Gemalto M2M ELS31 US User Manual

Cinterion® ELS31-US/ELS51-US
Hardware Interface Overview
Version: 01.000a DocId: ELS31-US_ELS51-US_HIO_v01.000a
M2M.GEMALTO.COM
Cinterion® ELS31-/ELS51-US Hardware Interface Overview
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Cinterion® ELS31-/ELS51-US Hardware Interface Overview
01.000a 2016-12-28 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary
GENERAL NOTE
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con­tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.
Copyright © 2016, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora­tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
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Contents

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Contents
1 Introduction.................................................................................................................7
1.1 Key Features at a Glance .................................................................................. 7
1.2 ELS31-US/ELS51-US System Overview ......................................................... 10
2 Interface Characteristics ..........................................................................................11
2.1 Application Interface ........................................................................................ 11
2.1.1 USB Interface...................................................................................... 11
2.1.2 Serial Interface ASC0 ......................................................................... 12
2.1.3 Serial Interface ASC1 ......................................................................... 13
2.1.4 UICC/SIM/USIM Interface................................................................... 14
2.1.5 GPIO Interface .................................................................................... 16
2.1.6 I
2.1.7 SPI Interface ....................................................................................... 17
2.1.8 Pulse Counter ..................................................................................... 17
2.1.9 HSIC Interface (ELS51-US Only)........................................................ 17
2.1.10 SDIO Interface (ELS51-US Only) ....................................................... 18
2.1.11 Control Signals.................................................................................... 19
2.2 RF Antenna Interface....................................................................................... 20
2.2.1 Antenna Installation ............................................................................ 21
2.2.2 RF Line Routing Design...................................................................... 22
2.3 Sample Application .......................................................................................... 28
2
C Interface ........................................................................................ 17
2.1.11.1 Status LED .......................................................................... 19
2.1.11.2 Fast Shutdown .................................................................... 19
2.2.2.1 RF Interface Signals Circuit Diagram Example................... 22
2.2.2.2 Line Arrangement Examples ............................................... 23
3 Operating Characteristics........................................................................................30
3.1 Operating Modes ............................................................................................. 30
3.2 Power Supply................................................................................................... 30
4 Mechanical Dimensions, Mounting and Packaging...............................................31
4.1 Mechanical Dimensions of ELS31-US/ELS51-US ........................................... 31
5 Regulatory and Type Approval Information...........................................................33
5.1 Directives and Standards................................................................................. 33
5.2 SAR requirements specific to portable mobiles ............................................... 35
5.3 Reference Equipment for Type Approval......................................................... 36
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 37
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6 Document Information..............................................................................................39
6.1 Revision History ............................................................................................... 39
6.2 Related Documents ......................................................................................... 39
6.3 Terms and Abbreviations ................................................................................. 39
6.4 Safety Precaution Notes .................................................................................. 43
7 Appendix....................................................................................................................44
7.1 List of Parts and Accessories........................................................................... 44
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Tab le s

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Tables
Table 1: Signals of the SIM interface (SMT application interface) ............................... 14
Table 2: GPIO lines and possible alternative assignment............................................ 16
Table 3: SDIO interface features.................................................................................. 18
Table 4: SDIO interface lines ....................................................................................... 18
Table 5: Return loss in the active band........................................................................ 20
Table 6: Overview of operating modes ........................................................................ 30
Table 7: Directives ....................................................................................................... 33
Table 8: Standards of North American type approval .................................................. 33
Table 9: Standards of GCF type approval.................................................................... 33
Table 10: Requirements of quality ................................................................................. 33
Table 11: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 34
Table 12: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 34
Table 13: Antenna gain limits for FCC and IC (TBD)..................................................... 37
Table 14: List of parts and accessories.......................................................................... 44
Table 15: Molex sales contacts (subject to change) ...................................................... 45
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Figures

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Figures
Figure 1: ELS31-US/ELS51-US system overview......................................................... 10
Figure 2: USB circuit ..................................................................................................... 11
Figure 3: Serial interface ASC0..................................................................................... 12
Figure 4: Serial interface ASC1..................................................................................... 13
Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 15
Figure 6: RF interface signals example......................................................................... 22
Figure 7: Embedded Stripline with 65µm prepreg (1080) and 710µm core .................. 23
Figure 8: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 24
Figure 9: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 25
Figure 10: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 26
Figure 11: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 27
Figure 12: Schematic diagram of ELS31-US/ELS51-US sample application.................. 29
Figure 13: ELS31-US/ELS51-US– top and bottom view................................................. 31
Figure 14: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) ....................... 32
Figure 15: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view. 32
Figure 16: Reference equipment for Type Approval ....................................................... 36
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1 Introduction

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1 Introduction
This document1 describes the hardware of the Cinterion® ELS31-US and ELS51-US modules. It helps you quickly retrieve interface specifications, electrical and mechanical details and in­formation on the requirements to be considered for integrating further components.
The ELS31-US and ELS51-US modules include a baseband, a complete dual band RF front­end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re­lease 10 set of specifications).
The module variants differentiate a follows:
- ELS31-US provides LTE connectivity with IP Services
- ELS51-US adds a Linux execution environment available for customer applications

1.1 Key Features at a Glance

Feature Implementation
General
Frequency bands LTE Triband: B2, B4, B12
Output power Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD B2
Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B12
Power supply 3.3V to 4.5V
Operating temperature (board temperature)
Physical Dimensions: 27.60mm x 18.80mm x 2.05mm
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 DL 10Mbps, UL 5Mbps
SMS Point-to-point MT and MO
Software
Normal operation: -30°C to +80°C Extended operation: -40°C to +90°C
Weight: approx. 3g
LTE Cat. 1 data rates
Text mode Storage in mobile equipment
AT commands Hayes, 3GPP TS 27.007, TS 27.005, product specific
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu­mentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
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Feature Implementation
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli­ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on module mounting and application layout issues as well as on SMT application development equipment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
8-wire modem interface with status and control lines, unbalanced, asyn­chronous
Default baud rate: 115,200 baud
Adjustable baud rates: 4,800 to 921,600, no autobauding support
Supports RTS0/CTS0 hardware flow control.
Indication of incoming data/SMS on RING0 (can be used to wake up host from power down modes)
ASC1 (shared with GPIO lines):
4-wire, unbalanced asynchronous interface
Default baud rate: 115,200 baud
Adjustable baud rates: 4,800bps to 921,600bps
Supports RTS1/CTS1 hardware flow control
UICC interface Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC Module is prepared for an embedded UICC
GPIO interface 20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3): GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and SPI signal lines Programming is done via AT commands
2
I
C interface Supports I2C serial interface
SPI interface Supports SPI interface
SDIO ELS51-US only:
4 wire interface.
HSIC ELS51-US only:
High Speed Interchip Communication interface.
ADC
Analog-to-Digital Converter with one unbalanced analog input.
Digitial audio interface Hardware prepared for future use.
Antenna interface pads 50 LTE main antenna, 50LTE diversity antenna
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Feature Implementation
Power on/off, Reset
Power on/off Switch-on by hardware signal ON
Switch-off by AT command Switch off by hardware signal GPIO4/FST_SHDN instead of AT command Automatic switch-off in case of critical temperature and voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Evaluation kit
Evaluation module ELS31-US/ELS51-US module soldered onto a dedicated PCB that can be
connected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS31-US/ELS51­US evaluation module to the DSB75.
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GPIO
interface
I2C
USB
ASC0
ASC0
CONTROL
POWER
ANTENNA
(LTE dual band)
Module
SIM interface
(with SIM detection)
SIM card
Application
Power supply
Emergency reset
ON
Serial modem interface
Serial modem interface
I2C
3
4
4
5
2
1
1
2
USB
Antenna / div. Antenna
2
GPIOs
7
Status
LED
1
FST_SHDN
Fast shutdown
1
1
ADC
ADC
1
COUNTER
Pulse counter
1
GP(I)Os
HSIC
SDIO
4
3
HSIC
SDIO
SPI
SPI
3
SPI
SPI
2
ASC1
Serial interface
4

1.2 ELS31-US/ELS51-US System Overview

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1.2 ELS31-US/ELS51-US System Overview
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Figure 1: ELS31-US/ELS51-US system overview
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VBUS
DP DN
VREG (3V075)
BATT+
USB_DP
2)
lin. reg.
GND
Module
Detection only
VUSB_IN
USB part
1)
RING0
Host wakeup
1)
It is recommended to add EMI suppression filter (see section 2.1.3.1)
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity.
SMT
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2 Interface Characteristics

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2 Interface Characteristics
ELS31-US/ELS51-US is equipped with an SMT application interface that connects to the ex­ternal application. The SMT application interface incorporates the various application interfac­es as well as the RF antenna interfaces.

2.1 Application Interface

2.1.1 USB Interface

ELS31-US/ELS51-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware.
The V
line is used for cable detection only, this is to be supplied by the external device. The
USB
USB circuitry in the ELS31-US/ELS51-US is designed to meet the USB 2.0 specification for
1
self-power.2.0”
.
To properly connect the module's USB interface to the external application, a USB 2.0 compat­ible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS31-US/ELS51-US needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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Figure 2: USB circuit
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2.1.2 Serial Interface ASC0

ELS31-US/ELS51-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
ELS31-US/ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to the module’s TXD0 signal line
Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0.
Configured for 8 data bits, no parity and 1 stop bit.
ASC0 can be operated at fixed bit rates from 4800bps up to 921600bps.
Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXD and TXD lines, if RTS0 is pulled low.
Wake up from SLEEP mode by RTS0 activation.
The ASC0 interface is dedicated to signaling via AT commands (3GPP standard 27.007 + mod­ule specific AT commands).
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2.1.3 Serial Interface ASC1

ELS31-US/ELS51-US provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 --> RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The configuration is non-volatile and becomes active after a module restart.
ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to module’s TXD1 signal line
Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand­shake.
On ASC1 no RING line is available.
Configured for 8 data bits, no parity and 1 or 2 stop bits.
ASC1 can be operated at fixed bit rates from 4800 bps to 921600 bps.
Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXD and TXD lines, if RTS1 is pulled low.
Wake up from SLEEP mode by RTS0 activation.
AT commands for signaling are not supported on ASC1 interface. ASC1 is intended only for data transfer in a Linux environment.
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2.1.4 UICC/SIM/USIM Interface

ELS31-US/ELS51-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP
31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an
external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. The CCIN signal must be connected to V180 for the detection to work on the module. Other­wise the SIM card can never be detected by the module.
Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper­ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test­ed to operate with ELS31-US/ELS51-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.
Table 1: Signals of the SIM interface (SMT application interface)
Signal Description
GND Separate ground connection for SIM card to improve EMC.
CCCLK Chipcard clock
CCVCC SIM supply voltage.
CCIO Serial data line, input and output.
CCRST Chipcard reset
CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruc­tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS31-US/ELS51-US.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ­ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS31-US/ELS51-US.
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