Gemalto M2M EHS8 User Manual

Cinterion ® EHS8
Hardware Interface Overview
M2M.GEMALTO.COM
Cinterion
2
EHS8 Hardware Interface Overview
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Cinterion ® EHS8 Hardware Interface Overview
02.770
2014-08-11
EHS8_HIO_v02.770
Confidential / Preliminary
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHA LL NOT TRANSFER , COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISC LAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.
Copyright © 2014, Gemalto M2M GmbH, a Gemalto Company
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Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
Contents
42
Contents
1 Introduction ........................................................................................................................... 8
1.1 Key Features at a Glance .......................................................................................... 8
1.2 EHS8 System Overview .......................................................................................... 13
2 Interface Characteristics .................................................................................................... 14
2.1 Application Interface ................................................................................................ 14
2.1.1 USB Interface ............................................................................................ 14
2.1.2 Serial Interface ASC0 ................................................................................ 15
2.1.3 Serial Interface ASC1 ................................................................................ 15
2.1.4 UICC/SIM/USIM Interface ......................................................................... 16
2.1.5 Digital Audio Interface ............................................................................... 18
2.1.6 GPIO Interface .......................................................................................... 18
2.1.7 I
2.1.8 SPI Interface ............................................................................................. 19
2.1.9 HSIC Interface .......................................................................................... 19
2.1.10 PWM Interfaces ...................................................................................... 20
2.1.11 Pulse Counter ......................................................................................... 20
2.1.12 Status LED .............................................................................................. 20
2.1.13 Fast Shutdown ........................................................................................ 20
2.2 RF Antenna Interface ............................................................................................... 21
2
C Interface .............................................................................................. 19
2.2.1 Antenna Installation ................................................................................... 22
2.3 GPS Interface .......................................................................................................... 23
2.3.1 GPS Receiver ........................................................................................... 23
2.3.2 GPS Antenna ............................................................................................ 23
2.4 Sample Application .................................................................................................. 23
3 Operating Characteristics .................................................................................................. 26
3.1 Operating Modes ..................................................................................................... 26
3.2 Power Supply .......................................................................................................... 26
4 Mechanical Dimensions, Mounting and Packaging ......................................................... 28
4.1 Mechanical Dimensions of EHS8 ............................................................................ 28
5 Regulatory and Type Approval Information ...................................................................... 30
5.1 Directives and Standards ........................................................................................ 30
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5.2 SAR requirements specific to portable mobiles ....................................................... 33
5.3 Reference Equipment for Type Approval ................................................................. 33
5.4 Compliance with FCC and IC Rules and Regulations ............................................. 35
6 Document Information ........................................................................................................ 36
6.1 Revision History ....................................................................................................... 36
6.2 Related Documents ................................................................................................. 36
6.3 Terms and Abbreviations ......................................................................................... 36
6.4 Safety Precaution Notes .......................................................................................... 40
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Contents
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7 Appendix....................................................................................................................
40
7.1 List of Parts and Accessories........................................................................... 40
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Tables
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Tables
Table 1: Signals of the SIM interface (SMT application interface)............................... 15
Table 2: GPIO lines and possible alternative assignment............................................ 17
Table 3: Return loss in the active band........................................................................ 20
Table 4: Overview of operating modes ........................................................................ 25
Table 5: Directives ....................................................................................................... 29
Table 6: Standards of North American type approval.................................................. 29
Table 7: Standards of European type approval............................................................ 29
Table 8: Requirements of quality ................................................................................. 30
Table 9: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 30
Table 10: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 31
Table 11: List of parts and accessories.......................................................................... 40
Table 12: Molex sales contacts (subject to change)...................................................... 41
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Figures
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Figures
Figure 1: EHS8 system overview.................................................................................. 11
Figure 2: USB circuit ..................................................................................................... 12
Figure 3: Serial interface ASC0..................................................................................... 13
Figure 4: Serial interface ASC1..................................................................................... 14
Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 16
Figure 6: Schematic diagram of EHS8 sample application........................................... 24
Figure 7: EHS8– top and bottom view........................................................................... 27
Figure 8: Dimensions of EHS8 (all dimensions in mm)................................................. 28
Figure 9: Reference equipment for Type Approval ....................................................... 33
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1 Introduction
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1 Introduction
This document1 describes the hardware of the Cinterion® EHS8 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1 Key Features at a Glance
Feature Implementation
General
Frequency bands GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz
GSM class Small MS
Output power +33dBm ±1dB for EGSM850
Power supply 3.3V to 4.5V
UMTS/HSPA+: Five band 800/850/900/1900/2100MHz
+30dBm ±1dB for GSM1900 +27dBm ±1dB for EGPRS 850(8-PSK, 1 Tx slot) +24dBm ±1dB for EGPRS 850(8-PSK, 2 Tx slot) +22dBm ±1dB for
+21dBm ±1dB for EGPRS 850(8-PSK, 4 Tx slot) +26dBm ±1dB for GPRS 1900(8-PSK, 1 Tx slot) +23dBm ±1dB for EGPRS 1900(8-PSK, 2 Tx slot) +21dBm ±1dB for +20dBm ±1dB for +33dBm ±1dB for +30dBm ±1dB for +28dBm ±1dB for GPRS 850(GMSK, 3 Tx slot) +27dBm ±1dB for +30dBm ±1dB for GPRS 1900(GMSK, 1 Tx slot) +27dBm ±1dB for GPRS 1900(GMSK, 2 Tx slot) +25dBm ±1dB for GPRS19050(GMSK, 3 Tx slot) +24dBm ±1dB for GPRS 1900(GMSK, 4Tx slot) +24dBm ±1dB for UMTS Band 2
+24dBm ±1dB for UMTS Band 5
EGPRS 850(8-PSK, 3 Tx slot)
EGPRS 1900(8-PSK, 3 Tx slot) EGPRS 1900(8-PSK, 4 Tx slot)
GPRS 850(GMSK, 1 Tx slot)
GPRS 850(GMSK,2 Tx slot)
GPRS 850(GMSK, 4 Tx slot)
Operating temperature (board temperature)
Physical Dimensions: 27.6mm x 25.4mm x 2.2mm
Normal operation: -30°C to +85°C Extended operation: -40°C to +90°C
Weight: approx. 3.5g
1
. The document is effective only if listed in the appropriate Release Notes as part of th e technical
documentation delivered with your Gemalto M2M product.
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RoHS All hardware components fully compliant with EU RoHS Directive
HSPA features
3GPP Release 6, 7 DL 7.2Mbps, UL 5.7Mbps
UMTS features
3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL
HSDPA Cat.8 / HSUPA Cat.6 data rates Compressed mode (CM) supported according to 3GPP TS25.212
CS data rate – 64 kbps DL / 64 kbps UL
Feature Implementation
GSM/GPRS/EGPRS features
Data transfer GPRS:
Multislot Class 12
Full PBCCH support
Mobile Station Class B • Coding Scheme 1 – 4 EGPRS:
Multislot Class 12
EDGE E2 power class for 8 PSK
Downlink coding schemes – CS 1-4, MCS 1-9
Uplink coding schemes – CS 1-4, MCS 1-9
SRB loopback and test mode B
8-bit, 11-bit RACH
PBCCH support
1 phase/2 phase access procedures
Link adaptation and IR
NACC, extended UL TBF
Mobile Station Class B CSD:
V.110, RLP, non-transparent
9.6kbps
USSD
SMS Point-to-point MT and MO
Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment
GPS Features
Protocol NMEA
Modes Standalone GPS
Assisted GPS
- Control plane - E911
- User plane
General Automatic power saving modes
Power supply for active antenna
Software
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AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M
Java™ Open Platform Java™ Open Platform with
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AT commands for RIL compatibility
Java™ profile IMP-NG & CLDC 1.1 HI
Secure data transmission via HTTPS/SSL
Multi-threading programming and multi-application execution
Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely cost­efficient hardware and software design – ideal platform for industrial GSM applications.
The memory space available for Java programs is around 8 MB in the flash file system and around 6MB RAM. Application code and data share the space in the flash file system and in RAM.
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1.1 Key Features at a Glance
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Feature Implementation
Microsoft™ compatibility RIL for Pocket PC and Smartphone
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem.
Interfaces
Module interface
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
2 serial interfaces ASC0 (shared with GPIO lines):
Audio 1 digital interface (PCM), shared with GPIO lines
Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equipment.
compliant
8-wire modem interface with status and control lines, unbalanced,
Adjustable baud rates: 1,200bps to 921,600bps
Autobauding: 1,200bps to 230,400bps
Supports RTS0/CTS0 hardware flow control.
Multiplex ability according to GSM 07.10 Multiplexer Protocol. ASC1
4-wire, unbalanced asynchronous interface
Adjustable baud rates: 1,200bps to 921,60bps
Autobauding: 1,200bps to 230,400bps
Supports RTS1/CTS1 hardware flow control
asynchronous
(shared with GPIO lines):
UICC interface Supported SIM/USIM cards: 3V, 1.8V
GPIO interface
I2C interface Supports I2C serial interface
HSIC interface High-Speed Inter-Chip (HSIC) interface for USB chip-to-chip interconnect
SPI interface Serial peripheral interface, shared with GPIO lines
Antenna interface pads
Power on/off, Reset
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including Link Power Management (LPM) lines shared with GPIO lines
50 
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1.1 Key Features at a Glance
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Power on/off Switch-on by hardware signal AUTO_ON and ON
Switch-off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch-off in case of critical temperature and voltage conditions
Feature Implementation
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Special features
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Evaluation kit
Evaluation module EHS8 module soldered onto a dedicated PCB that can be connected to an
DSB75 DSB75 Development Support Board designed to test and type approve
adapter in order to be mounted onto the DSB75.
Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the EHS8 evaluation module to the DSB75.
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1.2 EHS8 System Overview
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1.2 EHS8 System Overview
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