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This document1 describes the hardware of the Cinterion® ELS31-V and ELS51-V modules for
Verizon Network. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
The ELS31-V and ELS51-V modules include a baseband, a complete dual band RF frontend,
memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 10
set of specifications) and Verizon Wireless LTE UE specifications.
The module variants differentiate a follows:
- ELS31-V provides LTE connectivity with IP Services
- ELS51-V adds a Linux execution environment available for customer applications
Note: Throughout the document ELS31-V refers to ELS31-V Release 2.
1.1Key Features at a Glance
FeatureImplementation
General
Frequency bandsLTE dualband: B4, B13
Output power Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13
Power supply3.3V to 4.5V
Operating temperature
(board temperature)
PhysicalDimensions: 27.6mm x 18.8mm x 2.2mm
RoHSAll hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9DL 10Mbps, UL 5Mbps
SMSPoint-to-point MT and MO
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Weight: approx. 3g
LTE Cat. 1 data rates
Text and PDU mode
Storage in mobile equipment
Software
AT commandsHayes, 3GPP TS 27.007, TS 27.005, product specific
SIM Application ToolkitSAT Release 99
Firmware updateGeneric update from host application over ASC0 or USB modem
OTA over ASC0 and over USB
1. The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Gemalto M2M product.
Module interfaceSurface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application developmen t eq uip m en t.
USBUSB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
•8-wire modem interface with status and control lines, unbalanced, asynchronous
•Default baud rate: 115,200 baud
•Adjustable baud rates: 1,200 to 921,600, no autobauding support
•Supports RTS0/CTS0 hardware flow control.
•indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)
ELS51-V only:
ASC1 (shared with GPIO lines):
•4-wire, unbalanced asynchronous interface
•Default baud rate: 115,200 baud
•Adjustable baud rates: 1,200bps to 921,600bps
•Supports RTS1/CTS1 hardware flow control
UICC interfaceSupported SIM/USIM cards: 3V, 1.8V
Embedded UICCModule is prepared for an embedded UICC
GPIO interface20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3):
GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and
SPI signal lines
Programming is done via AT commands
2
I
C interfaceSupports I2C serial interface
SPI interfaceSupports SPI interface
SDIOELS51-V only:
4 wire interface.
HSICELS51-V only:
High Speed Interchip Communication interface.
ADC
Analog-to-Digital Converter with one unbalanced analog input.
Digitial audio interfaceHardware prepared for future use.
Antenna interface pads50 LTE main antenna, 50LTE diversity antenna
Switch-off by AT command
Switch off by hardware signal GPIO4/FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions
ResetOrderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Evaluation kit
Evaluation moduleELS31-V / ELS51-V module soldered onto a dedicated PCB that can be
connected to an adapter in order to be mounted onto the DSB75.
DSB75DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the ELS31-V / ELS51V evaluation module to the DSB75.
It is recommended to add EMI suppr essi on fi l t er ( see secti on 2 .1. 3. 1)
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90Ohm for proper signal integrity.
SMT
Page 6 of 35
2 Interface Characteristics
17
2Interface Characteristics
ELS31-V / ELS51-V is equipped with an SMT application interface that connects to the external
application. The SMT application interface incorporates the various application interfaces as
well as the RF antenna interfaces.
2.1Application Interface
2.1.1USB Interface
ELS31-V / ELS51-V supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full
Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and
data interface and for downloading firmware.
The V
line is used for cable detection only, this is to be supplied by the external device. The
USB
USB circuitry in the ELS31-V / ELS51-V is designed to meet the USB 2.0 specification for self-
1
power.2.0”
.
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver
distributed with ELS31-V / ELS51-V needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
ELS31-V / ELS51-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with
ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data
bit or inactive state).
ELS31-V / ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE
connections it communicates with the customer application (DTE) using the following signals:
•Port TXD @ application sends data to the module’s TXD0 signal line
•Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
•Includes the data lines TXD0 and RXD0, t he status line s RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
•Configured for 8 data bits, no parity and 1 stop bit.
•ASC0 can be operated at fixed bit rates from 1200bps up to 921600bps.
•Supports RTS0/CTS0 hardware flow control. Communication is possi ble by using only RXD
and TXD lines, if RTS0 is pulled low.
•Wake up from SLEEP mode by RTS0 activation (high to low transition).
ELS51-V provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to
ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T
V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit
or inactive state). With ELS31-V, ASC1 can only be used as data interface.
ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE connections
it communicates with the customer application (DTE) using the following signals:
•Port TXD @ application sends data to module’s TXD1 signal line
•Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
•Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.
•On ASC1 no RING line is available.
•Configured for 8 data bits, no parity and 1 or 2 stop bits.
•ASC1 can be operated at fixed bit rates from 1,200 bps to 921600 bps.
•Supports RTS1/CTS1 hardware flow control. Communication is possi ble by using only RXD
and TXD lines, if RTS1 is pulled low.
•Wake up from SLEEP mode by RTS0 activation (high to low transition).
ELS31-V_ELS51-V_HIO_v00.5022015-12-07
Confidential / Preliminary
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