Gemalto M2M ELS31 V User Manual

Cinterion® ELS31-V/ELS51-V
Hardware Interface Overview Version: 00.502
DocId: ELS31-V_ELS51-V_HIO_v00.502
M2M.GEMALTO.COM
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2
Page 2 of 35
Document Name: Version: Date: DocId: Status:
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
00.502 2015-12-07 ELS31-V_ELS51-V_HIO_v00.502 Confidential / Preliminary
GENERAL NOTE
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con­tents and communication thereof to others without ex press autho rization are prohib ited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.
Copyright © 2015, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Win dows are e ither regis tered trademarks or trademarks of Microsoft Corpora­tion in the United States and/or other countries. All other register ed trademarks or trademarks mention ed in this document are property of their respective owners.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

Contents

35
Page 1 of 35
Contents
1 Introduction.................................................................................................................2
1.1 Key Features at a Glance..................................................................................2
1.2 ELS31-V / ELS51-V System Overview.............................................................. 5
2 Interface Characteristics............................................................................................ 6
2.1 Application Interface ..........................................................................................6
2.1.1 USB Interface........................................................................................6
2.1.2 Serial Interface ASC0 ........................................................................... 7
2.1.3 Serial Interface ASC1 (ELS51-V Only)................................................. 8
2.1.4 UICC/SIM/USIM Interface.....................................................................9
2.1.5 GPIO Interface....................................................................................11
2.1.6 I
2.1.7 SPI Interface.......................................................................................13
2.1.8 Pulse Counter.....................................................................................13
2.1.9 HSIC Interface (ELS51-V Only).......................................................... 13
2.1.10 SDIO Interface (ELS51-V Only)..........................................................13
2.1.11 Control Signals....................................................................................13
2.2 RF Antenna Interface.......................................................................................14
2.2.1 Antenna Installation ............................................................................15
2.3 Sample Application..........................................................................................16
2
C Interface........................................................................................12
2.1.11.1 Status LED ..........................................................................13
2.1.11.2 Fast Shutdown....................................................................13
3 Operating Characteristics........................................................................................18
3.1 Operating Modes .............................................................................................18
3.2 Power Supply...................................................................................................19
4 Mechanical Dimensions, Mounting and Packaging...............................................20
4.1 Mechanical Dimensions of ELS31-V / ELS51-V..............................................20
5 Regulatory and Type Approval Information........................................................... 22
5.1 Directives and Standards.................................................................................22
5.2 SAR requirements specific to portable mobiles............................................... 24
5.3 Reference Equipment for Type Approval.........................................................25
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 26
6 Document Information..............................................................................................28
6.1 Revision History...............................................................................................28
6.2 Related Documents .........................................................................................28
6.3 Terms and Abbreviations.................................................................................28
6.4 Safety Precaution Notes..................................................................................32
7 Appendix....................................................................................................................33
7.1 List of Parts and Accessories...........................................................................33
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

Tables

35
Page 1 of 35
Tables
Table 1: Signals of the SIM interface (SMT application interface)................................. 9
Table 2: GPIO lines and possible alternative assignment............................................ 11
Table 3: Return loss in the active band........................................................................ 14
Table 4: Overview of operating modes ........................................................................ 18
Table 5: Directives ....................................................................................................... 22
Table 6: Standards of North American type approval.................................................. 22
Table 7: Standards of Verizon type approval............................................................... 22
Table 8: Standards of GCF type approval.................................................................... 22
Table 9: Requirements of quality ................................................................................. 22
Table 10: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 23
Table 11: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 23
Table 12: Antenna gain limits for FCC and IC................................................................ 26
Table 13: List of parts and accessories.......................................................................... 33
Table 14: Molex sales contacts (subject to change)...................................................... 34
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

Figures

35
Page 1 of 35
Figures
Figure 1: ELS31-V / ELS51-V system overview.............................................................. 5
Figure 2: USB circuit ....................................................................................................... 6
Figure 3: Serial interface ASC0....................................................................................... 7
Figure 4: Serial interface ASC1....................................................................................... 8
Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 10
Figure 6: Schematic diagram of ELS31-V / ELS51-V sample application..................... 17
Figure 7: ELS31-V– top and bottom view...................................................................... 20
Figure 8: Dimensions of ELS31-V / ELS51-V (all dimensions in mm)........................... 21
Figure 9: Dimensions of ELS31-V / ELS51-V (all dimensions in mm) - bottom view.... 21
Figure 10: Reference equipment for Type Approval....................................................... 25
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

1 Introduction

5
Page 2 of 35
1 Introduction
This document1 describes the hardware of the Cinterion® ELS31-V and ELS51-V modules for Verizon Network. It helps you quickly retrieve interface specifications, electrical and mechani­cal details and information on the requirements to be considered for integrating further compo­nents.
The ELS31-V and ELS51-V modules include a baseband, a complete dual band RF frontend, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 10 set of specifications) and Verizon Wireless LTE UE specifications.
The module variants differentiate a follows:
- ELS31-V provides LTE connectivity with IP Services
- ELS51-V adds a Linux execution environment available for customer applications
Note: Throughout the document ELS31-V refers to ELS31-V Release 2.

1.1 Key Features at a Glance

Feature Implementation
General
Frequency bands LTE dualband: B4, B13 Output power Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13 Power supply 3.3V to 4.5V Operating temperature
(board temperature) Physical Dimensions: 27.6mm x 18.8mm x 2.2mm
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 DL 10Mbps, UL 5Mbps
SMS Point-to-point MT and MO
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Weight: approx. 3g
LTE Cat. 1 data rates
Text and PDU mode
Storage in mobile equipment
Software
AT commands Hayes, 3GPP TS 27.007, TS 27.005, product specific SIM Application Toolkit SAT Release 99 Firmware update Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB
1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Page 3 of 35
1.1 Key Features at a Glance
5
Feature Implementation
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli­ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on module mounting and application layout issues as well as on SMT application developmen t eq uip m en t.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
8-wire modem interface with status and control lines, unbalanced, asyn­chronous
Default baud rate: 115,200 baud
Adjustable baud rates: 1,200 to 921,600, no autobauding support
Supports RTS0/CTS0 hardware flow control.
indication of incoming data/SMS on RING0 (can be used to wake up host from power down modes)
ELS51-V only:
ASC1 (shared with GPIO lines):
4-wire, unbalanced asynchronous interface
Default baud rate: 115,200 baud
Adjustable baud rates: 1,200bps to 921,600bps
Supports RTS1/CTS1 hardware flow control
UICC interface Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC Module is prepared for an embedded UICC
GPIO interface 20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3): GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and SPI signal lines Programming is done via AT commands
2
I
C interface Supports I2C serial interface
SPI interface Supports SPI interface
SDIO ELS51-V only:
4 wire interface.
HSIC ELS51-V only:
High Speed Interchip Communication interface.
ADC
Analog-to-Digital Converter with one unbalanced analog input.
Digitial audio interface Hardware prepared for future use. Antenna interface pads 50 LTE main antenna, 50LTE diversity antenna
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
1.1 Key Features at a Glance
5
Feature Implementation
Power on/off, Reset
Power on/off Switch-on by hardware signal ON
Switch-off by AT command Switch off by hardware signal GPIO4/FST_SHDN instead of AT command Automatic switch-off in case of critical temperature and voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Evaluation kit
Evaluation module ELS31-V / ELS51-V module soldered onto a dedicated PCB that can be
connected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS31-V / ELS51­V evaluation module to the DSB75.
Page 4 of 35
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
GPIO
interface
I2C
USB
ASC0
ASC0
CONTROL
POWER
ANTENNA
(LTE dual band)
Module
SIM interface
(with SIM de tec tion)
SIM card
App lication
Power supply
Emergency reset
ON
Serial modem interface
Serial modem interface
I2C
3
4
4
5
2
1 1
2
USB
Antenna / div. Antenna
2
GPIOs
7
Status
LED
1
FST_SHDN
Fast shutdown
1
1
ADC
ADC
1
COUNTER
Pulse counter
1
GP(I)Os
HSIC SDIO
4
3
HSIC SDIO
SPI
SPI
3
SPI
SPI
2
ASC1
Serial interface
4

1.2 ELS31-V / ELS51-V System Overview

5
1.2 ELS31-V / ELS51-V System Overview
Page 5 of 35
Figure 1: ELS31-V / ELS51-V system overview
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
VBUS
DP DN
VREG (3V075)
BATT+
USB_DP
2)
lin. reg.
GND
Module
Detection only
VUSB_IN
USB part
1)
RING0
Host wakeup
1)
It is recommended to add EMI suppr essi on fi l t er ( see secti on 2 .1. 3. 1)
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity.
SMT
Page 6 of 35

2 Interface Characteristics

17
2 Interface Characteristics
ELS31-V / ELS51-V is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interfaces.

2.1 Application Interface

2.1.1 USB Interface

ELS31-V / ELS51-V supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware.
The V
line is used for cable detection only, this is to be supplied by the external device. The
USB
USB circuitry in the ELS31-V / ELS51-V is designed to meet the USB 2.0 specification for self-
1
power.2.0”
.
To properly connect the module's USB interface to the external application, a USB 2.0 compat­ible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS31-V / ELS51-V needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Figure 2: USB circuit
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.1 Application Interface
17
Page 7 of 35

2.1.2 Serial Interface ASC0

ELS31-V / ELS51-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 con­forming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
ELS31-V / ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to the module’s TXD0 signal line
Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
Includes the data lines TXD0 and RXD0, t he status line s RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0.
Configured for 8 data bits, no parity and 1 stop bit.
ASC0 can be operated at fixed bit rates from 1200bps up to 921600bps.
Supports RTS0/CTS0 hardware flow control. Communication is possi ble by using only RXD and TXD lines, if RTS0 is pulled low.
Wake up from SLEEP mode by RTS0 activation (high to low transition).
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.1 Application Interface
17
Page 8 of 35

2.1.3 Serial Interface ASC1 (ELS51-V Only)

ELS51-V provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). With ELS31-V, ASC1 can only be used as data interface.
ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to module’s TXD1 signal line
Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand­shake.
On ASC1 no RING line is available.
Configured for 8 data bits, no parity and 1 or 2 stop bits.
ASC1 can be operated at fixed bit rates from 1,200 bps to 921600 bps.
Supports RTS1/CTS1 hardware flow control. Communication is possi ble by using only RXD and TXD lines, if RTS1 is pulled low.
Wake up from SLEEP mode by RTS0 activation (high to low transition).
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.1 Application Interface
17
Page 9 of 35

2.1.4 UICC/SIM/USIM Interface

ELS31-V / ELS51-V has an integrated UICC/SIM/USIM interface compatible with the 3GPP
31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an
external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper­ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test­ed to operate with ELS31-V / ELS51-V and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.
Table 1: Signals of the SIM interface (SMT application interface)
Signal Description
GND Separate ground connection for SIM card to improve EMC. CCCLK Chipcard clock CCVCC SIM supply voltage. CCIO Serial data line, input and output. CCRST Chipcard reset CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruc­tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS31-V
/ ELS51-V.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ­ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS31-V / ELS51-V.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
SIM
CCVCC
CCRST
CCIO
CCCLK
220nF
1nF
CCIN
V180
2.1 Application Interface
17
The figure below shows a circuit to connect an external SIM card holder.
Page 10 of 35
Figure 5: External UICC/SIM/USIM card holder circuit
The total cable length between the SMT application interface pads on ELS31-V / ELS51-V and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifi­cations of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Page 11 of 35
2.1 Application Interface
17

2.1.5 GPIO Interface

ELS31-V / ELS51-V offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED (see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9).
The following table shows the configuration variants for the GPIO pads. All variants are mutu­ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.
Table 2: GPIO lines and possible alternative assignment
GPIO Fast
Shutdown
GPIO1 DTR0 GPIO2 DCD0 GPIO3 DSR0 GPIO4 FST_SHDN GPO5 LED GPIO6 GPIO7 GPIO8 COUNTER GPIO16 RXD1 AP_WAKEUP GPIO17 TXD1 HOST_ACTIVE GPIO18 RTS1 CP_WAKEUP GPIO19 CTS1 SUSPEND GPIO20 GPIO21 GPIO22 GPO23
Status LED
Pulse Counter
ASC0 ASC1 SPI HSIC
GPIO24 RING0 GPIO25 GPO26 SPI_CS1 GPIO27 SPI_CS2
After startup, the above mentioned alternative GPIO line assignments can be configured u sing AT commands (see [1]). The configuration is non-volatile and available after module restart.
Notes:
GPO5, GPO23 and GPO26 are GPOs only.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.1 Application Interface
17
Page 12 of 35

2.1.6 I2C Interface

I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con­sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc­tional line. Each device connected to the bus is software addressable by a unique 7-bit ad­dress, and simple master/slave relationships exist at all times. The module operates a s master­transmitter or as master-receiver. The customer application transmits or receives data only on request of the module.
2
The I
C interface can be powered via the V180 line of ELS31-V / ELS51-V. If connected to the V180 line, the I mode.
Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible.
2
C interface will properly shut down when the module enters the Power Down
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.1 Application Interface
17
Page 13 of 35

2.1.7 SPI Interface

Four ELS31-V / ELS51-V GPIO interface lines can be configured as Serial Periphera l Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS31­V / ELS51-V and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select lines SPI_CS1 and SPI_CS2.

2.1.8 Pulse Counter

The GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter inter­face can be used, for example, as a clock (for GPIOs see Section 2.1.5).

2.1.9 HSIC Interface (ELS51-V Only)

TBD

2.1.10 SDIO Interface (ELS51-V Only)

TBD

2.1.11 Control Signals

2.1.11.1 Status LED
The GPO5 interface line can be configured to drive a status LED that indicates different oper­ating modes of the module (for GPIOs see Section 2.1.5). GPO and LED functionality are mu­tually exclusive.
2.1.11.2 Fast Shutdown
The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con­figured FST_SHDN line is an active low control signal.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

2.2 RF Antenna Interface

17
Page 14 of 35
2.2 RF Antenna Interface
The RF interface has an impedance of 50. ELS31-V /ELS51-V is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.
The external antenna must be matched properly to achieve best performance regarding radi­ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS31-V / ELS51-V module and should be placed in the host application if the antenna does not have an impedance of 50
Regarding the return loss ELS31-V / ELS51-V provides the following values in the active band:
Table 3: Return loss in the active band
State of module Return loss of module Recommended return loss of application
.
Receive > Transmit not applicable >
8dB > 12dB
12dB
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.2 RF Antenna Interface
17
Page 15 of 35

2.2.1 Antenna Installation

The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-V / ELS51-V. All RF data specified throughout this document is related to the ARP.
The distance between the antenna RF pads and its neighb oring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch.
The wiring of the antenna connection line, starting from the antenna pad to the application an­tenna should result in a 50 to be optimized with regard to the PCB’s layer stack.
To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology.
line impedance. Line width and distance to the GND plane needs
For type approval purposes, the use of a 50
coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS31-V / ELS51-V‘s antenna pad.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

2.3 Sample Application

17
Page 16 of 35
2.3 Sample Application
Figure 6 shows a typical example of how to integrate a ELS31-V / ELS51-V module with an
application. Usage of the various host interfaces depends on the desired features of the appli­cation.
Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines (e.g. RXD0, VDDLP, and ON).
While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [4].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po­sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic.
Note: ELS31-V / ELS51-V is not intended for use with cables longer than 3m. Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 6 and the information detailed in this section. As functionality and compliance with na-
tional regulations depend to a great amount on the used electronic components and the indi­vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using ELS31-V / ELS51-V modules.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
ELS31-V/51-V
Main Antenna
Div. Antenna
BATT+RF BATT+BB
GPIOs
LED
PWM
COUNTER
I2CCLK
I2CDAT
GND
SDIO
HSIC
ON FST_SHUTDOWN
ASC0
ASC1
USB
V180 CCIN
CCVCC CCIO CCRST CCCLK
Power Supply
33pF 33pF + 150µF
Low ESR!
2k2 2k2
V180
Blocking
WiFi
µC
1nF 10pF10pF220nF
SIM
USB
Interfaces available only on ELS51-V
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
2.3 Sample Application
17
Page 17 of 35
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Figure 6: Schematic diagram of ELS31-V / ELS51-V sample application
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

3 Operating Characteristics

19
Page 18 of 35
3 Operating Characteristics

3.1 Operating Modes

The table below briefly summarizes the various operating modes referred to throughout the document.
Table 4: Overview of operating modes
Mode Function
Normal opera­tion
Power Down
Airplane mode
LTE IDLE No data transfer is in progress and the USB connection is suspended
by host (or is not present) and no active communication via ASC0/ ASC1. In IDLE mode, the software can be active or in SLEEP state.
LTE DATA LTE data transfer in progress. Power consumption depends on network
settings and data transfer rate.
Normal shutdown after sending the power down command. Software is not active. Inter­faces are not accessible. Operating voltage remains applied.
Airplane mode shuts down the radio part of the module, causes the module to log off from the LTE network and disables all AT commands whose execution requires a radio connec­tion. Airplane mode can be controlled by AT command (see [1]). In Airplane mode, the software can be active or in SLEEP state.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

3.2 Power Supply

19
Page 19 of 35
3.2 Power Supply
ELS31-V/ ELS51-V needs to be connected to a power supply at the SMT application interface
- 2 BATT lines and GND. There are two separate voltage domains for BATT:
BATT_BB with a line mainly for the baseband power supply.
BATT_RF with a line for the RF power amplifier supply. Please note that throughout the document BATT refers to both voltage domains and power
supply lines - BATT_BB and BATT_RF. The power supply of ELS31-V / ELS51-V has to be a single voltage source at BATT_BB and
BATT_RF. It must be able to provide the current for all operation modes of the module. All the key functions for supplying power to the device are handled by t he power management
section of the analog controller. This IC provides the following features:
Stabilizes the supply voltages for the baseba nd using low drop linear voltage regulators and
a DC-DC step down switching regulator.
Switches the module's power voltages for the power-up and -down procedures.
SIM switch to provide SIM power supply.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Product label
Top view
Bottom view

4 Mechanical Dimensions, Mounting and Packaging

21
Page 20 of 35
4 Mechanical Dimensions, Mounting and Packaging

4.1 Mechanical Dimensions of ELS31-V / ELS51-V

Figure 7 shows the top and bottom view of ELS31-V / ELS51-V and provides an overview of
the board's mechanical dimensions. For further details see Figure 8.
Figure 7: ELS31-V– top and bottom view
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
4.1 Mechanical Dimensions of ELS31-V / ELS51-V
21
Page 21 of 35
Figure 8: Dimensions of ELS31-V / ELS51-V (all dimensions in mm)
Figure 9: Dimensions of ELS31-V / ELS51-V (all dimensions in mm) - bottom view
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

5 Regulatory and Type Approval Information

27
Page 22 of 35
5 Regulatory and Type Approval Information

5.1 Directives and Standards

ELS31-V / ELS51-V is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical spec­ifications provided in the "ELS31-V / ELS51-V Hardware Interface Description".
Table 5: Directives
2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2)
Table 6: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
OET Bulletin 65 (Edition 97-01)
UL 60 950-1 Product Safety Certification (Safety requirements)
California Leadfree Man­date
RSS132 (Issue2) RSS133 (Issue5)
Table 7: Standards of Verizon type approval
Verizon Wireless Unified Module Process for Complian ce Tes tin g an d App r oval , Oc to be r 20 14
Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
PCS); US Equipment Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to
Radiofrequency Electromagnetic Fields
Covered by European RoHS requirements
Canadian Standard
Verizon Wireless Device Requirements LTE 3GPP Band 13 Network Access, October 2014 Verizon Wireless Device Requirements LTE 3GPP Band 4 Network Access, October 2014 3GPP2 C.S0015-A v1.0 Short Message Service for spread spectrum systems
Table 8: Standards of GCF type approval
3GPP TS 51.010-1 Digital cellula r telecommunications system (Release 10); Mobile Station
(MS) conformance specification;
GCF-CC V3.58 Global Certification Forum - Certification Criteria
Table 9: Requirements of quality
IEC 60068 Environmental testing DIN EN 60529 IP codes
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
5.1 Directives and Standards
27
Table 10: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products” (2006-06).
SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06). According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description.
Please see Table 11 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006.
Table 11: Toxic or hazardous substances or elements with defined concentration limits
Page 23 of 35
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

5.2 SAR requirements specific to portable mobiles

27
Page 24 of 35
5.2 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS31V / ELS51-V based applications to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz
Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:
Portable device:
A portable device is defined as a transmitting device designed to be used so that the radi­ating structure(s) of the device is/are within 20 centimeters of the body of the user.
Mobile device:
A mobile device is defined as a transmitting device designed to be used in other than fixe d locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Antenna
GSM / GPRS / UMTS
Antenna with 1m cable
ASC0
PC
Power
supply
LTE
Base station
DSB75
ASC1
USB
Approval adapter for
DSB75
SMA
Evaluation module
ELS31-V ELS51-V
USB
Evaluation module
ELS31-V ELS51-V
SIM card
Top view
Bottom view

5.3 Reference Equipment for Type Approval

27
5.3 Reference Equipment for Type Approval
Page 25 of 35
The Gemalto M2M reference setup submitted to type approve ELS31-V / ELS51- V(including a special approval adapter for the DSB75) is shown in the following figure
1
:
Figure 10: Reference equipment for Type Approval
1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho­sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the ELS31-V- / ELS51-V-DSB75 adapter as shown in Figure 10. The following products are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40) (for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/ Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

5.4 Compliance with FCC and IC Rules and Regulations

27
Page 26 of 35
5.4 Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Gemalto M2M reference application de­scribed in Section 5.3 will be registered under the following identifiers:
ELS31-V: FCC Identifier: QIPELS31-V (not yet granted) Industry Canada Certification Number: 7830A-ELS31V (not yet granted) Granted to Gemalto M2M GmbH
ELS51-V: FCC Identifier: QIPELS51-V (not yet granted) Industry Canada Certification Number: 7830A-ELS51V (not yet granted) Granted to Gemalto M2M GmbH
Manufacturers of mobile or fixed devices incorporating ELS31-V / ELS51-V modules are au­thorized to use the FCC Grants and Industry Canada Certificates of the ELS31-V / ELS51-V modules for their own final products according to the conditions referenced in these docu­ments. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS31-V" / "Contains FCC ID: QIPELS51-V", and accordingly “Contains IC: 7830A-ELS31V“ / “Contains IC: 7830A-ELS51V“. The integration is limited to fixed or mobile categorised host devices, where a separation dis­tance between the antenna and any person of min. 20cm can be assured during normal oper­ating conditions.
For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits in the following Table 12 for FCC and IC.
Table 12: Antenna gain limits for FCC and IC
Operating band FCC limit IC limit Unit
Maximum gain in lower operating bands with f< 1GHz (LTE Bd13)
Maximum gain in higher operating bands with f=1700MHz (LTE Bd4)
10.4 7.4
6.5 6.5 dBi
dBi
IMPORTANT: Manufacturers of portable applications incorporating ELS31V / ELS51-V modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Cer­tificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter­ference in a residential installation. This equipment generates, uses and can radiate radio fre­quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
5.4 Compliance with FCC and IC Rules and Regulations
27
Page 27 of 35
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of t he following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating ELS31V / ELS51-V modules the
above note will have to be provided in the English and French language in the final user docu­mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

6 Document Information

32
Page 28 of 35
6 Document Information

6.1 Revision History

New document: "Cinterion® ELS31-V/ELS51-V Hardware Interface Overview" v00.502
Chapter What is new
-- Initial document setup.

6.2 Related Documents

[1] ELS31-V / ELS51-V AT Command Set [2] ELS31-V / ELS51-V Release Note [3] Application Note 40: Thermal Solutions [4] Application Note 48: SMT Module Integration [5] Universal Serial Bus Specification Revision 2.0, April 27, 2000

6.3 Terms and Abbreviations

Abbreviation Description
ADC Analog-to-digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of
the modue B Thermistor Constant BER Bit Error Rate BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Eur opéene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
6.3 Terms and Abbreviations
32
Abbreviation Description
DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module) DCS 1800 Digital Cellular System, also referred to as PCN DRX Discontinuous Reception DSB Development Support Box DSP Digital Signal Processor DSR Data Set Ready DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate
Page 29 of 35
EGSM Enhanced GSM EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPIO General Purpose Input/Output GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Li-Ion/Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery LTE Long Term Evolution
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
6.3 Terms and Abbreviations
32
Abbreviation Description
Mbps Mbits per second MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coeff icie nt OEM Original Equipment Manufacturer PA Power Amplifier PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level
Page 30 of 35
PCM Pulse Code Modulation PCN Personal Communications Network, also referred to as DCS 1800 PCS Personal Communication System, also referred to as GSM 1900 PDU Protocol Data Unit PLL Phase Locked Loop PPP Point-to-point protocol PSK Phase Shift Keying PSU Power Supply Unit PWM Pulse Width Modulation R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RMS Root Mean Square (value) RoHS Restriction of the use of certain hazardous substances in electrical and electronic
equipment. ROM Read-only Memory RTC Real Time Clock RTS Request to Send Rx Receive Direction SAR Specific Absorption Rate SAW Surface Accoustic Wave SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMD Surface Mount Device
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
6.3 Terms and Abbreviations
32
Abbreviation Description
SMS Short Message Service SMT Surface Mount Technology SRAM Static Random Access Memory TA Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Univers al asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio
Page 31 of 35
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

6.4 Safety Precaution Notes

32
Page 32 of 35
6.4 Safety Precaution Notes
The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-V. Manufacturers of the cellular terminal are advised to convey the following safety information to users and ope rating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail­ure to comply with these precautions violates safety standards of design, manufacture and in­tended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide­lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear­ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufa c­turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mob ile a way from the pace maker , while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can­not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec­trical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidd en, or when you suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv­ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera­tion can constitute a safety hazard.
IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com­munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi­nal or mobile.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview

7 Appendix

34
7 Appendix

7.1 List of Parts and Accessories

Table 13: List of parts and accessories
Description Supplier Ordering information
ELS31-V Gemalto M2M Standard module
Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N4500-A200 Module label number: S30960-S4500-A200-1
ELS51-V Gemalto M2M Standard module
Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N4530-A100 Module label number: S30960-S4530-A100-1
Page 33 of 35
ELS31-V Evaluation Module Gemalto M2M Ordering number:
L30960-N4501-A200
ELS51-V Evaluation Module Gemalto M2M Ordering number:
L30960-N4531-A100 DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100 DSB Mini
Compact Evaluation Board Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100 Multi-Adapter R1 for mount-
ing ELS31-V/ELS51-V evalu­ation modules onto DSB75
Approval adapter for mount­ing ELS31-V/ELS51-V evalu­ation modules onto DSB75
SIM card holder incl. push button ejector and slide-in tray
Gemalto M2M Ordering number: L30960-N0030-A100
Gemalto M2M Ordering number: L30960-N0010-A100
Gemalto M2M Ordering number: L30960-N2301-A100
Molex Ordering numbers: 91228
91236
Sales contacts are listed in Table 14.
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
7.1 List of Parts and Accessories
34
Table 14: Molex sales contacts (subject to change)
Page 34 of 35
Molex For further information please click:
http://www.molex.com
Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730
Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com
Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174
Phone: +65-6-268-6868 Fax: +65-6-265-6044
American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352
Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan
Phone: +81-46-265-2325 Fax: +81-46-265-2365
ELS31-V_ELS51-V_HIO_v00.502 2015-12-07
Confidential / Preliminary
35
About Gemalto
Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual revenues of €2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees operate out of 99 offices, 34 personalization and data centers, and 24 research and software development centers located in 46 countries.
We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere
- in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-to­machine (M2M) applications.
Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offer trusted and convenient digital services to billions of individuals.
Gemalto thrives with the growing nu mb e r of pe o pl e using its solutions to interact with the digital and wireless world.
For more information please visit
m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter.
Gemalto M2M GmbH
St.-Martin-Str. 60 81541 Munich Germany
M2M.GEMALTO.COM
© Gemalto 2015. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. April 2013
Loading...