18.

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8.1 List of Parts and Accessories

Table 18: Molex sales contacts (subject to change)

Molex For further information please click:

http://www.molex.com

Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-972 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730

Table 19: Hirose sales contacts (subject to change)

Hirose Ltd. For further information please click:

http://www.hirose.com

Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Mail: mxgermany@molex.com

Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044

Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217

American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352

Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366

Hirose Electric GmbH Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email info@hirose.de

Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401

Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933

Hirose Electric Co., Ltd. European Branch First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469

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8.2 Fasteners and Fixings for Electronic Equipment

This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document.

8.2.1 Fasteners from German Supplier ETTINGER GmbH

Sales contact: ETTINGER GmbH http://www.ettinger.de/main.cfm Phone: +49-81-046623-0 Fax: +49-81-046623-99

The following tables contain only article numbers and basic parameters of the listed components. For further detail and ordering information please contact Ettinger GmbH.

Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below.

Article number: 05.71.038 Spa ce r - Alum in um /

Wall thickness = 0.8mm

Length 3.0mm Material AlMgSi-0,5 For internal diameter M2=2.0-2.3 Internal diameter d = 2.4mm External diameter 4.0mm Vogt AG No. x40030080.10

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8.2 Fasteners and Fixings for Electronic Equipment

Article number: 07.51.403 Insulating Spacer for M2

Self-gripping Length 3.0mm Material Polyamide 6.6 Surface Black Internal diameter 2.2mm External diameter 4.0mm Flammability rating UL94-HB

2 spacers are delivered with DSB75 Support Board

Article number: 05.11.209 Threaded Stud M2 .5 - M2 Type E /

External thread at both ends Length 3.0mm Material Stainless steel X12CrMoS17 Thread 1 / Length M2.5 / 6.0mm Thread 2 / Length M2 / 8.0mm Width across flats 5 Recess yes Type External / External

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8.2 Fasteners and Fixings for Electronic Equipment

Article number: 01.14.131 Screw M21

DIN 84 - ISO 1207 Length 8.0mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8mm Head height 1.30mm Type Slotted cheese head screw

2 screws are delivered with DSB75 Support Board

Article number: 01.14.141 Screw M2

DIN 84 - ISO 1207 Length 10.0mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8mm Head height 1.30mm Type Slotted cheese head screw

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8.3 Mounting Advice Sheet

Article number: 02.10.011 Hexagon Nut

DIN 934 - ISO 4032 Material Steel 4.8 Surface Zinced A2K Thread M2 Wrench size / Ø 4 Thickness / L 1.6mm Type Nut DIN/UNC, DIN934

2 nuts are delivered with DSB75 Support Board

8.3 Mounting Advice Sheet

To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. The advice sheet on the next page shows a number of examples for the kind of bending that may lead to mechanical damage of the module.

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8.3 Mounting Advice Sheet

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Gemalto M2M HC25 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

Tables

Figures

1 Introduction

1.1 Related Documents

1.2 Terms and Abbreviations

1.3 Regulatory and Type Approval Information

1.3.1 Directives and Standards

1.4 SAR requirements specific to portable mobiles

1.4.1 SELV Requirements

1.5 Safety Precautions

2 Product Concept

2.1 Key Features at a Glance

3 Application Interface

3.1 Operating Modes

4 Antenna Interface

4.1 Antenna Installation

4.2 Antenna Pad

4.3 Antenna Connector

5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

5.2 Operating Temperatures

5.3 Storage Conditions

5.4 Reliability Characteristics

6 Mechanics

6.1 Mechanical Dimensions of HC25

6.2 Mounting HC25 to the Application Platform

6.3 Board-to-Board Application Connector

7 Reference Approval

7.1 Reference Equipment for Type Approval

7.2 Compliance with FCC Rules and Regulations

8 Appendix

8.1 List of Parts and Accessories

8.2 Fasteners and Fixings for Electronic Equipment

8.2.1 Fasteners from German Supplier ETTINGER GmbH

8.3 Mounting Advice Sheet