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CINTERION® BGS12
Hardware Interface Description
Version: 00.915
DocId: BGS12_HID_V00.915
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CINTERION® BGS12 Hardware Interface Description
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GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION
(THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER
WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL
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THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
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SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED
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DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR
AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE
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Copyright
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or registration of a utility model or design patent are reserved.
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in certain countries. Microsoft and Windows are either registered trademarks or trademarks
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Contents
Hardware Interface Description ............................................................................................. 1
Introduction ................................................................................................................. 9
1
1.1 Related Documents ............................................................................................ 9
1.2 Terms and Abbreviations..................................................................................... 9
1.3 Regulatory and Type Approval Information ......................................................... 12
1.3.1 Directives and Standards ..................................................................................... 12
1.3.2 SAR requirements specific to portable mobiles .................................................... 15
1.3.3 Safety Precautions .............................................................................................. 16
Product Concept .......................................................................................................... 18
2
2.1 Key Features at a Glance ................................................................................... 18
2.2 BGS12 System Overview .................................................................................... 21
2.3 Circuit Concept ................................................................................................... 22
Application Interface .................................................................................................... 23
3
3.1 Operating Modes ................................................................................................ 24
3.2 Power Supply ..................................................................................................... 25
3.2.1 Minimizing Power Losses .................................................................................... 25
3.2.2 Measuring the Supply Voltage (V
BATT+
3.2.3 Monitoring Power Supply by AT Command .......................................................... 26
3.3 Power Up/Power down Scenarios ....................................................................... 26
3.3.1 Turn on BGS12 ................................................................................................... 26
3.3.1.1
3.3.1.2
Switch on BGS12 Using ON Signal ........................................................ 26
Suppressing Unintentional Pulses on ON Signal Line ............................. 28
3.3.2 Restart BGS12 ................................................................................................... 29
Restart BGS12 via AT+CFUN Command ................................................ 29
3.3.2.1
Turn off or restart BGS12 Using EMERG_RST ...................................... 29
3.3.2.2
3.3.3 Signal States after Startup ................................................................................... 30
3.3.4 Turn off BGS12 ................................................................................................... 32
3.3.4.1
Switch off BGS12 Using AT Command ................................................... 32
3.3.5 Automatic Shutdown ........................................................................................... 33
Thermal Shutdown ................................................................................. 33
3.3.5.1
3.3.5.2
Undervoltage Shutdown ......................................................................... 34
Overvoltage Shutdown ........................................................................... 34
3.3.5.3
3.4 Power Saving ..................................................................................................... 35
3.4.1 No Power Saving (AT+CFUN=1) ......................................................................... 35
3.4.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0) ......................................................... 35
3.4.3 CYCLIC SLEEP Mode AT+CFUN=7 .................................................................... 35
3.4.4 CYCLIC SLEEP Mode AT+CFUN=9 .................................................................... 36
3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes............................................ 37
3.4.6 Power Saving in OFF-state ................................................................................. 38
3.4.7 Wake up BGS12 from SLEEP Mode ................................................................... 39
3.4.7.1 Wake-up via RTS0 and RTS2 (if AT+CFUN=0 or AT+CFUN=9) ............. 39
3.5 Summary of State Transitions (except SLEEP Mode) ......................................... 40
3.6 RTC Backup ....................................................................................................... 40
) ............................................................. 26
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3.7 SIM/USIM Interface ............................................................................................ 40
3.7.1 Single SIM/USIM Card Application ..................................................................... 40
3.7.2 Dual SIM/USIM Card Application ........................................................................ 42
3.8 Serial Interface ASC0 ......................................................................................... 42
3.9 Serial Interface ASC1 ......................................................................................... 46
3.10 Serial Interface ASC2 ......................................................................................... 47
3.11 Analog Audio Interface ........................................................................................ 49
3.11.1 Microphone Inputs and Supply ................................................................ 49
3.11.2 Loudspeaker Output ............................................................................... 50
3.12 I2S Interface ........................................................................................................ 52
3.13 GPIO Interface .................................................................................................... 52
3.14 I2C Interface ....................................................................................................... 54
3.14.1 I2C Interface on DSB75 ......................................................................... 55
3.15 Jamming Indicator .............................................................................................. 58
3.16 Status LED ......................................................................................................... 58
3.17 Behavior of the RING0 Line (ASC0 Interface only) .............................................. 58
3.18 Power Indication Circuit ...................................................................................... 59
3.19 Fast Shutdown .................................................................................................... 61
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4 Antenna Interface ........................................................................................................ 62
4.1 Antenna Installation ............................................................................................ 62
4.2 RF Line Routing Design ...................................................................................... 63
4.2.1 Line Arrangement Examples ............................................................................... 63
Embedded Stripline ................................................................................ 63
4.2.1.1
Micro-Stripline ........................................................................................ 64
4.2.1.2
4.2.2 Routing Example ................................................................................................ 68
Interface to RF Connector ...................................................................... 68
4.2.2.1
5 Electrical Reliability and Radio Characteristics ........................................................ 69
5.1 Absolute Maximum Ratings ................................................................................ 69
5.2 Operating Temperatures ..................................................................................... 69
5.3 Reliability Characteristics .................................................................................... 70
5.4 Pad Assignment and Signal Description .............................................................. 71
5.5 Power Supply Ratings ......................................................................................... 79
5.6 Electrical Characteristics of the Voiceband Part................................................... 81
5.6.1 Setting Audio Parameters by AT Commands ....................................................... 81
5.6.2 Audio Programming Model .................................................................................. 82
5.6.3 Characteristics of Audio Modes ........................................................................... 83
5.6.4 Voiceband Receive Path .................................................................................... 84
5.6.5 Voiceband Transmit Path.................................................................................... 85
5.7 Antenna Interface Specification .......................................................................... 86
5.8 Electrostatic Discharge ....................................................................................... 87
6 Mechanics, Mounting and Packaging ........................................................................ 88
6.1 Mechanical Dimensions of BGS12 ...................................................................... 88
6.2 Mounting BGS12 onto the Application Platform ................................................... 90
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6.2.1 SMT PCB Assembly............................................................................................ 90
Land Pattern and Stencil ........................................................................ 90
6.2.1.1
6.2.1.2
Board Level Characterization ................................................................. 92
6.2.2 Moisture Sensitivity Level .................................................................................... 92
6.2.3 Soldering Conditions and Temperature ................................................................ 93
6.2.3.1
Reflow Profile ......................................................................................... 93
Maximum Temperature and Duration ..................................................... 94
6.2.3.2
6.2.4 Durability and Mechanical Handling ..................................................................... 94
Storage Conditions ................................................................................. 94
6.2.4.1
Processing Life ....................................................................................... 95
6.2.4.2
6.2.4.3
Baking .................................................................................................... 95
6.2.4.4
Electrostatic Discharge ........................................................................... 95
6.3 Packaging ........................................................................................................... 95
6.3.1 Tape and Reel ..................................................................................................... 95
6.3.1.1 Orientation ............................................................................................. 96
6.3.2 Shipping Materials............................................................................................... 97
6.3.2.1
Moisture Barrier Bag .............................................................................. 97
Transportation Box ................................................................................. 99
6.3.2.2
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7 Sample Application ..................................................................................................... 100
7.1 Blocking against RF on Interface Lines .................................................................... 102
8 Reference Approval ..................................................................................................... 104
8.1 Reference Equipment for Type Approval ................................................................. 104
9 Appendix ...................................................................................................................... 105
9.1 List of Parts and Accessories ................................................................................... 105
9.2 FCC statement ........................................................................................................ 107
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Tables
Table 1: Directives ............................................................................................................. 12
Table 2: Standards of European type approval .................................................................. 13
Table 3: Requirements of quality........................................................................................ 13
Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China14
Table 5: Toxic or hazardous substances or elements with defined concentration limits ..... 14
Table 6: Overview of operating modes ............................................................................... 24
Table 7: Signal states ........................................................................................................ 31
Table 8: Temperature dependent behavior ........................................................................ 34
Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes ............................ 39
Table 10: State transitions of BGS12 (except SLEEP mode) ............................................. 40
Table 11: Signals of the SIM interface (SMT application interface) .................................... 41
Table 12: DCE-DTE wiring of ASC0 ................................................................................... 44
Table 13: DCE-DTE wiring of ASC1 ................................................................................... 46
Table 14: DCE-DTE wiring of ASC2 ................................................................................... 48
Table 15: GPIO assignment .............................................................................................. 52
Table 16: Return loss in the active band ............................................................................ 62
Table 17: Absolute maximum ratings ................................................................................. 69
Table 18: Board temperature ............................................................................................. 69
Table 19: Summary of reliability test conditions ................................................................. 70
Table 20: Pad assignments ................................................................................................ 72
Table 21: Electrical description of application interface ...................................................... 73
Table 22: Electrical description of application interface ...................................................... 75
Table 23: Electrical description of application interface ...................................................... 76
Table 24: Electrical description of application interface ...................................................... 76
Table 25: Electrical description of application interface ...................................................... 77
Table 26: Electrical description of application interface ...................................................... 78
Table 27: Power supply ratings1 ......................................................................................... 79
Table 28:Power supply ratings1 .......................................................................................... 80
Table 29: Audio parameters adjustable by AT command ................................................... 81
Table 30: Voiceband characteristics (typical) ..................................................................... 83
Table 31: Voiceband receive path ...................................................................................... 84
Table 32: Voiceband transmit path ..................................................................................... 85
Table 33: Antenna interface specifications ......................................................................... 86
Table 34: Measured electrostatic values ............................................................................ 87
Table 35: Reflow temperature ratings ................................................................................ 93
Table 36: Storage conditions ............................................................................................. 94
Table 37: EMI measures on the application interface ....................................................... 103
Table 38: List of parts and accessories ............................................................................ 105
Table 39: Molex sales contacts (subject to change) ......................................................... 106
Table 40: Manufacturer address DBG Holdings Limited ................................................... 106
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Figures
Figure 1: BGS12 system overview ..................................................................................... 21
Figure 2: BGS12 block diagram ......................................................................................... 22
Figure 3: Power supply limits during transmit burst ............................................................ 25
Figure 4: Position of reference points BATT+ and GND ..................................................... 26
Figure 5: ON circuit sample ................................................................................................ 27
Figure 6: ON timing ............................................................................................................ 28
Figure 7: Sample circuit to suppress spikes or glitches on ON signal line .......................... 29
Figure 8: Emergency shutdown/restart timing .................................................................... 30
Figure 9: Switch off behavior .............................................................................................. 33
Figure 10: Timing of CTS signal (example for a 2.12 s paging cycle) ................................. 37
Figure 11: Beginning of power saving if CFUN=7 ............................................................... 38
Figure 12: Power Saving in OFF-state ............................................................................... 38
Figure 13: External SIM card holder circuit......................................................................... 41
Figure 14: VDIG power supply domain ............................................................................... 43
Figure 15: Serial interface ASC0 ........................................................................................ 43
Figure 16: ASC0 startup behavior ...................................................................................... 45
Figure 17: Serial interface ASC1 ........................................................................................ 46
Figure 18: ASC1 startup behavior ...................................................................................... 47
Figure 19: Serial interface ASC2 ........................................................................................ 47
Figure 20: ASC1 startup behavior ...................................................................................... 48
Figure 21: Single ended microphone connection ............................................................... 49
Figure 22: Differential Microphone connection ................................................................... 50
Figure 23: Line Input .......................................................................................................... 50
Figure 24: Differential loudspeaker connection .................................................................. 51
Figure 25: Line output connection ...................................................................................... 51
Figure 26: GPIO startup behavior ...................................................................................... 53
Figure 27: I2C interface connected to VCC of application .................................................. 54
Figure 28: I2C interface connected to VDIG ....................................................................... 54
Figure 29: I2C startup behavior .......................................................................................... 55
Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75 ...................... 56
Figure 31: Jumper settings to enable usage of I2C interface on DSB75 ............................. 57
Figure 32: Status signalling with LED driver ....................................................................... 58
Figure 33: Incoming voice call ............................................................................................ 59
Figure 34: incoming data receive ....................................................................................... 59
Figure 35: URC transmission ............................................................................................. 59
Figure 36: Power indication circuit ..................................................................................... 60
Figure 37: Fast Shutdown timing ........................................................................................ 61
Figure 38: Antenna pads (bottom view) .............................................................................. 62
Figure 39: Embedded Stripline with 65µm prepreg (1080) and 710µm core ....................... 63
Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ..................... 64
Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 ................................ 65
Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 ................................ 66
Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 ................................ 67
Figure 44: Pouting to application‘s RF connector - top view ............................................... 68
Figure 45: Numbering plan for connecting pads (bottom view) ........................................... 71
Figure 46: Audio programming model ................................................................................ 82
Figure 47: BGS12 – top and bottom view ........................................................................... 88
Figure 48: Dimensions of BGS12 (all dimensions in mm) (to be replaced) ......................... 89
Figure 49: Land pattern (top view) (to be replaced) ............................................................ 90
Figure 50: Recommended design for 110 micron thick stencil (top view) ........................... 91
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Figure 51: Recommended design for 150 micron thick stencil (top view) (to be replaced).. 91
Figure 52: Reflow Profile .................................................................................................... 93
Figure 53: Carrier tape ....................................................................................................... 96
Figure 54: Reel direction .................................................................................................... 96
Figure 55: Barcode label on tape reel ................................................................................ 97
Figure 56: Moisture barrier bag (MBB) ............................................................................... 97
Figure 57: Moisture Sensitivity Label.................................................................................. 98
Figure 58: Humidity Indicator Card – HIC ........................................................................... 99
Figure 59: Schematic diagram of BGS12 sample application(to be repaced) ................... 101
Figure 60: EMI circuits ..................................................................................................... 102
Figure 61: Reference equipment for Type Approval ......................................................... 104
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Contents
1
Introduction
This document describes the hardware of the Cinterion® BGS12 module that connects to the
cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered
for integrating further components.
1.1 Related Documents
[1] Cinterion® BGS12 AT Command Set2
[2] Cinterion® BGS12 Release Note
[3] Application Note 48: SMT Module integration for BGS12
[4] Jamming Detection
[5] Upgrading BGS12 Firmware
[6] BGS12 migration guide
[7] BGS12 Dual SIM/USIM Card Application Note
1.2 Terms and Abbreviations
Abbreviation
ADC Analog-to-digital converter
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0/ASC1/
ASC2
B Thermistor Constant
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
Description
Asynchronous Controller. Abbreviations used for first and second and third
serial interface of BGS12
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
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Abbreviation Description
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. a Gemalto M2M
module)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE
DTR Data Terminal Ready
DTX Discontinuous Transmission
Data Terminal Equipment (typically computer, terminal, printer or, for
example, GSM application)
EFR Enhanced Full Rate
EGSM Enhanced GSM
EIRP Equivalent Isotropic Radiated Power
EMC Electromagnetic Compatibility
ERP Effective Radiated Power
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPIO General Purpose Input/Output
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion/Li+ Lithium-Ion
Li battery Rechargeable Lithium Ion or Lithium Polymer battery
Mbps Mbits per second
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Abbreviation Description
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM module), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
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PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSK Phase Shift Keying
PSU Power Supply Unit
PWM Pulse Width Modulation
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
RoHS
Restriction of the use of certain hazardous substances in electrical and
electronic equipment.
ROM Read-only Memory
RTC Real Time Clock
RTS Request to Send
Rx Receive Direction
SAR Specific Absorption Rate
SAW Surface Acoustic Wave
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMD Surface Mount Device
SMS Short Message Service
SMT Surface Mount Technology
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Abbreviation Description
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM module)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
1.3 Regulatory and Type Approval Information
1.3.1 Directives and Standards
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BGS12 is designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical
specifications provided in the "BGS12 Hardware Interface Description"
Table 1: Directives
RED（2014/53/EU）
Directive 2014/53/EU of the European Parliament and of the
Council of 16 April 2014 on the harmonisation of the laws of the
Member States relating to the making available on the market of
radio equipment and repealing Directive 1999/5/EC Text with EEA
relevance. Applicable as of 13 June 2016.
OJ L 153, 22.5.2014
The product is labeled with the CE conformity mark.
2002/05/EC
Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
FCC ID： QIPBGS12
US Federal Communications Commission
set up according to Communications Act in 1934.
The FCC control the radio, TV, telecom, satellite and cable to
coordinate domestic and international communication.
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NOTE: Hereby, Gemalto M2M GmbH declares that this GSM/GPRS Wireless
Module (Model No.:BGS12) is in compliance with the essential requirements and
other relevant provisions of RED 2014/53/EU. This product can be used across EU
member states.
The full text of the EU declaration of conformity is available at the following internet
address: https://www.gemalto.com/m2m
RF exposure information: The Maximum Permissible Exposure (MPE) level has been
calculated based on a distance of d=20 cm between the device and the human body.
To maintain compliance with RF exposure requirement, use product that maintain a
20cm distance between the device and human body.
Table 2: Standards of European type approval
3GPP TS 51.010-1
ETSI EN 301 511
V12.5.1
Digital cellular telecommunications system (Phase 2); Mobile
Station (MS) conformance specification
Global System for Mobile communications (GSM);
Mobile Stations (MS) equipment;
Harmonised Standard covering the essential requirements
of article 3.2 of Directive 2014/53/EU
GCF-CC V3.73.0 Global Certification Forum
ETSI EN 301 489-1
V.2.1.1
Electromagnetic compatibility and Radio spectrum Matters (ERM);
Electro Magnetic Compatibility (EMC) standard for radio
equipment and services
ETSI EN 301 489-52
V1.1.0
Candidate Harmonized European Standard (Telecommunications
series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for
radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular
radio telecommunications systems (GSM and DCS)
Table 3: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
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Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous
Substances in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by
Electronic Information Products” (2006-06).
According to the “Chinese Administration on the
Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e.,
Environmental Protection Use Period, of this product is 20 years as per the symbol shown here,
unless otherwise marked. The EPUP is valid only
as long as the product is operated within the
operating limits described in the Gemalto M2M
Hardware Interface Description.
Please see Table5 for an overview of toxic or hazardous
substances or elements that might be contained in product parts
in concentrations above the limits defined by SJ/T 11363-2006.
Table 5: Toxic or hazardous substances or elements with defined concentration limits
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1.3.2 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable BGS12 based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use.
For European markets the relevant directives are mentioned below. It is the responsibility of
the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.
Products intended for sale on European markets
EN 62311:2008 Assessment of electronic and electrical equipment related to human
exposure restrictions for electromagnetic fields (0 Hz - 300 Ghz)
The device complies with RF specifications when the device used at 20 cm form your body.
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1.3.3 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating BGS12. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product.
Failure to comply with these precautions violates safety standards of design, manufacture and
intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply
with these precautions.
When in a hospital or other health care facility, observe the restrictions on
the use of mobiles. Switch the cellular terminal or mobile off, if instructed to
do so by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference
from cellular terminals or mobiles placed close to the device. If in doubt about
potential danger, contact the physician or the manufacturer of the device to
verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications
systems. Failure to observe these instructions may lead to the suspension
or denial of cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used
close to TV sets, radios, computers or inadequately shielded equipment.
Follow any special regulations and always switch off the cellular terminal or
mobile wherever forbidden, or when you suspect that it may cause interference or danger.
Road safety comes first! Do not use a handheld cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a handheld terminal or mobile,
park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or
operation can constitute a safety hazard.
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IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular net-
works. Because of this, connection cannot be guaranteed at all times under
all conditions. Therefore, you should never rely solely upon any wireless
device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services
or phone features are in use (e.g. lock functions, fixed dialing etc.). You may
need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the
cellular terminal or mobile.
Use careful with the earphone maybe possible excessive sound pressure
from earphones and headphones can cause hearing loss.
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Product Concept
2
2.1 Key Features at a Glance
Feature Implementation
General
18 of 109
Frequency bands
GSM class
Output power
(according to Release
99, V5)
Power supply1
Operating temperature
(board temperature)
Physical
RoHS
Quad band : GSM 850/900/1800/1900MHz
Small MS
GSM850 824.2MHz~848.8MHz
GSM:31.5±1dBm
GPRS:31.5±1dBm
PCS1900 1850.2MHz~1909.8MHz GSM:27.5±1dBm
GPRS:27.5±1dBm
EGSM900:880~915MHz GSM:32.8dBm
GPRS:27.3dBm
DCS1800：1710MHz~1785MHz GSM:30.4dBm
GPRS:24.1dBm
3.4V to 4.2V
-10°C to +55°C
Dimensions: 27.6mm x 18.8mm x 2.7mm
Weight: approx. 2.2 g
All hardware components fully compliant with EU RoHS
Directive
GSM/GPRS features
GPRS:
•
Data transfer
SMS
Audio
1. The module operates within a voltage level range from 3.4V up to 4.2V without
restrictions. It is suggested to supply 3.4V to 4.35V on module.
Please add at least 3700uF capacitor to VBAT signal line against GSM burst current
while 3.2V to 3.4V supply for BGS12 module.
Multislot Class 12
•
Mobile Station Class B
•
Coding Scheme 1 – 4
PPP-stack for GPRS data transfer
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 50 SMS locations in mobile equipment
Speech codecs:
•
Half rate HR (ETS 06.20)
•
Full rate FR (ETS 06.10)
•
Enhanced full rate EFR (ETS 06.50/06.60/06.80)
Handsfree operation, echo cancellation, noise suppression,
7 different ringing tones/melodies
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application
and
.
This application note comprises chapters on module mounting and
CINTERION® BGS12 Hardware Interface Description
Contents
Feature Implementation
Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M
TCP/IP stack Protocols: TCP server/client, UDP, HTTP, FTP
Access by AT commands
Firmware update Generic update from host application over ASC1.
Interfaces
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Module interface
Surface mount device with solderable connection pads (SMT
interface).
Land grid array (LGA) technology ensures high solder joint reliability
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]
application layout issues as well as on additional SMT application
development equipment.
3 serial interfaces ASC0:
•
8-wire modem interface with status and control lines, unbalanced,
asynchronous
•
Adjustable baud rates: 4,800bps to 230,400bps
•
Autobauding: 4,800bps to 230,400bps
•
Supports RTS0/CTS0 hardware handshake
•
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
•
2-wire, unbalanced asynchronous interface
•
ASC1 operated at Fixed Bit rate 921,600 bps
For firmware upgrade and tracing purpose
ASC2:
•
4-wire, unbalanced asynchronous interface
•
ASC2 operated at Fixed Bit rates from 4,800 bps to 230,400 bps
Supports RTS2/CTS2 hardware handshake
Audio 1 analog interface (with microphone feeding)
UICC interface Supported SIM/USIM cards: 3V, 1.8V
External SIM card reader has to be connected via interface connector
(note that card reader is not part of BGS12)
GPIO interface
GPIO interface with 6 GPIO lines. The GPIO interface is shared with an
I2C interface and LED signalling functionality as well as a jamm- ing
indicator.
Antenna
50
Power on/off, Reset
Power on/off
Switch-on by hardware signal ON
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions
Fast power shutdown by GPIO
Fast power shutdown by AT command
UpgradingReset
Orderly shutdown and reset by AT command
Special features
Real time clock Timer functions via AT commands
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Feature Implementation
Evaluation kit
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Phonebook
SSL security
RLS monitoring
Evaluation module
DSB75
SIM and phone
TLS 1.2
Jamming detection
BGS12 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.
DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for
application engineering. A special adapter setup is required to connect the evaluation module to the DSB75. For more information on
how to setup such a connection please refer to Chapter 9.
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2.2 BGS12 System Overview
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6
-
-
2
-
-
1
-
-
1
-
-
1
-
-
2
-
-
1
-
-
2
-
-
8
-
-
2
-
-
4
-
-
5
-
-
1
-
-
1
-
-
1
-
-
1
-
-
1
-
Figure 1: BGS12 system overview
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2.3 Circuit Concept
Figure 2 shows a block diagram of the BGS12 module and illustrates the major functional
components:
Baseband block:
GSM baseband processor and power management
•
Stacked flash/PSRAM memory
•
•
Application interface (SMT with connecting pads)
GSM RF section:
RF transceiver (part of baseband processor IC)
•
•
RF power amplifier/front-end module inc. harmonics filtering
•
Receive Balun
Figure 2: BGS12 block diagram
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3
Application Interface
BGS12 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several subinterfaces described in the following sections:
Power supply - see Section 3.2
•
SIM/USIM interface - see Section 3.7
•
Serial interface ASC0 - see Section 3.8
•
•
Serial interface ASC1 - see Section 3.9
•
Serial interface ASC2 - see Section 3.10
Analog audio interface - see Section 3.11
•
Digital audio interface - see Section 3.12
•
GPIO interface - see Section 3.13
•
•
I2C interface - Section 3.14
Jamming indicator - Section 3.15
•
•
Status Control - LED: Section 3.16, RING line: Section 3.17, Power indication: Section 3.18
Fast shutdown - Section 3.19
•
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3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 6: Overview of operating modes
Normal
operation
GSM/GPRS
SLEEP
Various power save modes set with AT+CFUN
command.
Software is active to minimum extent. If the module
was registered to the GSM network in IDLE mode, it is
registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode
(AT+CFUN=0) disables the AT interface.
The CYCLIC SLEEP modes AT+CFUN=7 and 9 alternatingly activate and deactivate the AT interfaces
to allow permanent access to all AT commands.
GSM IDLE Software is active. Once registered to the GSM net-
work, paging with BTS is carried out. The module is
ready to send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage
individual settings,such as DTX off/on,FR/EFR/HR,
hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data
is currently sent or received. Power consumption depends on network settings and GPRS configuration
(e.g. multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level), uplink/downlink data rates, GPRS configuration
(e.g. used multislot settings) and reduction of maximum output power.
Power Down Normal shutdown after sending the AT^SMSO command.
Only a voltage regulator is active for powering the RTC. Software is not
active. Interfaces are not accessible.
Operating voltage (connected to BATT+) remains applied.
See the following sections for the various options of waking up BGS12 and proceeding from
one mode to another.
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3.2 Power Supply
BGS12 needs to be connected to a power supply at the SMT application interface - 3 lines
each BATT
BATT
+RF
, BATT
+BB
and GND. BATT
+RF
+BB
is for the GSM power amplifier supply.
is for the general power management and
The power supply of BGS12 has to be a single voltage source at BATT
and BATT
+BB
+RF
. It
must be able to provide the peak current during the uplink transmission.
All the key functions for supplying power to the device are handled by the power management
section of the analog controller. This IC provides the following features:
•
Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators and a DC-DC step down switching regulator.
Switches the module's power voltages for the power-up and -down procedures.
•
•
SIM switch to provide SIM power supply.
When power supply is provided on BATT
make sure to avoid that current is flowing from any other source into the module circuit (for example reverse
current from high state external control lines). The controlling application must be designed to prevent reverse
current flow, otherwise there is the risk of damaging the module.
and BATT
+BB
pins and BGS12 has not
+RF
been powered on, please
3.2.1 Minimizing Power Losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage V
never drops below 3.3V on the BGS12 board, not
BATT+
even in a GSM transmit burst where current consumption can rise (for peaks values see the
power supply ratings listed in Section 5.5). It should be noted that BGS12 switches off when
exceeding these limits. Any voltage drops that may occur in a transmit burst should not
exceed 400mV.
The module switches off if the minimum battery voltage (V
) is reached. Example:
BattMin
V
BattLowLimit
D
DropMax
V
BattMin
V
BattMin
= 3.3V
= 0.4V
= V
BattLowLimit
+ D
DropMax
= 3.3V + 0.4V = 3.7V
Figure 3: Power supply limits during transmit burst
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3.2.2 Measuring the Supply Voltage (V
To measure the supply voltage V
it is possible to define two reference points GND and
BATT+
BATT+
)
BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the
external application the module is mounted on. The external BATT+ reference point has to be
connected to and positioned close to the SMT application interface’s BATT+ pads 5 or 53 as
shown in Figure 4.
Figure 4: Position of reference points BATT+ and GND
3.2.3 Monitoring Power Supply by AT Command
To monitor the supply voltage you can also use the AT^SBV command which returns the value
related to the reference points BATT+ and GND.
The module continuously measures the voltage at intervals. The displayed voltage (in mV) is
averaged over the last measuring period before the AT^SBV command was executed.
If the measured average voltage drops below or rises above the specified voltage shutdown
thresholds, the module will send an "^SBC" URC and shut down. (for details see Section
3.3.5)
3.3 Power Up/Power down Scenarios
In general, be sure not to turn on BGS12 while it is beyond the safety limits of voltage and temperature stated in Chapter 5. BGS12 will immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to
the module.
3.3.1 Turn on BGS12
3.3.1.1
BGS12 can be started as described in the following sections:
Hardware driven switch on by ON line: Starts Normal mode (see Section 3.3.1.1).
Switch on BGS12 Using ON Signal
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When the operating voltage BATT
+BB
/BATT
is applied, BGS12 can be switched on by
+RF
means of the ON signal.
If the operating voltage BATT
+BB
/BATT
is applied while the ON signal is present for at least
+RF
2s, the BGS12 will be switched on automatically. The startup time is about 4s.
Please also note that if there is no ON signal present right after applying BATT
+BB
/BATT
BGS12 will instead of switching on perform a switch on/off sequence that cannot be avoided.
The switch on/off sequence is about 3.7s.
The ON signal is a high active signal and only allows the input voltage level of the VDDLP
signal. The following Figure 5 shows an example for a switch-on circuit (an alternative switchon possibility is shown in Figure 59).
+RF
,
Figure 5: ON circuit sample
It is recommended to set a serial 1kOhm resistor between the ON circuit and the external
capacitor or battery at the VDDLP power supply. This serial resistor protection is necessary
in case the capacitor or battery has low power (is empty).
Please note that the ON signal is an edge triggered signal. This implies that a micro-second
high pulse on the signal line suffices to almost immediately switch on the module, as shown
in Figure 6. The following Section 3.3.1.2 describes a sample circuit that may be implemented
to prevent possible spikes or glitches on the ON signal line from unintentionally switching on
the module.
Please also note that if the state of the ON signal is coupled to the state of the VDDLP line or
that if the ON signal otherwise remains active high after switch on, it is no longer possible to
switch off BGS12 using the AT command AT^SMSO. Using this command will instead
automatically restart the module.
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+BB
BATT
BATT
+RF
VDDLP
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ON
EMERG_RST
VDIG
A high impulse starts the module up
Figure 6: ON timing
If configured to a fixed bit rate (AT+IPR≠0), the module will send the URC “^SYSSTART” which
notifies the host application that the first AT command can be sent to the module. The duration
until this URC is output varies with the SIM card and may take a couple of seconds, particularly
if the request for the SIM PIN is deactivated on the SIM card.
Please note that no “^SYSSTART” URC will be generated if autobauding (AT+IPR=0) is
enabled.
To allow the application to detect the ready state of the module we recommend using hardware
flow control which can be set with AT\Q (see [1] for details). The default setting is AT\Q0 (no
flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design
does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART”
URC. However, if the URC is not available (due to autobauding), you will simply have to wait
for a period of time (at least 2 seconds) before assuming the module to be in ready state and
before entering any data.
Please note that no data must be sent over the ASC0 interface before the interface is active
and ready to receive data.
3.3.1.2
Suppressing Unintentional Pulses on ON Signal Line
Since the ON signal is edge triggered and a high pulse on the signal line suffices to almost immediately switch on the module, it might be necessary to implement a circuit on the external
application that prevents possible spikes or glitches on the signal line from unintentionally
switching on the module. Figure 7 shows an example for such a circuit.
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Figure 7: Sample circuit to suppress spikes or glitches on ON signal line
3.3.2 Restart BGS12
After startup BGS12 can be restarted as described in the following sections:
Software controlled reset by AT+CFUN command: Starts Normal mode (see Section
•
3.3.2.1).
Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.3.2.2)
•
3.3.2.1
To reset and restart the BGS12 module use the command AT+CFUN. You can enter the command AT+CFUN=,1 or 1,1 or 7,1 or 9,1. See [1] for details.
If configured to a fix baud rate (AT+IPR0) the module will send the URC "^SYSSTART" to
notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart.
3.3.2.2
The EMERG_RST signal is internally connected to the central GSM processor. Abrupt
“hardware” shutdown will accur when A low level for more than 1ms is applied to
EMERG_RST pin. BGS12 can be switched on by mean of ON signal after releasing
EMERG_RST.
Note: EMERG_RST is controlled solely cannot restart BGS12, it can only turn BGS12
off at the hardware aspect. If want to achieve restart module like RESET behaver, it
should control ON signal at the same time as described by following paragraph.
For the other solution that high level has always been applied to ON pin, triggering
EMERG_RST will set the processor and with it all the other signal pads to their respective
Restart BGS12 via AT+CFUN Command
Turn off or restart BGS12 Using EMERG_RST
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reset state. The reset state is described in Section 3.3.3 as well as in the figures showing the
startup behavior of an interface.
After releasing the EMERG_RST line, i.e., with a change of the signal level from low to high,
the module restarts. The other signals continue from their reset state as the module was
switched on by the ON signal.
Figure 8: Emergency shutdown/restart timing
It is recommended to control this EMERG_RST line with an open collector transistor or an open
drain field-effect transistor.
Caution: Use the EMERG_RST line only when, due to serious problems, the software
is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the
loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if BGS12 does not respond, if reset or
shutdown via AT command fails.
3.3.3 Signal States after Startup
Table 7 lists three states each interface signal passes through during reset and firmware in-
itialization:
1) At reset: BGS12 begins to startup and performs the reset action.
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2) After reset: BGS12 has finished the reset action and has not entered the firmware initialization state.
3) Firmware initialization: The software has taken the control right of hardware, and begins to
initialize the firmware.
At reset state is reached with the rising edge of the EMERG_RST signal - either after a normal module startup (see Section 3.3.1.1) or after a reset (see Section 3.3.2.2). When BGS12
passes through at reset state and after reset state, the firmware initialization state begins.
The firmware initialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and
RING0 as well as the ASC1 interface line CTS1 have turned high (see Section 3.7 and
Section 3.8). At that time, the module is ready to receive and transmit data.
Table 7: Signal states
Signal name At reset After reset Firmware
initialization
CCIN I / 166K PD I / 166K PD I /166K PD
CCRST L L O / L
CCIO L L I O / L
CCCLK L L O / L
RXD0 I / 166K PD I / 166K PD O / H
TXD0 I / 166K PD I / 166K PD I
CTS0 I / 166K PD I / 166K PD O / H
RTS0 I / 166K PD I / 166K PD I / 166K PU
RING0 I / 166K PD I / 166K PD O / H
DTR0 I / 166K PD I / 166K PD I / 166K PU
DCD0 I / 166K PD I / 166K PD O / 166K PU
DSR0 I / 166K PD I / 166K PD O / 166K PU
RXD1 O / 166K PU O / 166K PU O / H
TXD1 I / 166K PU I / 166K PU I
RXD2 I / 166K PD I / 166K PD O / H
TXD2 I / 166K PD I / 166K PD I
CTS2 I / 33K PD I / 33K PD O / H
RTS2 I / 33K PD I / 33K PD I / 33K PU
FAST_SHTDWN I / 166K PD I / 166K PD I / 166K PU
GPIO5 / LED O / L O / L O / 33K PU
GPIO6 /
Jamming Indicator
I / 166K PD I / 166K PD I O / 166K PU
GPIO7 I / 166K PD I / 166K PD I O / 166K PU
GPIO8 I / 166K PD I / 166K PD I O / 166K PU
GPIO9 / I2CCLK O / L O / L O / 33K PU
GPIO10 / I2CDAT O / L O / L I O / 33K PU
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Abbreviations used in above Table 7:
L = Low level OD = Open Drain
H =High level PD = Pull Down
L/H = Low or High level PU = Pull Up
T = Tristate
I = Input
O = Output
IO=Input or Output
3.3.4 Turn off BGS12
To switch the module off the following procedures may be used:
Software controlled shutdown procedure: See Section 3.3.4.1.
•
Software controlled by sending the AT^SMSO command over the serial application
interface.
•
Automatic shutdown of BGS12 due to safety precautions: See Section 3.3.5
•
Fast shutdown (Hardware line): See Section 3.19
3.3.4.1
Switch off BGS12 Using AT Command
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The best and safest approach to powering down BGS12 is to issue the AT^SMSO command. This procedure lets BGS12 log off from the network and allows the software to enter
into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power Down mode. In this mode, only the RTC stays active.
Before switching off the device sends the following response:
^SMSO: MS OFF
OK
^SHUTDOWN
After sending AT^SMSO do not enter any other AT commands. There are two ways to verify
when the module turns off:
Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile and
•
the module turns off in less than 1 second.
•
Also, you can monitor the VDIG pad. The low state of this pad definitely indicates that the
module is switched off.
Be sure not to disconnect the operating voltage V
before the URC “^SHUTDOWN” has
BATT+
been issued and the VDIG pads have gone low. Otherwise you run the risk of losing data.
While BGS12 is in Power Down mode the application interface is switched off and must not
be fed from any other voltage source. Therefore, your application must be designed to avoid
any current flow into any digital pads of the application interface.
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Figure 9: Switch off behavior
3.3.5 Automatic Shutdown
Automatic shutdown takes effect if any of the following events occurs:
•
the BGS12 board is exceeding the critical limits of overtemperature or undertemperature
(see Section 3.3.5.1)
undervoltage or overvoltage is detected (see Section 3.3.5.2 and Section 3.3.5.3)
•
The automatic shutdown procedure is equivalent to the power-down initiated with the
AT^SMSO command, i.e. BGS12 logs off from the network and the software enters a secure
state avoiding loss of data.
3.3.5.1
Thermal Shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the PCB.
The values detected by the NTC resistor are measured directly on the board and therefore, are
not fully identical with the ambient temperature.
Each time the board temperature goes out of range or back to normal, BGS12 instantly
displays an alert (if enabled).
URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as
•
protecting the module from exposure to extreme conditions. The presentation of the URCs
depends on the settings selected with the AT^SCTM write command (for details see [1]):
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled during the 15 second guard period
after start-up of BGS12. After expiry of the 15 second guard period, the presentation will
be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.
URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre-
•
sentation of these URCs is always enabled, i.e. they will be output even though the factory
setting AT^SCTM=0 was never changed.
The maximum temperature ratings are stated in Section 5.2. Refer to Table 8 for the associated
URCs.
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Table 8: Temperature dependent behavior
Sending temperature alert (15s after BGS12 startup, otherwise only if URC presentation
enabled)
^SCTM_B: 1 Board close to overtemperature limit.
^SCTM_B: -1 Board close to undertemperature limit.
^SCTM_B: 0 Board back to non-critical temperature range.
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. BGS12 switches off.
^SCTM_B: -2 Alert: Board equal or below undertemperature limit. BGS12 switches off.
3.3.5.2
The undervoltage shutdown threshold is 3.2V, i.e., it is 50mV below the specified minimum
supply voltage V
Undervoltage Shutdown
given in Table 21
BATT+
When the average supply voltage measured by BGS12 drops below the undervoltage shutdown threshold the module will send the following URC:
^SBC: Undervoltage
This alert is sent only once before the module shuts down cleanly without sending any further
messages.
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
3.3.5.3
The overvoltage shutdown threshold is equal to the maximum supply voltage V
Overvoltage Shutdown
BATT+
cified in Table 21.
When the supply voltage approaches the overvoltage shutdown threshold the module will send
the following URC:
^SBC: Overvoltage
This alert is sent once.
When the overvoltage shutdown threshold is exceeded the module will shut down cleanly.
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
Keep in mind that several BGS12 components are directly linked to BATT
and BATT
+BB
therefore, the supply voltage remains applied at major parts of BGS12. Especially the power
amplifier linked to BATT
is very sensitive to high voltage and might
+RF
even be destroyed.
spe-
+RF
,
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3.4 Power Saving
SLEEP mode reduces the functionality of the BGS12 module to a minimum and, thus,
minimizes the current consumption to the lowest level. Settings can be made using the
AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories:
•
NON-CYCLIC SLEEP mode AT+CFUN=0
•
CYCLIC SLEEP modes, selectable with AT+CFUN=7 or 9.
IMPORTANT: Please keep in mind that power saving works properly only when PIN authentication has been done. If you attempt to activate power saving while the SIM card is not
inserted or the PIN not correctly entered (Limited Service), the selected <fun> level will be
set, though power saving does not take effect.
To check whether power saving is on, you can query the status of AT+CFUN if you have
chosen CYCLIC SLEEP mode.
The wake-up procedures are quite different depending on the selected SLEEP mode. Table 9
compares the wake-up events that can occur in NON-CYCLIC and CYCLIC SLEEP modes.
3.4.1 No Power Saving (AT+CFUN=1)
The functionality level <fun>=1 is where power saving is switched off. This is the default after
startup.
3.4.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0)
If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module shortly
deactivates power saving to listen to a paging message sent from the base station and then
immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode, since the
serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode.
The first wake-up event fully activates the module, enables the serial interface and terminates
the power saving mode. In short, it takes BGS12 back to the highest level of functionality
<fun>=1.
In NON-CYCLIC mode, the falling edge of the RTS0 or RTS1 lines wakes up the module to
<fun>=1. To efficiently use this feature it is recommended to enable hardware flow control
(RTS/CTS handshake) as in this case the CTS line notifies the application when the module is
ready to send or receive characters. See Section 3.4.7.1 for details.
3.4.3 CYCLIC SLEEP Mode AT+CFUN=7
The functionality level AT+CFUN=7 is referred to as CYCLIC SLEEP modes. The major benefit
of all CYCLIC SLEEP modes is that the serial interface remains accessible, and that, in intermittent wake-up periods, characters can be sent or received without terminating the selected
mode.
The CYCLIC SLEEP modes give you greater flexibility regarding the wake-up procedures. For
example, in all CYCLIC SLEEP modes, you can enter AT+CFUN=1 to permanently wake up
the module. In mode CFUN=7, BGS12 automatically resumes power saving, after you have
sent or received a short message, made a call or completed a GPRS transfer. Please refer to
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Table 9 for a summary of all modes.
The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables the
serial interface. By setting/resetting the CTS signal, the module indicates to the application
whether or not the UART is active. The timing of CTS is described below.
Both the application and the module must be configured to use hardware flow control (RTS/
CTS handshake). The default setting of BGS12 is AT\Q0 (no flow control) which must be
altered to AT\Q3. See [1] for details.
Note: If both serial interfaces ASC0 and ASC1 are connected, both are synchronized.
This means that SLEEP mode takes effect on both, no matter on which interface the
AT command was issued. Although not explicitly stated, all explanations given in this
section refer equally to ASC0 and ASC1, and accordingly to CTS0 and CTS1.
3.4.4 CYCLIC SLEEP Mode AT+CFUN=9
Mode AT+CFUN=9 is similar to AT+CFUN=7, but provides two additional features:
The time the module stays active after RTS was asserted or after the last character was
•
sent or received, can be configured individually using the command AT^SCFG. Default
setting is 2 seconds like in AT+CFUN=7. The entire range is from 0.5 seconds to 1 hour,
selectable in tenths of seconds. For details see [1].
RTS0 and RTS1 are not only used for flow control (as in mode AT+CFUN=7), but also
•
cause the module to wake up temporarily. See Section 3.4.7.1 for details.
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3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes
The CTS signal is enabled in synchrony with the module’s paging cycle. It goes active low each
time when the module starts listening to a paging message block from the base station. The
timing of the paging cycle varies with the base station. The duration of a paging interval can be
calculated from the following formula:
4.616 ms (TDMA frame duration) * 51 (number of frames) * DRX value.
DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from 0.47
to 2.12 seconds. The DRX value of the base station is assigned by the network operator.
Each listening period causes the CTS signal to go active low: If DRX is 2, the CTS signal is
activated every 0.47 seconds, if DRX is 3, the CTS signal is activated every 0.71 seconds and
if DRX is 9, the CTS signal is activated every 2.1 seconds.
The CTS signal is active low for 5ms. This is followed by another 5ms UART activity. If the start
bit of a received character is detected within these 10ms, CTS will be activated and the proper reception of the character will be guaranteed. CTS will also be activated if any character is
to be sent.
After the last character was sent or received the interface will remain active for
another 2 seconds, if AT+CFUN=7
•
or for an individual time defined with AT^SCFG, if AT+CFUN=9. Assertion of RTS has the
•
same effect.
In the pauses between listening to paging messages, while CTS is high, the module resumes
power saving and the AT interface is not accessible. See Figure 10 and Figure 11.
Figure 10: Timing of CTS signal (example for a 2.12 s paging cycle)
Figure 11 illustrates the CFUN=7 modes, which reset the CTS signal 2 seconds after the last
character was sent or received.
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Figure 11: Beginning of power saving if CFUN=7
3.4.6 Power Saving in OFF-state
When the BGS12 is powered off, and the BATT
current can be lesser than 100uA (V
I
is
BATT+
MOSFET as
the MOS-
shown in Table 27. If the power-off current is a concern, it is suggested to use a
a switch to reduce the 100uA (V
FET.
=4.2V). Detail power off state supply current of
BATT+
BATT+
The figure below shows an external application circuit that provides the possibility to disconnect the module‘s BATT+ lines from the external application‘s power supply. The
MOSFET transistor (T8) should have an RDS_ON value < 50mΩ in order to minimize voltage
drops.
This circuit can also be used to reset the module in case it becomes unresponsive, or to
completely switch off and restart the module after a firmware update.
Afterwards the module can be restarted using the ON signal as described in Section 3.3.1.1.
, BATT
+BB
lines are supplied, the OFF-
+RF
=4.2V) current to the quiescence current of
Figure 12: Power Saving in OFF-state
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3.4.7 Wake up BGS12 from SLEEP Mode
A wake-up event is any event that causes the module to draw current. Depending on the
selected mode the wake-up event either switches SLEEP mode off and takes BGS12 back to
AT+CFUN=1, or activates BGS12 temporarily without leaving the current SLEEP mode.
Definitions of the state transitions described in Table 9:
Quit = BGS12 exits SLEEP mode and returns to AT+CFUN=1.
Temporary = BGS12 becomes active temporarily for the duration of the event and the mode
specific follow-up time after the last character was sent or received on the serial
interface.
No effect = Event is not relevant in the selected SLEEP mode. BGS12 does not wake up.
Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes
Event
Ignition line No effect No effect
RTS0 or RTS1
(falling edge)
1
)
Unsolicited Result Code (URC) Quit Temporary
Incoming voice or data call Quit Temporary
Any AT command
(incl. outgoing voice or data call,
SMS)
Incoming SMS depending on mode selected by AT+CNMI:
received SMS)
AT+CNMI=1,1 (= displays URC upon receipt of SMS)
GPRS data transfer
AT+CFUN=1
1. See Section Section 3.4.7.1 on wake-up via RTS.
3.4.7.1 Wake-up via RTS0 and RTS2 (if AT+CFUN=0 or AT+CFUN=9)
Selected mode
AT+CFUN=0
Quit + flow control
Not possible
(UART disabled)
No effect
Quit
Not possible
(UART disabled)
Not possible
(UART disabled)
Selected mode
AT+CFUN=7 or 9
Mode 7: No effect, RTS
is only used for flow
control Mode 9: Temporary + flow control
Temporary
No effect
Temporary
Temporary
Quit
During the CYCLIC SLEEP mode 7, the RTS0 and RTS2 lines are conventionally used for flow
control: The assertion of RTS0 or RTS2 indicates that the application is ready to receive data
without waking up the module.
If the module is in CFUN=0 mode the assertion of RTS0 and RTS2 serves as a wake-up event,
giving the application the possibility to intentionally terminate power saving. If the module is in
CFUN=9 mode, the assertion of RTS0 or RTS2 can be used to temporarily wake up BGS12
for the time specified with the AT^SCFG command (default = 2s). In both cases, if RTS0 or
RTS2 is asserted while AT+CFUN=0 or AT+CFUN=9 is set, there may be a short delay until
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s at VDDLP
level
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the module is able to receive data again. This delay depends on the current module
activities (e.g. paging cycle) and may be up to 60ms. The ability to receive data is signalized
by CTS0 and CTS2. It is therefore recommended to enable RTS/CTS flow control, not only in
CYCLIC SLEEP mode, but also in NON-CYCLIC SLEEP mode.
3.5 Summary of State Transitions (except SLEEP Mode)
The table shows how to proceed from one mode to another (grey column = present mode, white
columns = intended modes)
Table 10: State transitions of BGS12 (except SLEEP mode)
Further mode
Present mode
Power Down mode --Normal mode AT^SMSO ---
Normal mode EMERG_RST > 1ms EMERG_RST > 1ms
Power Down Normal mode
And ON has always been at VDDLP level
3.6 RTC Backup
The internal Real Time Clock of BGS12 is supplied from a separate voltage regulator in the
power supply component which is also active when BGS12 is in Power Down mode and
BATT+ is available.
In addition, you can use the VDDLP pad to backup the RTC from an external capacitor. The
capacitor is charged from the internal LDO of BGS12. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the
duration of buffering when no voltage is applied to BGS12, i.e. the greater the capacitor the
longer BGS12 will save the date and time. The RTC can also be supplied from an external
battery (rechargeable or non-chargeable). In this case the electrical specification of the
VDDLP pad (see Section 5.4) has to be taken in to account.
3.7 SIM/USIM Interface
The baseband processor has an integrated SIM/USIM card interface compatible with the ISO/
IEC 7816 IC Card standard. This is wired to the host interface in order to be connected to an
external SIM card holder. Five pads are reserved for the SIM interface. BGS12 supports and
automatically detects 3.0V as well as 1.8V SIM cards.
3.7.1 Single SIM/USIM Card Application
The CCIN pad serves to detect whether a tray is present in the card holder. Using the CCIN
pad is mandatory for compliance with the 3GPP TS 11.11 (Rel.99) recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation.
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Table 11: Signals of the SIM interface (SMT application interface)
Signal Description
CCCLK Chipcard clock, various clock rates can be set in the baseband processor.
The total capacitors on CCCLK should be less than 12pF. Some device which
connect with CCCLK, have the equivalent capacitors, such as the ESD component and analogue switch IC. When selecting such component, one should
calculate equivalent capacitors of all device, and make sure they are less than
12pF.
CCVCC SIM supply voltage from PSU-ASIC
CCIO Serial data line, input and output.
CCRST Chipcard reset, provided by baseband processor
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CCIN
Input on the baseband processor for detecting a SIM card tray in the holder. The
default level of CCIN is low (internal pull down resistor, no card inserted). It will
change to high level when the card is inserted. To take advantage of this feature,
an appropriate contact is required on the cardholder. Ensure that the cardholder
on your application platform is wired to output a high signal when the SIM card is
present.
The CCIN pad is mandatory for applications that allow the user to remove the SIM
card during operation.
The CCIN pad is solely intended for use with a SIM card. It must not be used for
any other purposes. Failure to comply with this requirement may invalidate the
type approval of BGS12.
The figure below shows a circuit to connect an external SIM card holder.
Figure 13: External SIM card holder circuit
It is recommended that the total cable length between SMT application interface pads on
BGS12 and the connector of the external SIM card holder must not exceed 100mm in order
to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC com-
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pliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach would be to use a separate
SIM card ground connection to shield the CCIO line from the CCCLK line. A GND line may be
employed for such a case.
Notes: The total capacitors on CCCLK should be less than 12pF. Some device which
connect with CCCLK, have the equivalent capacitors, such as the ESD component and
analogue switch IC. When selecting such component, one should calculate equivalent
capacitors of all device, and make sure they are less than 12pF.
No guarantee can be given, nor any liability accepted, if loss of data is encountered after
removing the SIM card during operation.
Also, no guarantee can be given for properly initialising any SIM card that the user
inserts after having removed a SIM card during operation. In this case, the application
must restart BGS12.
If using a SIM card holder without detecting contact please be sure to switch off the
module before removing the SIM Card or inserting a new one.
3.7.2 Dual SIM/USIM Card Application
BGS12 can support dual SIM card by add a dual SIM card analog switch IC (for details see
[7]).
3.8 Serial Interface ASC0
BGS12 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to
ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28.
The voltage level of the ASC0 interface is at 2.8V.
As the 2.8V voltage level is not supported by Gemalto M2M 3G modules, it is recommended
to use the 1.8V level convertor in case a migration to these modules is intended.
For electrical characteristics of the interface signals please refer to Section 5.4.
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Module
Voltage
domain
ASC0
ASC1
ASC2
GPIOs
VDIG(2.8V)
Serial inrterface
ASC0
Serial inrterface
ASC1
Board-to-board connector
Serial inrterface
ASC2
GPIOs
Figure 14: VDIG power supply domain
BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to the module’s TXD0 signal line
•
Port RXD @ application receives data from the module’s RXD0 signal line
•
Figure 15: Serial interface ASC0
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Features:
•
Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
ASC0 is primarily designed for controlling voice calls, GPRS data and for controlling the
•
GSM module with AT commands.
•
The DTR0 signal will only be polled once per second from the internal firmware of BGS12.
The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
•
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state. See [1] for details on how to configure the
RING0 line by AT^SCFG.
Configured for 8 data bits, no parity and 1 stop bit.
•
•
Autobauding supports bit rates from 4,800 bps to 230,400 bps.
Supports RTS0/CTS0 hardware flow control.
•
Table 12: DCE-DTE wiring of ASC0
V.24
circuit
103 TXD0 Input TXD Output
DCE DTE
Pad function Signal direction Pad function Signal direction
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104 RXD0 Output RXD Input
105 RTS0 Input RTS Output
106 CTS0 Output CTS Input
108/2 DTR0 Input DTR Output
107 DSR0 Output DSR Input
109 DCD0 Output DCD Input
125 RING0 Output RING Input
The following figure shows the startup behavior of the asynchronous serial interface ASC0.
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For output and input states see Table 7
Figure 16: ASC0 startup behavior
Please note that no data must be sent over the ASC0 interface before the interface is active
and ready to receive data (see Section 3.3.1.1).
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3.9 Serial Interface ASC1
BGS12 offers a 2-wire unbalanced, asynchronous modem interface ASC1 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28.
The electrical level of the ASC1 interface is set to 2.8V. For electrical characteristics please
refer to Table 20.
BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to module’s TXD1 signal line
•
•
Port RXD @ application receives data from the module’s RXD1 signal line
Figure 17: Serial interface ASC1
Features
Includes only the data lines TXD1 and RXD1.
•
•
For firmware upgrading and tracing purpose.
Configured for 8 data bits, no parity and 1 or 2 stop bits.
•
ASC1 can be operated at fixed bit rate at 921,600 bps. Autobauding is not supported on
•
ASC1.
Table 13: DCE-DTE wiring of ASC1
DCE DTE
V.24 circuit
Line function Signal direction Line function Signal direction
103 TXD1 Input TXD Output
104 RXD1 Output RXD Input
The following figure shows the startup behavior of the asynchronous serial interface ASC1.
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For output and input states see Table 7
Figure 18: ASC1 startup behavior
3.10 Serial Interface ASC2
BGS12 offers a 4-wire unbalanced, asynchronous modem interface ASC2 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28.
The electrical level of the ASC2 interface is set to 2.8V. For electrical characteristics please
refer to Table 20.
BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to module’s TXD2 signal line
•
Port RXD @ application receives data from the module’s RXD2 signal line
•
Figure 19: Serial interface ASC2
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Features
•
Includes only the data lines TXD2 and RXD2 plus RTS2 and CTS2 for hardware handshake.
•
On ASC2 no RING line is available. The indication of URCs on the second interface
depends on the settings made with the AT^SCFG command. For details refer to [1].
•
Configured for 8 data bits, no parity and 1 or 2 stop bits.
ASC2 can be operated at fixed bit rates from 4,800 bps to 230,400 bps. Autobauding is not
•
supported on ASC2.
Supports RTS2/CTS2 hardware flow control.
•
Table 14: DCE-DTE wiring of ASC2
V.24 circuit
103 TXD2 Input TXD Output
104 RXD2 Output RXD Input
105 RTS2 Input RTS Output
DCE DTE
Line function Signal direction Line function Signal direction
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106 CTS2 Output CTS Input
The following figure shows the startup behavior of the asynchronous serial interface ASC2.
For output and input states see Table 7
Figure 20: ASC2 startup behavior
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3.11 Analog Audio Interface
BGS12 has an analog audio interface with a balanced analog microphone input and a balanced analog earpiece output. A supply voltage is provided at dedicated pad.
BGS12 offers four audio modes which can be selected with the AT^SNFS command. The
electrical characteristics of the voice band part vary with the audio mode. For example,
sending and receiving amplification, side tone paths, noise suppression etc. depend on the
selected mode and can be altered with AT commands.
Please refer to Section 5.6 for specifications of the audio interface and an overview of the audio
parameters. Detailed instructions on using AT commands are presented in [1]. Table 30
summarizes the characteristics of the various audio modes and shows what parameters are
supported in each mode.
When shipped from factory, all audio parameters of BGS12 are set to default audio mode.
3.11.1 Microphone Inputs and Supply
The differential microphone inputs MICP and MICN present an impedance of 2kOhm and
must be decoupled by capacitors (typical 100nF). A regulated power supply for electret microphones is available at VMIC. The voltage at VMIC is rated at 1.8V and available while audio is
active (e.g., during a call). It can also be controlled by AT^SNFM. It is recommended to use an
additional RC-filter if a high microphone gain is necessary.
The following figures show possible microphone and line connections.
Figure 21: Single ended microphone connection
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Figure 22: Differential Microphone connection
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Figure 23: Line Input
3.11.2 Loudspeaker Output
BGS12 provides a differential loudspeaker output EPP/EPN. If it is used as line output (see
Figure 25), the application should provide a capacitor decoupled differential input to elimi-
nate GSM humming. A first order low pass filter above 4 kHz may be useful to improve the outof-band signal attenuation. A single ended connection to a speaker or a line input should not
be realized.
The following figures show the typical output configurations.
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Figure 24: Differential loudspeaker connection
Figure 25: Line output connection
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3.12 I2S Interface
BGS12 offers a I2S interface with 4 lines. These signals are shared with IISDO, IISLRCK,
IISDI, IISCLK pads.
Normal I2S master mode supports:
16 bits word, linear.
•
•
Mono interface.
•
Sample:<I2S_sample_rate>parameter.
•
I2S runs in normal I2S – long alignment mode.
•
I2S word alignment signal always runs at the <I2S_sample_rate> and synchronizes 2
channel (timeslots on word alignment high, word alignment low).
I2S transmit data is composed of 16 bit words, dual mono (the words are written on both
•
channels). Data are in 2’s complement notation. MSB is transmitted first. The bits are
written on I2S clock rising or falling edge (configurable).
I2S receive data is read as 16 bit words, mono (words are read only on the timeslot with
•
WA high). Data is read in 2’s complement notation. MSB is read first. The bits are read on
the I2S clock edge opposite to I2S transmit data writing edge (configurable).
I2S clock frequency is 16 bits x 2 channels x <I2S_sample_rate>.
•
MSB can be 1 bit delayed or non-delayed on I2S word alignment edge.
•
I2S transmit data can change on rising or falling edge of I2S clock signal.
•
•
I2S receive data are read on the opposite front of I2S clock signal.
3.13 GPIO Interface
BGS12 offers a GPIO interface with 6 GPIO lines. Some GPIO lines are shared with other
interfaces, such as I2C interface (see Section 3.14), Status LED (see Section 3.16), and the
jamming indicator (see Section 3.15). All functions are controlled by dedicated AT
commands.
The following table shows the configuration variants of the GPIO pads. All variants are mutually
exclusive, i.e. a pad configured as GPIO is locked for alternative use.
Table 15: GPIO assignment
GPIO I2C Status LED
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9 I2CCLK
GPIO10 I2CDAT
Status LED VDIG(=2.8V)
Jamming
indicator
Each GPIO line can be configured for use as input or output. The default function is reserved in
present software, the GPIO related AT commands will be developed in the future, please pay attention
to the newest released note.
Voltage
domain
VDIG(=2.8V)
VDIG(=2.8V)
VDIG(=2.8V)
VDIG(=2.8V)
VDIG(=2.8V)
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When the BGS12 starts up, all GPIO lines states are described in Section 3.3.3. Therefore, it
is recommended to connect external pull-up or pull-down resistors to all GPIO lines you want
to use as output.
The power supply domain voltage level for GPIO5 to GPIO10 is 2.8V. I2CCLK (GPIO9) and
I2CDAT (GPIO10) require an external pull-up resistor.
The following figure shows the startup behavior of the GPIO interface.
For output and input states see Table 7
Figure 26: GPIO startup behavior
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3.14 I2C Interface
The signal lines of the I2C interface are shared with the GPIO9 and GPIO10 signal pads.
The power supply domain voltage level for 2.8V, the I2C interface pads voltage level (see Figure 14).
I2C is a serial data transfer bus. Only normal (100kbps) and fast modes (400kbps) are supported. It
consists of two lines, the serial data line I2CDAT (GPIO10) and the serial clock line I2CCLK (GPIO9).
The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a
bidirectional line. Each device connected to the bus is software addressable by a unique 7- bit address,
and simple master/slave relationships exist at all times. The module operates as master- transmitter or
as master receiver. The customer application transmits or receives data only on request of the module.
In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pullup resistor. For electrical characteristics please refer to Table 22.
Figure 27: I2C interface connected to VCC of application
Figure 28: I2C interface connected to VDIG
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Note: Good care should be taken when creating the PCB layout of the host application: The
traces of I2CCLK and I2CDAT should be equal in length and as short as possible.
The timing of TSU:STO and SHD:STA has deviation from the I2C specification but the I2C
interface do work properly with slave devices as verified. The deviation cannot be changed due
to limitation on the chipset.
The following figure shows the startup behavior of the I2C interface.
Figure 29: I2C startup behavior
3.14.1 I2C Interface on DSB75
To evaluate the I2C interface employing the DSB75, some modifications are required on the AH6-DSB75
adapter mentioned in Section 9.1. Four components will have to be populated on the adapter: D305 (I2C
EEPROM, SOIC-8, 1V8; a suitable EEPROM type would for example be "AT24C1024BN-SH-T" from
ATMEL), C300 (decoupling capacitor, 0402 package), R301, R302 (I2C pull-up resistors, 0402
package). For details see Figure 30.
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1.8V 2K I2C EEPROM
1
2
3
4
A0
A1
A2
GND
VCC 8
SCL 6
SDA 5
VI2C
NC 7
C300
100n
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I2CCLK_A
I2CDAT_A
R302
4K7
R301
VI2C
4K7
Capacitor Resistors EEPROM
Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75
Furthermore, two jumpers (X171, for pins 7&8, 9&10) must be set in order to connect the
module's I2C signals with the memory device's input pins. For details see Figure 31.
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X171
1K
1
C111
C110
220n
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1 2 3 4 5 6 7 8 9 10 11 12 13 14
X170
CCVCC
CCVPP
CCIO
CCCLK
CCRST
GND
CCDET1
CCDET2
5
6
3
2
4
7
8
1n
R100
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IGT
DCD0
I2CCL
I2CCK
I2CD
I2CD
RESE
VSIM
CCIO
CCCLK
CCRST
Jumper settings
Figure 31: Jumper settings to enable usage of I2C interface on DSB75
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3.15 Jamming Indicator
The GPIO6 interface line can be configured as a jamming indicator by AT command. When
possible jamming is detected by the module, GPIO6 is set to high level. This state lasts as
long as possible jamming is detected.
By default, the jamming indicator feature is disabled. It has to be enabled using the AT command AT^SCFG "MEopMode/JamDet/If". For details see [1].
3.16 Status LED
The GPIO5 line at the SMT application interface can be configured to drive a status LED which
indicates different operating modes of the module (for GPIOs see Section 3.13). GPIO and LED
functionality are mutually exclusive.
To take advantage of this function connect an LED to the GPIO5/LED line as shown in Figure
32. The LED can be enabled/disabled by AT command. For details refer to [1]: AT^SSYNC.
Figure 32: Status signalling with LED driver
3.17 Behavior of the RING0 Line (ASC0 Interface only)
The RING0 line is available on the first serial interface (ASC0). The signal serves to indicate
incoming calls and other types of URCs (Unsolicited Result Code).
Although not mandatory for use in a host application, it is strongly suggested that you connect
the RING0 line to an interrupt line of your application. In this case, the application can be de-
signed to receive an interrupt when a falling edge on RING0 occurs. This solution is most
effective, particularly, for waking up an application from power saving. Note that if the RING0
line is not wired, the application would be required to permanently poll the data and status
lines of the serial interface at the expense of a higher current consumption. Therefore, utilizing the RING0 line provides an option to significantly reduce the overall current consumption of your application.
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The behavior of the RING0 line varies with the type of event:
When a voice call comes in the RING0 line goes low for 1s and high for another 4s. Every
•
5 seconds the ring string is generated and sent over the RXD0 line. If there is a call in
progress and call waiting is activated for a connected handset device, the RING0 line
switches to ground in order to generate acoustic signals that indicate the waiting call.
Figure 33: Incoming voice call
•
Likewise, when a data is received, RING0 goes low. However, in contrast to voice calls, the
line remains low. Every 5 seconds the ring string is generated and sent over the RXD0
line.
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Figure 34: incoming data receive
All other types of Unsolicited Result Codes (URCs) also cause the RING0 line to go low,
however for 1 second only.
Figure 35: URC transmission
3.18 Power Indication Circuit
In Power Down mode the maximum voltage at any digital or analog interface line must not
exceed +0.3V (see also Section 5.1). Exceeding this limit for any length of time might cause
permanent damage to the module.
It is therefore recommended to implement a power indication signal that reports the module’s
power state and shows whether it is active or in Power Down mode. While the module is in
Power Down mode all signals with a high level from an external application need to be set to
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low state or high impedance state. The sample power indication circuit illustrated in Figure 36
denotes the module’s active state with a low signal and the module’s Power Down mode with
a high signal or high impedance state.
Figure 36: Power indication circuit
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3.19 Fast Shutdown
BGS12 provides a dedicated fast shutdown signal. The FAST_SHTDWN line is an active low
control signal and it is recommended to be applied for at least 10 milliseconds. If unused this
pin can be left open because of a configured internal pull-up resistor.
By default, the fast shutdown feature is disabled. It has to be enabled using the AT command
AT^SCFG "MEShutdown/Fso". For details see [1].
If enabled, a low impulse >10 milliseconds on the FAST_SHTDWN line starts the fast shutdown. The fast shutdown procedure still finishes any data activities on the module's flash file
system, thus ensuring data integrity, but will no longer deregister gracefully from the network,
thus saving the time required for network deregistration.
Please note that if enabled, the normal software controlled shutdown using AT^SMSO will
also be a fast shutdown, i.e., without network deregistration. However, in this case no URCs
including shutdown URCs will be provided by the AT^SMSO command.
System shutdown
BATT
+BB
+RF
BATT
VDDLP
FST_SHDN
ON
EMERG_RST
VDIG
＜
200ms
Figure 37: Fast Shutdown timing
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4 Antenna Interface
The RF interface has an impedance of 50Ω. BGS12 is capable of sustaining a total mismatch
at the antenna lines without any damage, even when transmitting at maximum RF power.
The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression. Antenna matching networks are
not included on the BGS12 module and should be placed in the host application if the antenna does not have an impendance of 50Ω.
Regarding the return loss BGS12 provides the following values in the active band:
Table 16: Return loss in the active band
State of
module
Receive > 8dB > 12dB
Return loss of module Recommended return loss of
application
Transmit not applicable > 12dB
4.1 Antenna Installation
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34
53
54
GND
55
RF_OUT
56
57
58
59
60
61
62
63
64
65
66
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
250 100 101 102 103 104 105 106 249
251 93 94 95 96 97 98 99 248
GND
89 90
85 86
81 82 83 84
252 74 75 76 77 78 79 80 247
245
67 68 69 70 71 72 73 246
91 92
87 88
33
32
31
30
29
28
27
26
25
24
23
22
21
20
The antenna is connected by soldering the antenna pad (RF_OUT, i.e., pad #59) and its neigh-
boring ground pads (GND, i.e., pads #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for BGS12. All RF data specified throughout
this document is related to the ARP.
Figure 38: Antenna pads (bottom view)
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The distance between the antenna RF_OUT pad (#59) and its neighboring GND pads (#58,
#60) has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch.
The wiring of the antenna connection line, starting from the antenna pad to the application antenna should result in a 50Ω line impedance. Line width and distance to the GND plane needs
to be optimized with regard to the PCB’s layer stack. Some examples are given in Section 4.2 .
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the application PCB, it is recommended to realize the antenna connection line
using embedded Stripline rather than Micro-Stripline technology. Please see Section 4.2.1 for
an example.
For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
to BGS12‘s antenna pad.
4.2 RF Line Routing Design
4.2.1 Line Arrangement Examples
Several dedicated tools are available to calculate line arrangements for specific applications
and PCB materials - for example from http://www.polarinstruments.com/ (commercial software)
or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
4.2.1.1
This below figure shows a line arrangement example for embedded stripline with 65µm FR4
prepreg (type: 1080) and 710µm FR4 core (4-layer PCB).
Embedded Stripline
Figure 39: Embedded Stripline with 65µm prepreg (1080) and 710µm core
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4.2.1.2
Micro-Stripline
This section gives two line arrangement examples for micro-stripline.
Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB
The following two figures show examples with different values for D1 (ground strip separation).
Application board
Ground line
Antenna line
Ground line
Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1
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Application board
Ground line
Antenna line
Ground line
Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2
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Application
board
Ground line
Antenna line
Ground line
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Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB
The following two figures show examples with different values for D1 (ground strip separation).
Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1
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Application board
Ground line
Antenna line
Ground line
Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2
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4.2.2 Routing Example
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4.2.2.1
Interface to RF Connector
Figure 44 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial
antenna connector. Please note that the BGS12 bottom plane appears mirrored, since it is
viewed from BGS12 top side. By definition the top of customer's board shall mate with the
bottom of the BGS12 module.
Figure 44: Pouting to application‘s RF connector - top view
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Automatic shutdown
1
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5 Electrical Reliability and Radio Characteristics
5.1 Absolute Maximum Ratings
The absolute maximum ratings stated in Table 17 are stress ratings under any conditions.
Stresses beyond any of these limits will cause permanent damage to BGS12.
Table 17: Absolute maximum ratings
Parameter Min Max Unit
Supply voltage BATT
+BB
, BATT
-0.3 +5 V
+RF
Voltage at all digital lines in Power Down mode -0.3 +0.3 V
Voltage at digital lines VDIG domain (2.8V) in normal
-0.3 +3.3 V
operation
Voltage at SIM interface, CCVCC 1.8V in normal
-0.3 +2.2 V
Operation
Voltage at SIM interface, CCVCC 3.0V in normal
-0.3 +3.3 V
Operation
Voltage at analog lines in normal operation -0.3 +3.0 V
Voltage at analog lines in Power Down mode -0.3 +0.3 V
VDDLP -0.3 +3.6 V
5.2 Operating Temperatures
Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if
operated outside the restricted temperature range. A special URC reports whether the module
enters or leaves the restricted temperature range (see [1]; AT^SCTM).
Table 18: Board temperature
Parameter Min Typ Max Unit
Normal operation -20 +25 +85 °C
Extended operation -40
Temperature measured on BGS12
<-40
---
+90 °C
>+95
board
1. Due to temperature measurement uncertainty, a tolerance of ±3°C on the thresholds may
occur.
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See also Section 3.3.5.1 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages.
Note that within the specified operating temperature ranges the board temperature may vary
to a great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
5.3 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 19: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10 - 20 Hz
Acceleration: 5g;
Frequency range: 20 - 500 Hz
Acceleration: 5g; Duration:20h
per axis; 3 axes
Shock half-sinus
Acceleration: 25g
Shock duration:
6msec
5 shock per axis
6 positions(±x, y and z)
Dry heat
Temperature: +70
±2°C Test duration:
16h
Humidity in the test chamber: < 50%
Temperature
change
(shock)
Low temperature: -40°C ±2°C
High temperature:+85 ℃±
2°C
Changeover time:< 30s(dual chamber
system)
Test duration: 1h
Number of repetitions: 24
Damp heat
cyclic
High temperature: +55°C
±2°C
Low temperature: +25°C
±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
Cold (constant
exposure)
Temperature: -40 ±2°C
Test duration: 16h
EN 60068-2-2 Bb
ETS 300 019-2-7
DIN IEC 60068-2-30 Db
ETS 300 019-2-5
DIN IEC 60068-2-1
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5.4 Pad Assignment and Signal Description
The SMT application interface on the BGS12 provides connecting pads to integrate the module into external applications. Figure 45 shows the connecting pads’ numbering plan, the
following Table 20 lists the pads’ assignments.
Figure 45: Numbering plan for connecting pads (bottom view)
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Table 20: Pad assignments
Pad no. Signal name Pad no. Signal name Pad no. Signal name
1
2
3
4
5
6
7
8
9
10
11
12
VMIC
EPN
EPP
27
28
29
GND 30
BATT
+BB
GND
Do not use
ON
GND
VDIG
RXD0
CTS0
31
32
33
34
35
36
37
38
GPIO10/I2CDAT
GPIO9/I2CCLK
TXD1
RXD1
Do not use
Do not use
EMERG_RST
GND
NC
GPIO8
GPIO7
GPIO6/
Jamming
53
BATT
+RF
54 GND
55 GND
56 GND
57 GND
58 GND
59 RF_OUT
60 GND
61
GND
62 GND
63 GND
64 AGND
Indicator
13
14
TXD0
RING0
39
40
GPIO5/LED
FAST_SHTDWN
65 MICP
66 MICN
15 RTS0 41 DSR0 67-97 GND
16
17
18
19
20
21
22
23
24
25
26
VDDLP
CCRST
CCIN
CCIO
CCVCC
CCCLK
NC
IISDO 49 GND
IISLRCK
IISDI
IISCLK
42
43
44
DCD0
DTR0
Do not use
98 Do not use
99-106 GND
245 GND
45 Do not use 246 RTS2
46 Do not use 247 CTS2
47 GND 248 RXD2
48 GND 249 TXD2
250 GND
50 GND 251 GND
51 GND 252 GND
52 GND
1. The pads 67-106 are centrally located and should be connected to Ground except for pad
98 that is not used. Pad 98 should not be connected to the external appli- cation, but should
be left open.
Signal pads that are not used should not be connected to an external application.
Please note that the reference voltages listed in Table 21 are the values measured directly on
the BGS12 module. They do not apply to the accessories connected.
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C I
C=2200uF
and GND must be
supply purposes because
at EGSM
CINTERION® BGS12 Hardware Interface Description
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Table 21: Electrical description of application interface
Function Signal IO Signal form and level Comment
Power
supply
BATT
BATT
+BB
+RF
Power GND
External
VDIG
supply
voltage
I
VImax = 4.35V VInorm
= 3.8V
VImin = 3.2V1 during Tx burst on board
Lines of BATT
BATT
connected in parallel for
higher peak currents may
C=0 2.1A
occur.
0.92A
C=4400uF 0.62A
C is the capacitor connecting with VBAT
pins.
Minimum voltage must
not fall below 3.2V includ-
ing drop, ripple, spikes.
I is the peak current of Tx burst
network.
Ground Application Ground
O
Normal operation: VOnorm
= 2.80V ±3%
IOmax = -50mA
SLEEP mode Operation:
VOSleep = 2.80V ±5%
IOmax = -50mA
VDIG may be used for
application circuits.
If unused keep line open.
Not available in Power
Down mode. The exter-
nal digital logic must not
cause any spikes or
glitches on VDIG.
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+RF
+BB
or
Ignition ON
Emergency
shutdown
Fast
shutdown
EMERG_
RST
FAST_S
HTDWN
RTC
VDDLP I/O
backup
I
RI 1M ±15%
VIHmax = VDDLP + 0.5V
VIHmin = 1.2V at ~12µA
VILmax = 0.2V
|¯ _¯ _¯ _¯ _ high impulse
I
V
max = V
I
H
V
min =1.2V
I
H
VILmax =0.2V
BAT
~~| |~~ low impulse width > 1ms
I
VILmax = 0.84V
VIHmin = 1.96V
VIHmax = 3.1V
~~| |~~ low impulse width = 10ms
VOnorm = 3.0V ±10%
IOmax = 1.6mA
VImax = 3.3V
VImin = 2.6V
IItyp = 170µA
This signal switches the
module ON.
This line must be driven
high by an open drain or
open collector driver
connected to VDDLP.
See Section 3.3.
This line must be driven
low by an open drain or
open collector driver con-
nected to GND.
If unused keep line open.
This line must be driven
low.
If unused keep line
open.
It is recommended to use
a serial resistor between
VDDLP and a possible
capacitor. See 3.3.1.1.
If unused keep line open.
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SIM card
detection
CCIN
VIHmin = 1.96V
I
VIHmax= 3.1V
VILmax = 0.84V
CCIN = High, SIM card
inserted.
If unused keep line open.
1. The module operates within a voltage level range from 3.4V up to 4.2V without
restrictions. It is suggested to supply 3.4V to 4.35V on module.
Please add at least 3700uF capacitor to VBAT signal line against GSM burst current
while 3.2V to 3.4V supply for BGS12 module.
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CCIO
I/O
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Table 22: Electrical description of application interface
Function Signal IO Signal form and level Comment
CCRST
VOLmax = 0.30V
VOHmin = 2.40V
O
VOHmax = 3.2V
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3V SIM
Card Inter-
face
CCCLK
CCVCC O
CCRST
VILmax = 0.60V
VIHmin=1.95V
VIHmax = 3.2V
VOLmax = 0.30V
VOHmin = 2.40V
VOHmax = 3.2V
VOLmax = 0.30V
VOHmin = 2.40V
O
VOHmax = 3.2V
VOmin = 2.59V
VOtyp = 3.00V
VOmax = 3.2V
IOmax = 150mA
VOLmax = 0.19V
VOHmin = 1.5V
O
VOHmax = 2.05V
Maximum cable length
or copper track to SIM
card holder should not
exceed 100mm.
1.8V SIM
Card Inter-
face
CCIO I/O
CCCLK
CCVCC
VILmax = 0.57V
VIHmin = 1.33V
VIHmax = 2.05V
VOLmax = 0.19V
VOHmin = 1.5V
VOHmax = 2.05V
VOLmax = 0.19V
VOHmin = 1.5V
O
VOHmax = 2.05V
VOmin = 1.73V
VOtyp = 1.90V
O
VOmax = 2.05V
IOmax = 110mA
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Serial
Interface
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Table 23: Electrical description of application interface
Function Signal IO Signal form and level Comment
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Serial
Interface
ASC0
RXD0
TXD0 I
CTS0 O
RTS0 I
O
VOLmax = 0.19V
VOHmin = 2.78V
VOHmax = 3.1V
VILmax = 0.84V
VIHmin = 1.96V
If unused keep line
open.
VIHmax = 3.3V
RING0 O
DTR0 I
DSR0 O
DCD0 O
Serial
Interface
RXD1 O VOLmax = 0.19V
TXD1 I
VOHmin = 2.78V
VOHmax = 3.1V
ASC1
VILmax = 0.84V
VIHmin = 1.96V
VIHmax = 3.3V
ASC2
RXD2 O VOLmax = 0.19V
VOHmin = 2.78V
TXD2 I
VOHmax = 3.1V
VILmax = 0.84V
RTS2 I
CTS2 O
VIHmin = 1.96V
VIHmax = 3.3V
If unused keep line
open.
Table 24: Electrical description of application interface
Function Signal IO Signal form and level Comment
I2C
I2CCLK O VILmax = 0.84V
I2CDAT IO
VIHmin = 1.96V
VIHmax = 3.1V
I2C is configured as
pull-up internal and
needs a pull-up resistor
in the host
application.
If lines are unused
keep lines open.
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If unused keep line open.
GPIO10,
GPIO9,
Input, Open Drain Output (no Pull
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Table 25: Electrical description of application interface
Function Signal IO Signal form and level Comment
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GPIO
interface
GPIO5
GPIO6
GPIO7
GPIO8
i.e.,
I2CDAT
i.e., I2CCLK
VOLmax = 0.19V
IO
VOHmin = 1.5V
IO
VOHmax = 2.05V
IO
VILmax = 0.57V
VIHmin = 1.53V
IO
VIHmax = 2.05V
IO
Input, Open Drain Output (no
Pull up)
VILmax = 0.84V
VIHmin = 1.96V
VIHmax = 3.1V
IO
up)
VOHmax = 3.1V
Please note that some
GPIO lines can be used
for functions other than
GPIO:
Status LED line: GPIO5
Jamming Indicator:
GPIO6
I2C: GPIO9/GPIO10.
For further details see
Section 3.14, Section
3.15, Section 3.16.
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Table 26: Electrical description of application interface
Function Signal IO Signal form and level Comment
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Analog
VMIC O
audio
interfac
e
EPP O Differential,
EPN O
MICP I
MICN I
VOtyp =
1.8V
Imax
=0.5 mA
max 1.3Vrms at 32
load
0.95kHz sine wave
ZItyp = 2k
0.3Vrms
(@0dB gain)
Microphone supply for
customer feeding circuits
If unused keep line open.
Balanced output for
earphone or balance output
for line out
If unused keep line open.
Balanced differential
microphone with external
feeding circuit (using VMIC
and AGND) or balanced
differential line input.
Use coupling capacitors.
If unused keep lines
open.
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Parameter
BAT
T
Supply
Voltage must stay within
Voltage drop
I
OFF state
RTC backup
I
Average
IDLE mode
1
TALK mode GSM
DATA mode GPRS 1 TX,
DATA mode GPRS 4 TX,
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5.5 Power Supply Ratings
Table 27: Power supply ratings1
Description Conditions Min Typ Max Unit
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BATT
VDDLP
BATT+
+BB
+RF
voltage
during
transmit burst
supply
current
supply
current
the min/ max values,
including voltage drop,
ripple and spikes.
Normal condition, power
control level for Pout max
@ BATT+ = 0V
@ VDDLP = 3.3V
@ VDDLP = 3.0V
@ VDDLP = 2.8V
@ VDDLP = 2.6V
@ VDDLP = 2.3V
@ VDDLP = 2.0V
@ VDDLP = 1.8V
Power Down mode
@ BATT+ =3.8V
@ VDDLP = 3.3V
@ VDDLP = 3.0V
@ VDDLP = 2.8V
@ VDDLP = 2.6V
@ VDDLP = 2.3V
@ VDDLP = 2.0V
@ VDDLP = 1.8V
SLEEP mode, GSM
1
@ DRX = 2
@ DRX = 9
3.2
3.8 4.35
171
170
169
169
168
167
164
25
-223
-3148
-3144
-3152
-3152
-3152
1.6
0.9
400
V
mV
µA
µA
mA
GSM
GSM 850
2
GSM 9002
DCS 18003
PCS 1900
3
4 Rx
GSM 850
2
EGSM 9002
DCS 18003
PCS 1900
3
1Rx
GSM 850
2
EGSM 9002
DCS 18003
PCS 1900
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12.6
211.3
210.3
151.7
137.9
201.5
196.4
140.6
127.1
408.5
412.9
300.1
267.2
mA
mA
mA
mA
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DATA mode GPRS 3 TX,
DATA mode GPRS 2 Tx, 3
Parameter
I
Peak supply
Power Control Level
current
2.10
slot every
4.6ms)
OFF state
Power Down mode
supply
@ BATT+ =3.8V
38
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2Rx
GSM 850
EGSM 9002
DCS 18003
PCS 19003
Rx
GSM 850
EGSM 9002
DCS 18003
PCS 1900
2
2
3
318.4
320.2
238.8
212.7
283.1
284.2
210.8
186.5
Table 28:Power supply ratings
1
Description Conditions Min Typ Max Unit
BATT+
(during
transmission
current
GSM 850
2
EGSM 9002
DCS 18003
PCS 19003
1. Measurements start 3 minutes after the module was switched ON,
2.06
1.18
1.24
Averaging times: SLEEP mode 10minutes; TALK mode and DATA mode 5 minutes,
IDLE mode 1.5 minutes.
Communication tester settings: no neighbour cells, no cell reselection, etc.
2. Power control level PCL 5
3. Power control level PCL 0
mA
mA
A
uA
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Contents
5.6 Electrical Characteristics of the Voiceband Part
5.6.1 Setting Audio Parameters by AT Commands
The audio modes 1 to 3 can be adjusted according to the parameters listed below. Each audio
mode is assigned a separate set of parameters.
Table 29: Audio parameters adjustable by AT command
Parameter Influence to Range Gain Calculation
inBbcGain
MICP/MICN analog amplifier gain
of baseband controller before
ADC
inCalibrate
Digital attenuation of input signal
after ADC
outBbcGain
EPP/EPN analog output gain of
baseband controller after DAC
Digital attenuation of output
] n = 0...4
signal after speech decoder,
before summation of sidetone
and DAC present for each
volume step[n]
sideTone Digital attenuation of sidetone is
corrected internally by
outBbcGain to obtain a constant
sidetone independent of output
volume
0...8 0...24dB
-13...16
-13...16dB
3dB steps
0...21 -6....15dB 1dB steps
-26...5
0...32767
-26...5dB
-128dB
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5.6.2 Audio Programming Model
The audio programming model shows how the signal path can be influenced by varying the AT
command parameters.
The parameters <inBbcGain> and <inCalibrate> can be set with AT^SNFI. All the other parameters are adjusted with AT^SNFO.
Figure 46: Audio programming model
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5.6.3 Characteristics of Audio Modes
The electrical characteristics of the voiceband part depend on the current audio mode set with
the AT^SNFS command.
Table 30: Voiceband characteristics (typical)
1 2 3
AT^SNFS=
Name
Purpose
User Handset Basic
Handsfree
DSB with
Car Kit Headset
Headset
individual
handset
Adjustable
Adjustable
Adjustable
command.
Defaults:
inBbcGain
0-24dB
-6-15dB
0-24dB
-6-15dB
0-24dB
-6-15dB
outBbcGain
Sidetone Adjustable Adjustable Adjustable
Volume control Adjustable Adjustable Adjustable
Echo control
Cancellation Cancellation Cancellation
(send)
Sidetone gain at
-128dB
-128dB
-128dB
default settings
Note: With regard to acoustic shock, the cellular application must be designed to avoid
sending false AT commands that might increase amplification, e.g. for a high sensitive
earpiece. A protection circuit should be implemented in the cellular application.
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32Ohm,
Differential output gain
Differential output load
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5.6.4 Voiceband Receive Path
Test conditions:
The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise
•
stated.
Table 31: Voiceband receive path
Parameter Min Typ Max Unit Test condition/remark
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Differential output voltage (peak to peak)
settings (gs) at 6dB
stages (outBbcGain)
Fine scaling by DSP
(outCalibrate)
Output differential
DC offset
resistance
Allowed single ended
load capacitance
gs = gain setting
•
1.3
-6
-26
1.2
16
32
Vrms
from EPPx to EPNx
+15 dB Set with AT^SNFO
+5 dB Set with AT^SNFO
1.2 V gs = 0dB, outBbcGain = 0 and 6dB
from EPP to EPN
100 pF from EPP or EPN to GND
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5.6.5 Voiceband Transmit Path
Test conditions:
•
The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise
stated.
Table 32: Voiceband transmit path
Parameter Min Typ Max Unit Test condition/Remark
Input voltage (peak to peak)
MICP to MICN
Input amplifier gain in 6dB
steps (inBbcGain)
1
Fine scaling by DSP
(inCalibrate)
Input impedance MIC
Microphone supply voltage
Microphone supply current
0
-13
2
1.8
0.5
0.3 Vrms
(@0dB gain)
24 dB Set with AT^SNFI
16 dB Set with AT^SNFI
k
V
mA
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5.7 Antenna Interface Specification
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Measurement conditions: T
= 25°C, V
amb
BATT+ nom
= 4.1V.
Table 33: Antenna interface specifications
Parameter Min Typ Max Unit
Frequency range Uplink
(MS BTS)
Frequency range Downlink
(BTS MS)
Receiver input sensitivity @ ARP
Under all propagation conditions
according to GSM specification
GSM 850 824
E-GSM 900 880
DCS 1800 1710
PCS 1900 1850
GSM 850
E-GSM 900
DCS 1800
PCS 1900
GSM 850
E-GSM 900
869
925
1805
1930
-102
-102
849
915
1785
1910
894
960
1880
1990
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
dBm
dBm
DCS 1800
-102
dBm
Receiver input sensitivity @ ARP
BER Class II <= 2.43% @ static
input level (no fading)
PCS 1900
GSM 850
E-GSM 900
DCS 1800
PCS 1900
-102
-107
-107
-107
-107
dBm
dBm
dBm
dBm
dBm
RF power @ ARP with 50 load
RF Gain
GSM 850
E-GSM 900
DCS 1800
PCS 1900
GSM 850
E-GSM 900
DCS 1800
PCS 1900
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31 32.5 34 dBm
31 32.5 34 dBm
28 29.5 31 dBm
28 29.5 31 dBm
1.0
1.2
2.1
2.7
dBi
dBi
dBi
dBi
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5.8 Electrostatic Discharge
The GSM module is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive
components. Proper ESD handling and packaging procedures must be applied through-
out the processing, handling and operation of any application that incorporates a BGS12
module.
Special ESD protection provided on BGS12:
SIM interface: Serial resistor and ESD protection diode
•
BGS12 has been tested according to group standard ETSI EN 301 489-1 (see Table 2) and
test standard EN 61000-4-2. The measured values can be gathered from the following table.
Table 34: Measured electrostatic values
Specification/Requirements Contact discharge Air discharge
EN 61000-4-2
SIM interface
Antenna interface
4kV 8kV
4kV 8kV
JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF)
ESD at the module
1kV
n.a.
Note: Please note that the values may vary with the individual application design. For
example, it matters whether or not the application platform is grounded over external
devices like a computer or other equipment, such as the Gemalto M2M reference application described in Chapter 8.
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6 Mechanics, Mounting and Packaging
The following sections describe the mechanical dimensions of BGS12 and give recommendation for integrating BGS12 into the host application. Also, a number of files containing
product model data in STEP format as well as Gerber data for the external application footprint are attached to this PDF. Please open the attachments navigation panel to view and
save these files.
6.1 Mechanical Dimensions of BGS12
Figure 47 shows the top and bottom view of BGS12 and provides an overview of the board's
mechanical dimensions. For further details see Figure 48.
Product label
Top view
Bottom view
Figure 47: BGS12 – top and bottom view
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Figure 48: Dimensions of BGS12 (all dimensions in mm)
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6.2 Mounting BGS12 onto the Application Platform
This section describes how to mount BGS12 onto the PCBs (=printed circuit boards), including land pattern and stencil design, board-level characterization, soldering conditions,
durability and mechanical handling. For more information on issues related to SMT module integration see also [3].
6.2.1 SMT PCB Assembly
6.2.1.1
The land pattern and stencil design as shown below is based on Gemalto M2M characterizations
for lead-free solder paste on a four-layer test PCB and a 120 respectively 150 micron thick
stencil.
Land Pattern and Stencil
The land pattern given in Figure 49 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 5.4).
Figure 49: Land pattern (top view)
The stencil design illustrated in Figure 50 and Figure 51 is recommended by Gemalto M2M as
a result of extensive tests with Gemalto M2M Daisy Chain modules.
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Note that depending on coplanarity or other properties of the external PCB, it could be that all
of the central ground pads may have to be soldered.
Figure 50: Recommended design for 120 micron thick stencil (top view)
Figure 51: Recommended design for 150 micron thick stencil (top view)
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6.2.1.2
Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT
process.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount
checks are described in [3].
It is recommended to characterize land patterns before an actual PCB production, taking
individual processes, materials, equipment, stencil design, and reflow profile into account. For
land and stencil pattern design recommendations see also Section 6.2.1.1. Optimizing the
solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease solder voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to
[3].
Generally, solder paste manufacturer recommendations for screen printing process parameters and reflow profile conditions should be followed. Maximum ratings are described in
Section 6.2.3.
6.2.2 Moisture Sensitivity Level
BGS12 comprises components that are susceptible to damage induced by absorbed
moisture.
Gemalto M2M’s BGS12module complies with the latest revision of the IPC/JEDEC J-STD020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional MSL (=moisture sensitivity level) related information see Section 6.2.4 and
Section 6.3.2.
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6.2.3 Soldering Conditions and Temperature
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6.2.3.1
Reflow Profile
Figure 52: Reflow Profile
Table 35: Reflow temperature ratings
Profile Feature Pb-Free Assembly
Initial temperature (TI)
Average temperature slope (TI to T
Smin
)
Preheat & Soak
Temperature Minimum (T
Temperature Maximum (T
Time (t
Smin
to t
Smax
) (tS)
Average ramp up rate (T
Smin
Smax
Smax
)
)
to TP)
Liquidous temperature (TL1)
Time at liquidous (tR)
Peak package body temperature (TP)
Time (tP) within 5 °C of the peak package
body temperature (TP)
Average ramp-down rate (TP to T
Smax
)
Time of cold-down (TP to TL2)
Time TI to maximum (TI to TP)
25 °C
0.5-2.0 °C /second
150°C
210°C
90-120 seconds
3K/second max.
217°C
30-90 seconds
245°C +0/-5°C
30 seconds max.
6K/second max.
0-60 seconds
8 min max.
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-25
10
Air pressure:
Low
70
IEC TR 60271
-3-
1: 1K4
High
106 IEC TR 60271
-3-
1: 1K4
Radiation:
Solar
1120
ETS 300 019
-2-
1: T1.2,
Heat
600
ETS 300 019
-2-
1: T1.2,
recommended
Not
Vibration sinusoidal:
Displacement
1.5 mm Acceleration
5
m/s2
Frequency range
2-9 9-200
Hz
Shocks:
Shock spectrum
semi
-
sinusoidal
Duration
1 ms
Acceleration
50
m/s2
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6.2.3.2
Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
A maximum module temperature of 245°C. This specifies the temperature as measured at
•
the module’s top side.
A maximum duration of 30 seconds at this temperature.
•
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
BGS12 is specified for one soldering cycle only. Once BGS12 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.
6.2.4 Durability and Mechanical Handling
6.2.4.1
BGS12 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture
barrier anti-static bags. The conditions stated below are only valid for modules in their original
packed state in weather protected, non-temperature-controlled storage locations. Normal
storage time under these conditions is 12 months maximum.
Table 36: Storage conditions
Type Condition Unit Reference
Storage Conditions
Air temperature: Low
High
Humidity relative: Low
High
+40
90 at 40°C
°C IPC/JEDEC J-STD-033A
%
IPC/JEDEC J-STD-033A
kPa
Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4
Water: rain, dripping, icing
Not allowed --- ---
and frosting
W/m2
IEC 60068-2-2 Bb
Chemically active substances
Mechanically active
substances
Not
recommended
IEC TR 60271-3-1: 1C1L
IEC TR 60271-3-1: 1S1
IEC TR 60271-3-1: 1M2
IEC 60068-2-27 Ea
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6.2.4.2
BGS12 must be soldered to an application within 72 hours after opening the MBB (=moisture barrier bag) it was stored in.
Processing Life
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
6.2.4.3
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 55 for details):
•
•
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
6.2.4.4
ESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 5.8 for further information on electrostatic discharge.
Baking
It is not necessary to bake BGS12, if the conditions specified in Section 6.2.4.1 and Sec-
tion 6.2.4.2 were not exceeded.
It is necessary to bake BGS12, if any condition specified in Section 6.2.4.1 and Section
6.2.4.2 was exceeded.
Electrostatic Discharge
6.3 Packaging
6.3.1 Tape and Reel
The single-feed tape carrier for BGS12 is illustrated in Figure 53. The figure also shows the
proper part orientation. The tape width is 44 mm and the BGS12 modules are placed on the
tape with a 28-mm pitch. The reels are 330 mm in diameter with a core diameter of 180 mm.
Each reel contains 500 modules.
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6.3.1.1 Orientation
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Figure 53: Carrier tape
Figure 54: Reel direction
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oldered onto the
application.
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Barcode Label
A barcode label provides detailed information on the tape and its contents. It is attached to the
reel.
Barcode label
Figure 55: Barcode label on tape reel
6.3.2 Shipping Materials
BGS12 is distributed in tape and reel carriers. The tape and reel carriers used to distribute
BGS12 are packed as described below, including the following required shipping materials:
Moisture barrier bag, including desiccant and humidity indicator card
•
•
Transportation box
6.3.2.1
The tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity
indicator card and desiccant pouches - see Figure 56. The bag is ESD protected and delimits
moisture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the BGS12 modules from moisture exposure. It should not be
opened until the devices are ready to be s
Moisture Barrier Bag
Figure 56: Moisture barrier bag (MBB)
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The label shown in Figure 57 summarizes requirements regarding moisture sensitivity, includ-
ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.
Figure 57: Moisture Sensitivity Label
MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The
humidity indicator card described below should be used to determine whether the enclosed
components have absorbed an excessive amount of moisture.
The desiccant pouches should not be baked or reused once removed from the MBB.
The humidity indicator card is a moisture indicator and is included in the MBB to show the approximate relative humidity level within the bag. Sample humidity cards are shown in Figure 58.
If the components have been exposed to moisture above the recommended limits, the units will
have to be rebaked.
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Figure 58: Humidity Indicator Card – HIC
A baking is required if the humidity indicator inside the bag indicates 10% RH or more.
6.3.2.2
Transportation Box
Tape and reel carriers are distributed in a box, marked with a barcode label for identification
purposes. A box contains 4 reels with 500 modules each.
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7 Sample Application
Figure 59 shows a typical example of how to integrate a BGS12 module with an application.
Usage of the various host interfaces depends on the desired features of the application.
The audio interface demonstrates the balanced connection of microphone and earpiece. This
solution is particularly well suited for internal transducers.
Because of the very low power consumption design, current flowing from any other source into
the module circuit must be avoided, for example reverse current from high state external control
lines. Therefore, the controlling application must be designed to prevent reverse current flow.
Otherwise there is the risk of undefined states of the module during startup and shutdown or
even of damaging the module.
Because of the high RF field density inside the module, it cannot be guaranteed that no self
interference might occur, depending on frequency and the applications grounding concept. The
potential interferers may be minimized by placing small capacitors (47pF) at suspected lines
(e.g. RXD0, RXT0, VDDLP, and ON).
While developing SMT applications it is strongly recommended to provide test points
for certain signals resp. lines to and from the module - for debug and/or test purposes.
The SMT application should allow for an easy access to these signals. For details on
how to implement test points see [3].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for
an individual application is very much determined by the overall layout and, especially, the
position of components. For example, mounting the internal acoustic transducers directly on
the PCB eliminates the need to use the ferrite beads shown in the sample schematic.
Please note that BGS12 is not intended for use with cables longer than 3m.
Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 59 and the information detailed in this section. As functionality and compliance with
national regulations depend to a great amount on the used electronic components and the
individual application layout manufacturers are required to ensure adequate design and
operating safeguards for their products using BGS12 modules.
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