Gemalto M2M ELS61 US User Manual
Cinterion® ELS61-US
Hardware Interface Overview
Version: 00.281
DocId: ELS61-US_HIO_v00.281
M2M.GEMALTO.COM
Cinterion® ELS61-US Hardware Interface Overview
2
Page 2 of 40
Document Name:
Version:
Date:
DocId:
Status
Cinterion
®
ELS61-US Hardware Interface Overview
00.281
2016-02-1 1
ELS61-US_HIO_v00.281
Confidential / Preliminary
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE
SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,
MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY
AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY
AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED
BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.
THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED
ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2016, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain
countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned
in this document are property of their respective owners.
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
Contents
40
Page 3 of 40
Contents
1 Introduction.................................................................................................................6
1.1 Key Features at a Glance .................................................................................. 6
1.2 ELS61-US System Overview ............................................................................. 9
2 Interface Characteristics ..........................................................................................10
2.1 Application Interface ........................................................................................ 10
2.1.1 USB Interface...................................................................................... 10
2.1.2 Serial Interface ASC0 ......................................................................... 11
2.1.3 Serial Interface ASC1 ......................................................................... 12
2.1.4 UICC/SIM/USIM Interface................................................................... 13
2.1.5 GPIO Interface .................................................................................... 15
2.1.6 I
2.2 SPI Interface .................................................................................................... 16
2.2.1 PWM Interfaces .................................................................................. 17
2.2.2 Pulse Counter ..................................................................................... 17
2.2.3 Status LED.......................................................................................... 17
2.2.4 Fast Shutdown .................................................................................... 17
2.3 RF Antenna Interface....................................................................................... 18
2.3.1 Antenna Installation ............................................................................ 19
2.4 Sample Application .......................................................................................... 20
2
C Interface ........................................................................................ 16
3 Operating Characteristics........................................................................................22
3.1 Operating Modes ............................................................................................. 22
3.2 Power Supply................................................................................................... 23
4 Mechanical Dimensions ........................................................................................... 24
4.1 Mechanical Dimensions of ELS61-US ............................................................. 24
5 Regulatory and Type Approval Information...........................................................26
5.1 Directives and Standards................................................................................. 26
5.2 SAR requirements specific to portable mobiles ............................................... 29
5.3 Reference Equipment for Type Approval......................................................... 30
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 31
6 Document Information..............................................................................................33
6.1 Revision History ............................................................................................... 33
6.2 Related Documents ......................................................................................... 33
6.3 Terms and Abbreviations ................................................................................. 34
6.4 Safety Precaution Notes .................................................................................. 37
7 Appendix....................................................................................................................38
7.1 List of Parts and Accessories........................................................................... 38
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
Tables
114
Page 4 of 40
Tables
Table 1: Signals of the SIM interface (SMT application interface) ............................... 13
Table 2: GPIO lines and possible alternative assignment............................................ 15
Table 3: Return loss in the active band........................................................................ 18
Table 4: Overview of operating modes ........................................................................ 22
Table 5: Directives ....................................................................................................... 26
Table 6: Standards of North American type approval .................................................. 26
Table 7: Standards of European type approval............................................................ 26
Table 8: Requirements of quality ................................................................................. 27
Table 9: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 27
Table 10: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 28
Table 11: List of parts and accessories.......................................................................... 38
Table 12: Molex sales contacts (subject to change) ...................................................... 39
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
Figures
114
Page 5 of 40
Figures
Figure 1: ELS61-US system overview............................................................................. 9
Figure 2: USB circuit ..................................................................................................... 10
Figure 3: Serial interface ASC0..................................................................................... 11
Figure 4: Serial interface ASC1..................................................................................... 12
Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 14
Figure 6: Schematic diagram of ELS61-US sample application.................................... 21
Figure 7: ELS61-US– top and bottom view................................................................... 24
Figure 8: Dimensions of ELS61-US (all dimensions in mm) ......................................... 25
Figure 9: Reference equipment for Type Approval ....................................................... 30
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
1 Introduction
9
Page 6 of 40
1 Introduction
This document1 describes the hardware of the Cinterion® ELS61-US module. It helps you
quickly retrieve interface specifications, electrical and mechanical details and information on
the requirements to be considered for integrating further components.
1.1 Key Features at a Glance
Feature Implementation
General
Frequency bands UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII)
LTE: Quad band, 700 (Bd12) / 850 (Bd5) / AWS (Bd4) / 1900MHz (Bd2)
Output power (according
to Release 99)
Output power (according
to Release 8)
Power supply 3.0V to 4.5V
Operating temperature
(board temperature)
Physical Dimensions: 27.6mm x 25.4mm x 2.2mm
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 UE CAT 1 supported
HSPA features
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIV
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+23dBm ±2dB) for LTE 1900,LTE FDD Bd2
Class 3 (+23dBm ±2dB) for LTE AWS, LTE FDD Bd4
Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5
Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12
Normal operation: -30°C to +85°C
Extended operation: -40°C to +90°C
Weight: approx. TBD.g
DL 10.2Mbps, UL 5.2Mbps
3GPP Release 8 DL 7.2Mbps, UL 5.7Mbps
HSDPA Cat.8 / HSUPA Cat.6 data rates
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL
CS data rate – 64 kbps DL / 64 kbps UL
1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
1.1 Key Features at a Glance
9
Feature Implementation
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus SMS locations in mobile equipment
Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M
AT commands for RIL compatibility
Java™ Open Platform Java™ Open Platform with
• Java™ profile IMP-NG & CLDC 1.1 HI
• Secure data transmission via HTTPS/SSL
• Multi-threading programming and multi-application execution
Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely cost-efficient
hardware and software design – ideal platform for industrial applications.
Page 7 of 40
The memory space available for Java programs is around 30MB in the flash
file system and around 18MB RAM. Application code and data share the
space in the flash file system and in RAM.
Microsoft™ compatibility RIL for Pocket PC and Smartphone
SIM Application Toolkit SAT letter classes b, c, e; with BIP
Firmware update Generic update from host application over ASC0 or USB modem.
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equipment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0 (shared with GPIO lines):
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Adjustable baud rates: 1,200bps to 921,600bps
• Autobauding: 1,200bps to 230,400bps
• Supports RTS0/CTS0 hardware flow control.
ASC1 (shared with GPIO lines):
• 4-wire, unbalanced asynchronous interface
• Adjustable baud rates: 1,200bps to 921,60bps
• Autobauding: 1,200bps to 230,400bps
• Supports RTS1/CTS1 hardware flow control
UICC interface Supported SIM/USIM cards: 3V, 1.8V
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
1.1 Key Features at a Glance
9
Feature Implementation
GPIO interface 22 GPIO lines comprising:
13 lines shared with ASC0, ASC1 and SPI lines, with network status indication, PWM functionality, fast shutdown and pulse counter
9 GPIO lines not shared
2
I
C interface Supports I2C serial interface
SPI interface Serial peripheral interface, shared with GPIO lines
Antenna interface pads 50Ω. UMTS/LTE main antenna, UMTS/LTE Rx Diversity antenna
Power on/off, Reset
Power on/off Switch-on by hardware signal ON
Switch-off by AT command
Switch off by hardware signal FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature or voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Special features
Page 8 of 40
Real time clock Timer functions via AT commands
Phonebook SIM and phone
Evaluation kit
Evaluation module ELS61-US module soldered onto a dedicated PCB that can be connected
to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the ELS61-US evaluation module to the DSB75.
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
GPIO
interface
I2C
USB
ASC0 lines
ASC1/SPI
CONTROL
RTC
POWER
Rx diversity
antenna
(UMTS/LTE)
Module
SIM interface
(with SIM detection)
SIM card
Application
Power supply
Backup supply
Emergency reset
ON
Serial interface/
SPI interface
Serial modem
interface lines
I2C
GPIO
3
4
4
5
2
9
1
1
1
2
USB
Rx diversity
1
Status LED
1
DAC (PWM) PWM
2
Fast
shutdown
Fast shutdown
1
1
COUNTER
Pulse counter
1
ASC0 lines
Serial modem
interface lines/
SPI interface
4
Main antenna
(UMTS/LTE)
Main antenna
1
1.2 ELS61-US System Overview
9
1.2 ELS61-US System Overview
Page 9 of 40
Figure 1: ELS61-US system overview
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
VBUS
DP
DN
VREG (3V075)
BATT+
USB_DP
2)
lin. reg.
GND
Module
Detection only
VUSB_IN
USB part
1)
RING0
Host wakeup
1)
All serial (including RS) and pull-up resistors for data lines are implemented.
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90 ohms for proper signal integrity.
R
S
R
S
SMT
Page 10 of 40
2 Interface Characteristics
21
2 Interface Characteristics
ELS61-US is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as
the RF antenna interface.
2.1 Application Interface
2.1.1 USB Interface
ELS61-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed
(12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware.
The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This
is because ELS61-US is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 2.0”
1
.
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver
distributed with ELS61-US needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
ELS61-US_HIO_v00.281 2016-02-11
Figure 2: USB circuit
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
2.1 Application Interface
21
Page 11 of 40
2.1.2 Serial Interface ASC0
ELS61-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to
ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T
V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit
or inactive state).
ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections
it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps.
• Autobauding supports bit rates from 1,200bps up to 230,400bps.
• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an
internal pull down resistor causing a low level signal, if the line is not used and open.
Although hardware flow control is recommended, this allows communication by using only
RXD and TXD lines.
• Wake up from SLEEP mode by RTS0 activation.
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Cinterion® ELS61-US Hardware Interface Overview
2.1 Application Interface
21
Page 12 of 40
2.1.3 Serial Interface ASC1
Four ELS61-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire
unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE
signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels
are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections
it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.
• On ASC1 no RING line is available.
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps.
• Autobauding supports bit rates from 1,200bps up to 230,400bps.
• Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal
pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD
lines.
ELS61-US_HIO_v00.281 2016-02-11
Confidential / Preliminary
Loading...