Gemalto M2M EHS6 User Manual
Cinterion® EHS6
Hardware Interface Overview
Version: 04.000
DocId: EHS6_HIO_v04.000
M2M.GEMALTO.COM
Cinterion® EHS6 Hardware Interface Overview
2
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Document Name:
Version:
Date:
DocId:
Status
Cinterion
®
EHS6 Hardware Interface Overview
04.000
2019-03-05
EHS6_HIO_v04.000
Confidential / Preliminary
GENERAL NOTE
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THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
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Copyright
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Contents
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Contents
1 Introduction ................................................................................................................. 6
1.1 Key Features at a Glance .................................................................................. 6
1.2 EHS6 System Overview..................................................................................... 9
2 Interface Characteristics .......................................................................................... 10
2.1 Application Interface ........................................................................................ 10
2.1.1 USB Interface...................................................................................... 10
2.1.2 Serial Interface ASC0 ......................................................................... 11
2.1.3 Serial Interface ASC1 ......................................................................... 12
2.1.4 UICC/SIM/USIM Interface................................................................... 13
2.1.5 Digital Audio Interface......................................................................... 14
2.1.6 GPIO Interface .................................................................................... 14
2.1.7 I
2.1.8 SPI Interface ....................................................................................... 16
2.1.9 HSIC Interface .................................................................................... 16
2.1.10 PWM Interfaces .................................................................................. 17
2.1.11 Pulse Counter ..................................................................................... 17
2.1.12 Status LED.......................................................................................... 17
2.1.13 Fast Shutdown .................................................................................... 17
2.2 RF Antenna Interface....................................................................................... 18
2.2.1 Antenna Installation ............................................................................ 19
2.3 Sample Application .......................................................................................... 20
2
C Interface ........................................................................................ 16
3 Operating Characteristics ........................................................................................ 22
3.1 Operating Modes ............................................................................................. 22
3.2 Power Supply................................................................................................... 23
4 Mechanical Dimensions, Mounting and Packaging............................................... 24
4.1 Mechanical Dimensions of EHS6..................................................................... 24
5 Regulatory and Type Approval Information ........................................................... 26
5.1 Directives and Standards................................................................................. 26
5.2 SAR requirements specific to portable mobiles ............................................... 29
5.3 Reference Equipment for Type Approval......................................................... 30
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 31
6 Document Information.............................................................................................. 32
6.1 Revision History ............................................................................................... 32
6.2 Related Documents ......................................................................................... 32
6.3 Terms and Abbreviations ................................................................................. 32
6.4 Safety Precaution Notes .................................................................................. 36
7 Appendix.................................................................................................................... 37
7.1 List of Parts and Accessories........................................................................... 37
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Tab le s
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Tables
Table 1: Signals of the SIM interface (SMT application interface) ............................... 13
Table 2: GPIO lines and possible alternative assignment............................................ 15
Table 3: Return loss in the active band........................................................................ 18
Table 4: Overview of operating modes ........................................................................ 22
Table 5: Directives ....................................................................................................... 26
Table 6: Standards of North American type approval .................................................. 26
Table 7: Standards of European type approval............................................................ 26
Table 8: Requirements of quality ................................................................................. 27
Table 9: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 27
Table 10: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 28
Table 11: List of parts and accessories.......................................................................... 37
Table 12: Molex sales contacts (subject to change) ...................................................... 38
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Figures
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Figures
Figure 1: EHS6 system overview .................................................................................... 9
Figure 2: USB circuit ..................................................................................................... 10
Figure 3: Serial interface ASC0..................................................................................... 11
Figure 4: Serial interface ASC1..................................................................................... 12
Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 14
Figure 6: Schematic diagram of EHS6 sample application ........................................... 21
Figure 7: EHS6– top and bottom view........................................................................... 24
Figure 8: Dimensions of EHS6 (all dimensions in mm)................................................. 25
Figure 9: Reference equipment for Type Approval ....................................................... 30
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1 Introduction
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1 Introduction
This document1 describes the hardware of the Cinterion® EHS6 module. It helps you quickly
retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1 Key Features at a Glance
Feature Implementation
General
Frequency bands GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz
UMTS/HSPA+: Five band 800/850/900/1900/2100MHz
GSM class Small MS
Output power Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVI
Power supply 3.3V to 4.5V
Operating temperature
(board temperature)
Physical Dimensions: 27.6mm x 25.4mm x 2.2mm
RoHS All hardware components fully compliant with EU RoHS Directive
HSPA features
3GPP Release 6, 7 DL 7.2Mbps, UL 5.7Mbps
Normal operation: -30°C to +85°C
Extended operation: -40°C to +90°C
Weight: approx. 3.5g
HSDPA Cat.8 / HSUPA Cat.6 data rates
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL
CS data rate – 64 kbps DL / 64 kbps UL
1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
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Feature Implementation
GSM/GPRS/EGPRS features
Data transfer GPRS:
• Multislot Class 12
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• PBCCH support
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
CSD:
• V.110, RLP, non-transparent
•9.6kbps
•USSD
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SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus SMS locations in mobile equipment
Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M
AT commands for RIL compatibility
Java™ Open Platform Java™ Open Platform with
• Java™ profile IMP-NG & CLDC 1.1 HI
• Secure data transmission via HTTPS/SSL
• Multi-threading programming and multi-application execution
Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely cost-efficient
hardware and software design – ideal platform for industrial GSM applications.
The memory space available for Java programs is around 13MB in the flash
file system and around 10MB RAM. Application code and data share the
space in the flash file system and in RAM.
Microsoft™ compatibility RIL for Pocket PC and Smartphone
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem.
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1.1 Key Features at a Glance
9
Feature Implementation
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equipment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0 (shared with GPIO lines):
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Adjustable baud rates: 300bps to 921,600bps
• Autobauding: 300bps to 230,400bps
• Supports RTS0/CTS0 hardware flow control.
ASC1 (shared with GPIO lines):
• 4-wire, unbalanced asynchronous interface
• Adjustable baud rates: 300bps to 921,60bps
• Autobauding: 300bps to 230,400bps
• Supports RTS1/CTS1 hardware flow control
Audio 1 digital interface (PCM), shared with GPIO lines
UICC interface Supported SIM/USIM cards: 3V, 1.8V
GPIO interface 14 GPIO lines shared with ASC0 lines, LED signalling, PWM functionality,
fast shutdown and pulse counter
4 GPIO lines shared with PCM interface
4 GPIO lines shared with ASC1, SPI and HSIC interfaces
2
I
C interface Supports I2C serial interface
HSIC interface High-Speed Inter-Chip (HSIC) interface for USB chip-to-chip interconnect
including Link Power Management (LPM) lines shared with GPIO lines
SPI interface Serial peripheral interface, shared with GPIO lines
Antenna interface pads 50
Power on/off, Reset
Power on/off Switch-on by hardware signal AUTO_ON and ON
Switch-off by AT command
Switch off by hardware signal FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Special features
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
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GPIO
interface
I2C
USB
ASC0 lines
HSIC LPM/
ASC1/SPI
CONTROL
RTC
POWER
ANTENNA
(GSM/UMTS
quad band)
Module
SIM interface
(with SIM detection)
SIM card
Application
Power supply
Backup supply
Emergency reset
AUTO_ON, ON
HSIC LPM/
Serial interface/
SPI interface
Serial modem
interface lines
I2C
GPIO
3
4
4
5
2
5
2
1
1
2
USB
Antenna
1
PCM
Digital audio
(PCM)
4
Status LED
1
DAC (PWM) PWM
2
Fast
shutdown
Fast shutdown
1
1
ADC
ADC
1
HSIC
2
HSIC
COUNTER
Pulse counter
1
ASC0 lines
Serial modem
interface lines/
SPI interface
4
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1.2 EHS6 System Overview
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Feature Implementation
Evaluation kit
Evaluation module EHS6 module soldered onto a dedicated PCB that can be connected to an
adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the EHS6 evaluation
module to the DSB75.
1.2 EHS6 System Overview
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VBUS
DP
DN
VREG (3V075)
BATT+
USB_DP
2)
lin. reg.
GND
Module
Detection only
VUSB_IN
USB part
1)
RING0
Host wakeup
1)
All serial (including RS) and pull-up resistors for data lines are implemented.
USB_DN
2)
2)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90 ohms for proper signal integrity.
R
S
R
S
SMT
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2 Interface Characteristics
21
2 Interface Characteristics
EHS6 is equipped with an SMT application interface that connects to the external application.
The SMT application interface incorporates the various application interfaces as well as the RF
antenna interface.
2.1 Application Interface
2.1.1 USB Interface
EHS6 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s)
compliant. The USB interface is primarily intended for use as command and data interface and
for downloading firmware.
The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This
is because EHS6 is designed as a self-powered device compliant with the “Universal Serial Bus
Specification Revision 2.0”
1
.
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver
distributed with EHS6 needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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2.1 Application Interface
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2.1.2 Serial Interface ASC0
EHS6 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
EHS6 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 300bps up to 921,600bps.
• Autobauding supports bit rates from 300bps up to 230,400bps.
• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an
internal pull down resistor causing a low level signal, if the line is not used and open.
Although hardware flow control is recommended, this allows communication by using only
RXD and TXD lines.
• Wake up from SLEEP mode by RTS0 activation (high to low transition).
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2.1.3 Serial Interface ASC1
Four EHS6 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V
(for low data bit or active state) and 1.8V (for high data bit or inactive state).
EHS6 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.
• On ASC1 no RING line is available.
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at fixed bit rates from 300 bps to 921,600 bps.
• Autobauding supports bit rates from 300bps up to 230,400bps.
• Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal
pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD
lines.
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