Gemalto M2M ELS31-VA User Manual
Cinterion® ELS31-VA/ELS51-VA
Hardware Interface Description
Version: 01.000
DocId: ELS31-VA_ELS51-VA_HID_v01.000
M2M.GEMALTO.COM
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description
2
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Document Name:
Version:
Date:
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Cinterion® ELS31-V A/ELS51-V A Hardware Interface Description
01.000
2017-01-04
ELS31-VA_ELS51-VA_HID_v01.000
Confidential / Preliminary
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE
SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,
MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY
AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY
AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED
BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.
THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED
ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2017, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain
countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned
in this document are property of their respective owners.
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Contents
1 Introduction.................................................................................................................9
1.1 Key Features at a Glance .................................................................................. 9
1.2 ELS31-VA/ELS51-VA System Overview ......................................................... 12
1.3 Circuit Concept ................................................................................................ 13
2 Interface Characteristics ..........................................................................................14
2.1 Application Interface ........................................................................................ 14
2.1.1 Pad Assignment.................................................................................. 14
2.1.2 Signal Properties................................................................................. 16
2.1.2.1 Absolute Maximum Ratings ................................................ 21
2.1.3 USB Interface...................................................................................... 22
2.1.3.1 Interface implementation..................................................... 23
2.1.3.2 Reducing Power Consumption............................................ 24
2.1.4 Serial Interface ASC0 ......................................................................... 25
2.1.4.1 Serial Interface Start-up Behavior ....................................... 26
2.1.5 Serial Interface ASC1 ......................................................................... 27
2.1.6 UICC/SIM/USIM Interface................................................................... 29
2.1.7 Digital Audio Interface......................................................................... 31
2.1.8 Pulse Code Modulation Interface (PCM) ............................................ 31
2.1.9 Inter IC Sound Interface (I
2.1.10 GPIO Interface .................................................................................... 34
2.1.11 I
2
C Interface ........................................................................................ 36
2.1.12 SPI Interface ....................................................................................... 38
2.1.13 Pulse Counter ..................................................................................... 39
2.1.14 HSIC Interface (ELS51-VA Only)........................................................ 39
2.1.15 SDIO Interface (ELS51-VA Only)........................................................ 39
2.1.16 Control Signals.................................................................................... 42
2.1.16.1 Status LED .......................................................................... 42
2.1.16.2 Power Indication Circuit ...................................................... 43
2.1.16.3 Host Wakeup....................................................................... 43
2.1.16.4 Fast Shutdown .................................................................... 45
2.2 RF Antenna Interface....................................................................................... 46
2.2.1 Antenna Interface Specifications ........................................................ 46
2.2.2 Antenna Installation ............................................................................ 47
2.2.3 RF Line Routing Design...................................................................... 48
2.2.3.1 RF Interface Signals Circuit Diagram Example................... 48
2.2.3.2 Line Arrangement Examples ............................................... 49
2.3 Sample Application .......................................................................................... 54
2.3.1 Prevent Back Powering....................................................................... 56
2.3.2 Sample Level Conversion Circuit........................................................ 56
2
S).............................................................. 33
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3 Operating Characteristics........................................................................................57
3.1 Operating Modes ............................................................................................. 57
3.2 Power Up/Power Down Scenarios................................................................... 58
3.2.1 Turn on ELS31-VA/ELS51-VA ............................................................ 58
3.2.1.1 Connecting ELS31-VA/ELS51-VA BATT Lines.................... 58
3.2.1.2 Switch on ELS31-VA/ELS51-VA Using ON Signal .............. 59
3.2.2 Restart ELS31-VA/ELS51-VA............................................................. 60
3.2.2.1 Restart ELS31-VA/ELS51-VA via AT+CFUN Command ..... 60
3.2.2.2 Restart ELS31-VA/ELS51-VA Using EMERG_RST ............ 60
3.2.3 Signal States after First Startup .......................................................... 62
3.2.4 Turn off ELS31-VA/ELS51-VA ............................................................ 63
3.2.4.1 Switch off ELS31-VA/ELS51-VA Using AT Command ......... 63
3.2.5 Automatic Shutdown ........................................................................... 64
3.2.5.1 Thermal Shutdown .............................................................. 64
3.2.5.2 Undervoltage Shutdown...................................................... 65
3.2.5.3 Overvoltage Shutdown........................................................ 65
3.3 Power Saving................................................................................................... 66
3.3.1 Power Saving while Attached to LTE Networks.................................. 66
3.3.2 Wake-up via RTS0/RTS1.................................................................... 67
3.4 Power Supply................................................................................................... 68
3.4.1 Power Supply Ratings......................................................................... 69
3.4.2 Minimizing Power Losses ................................................................... 70
3.4.3 Measuring the Supply Voltage (BATT_BB)......................................... 70
3.4.4 Monitoring Power Supply by AT Command ........................................ 70
3.5 Operating Temperatures.................................................................................. 71
3.6 Electrostatic Discharge .................................................................................... 72
3.6.1 ESD Protection for Antenna Interface................................................. 72
3.7 Blocking against RF on Interface Lines ........................................................... 73
3.8 Reliability Characteristics................................................................................. 76
4 Mechanical Dimensions, Mounting and Packaging...............................................77
4.1 Mechanical Dimensions of ELS31-VA/ELS51-VA ........................................... 77
4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform........................ 79
4.2.1 SMT PCB Assembly ........................................................................... 79
4.2.1.1 Land Pattern and Stencil..................................................... 79
4.2.1.2 Board Level Characterization.............................................. 81
4.2.2 Moisture Sensitivity Level ................................................................... 81
4.2.3 Soldering Conditions and Temperature .............................................. 82
4.2.3.1 Reflow Profile ...................................................................... 82
4.2.3.2 Maximum Temperature and Duration .................................. 83
4.2.4 Durability and Mechanical Handling.................................................... 84
4.2.4.1 Storage Conditions.............................................................. 84
4.2.4.2 Processing Life.................................................................... 85
4.2.4.3 Baking ................................................................................. 85
4.2.4.4 Electrostatic Discharge ....................................................... 85
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4.3 Packaging ........................................................................................................ 86
4.3.1 Tape and Reel .................................................................................... 86
4.3.1.1 Orientation........................................................................... 86
4.3.1.2 Barcode Label ..................................................................... 87
4.3.2 Shipping Materials .............................................................................. 88
4.3.2.1 Moisture Barrier Bag ........................................................... 88
4.3.2.2 Transportation Box.............................................................. 90
4.3.3 Trays ................................................................................................... 91
5 Regulatory and Type Approval Information...........................................................93
5.1 Directives and Standards................................................................................. 93
5.2 SAR requirements specific to portable mobiles ............................................... 95
5.3 Reference Equipment for Type Approval......................................................... 96
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 97
6 Document Information..............................................................................................99
6.1 Revision History ............................................................................................... 99
6.2 Related Documents ....................................................................................... 100
6.3 Terms and Abbreviations ............................................................................... 100
6.4 Safety Precaution Notes ................................................................................ 103
7 Appendix..................................................................................................................104
7.1 List of Parts and Accessories......................................................................... 104
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Tables
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Tables
Table 1: Pad assignments............................................................................................ 15
Table 2: Signal properties ............................................................................................ 16
Table 3: Absolute maximum ratings............................................................................. 21
Table 4: Signals of the SIM interface (SMT application interface) ............................... 29
Table 5: Overview of PCM pin functions...................................................................... 32
Table 6: Overview of I
Table 7: GPIO lines and possible alternative assignment............................................ 34
Table 8: SDIO interface features.................................................................................. 39
Table 9: SDIO interface lines ....................................................................................... 40
Table 10: SDIO timings.................................................................................................. 40
Table 11: Host wakeup line............................................................................................ 43
Table 12: Return loss in the active band........................................................................ 46
Table 13: RF Antenna interface LTE.............................................................................. 46
Table 14: Overview of operating modes ........................................................................ 57
Table 15: Signal states................................................................................................... 62
Table 16: Temperature dependent behavior.................................................................. 64
Table 17: Voltage supply ratings.................................................................................... 69
Table 18: Current consumption ratings.......................................................................... 69
Table 19: Board temperature ......................................................................................... 71
Table 20: Electrostatic values ........................................................................................ 72
Table 21: EMI measures on the application interface.................................................... 74
Table 22: Summary of reliability test conditions............................................................. 76
Table 23: Reflow temperature ratings............................................................................ 82
Table 24: Storage conditions ......................................................................................... 84
Table 25: Directives ....................................................................................................... 93
Table 26: Standards of North American type approval .................................................. 93
Table 27: Standards of Verizon type approval............................................................... 93
Table 28: Standards of GCF type approval.................................................................... 93
Table 29: Requirements of quality ................................................................................. 93
Table 30: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 94
Table 31: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 94
Table 32: Antenna gain limits for FCC and IC................................................................ 97
Table 33: List of parts and accessories........................................................................ 104
Table 34: Molex sales contacts (subject to change) .................................................... 105
2
S pin functions ......................................................................... 33
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Figures
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Figures
Figure 1: ELS31-VA/ELS51-VA system overview......................................................... 12
Figure 2: ELS31-VA/ELS51-VA baseband block diagram ............................................ 13
Figure 3: Numbering plan for connecting pads (bottom view)....................................... 14
Figure 4: USB circuit ..................................................................................................... 22
Figure 5: USB Additional ESD Protection Implementation............................................ 23
Figure 6: Serial interface ASC0..................................................................................... 25
Figure 7: ASC0 startup behavior................................................................................... 26
Figure 8: Serial interface ASC1..................................................................................... 27
Figure 9: ASC1 startup behavior................................................................................... 28
Figure 10: External UICC/SIM/USIM card holder circuit ................................................. 30
Figure 11: PCM timing short frame (4096KHz, 16kHz sample rate) ............................... 32
Figure 12: I
Figure 13: GPIO startup behavior ................................................................................... 35
Figure 14: I
Figure 15: I
Figure 16: Characteristics of SPI modes......................................................................... 38
Figure 17: SDIO interface timing diagrams (Input/Output).............................................. 40
Figure 18: Status signaling with LED driver .................................................................... 42
Figure 19: Power indication circuit .................................................................................. 43
Figure 20: Wake-up via RING0 ....................................................................................... 44
Figure 21: Fast shutdown timing ..................................................................................... 45
Figure 22: Antenna pads (bottom view) .......................................................................... 47
Figure 23: RF interface signals example......................................................................... 48
Figure 24: Embedded Stripline with 65µm prepreg (1080) and 710µm core .................. 49
Figure 25: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 50
Figure 26: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 51
Figure 27: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 52
Figure 28: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 53
Figure 29: Schematic diagram of ELS31-VA/ELS51-VA sample application.................. 55
Figure 30: Sample level conversion circuit...................................................................... 56
Figure 31: Sample circuit for applying power using an external µC ................................ 58
Figure 32: ON timing ....................................................................................................... 59
Figure 33: Emergency restart timing ............................................................................... 60
Figure 34: Switch off behavior......................................................................................... 63
Figure 35: Power saving and paging in LTE networks.................................................... 66
Figure 36: Wake-up via RTS0/RTS1............................................................................... 67
Figure 37: Position of reference points BATT_BB/BATT_RF and GND.......................... 70
Figure 38: ESD protection for RF antenna interface ....................................................... 72
Figure 39: EMI circuits..................................................................................................... 73
Figure 40: ELS31-VA/ELS51-VA– top and bottom view ................................................. 77
Figure 41: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm)........................ 78
Figure 42: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) - bottom view . 78
Figure 43: Land pattern (top view) .................................................................................. 79
Figure 44: Recommended design for 120 micron thick stencil (top view, dual design)... 80
Figure 45: Reflow Profile................................................................................................. 82
Figure 46: Carrier tape .................................................................................................... 86
Figure 47: Reel direction ................................................................................................. 86
Figure 48: Barcode label on tape reel ............................................................................. 87
Figure 49: Moisture barrier bag (MBB) with imprint......................................................... 88
2
S timing (slave mode) .................................................................................. 33
2
C interface connected to V180 .................................................................... 36
2
C startup behavior ....................................................................................... 37
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Figure 50: Moisture Sensitivity Label .............................................................................. 89
Figure 51: Humidity Indicator Card - HIC ........................................................................ 90
Figure 52: Small quantity tray.......................................................................................... 91
Figure 53: Tray to ship odd module amounts.................................................................. 91
Figure 54: Trays with packaging materials...................................................................... 91
Figure 55: Tray dimensions............................................................................................. 92
Figure 56: Reference equipment for Type Approval ....................................................... 96
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description
1 Introduction
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1 Introduction
This document1 describes the hardware of the Cinterion® ELS31-VA and ELS51-VA modules
for Verizon Networks. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further
components.
The ELS31-VA and ELS51-VA modules include a baseband, a complete dual band RF frontend, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 10 set of specifications) and Verizon Wireless LTE UE specifications.
The module variants differentiate a follows:
- ELS31-VA provides LTE connectivity with IP Services
- ELS51-VA adds a Linux execution environment available for customer applications
1.1 Key Features at a Glance
Feature Implementation
General
Frequency bands LTE dualband: B4, B13
Output power Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13
Power supply 3.3V to 4.5V
Operating temperature
(board temperature)
Physical Dimensions: 27.60mm x 18.80mm x 2.05mm
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 DL 10Mbps, UL 5Mbps
SMS Point-to-point MT and MO
Software
AT commands Hayes, 3GPP TS 27.007, TS 27.005, product specific
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Weight: approx. 3g
LTE Cat. 1 data rates
Text mode
Storage in mobile equipment
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB
1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
13
Feature Implementation
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application development equipment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Default baud rate: 115,200 baud
• Adjustable baud rates: 4,800 to 921,600, no autobauding support
• Supports RTS0/CTS0 hardware flow control.
• Indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)
ASC1 (shared with GPIO lines):
• 4-wire, unbalanced asynchronous interface
• Default baud rate: 115,200 baud
• Adjustable baud rates: 4,800bps to 921,600bps
• Supports RTS1/CTS1 hardware flow control
UICC interface Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC Module is prepared for an embedded UICC
GPIO interface 20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3):
GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, SPI,
and DAI signal lines
Programming is done via AT commands
2
I
C interface Supports I2C serial interface
SPI interface Supports SPI interface
SDIO ELS51-VA only:
4 wire interface.
HSIC ELS51-VA only:
High Speed Interchip Communication interface.
ADC
Digitial audio interface 4 GPIO lines can be configured as PCM/I
Analog-to-Digital Converter with one unbalanced analog input.
2
S lines for VoLTE communica-
tion.
Antenna interface pads 50Ω LTE main antenna, 50LTE diversity antenna
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1.1 Key Features at a Glance
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Feature Implementation
Power on/off, Reset
Power on/off Switch-on by hardware signal ON
Switch-off by AT command
Switch off by hardware signal GPIO4/FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Evaluation kit
Evaluation module ELS31-VA/ELS51-VA module soldered onto a dedicated PCB that can be
connected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the ELS31-VA/ELS51VA evaluation module to the DSB75.
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GPIO
interface
I2C
USB
ASC0
ASC0
CONTROL
POWER
ANTENNA
(LTE dual band)
Module
SIM interface
(with SIM detection)
SIM card
Application
Power supply
Emergency reset
ON
Serial modem
interface
Serial modem
interface
I2C
USB
Antenna /
div. Antenna
GPIOs
Status
LED
FST_SHDN
Fast shutdown
ADC
ADC
COUNTER
Pulse counter
GP(I)Os
HSIC
SDIO
HSIC
SDIO
SPI
SPI
SPI
SPI
ASC1
Serial interface
PCM/DAI
PCM/DAI
1.2 ELS31-VA/ELS51-VA System Overview
13
1.2 ELS31-VA/ELS51-VA System Overview
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Figure 1: ELS31-VA/ELS51-VA system overview
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SPDT
RF Swi tch
B13 Duplexer
B4 Duplexer
SPDT
RF Swi tch
PA DC/DC PMIC
B13 SAW
B4 SAW
SQN3241
B13 PA
B4 PA
Pri mary
Antenna
Div ers ity
Antenna
TCXO
Cont rol
RXIF1
RXIF2
TXIF
CLKREF
512Mbit LPDDR
SPI Fl ash
ELS31-V 256Mbit
ELS51-V 512Mbit
SIM
Level
Shifter
32.768kHz
Xtal
SQN3223
GPIO
SPI
UARTS
USB
HSIC
SDIO
SIM
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1.3 Circuit Concept
13
1.3 Circuit Concept
The following figure shows block diagram of the ELS31-VA/ELS51-VA module and illustrate
the major functional components (see Figure 2):
Baseband block:
• baseband processor and power management
• serial NOR flash and LPDDR RAM memory
• Application interface (SMT with connecting pads)
LTE RF section:
• RF transceiver
• RF power amplifier/front-end module and duplexers
• Receive SAW filters
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Figure 2: ELS31-VA/ELS51-VA baseband block diagram
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65
64
63
62
61
60
59
58
57
56
55
54
66
33
21
22
23
24
25
26
27
28
29
30
31
32
20
106
9291
9897969594
9089
85 86
93
74
99
87 88
8483
7978777675
8281
80
727170696867
105104103102101100
73
44
19181716151413121110987654321
3435363839404142434546474849505152
Supply pads : BATT+
Control pads
GND pads
ASC0 pads
SPI pads
SIM pads RF antenna pad
I2C pads
ADC pad
Supply pads : Other
Combined GPIO /DAI pads
Com bined GPIO / Control pads
(LED, COUNTER, FST_SHDN)
Do not use
Not connected
Reserved
USB pads
Combined GPIO/ASC1/HSIC pads
Combined GPIO /
ASC0 pads
250
251
252
245
249
248
247
246
Test points , do not
use
HSIC pads
37
SDIO pads
35
GPIO pads
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2 Interface Characteristics
56
2 Interface Characteristics
ELS31-VA/ELS51-VA is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces
as well as the RF antenna interfaces.
2.1 Application Interface
2.1.1 Pad Assignment
The SMT application interface on the ELS31-VA/ELS51-VA provides connecting pads to integrate the module into external applications. Figure 3 shows the connecting pads’ numbering
plan, the following Table 1 lists the pads’ assignments.
Figure 3: Numbering plan for connecting pads (bottom view)
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Table 1: Pad assignments
Pad no. Signal name Pad no. Signal name Pad no. Signal name
1 GND 23 GPIO20/PCM_I2S_OUT 45 USB_DP
2 GND 24 GPIO22/PCM_I2S_FSC 46 USB_DN
3 GND 25 GPIO21/PCM_I2S_IN 47 GND
4 GND 26 GPO23/PCM_I2S_CLK 48 GND
5 BATT_RF 27 I2CDAT 49 GND
6 GND 28 I2CCLK 50 GND
7 ADC1 29 GPIO17/TXD1/HOST_ACTIVE 51 GND
8 ON 30 GPIO16/RXD1/AP_WAKEUP 52 GND
9 GND 31 GPIO18/RTS1/CP_WAKEUP 53 BATT_BB
10 V180 32 GPIO19/CTS1/SUSPEND 54 GND
11 RXD0 33 EMERG_RST 55 GND
12 CTS0 34 GND 56 DIV_ANT
13 TXD0 35 GPIO25 57 GND
14 RING0/GPIO24 36 GPIO8/COUNTER 58 GND
15 RTS0 37 GPIO7 59 RF_OUT
16 Not connected 38 GPIO6 60 GND
17 CCRST 39 LED/GPO5 61 GND
18 CCIN 40 GPIO4/FST_SHDN 62 GND
19 CCIO 41 DSR0/GPIO3 63 GND
20 CCVCC 42 DCD0/GPIO2 64 GND
21 CCCLK 43 DTR0/GPIO1 65 GPIO27/SPI_CS2
22 VCORE 44 VUSB 66 GPO26/SPI_CS1
Centrally located pads
67 GND 83 Do not use (test) 99 GND
68 GND 84 GND 100 GND
69 GND 85 GND 101 GND
70 GND 86 GND 102 GND
71 GND 87 Do not use (test) 103 GND
72 Not connected 88 GND 104 Not connected
73 GND 89 GND 105 Not connected
74 Do not use (test) 90 GND 106 SPI_MOSI
75 Do not use (test) 91 Do not use (test) 245 GND
76 Do not use (test) 92 GND 246 HSIC_DATA
77 Do not use (test) 93 SDIO0 247 HSIC_STRB
78 Do not use (test) 94 SDIOCLK 248 SPI_CLK
79 Not connected 95 SDIO1 249 SPI_MISO
80 Do not use 96 SDIO2 250 GND
81 GND 97 SDIO3 251 SDIOCMD
82 GND 98 GND 252 GND
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Signal pads that are not used should not be connected to an external application.
Please note that the reference voltages listed in Table 2 are the values measured directly on
the ELS31-VA/ELS51-VA module. They do not apply to the accessories connected.
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2.1.2 Signal Properties
Table 2: Signal properties
Function Signal name IO Signal form and level Comment
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Power
supply
Power
supply
External
supply
voltage
BATT_BB
BATT_RF
IV
max = 4.5V
I
V
norm = 3.8V
I
V
min = 3.3V
I
Imax=720mA nominal voltage 3.8V
- 300 mA for BATT_RF
Lines of BATT+ and GND
must be connected in
parallel for supply purposes because higher
peak currents may occur.
- 420 mA for BATT_BB
Minimum voltage must
not fall below 3.3V including drop, ripple, spikes
and not rise above 4.5V.
GND Ground Application Ground
V180 O V
VCORE O V
norm = 1.80V
O
V
min = 1.71 V
O
V
max = 1.89V
O
I
max = 50mA
O
CLmax = 2µF
norm = 1.1V
O
V
min= 1.09
O
V
max= 1.12
O
I
max = 50mA
O
V180 may be used to
supply level shifters at
the interfaces or to supply
external application circuits.
If unused keep line open.
CLmax = 100nF
Ignition ON I BATT_BB= 4.5V
V
max = 5.5V
IH
V
min = 2.16V
IH
max = 1.79V
V
IL
V
min=0V
IL
BATT_BB= 3.3V
V
max = 5.5V
IH
V
min = 1.7V
IH
V
max = 1.3V
IL
V
min = 0V
IL
Min low time before rising edge
<=100µs
Rin = 380k
--
|____ high level min. 100µs
max = 5.5V
min = 0.85V
max =0.65V
min= 0V
Emergency
restart
EMERG_RST I V
ON ___|
IH
V
IH
V
IL
V
IL
Internal pull-up resistor
Low impulse width > 10ms
Edge triggered signal to
switch the module on.
Set this signal low before
and after the startup
impulse. Input is Schmitt
Trigger.
The ON signal can be
connected to BATT_BB.
In this case, the module
cannot be switched off by
a fast shutdown, but can
only be switched off by
disconnecting BATT_BB.
Pulse triggered signal to
reset the module. This
line must be driven low by
an open drain or open
collector driver connected to GND. See also
Section 3.2.2.2.
If unused keep line open.
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Table 2: Signal properties (Continued)
Function Signal name IO Signal form and level Comment
Page 17 of 106
Fast
FST_SHDN I V
shutdown
USB VUSB_IN I V
USB_DN I/O Full and high speed signal characteris-
USB_DP
Serial
Interface
ASC0
RXD0 O V
CTS0 O
RING0 O
TXD0 I
RTS0 I
DTR0 I
DCD0 O
DSR0 O
max = 0.63V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
~~|___|~~ low impulse width > 10ms
min = 3V
I
V
max = 5.25V
I
Active and suspend current:
I
< 100µA
max
tics according USB 2.0 Specification.
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
This line must be driven
low.
If unused keep line open.
Note that the fast shutdown line is originally
available as GPIO line. If
configured as fast shutdown, the GPIO line is
assigned as follows:
GPIO4 --> FST_SHDN
All electrical characteristics according to USB
Implementers' Forum,
USB 2.0 Specification.
If unused keep lines
open.
If unused keep lines
open.
By delivery default, lines
are available as ASC0
interface lines.
If configured for use as
GPIOs the assignment is
as follows:
DTR0 --> GPIO1
DCD0 --> GPIO2
DSR0 --> GPIO3
RING0 --> GPIO24
Serial
Interface
ASC1
RXD1 O V
CTS1 O
TXD1 I
RTS1 I
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
If unused keep lines
open.
By delivery default, ASC1
interface lines are available as GPIO lines.
If configured as ASC1
lines, the GPIO lines are
assigned as follows:
GPIO16 --> RXD1
GPIO17 --> TXD1
GPIO18 --> RTS1
GPIO19 --> CTS1
ASC1 is available as data
interface.
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Table 2: Signal properties (Continued)
Function Signal name IO Signal form and level Comment
2
I
C I2CCLK IO VOLmax = 0.45V
V
min = 1.35V
I2CDAT IO
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
According to the I
Specification Version 2.1
for the fast mode a rise
time of max. 300ns is permitted. There is also a
maximum V
3mA specified.
Minimum R external pullup (connected to V180
power supply) is 391
Ohms. The value of the
pull-up depends on the
capacitive load of the
whole system (I
+ lines).
The maximum sink current of I2CDAT and
I2CCLK is 4.6mA.
Page 18 of 106
2
C Bus
=0.4V at
OL
2
C Slave
SPI SPI_CLK O V
SPI_MOSI O
SPI_MISO I
SPI_CS1
O
SPI_CS2
GPIO interface
GPIO1-4
GPIO6-22
IO V
GPIO24,25,
27
GPO5,23,26 O
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
If lines are unused keep
lines open.
If lines are unused keep
lines open.
By delivery default, the
SPI CS interface lines are
available as GPIO lines.
If configured as SPI lines,
the GPIO lines are
assigned as follows:
GPO26 --> SPI_CS1
GPIO27 --> SPI_CS2
If unused keep line open.
Please note that some
GPIO lines are or can be
can be configured by AT
command for alternative
functions:
GPIO1-GPIO3: ASC0
control lines DTR0,
DCD0, and DSR0
GPIO4: FST_SHDN
GPO5: LED
GPIO8: Pulse Counter
GPIO16-GPIO19: ASC1,
HSIC control lines
GPIO20-GPO23: PCM/
2
I
S lines
GPIO24: ASC0 control
line RING0
GPO26-GPIO27: SPI CS
signals
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Table 2: Signal properties (Continued)
Function Signal name IO Signal form and level Comment
Page 19 of 106
Status LED LED O V
Pulse
COUNTER I V
counter
ADC
ADC1 I R
(Analog-toDigital converter)
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = -0.3V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
= 10kOhm
I
V
= 0V ... 2.0V
I
Resolution 1024 steps
Tolerance +/-2%
If unused keep line open.
By delivery default, the
line is available as LED
line.
If configured for use as
GPIO line, the LED line is
assigned as follows:
LED --> GPO5
If unused keep line open.
By delivery default, the
COUNTER line is originally available as GPIO
line. If configured for use
as COUNTER line, the
GPIO line is assigned as
follows:
GPIO8 --> COUNTER
ADC1 can be used as
input for external measurements.
If unused keep line open.
SIM card
detection
3V SIM
Card Interface
CCIN I R
CCRST O V
CCIO I/O V
CCCLK O V
CCVCC O V
90kOhm
I
V
max = 0.63V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
typical = 2.065V
OH
V
max = 2.95V
OH
V
typical = 0.1V @1mA
OL
V
max = 0.3V
OL
max = 0.44V
IL
V
min = -0.15V
IL
V
min = 2.065V
IH
V
max = 3.15V
IH
V
typical = 0.1V @1mA
OL
VOLmax = 0.3V
V
min = 2.065V at I = -10µA
OH
V
max = 2.95V
OH
typical = 2.065V
OH
V
max = 2.95V
OH
V
typical = 0.1V @1mA
OL
V
max = 0.3V
OL
min = 2.85V
O
typ = 2.95V
V
O
V
max = 3.10V
O
I
max = -50mA
O
CCIN = High, SIM card
inserted.
For details please refer to
Section 2.1.6.
If unused keep line open.
Maximum cable length or
copper track to SIM card
holder should not exceed
100mm.
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Table 2: Signal properties (Continued)
Function Signal name IO Signal form and level Comment
Page 20 of 106
1.8V SIM
CCRST O V
Card Interface
CCIO I/O V
CCCLK O V
CCVCC O V
HSIC HSIC_DATA
HSIC_STRB
typical = 1.26V
OH
V
max = 1.8V
OH
V
typical = 0.1V @1mA
OL
V
max = 0.3V
OL
max = 0.27V
IL
V
min=-0.15V
IL
VIHmin = 1.26V
V
max = 2V
IH
V
typical = 0.1V @1mA
OL
V
max = 0.3V
OL
V
min = 1.26V at I = -10µA
OH
VOHmax = 1.85V
typical = 1.26V
OH
V
max = 1.8V
OH
V
typical = 0.1V @1mA
OL
V
max = 0.3V
OL
min = 1.7V
O
V
typ = 1.80V
O
V
max = 1.9V
O
I
max = -50mA
O
IO Signal characteristics according to
“High-Speed Inter-Chip USB Electrical
Specification”, Version 1, September
23, 2007
HSIC available with
ELS51-VA only.
See also Section 2.1.14.
SDIO SDIOCMD
SDIOCLK
SDIO0
SDIO1
SDIO2
SDIO3
S)
PCM_I2S_-
CLK
PCM_I2S_
FSC
Digital
audio
interface
(PCM/I
2
PCM_I2S_
IN
PCM_I2S_
OUT
IO V
IV
I
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
V
max = 0.63V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
max = 0.63V
IL
V
min = 1.17V
IH
V
max = 1.85V
IH
I
OV
max = 0.45V
OL
V
min = 1.35V
OH
V
max = 1.85V
OH
SDIO available with
ELS51-VA only.
See also Section 2.1.15.
If unused keep line open.
Note that the PCM interface lines are originally
available as GPIO lines.
If configured as PCM
lines, the GPIO lines are
assigned as follows:
GPIO23 --> PCM_I2S_CLK
GPIO22 --> PCM_I2S_
FSC
GPIO20 --> PCM_I2S_
OUT
GPIO21 --> PCM_I2S_
IN
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Page 21 of 106
2.1.2.1 Absolute Maximum Ratings
The absolute maximum ratings stated in Table 3 are stress ratings under any conditions.
Stresses beyond any of these limits will cause permanent damage to ELS31-VA/ELS51-VA.
Table 3: Absolute maximum ratings
Parameter Min Max Unit
Supply voltage BATT+
Voltage at all digital lines in Power Down mode -0.3 +0.3 V
Voltage at digital lines in normal operation -0.2 2.0 V
Voltage at SIM/USIM interface, CCVCC in normal operation -0.5 +3.6 V
Voltage at ADC line in normal operation 0 2 V
Voltage at analog lines in Power Down mode -0.3 +0.3 V
V180 in normal operation +1.7 +1.9 V
Current at V180 in normal operation 50 mA
Current at VCORE in normal operation 50 mA
, BATT+
BB
RF
-0.3 +4.5 V
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VBUS
DP
DN
VREG (3V075)
BATT+
USB_DP
2)
lin. reg.
GND
Module
Detection only
VUSB_IN
USB part
1)
RING0
Host wakeup
1)
It is recommended to add EMI suppression filter (see section 2.1.3.1)
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90Ohm for proper signal integrity.
SMT
Page 22 of 106
2.1 Application Interface
56
2.1.3 USB Interface
ELS31-VA/ELS51-VA supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full
Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and
data interface and for downloading firmware.
The V
line is used for cable detection only, this is to be supplied by the external device. The
USB
USB circuitry in the ELS31-VA/ELS51-VA is designed to meet the USB 2.0 specification for
1
self-power.2.0”
.
Figure 4: USB circuit
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. For more information on the USB related signals see Table 2. Furthermore, the USB modem driver distributed with ELS31-VA/
ELS51-VA needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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USB_DP
USB_DN
GND
VUSB
GND
1
12
3
12
342
3
4
65
45
46
ELS31
ELS51
J1
USB-Type B
F1
U1
Page 23 of 106
2.1 Application Interface
56
2.1.3.1 Interface implementation
Figure 5 shows a standard USB interfacing circuit for "off board" interfacing (connection directly
to a USB connector).
If the USB interface is directly wired to a Host interface, the additional ESD protection (U1 on
Figure 5) is not necessary, as the final product will not be a "hot swappable" item. The filter is
used to offer high impedance to higher frequency components of the USB signals. This helps
reduce any potential RF noise coming from these USB wires.
Figure 5: USB Additional ESD Protection Implementation
The digital signals USB_DP and USB_DN are sensitive to track design. Make sure these signals are routed with 90 Ohms differential resistance. If the host product is containing other USB
interfaces, then ensure that the rules used to design those are replicated here too. An overvoltage protection device U1 is recommended, such as ESD5V3U2U-03F.
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Page 24 of 106
2.1.3.2 Reducing Power Consumption
While a USB connection is active, the module will never switch into SLEEP mode. Only if the
USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to
switch into SLEEP mode thereby saving power. There are two possibilities to enable power reduction mechanisms:
• Recommended implementation of USB Suspend/Resume/Remote Wakeup:
The USB host should be able to bring its USB interface into the Suspended state as
described in the “Universal Serial Bus Specification Revision 2.0“
work, the VUSB_IN line should always be kept enabled. On incoming calls and other events
ELS31-VA/ELS51-VA will then generate a Remote Wakeup request to resume the USB
host controller.
See also [5] (USB Specification Revision 2.0, Section 10.2.7, p.282):
"If USB System wishes to place the bus in the Suspended state, it commands the Host Controller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Suspended state. In this state, the USB System may enable the Host Controller to respond to
bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to
restart the host system."
1
. For this functionality to
• Implementation for legacy USB applications not supporting USB Suspend/Resume:
As an alternative to the regular USB suspend and resume mechanism it is possible to
employ the RING0 line to wake up the host application in case of incoming calls or events
signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every
wakeup event will force a new USB enumeration. Therefore, the external application has to
carefully consider the enumeration timings to avoid loosing any signalled events. For details
on this host wakeup functionality see Section 2.1.16.3.
Note: Existing data connections will not be disconnected even if the USB interface is in de-
tached state. URCs will be queued during detached state, but may be signaled to the host via
host wakeup line RING0.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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Page 25 of 106
2.1.4 Serial Interface ASC0
ELS31-VA/ELS51-VA offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with
ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data
bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of
the interface line’s startup behavior see Figure 7.
ELS31-VA/ELS51-VA is designed for use as a DCE. Based on the conventions for DCE-DTE
connections it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 6: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 4800bps up to 921600bps.
• Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXD
and TXD lines, if RTS0 is pulled low.
• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.2).
The ASC0 interface is dedicated to signaling via AT commands (3GPP standard 27.007 + module specific AT commands).
Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured
as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:
DTR0 --> GPIO1, DCD0 --> GPIO2, DSR0 --> GPIO3 and RING0 --> GPIO24.
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TXD0
RXD0
RTS0
CTS0
DTR0
DSR0
DCD0
RING0
ON
EMERG_RST
Power supply active
Start up
Firmware
initialization
Command interface
initialization
Interface
active
V180
VCORE
Reset
state
Page 26 of 106
2.1 Application Interface
56
2.1.4.1 Serial Interface Start-up Behavior
The following figure shows the startup behavior of the asynchronous serial interface ASC0.
For pull-up and pull-down values see Table 15.
Figure 7: ASC0 startup behavior
No data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.2.1).
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Page 27 of 106
2.1.5 Serial Interface ASC1
ELS31-VA/ELS51-VA provides a 4-wire unbalanced, asynchronous modem interface ASC1
conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply
with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high
data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface line’s startup behavior see Figure 9. ASC1 can only be used as data interface.
The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines,
the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 -->
RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The
configuration is non-volatile and becomes active after a module restart.
ELS51-VA is designed for use as a DCE. Based on the conventions for DCE-DTE connections
it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
Figure 8: Serial interface ASC1
Features
• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.
• On ASC1 no RING line is available.
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at fixed bit rates from 4800 bps to 921600 bps.
• Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXD
and TXD lines, if RTS1 is pulled low.
• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.2).
AT commands for signaling are not supported on ASC1 interface. ASC1 is intended only for
data transfer in a Linux environment.
The following figure shows the startup behavior of the asynchronous serial interface ASC1.
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TXD1
RXD1
RTS1
CTS1
ON
Power supply active
Start up
Firmware
initialization
Command interface
initialization
Interface
active
V180
VCORE
EMERG_RST
Reset
state
~ 15sec
2.1 Application Interface
56
Page 28 of 106
*) For pull-down values see Table 15.
Figure 9: ASC1 startup behavior
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Page 29 of 106
2.1.6 UICC/SIM/USIM Interface
ELS31-VA/ELS51-VA has an integrated UICC/SIM/USIM interface compatible with the 3GPP
31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an
external SIM card holder. Five pads on the SMT application interface are reserved for the SIM
interface.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 2 for
electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or
1.8V SIM card is used.
The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder.
The CCIN signal must be connected to V180 for the detection to work on the module. Otherwise the SIM card can never be detected by the module.
Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the
mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on
the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with ELS31-VA/ELS51-VA and is part of the Gemalto M2M reference equipment
submitted for type approval. See Section 7.1 for Molex ordering numbers.
Table 4: Signals of the SIM interface (SMT application interface)
Signal Description
GND Separate ground connection for SIM card to improve EMC.
CCCLK Chipcard clock
CCVCC SIM supply voltage.
CCIO Serial data line, input and output.
CCRST Chipcard reset
CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN signal is by default low and will change to high level if a SIM card
is inserted.
The CCIN signal is mandatory for applications that allow the user to remove the SIM card
during operation.
The CCIN signal is solely intended for use with a SIM card. It must not be used for any other
purposes. Failure to comply with this requirement may invalidate the type approval of
ELS31-VA/ELS51-VA.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after
removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In
this case, the application must restart ELS31-VA/ELS51-VA.
ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04
Confidential / Preliminary
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description
SIM
CCVCC
CCRST
CCIO
CCCLK
220nF
1nF
CCIN
V180
2.1 Application Interface
56
The figure below shows a circuit to connect an external SIM card holder.
Page 30 of 106
Figure 10: External UICC/SIM/USIM card holder circuit
The total cable length between the SMT application interface pads on ELS31-VA/ELS51-VA
and the pads of the external SIM card holder must not exceed 100mm in order to meet the
specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach is using a GND line to shield
the CCIO line from the CCCLK line.
The ELS31-VA/ELS51-VA includes embedded ESD protection for the SIM interface that complies to ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.
ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04
Confidential / Preliminary
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