Gemalto M2M BGS12 Users Manual
1
Confidential /
Released
CINTERION® BGS12
Hardware Interface Description
Version: 00.915
DocId: BGS12_HID_V00.915
M2M.GEMALTO.COM
BGS1-E HID_V02.000 2017-07-13
BGS12 HID_V00.
915
2019-01-07
Document Name:
Version:
Status
00.915
CINTERION® BGS12 Hardware Interface Description
Contents
Cinterion® BGS12 Hardware Interface Description
2 of 109 Page
Date:
DocId:
2019-01-07
BGS12 HID_V00.915
Confidential / Released
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION
(THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER
WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL
PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS.
THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO
M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE
THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS
SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED
ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO
THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH
DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR
AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE
PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization
of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant
or registration of a utility model or design patent are reserved.
Copyright © 2017, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered
in certain countries. Microsoft and Windows are either registered trademarks or trademarks
of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
3 of 109 Page
Contents
Hardware Interface Description ............................................................................................. 1
Introduction ................................................................................................................. 9
1
1.1 Related Documents ............................................................................................ 9
1.2 Terms and Abbreviations..................................................................................... 9
1.3 Regulatory and Type Approval Information ......................................................... 12
1.3.1 Directives and Standards ..................................................................................... 12
1.3.2 SAR requirements specific to portable mobiles .................................................... 15
1.3.3 Safety Precautions .............................................................................................. 16
Product Concept .......................................................................................................... 18
2
2.1 Key Features at a Glance ................................................................................... 18
2.2 BGS12 System Overview .................................................................................... 21
2.3 Circuit Concept ................................................................................................... 22
Application Interface .................................................................................................... 23
3
3.1 Operating Modes ................................................................................................ 24
3.2 Power Supply ..................................................................................................... 25
3.2.1 Minimizing Power Losses .................................................................................... 25
3.2.2 Measuring the Supply Voltage (V
BATT+
3.2.3 Monitoring Power Supply by AT Command .......................................................... 26
3.3 Power Up/Power down Scenarios ....................................................................... 26
3.3.1 Turn on BGS12 ................................................................................................... 26
3.3.1.1
3.3.1.2
Switch on BGS12 Using ON Signal ........................................................ 26
Suppressing Unintentional Pulses on ON Signal Line ............................. 28
3.3.2 Restart BGS12 ................................................................................................... 29
Restart BGS12 via AT+CFUN Command ................................................ 29
3.3.2.1
Turn off or restart BGS12 Using EMERG_RST ...................................... 29
3.3.2.2
3.3.3 Signal States after Startup ................................................................................... 30
3.3.4 Turn off BGS12 ................................................................................................... 32
3.3.4.1
Switch off BGS12 Using AT Command ................................................... 32
3.3.5 Automatic Shutdown ........................................................................................... 33
Thermal Shutdown ................................................................................. 33
3.3.5.1
3.3.5.2
Undervoltage Shutdown ......................................................................... 34
Overvoltage Shutdown ........................................................................... 34
3.3.5.3
3.4 Power Saving ..................................................................................................... 35
3.4.1 No Power Saving (AT+CFUN=1) ......................................................................... 35
3.4.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0) ......................................................... 35
3.4.3 CYCLIC SLEEP Mode AT+CFUN=7 .................................................................... 35
3.4.4 CYCLIC SLEEP Mode AT+CFUN=9 .................................................................... 36
3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes............................................ 37
3.4.6 Power Saving in OFF-state ................................................................................. 38
3.4.7 Wake up BGS12 from SLEEP Mode ................................................................... 39
3.4.7.1 Wake-up via RTS0 and RTS2 (if AT+CFUN=0 or AT+CFUN=9) ............. 39
3.5 Summary of State Transitions (except SLEEP Mode) ......................................... 40
3.6 RTC Backup ....................................................................................................... 40
) ............................................................. 26
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
3.7 SIM/USIM Interface ............................................................................................ 40
3.7.1 Single SIM/USIM Card Application ..................................................................... 40
3.7.2 Dual SIM/USIM Card Application ........................................................................ 42
3.8 Serial Interface ASC0 ......................................................................................... 42
3.9 Serial Interface ASC1 ......................................................................................... 46
3.10 Serial Interface ASC2 ......................................................................................... 47
3.11 Analog Audio Interface ........................................................................................ 49
3.11.1 Microphone Inputs and Supply ................................................................ 49
3.11.2 Loudspeaker Output ............................................................................... 50
3.12 I2S Interface ........................................................................................................ 52
3.13 GPIO Interface .................................................................................................... 52
3.14 I2C Interface ....................................................................................................... 54
3.14.1 I2C Interface on DSB75 ......................................................................... 55
3.15 Jamming Indicator .............................................................................................. 58
3.16 Status LED ......................................................................................................... 58
3.17 Behavior of the RING0 Line (ASC0 Interface only) .............................................. 58
3.18 Power Indication Circuit ...................................................................................... 59
3.19 Fast Shutdown .................................................................................................... 61
4 of 109 Page
4 Antenna Interface ........................................................................................................ 62
4.1 Antenna Installation ............................................................................................ 62
4.2 RF Line Routing Design ...................................................................................... 63
4.2.1 Line Arrangement Examples ............................................................................... 63
Embedded Stripline ................................................................................ 63
4.2.1.1
Micro-Stripline ........................................................................................ 64
4.2.1.2
4.2.2 Routing Example ................................................................................................ 68
Interface to RF Connector ...................................................................... 68
4.2.2.1
5 Electrical Reliability and Radio Characteristics ........................................................ 69
5.1 Absolute Maximum Ratings ................................................................................ 69
5.2 Operating Temperatures ..................................................................................... 69
5.3 Reliability Characteristics .................................................................................... 70
5.4 Pad Assignment and Signal Description .............................................................. 71
5.5 Power Supply Ratings ......................................................................................... 79
5.6 Electrical Characteristics of the Voiceband Part................................................... 81
5.6.1 Setting Audio Parameters by AT Commands ....................................................... 81
5.6.2 Audio Programming Model .................................................................................. 82
5.6.3 Characteristics of Audio Modes ........................................................................... 83
5.6.4 Voiceband Receive Path .................................................................................... 84
5.6.5 Voiceband Transmit Path.................................................................................... 85
5.7 Antenna Interface Specification .......................................................................... 86
5.8 Electrostatic Discharge ....................................................................................... 87
6 Mechanics, Mounting and Packaging ........................................................................ 88
6.1 Mechanical Dimensions of BGS12 ...................................................................... 88
6.2 Mounting BGS12 onto the Application Platform ................................................... 90
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
6.2.1 SMT PCB Assembly............................................................................................ 90
Land Pattern and Stencil ........................................................................ 90
6.2.1.1
6.2.1.2
Board Level Characterization ................................................................. 92
6.2.2 Moisture Sensitivity Level .................................................................................... 92
6.2.3 Soldering Conditions and Temperature ................................................................ 93
6.2.3.1
Reflow Profile ......................................................................................... 93
Maximum Temperature and Duration ..................................................... 94
6.2.3.2
6.2.4 Durability and Mechanical Handling ..................................................................... 94
Storage Conditions ................................................................................. 94
6.2.4.1
Processing Life ....................................................................................... 95
6.2.4.2
6.2.4.3
Baking .................................................................................................... 95
6.2.4.4
Electrostatic Discharge ........................................................................... 95
6.3 Packaging ........................................................................................................... 95
6.3.1 Tape and Reel ..................................................................................................... 95
6.3.1.1 Orientation ............................................................................................. 96
6.3.2 Shipping Materials............................................................................................... 97
6.3.2.1
Moisture Barrier Bag .............................................................................. 97
Transportation Box ................................................................................. 99
6.3.2.2
5 of 109 Page
7 Sample Application ..................................................................................................... 100
7.1 Blocking against RF on Interface Lines .................................................................... 102
8 Reference Approval ..................................................................................................... 104
8.1 Reference Equipment for Type Approval ................................................................. 104
9 Appendix ...................................................................................................................... 105
9.1 List of Parts and Accessories ................................................................................... 105
9.2 FCC statement ........................................................................................................ 107
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Tables
Table 1: Directives ............................................................................................................. 12
Table 2: Standards of European type approval .................................................................. 13
Table 3: Requirements of quality........................................................................................ 13
Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China14
Table 5: Toxic or hazardous substances or elements with defined concentration limits ..... 14
Table 6: Overview of operating modes ............................................................................... 24
Table 7: Signal states ........................................................................................................ 31
Table 8: Temperature dependent behavior ........................................................................ 34
Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes ............................ 39
Table 10: State transitions of BGS12 (except SLEEP mode) ............................................. 40
Table 11: Signals of the SIM interface (SMT application interface) .................................... 41
Table 12: DCE-DTE wiring of ASC0 ................................................................................... 44
Table 13: DCE-DTE wiring of ASC1 ................................................................................... 46
Table 14: DCE-DTE wiring of ASC2 ................................................................................... 48
Table 15: GPIO assignment .............................................................................................. 52
Table 16: Return loss in the active band ............................................................................ 62
Table 17: Absolute maximum ratings ................................................................................. 69
Table 18: Board temperature ............................................................................................. 69
Table 19: Summary of reliability test conditions ................................................................. 70
Table 20: Pad assignments ................................................................................................ 72
Table 21: Electrical description of application interface ...................................................... 73
Table 22: Electrical description of application interface ...................................................... 75
Table 23: Electrical description of application interface ...................................................... 76
Table 24: Electrical description of application interface ...................................................... 76
Table 25: Electrical description of application interface ...................................................... 77
Table 26: Electrical description of application interface ...................................................... 78
Table 27: Power supply ratings1 ......................................................................................... 79
Table 28:Power supply ratings1 .......................................................................................... 80
Table 29: Audio parameters adjustable by AT command ................................................... 81
Table 30: Voiceband characteristics (typical) ..................................................................... 83
Table 31: Voiceband receive path ...................................................................................... 84
Table 32: Voiceband transmit path ..................................................................................... 85
Table 33: Antenna interface specifications ......................................................................... 86
Table 34: Measured electrostatic values ............................................................................ 87
Table 35: Reflow temperature ratings ................................................................................ 93
Table 36: Storage conditions ............................................................................................. 94
Table 37: EMI measures on the application interface ....................................................... 103
Table 38: List of parts and accessories ............................................................................ 105
Table 39: Molex sales contacts (subject to change) ......................................................... 106
Table 40: Manufacturer address DBG Holdings Limited ................................................... 106
6 of 109 Page
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Figures
Figure 1: BGS12 system overview ..................................................................................... 21
Figure 2: BGS12 block diagram ......................................................................................... 22
Figure 3: Power supply limits during transmit burst ............................................................ 25
Figure 4: Position of reference points BATT+ and GND ..................................................... 26
Figure 5: ON circuit sample ................................................................................................ 27
Figure 6: ON timing ............................................................................................................ 28
Figure 7: Sample circuit to suppress spikes or glitches on ON signal line .......................... 29
Figure 8: Emergency shutdown/restart timing .................................................................... 30
Figure 9: Switch off behavior .............................................................................................. 33
Figure 10: Timing of CTS signal (example for a 2.12 s paging cycle) ................................. 37
Figure 11: Beginning of power saving if CFUN=7 ............................................................... 38
Figure 12: Power Saving in OFF-state ............................................................................... 38
Figure 13: External SIM card holder circuit......................................................................... 41
Figure 14: VDIG power supply domain ............................................................................... 43
Figure 15: Serial interface ASC0 ........................................................................................ 43
Figure 16: ASC0 startup behavior ...................................................................................... 45
Figure 17: Serial interface ASC1 ........................................................................................ 46
Figure 18: ASC1 startup behavior ...................................................................................... 47
Figure 19: Serial interface ASC2 ........................................................................................ 47
Figure 20: ASC1 startup behavior ...................................................................................... 48
Figure 21: Single ended microphone connection ............................................................... 49
Figure 22: Differential Microphone connection ................................................................... 50
Figure 23: Line Input .......................................................................................................... 50
Figure 24: Differential loudspeaker connection .................................................................. 51
Figure 25: Line output connection ...................................................................................... 51
Figure 26: GPIO startup behavior ...................................................................................... 53
Figure 27: I2C interface connected to VCC of application .................................................. 54
Figure 28: I2C interface connected to VDIG ....................................................................... 54
Figure 29: I2C startup behavior .......................................................................................... 55
Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75 ...................... 56
Figure 31: Jumper settings to enable usage of I2C interface on DSB75 ............................. 57
Figure 32: Status signalling with LED driver ....................................................................... 58
Figure 33: Incoming voice call ............................................................................................ 59
Figure 34: incoming data receive ....................................................................................... 59
Figure 35: URC transmission ............................................................................................. 59
Figure 36: Power indication circuit ..................................................................................... 60
Figure 37: Fast Shutdown timing ........................................................................................ 61
Figure 38: Antenna pads (bottom view) .............................................................................. 62
Figure 39: Embedded Stripline with 65µm prepreg (1080) and 710µm core ....................... 63
Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ..................... 64
Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 ................................ 65
Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 ................................ 66
Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 ................................ 67
Figure 44: Pouting to application‘s RF connector - top view ............................................... 68
Figure 45: Numbering plan for connecting pads (bottom view) ........................................... 71
Figure 46: Audio programming model ................................................................................ 82
Figure 47: BGS12 – top and bottom view ........................................................................... 88
Figure 48: Dimensions of BGS12 (all dimensions in mm) (to be replaced) ......................... 89
Figure 49: Land pattern (top view) (to be replaced) ............................................................ 90
Figure 50: Recommended design for 110 micron thick stencil (top view) ........................... 91
7 of 109 Page
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Figure 51: Recommended design for 150 micron thick stencil (top view) (to be replaced).. 91
Figure 52: Reflow Profile .................................................................................................... 93
Figure 53: Carrier tape ....................................................................................................... 96
Figure 54: Reel direction .................................................................................................... 96
Figure 55: Barcode label on tape reel ................................................................................ 97
Figure 56: Moisture barrier bag (MBB) ............................................................................... 97
Figure 57: Moisture Sensitivity Label.................................................................................. 98
Figure 58: Humidity Indicator Card – HIC ........................................................................... 99
Figure 59: Schematic diagram of BGS12 sample application(to be repaced) ................... 101
Figure 60: EMI circuits ..................................................................................................... 102
Figure 61: Reference equipment for Type Approval ......................................................... 104
8 of 109 Page
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
9 of 109 Page
Contents
1
Introduction
This document describes the hardware of the Cinterion® BGS12 module that connects to the
cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered
for integrating further components.
1.1 Related Documents
[1] Cinterion® BGS12 AT Command Set2
[2] Cinterion® BGS12 Release Note
[3] Application Note 48: SMT Module integration for BGS12
[4] Jamming Detection
[5] Upgrading BGS12 Firmware
[6] BGS12 migration guide
[7] BGS12 Dual SIM/USIM Card Application Note
1.2 Terms and Abbreviations
Abbreviation
ADC Analog-to-digital converter
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0/ASC1/
ASC2
B Thermistor Constant
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
Description
Asynchronous Controller. Abbreviations used for first and second and third
serial interface of BGS12
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
10 of 109
Contents
Abbreviation Description
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. a Gemalto M2M
module)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE
DTR Data Terminal Ready
DTX Discontinuous Transmission
Data Terminal Equipment (typically computer, terminal, printer or, for
example, GSM application)
EFR Enhanced Full Rate
EGSM Enhanced GSM
EIRP Equivalent Isotropic Radiated Power
EMC Electromagnetic Compatibility
ERP Effective Radiated Power
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPIO General Purpose Input/Output
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion/Li+ Lithium-Ion
Li battery Rechargeable Lithium Ion or Lithium Polymer battery
Mbps Mbits per second
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Abbreviation Description
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM module), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
11 of 109
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSK Phase Shift Keying
PSU Power Supply Unit
PWM Pulse Width Modulation
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
RoHS
Restriction of the use of certain hazardous substances in electrical and
electronic equipment.
ROM Read-only Memory
RTC Real Time Clock
RTS Request to Send
Rx Receive Direction
SAR Specific Absorption Rate
SAW Surface Acoustic Wave
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMD Surface Mount Device
SMS Short Message Service
SMT Surface Mount Technology
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Abbreviation Description
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM module)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
1.3 Regulatory and Type Approval Information
1.3.1 Directives and Standards
12 of 109
BGS12 is designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical
specifications provided in the "BGS12 Hardware Interface Description"
Table 1: Directives
RED（2014/53/EU）
Directive 2014/53/EU of the European Parliament and of the
Council of 16 April 2014 on the harmonisation of the laws of the
Member States relating to the making available on the market of
radio equipment and repealing Directive 1999/5/EC Text with EEA
relevance. Applicable as of 13 June 2016.
OJ L 153, 22.5.2014
The product is labeled with the CE conformity mark.
2002/05/EC
Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
FCC ID： QIPBGS12
US Federal Communications Commission
set up according to Communications Act in 1934.
The FCC control the radio, TV, telecom, satellite and cable to
coordinate domestic and international communication.
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
13 of 109
Contents
NOTE: Hereby, Gemalto M2M GmbH declares that this GSM/GPRS Wireless
Module (Model No.:BGS12) is in compliance with the essential requirements and
other relevant provisions of RED 2014/53/EU. This product can be used across EU
member states.
The full text of the EU declaration of conformity is available at the following internet
address: https://www.gemalto.com/m2m
RF exposure information: The Maximum Permissible Exposure (MPE) level has been
calculated based on a distance of d=20 cm between the device and the human body.
To maintain compliance with RF exposure requirement, use product that maintain a
20cm distance between the device and human body.
Table 2: Standards of European type approval
3GPP TS 51.010-1
ETSI EN 301 511
V12.5.1
Digital cellular telecommunications system (Phase 2); Mobile
Station (MS) conformance specification
Global System for Mobile communications (GSM);
Mobile Stations (MS) equipment;
Harmonised Standard covering the essential requirements
of article 3.2 of Directive 2014/53/EU
GCF-CC V3.73.0 Global Certification Forum
ETSI EN 301 489-1
V.2.1.1
Electromagnetic compatibility and Radio spectrum Matters (ERM);
Electro Magnetic Compatibility (EMC) standard for radio
equipment and services
ETSI EN 301 489-52
V1.1.0
Candidate Harmonized European Standard (Telecommunications
series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for
radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular
radio telecommunications systems (GSM and DCS)
Table 3: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
14 of 109
Contents
Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous
Substances in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by
Electronic Information Products” (2006-06).
According to the “Chinese Administration on the
Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e.,
Environmental Protection Use Period, of this product is 20 years as per the symbol shown here,
unless otherwise marked. The EPUP is valid only
as long as the product is operated within the
operating limits described in the Gemalto M2M
Hardware Interface Description.
Please see Table5 for an overview of toxic or hazardous
substances or elements that might be contained in product parts
in concentrations above the limits defined by SJ/T 11363-2006.
Table 5: Toxic or hazardous substances or elements with defined concentration limits
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
15 of 109
Contents
1.3.2 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable BGS12 based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use.
For European markets the relevant directives are mentioned below. It is the responsibility of
the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.
Products intended for sale on European markets
EN 62311:2008 Assessment of electronic and electrical equipment related to human
exposure restrictions for electromagnetic fields (0 Hz - 300 Ghz)
The device complies with RF specifications when the device used at 20 cm form your body.
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
16 of 109
Contents
1.3.3 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating BGS12. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product.
Failure to comply with these precautions violates safety standards of design, manufacture and
intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply
with these precautions.
When in a hospital or other health care facility, observe the restrictions on
the use of mobiles. Switch the cellular terminal or mobile off, if instructed to
do so by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference
from cellular terminals or mobiles placed close to the device. If in doubt about
potential danger, contact the physician or the manufacturer of the device to
verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications
systems. Failure to observe these instructions may lead to the suspension
or denial of cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used
close to TV sets, radios, computers or inadequately shielded equipment.
Follow any special regulations and always switch off the cellular terminal or
mobile wherever forbidden, or when you suspect that it may cause interference or danger.
Road safety comes first! Do not use a handheld cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a handheld terminal or mobile,
park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or
operation can constitute a safety hazard.
Confidential / Released
BGS12 HID_V00.
915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular net-
works. Because of this, connection cannot be guaranteed at all times under
all conditions. Therefore, you should never rely solely upon any wireless
device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services
or phone features are in use (e.g. lock functions, fixed dialing etc.). You may
need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the
cellular terminal or mobile.
Use careful with the earphone maybe possible excessive sound pressure
from earphones and headphones can cause hearing loss.
17 of 109
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Product Concept
2
2.1 Key Features at a Glance
Feature Implementation
General
18 of 109
Frequency bands
GSM class
Output power
(according to Release
99, V5)
Power supply1
Operating temperature
(board temperature)
Physical
RoHS
Quad band : GSM 850/900/1800/1900MHz
Small MS
GSM850 824.2MHz~848.8MHz
GSM:31.5±1dBm
GPRS:31.5±1dBm
PCS1900 1850.2MHz~1909.8MHz GSM:27.5±1dBm
GPRS:27.5±1dBm
EGSM900:880~915MHz GSM:32.8dBm
GPRS:27.3dBm
DCS1800：1710MHz~1785MHz GSM:30.4dBm
GPRS:24.1dBm
3.4V to 4.2V
-10°C to +55°C
Dimensions: 27.6mm x 18.8mm x 2.7mm
Weight: approx. 2.2 g
All hardware components fully compliant with EU RoHS
Directive
GSM/GPRS features
GPRS:
•
Data transfer
SMS
Audio
1. The module operates within a voltage level range from 3.4V up to 4.2V without
restrictions. It is suggested to supply 3.4V to 4.35V on module.
Please add at least 3700uF capacitor to VBAT signal line against GSM burst current
while 3.2V to 3.4V supply for BGS12 module.
Multislot Class 12
•
Mobile Station Class B
•
Coding Scheme 1 – 4
PPP-stack for GPRS data transfer
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 50 SMS locations in mobile equipment
Speech codecs:
•
Half rate HR (ETS 06.20)
•
Full rate FR (ETS 06.10)
•
Enhanced full rate EFR (ETS 06.50/06.60/06.80)
Handsfree operation, echo cancellation, noise suppression,
7 different ringing tones/melodies
Confidential / Released
BGS12 HID_V00.915
2019-01-07
application
and
.
This application note comprises chapters on module mounting and
CINTERION® BGS12 Hardware Interface Description
Contents
Feature Implementation
Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M
TCP/IP stack Protocols: TCP server/client, UDP, HTTP, FTP
Access by AT commands
Firmware update Generic update from host application over ASC1.
Interfaces
19 of 109
Module interface
Surface mount device with solderable connection pads (SMT
interface).
Land grid array (LGA) technology ensures high solder joint reliability
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]
application layout issues as well as on additional SMT application
development equipment.
3 serial interfaces ASC0:
•
8-wire modem interface with status and control lines, unbalanced,
asynchronous
•
Adjustable baud rates: 4,800bps to 230,400bps
•
Autobauding: 4,800bps to 230,400bps
•
Supports RTS0/CTS0 hardware handshake
•
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
•
2-wire, unbalanced asynchronous interface
•
ASC1 operated at Fixed Bit rate 921,600 bps
For firmware upgrade and tracing purpose
ASC2:
•
4-wire, unbalanced asynchronous interface
•
ASC2 operated at Fixed Bit rates from 4,800 bps to 230,400 bps
Supports RTS2/CTS2 hardware handshake
Audio 1 analog interface (with microphone feeding)
UICC interface Supported SIM/USIM cards: 3V, 1.8V
External SIM card reader has to be connected via interface connector
(note that card reader is not part of BGS12)
GPIO interface
GPIO interface with 6 GPIO lines. The GPIO interface is shared with an
I2C interface and LED signalling functionality as well as a jamm- ing
indicator.
Antenna
50
Power on/off, Reset
Power on/off
Switch-on by hardware signal ON
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions
Fast power shutdown by GPIO
Fast power shutdown by AT command
UpgradingReset
Orderly shutdown and reset by AT command
Special features
Real time clock Timer functions via AT commands
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
Feature Implementation
Evaluation kit
20 of 109
Phonebook
SSL security
RLS monitoring
Evaluation module
DSB75
SIM and phone
TLS 1.2
Jamming detection
BGS12 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.
DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for
application engineering. A special adapter setup is required to connect the evaluation module to the DSB75. For more information on
how to setup such a connection please refer to Chapter 9.
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
2.2 BGS12 System Overview
21 of 109
-
6
-
-
2
-
-
1
-
-
1
-
-
1
-
-
2
-
-
1
-
-
2
-
-
8
-
-
2
-
-
4
-
-
5
-
-
1
-
-
1
-
-
1
-
-
1
-
-
1
-
Figure 1: BGS12 system overview
Confidential / Released
-
1
-
-
2
6
-
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
22 of 109
Contents
2.3 Circuit Concept
Figure 2 shows a block diagram of the BGS12 module and illustrates the major functional
components:
Baseband block:
GSM baseband processor and power management
•
Stacked flash/PSRAM memory
•
•
Application interface (SMT with connecting pads)
GSM RF section:
RF transceiver (part of baseband processor IC)
•
•
RF power amplifier/front-end module inc. harmonics filtering
•
Receive Balun
Figure 2: BGS12 block diagram
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
23 of 109
Contents
3
Application Interface
BGS12 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several subinterfaces described in the following sections:
Power supply - see Section 3.2
•
SIM/USIM interface - see Section 3.7
•
Serial interface ASC0 - see Section 3.8
•
•
Serial interface ASC1 - see Section 3.9
•
Serial interface ASC2 - see Section 3.10
Analog audio interface - see Section 3.11
•
Digital audio interface - see Section 3.12
•
GPIO interface - see Section 3.13
•
•
I2C interface - Section 3.14
Jamming indicator - Section 3.15
•
•
Status Control - LED: Section 3.16, RING line: Section 3.17, Power indication: Section 3.18
Fast shutdown - Section 3.19
•
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
24 of 109
Contents
3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 6: Overview of operating modes
Normal
operation
GSM/GPRS
SLEEP
Various power save modes set with AT+CFUN
command.
Software is active to minimum extent. If the module
was registered to the GSM network in IDLE mode, it is
registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode
(AT+CFUN=0) disables the AT interface.
The CYCLIC SLEEP modes AT+CFUN=7 and 9 alternatingly activate and deactivate the AT interfaces
to allow permanent access to all AT commands.
GSM IDLE Software is active. Once registered to the GSM net-
work, paging with BTS is carried out. The module is
ready to send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage
individual settings,such as DTX off/on,FR/EFR/HR,
hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data
is currently sent or received. Power consumption depends on network settings and GPRS configuration
(e.g. multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level), uplink/downlink data rates, GPRS configuration
(e.g. used multislot settings) and reduction of maximum output power.
Power Down Normal shutdown after sending the AT^SMSO command.
Only a voltage regulator is active for powering the RTC. Software is not
active. Interfaces are not accessible.
Operating voltage (connected to BATT+) remains applied.
See the following sections for the various options of waking up BGS12 and proceeding from
one mode to another.
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
25 of 109
Contents
3.2 Power Supply
BGS12 needs to be connected to a power supply at the SMT application interface - 3 lines
each BATT
BATT
+RF
, BATT
+BB
and GND. BATT
+RF
+BB
is for the GSM power amplifier supply.
is for the general power management and
The power supply of BGS12 has to be a single voltage source at BATT
and BATT
+BB
+RF
. It
must be able to provide the peak current during the uplink transmission.
All the key functions for supplying power to the device are handled by the power management
section of the analog controller. This IC provides the following features:
•
Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators and a DC-DC step down switching regulator.
Switches the module's power voltages for the power-up and -down procedures.
•
•
SIM switch to provide SIM power supply.
When power supply is provided on BATT
make sure to avoid that current is flowing from any other source into the module circuit (for example reverse
current from high state external control lines). The controlling application must be designed to prevent reverse
current flow, otherwise there is the risk of damaging the module.
and BATT
+BB
pins and BGS12 has not
+RF
been powered on, please
3.2.1 Minimizing Power Losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage V
never drops below 3.3V on the BGS12 board, not
BATT+
even in a GSM transmit burst where current consumption can rise (for peaks values see the
power supply ratings listed in Section 5.5). It should be noted that BGS12 switches off when
exceeding these limits. Any voltage drops that may occur in a transmit burst should not
exceed 400mV.
The module switches off if the minimum battery voltage (V
) is reached. Example:
BattMin
V
BattLowLimit
D
DropMax
V
BattMin
V
BattMin
= 3.3V
= 0.4V
= V
BattLowLimit
+ D
DropMax
= 3.3V + 0.4V = 3.7V
Figure 3: Power supply limits during transmit burst
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
26 of 109
3.2.2 Measuring the Supply Voltage (V
To measure the supply voltage V
it is possible to define two reference points GND and
BATT+
BATT+
)
BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the
external application the module is mounted on. The external BATT+ reference point has to be
connected to and positioned close to the SMT application interface’s BATT+ pads 5 or 53 as
shown in Figure 4.
Figure 4: Position of reference points BATT+ and GND
3.2.3 Monitoring Power Supply by AT Command
To monitor the supply voltage you can also use the AT^SBV command which returns the value
related to the reference points BATT+ and GND.
The module continuously measures the voltage at intervals. The displayed voltage (in mV) is
averaged over the last measuring period before the AT^SBV command was executed.
If the measured average voltage drops below or rises above the specified voltage shutdown
thresholds, the module will send an "^SBC" URC and shut down. (for details see Section
3.3.5)
3.3 Power Up/Power down Scenarios
In general, be sure not to turn on BGS12 while it is beyond the safety limits of voltage and temperature stated in Chapter 5. BGS12 will immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to
the module.
3.3.1 Turn on BGS12
3.3.1.1
BGS12 can be started as described in the following sections:
Hardware driven switch on by ON line: Starts Normal mode (see Section 3.3.1.1).
Switch on BGS12 Using ON Signal
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
27 of 109
When the operating voltage BATT
+BB
/BATT
is applied, BGS12 can be switched on by
+RF
means of the ON signal.
If the operating voltage BATT
+BB
/BATT
is applied while the ON signal is present for at least
+RF
2s, the BGS12 will be switched on automatically. The startup time is about 4s.
Please also note that if there is no ON signal present right after applying BATT
+BB
/BATT
BGS12 will instead of switching on perform a switch on/off sequence that cannot be avoided.
The switch on/off sequence is about 3.7s.
The ON signal is a high active signal and only allows the input voltage level of the VDDLP
signal. The following Figure 5 shows an example for a switch-on circuit (an alternative switchon possibility is shown in Figure 59).
+RF
,
Figure 5: ON circuit sample
It is recommended to set a serial 1kOhm resistor between the ON circuit and the external
capacitor or battery at the VDDLP power supply. This serial resistor protection is necessary
in case the capacitor or battery has low power (is empty).
Please note that the ON signal is an edge triggered signal. This implies that a micro-second
high pulse on the signal line suffices to almost immediately switch on the module, as shown
in Figure 6. The following Section 3.3.1.2 describes a sample circuit that may be implemented
to prevent possible spikes or glitches on the ON signal line from unintentionally switching on
the module.
Please also note that if the state of the ON signal is coupled to the state of the VDDLP line or
that if the ON signal otherwise remains active high after switch on, it is no longer possible to
switch off BGS12 using the AT command AT^SMSO. Using this command will instead
automatically restart the module.
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
+BB
BATT
BATT
+RF
VDDLP
28 of 109
ON
EMERG_RST
VDIG
A high impulse starts the module up
Figure 6: ON timing
If configured to a fixed bit rate (AT+IPR≠0), the module will send the URC “^SYSSTART” which
notifies the host application that the first AT command can be sent to the module. The duration
until this URC is output varies with the SIM card and may take a couple of seconds, particularly
if the request for the SIM PIN is deactivated on the SIM card.
Please note that no “^SYSSTART” URC will be generated if autobauding (AT+IPR=0) is
enabled.
To allow the application to detect the ready state of the module we recommend using hardware
flow control which can be set with AT\Q (see [1] for details). The default setting is AT\Q0 (no
flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design
does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART”
URC. However, if the URC is not available (due to autobauding), you will simply have to wait
for a period of time (at least 2 seconds) before assuming the module to be in ready state and
before entering any data.
Please note that no data must be sent over the ASC0 interface before the interface is active
and ready to receive data.
3.3.1.2
Suppressing Unintentional Pulses on ON Signal Line
Since the ON signal is edge triggered and a high pulse on the signal line suffices to almost immediately switch on the module, it might be necessary to implement a circuit on the external
application that prevents possible spikes or glitches on the signal line from unintentionally
switching on the module. Figure 7 shows an example for such a circuit.
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
Contents
29 of 109
Figure 7: Sample circuit to suppress spikes or glitches on ON signal line
3.3.2 Restart BGS12
After startup BGS12 can be restarted as described in the following sections:
Software controlled reset by AT+CFUN command: Starts Normal mode (see Section
•
3.3.2.1).
Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.3.2.2)
•
3.3.2.1
To reset and restart the BGS12 module use the command AT+CFUN. You can enter the command AT+CFUN=,1 or 1,1 or 7,1 or 9,1. See [1] for details.
If configured to a fix baud rate (AT+IPR0) the module will send the URC "^SYSSTART" to
notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart.
3.3.2.2
The EMERG_RST signal is internally connected to the central GSM processor. Abrupt
“hardware” shutdown will accur when A low level for more than 1ms is applied to
EMERG_RST pin. BGS12 can be switched on by mean of ON signal after releasing
EMERG_RST.
Note: EMERG_RST is controlled solely cannot restart BGS12, it can only turn BGS12
off at the hardware aspect. If want to achieve restart module like RESET behaver, it
should control ON signal at the same time as described by following paragraph.
For the other solution that high level has always been applied to ON pin, triggering
EMERG_RST will set the processor and with it all the other signal pads to their respective
Restart BGS12 via AT+CFUN Command
Turn off or restart BGS12 Using EMERG_RST
Confidential / Released
BGS12 HID_V00.915
2019-01-07
CINTERION® BGS12 Hardware Interface Description
30 of 109
Contents
reset state. The reset state is described in Section 3.3.3 as well as in the figures showing the
startup behavior of an interface.
After releasing the EMERG_RST line, i.e., with a change of the signal level from low to high,
the module restarts. The other signals continue from their reset state as the module was
switched on by the ON signal.
Figure 8: Emergency shutdown/restart timing
It is recommended to control this EMERG_RST line with an open collector transistor or an open
drain field-effect transistor.
Caution: Use the EMERG_RST line only when, due to serious problems, the software
is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the
loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if BGS12 does not respond, if reset or
shutdown via AT command fails.
3.3.3 Signal States after Startup
Table 7 lists three states each interface signal passes through during reset and firmware in-
itialization:
1) At reset: BGS12 begins to startup and performs the reset action.
Confidential / Released
Loading...