Gemalto M2M AC75 User Manual

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AC65/AC75 Siemens Cellular Engines

Version: 00.372 DocID: AC65/AC75_hd_v00.372

Hardware Interface Descri

AC65/AC75 Hardware Interface Description

Confidential / Preliminary

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AC65/AC75 Hardware Interface Description

00.372

August 03, 2006

AC65/AC75_hd_v00.372

Confidential / Preliminary

General note

Product is deemed accepted by Recipient and is provided without interface to Recipient´s products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time.

Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.

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Contents

0 Document History .........................................................................................................7

1 Introduction ...................................................................................................................9

1.1 Related Documents ...............................................................................................9

1.2 Terms and Abbreviations.....................................................................................10

1.3 Type Approval......................................................................................................13

1.3.1 SAR Requirements Specific to Portable Mobiles...................................15

1.4 Safety Precautions...............................................................................................16

2 Product Concept .........................................................................................................18

2.1 Key Features at a Glance ....................................................................................18

2.2 AC65/AC75 System Overview.............................................................................21

2.3 Circuit Concept ....................................................................................................22

3 Application Interface...................................................................................................23

3.1 Operating Modes .................................................................................................24

3.2 Power Supply.......................................................................................................26

3.2.1 Minimizing Power Losses ......................................................................26

3.2.2 Measuring the Supply Voltage V

3.2.3 Monitoring Power Supply by AT Command ...........................................27

3.3 Power-Up / Power-Down Scenarios ....................................................................28

3.3.1 Turn on AC65/AC75...............................................................................28

3.3.1.1 Turn on AC65/AC75 Using Ignition Line IGT ......................................... 28

3.3.1.2 Configuring the IGT Line for Use as ON/OFF Switch ............................31

3.3.1.3 Turn on AC65/AC75 Using the VCHARGE Signal.................................32

3.3.1.4 Reset AC65/AC75 via AT+CFUN Command.........................................32

3.3.1.5 Reset or Turn off AC65/AC75 in Case of Emergency............................33

3.3.1.6 Using EMERG_RST to Reset Application(s) or External Device(s).......33

3.3.2 Signal States after Startup.....................................................................34

3.3.3 Turn off AC65/AC75...............................................................................36

3.3.3.1 Turn off AC65/AC75 Using AT Command .............................................36

3.3.3.2 Leakage Current in Power-Down Mode.................................................37

3.3.3.3 Turn on/off AC65/AC75 Applications with Integrated USB ....................38

3.3.4 Automatic Shutdown .............................................................................. 39

3.3.4.1 Thermal Shutdown.................................................................................39

3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions ......................40

3.3.4.3 Monitoring the Board Temperature of AC65/AC75 ................................40

3.3.4.4 Undervoltage Shutdown if Battery NTC is Present ................................40

3.3.4.5 Undervoltage Shutdown if no Battery NTC is Present ...........................41

3.3.4.6 Overvoltage Shutdown...........................................................................41

3.4 Automatic EGPRS/GPRS Multislot Class Change ..............................................42

3.5 Charging Control..................................................................................................43

3.5.1 Hardware Requirements ........................................................................43

3.5.2 Software Requirements .........................................................................43

3.5.3 Battery Pack Requirements ...................................................................44

3.5.4 Charger Requirements...........................................................................45

3.5.5 Implemented Charging Technique.........................................................46

3.5.6 Operating Modes during Charging.........................................................47

3.6 Power Saving.......................................................................................................49

3.6.1 Network Dependency of SLEEP Modes ................................................49

3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7..........................50

3.6.3 Timing of the RTSx Signal in CYCLIC SLEEP Mode 9..........................50

3.7 Summary of State Transitions (Except SLEEP Mode).........................................51

....................................................27

BATT+

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3.8 RTC Backup ........................................................................................................52

3.9 SIM Interface .......................................................................................................53

3.9.1 Installation Advice..................................................................................54

3.10 Serial Interface ASC0 ..........................................................................................55

3.11 Serial Interface ASC1 ..........................................................................................57

3.12 USB Interface ......................................................................................................58

3.13 I2C Interface ......................................................................................................... 59

3.14 SPI Interface ........................................................................................................61

3.15 Audio Interfaces...................................................................................................63

3.15.1 Speech Processing................................................................................64

3.15.2 Microphone Circuit.................................................................................64

3.15.2.1 Single-ended Microphone Input.............................................................65

3.15.2.2 Differential Microphone Input.................................................................66

3.15.2.3 Line Input Configuration with OpAmp ....................................................67

3.15.3 Loudspeaker Circuit...............................................................................68

3.15.4 Digital Audio Interface (DAI) ..................................................................69

3.15.4.1 Master Mode..........................................................................................70

3.15.4.2 Slave Mode............................................................................................72

3.16 GPIO Interface.....................................................................................................74

3.16.1 Using the GPIO10 Pin as Pulse Counter ............................................... 74

3.17 Control Signals ....................................................................................................75

3.17.1 Synchronization Signal ..........................................................................75

3.17.2 Using the SYNC Pin to Control a Status LED........................................76

3.17.3 Behavior of the RING0 Line (ASC0 Interface only)................................77

3.17.4 PWR_IND Signal ...................................................................................77

4 Antenna Interface........................................................................................................ 78

4.1 Antenna Diagnostic..............................................................................................79

4.2 Antenna Connector..............................................................................................80

5 Electrical, Reliability and Radio Characteristics......................................................82

5.1 Absolute Maximum Ratings .................................................................................82

5.2 Operating Temperatures......................................................................................83

5.3 Storage Conditions ..............................................................................................84

5.4 Reliability Characteristics.....................................................................................85

5.5 Pin Assignment and Signal Description...............................................................86

5.6 Power Supply Ratings .........................................................................................93

5.7 Electrical Characteristics of the Voiceband Part..................................................96

5.7.1 Setting Audio Parameters by AT Commands ........................................96

5.7.2 Audio Programming Model ....................................................................97

5.7.3 Characteristics of Audio Modes .............................................................98

5.7.4 Voiceband Receive Path........................................................................99

5.7.5 Voiceband Transmit Path.....................................................................100

5.8 Air Interface .......................................................................................................101

5.9 Electrostatic Discharge ......................................................................................102

6 Mechanics..................................................................................................................103

6.1 Mechanical Dimensions of AC65/AC75.............................................................103

6.2 Mounting AC65/AC75 to the Application Platform .............................................105

6.3 Board-to-Board Application Connector ..............................................................106

7 Sample Application................................................................................................... 109

8 Reference Approval ..................................................................................................111

8.1 Reference Equipment for Type Approval...........................................................111

8.2 Compliance with FCC Rules and Regulations...................................................112

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9 Appendix....................................................................................................................113

9.1 List of Parts and Accessories ............................................................................113

9.2 Fasteners and Fixings for Electronic Equipment ...............................................115

9.2.1 Fasteners from German Supplier ETTINGER GmbH ..........................115

Tables

Table 1: Directives..................................................................................................................13

Table 2: Standards of North American type approval ............................................................13

Table 3: Standards of European type approval...................................................................... 14

Table 4: Requirements of quality............................................................................................ 14

Table 5: Overview of operating modes................................................................................... 24

Table 6: Signal states.............................................................................................................34

Table 7: Temperature dependent behavior ............................................................................40

Table 8: Specifications of battery packs suitable for use with AC65/AC75 ............................ 45

Table 9: AT commands available in Charge-only mode......................................................... 47

Table 10: Comparison Charge-only and Charge mode.......................................................... 48

Table 11: State transitions of AC65/AC75 (except SLEEP mode) .........................................51

Table 12: Signals of the SIM interface (board-to-board connector) .......................................53

Table 13: DCE-DTE wiring of ASC0....................................................................................... 56

Table 14: DCE-DTE wiring of ASC1....................................................................................... 57

Table 15: Configuration combinations for the PCM interface................................................. 69

Table 16: Overview of DAI pin functions ................................................................................ 70

Table 17: Return loss in the active band ................................................................................ 78

Table 18: Values of the AT^SAD parameter <diag> and their meaning................................. 79

Table 19: Product specifications of Rosenberger SMP connector ......................................... 80

Table 20: Absolute maximum ratings .....................................................................................82

Table 21: Board temperature .................................................................................................83

Table 22: Ambient temperature according to IEC 60068-2 (without forced air circulation) ....83

Table 23: Charging temperature ............................................................................................83

Table 24: Storage conditions.................................................................................................. 84

Table 25: Summary of reliability test conditions .....................................................................85

Table 26: Signal description................................................................................................... 87

Table 27: Power supply ratings ..............................................................................................93

Table 28: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz..........94

Table 29: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz......95

Table 30: Audio parameters adjustable by AT command ......................................................96

Table 31: Voiceband characteristics (typical)......................................................................... 98

Table 32: Voiceband receive path..........................................................................................99

Table 33: Voiceband transmit path....................................................................................... 100

Table 34: Air Interface .......................................................................................................... 101

Table 35: Measured electrostatic values..............................................................................102

Table 36: Technical specifications of Molex board-to-board connector ...............................106

Table 37: List of parts and accessories................................................................................ 113

Table 38: Molex sales contacts (subject to change) ............................................................114

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Figures

Figure 1: AC65/AC75 system overview.................................................................................. 21

Figure 2: AC65/AC75 block diagram...................................................................................... 22

Figure 3: Power supply limits during transmit burst................................................................ 27

Figure 4: Position of the reference points BATT+ and GND .................................................. 27

Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT.............. 29

Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+ .......30

Figure 7: Timing of IGT if used as ON/OFF switch ................................................................31

Figure 8: Signal states during turn-off procedure ................................................................... 37

Figure 9: Battery pack circuit diagram....................................................................................44

Figure 10: Power saving and paging...................................................................................... 49

Figure 11: Timing of CTSx signal (if CFUN= 7)...................................................................... 50

Figure 12: Timing of RTSx signal (if CFUN = 9)..................................................................... 50

Figure 13: RTC supply from capacitor.................................................................................... 52

Figure 14: RTC supply from rechargeable battery ................................................................. 52

Figure 15: RTC supply from non-chargeable battery ............................................................. 52

Figure 16: Serial interface ASC0............................................................................................ 55

Figure 17: Serial interface ASC1............................................................................................ 57

Figure 18: USB circuit ............................................................................................................58

Figure 19: I2C interface connected to VCC of application .....................................................59

Figure 20: I2C interface connected to VEXT line of AC65/AC75 ........................................... 60

Figure 21: SPI interface..........................................................................................................61

Figure 22: Characteristics of SPI modes................................................................................ 62

Figure 23: Audio block diagram.............................................................................................. 63

Figure 24: Single ended microphone input............................................................................. 65

Figure 25: Differential microphone input ................................................................................66

Figure 26: Line input configuration with OpAmp ....................................................................67

Figure 27: Differential loudspeaker configuration................................................................... 68

Figure 28: Master PCM interface Application......................................................................... 70

Figure 29: Master PCM timing, short frame selected .............................................................71

Figure 30: Master PCM timing, long frame selected .............................................................. 71

Figure 31: Slave PCM interface application ........................................................................... 72

Figure 32: Slave PCM timing, short frame selected ...............................................................73

Figure 33: Slave PCM timing, long frame selected ................................................................ 73

Figure 34: SYNC signal during transmit burst ........................................................................75

Figure 35: LED Circuit (Example)........................................................................................... 76

Figure 36: Incoming voice/fax/data call ..................................................................................77

Figure 37: URC transmission ................................................................................................. 77

Figure 38: Resistor measurement used for antenna detection ..............................................79

Figure 39: Datasheet of Rosenberger SMP MIL-Std 348-A connector .................................. 81

Figure 40: Pin assignment (component side of AC65/AC75)................................................. 86

Figure 41: Audio programming model ....................................................................................97

Figure 42: AC65/AC75 – top view ........................................................................................103

Figure 43: Dimensions of AC65/AC75 .................................................................................104

Figure 44: Molex board-to-board connector 52991-0808 on AC65/AC75............................ 107

Figure 45: Mating board-to-board connector 53748-0808 on application ............................108

Figure 46: AC65/AC75 sample application for Java............................................................. 110

Figure 47: Reference equipment for Type Approval ............................................................111

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0 Document History

Preceding document: "AC75 Hardware Interface Description" Version 00.251 New document: "AC65/AC75 Hardware Interface Description" Version 00.372

Chapter What is new

Throughout document

1 Added AC65 and general statement on difference between AC65 and AC75.

1.3 Updated list of standards.

1.3.1 Every portable mobile shall have an FCC Grant and IC Certificate of its own.

1.4 Added note on audio safety precautions.

3.5, 9 Removed all information related to specific types of batteries and specific vendors.

3.9 Removed note on required restart of module after removing and reinserting a SIM

3.12 Removed section describing USB modem installation. For installation details see [11].

3.15.4.1 Corrected description of master PCM timing with long or short frame selected.

3.15.4.2 Updated timing for slave mode of PCM interface (Figure 32 and Figure 33).

5.1 Added remark on SELV compliance.

5.5 Table 26: Modified RTC input voltage values (RTC Backup VDDLP).

5.6 Table 27: Different current consumption depending on whether autobauding enabled /

8.2 Added FCC and IC identifiers for AC65. Changed notes on mobile and fixed devices,

Added new product: AC65 module

card during operation.

disabled.

added note on portable mobiles.

9.1 Added AC65 incl. Siemens ordering numbers.

Preceding document: "AC75 Hardware Interface Description" Version 00.202 New document: "AC75 Hardware Interface Description" Version 00.251

Chapter What is new

3.3.4.2 Corrected description of deferred shutdown.

3.3.4.4 to

3.3.4.6

3.5.3 Added overdischarge release voltage 2.6V

9.1 Specified Siemens ordering numbers for AC75.

Alert URCs for undervoltage and overvoltage do not need to enabled by the user.

Preceding document: "AC75 Hardware Interface Description" Version 00.020 New document: "AC75 Hardware Interface Description" Version 00.202

Chapter What is new

3.3.2 New chapter: Signal States after Startup.

3.3.1.1 More detailed description of IGT timing depending on Power-down or Charge-only mode. Added further details on timing after power-up. Added alert message “SHUTDOWN after Illegal PowerUp”

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Chapter What is new

3.3.1.2 New chapter: Configuring the IGT Line for Use as ON/OFF Switch

3.3.4.1 Revised Table 7: Temperature dependent behavior.

3.3.4.2,

3.3.4.3

3.4 Minor text change.

3.3.1.3,

3.5.6, 3.7

3.5.6, 3.7 Added transition from Charge-only to Normal mode by switching off Airplane mode.

3.6 Added chapter on power saving.

3.12 AC75 does not support generic USB 2.0 High Speed hubs.

3.15.2.2 Added remarks on VMIC behaviour.

3.15.2.3 Replaced remark on VMIC behaviour.

3.15.4 Added Table 15: Configuration combinations for the PCM interface

5.1 New maximum values for voltage at analog pins with VMIC on/off.

5.2 Specified operating board temperature.

5.5

5.7 New chapter: Electrical Characteristics of the Voiceband Part

Changed description. Added new section.

To change from Charge-only mode to Normal mode the IGT line must be pulled low for at least 1s and then released. High state of IGT lets AC75 enter Normal mode.

Table 22: Temperature specified for charging is battery temperature (not ambient)

Specified internal pull-down resistors 330kΩ at TXD0, RXD0, TXD1, RXD1. Changed all

VIHmin values from 2.0 to 2.15V. Corrected overview table: USB_DP was listed in

wrong row.

7 Modified description for Java “System.out” in sample application.

9 New datasheet for recommended VARTA PoLiFlex® Lithium polymer battery.

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1 Introduction

This document applies to the following Siemens products:

• AC65 Module

• AC75 Module

The document describes the hardware of the AC65 and the AC75, both designed to connect to a cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.

The difference between both modules is that AC75 additionally features EGPRS. Please note that except for EGPRS specific statements, all information provided below applies to both module types.

Throughout the document, both modules are generally referred to as AC65/AC75.

1.1 Related Documents

[1] AC65 AT Command Set 00.372 AC75 AT Command Set 00.372 [2] AC65/AC75 Release Notes 00.372 [3] DSB75 Support Box - Evaluation Kit for Siemens Cellular Engines [4] Application Note 02: Audio Interface Design for GSM Applications (AC65, AC75) [5] Application Note 07: Rechargeable Lithium Batteries in GSM Applications [6] Application Note 16: Upgrading Firmware on MC75, TC6x, AC65, AC75 [7] Application Note 17: Over-The-Air Firmware Update for TC65, AC65, AC75 [8] Application Note 22: Using TTY / CTM Equipment [9] Application Note 26: Power Supply Design for GSM Applications [10] Application Note 24: Application Developer’s Guide [11] Application Note 32: Integrating USB into MC75, TC6x, AC65, AC75 Applications [12] Multiplexer User's Guide [13] Multiplex Driver Developer’s Guide for Windows 2000 and Windows XP [14] Multiplex Driver Installation Guide for Windows 2000 and Windows XP [15] Remote SAT User’s Guide for MC75, TC6x, AC65, AC75 [16] Java User’s Guide for TC65, AC65, AC75 [17] Java doc \wtk\doc\html\index.html

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1.2 Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AGC Automatic Gain Control

ANSI American National Standards Institute

ARFCN Absolute Radio Frequency Channel Number

ARP Antenna Reference Point

ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of

AC65/AC75

B Thermistor Constant

B2B Board-to-board connector

BER Bit Error Rate

BTS Base Transceiver Station

CB or CBM Cell Broadcast Message

CE Conformité Européene (European Conformity)

CHAP Challenge Handshake Authentication Protocol

CPU Central Processing Unit

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DAC Digital-to-Analog Converter

DAI Digital Audio Interface

dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law

DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)

DCS 1800 Digital Cellular System, also referred to as PCN

DRX Discontinuous Reception

DSB Development Support Box

DSP Digital Signal Processor

DSR Data Set Ready

DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM

application)

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

EGSM Enhanced GSM

EIRP Equivalent Isotropic Radiated Power

EMC Electromagnetic Compatibility

ERP Effective Radiated Power

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Abbreviation Description

ESD Electrostatic Discharge

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)

FDMA Frequency Division Multiple Access

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPIO General Purpose Input/Output

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

HiZ High Impedance

HR Half Rate

I/O Input/Output

IC Integrated Circuit

IMEI International Mobile Equipment Identity

ISO International Standards Organization

ITU International Telecommunications Union

kbps kbits per second

LED Light Emitting Diode

Li-Ion / Li+ Lithium-Ion

Li battery Rechargeable Lithium Ion or Lithium Polymer battery

Mbps Mbits per second

MMI Man Machine Interface

MO Mobile Originated

MS Mobile Station (GSM engine), also referred to as TE

MSISDN Mobile Station International ISDN number

MT Mobile Terminated

NTC Negative Temperature Coefficient

OEM Original Equipment Manufacturer

PA Power Amplifier

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PCL Power Control Level

PCM Pulse Code Modulation

PCN Personal Communications Network, also referred to as DCS 1800

PCS Personal Communication System, also referred to as GSM 1900

PDU Protocol Data Unit

PLL Phase Locked Loop

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Abbreviation Description

PPP Point-to-point protocol

PSK Phase Shift Keying

PSU Power Supply Unit

R&TTE Radio and Telecommunication Terminal Equipment

RAM Random Access Memory

RF Radio Frequency

RMS Root Mean Square (value)

ROM Read-only Memory

RTC Real Time Clock

RTS Request to Send

Rx Receive Direction

SAR Specific Absorption Rate

SELV Safety Extra Low Voltage

SIM Subscriber Identification Module

SMS Short Message Service

SPI Serial Peripheral Interface

SRAM Static Random Access Memory

TA Terminal adapter (e.g. GSM engine)

TDMA Time Division Multiple Access

TE Terminal Equipment, also referred to as DTE

Tx Transmit Direction

UART Universal asynchronous receiver-transmitter

URC Unsolicited Result Code

USB Universal Serial Bus

USSD Unstructured Supplementary Service Data

VSWR Voltage Standing Wave Ratio

Phonebook abbreviations

FD SIM fixdialing phonebook

LD SIM last dialing phonebook (list of numbers most recently dialed)

MC Mobile Equipment list of unanswered MT calls (missed calls)

ME Mobile Equipment phonebook

ON Own numbers (MSISDNs) stored on SIM or ME

RC Mobile Equipment list of received calls

SM SIM phonebook

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1.3 Type Approval

AC65/AC75 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed.

Table 1: Directives

99/05/EC Directive of the European Parliament and of the council of 9

March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC).

The product is labeled with the CE conformity mark

89/336/EC Directive on electromagnetic compatibility

73/23/EC Directive on electrical equipment designed for use within certain

voltage limits (Low Voltage Directive)

95/94/EC Automotive EMC directive

2002/95/EC Directive of the European Parliament and of the

Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

Table 2: Standards of North American type approval

CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommuni-

cations, PCS); US Equipment Authorization FCC

UL 60 950 Product Safety Certification (Safety requirements)

NAPRD.03 V3.6.1 Overview of PCS Type certification review board Mobile

Equipment Type Certification and IMEI control

PCS Type Certification Review board (PTCRB)

RSS133 (Issue2) Canadian Standard

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Table 3: Standards of European type approval

3GPP TS 51.010-1 Digital cellular telecommunications system (Phase 2); Mobile

Station (MS) conformance specification

ETSI EN 301 511 V9.0.2

GCF-CC V3.21.0 Global Certification Forum - Certification Criteria

ETSI EN 301 489-1 V1.4.1

ETSI EN 301 489-7 V1.2.1 (2000-09)

IEC/EN 60950-1 (2001)

Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article

3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)

Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)

Safety of information technology equipment (2000)

Table 4: Requirements of quality

IEC 60068 Environmental testing

DIN EN 60529 IP codes

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1.3.1 SAR Requirements Specific to Portable Mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable AC65/AC75 based applications to be evaluated and approved for compliance with national and/or international regulations.

Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.

Products intended for sale on US markets

ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to

Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz

Products intended for sale on European markets

EN 50360 Product standard to demonstrate the compliance of mobile phones

with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)

IMPORTANT:

Manufacturers of portable applications based on AC65/AC75 modules are required to have their final product certified and apply for their own FCC Grant and IC Certificate related to the specific portable mobile. See also Chapter 8.2.

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1.4 Safety Precautions

The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating AC65/AC75. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer’s failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions on the

use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.

The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.

Switch off the cellular terminal or mobile before boarding an aircraft. Make

sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable

gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency

energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.

Road safety comes first! Do not use a hand-held cellular terminal or mobile

when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.

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IMPORTANT!

SOS

Bear in mind that exposure to excessive levels of noise can cause physical

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.

Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.

Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

damage to users! With regard to acoustic shock, the cellular application must be designed to avoid unintentional increase of amplification, e.g. for a highly sensitive earpiece. A protection circuit should be implemented in the cellular application.

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2 Product Concept

2.1 Key Features at a Glance

Feature Implementation

General

Frequency bands Quad band: GSM 850/900/1800/1900MHz

GSM class Small MS

Output power (according to Release 99, V5)

Power supply 3.3V to 4.5V

Ambient operating temperature according to IEC 60068-2

Physical Dimensions: 33.9mm x 55mm x max. 4mm

Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900

AC75 only: Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK

The values stated above are maximum limits. According to Release 99, Version 5, the maximum output power in a multislot configuration may be lower. The nominal reduction of maximum output power varies with the number of uplink timeslots used and amounts to 3.0dB for 2Tx, 4.8dB for 3Tx and 6.0dB for 4Tx.

Normal operation -30°C to +75°C Restricted operation -30°C / +85°C

Weight: approx. 8.5g

RoHS All hardware components fully compliant with EU RoHS Directive

GSM / GPRS / EGPRS features

Data transfer GPRS

• Multislot Class 12

• Full PBCCH support

• Mobile Station Class B

• Coding Scheme 1 – 4

EGPRS (AC75 only)

• Multislot Class 10

• Mobile Station Class B

• Modulation and Coding Scheme MCS 1 – 9

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Feature Implementation

CSD

• V.110, RLP, non-transparent

• 2.4, 4.8, 9.6, 14.4kbps

• USSD

PPP-stack for GPRS data transfer

SMS

Fax Group 3; Class 1

Audio Speech codecs:

Software

AT commands AT-Hayes GSM 07.05 and 07.07, Siemens

MicrosoftTM compatibility RIL / NDIS for Pocket PC and Smartphone

Java platform JDK Version: 1.4.2_09

• Point-to-point MT and MO

• Cell broadcast

• Text and PDU mode

• Storage: SIM card plus 25 SMS locations in mobile equipment

• Transmission of SMS alternatively over CSD or GPRS.

Preferred mode can be user defined.

• Half rate HR (ETS 06.20)

• Full rate FR (ETS 06.10)

• Enhanced full rate EFR (ETS 06.50/06.60/06.80)

• Adaptive Multi Rate AMR

Speakerphone operation (VDA), echo cancellation, noise suppression, DTMF, 7 ringing tones

AT commands for RIL compatibility (NDIS/RIL)

Java Virtual Machine with APIs for AT Parser, Serial Interface, FlashFileSystem and TCP/IP Stack. Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely cost-efficient hardware and software design – ideal platform for industrial GSM applications. The memory space available for Java programs is around 1.7 MB in the flash file system and around 400k RAM. Application code and data share the space in the flash file system and in RAM.

SIM Application Toolkit SAT Release 99

TCP/IP stack Access by AT commands

IP addresses IP version 6

Remote SIM Access AC65/AC75 supports Remote SIM Access. RSA enables

AC65/AC75 to use a remote SIM card via its serial interface and an external application, in addition to the SIM card locally attached to the dedicated lines of the application interface. The connection between the external application and the remote SIM card can be a Bluetooth wireless link or a serial link. The necessary protocols and procedures are implemented according to the “SIM Access Profile Interoperability Specification of the Bluetooth Special Interest Group”.

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Feature Implementation

Firmware update Generic update from host application over ASC0, ASC1 or USB.

Over-the-air (OTA) firmware update is possible via SPI interface.

Interfaces

2 serial interfaces

USB Supports a USB 2.0 Full Speed (12Mbit/s) slave interface.

I2C I2C bus for 7-bit addressing and transmission rates up to 400kbps.

SPI Serial Peripheral Interface for transmission rates up to 6.5 Mbps.

ASC0:

• 8-wire modem interface with status and control lines,

unbalanced, asynchronous

• Fixed bit rates: 300 bps to 460,800 bps

• Autobauding: 1,200 bps to 460,800 bps

• RTS0/CTS0 and XON/XOFF flow control.

• Multiplex ability according to GSM 07.10 Multiplexer Protocol.

ASC1:

• 4-wire, unbalanced asynchronous interface

• Fixed bit rates: 300 bps to 460,800 bps

• RTS1/CTS1 and software XON/XOFF flow control

Programmable with AT^SSPI command. Alternatively, all pins of the I²C interface are configurable as SPI.

Programmable with AT^SSPI command. If the SPI is active the I²C interface is not available.

Audio

SIM interface Supported SIM cards: 3V, 1.8V

Antenna

Module interface 80-pin board-to-board connector

Power on/off, Reset

Power on/off

Reset

Special features

Charging Supports management of rechargeable Lithium Ion and Lithium

• 2 analog interfaces (2 microphone inputs and 2 headphone

outputs with microphone power supply)

• 1 digital interface (PCM)

• 50Ohms. External antenna can be connected via antenna

connector.

• Antenna diagnostic

• Switch-on by hardware pin IGT

• Switch-off by AT command (AT^SMSO)

• Automatic switch-off in case of critical temperature and

voltage conditions.

• Orderly shutdown and reset by AT command

• Emergency reset by hardware pin EMERG_RST and IGT.

Polymer batteries

Real time clock Timer functions via AT commands

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Feature Implementation

GPIO 10 I/O pins of the application interface programmable as GPIO.

Programming is done via AT commands. Alternatively, GPIO pin10 is configurable as pulse counter.

Pulse counter Pulse counter for measuring pulse rates from 0 to 1000 pulses

per second. If the pulse counter is active the GPIO10 pin is not available.

DAC output Digital-to-Analog Converter which can provide a PWM signal.

Phonebook SIM and phone

Evaluation kit

DSB75 DSB75 Evaluation Board designed to test and type approve

Siemens cellular engines and provide a sample configuration for application engineering.

2.2 AC65/AC75 System Overview

AC65 / AC75

ASC1

Digital

Audio

Codec

USB

Pulse Counter

USB Host

Antenna

Interface

GPIO

9 x

GPIO

SPI

Slave

SPI

I2C

Slave

Antenna

Diagnostic

I2C

SIM

Application Interface

ASC0

(modem)

card

UART

SIM

Analog

Audio

Headphones

or Headsets

Charge

Charging

DAC

Power

Supply

circuit

Charger

User Application

Figure 1: AC65/AC75 system overview

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2.3 Circuit Concept

Figure 1 shows a block diagram of the AC65/AC75 module and illustrates the major functional components:

Baseband block:

• Digital baseband processor with DSP

• Analog processor with power supply unit (PSU)

• Flash / SRAM (stacked)

• Application interface (board-to-board connector)

• Antenna diagnostic

RF section:

• RF transceiver

• RF power amplifier

• RF front end

• Antenna connector

Antenna

Diagnostic

Front End

RF Power

Amplifier

RF-Part

Transceiver

NTC

AC65/AC75

Measuring

Network

26MHz

32.768kHz

Interface RF - Baseband

RF Control Bus

I / Q

Digital Baseband

Processer with DSP

RTC

CCIN CCRST

CCIO CCCLK CCVCC

Analog

Controller

with PSU

REFCHG

TEMP2

BATTYPE

ADC

Reset

RESET

D(0:15)

A(0:24)

RD; WR; CS; WAIT

SRAM

Flash

ASC(0)

ASC(1)

I2C/SPI

SPI

USB

GPIO

DAI

SYNC

SIM Interface

PWR_IND

VEXT

DAC_OUT

EMERG_RST

Audio analog

IGT

VDDLP

CHARGEGATE

VCHARGE

ISENSE

VSENSE

BATT_TEMP

BATT+

5 8

GND

Application Interface (80 pin)

Figure 2: AC65/AC75 block diagram

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3 Application Interface

AC65/AC75 is equipped with an 80-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces described in the following chapters:

• Power supply - see Chapter 3.1

• Charger interface – see Chapter 3.5

• SIM interface - see Chapter 3.9

• Serial interface ASC0 - see Chapter 3.10

• Serial interface ASC1 - see Chapter 3.11

• Serial interface USB - see Chapter 3.12

• Serial interface I²C/SPI - see Chapter 3.13 and 3.14

• Two analog audio interfaces - see Chapter 3.15

• Digital audio interface (DAI) - see Chapter 3.15 and 3.15.4

• 10 lines GPIO interface – see Chapter 3.16

• Status and control lines: IGT, EMERG_RST, PWR_IND, SYNC - see Table 26

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3.1 Operating Modes

The table below briefly summarizes the various operating modes referred to in the following chapters.

Table 5: Overview of operating modes

Normal operation

GSM / GPRS SLEEP Various power save modes set with AT+CFUN

command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=7 and 9 alternatingly activate and deactivate the AT interfaces to allow permanent access to all AT commands.

GSM IDLE Software is active. Once registered to the GSM

network, paging with BTS is carried out. The module is ready to send and receive.

GSM TALK Connection between two subscribers is in progress.

Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna.

GPRS IDLE EGPRS IDLE

Module is ready for GPRS/EGPRS data transfer, but no data is currently sent or received. Power consumption depends on network settings and GPRS/EGPRS configuration (e.g. multislot settings).

GPRS DATA EGPRS DATA

POWER DOWN Normal shutdown after sending the AT^SMSO command.

Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.

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GPRS/EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates, GPRS configuration (e.g. used multislot settings) and reduction of maximum output power.

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Airplane mode Airplane mode shuts down the radio part of the module, causes the module to

log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by using the AT commands AT^SCFG and AT+CALA:

• With AT^SCFG=MEopMode/Airplane/OnStart the module can be configured

to enter the Airplane mode each time when switched on or reset.

• The parameter AT^SCFG=MEopMode/Airplane can be used to switch back

and forth between Normal mode and Airplane mode any time during operation.

• Setting an alarm time with AT+CALA followed by AT^SMSO wakes the

module up into Airplane mode at the scheduled time.

Charge-only mode Limited operation for battery powered applications. Enables charging while

module is detached from GSM network. Limited number of AT commands is accessible. Charge-only mode applies when the charger is connected if the module was powered down with AT^SMSO.

Charge mode during normal operation

See Table 11 for the various options proceeding from one mode to another.

Normal operation (SLEEP, IDLE, TALK, GPRS/EGPRS IDLE, GPRS/EGPRS DATA) and charging running in parallel. Charge mode changes to Charge-only mode when the module is powered down before charging has been completed.

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3.2 Power Supply

AC65/AC75 needs to be connected to a power supply at the B2B connector (5 pins each BATT+ and GND).

The power supply of AC65/AC75 has to be a single voltage source at BATT+. It must be able to provide the peak current during the uplink transmission.

All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

• Stabilizes the supply voltages for the GSM baseband using low drop linear voltage

regulators.

• Switches the module's power voltages for the power-up and -down procedures.

• Delivers, across the VEXT pin, a regulated voltage for an external application. This

voltage is not available in Power-down mode.

• SIM switch to provide SIM power supply.

3.2.1 Minimizing Power Losses

When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage V board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that AC65/AC75 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV.

The measurement network monitors outburst and inburst values. The drop is the difference of both values. The maximum drop (Dmax) since the last start of the module will be saved. In IDLE and SLEEP mode, the module switches off if the minimum battery voltage (V reached.

Example: V

min = 3.3V

Dmax = 0.4V

min = VImin + Dmax

batt

min = 3.3V + 0.4V = 3.7V

batt

The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered.

Note: If the application design requires an adapter cable between both board-to-board

connectors, use a flex cable as short as possible in order to minimize power losses.

never drops below 3.3V on the AC65/AC75

BATT+

min) is

batt

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Example: If the length of the flex cable reaches the maximum length of 100mm, this

connection may cause, for example, a resistance of 30m in the BATT+ line and 30m in the GND line. As a result, a 2A transmit burst would add up to a total voltage drop of 120mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery including its protection circuit.

Figure 3: Power supply limits during transmit burst

3.2.2 Measuring the Supply Voltage V

The reference points for measuring the supply voltage V GND, both accessible at a capacitor located close to the board-to-board connector of the module.

Reference point BATT+

Figure 4: Position of the reference points BATT+ and GND

Reference point GND

BATT+

on the module are BATT+ and

3.2.3 Monitoring Power Supply by AT Command

To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND.

The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when AC65/AC75 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.

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3.3 Power-Up / Power-Down Scenarios

In general, be sure not to turn on AC65/AC75 while it is beyond the safety limits of voltage and temperature stated in Chapter 5.1. AC65/AC75 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module.

3.3.1 Turn on AC65/AC75

AC65/AC75 can be started in a variety of ways as described in the following sections:

• Hardware driven start-up by IGT line: starts Normal mode or Airplane mode (see Section

3.3.1.1)

• Software controlled reset by AT+CFUN command: starts Normal mode or Airplane mode

(see Section 3.3.1.4)

• Hardware driven start-up by VCHARGE line: starts charging algorithm and Charge-only

mode (see Section 3.3.1.3)

• Wake-up from Power-down mode by using RTC interrupt: starts Airplane mode

The option whether to start into Normal mode or Airplane mode depends on the settings made with the AT^SCFG command or AT+CALA. With AT+CALA, followed by AT^SMSO the module can be configured to restart into Airplane mode at a scheduled alarm time. Switching back and forth between Normal mode and Airplane mode is possible any time during operation by using the AT^SCFG command.

After startup or mode change the following URCs indicate the module’s ready state:

• “SYSSTART” indicates that the module has entered Normal mode.

• “^SYSSTART AIRPLANE MODE” indicates that the module has entered Airplane mode.

• “^SYSSTART CHARGE ONLY MODE” indicates that the module has entered the

Charge-only mode. These URCs are indicated only if the module is set to a fixed bit rate, i.e. they do not appear if autobauding is enabled (AT+IPR0).

Detailed explanations on AT^SCFG, AT+CFUN, AT+CALA, Airplane mode and AT+IPR can be found in [1].

3.3.1.1 Turn on AC65/AC75 Using Ignition Line IGT

When AC65/AC75 is in Power-down mode or Charge-only mode, it can be started to Normal mode or Airplane mode by driving the IGT (ignition) line to ground. This must be accomplished with an open drain/collector driver to avoid current flowing into this pin. The module will start up when both of the following two conditions are met:

• The supply voltage applied at BATT+ must be in the operating range.

• The IGT line needs to be driven low for at least 400ms in Power-down mode or at least

2s in Charge-only mode. When released IGT goes high and causes the module to start.

Considering different strategies of host application design the figures below show two approaches to meet this requirement: The example in Figure 5 assumes that IGT is activated after BATT+ has already been applied. The example in Figure 6 assumes that IGT is held low before BATT+ is switched on. In either case, to power on the module, ensure that low state of IGT takes at least 400ms (Power-down mode) or 2s (Charge-only mode) from the moment the voltage at BATT+ is available. For Charge-only mode see also Chapter 3.5.6.

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Assertion of CTS indicates that the module is ready to receive data from the host application. In addition, if configured to a fixed bit rate (AT+IPR0), the module will send the URC “^SYSSTART” or “^SYSSTART AIRPLANE MODE” which notifies the host application that the first AT command can be sent to the module. The duration until this URC is output varies with the SIM card and may take a couple of seconds.

Please note that no “^SYSSTART” or “^SYSSTART AIRPLANE MODE” URC will be generated if autobauding (AT+IPR=0) is enabled.

To allow the application to detect the ready state of the module we recommend using hardware flow control which can be set with AT\Q or AT+ICF (see [1] for details). The default setting of AC65/AC75 is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART” or “^SYSSTART AIRPLANE MODE” URC. However, if the URCs are neither used (due to autobauding) then the only way of checking the module’s ready state is polling. To do so, try to send characters (e.g. “at”) until the module is responding.

See also Chapter 3.3.2 “Signal States after Startup”

BATT+

t = 400ms

min

IGT

HiZ

PWR_IND

120ms

EMERG_RST

VEXT

TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)

CTS0/CTS1/DSR0/DCD0

Undefined

Interface pins

Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT

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ca. 500 ms

Defined

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BATT+

t = 400ms

min

IGT

PWR_IND

120ms

EMERG_RST

VEXT

HiZ

TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)

CTS0/CTS1/DSR0/DCD0

Undefined

Defined

Interface pins

ca. 500 ms

Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+

If the IGT line is driven low for less than 400ms the module will, instead of starting up, send only the alert message “SHUTDOWN after Illegal PowerUp” to the host application. The alert message appears on the serial interfaces ASC0 and ASC1 at a fixed bit rate of 115200bps. If other fixed bit rates or autobauding are set, the URC delivers only undefined characters. The message will not be indicated on the USB interface.

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3.3.1.2 Configuring the IGT Line for Use as ON/OFF Switch

The IGT line can be configured for use in two different switching modes: You can set the IGT line to switch on the module only, or to switch it on and off. The switching mode is determined by the parameter “MEShutdown/OnIgnition” of the AT^SCFG command. This approach is useful for application manufacturers who wish to have an ON/OFF switch installed on the host device.

By factory default, the ON/OFF switch mode of IGT is disabled:

at^scfg=meshutdown/onignition

^SCFG: "MEShutdown/OnIgnition","off"

# Query the current status of IGT.

# IGT can be used only to switch on AC65/AC75.

IGT works as described in Section 3.3.1.1.

To configure IGT for use as ON/OFF switch:

at^scfg=meshutdown/onignition,on

^SCFG: "MEShutdown/OnIgnition","on"

# Enable the ON/OFF switch mode of IGT.

# IGT can be used to switch on and off AC65/AC75.

We strongly recommend taking great care before changing the switching mode of the IGT line. To ensure that the IGT line works properly as ON/OFF switch it is of vital importance that the following conditions are met. Switch-on condition: If the AC65/AC75 is off, the IGT line must be asserted for at least

400ms before being released. The module switches on after 400ms.

Switch-off condition: If the AC65/AC75 is on, the IGT line must be asserted for at least 1s

before being released. The module switches off after the line is released.

The switch-off routine is identical with the procedure initiated by

AT^SMSO, i.e. the software performs an orderly shutdown as described in Section 3.3.3.1.

Before switching off the module wait at least 2 seconds after startup.

ON OFF

~~~~

|________|

| 0.4s |  2s |  1s |

~~~~~~~~~~~~~

|________|

~~~~

Figure 7: Timing of IGT if used as ON/OFF switch

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3.3.1.3 Turn on AC65/AC75 Using the VCHARGE Signal

As detailed in Section 3.5.6, the charging adapter can be connected regardless of the module’s operating mode.

If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE pin while AC65/AC75 is off, and the battery voltage is above the undervoltage lockout threshold, processor controlled fast charging starts (see Section 3.5.5). AC65/AC75 enters a restricted mode, referred to as Charge-only mode where only the charging algorithm will be launched.

During the Charge-only mode AC65/AC75 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch from Charge-only mode to Normal mode the ignition line (IGT) must be pulled low for at least 2 seconds. When released, the IGT line goes high and causes the module to enter the Normal mode. See also Section 3.5.6.

3.3.1.4 Reset AC65/AC75 via AT+CFUN Command

To reset and restart the AC65/AC75 module use the command AT+CFUN. You can enter AT+CFUN=,1 or AT+CFUN=x,1, where x may be in the range from 0 to 9. See [1] for details.

If configured to a fix baud rate (AT+IPR0), the module will send the URC “^SYSSTART” or “^SYSSTART AIRPLANE MODE” to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart.

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3.3.1.5 Reset or Turn off AC65/AC75 in Case of Emergency

Caution: Use the EMERG_RST pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST pin causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if AC65/AC75 does not respond, if reset or shutdown via AT command fails.

The EMERG_RST signal is available on the application interface. To control the EMERG_RST line it is recommended to use an open drain / collector driver.

The EMERG_RST line can be used to switch off or to reset the module. In any case the EMERG_RST line must be pulled to ground for ≥10ms. Then, after releasing the EMERG_RST line the module restarts if IGT is held low for at least 400ms. Otherwise, if IGT is not low the module switches off. In this case, it can be restarted any time as described in Section 3.3.1.1.

After hardware driven restart, notification via “^SYSSTART” or “^SYSSTART AIRPLANE” URC is the same as in case of restart by IGT or AT command. To register to the network SIM PIN authentication is necessary after restart.

3.3.1.6 Using EMERG_RST to Reset Application(s) or External Device(s)

When the module starts up, while IGT is held low for 400ms, the EMERG_RST signal goes low for 120ms as shown in Figure 5 and Figure 6. During this 120ms period, EMERG_RST becomes an output which can be used to reset application(s) or external device(s) connected to the module.

After the 120ms period, i.e. during operation of the module, the EMERG_RST is an input.

Specifications of the input and output mode of EMERG_RST can be found in Table 26.

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3.3.2 Signal States after Startup

Table 6 describes the various states each interface pin passes through after startup and during operation.

As shown in Figure 5 and Figure 6 the pins are in undefined state while the module is initializing. Once the startup initialization has completed, i.e. when CTS is high and the software is running, all pins are in defined state. The state of several pins will change again once the respective interface is activated or configured by AT command.

Table 6: Signal states

during startup

SYNC

CCIN

CCRST

CCIO

CCCLK

CCVCC

RXD0

TXD0 I, PU I, PD(330k)

CTS0 L O

RTS0 I, PU I, PD(330k)

DTR0 I, PU I

DCD0 L O

DSR0 L O

RING0 I, PU O

RXD1

TXD1

CTS1

RTS1

SPIDI

SPICS

I2CDAT_SPIDO

I2CCLK_SPICLK

GPIO1 I, PU Tristate IO

GPIO2 I, PU Tristate IO

GPIO3 I, PU Tristate IO

GPIO4 I, PD Tristate IO

GPIO5 L Tristate IO

GPIO6 I Tristate IO

GPIO7 I, PU Tristate IO

GPIO8 L Tristate IO

GPIO9 I Tristate IO

GPIO10 I Tristate IO

DAC_OUT L O

DAI0

DAI1

DAI2

DAI3

DAI4

DAI5

DAI6

L O

I, PU(100k) I, PU(100k)

L O

L 2.9V

I, PU O

H O

I, PD(330k) I, PD(330k)

L O

I, PD(330k) I, PD(330k)

I Tristate I Tristate

I Tristate O Tristate

I O O IO

I O O O

I Tristate O

I Tristate I

I Tristate O

I Tristate I

Defined state after initialization

Active state after configuration by AT command Signal name Undefined state

GPIO SPI I2C DAI

For abbreviations, see below.

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Abbreviations used in Table 6:

L = Low output level H = High output level I = Input O = Output

PD = Pull down with min +15µA and max. +100µA PD(…k) = Fix pull down resistor PU = Pull up with min -15µA and max. -100µA PU(…k) = Fix pull up resistor

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3.3.3 Turn off AC65/AC75

AC65/AC75 can be turned off as follows:

• Normal shutdown: Software controlled by AT^SMSO command

• Automatic shutdown: Takes effect if board or battery temperature is out of range or if

undervoltage or overvoltage conditions occur.

3.3.3.1 Turn off AC65/AC75 Using AT Command

The best and safest approach to powering down AC65/AC75 is to issue the AT^SMSO command. This procedure lets AC65/AC75 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode. In this mode, only the RTC stays active.

Before switching off the device sends the following response: ^SMSO: MS OFF

OK ^SHUTDOWN

After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off:

• Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile

and the module turns off in less than 1 second.

• Also, you can monitor the PWR_IND pin. High state of PWR_IND definitely indicates that

the module is switched off.

Be sure not to disconnect the supply voltage V been issued and the PWR_IND signal has gone high. Otherwise you run the risk of losing data. Signal states during turn-off are shown in Figure 8.

While AC65/AC75 is in Power-down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface, especially of the serial interfaces. No special care is required for the USB interface which is protected from reverse current.

before the URC “^SHUTDOWN” has

BATT+

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PWR_IND

VEXT

CTS0/CTS1/DSR0/DTR0

TXD0/TXD1/RTS0/RTS1/DTR0 (driven by the application)

Defined

Interface pins

Figure 8: Signal states during turn-off procedure

Note 1: Depending on capacitance load from host application

See note 1

Undefined

3.3.3.2 Leakage Current in Power-Down Mode

The leakage current in Power-down mode varies depending on the following conditions:

• If the supply voltage at BATT+ was disconnected and then applied again without starting

up the AC65/AC75 module, the leakage current ranges between 90µA and 100µA.

• If the AC65/AC75 module is started and afterwards powered down with AT^SMSO, then

the leakage current is only 50µA.

Therefore, in order to minimize the leakage current take care to start up the module at least once before it is powered down.

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3.3.3.3 Turn on/off AC65/AC75 Applications with Integrated USB

In a Windows environment, the USB COM port emulation causes the USB port of AC65/AC75 to appear as a virtual COM port (VCOM port). The VCOM port emulation is only present when Windows can communicate with the module, and is lost when the module shuts down. Therefore, the host application or Terminal program must be disconnected from the USB VCOM port each time the module is restarted.

Restart after shutdown with AT^SMSO:

After entering the power-down command AT^SMSO on one of the interfaces (ASC0, ASC1, USB) the host application or Terminal program used on the USB VCOM port must be closed before the module is restarted by activating the IGT line.

Software reset with AT+CFUN=x,1:

Likewise, when using the reset command AT+CFUN=x,1 on one of the interfaces (ASC0, ASC1, USB) ensure that the host application or Terminal program on the USB VCOM port be closed down before the module restarts. Note that if AT+CFUN=x,1 is entered on the USB interface the application or Terminal program on the USB VCOM port must be closed immediately after the response OK is returned.

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3.3.4 Automatic Shutdown

Automatic shutdown takes effect if:

• the AC65/AC75 board is exceeding the critical limits of overtemperature or

undertemperature

• the battery is exceeding the critical limits of overtemperature or undertemperature

• undervoltage or overvoltage is detected

See Charge-only mode described in Section 3.5.6 for exceptions.

The automatic shutdown procedure is equivalent to the Power-down initiated with the AT^SMSO command, i.e. AC65/AC75 logs off from the network and the software enters a secure state avoiding loss of data.

Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The URC presentation mode varies with the condition, please see Chapters 3.3.4.1 to 3.3.4.5 for details. For further instructions on AT commands refer to [1].

3.3.4.1 Thermal Shutdown

The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The NTC that detects the battery temperature must be part of the battery pack circuit as described in 3.5.3 The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature.

Each time the board or battery temperature goes out of range or back to normal, AC65/AC75 instantly displays an alert (if enabled).

• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such

as protecting the module from exposure to extreme conditions. The presentation of the

URCs depends on the settings selected with the AT^SCTM write command:

AT^SCTM=1: Presentation of URCs is always enabled.

AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after

start-up of AC65/AC75. After 15 seconds operation, the presentation will be disabled, i.e. no alert messages can be generated.

• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The

presentation of these URCs is always enabled, i.e. they will be output even though the

factory setting AT^SCTM=0 was never changed.

The maximum temperature ratings are stated in Chapter 5.2. Refer to Table 7 for the associated URCs.

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Table 7: Temperature dependent behavior

Sending temperature alert (2min after AC65/AC75 start-up, otherwise only if URC presentation enabled)

^SCTM_A: 1 Caution: Battery close to overtemperature limit.

^SCTM_B: 1 Caution: Bboard close to overtemperature limit.

^SCTM_A: -1 Caution: Battery close to undertemperature limit.

^SCTM_B: -1 Caution: Board close to undertemperature limit.

^SCTM_A: 0 Battery back to uncritical temperature range.

^SCTM_B: 0 Board back to uncritical temperature range.

Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_A: 2 Alert: Battery equal or beyond overtemperature limit. AC65/AC75 switches off.

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. AC65/AC75 switches off.

^SCTM_A: -2 Alert: Battery equal or below undertemperature limit. AC65/AC75 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. AC65/AC75 switches off.

3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions

In the following cases, shutdown will be deferred if a critical temperature limit is exceeded:

• while an emergency call is in progress

• during a two minute guard period after power-up. This guard period has been introduced

in order to allow the user to make an emergency call. The start of an emergency call

extends the guard period until the end of the call. Any other network activity may be

terminated by shutdown upon expiry of the guard time. The guard period starts again

when the module registers to the GSM network the first time after power-up.

If the temperature is still out of range after the guard period expires or the call ends, the module switches off immediately (without another alert message).

CAUTION! Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown functionality may result in damage to the module, and possibly other severe consequences.

3.3.4.3 Monitoring the Board Temperature of AC65/AC75

The AT^SCTM command can also be used to check the present status of the board. Depending on the selected mode, the read command returns the current board temperature in degrees Celsius or only a value that indicates whether the board is within the safe or critical temperature range. See [1] for further instructions.

3.3.4.4 Undervoltage Shutdown if Battery NTC is Present

In applications where the module’s charging technique is used and an NTC is connected to the BATT_TEMP terminal, the software constantly monitors the applied voltage. If the measured battery voltage is no more sufficient to set up a call the following URC will be presented: ^SBC: Undervoltage.

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The message will be reported, for example, when you attempt to make a call while the voltage is close to the shutdown threshold of 3.2V and further power loss is caused during the transmit burst. In IDLE mode, the shutdown threshold is the sum of the module’s minimum supply voltage (3.2V) and the value of the maximum voltage drop resulting from earlier calls. This means that in IDLE mode the actual shutdown threshold may be higher than 3.2V. Therefore, to properly calculate the actual shutdown threshold application manufacturers are advised to measure the maximum voltage drops that may occur during transmit bursts.

To remind you that the battery needs to be charged soon, the URC appears several times before the module switches off.

This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur.

3.3.4.5 Undervoltage Shutdown if no Battery NTC is Present

The undervoltage protection is also effective in applications, where no NTC connects to the BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or AC65/AC75 is fed by a fixed supply voltage.

Whenever the supply voltage falls below the value of 3.2V the URC ^SBC: Undervoltage appears several times before the module switches off.

This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur.

3.3.4.6 Overvoltage Shutdown

The overvoltage shutdown threshold is 100mV above the maximum supply voltage V specified in Table 27.

When the supply voltage approaches the overvoltage shutdown threshold the module will send the URC ^SBC: Overvoltage warning. This alert is sent once.

When the overvoltage shutdown threshold is exceeded the module will send the URC ^SBC: Overvoltage shutdown, before it shuts down cleanly.

This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur.

Keep in mind that several AC65/AC75 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of AC65/AC75, even if the module is switched off. Especially the power amplifier is very sensitive to high voltage and might even be destroyed.

BATT+

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3.4 Automatic EGPRS/GPRS Multislot Class Change

Temperature control is also effective for operation in EGPRS Multislot Class 10 (AC75 only), GPRS Multislot Class 10 and GPRS Multislot Class 12. If the board temperature rises close to the limit specified for normal operation the module automatically reverts

• from EGPRS Multislot Class 10 (2Tx slots) to EGPRS Multislot Class 8 (1Tx),

• from GPRS Multislot Class 12 (4Tx slots) to GPRS Multislot Class 8 (1Tx),

• from GPRS Multislot Class 10 (2Tx slots) to GPRS Multislot Class 8 (1Tx)

This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops by 5 degrees, AC65/AC75 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, AC65/AC75 will not switch back to the higher class.

After a transition from EGPRS Multislot Class 10 to EGPRS Multislot Class 8 a possible switchback to EGPRS Multislot Class 10 is blocked for one minute. The same applies when a transition occurs from GPRS Multislot Class 12 or 10 to GPRS Multislot Class 8.

Please note that there is not one single cause of switching over to a lower Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in Section 3.3.4.1.

while data are transmitted over EGPRS or GPRS,

See Chapter 5.2 for temperature limits.

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3.5 Charging Control

AC65/AC75 integrates a charging management for rechargeable Lithium Ion and Lithium Polymer batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm.

The following sections contain an overview of charging and battery specifications. Please refer to [4] for greater detail, especially regarding requirements for batteries and chargers, appropriate charging circuits, recommended batteries and an analysis of operational issues typical of battery powered GSM/GPRS applications.

3.5.1 Hardware Requirements

AC65/AC75 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application according to the Figure 46.

3.5.2 Software Requirements

Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the AC65/AC75 module to correctly determine the end of charging and terminate charging automatically when the battery is fully charged. If the <current> value is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage. Therefore, the termination condition is defined as: current consumption dependent on the operating mode of the ME plus current consumption of the external application. If used the current flowing over the VEXT pin of the application interface must be added, too.

The parameter <current> is volatile, meaning that the factory default (0mA) is restored each time the module is powered down or reset. Therefore, for better control of charging, it is recommended to enter the value every time the module is started.

See [1] for details on AT^SBC.

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3.5.3 Battery Pack Requirements

The charging algorithm has been optimized for rechargeable Lithium batteries that meet the characteristics listed below and in Table 8. It is recommended that the battery pack you want to integrate into your AC65/AC75 application is compliant with these specifications. This ensures reliable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.

• Li-Ion or Lithium Polymer battery pack specified for a maximum charging voltage of 4.2V

and a recommended capacity of 1000 to 1200mAh.

• Since charging and discharging largely depend on the battery temperature, the battery

pack should include an NTC resistor. If the NTC is not inside the battery it must be in

thermal contact with the battery. The NTC resistor must be connected between

BATT_TEMP and GND.

The B value of the NTC should be in the range: 10kΩ +

=3435K ± 3% (alternatively acceptable: 10kΩ +

2% @ 25°C, B

note that the NTC is indispensable for proper charging, i.e. the charging process will not

start if no NTC is present.

• Ensure that the pack incorporates a protection circuit capable of detecting overvoltage

(protection against overcharging), undervoltage (protection against deep discharging)

and overcurrent. Due to the discharge current profile typical of GSM applications, the

circuit must be insensitive to pulsed current.

• On the AC65/AC75 module, a built-in measuring circuit constantly monitors the supply

voltage. In the event of undervoltage, it causes AC65/AC75 to power down. Undervoltage

thresholds are specific to the battery pack and must be evaluated for the intended model.

When you evaluate undervoltage thresholds, consider both the current consumption of

AC65/AC75 and

of the application circuit.

• The internal resistance of the battery and the protection should be as low as possible. It

is recommended not to exceed 150m, even in extreme conditions at low temperature.

The battery cell must be insensitive to rupture, fire and gassing under extreme conditions

of temperature and charging (voltage, current).

• The battery pack must be protected from reverse pole connection. For example, the

casing should be designed to prevent the user from mounting the battery in reverse

orientation.

• It is recommended that the battery pack be approved to satisfy the requirements of CE

conformity.

Figure 9 shows the circuit diagram of a typical battery pack design that includes the protection elements described above.

5% @ 25°C, B

to BATT+

= 3423K to B

25/85

= 3370K +3%). Please

25/50

to BATT_TEMP to GND

NTC

Protection Circuit

Figure 9: Battery pack circuit diagram

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Table 8: Specifications of battery packs suitable for use with AC65/AC75

Battery type Rechargeable Lithium Ion or Lithium Polymer battery

Nominal voltage 3.6V / 3.7V

Capacity Recommended: 1000mAh to 1200mAh

Minimum: 500mAh

NTC 10k ± 5% @ 25°C

approx. 5k @ 45°C approx. 26.2k @ 0°C B value range: B (25/85)=3423K to B =3435K ± 3%

Overcharge detection voltage 4.325 ± 0.025V

Overdischarge detection voltage 2.5V

Overdischarge release voltage 2.6V

Overcurrent detection 3 ± 0.5A

Overcurrent detection delay time 4 ~ 16ms

Short detection delay time 50µs

Internal resistance <130m

Note: A maximum internal resistance of 150m should not be exceeded even after 500 cycles and under extreme conditions.

3.5.4 Charger Requirements

For using the implemented charging algorithm and the reference charging circuit recommended in [4] and in Figure 46, the charger has to meet the following requirements: Output voltage: 5.2Volts ±0.2V (stabilized voltage) Output current: 500mA Chargers with a higher output current are acceptable, but please

consider that only 500mA will be applied when a 0.3Ohms shunt resistor is connected between VSENSE and ISENSE. See [4] for further details.

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3.5.5 Implemented Charging Technique

If all requirements listed above are met (appropriate external charging circuit of application, battery pack, charger, AT^SBC settings) then charging is enabled in various stages depending on the battery condition:

Trickle charging:

• Trickle charge current flows over the VCHARGE line.

• Trickle charging is done when a charger is present (connected to VCHARGE) and the

battery is deeply discharged or has undervoltage. If deeply discharged (Deep Discharge

Lockout at V

(Undervoltage Lockout at V

Software controlled charging:

• Controlled over the CHARGEGATE.

• Temperature conditions: 0°C to 45°C

• Software controlled charging is done when the charger is present (connected to

VCHARGE) and the battery voltage is at least above the undervoltage threshold.

Software controlled charging passes the following stages:

- Power ramp: Depending on the discharge level of the battery (i.e. the measured battery

voltage V

BATT+

battery. The duration of power ramp charging is very short (less than 30 seconds).

- Fast charging: Battery is charged with constant current (approx. 500mA) until the

battery voltage reaches 4.2V (approx. 80% of the battery capacity).

- Top-up charging: The battery is charged with constant voltage of 4.2V at stepwise

reducing charge current until full battery capacity is reached.

Duration of charging:

• AC65/AC75 provides two charging timers: a software controlled timer set to 4 hours and

a hardware controlled timer set to 4.66 hours.

- The duration of software controlled charging depends on the battery capacity and the

level of discharge. Normally, charging stops when the battery is fully charged or, at the latest, when the software timer expires after 4 hours.

- The hardware timer is provided to prevent runaway charging and to stop charging if the

software is not responding. The hardware timer will start each time the charger is plugged to the VCHARGE line.

= <2.5V) the battery is charged with 5mA, in case of undervoltage

BATT+

= 2.5…3.2V) it is charged with 30mA.

BATT+

) the software adjusts the maximum charge current for charging the

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3.5.6 Operating Modes during Charging

Of course, the battery can be charged regardless of the engine's operating mode. When the GSM module is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remains operational while charging is in progress (provided that sufficient voltage is applied). The charging process during the Normal mode is referred to as

If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE pin while AC65/AC75 is in Power-down mode, AC65/AC75 goes into

Charge-only mode.

While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism. Instead the following applies:

• If the module is in Normal mode and the charger is connected (Charge mode) the

AT^SMSO command causes the module to shut down shortly and then start into the

Charge-only mode.

• In Charge-only mode the AT^SMSO command is not usable.

• In Charge-only mode the module neither switches off when the battery or the module

exceeds the critical limits of overtemperature or undertemperature. In these cases you can only switch the module off by disconnecting the charger.

To proceed from Charge-only mode to another operating mode you have the following options, provided that the battery voltage is at least above the undervoltage threshold.

• To switch from Charge-only mode to Normal mode you have two ways:

- Hardware driven: The ignition line (IGT) must be pulled low for at least 2 seconds.

When released, the IGT line goes high and causes the module to enter the Normal mode.

- AT command driven: Set the command AT^SCFG=MEopMode/Airplane,off (please do

so although the current status of Airplane mode is already “off”). The module will enter the Normal mode, indicated by the “^SYSSTART” URC.

• To switch from Charge-only mode to Airplane mode set the command

AT^SCFG=MEopMode/Airplane,on. The mode is indicated by the URC “^SYSSTART

AIRPLANE MODE”.

• If

AT^SCFG=MEopMode/Airplane/OnStart,on is set, driving the ignition line (IGT)

activates the Airplane mode. The mode is indicated by the URC “^SYSSTART

AIRPLANE MODE”.

Charge mode.

Table 9: AT commands available in Charge-only mode

AT command Use

AT+CALA Set alarm time, configure Airplane mode.

AT+CCLK Set date and time of RTC.

AT^SBC Query status of charger connection.

AT^SBV Monitor supply voltage.

AT^SCTM Query temperature range, enable/disable URCs to report critical temperature

ranges

AT^SCFG Enable/disable parameters MEopMode/Airplane or MEopMode/Airplane/OnStart

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Table 10: Comparison Charge-only and Charge mode

How to activate mode

Connect charger to charger input of host application charging circuit and module’s VCHARGE pin while AC65/AC75 is

• operating, e.g. in IDLE or TALK mode

• in SLEEP mode

Charge mode

Connect charger to charger input of host application charging circuit and module’s VCHARGE pin while AC65/AC75 is

• in Power-down mode

• in Normal mode: Connect charger to

the VCHARGE pin, then enter AT^SMSO.

NOTE: While trickle charging is in progress, be sure that the host application is switched off. If the

Charge-only mode

application is fed from the trickle charge current the module might be prevented from proceeding to software controlled charging since the current would not be sufficient.

Description of mode

• Battery can be charged while GSM module

remains operational and registered to the GSM network.

• In IDLE and TALK mode, the serial interfaces

are accessible. All AT commands can be

used to full extent. NOTE: If the module operates at maximum power level (PCL5) and GPRS Class 12 at the same time the current consumption is higher than the current supplied by the charger.

• Battery can be charged while GSM engine is

deregistered from GSM network.

• Charging runs smoothly due to constant

current consumption.

• The AT interface is accessible and allows to

use the commands listed below.

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3.6 Power Saving

Intended for power saving, SLEEP mode reduces the functionality of the AC65/AC75 to a minimum and thus minimizes the current consumption. Settings can be made using the AT+CFUN command. For details see [1]. SLEEP mode falls in two categories:

• NON-CYCLIC SLEEP mode: AT+CFUN = 0

• CYCLIC SLEEP modes, AT+CFUN = 7 or 9.

The functionality level AT+CFUN=1 is where power saving is switched off. This is the default after startup.

NON-CYCLIC SLEEP mode permanently blocks the serial interface. The benefit of the CYCLIC SLEEP mode is that the serial interface remains accessible and that, in intermittent wake-up periods, characters can be sent or received without terminating the selected mode. This allows the AC65/AC75 to wake up for the duration of an event and, afterwards, to resume power saving. Please refer to [1] for a summary of all SLEEP modes and the different ways of waking up the module.

For CYCLIC SLEEP mode both the AC65/AC75 and the application must be configured to use hardware flow control. This is necessary since the CTSx signal is set/reset every 0.9-2.7 seconds in order to indicate to the application when the UART is active. Please refer to [1] for details on how to configure hardware flow control for the AC65/AC75.

Note: Although not explicitly stated, all explanations given in this section refer equally to ASC0 and ASC1, and accordingly to CTS0 and CTS1 or RTS0 and RTS1.

3.6.1 Network Dependency of SLEEP Modes

The power saving possibilities of SLEEP modes depend on the network the module is registered in. The paging timing cycle varies with the base station. The duration of a paging interval can be calculated from the following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value.

DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from

0.47-2.12 seconds. The DRX value of the base station is assigned by the network operator.

In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 10.

Paging

Power Saving

0.47-2.12 s

The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed.

Paging

Figure 10: Power saving and paging

Power Saving

0.47-2.12 s 0.47-2.12 s

Paging

Power Saving

Paging

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3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7

Figure 11 illustrates the CTSx signal timing in CYCLIC SLEEP mode 7 (CFUN=7).

Beginning of power saving

CTSx

2 s

1 characterstLast character

AT interface disabled

Figure 11: Timing of CTSx signal (if CFUN= 7)

AT interface enabled

0.9...2.7 s

With regard to programming or using timeouts, the UART must take the varying CTS inactivity periods into account.

3.6.3 Timing of the RTSx Signal in CYCLIC SLEEP Mode 9

In SLEEP mode 9 the falling edge of RTSx can be used to temporarily wake up the ME. In this case the activity time is at least the time set with AT^SCFG="PowerSaver/Mode9/ Timeout",<psm9to> (default 2 seconds). RTSx has to be asserted for at least a dedicated debounce time in order to wake up the ME. The debounce time specifies the minimum time period an RTSx signal has to remain asserted for the signal to be recognized as wake up signal and being processed. The debounce time is defined as 8*4.615 ms (TDMA frame duration) and is used to prevent bouncing or other fluctuations from being recognized as signals. Toggling RTSx while the ME is awake has no effect on the AT interface state, the regular hardware flow control via CTS/RTS is unaffected by this RTSx behaviour.

Power saving

CTSx

RTSx

AT interface disabled

Debounce Time

AT interface enabled

Figure 12: Timing of RTSx signal (if CFUN = 9)

Wake up of ME

2 s

37 ms

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3.7 Summary of State Transitions (Except SLEEP Mode)

Table 11: State transitions of AC65/AC75 (except SLEEP mode) The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes)

Further mode ÎÎÎ

Present mode

POWER DOWN Normal mode

**)

Charge-only mode*) Airplane mode

POWER DOWN mode

--- If AT^SCFG=MeOpMode/ Airplane/OnStart,off: IGT >400 ms at low level, then release IGT

Normal mode

**)

AT^SMSO --- AT^SMSO if charger is

Charge-only mode *) Disconnect charger Hardware driven: If AT^SCFG=

MeOpMode/Airplane/OnStart,off: IGT >2s at low level, then release IGT AT command driven: AT^SCFG= MeOpMode/Airplane,off

Airplane mode AT^SMSO AT^SCFG=MeOpMode/

Airplane,off

See Section 3.5.6 for details on the charging mode

**)

Normal mode covers TALK, DATA, GPRS/EGPRS, IDLE and SLEEP modes

Connect charger to VCHARGE If AT^SCFG=MeOpMode/

Airplane/OnStart,on: IGT >400 ms at low level, then release IGT. Regardless of AT^SCFG configuration: scheduled wake-up set with AT+CALA.

AT^SCFG=MeOpMode/

connected

Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: AT+CFUN=x,1 or EMERG_RST + IGT >400 ms.

--- AT^SCFG=MeOpMode/ Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: IGT >2s at low level

AT^SMSO if charger is

---

connected

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3.8 RTC Backup

The internal Real Time Clock of AC65/AC75 is supplied from a separate voltage regulator in the analog controller which is also active when AC65/AC75 is in POWER DOWN status. An alarm function is provided to wake up AC65/AC75 to Airplane mode without logging on to the GSM network.

In addition, you can use the VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged by the BATT+ line of AC65/AC75. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to AC65/AC75, i.e. the larger the capacitor the longer AC65/AC75 will save the date and time.

A serial 1k resistor placed on the board next to VDDLP limits the charge current of an empty capacitor or battery.

The following figures show various sample configurations. Please refer to Table 26 for the parameters required.

Baseband processor

RTC

PSU

B2B

BATT+

VDDLP

Figure 13: RTC supply from capacitor

BATT+

Baseband processor

RTC

PSU

B2B

VDDLP

Figure 14: RTC supply from rechargeable battery

BATT+

Baseband processor

RTC

PSU

B2B

VDDLP

Figure 15: RTC supply from non-chargeable battery

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3.9 SIM Interface

The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface.

The SIM interface supports 3V and 1.8V SIM cards. Please refer to Table 26 for electrical specifications of the SIM interface lines depending on whether a 3V or 1.8V SIM card is used.

The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with AC65/AC75 and is part of the Siemens reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers.

Table 12: Signals of the SIM interface (board-to-board connector)

Signal Description

CCGND Separate ground connection for SIM card to improve EMC.

Be sure to use this ground line for the SIM interface rather than any other ground pin or plane on the module. A design example for grounding the SIM interface is shown in Figure 46.

CCCLK Chipcard clock, various clock rates can be set in the baseband processor.

CCVCC SIM supply voltage.

CCIO Serial data line, input and output.

CCRST Chipcard reset, provided by baseband processor.

CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is

removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN pin is active low. The CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN pin is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of AC65/AC75.

Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered

after removing the SIM card during operation.

Also, no guarantee can be given for properly initializing any SIM card that the user

inserts after having removed a SIM card during operation.

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3.9.1 Installation Advice

The total cable length between the board-to-board connector pins on AC65/AC75 and the pins of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.

To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using the CCGND line to shield the CCIO line from the CCCLK line.

To meet EMC requirements it is strongly recommended to add several capacitors as shown in Figure 46. Take care to place the capacitors close to the SIM card holder.

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3.10 Serial Interface ASC0

AC65/AC75 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table 26.

AC65/AC75 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to the module’s TXD0 signal line

• Port RXD @ application receives data from the module’s RXD0 signal line

GSM Module (DCE) Application (DTE)

TXD0

RXD0

RTS0

CTS0

DTR0

DSR0

DCD0

RING0

TXD

RXD

RTS

CTS

DTR

DSR

DCD

RING

Figure 16: Serial interface ASC0

Features

• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in

addition, the modem control lines DTR0, DSR0, DCD0 and RING0.

• ASC0 is primarily designed for controlling voice calls, transferring CSD, fax and GPRS

data and for controlling the GSM engine with AT commands.

• Full Multiplex capability allows the interface to be partitioned into three virtual channels,

yet with CSD and fax services only available on the first logical channel. Please note that when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more details on Multiplex mode see [10].

• The DTR0 signal will only be polled once per second from the internal firmware of

AC65/AC75.

• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited

Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG.

• By default, configured for 8 data bits, no parity and 1 stop bit. The setting can be

changed using the AT command AT+ICF and, if required, AT^STPB. For details see [1].

• ASC0 can be operated at fixed bit rates from 300 bps to 460,800 bps.

• Autobauding supports bit rates from 1,200 to 460,800 bps.

• Autobauding is not compatible with multiplex mode.

• Supports RTS0/CTS0 hardware flow control and XON/XOFF software flow control.

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Table 13: DCE-DTE wiring of ASC0

DCE DTE V.24

circuit

103 TXD0 Input TXD Output

104 RXD0 Output RXD Input

105 RTS0 Input RTS Output

106 CTS0 Output CTS Input

108/2 DTR0 Input DTR Output

107 DSR0 Output DSR Input

109 DCD0 Output DCD Input

125 RING0 Output RING Input

Pin function Signal direction Pin function Signal direction

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3.11 Serial Interface ASC1

The ASC1 interface is available as a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and

2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table

26.

AC65/AC75 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to module’s TXD1 signal line

• Port RXD @ application receives data from the module’s RXD1 signal line

GSM Module (DCE) Application (DTE)

TXD1

RXD1

RTS1

CTS1

TXD

RXD

RTS

CTS

Figure 17: Serial interface ASC1

Features

• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware

handshake.

• On ASC1 no RING line is available. The indication of URCs on the second interface

depends on the settings made with the AT^SCFG command. For details refer to [1].

• Configured for 8 data bits, no parity and 1 or 2 stop bits.

• ASC1 can be operated at fixed bit rates from 300 bps to 460,800 bps. Autobauding is not

supported on ASC1.

• Supports RTS1/CTS1 hardware flow control and XON/XOFF software flow control.

Table 14: DCE-DTE wiring of ASC1

DCE DTE V.24

circuit

103 TXD1 Input TXD Output

104 RXD1 Output RXD Input

105 RTS1 Input RTS Output

106 CTS1 Output CTS Input

Pin function Signal direction Pin function Signal direction

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3.12 USB Interface

AC65/AC75 supports a USB 2.0 Full Speed (12Mbit/s) device interface. It can be operated on a USB 2.0 Full Speed or High Speed root hub (a PC host), but not on a generic USB 2.0 High Speed hub which translates High Speed (480 Mbit/s/) to Full Speed (12 Mbit/s).

The USB port has different functions depending on whether or not Java is running. Under Java, the lines may be used for debugging purposes (see [16] for further detail). If Java is not used, the USB interface is available as a command and data interface and for downloading firmware.

The USB I/O-pins are capable of driving the signal at min 3.0V. They are 5V I/O compliant.

The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s USB interface, but not to other AC65/AC75 interfaces. This is because AC65/AC75 is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 2.0”

VUSB_IN

USB_DP

USB_DN

GSM module

80 pole board-to-board connector

VBUS

GND

D+

D-

Host

MCU

Baseband controller

Transceiver

USB

lin.

Regulator

PSU

Figure 18: USB circuit

5V3.2V

1.5kOhms

22Ohms

To properly connect the module’s USB interface to the host a USB 2.0 compatible connector is required. For more information on how to install a USB modem driver and on how to integrate USB into AC65/AC75 applications see [11].

The specification is ready for download on http://www.usb.org/developers/docs/

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3.13 I2C Interface

I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK.

The AC65/AC75 module acts as a single master device, e.g. the clock I2CCLK is driven by module. I2CDAT is a bi-directional line.

Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as mastertransmitter or as master-receiver. The customer application transmits or receives data only on request of the module.

To configure and activate the I two lines I2CCLK and I2DAT are locked for use as SPI lines. Vice versa, the activation of the SPI locks both lines for I explanations on the protocol and syntax required for data transmission can be found in [1].

The I

C interface can be powered from an external supply or via the VEXT line of AC65/AC75. If connected to the VEXT line the I the module enters the Power-down mode. If you prefer to connect the I external power supply, take care that VCC of the application is in the range of V the interface is shut down when the PWR_IND signal goes high. See figures below as well as Section 7 and Figure 46.

In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor.

For electrical characteristics please refer to Table 26.

C bus use the AT^SSPI command. If the I2C bus is active the

C. Detailed information on the AT^SSPI command as well

C interface will be properly shut down when

C interface to an

and that

VEXT

GSM module

I2CDAT I2CCLK GND

Application

VCC

Figure 19: I2C interface connected to VCC of application

I2CDAT I2CCLK GND

VEXT

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GSM module

VEXT

I2CDAT I2CCLK GND

Application

I2CDAT I2CCLK GND

Figure 20: I2C interface connected to VEXT line of AC65/AC75

Note: Good care should be taken when creating the PCB layout of the host application: The

traces of I2CCLK and I2CDAT should be equal in length and as short as possible.

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3.14 SPI Interface

The SPI (serial peripheral interface) is a synchronous serial interface for control and data transfer between the AC65/AC75 module and the connected application. Only one application can be connected to the module’s SPI. The interface supports transmission rates up to 6.5Mbit/s. It consists of four lines, the two data lines SPIDI/SPIDO, the clock line SPICLK and the chip select line SPICS.

The AC65/AC75 module acts as a single master device, e.g. the clock SPICLK is driven by module. Whenever the SPICS pin is in a low state, the SPI bus is activated and data can be transferred from the module and vice versa. The SPI interface uses two independent lines for data input (SPIDI) and data output (SPIDO).

GSM module Application

SPIDI SPIDI SPIDO

SPICS SPICLK SPICLK

Figure 21: SPI interface

SPIDO SPICS

To configure and activate the SPI bus use the AT^SSPI command. If the SPI bus is active the two lines I2CCLK and I2DAT are locked for use as I

C lines. Detailed information on the AT^SSPI command as well explanations on the SPI modes required for data transmission can be found in [1].

In general, SPI supports four operation modes. The modes are different in clock phase and clock polarity. The module’s SPI mode can be configured by using the AT command AT^SSPI. Make sure the module and the connected slave device works with the same SPI mode.

Figure 22 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the most common used modes.

For electrical characteristics please refer to Table 26.

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Clock phase

SPI MODE 0 SPI MODE 1

Clock polarity

SPICS

SPICLK

SPIDO

SPIDI

SPICS

SPICLK

SPIDO

SPIDI

SPICS

SPICLK

SPIDO

SPIDI

Sample Sample

SPI MODE 2 SPI MODE 3

SPICS

SPICLK

SPIDO

SPIDI

Sample Sample

Figure 22: Characteristics of SPI modes

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3.15 Audio Interfaces

AC65/AC75 comprises three audio interfaces available on the board-to-board connector:

• Two analog audio interfaces, both with balanced or single-ended inputs/outputs.

• Serial digital audio interface (DAI) designed for PCM (Pulse Code Modulation).

This means you can connect up to three different audio devices, although only one interface can be operated at a time. Using the AT^SAIC command you can easily switch back and forth.

MICP1

MICN1

MUX

DSP

Air Interface

MICP2

MICN2

EPP1

EPN1

EPP2

EPN2

VMIC

AGND

DAI0

DAI1

DAI2

DAI3

DAI4

DAI5

DAI6

MUX

Analog switch

Digital Audio Interface

Figure 23: Audio block diagram

To suit different types of accessories the audio interfaces can be configured for different audio modes via the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands (except for mode 1).

Both analog audio interfaces can be used to connect headsets with microphones or speakerphones. Headsets can be operated in audio mode 3, speakerphones in audio mode 2. Audio mode 5 can be used for direct access to the speech coder without signal pre or post processing.

When shipped from factory, all audio parameters of AC65/AC75 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode.

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3.15.1 Speech Processing

The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder. Received samples from the speech decoder are passed to the DAC or DAI after post processing (frequency response correction, adding sidetone etc.).

Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are also performed on the GSM baseband processor.

3.15.2 Microphone Circuit

AC65/AC75 has two identical analog microphone inputs. There is no on-board microphone supply circuit, except for the internal voltage supply VMIC and the dedicated audio ground line AGND. Both lines are well suited to feed a balanced audio application or a single-ended audio application.

The AGND line on the AC65/AC75 board is especially provided to achieve best grounding conditions for your audio application. As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems.

While AC65/AC75 is in Power-down mode, the input voltage at any MIC pin must not exceed ±0.3V relative to AGND (see also Chapter 5.1). In any other operating state the voltage applied to any MIC pin must be in the range of +2.7V to -0.3V, otherwise undervoltage shutdown may be caused.

If VMIC is used to generate the MICP-pin bias voltage as shown in the following examples consider that VMIC is switched off (0V) outside a call. Audio signals applied to MICP in this case must not fall below -0.3V.

If higher input levels are used especially in the line input configuration the signal level must be limited to 600mV permanently.

outside a call, or AT^SNFM=,1 should be used to switch on VMIC

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3.15.2.1 Single-ended Microphone Input

Figure 24 as well as Figure 46 show an example of how to integrate a single-ended microphone input.

VMIC

Bias

VMIC

MICPx

GSM module

MICNx

AGND

RA = typ. 2k R

= typ. 5k

= typ. 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= 1.0V … 1.6V, typ. 1.5V

bias

Figure 24: Single ended microphone input

has to be chosen so that the DC voltage across the microphone falls into the bias voltage

range of 1.0V to 1.6V and the microphone feeding current meets its specification.

The MICNx input is automatically self biased to the MICPx DC level. It is AC coupled via C

to a resistive divider which is used to optimize supply noise cancellation by the differential microphone amplifier in the module.

The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (R

and CF).

VMIC

This circuit is well suited if the distance between microphone and module is kept short. Due to good grounding the microphone can be easily ESD protected as its housing usually connects to the negative terminal.

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3.15.2.2 Differential Microphone Input

Figure 25 shows a differential solution for connecting an electret microphone.

VMIC

MICPx

MICNx

Bias

AGND

GSM module

RA = typ. 1k R

= 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= 1.0V … 1.6V, typ. 1.5V

bias

Figure 25: Differential microphone input

The advantage of this circuit is that it can be used if the application involves longer lines between microphone and module.

While VMIC is switched off, the input voltage at any MIC pin should not exceed ±0.25V relative to AGND (see also Chapter 5.1). In this case no bias voltage has to be supplied from the customer circuit to the MIC pin and any signal voltage should be smaller than Vpp = 0.5V.

VMIC can be used to generate the MICP-pin bias voltage as shown below. In this case the bias voltage is only applied if VMIC is switched on.

Only if VMIC is switched on, can the voltage applied to any MIC pin be in the range of 2.4V to 0V. If these limits are exceeded undervoltage shutdown may be caused.

Consider that the maximum full scale input voltage is Vpp = 1.6V.

The behavior of VMIC can be controlled with the parameter micVccCtl of the AT command AT^SNFM (see [1]):

• micVccCtl=2 (default). VMIC is controlled automatically by the module. VMIC is always

switched on while the internal audio circuits of the module are active (e.g., during a call). VMIC can be used as indicator for active audio in the module.

• micVccCtl=1. VMIC is switched on continuously. This setting can be used to supply the

microphone in order to use the signal in other customer circuits as well. However, this setting leads to a higher current consumption in SLEEP modes.

• micVccCtl=0. VMIC is permanently switched off.

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3.15.2.3 Line Input Configuration with OpAmp

Figure 26 shows an example of how to connect an opamp into the microphone circuit.

VMIC

MICPx

MICNx

Bias

GSM module

AGND

Figure 26: Line input configuration with OpAmp

RA = typ. 47k R

= 470Ohm

VMIC

= typ. 100nF

= typ. 22µF

= typ. 2.5V

MIC

= typ. ½ V

bias

= 1.25V

MIC

The AC source (e.g. an opamp) and its reference potential have to be AC coupled to the MICPx resp. MICNx input terminals. The voltage divider between VMIC and AGND is necessary to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level.

The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (R

and CF). If a high input level and a lower

VMIC

gain are applied the filter is not necessary.

Consider that if VMIC is switched off, the signal voltage should be limited to Vpp = 0.5V and any bias voltage must not be applied. Otherwise VMIC can be switched on permanently by using AT^SNFM=,1. In this case the current consumption in SLEEP modes is higher.

If desired, MICNx via C

can also be connected to the inverse output of the AC source

instead of connecting it to the reference potential for differential line input.

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3.15.3 Loudspeaker Circuit

The GSM module comprises two analog speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Each interface can be connected in differential and in single ended configuration. Figure 27 shows an example of a differential loudspeaker configuration.

Loudspeaker impedance

EPP1/EPN1 Z

= typ. 8Ohm

EPPx

GSM module

EPNx

EPP2/EPN2 Z

= typ. 32Ohm

AGND

Figure 27: Differential loudspeaker configuration

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3.15.4 Digital Audio Interface (DAI)

The DAI can be used to connect audio devices capable of PCM (Pulse Code Modulation) or for type approval. The following chapters describe the PCM interface functionality.

The PCM functionality allows the use of a codec like for example the MC145483. This codec replaces the analog audio inputs and outputs during a call, if digital audio is selected by AT^SAIC.

The PCM interface is configurable with the AT^SAIC command (see [1]) and supports the following features:

- Master and slave mode

- Short frame and long frame synchronization

- 256 kHz or 512 kHz bit clock frequency

For the PCM interface configuration the parameters <clock>, <mode> and <framemode> of the AT^SAIC command are used. The following table lists possible combinations:

Table 15: Configuration combinations for the PCM interface

Configuration <clock> <mode> <framemode>

Master, 256kHz, short frame 0 0 0

Master, 256kHz, long frame 0 0 1

Master, 512kHz, short frame 1 0 0

Master, 512kHz, long frame 1 0 1

Slave, 256kHz, short frame 0 or 13 1 0

Slave, 256kHz, long frame 0 or 1 1 1

Slave, 512kHz, short frame 0 or 1 1 0

Slave, 512kHz, long frame 0 or 1 1 1

In all configurations the PCM interface has the following common features:

- 16 Bit linear

- 8 kHz sample rate

- the most significant bit MSB is transferred first

- 125 µs frame duration

- common frame sync signal for transmit and receive

In slave mode the BCLKIN signal is directly used for data shifting. Therefore, the clock frequency setting is not

evaluated and may be either 0 or 1.

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Table 16 shows the assignment of the DAI0…6 pins to the PCM interface signals. To avoid hardware conflicts different pins are used as inputs and outputs for frame sync and clock signals in master or slave operation. The table shows also which pin is used for master or slave. The data pins (TXDAI and RXDAI) however are used in both modes. Unused inputs have to be tied to GND, unused outputs must be left open.

Table 16: Overview of DAI pin functions

Signal name on B2B connector

DAI0 TXDAI Master/Slave O

DAI1 RXDAI Master/Slave I

DAI2 FS (Frame sync) Master O

DAI3 BITCLK Master O

DAI4 FSIN Slave I

DAI5 BCLKIN Slave I

DAI6 nc I

Function for PCM Interface Input/Output

3.15.4.1 Master Mode

To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK) which is synchronous to the GSM system clock. The frequency of the bit clock is 256kHz or 512kHz. Any edge of this clock deviates less than ±100ns (Jitter) from an ideal 256-kHz clock respective 512-kHz-clock.

The frame sync signal (FS) has a frequency of 8 kHz and is high for one BITCLK period before the data transmission starts if short frame is configured. If long frame is selected the frame sync signal (FS) is high during the whole transfer of the 16 data bits. Each frame has a duration of 125µs and contains 32 respectively 64 clock cycles.

PCM interface of the GSM module

BITCLK

TXDAI

RXDAI

Figure 28: Master PCM interface Application

Codec

bitclk

frame sync

RX_data

TX_data

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The timing of a PCM short frame is shown in Figure 29. The 16-bit TXDAI and RXDAI data are transferred simultaneously in both directions during the first 16 clock cycles after the frame sync pulse. The duration of a frame sync pulse is one BITCLK period, starting at the rising edge of BITCLK. TXDAI data is shifted out at the next rising edge of BITCLK. RXDAI data (i.e. data transmitted from the host application to the module’s RXDAI line) is sampled at the falling edge of BITCLK.

125 µs

BITCLK

TXDAI

RXDAI

MSB

14 13

LSB

MSB

Figure 29: Master PCM timing, short frame selected

The timing of a PCM

long frame is shown in Figure 30. The 16-bit TXDAI and RXDAI data

are transferred simultaneously in both directions while the frame sync pulse FS is high. For this reason the duration of a frame sync pulse is 16 BITCLK periods, starting at the rising edge of BITCLK. TXDAI data is shifted out at the same rising edge of BITCLK. RXDAI data (i.e. data transmitted from the host application to the module’s RXDAI line) is sampled at the falling edge of BITCLK.

125 µs

BITCLK

TXDAI

RXDAI

MSB

14 13

LSB

MSB

Figure 30: Master PCM timing, long frame selected

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3.15.4.2 Slave Mode

In slave mode the PCM interface is controlled by an external bit clock and an external frame sync signal applied to the BCLKIN and FSIN pins and delivered either by the connected codec or another source. The bit clock frequency has to be in the range of 256kHz -125ppm to 512kHz +125ppm.

Data transfer starts at the falling edge of FSIN if the short frame format is selected, and at the rising edge of FSIN if long frame format is selected. With this edge control the frame sync signal is independent of the frame sync pulse length.

TXDAI data is shifted out at the rising edge of BCLKIN. RXDAI data (i.e. data transmitted from the host application to the module’s RXDAI line) is sampled at the falling edge of BCLKIN.

The deviation of the external frame rate from the internal frame rate must not exceed ±125ppm. The internal frame rate of nominal 8kHz is synchronized to the GSM network. The difference between the internal and the external frame rate is equalized by doubling or skipping samples. This happens for example every second, if the difference is 125ppm. The resulting distortion can be neglected in speech signals.

The pins BITCLK and FS remain low in slave mode.

Figure 31 shows the typical slave configuration. The external codec delivers the bit clock and the frame sync signal. If the codec itself is not able to run in master mode as for example the MC145483, a third party has to generate the clock and the frame sync signal.

AC75

BCLKIN

FSIN

TXDAI

RXDAI

bitclk

Frame Sync

RX_data

TX_data

CODEC

Figure 31: Slave PCM interface application

The following figures show the slave short and long frame timings. Because these are edge controlled, frame sync signals may deviate from the ideal form as shown with the dotted lines.

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BCLKIN

FSIN

125 µs

TXDAI

RXDAI

BCLKIN

FSIN

TXDAI

RXDAI

MSB

14 13

LSB

MSB

Figure 32: Slave PCM timing, short frame selected

125 µs

MSB

14 13

LSB

MSB

Figure 33: Slave PCM timing, long frame selected

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3.16 GPIO Interface

The AC65/AC75 has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled.

The GIPO related AT commands are the following: AT^SPIO, AT^SCPIN, AT^SCPOL, AT^SCPORT, AT^SDPORT, AT^SGIO, AT^SSIO. A detailed description can be found in [1].

3.16.1 Using the GPIO10 Pin as Pulse Counter

The GPIO10 pin can be assigned two different functions selectable by AT command:

• The AT^SCPIN command configures the pin for use as GPIO.

• With AT^SCCNT and AT^SSCNT the pin can be configured and operated as pulse

counter.

Both functions exclude each other. The pulse counter disables the GPIO functionality, and vice versa, the GPIO functionality disables the pulse counter. Detailed AT command descriptions can be found in [1].

The pulse counter is designed to measure signals from 0 to 1000 pulses per second. It can be operated either in Limit counter mode or Start-Stop mode. Depending on the selected mode the counted value is either the number of pulses or the time (in milliseconds) taken to generate a number of pulses specified with AT^SCCNT.

In Limit counter mode, the displayed measurement result (URC “^SSCNT: <count>”) implies an inaccuracy <5ms. In Start-Stop mode, you can achieve 100% accuracy if you take care that no pulses are transmitted before starting the pulse counter (AT^SSCNT=0 or 1) and after closing the pulse counter (AT^SSCNT=3).

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3.17 Control Signals

3.17.1 Synchronization Signal

The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the SYNC pin. Please note that this pin can adopt three different operating modes which you can select by using the AT^SSYNC command: the mode AT^SSYNC=0 described below, and the two LED modes AT^SSYNC=1 or AT^SSYNC=2 described in [1] and Section 3.17.2.

The first function (factory default AT^SSYNC=0) is recommended if you want your application to use the synchronization signal for better power supply control. Your platform design must be such that the incoming signal accommodates sufficient power supply to the AC65/AC75 module if required. This can be achieved by lowering the current drawn from other components installed in your application.

The timing of the synchronization signal is shown below. High level of the SYNC pin indicates increased power consumption during transmission.

1 Tx 577 µs every 4.616 ms 2 Tx 1154 µs every 4.616 ms

Transmit burst

SYNC signal

The duration of the SYNC signal is always equal, no matter whether the traffic or the

t = 180 sµ

Figure 34: SYNC signal during transmit burst

access burst are active.

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3.17.2 Using the SYNC Pin to Control a Status LED

As an alternative to generating the synchronization signal, the SYNC pin can be configured to drive a status LED that indicates different operating modes of the AC65/AC75 module. To take advantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application. The connected LED can be operated in two different display modes (AT^SSYNC=1 or AT^SSYNC=2). For details please refer to [1].

Especially in the development and test phase of an application, system integrators are advised to use the LED mode of the SYNC pin in order to evaluate their product design and identify the source of errors.

To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample circuit is shown in Figure 35. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 26, SYNC pin.

Figure 35: LED Circuit (Example)

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3.17.3 Behavior of the RING0 Line (ASC0 Interface only)

The RING0 line is available on the first serial interface ASC0 (see also Chapter 3.10). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).

Although not mandatory for use in a host application, it is strongly suggested that you connect the RING0 line to an interrupt line of your application. In this case, the application can be designed to receive an interrupt when a falling edge on RING0 occurs. This solution is most effective, particularly, for waking up an application from power saving. Note that if the RING0 line is not wired, the application would be required to permanently poll the data and status lines of the serial interface at the expense of a higher current consumption. Therefore, utilizing the RING0 line provides an option to significantly reduce the overall current consumption of your application.

The behavior of the RING0 line varies with the type of event:

• When a voice/fax/data call comes in the RING0 line goes low for 1s and high for another

4s. Every 5 seconds the ring string is generated and sent over the /RXD0 line. If there is a call in progress and call waiting is activated for a connected handset or handsfree device, the RING0 line switches to ground in order to generate acoustic signals that indicate the waiting call.

RING0

Ring

string

Figure 36: Incoming voice/fax/data call

• All other types of Unsolicited Result Codes (URCs) also

cause the RING0 line to go low, however for 1 second only.

Figure 37: URC transmission

Ring

string

3.17.4 PWR_IND Signal

Ring

string

RING0

URC

PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required.

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4 Antenna Interface

The RF interface has an impedance of 50. AC65/AC75 is capable of sustaining a total mismatch at the antenna connector without any damage, even when transmitting at maximum RF power.

The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the AC65/AC75 PCB and should be placed in the host application.

Regarding the return loss AC65/AC75 provides the following values in the active band:

Table 17: Return loss in the active band

State of module Return loss of module Recommended return loss of application

Receive > 8dB > 12dB

Transmit not applicable > 12dB

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4.1 Antenna Diagnostic

The antenna diagnostic allows the customer to check the presence and the connection status of the antenna by using the AT^SAD command. A description of the AT^SAD command can be found in [1].

To properly detect the antenna and verify its connection status the antenna feed point must have a DC resistance R 12kΩ to 40k gives an undefined result.

A positive or negative voltage drop (referred to as V without having any impact on the measuring procedure and the measuring result. A peak deviation (V

) of ≤ 0.8V from ground is acceptable.

disturb

(peak) = ± 0.8V (maximum); f

disturb

Waveform: DC, sinus, square-pulse, peak-pulse (width = 100µs) R

= 5

disturb

of 9kΩ (±3kΩ). Any lower or higher resistance from 1kΩ to 6kΩ or

ANT

) on the ground line may occur

disturb

= 0Hz … 5kHz

disturb

Antenna connector

External antenna

9k±3k

AC75

Figure 38: Resistor measurement used for antenna detection

5 Ohm

disturb

Table 18: Values of the AT^SAD parameter <diag> and their meaning

Antenna connection status indicated by AT^SAD <diag> Equivalent ranges

Normal operation, antenna connected (resistance at feed point as required)

Antenna connector short-circuited to GND <diag>=1

Antenna connector is short-circuited to the supply voltage of the host application, for example the vehicle’s on-board power supply voltage

Antenna not properly connected, or resistance at antenna feed point wrong or not present

<diag>=0

<diag>=2 max. 36V

<diag>=3

= 6kΩ…12kΩ

ANT

= 0...1kΩ

ANT

= 40kΩ...Ω

ANT

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4.2 Antenna Connector

AC65/AC75 uses a subminiature coaxial antenna connector type SMP MIL-Std 348-A supplied from Rosenberger.

Table 19: Product specifications of Rosenberger SMP connector

Item Specification Conditions

Material and finish

Center contact Brass

0.8 µm gold plating over 2-4 µm NiP plating

Outer contact Brass

0.8 µm gold plating over 2-4 µm NiP plating

Dielectric PTFE

Electrical ratings

Nominal Impedance

Operating frequency DC – 2 GHz

VSWR 1.10 DC to 2 GHz

Insertion loss

Center contact resistance

Outer contact resistance

Insulation resistance

Working voltage 335 V rms at sea level

Dielectric withstanding voltage 500 V rms at sea level

Mechanical ratings

50 Ω

≤ 0.1 dB x √ f/GHz

max. 6 mΩ

max. 2 mΩ

5 GΩ

Durability 30 mating cycles

Engagement force 20-35 N

Disengagement force 30-50 N

Center contact captivation Axial retention force

Environmental ratings

Operating temperature -65°C to +155°C

Manufacturer

Rosenberger Hochfrequenztechnik GmbH & Co. POB 1260 D-84526 Tittmoning

http://www.rosenberger.de

7 N min.

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Figure 39: Datasheet of Rosenberger SMP MIL-Std 348-A connector

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5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

The absolute maximum ratings stated in Table 20 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to AC65/AC75. The power supply shall be compliant with the SELV safety standard defined in EN60950. The supply voltage must be limited according to Table 20.

Table 20: Absolute maximum ratings

Parameter Min Max Unit

Supply voltage BATT+ -0.3 5.5 V

Voltage at digital pins in POWER DOWN mode -0.3 0.3 V

Voltage at digital pins in normal operation -0.3 3.05

or VEXT+0.3

Voltage at analog pins in POWER DOWN mode -0.3 0.3 V

Voltage at analog pins, VMIC on4 -0.3 2.75 V

Voltage at analog pins, VMIC off4 -0.3 0.3 V

Voltage at VCHARGE pin -0.3 5.5 V

Voltage at CHARGEGATE pin -0.3 5.5 V

VUSB_IN -0.3 5.5 V

USB_DP, USB_DN -0.3 3.5 V

VSENSE 5.5 V

ISENSE 5.5 V

PWR_IND -0.3 10 V

VDDLP -0.3 5.5 V

For normal operation the voltage at analog pins with VMIC on should be within the range of 0V to 2.4V and with

VMIC off within the range of -0.25V to 0.25V.

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5.2 Operating Temperatures

Table 21: Board temperature

Parameter Min Typ Max Unit

Operating temperature range -30 +85

°C

Automatic shutdown5 Temperature measured on AC65/AC75 board Temperature measured at battery NTC

-30

-20

---

+90 +60

°C

Table 22: Ambient temperature according to IEC 60068-2 (without forced air circulation)

Parameter Min Typ Max Unit

+85

°C

Operating temperature range -30 +25 +75

Restricted operation6 --- +75 to

Table 23: Charging temperature

Parameter Min Typ Max Unit

Battery temperature for software controlled fast charging (measured at battery NTC)

0 --- +45 °C

Note:

• See Chapter 3.3.4 for further information about the NTCs for on-board and battery

temperature measurement, automatic thermal shutdown and alert messages.

• When data are transmitted over EGPRS or GPRS the AC65/AC75 automatically reverts

to a lower Multislot Class if the temperature increases to the limit specified for normal operation and, vice versa, returns to the higher Multislot Class if the temperature is back to normal. For details see Chapter 3.4 “Automatic EGPRS/GPRS Multislot Class Change”.

Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The

possible deviation is in the range of ± 3°C at the overtemperature limit and ± 5°C at the undertemperature limit.

Restricted operation allows normal mode speech calls or data transmission for limited time until automatic

thermal shutdown takes effect. The duration of emergency calls is unlimited because automatic thermal shutdown is deferred until hang up.

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5.3 Storage Conditions

The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.

Table 24: Storage conditions

Type Condition Unit Reference

Air temperature: Low

High

Humidity relative: Low

High

Condens.

Air pressure: Low

High

Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4

Water: rain, dripping, icing and frosting

Radiation: Solar

Heat

Chemically active substances Not

Mechanically active substances Not

Vibration sinusoidal:

Displacement

Acceleration

-40

+85

90 at 30°C

90-100 at 30°C

106

Not allowed --- ---

1120

600

recommended

1.5

°C ETS 300 019-2-1: T1.2, IEC 68-2-1 Ab

ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

% ---

ETS 300 019-2-1: T1.2, IEC 68-2-56 Cb

ETS 300 019-2-1: T1.2, IEC 68-2-30 Db

kPa IEC TR 60271-3-1: 1K4

IEC TR 60271-3-1: 1K4

W/m2 ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

IEC TR 60271-3-1: 1C1L

IEC TR 60271-3-1: 1S1

m/s

IEC TR 60271-3-1: 1M2

Frequency range

Shocks:

Shock spectrum

Duration

Acceleration

2-9 9-200

semi-sinusoidal

m/s

IEC 68-2-27 Ea

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5.4 Reliability Characteristics

The test conditions stated below are an extract of the complete test specifications.

Table 25: Summary of reliability test conditions

Type of test Conditions Standard

Vibration Frequency range: 10-20Hz; acceleration: 3.1mm

amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes

Shock half-sinus Acceleration: 500g

Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z)

Dry heat Temperature: +70 ±2°C

Test duration: 16h Humidity in the test chamber: < 50%

Temperature change (shock)

Damp heat cyclic High temperature: +55°C ±2°C

Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100

Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h

DIN IEC 68-2-6

DIN IEC 68-2-27

EN 60068-2-2 Bb ETS 300 019-2-7

DIN IEC 68-2-14 Na

ETS 300 019-2-7

DIN IEC 68-2-30 Db

ETS 300 019-2-5

Cold (constant exposure)

Temperature: -40 ±2°C Test duration: 16h

DIN IEC 68-2-1

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5.5 Pin Assignment and Signal Description

The Molex board-to-board connector on AC65/AC75 is an 80-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 1 which shows the top view of AC65/AC75.

1 GND GND 80

2 Not connected DAC_OUT 79

3 Not connected PWR_IND 78

4 GND

5 GPIO10 GPIO9 76

6 GPIO8 SPICS 75 7 SPIDI GPIO4 74

8 GPIO7 GPIO3 73

9 GPIO6 GPIO2 72

10 GPIO5 GPIO1 71

11 I2CCLK_SPICLK I2CDAT_SPIDO 70

12 VUSB_IN USB_DP 69

13 DAI5 USB_DN 68

14 ISENSE VSENSE 67

15 DAI6 VMIC 66

16 CCCLK EPN2 65

17 CCVCC EPP2 64

18 CCIO EPP1 63

19 CCRST EPN1 62

20 CCIN MICN2 61

21 CCGND MICP2 60

22 DAI4 MICP1 59

23 DAI3 MICN1 58

24 DAI2 AGND 57

25 DAI1 IGT 56

26 DAI0 EMERG_RST 55

27 BATT_TEMP DCD0 54

28 SYNC CTS1 53

29 RXD1 CTS0 52

30 RXD0 RTS1 51

31 TXD1 DTR0 50

32 TXD0 RTS0 49

33 VDDLP DSR0 48

34 VCHARGE RING0 47

35 CHARGEGATE VEXT 46

36 GND BATT+ 45

37 GND BATT+ 44

38 GND BATT+ 43

39 GND BATT+ 42

40 GND BATT+ 41

Do not use

Figure 40: Pin assignment (component side of AC65/AC75)

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Please note that the reference voltages listed in Table 26 are the values measured directly on the AC65/AC75 module. They do not apply to the accessories connected.

Table 26: Signal description

Function Signal name IO Signal form and level Comment

Power supply

Charge Interface

External supply voltage

BATT+ I

GND Ground Application Ground

VCHARGE I VImin = 1.015 * V

BATT_TEMP I

ISENSE I VImax = 4.65V

VSENSE I VImax = 4.5V VSENSE must be directly

CHARGEGATE O V

VEXT O Normal mode:

VImax = 4.5V

typ = 3.8V

min = 3.3V during Tx burst on board

I  2A, during Tx burst

n Tx = n x 577µs peak current every

4.616ms

max = 5.45V

Connect NTC with R

BATT+

 10kΩ @ 25°C to

NTC

ground. See Section 3.5.3 for B value of NTC.

∆VImax to V

= +0.3V at normal

BATT+

condition

max = 5.5V

max = 0.6mA

min = 2.75V

typ = 2.93V

max = 3.05V

max = -50mA

Five pins of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur.

Minimum voltage must not fall below 3.3V including drop, ripple, spikes.

This line signalizes to the processor that the charger is connected.

If unused keep pin open.

Battery temperature measurement via NTC resistance.

NTC should be installed inside or near battery pack to enable proper charging and deliver temperature values.

If unused keep pin open.

ISENSE is required for measuring the charge current. For this purpose, a shunt resistor for current measurement needs to be connected between ISENSE and VSENSE.

If unused connect pin to VSENSE.

connected to BATT+ at battery connector or external power supply.

Control line to the gate of charge FET

If unused keep pin open.

VEXT may be used for application circuits, for example to supply power for an I2C

If unused keep pin open. Not available in Power-down

mode. The external digital logic must not cause any spikes or glitches on voltage VEXT.

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Function Signal name IO Signal form and level Comment

Power indicator

Ignition IGT I

PWR_IND O VIHmax = 10V

Internal pull-up: R V

Emergency reset

EMERG_RST

Internal pull-up: R V

Signal

Power-on reset

Internal pull-up: R V

Reset signal driven by the module:

max = 0.4V at Imax = 2mA

 30kΩ, CI  10nF

max = 0.8V at Imax = -150µA

max = 4.5V (V

~~~

|____|

)

BATT+

~~~

Active Low ≥ 400ms

 5kΩ

max = 0.2V at Imax = -0.5mA

min = 1.75V

max = 3.05V

~~~

|______|

~~~

Pull down ≥ 10ms

 5kΩ

max = 0.2V at I = 2mA min = 1.75V

max = 3.05V

VEXT

PWR_IND (Power Indicator) notifies the module’s on/off state.

PWR_IND is an open collector that needs to be connected to an external pullup resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Powerdown mode.

Therefore, the pin may be used to enable external voltage regulators which supply an external logic for communication with the module, e.g. level converters.

This signal switches the mobile on.

This line must be driven low by an open drain or open collector driver.

Reset or turn-off in case of emergency: Pull down and release EMERG_RST. Then, activating IGT for 400ms will reset AC65/AC75. If IGT is not activated for 400ms, AC65/AC75 switches off.

Data stored in the volatile memory will be lost. For orderly software controlled reset rather use the AT+CFUN command (e.g. AT+CFUN=x,1).

This line must be driven by open drain or open collector.

If unused keep pin open.

Reset signal driven by the module which can be used to reset any application or device connected to the module. Only effective for 120ms during the assertion of IGT when the module is about to start.

EMRG_RST

appr. 120ms

(see also Figure 5 and Figure 6)

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Function Signal name IO Signal form and level Comment

Synchronization

SYNC

VOLmax = 0.3V at I = 0.1mA

min = 2.3V at I = -0.1mA

max = 3.05V

n Tx = n x 577µs impulse each 4.616ms, with 180µs forward time.

There are two alternative options for using the SYNC pin:

a) Indicating increased current consumption during uplink transmission burst. Note that the timing of the signal is different during handover.

b) Driving a status LED to indicate different operating modes of AC65/AC75. The LED must be installed in the host application.

To select a) or b) use the AT^SSYNC command.

If unused keep pin open.

RTC backup VDDLP I/O RI  1k

max = 4.5V

= 4.3V:

BATT+

= 3.2V at IO = -500µA

= 0V:

BATT+

= 2.4V…4.5V at I

max

= 25µA

If unused keep pin open.

ASC0

Serial interface

RXD0

TXD0

CTS0

RTS0

DTR0

DCD0

DSR0

RING0

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

VILmax = 0.8V

min = 2.15V

max = VEXTmin + 0.3V = 3.05V

Internal pull-down at TXD0: RI =330kΩ Internal pull-down at RTS0: R

=330kΩ

Serial interface for AT commands or data stream.

If lines are unused keep pins open.

ASC1

Serial interface

RXD1

TXD1

CTS1

RTS1

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

max = 0.8V

min = 2.15V

max = VEXTmin + 0.3V = 3.05V

4-wire serial interface for AT commands or data stream.

If lines are unused keep pins open.

Internal pull-down at TXD1: RI =330kΩ Internal pull-down at RTS1: R

=330kΩ

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Function Signal name IO Signal form and level Comment

SIM interface specified for use with 3V SIM card

CCIN I

CCRST O

CCIO I/O

 100kΩ

max = 0.6V at I = -25µA

min = 2.1V at I = -10µA

max = 3.05V

 47Ω

max = 0.25V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

 4.7kΩ

max = 0.75V

min = -0.3V

min = 2.1V

max = CCVCCmin + 0.3V = 3.05V

RO  100Ω V

max = 0.3V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

CCCLK O

 100Ω

max = 0.3V at I = +1mA

min = 2.5V at I = -0.5mA

max = 2.95V

CCIN = Low, SIM card holder closed

Maximum cable length or copper track 100mm to SIM card holder.

All signals of SIM interface are protected against ESD with a special diode array.

Usage of CCGND is mandatory.

CCVCC O VOmin = 2.75V

typ = 2.85V

max = 2.95V

max = -20mA

CCGND Ground

SIM interface specified for use with

1.8V SIM card

CCIN I

CCRST O

CCIO I/O

CCCLK O

 100kΩ

max = 0.6V at I = -25µA

min = 2.1V at I = -10µA

max = 3.05V

 47Ω

max = 0.25V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

 4.7kΩ

max = 0.45V

min = 1.35V

max = CCVCCmin + 0.3V = 2.00V

 100Ω

max = 0.3V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

 100Ω

max = 0.3V at I = +1mA

min = 1.45V at I = -0.5mA

max = 1.90V

CCIN = Low, SIM card holder closed

Maximum cable length or copper track 100mm to SIM card holder.

All signals of SIM interface are protected against ESD with a special diode array.

Usage of CCGND is mandatory.

CCVCC O VOmin = 1.70V,

typ = 1.80V

max = 1.90V

max = -20mA

CCGND Ground

SPI

Serial Peripheral Interface

SPIDI

I2CDAT_SPIDO

I2CCLK_SPICLK

SPICS

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

max = 0.8V

min = 2.15V,

max = VEXTmin + 0.3V = 3.05V

If the Serial Peripheral Interface is active the I interface is not available.

If lines are unused keep pins open.

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Function Signal name IO Signal form and level Comment

I2C interface

I2CCLK _SPICLK O VOLmax = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

I2CDAT_SPIDO I/O V

max = 0.2V at I = 2mA

max = 0.8V

min = 2.15V

VIHmax = VEXTmin + 0.3V = 3.05V

USB

General Purpose Input/Output

VUSB_IN I VINmin = 4.0V

max = 5.25V

USB_DN I/O

USB_DP I/O

Differential Output Crossover voltage Range V

min = 1.5V, V

CRS

Line to GND:

max = 3.6V

typ = 3.2V

min = 3.0V at I=-0.5mA

max = 0.2V at I=2mA

min = 2.24V

max = 0.96V

Driver Output Resistance Z

= 32Ohm

typ

Pullup at USB_DP R

GPIO1 I/O

GPIO2 I/O

GPIO3 I/O

GPIO4 I/O

GPIO5 I/O

GPIO6 I/O

GPIO7 I/O

GPIO8 I/O

GPIO9 I/O

GPIO10 I/O

max = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

VILmax = 0.8V V

min = 2.15V,

max = VEXTmin + 0.3V = 3.05V

Pulse counter: pulse

|________|

~~~~~~~~~~~~~

|  450µs |  450µs |

Slew rate  1µs Pulse rate: max. 1000 pulses per second

max = 2.0V

CRS

=1.5kOhm

typ

|________|

~~~

C interface is only available if the two pins are not used as SPI interface.

I2CDAT is configured as Open Drain and needs a pullup resistor in the host application.

According to the I Specification Version 2.1 for the fast mode a rise time of max. 300ns is permitted. There is also a maximum VOL=0.4V at 3mA specified.

The value of the pull-up depends on the capacitive load of the whole system (I2C Slave + lines). The maximum sink current of I2CDAT and I2CCLK is 4mA.

If lines are unused keep pins open.

All electrical characteristics according to USB Implementers’ Forum, USB

2.0 Full Speed Specification.

Without Java: USB port

Under Java: Debug interface for development purposes.

If lines are unused keep pins open.

All pins which are configured as input must be connected to a pull-up or pull-down resistor.

If lines are unused (not configured) keep pins open.

Alternatively, the GPIO10 pin can be configured as a pulse counter for pulse rates from 0 to 1000 pulses per second.

2C Bus

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Function Signal name IO Signal form and level Comment

Digital Analog Converter

DAC_OUT O VOLmax = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

PWM signal which can be smoothed by an external filter.

Use the AT^SWDAC command to open and configure the DAC_OUT output.

Digital Audio interface

Analog Audio interface

DAI0

DAI1

DAI2

DAI3

DAI4 DAI5 I

DAI6 I

VMIC O VOmin = 2.4V

EPP2 O

EPN2 O

VOLmax = 0.2V at I = 2mA

min = 2.55V at I = -0.5mA

max = 3.05V

max = 0.8V

min = 2.15V

max = VEXTmin + 0.3V = 3.05V

typ = 2.5V

max = 2.6V

= 2mA

max

3.0Vpp differential typical @ 0dBm0

4.2Vpp differential maximal @ 3.14dBm0

Measurement conditions: Audio mode: 6

See Table 16 for details.

If unused keep pins open.

Microphone supply for customer feeding circuits

The audio output can directly operate a 32-Ohmloudspeaker.

If unused keep pins open.

Outstep 3 No load

Minimum differential resp. single ended load 27Ohms

EPP1 O

EPN1 O

4.2Vpp (differential) typical @ 0dBm0

6.0Vpp differential maximal @ 3.14dBm0

Measurement conditions: Audio mode: 5

The audio output can directly operate an 8-Ohmloudspeaker.

If unused keep pins open.

Outstep 4 No load

Minimum differential resp. single ended load 7.5Ohms

MICP1 I

MICN1 I

Full Scale Input Voltage 1.6Vpp

0dBm0 Input Voltage 1.1Vpp

At MICN1, apply external bias from 1.0V to

1.6V.

Measurement conditions:

Balanced or single ended microphone or line input with external feeding circuit (using VMIC and AGND).

If unused keep pins open.

Audio mode: 5

MICP2 I

MICN2 I

Full Scale Input Voltage 1.6Vpp

0dBm0 Input Voltage 1.1Vpp

At MICN2, apply external bias from 1.0V to

1.6V.

Measurement conditions:

Balanced or single ended microphone or line input with external feeding circuit (using VMIC and AGND).

If unused keep pins open.

Audio mode: 6

AGND Analog Ground GND level for external audio

circuits

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5.6 Power Supply Ratings

Table 27: Power supply ratings

Parameter Description Conditions Min Typ Max Unit

BATT+

RTC Backup @ BATT+ = 0V 25 µA OFF State

VDDLP

BATT+

Supply voltage Directly measured at reference point

TP BATT+ and TP GND, see chapter

3.2.2

Voltage must stay within the min/max values, including voltage drop, ripple, spikes.

Voltage drop during transmit burst

Voltage ripple Normal condition, power control level

supply current

Average standby supply current8

Normal condition, power control level for P

for P

@ f<200kHz

@ f>200kHz

POWER DOWN mode

SLEEP mode @ DRX = 9 3.7 9 mA

SLEEP mode @ DRX = 5 4.6 9 mA

SLEEP mode @ DRX = 2 7.0 9 mA

IDLE mode @ DRX = 2 28

out max

50 100 µA

3.3 3.8 4.5 V

400 mV

Measured after module INIT (switch ON the module and following switch OFF); applied voltage on BATT+ (w/o

INIT) show increased POWER DOWN supply current.

Additional conditions:

- SLEEP and IDLE mode measurements started 5 minutes after switching ON the module or after mode transition

- Averaging times: SLEEP mode - 3 minutes; IDLE mode - 1.5 minutes

- Communication tester settings: no neighbor cells, no cell reselection

- USB interface disabled

Stated value applies to operation without autobauding (AT+IPR0).

Stated value applies to operation without autobauding (AT+IPR0). If autobauding is enabled (AT+IPR=0)

average current consumption in IDLE mode is up to 43mA.

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AC65/AC75 Hardware Interface Description

Confidential / Preliminary

Table 28: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz

Mode GSM call GPRS

Class 8

Timeslot configuration

RF power nominal 2W

Radio output power reduction with AT^SCFG, parameter <ropr>

Current characteristics

Burst current @ 50 antenna (typ.)

Burst current @ total mismatch

Average current @ 50 antenna (typ.)

Average current @ total mismatch

AT parameters are given in brackets <...> and marked italic. Statements on EGPRS apply to AC75 only.

1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx 1Tx / 4Rx

(33dBm)

<ropr> = 1 ... 3 <ropr> = 1 ... 3 <ropr> = 1

1.75A 1.75A 1.75A 1.48A 1.26A 1.1A 1.4A peak

3.2A 3.2A 3.2A 2.7A 2.3A 1.9A 1.8A peak

330mA 360mA 540mA 475mA 680mA 600mA 370mA 450mA 400mA

510mA 540mA 905mA 780mA 1200mA 1000mA 395mA 525mA 450mA

(33dBm)

GPRS Class10 GPRS Class 12 EGPRS

2W (33dBm)

1W (30dBm)

<ropr> = 2 or 3 <ropr> = 1

1W (30dBm)

EGPRS Class 10

Class 8

2Tx / 3Rx

0.5W (27dBm)

<ropr> = 2 or 3 <ropr> = 1 ... 3 <ropr> = 1 or 2 <ropr> = 3

0.5W (27dBm)

1.2A plateau

1.5A plateau

0.5W (27dBm)

1.4A peak

1.2A plateau

1.8A peak

1.5A plateau

0.25W (24dBm)

1.1A peak

1.0A plateau

1.4A peak

1.2A plateau

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Table 29: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz

1W (30dBm)

GPRS

Class 8

1W (30dBm)

Mode GSM call

Timeslot configuration

RF power nominal 1W

Radio output power reduction with AT^SCFG, parameter <ropr>

Current characteristics

Burst current @ 50 antenna (typ.)

Burst current @ total mismatch

Average current @ 50 antenna (typ.)

Average current @ total mismatch

AT parameters are given in brackets <...> and marked italic. Statements on EGPRS apply to AC75 only.

1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx

(30dBm)

<ropr> = 1 ... 3 <ropr> = 1 ... 3 <ropr> = 1

1.3A 1.3A 1.3A 1.1A 0.95A 0.85A 1.0A peak

2.2A 2.2A 2.2A 1.75A 1.5A 1.25A 1.3A peak

295mA 330mA 430mA 380mA 520mA 470mA 360mA 445mA 420mA

360mA 395mA 650mA 540mA 800mA 670mA 410mA 545mA 470mA

GPRS Class10 GPRS Class 12

0.5W (27dBm)

<ropr> = 2 or 3 <ropr> = 1

0.5W (27dBm)

0.25W (24dBm)

<ropr> = 2 or 3 <ropr> = 1 ... 3 <ropr> = 1 or 2 <ropr> = 3

EGPRS Class 8

0.4W (26dBm)

0.9A plateau

1.0A plateau

EGPRS Class 10

0.4W (26dBm)

1.0A peak

0.9A plateau

1.3A peak

1.0A plateau

0.2W (23dBm)

0.9A peak

0.75A plateau

1.1A peak

0.95A plateau

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5.7 Electrical Characteristics of the Voiceband Part

5.7.1 Setting Audio Parameters by AT Commands

The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters.

Table 30: Audio parameters adjustable by AT command

Parameter Influence to Range Gain range Calculation

inBbcGain MICP/MICN analogue amplifier gain of

baseband controller before ADC

inCalibrate Digital attenuation of input signal after

ADC

outBbcGain EPP/EPN analogue output gain of

baseband controller after DAC

outCalibrate[n] n = 0...4

sideTone Digital attenuation of sidetone

Digital attenuation of output signal after speech decoder, before summation of sidetone and DAC

Present for each volume step[n]

Is corrected internally by outBbcGain to obtain a constant sidetone independent of output volume

Note: The parameters outCalibrate and sideTone accept also values from 32768 to 65535. These values are internally truncated to 32767.

0...7 0...42dB 6dB steps

0...32767 -...0dB 20 * log (inCalibrate/

32768)

0...3 0...-18dB 6dB steps

0...32767 -...+6dB 20 * log (2 * outCalibrate[n]/

32768)

0...32767 -...0dB 20 * log (sideTone/

32768)

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5.7.2 Audio Programming Model

The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters inBbcGain and inCalibrate can be set with AT^SNFI. All the other parameters are adjusted with AT^SNFO.

Microphone

feeding

VMIC

GSM module

MIC1

MIC2

RXDDAI

EP1

8Ohms

EP2

32 Ohms

TXDDAI

<mic>

<io>

<ep>

AT parameters are given in brackets <...>

and marked red and italic.

Speech

coder

Speech

decoder

Figure 41: Audio programming model

AC65/AC75_hd_v00.372 Page 97 of 118 2006-08-03

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5.7.3 Characteristics of Audio Modes

The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. All values are noted for default gains e.g. all parameters of AT^SNFI and AT^SNFO are left unchanged.

Table 31: Voiceband characteristics (typical)

Audio mode no. AT^SNFS=

1 (Default settings, not

2 3 4 5 6

adjustable)

Name Default

Handset

Purpose DSB with

Votronic handset

Gain setting via AT command. Defaults:

inBbcGain outBbcGain

Default audio interface

Power supply VMIC ON ON ON ON ON ON

Sidetone Fix --- Adjustable Adjustable Adjustable Adjustable

Volume control Fix Adjustable Adjustable Adjustable Adjustable Adjustable

Echo control

Echo canceller ON ON ON ON OFF OFF

Loss controller idle/full attenuation

Comfort noise generator

Non linear processor ON ON ON ON OFF OFF

MIC input signal for 0dBm0

-10dBm0 f=1024 Hz

EP output signal in mV rms. @ 0dBm0, 1024 Hz, no load (default gain) /

@ 3.14 dBm0

Sidetone gain at default settings

Fix

5 (30dB) 1 (-6dB)

1 2 2 1 1 2

3dB / 6dB 4dB / 50dB 9dB / 18dB 3dB / 6dB OFF OFF

ON ON ON ON OFF OFF

18mV

5.8mV

475mV 70mV

21.9dB - dB 10.0dB 21.9dB - dB - dB

Basic Handsfree

Siemens Car Kit Portable

Adjustable

2 (12dB) 2 (-12dB)

--95mV

default @ max volume

Headset User

Handset

Siemens Headset

Adjustable

5 (30dB) 1 (-6dB)

--14mV

270mV default @ max volume

DSB with individual handset

Adjustable

5 (30dB) 1 (-6dB)

18mV

5.8mV

475mV default @ max volume

Plain Codec 1

Direct access to speech coder

Adjustable

0 (0dB) 0 (0dB)

400mV 126mV

1.47V

Vpp = 6.2 V

Plain Codec 2

Direct access to speech coder

Adjustable

0 (0dB) 0 (0dB)

400mV 126mV

1.47V

NOTE: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification, e.g. for a highly sensitive earpiece. A protection circuit should be implemented in the cellular application.

Audio mode 5 and 6 are identical. AT^SAIC can be used to switch mode 5 to the second interface. Audio mode

6 is therefore kept mainly for compatibility to earlier Siemens GSM products.

In audio modes with an active loss controller a continuous sine signal is attenuated by the idle attenuation after

a few seconds. All input voltages are noted for the idle attenuation. If the idle attenuation is higher than 3 dB, 0dBm0 cannot be reached without clipping. In this case only the value for -10dBm0 is noted.

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5.7.4 Voiceband Receive Path

Test conditions:

• The values specified below were tested to 1kHz with default audio mode settings, unless

otherwise stated.

• Default audio mode settings are: mode=5 for EPP1 to EPN1 and mode=6 for EPP2 to

EPN2, inBbcGain=0, inCalibrate=32767, outBbcGain=0, OutCalibrate=16384 (volume=4) or OutCalibrate=11585 (volume=3), sideTone=0.

Table 32: Voiceband receive path

Parameter Min Typ Max Unit Test condition / remark

Maximum differential output voltage (peak to peak)

EPP1 to EPN1

Maximum differential output voltage (peak to peak)

EPP2 to EPN2

Nominal differential output voltage (peak to peak)

EPP1 to EPN1

Nominal differential output voltage (peak to peak)

EPP1 to EPN1

Output bias voltage Batt+/2 V from EPP1 or EPN1 to AGND

Output bias voltage 1.2 V from EPP2 or EPN2 to AGND

Differential output gain settings (gs) at 6dB stages (outBbcGain)

Fine scaling by DSP (outCalibrate)

Differential output load resistance

Single ended output load resistance

Absolute gain error -0.1 0.1 dB outBbcGain=2

Idle channel noise14 -83 -75 dBm0p outBbcGain=2

Signal to noise and distortion

6.0

6.2

4.0

4.2

4.3

2.8

2.9

-18 0 dB Set with AT^SNFO

- 0 dB Set with AT^SNFO

7.5 8  From EPP1 to EPN1

27 32  From EPP2 to EPN2

7.5 8  From EPP1 or EPN1 to AGND

27 32  From EPP2 or EPN2 to AGND

47 dB outBbcGain=2

V V 8 ,

no load, Audio Mode 5, Volume 4 @ 3.14 dBm0 (Full Scale) Batt+ = 3.6V

V V 32 ,

no load Audio Mode 6, Volume 3 @ 3.14 dBm0 (Full Scale)

V V 8 ,

no load, Audio Mode 5, Volume 4 @ 0 dBm0 (Nominal level)

V V 32 ,

no load Audio Mode 6, Volume 3 @ 0 dBm0 (Nominal level)

Full scale of EPP2/EPN2 is lower than full scale of EPP1/EPN1 but the default gain is the same. 3.14dBm0 will

lead to clipping if the default gain is used.

The idle channel noise was measured with digital zero signal fed to decoder. This can be realized by setting

outCalibrate and sideTone to 0 during a call.

The test signal is a 1 kHz, 0 dbm0 sine wave.

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Parameter Min Typ Max Unit Test condition / remark

Frequency Response16

0Hz - 100Hz 200Hz 300Hz - 3350Hz 3400Hz 4000Hz 4400Hz

-0.2

-1.1

-0.7

-39

-34

0.1

-75

gs = gain setting

5.7.5 Voiceband Transmit Path

Test conditions:

• The values specified below were tested to 1kHz and default settings of audio modes,

unless otherwise stated.

• Parameter setup: Audio mode=5 for MICP1 to MICN1 and 6 for MICP2 to MICN2,

inBbcGain=0, inCalibrate=32767, outBbcGain=0, OutCalibrate=16384, sideTone=0

Table 33: Voiceband transmit path

Parameter Min Typ Max Unit Test condition / Remark

Full scale input voltage (peak to peak) for 3.14dBm0

MICP1 to MICN1 or AGND, MICP2 to MICN2 or AGND

Nominal input voltage (peak to peak) for 0dBm0

MICP1 to MICN1 or AGND, MICP2 to MICN2 or AGND

Input amplifier gain in 6dB steps (inBbcGain)

Fine scaling by DSP (inCalibrate) - 0 dB Set with AT^SNFI

Microphone supply voltage VMIC 2.4 2.5 2.6 V

VMIC current 2 mA

Idle channel noise -82 -76 dBm0p

Signal to noise and distortion 70 77 dB

Frequency response16

0Hz - 100Hz 200Hz 300Hz - 3350Hz 3400Hz 4000Hz 4400Hz

1.6 V MICPx must be biased with

1.25V (VMIC/2)

1.1 V MICPx must be biased with

1.25V (VMIC/2)

0 42 dB Set with AT^SNFI

-0.2

-1.1

-0.7

-39

-34

0.1

-75

This is the frequency response from a highpass and lowpass filter combination in the DAC of the baseband chip

set. If the PCM interface is used, this filter is not involved in the audio path. Audio mode 1 to 4 incorporate additional frequency response correction filters in the digital signal processing unit and are adjusted to their dedicated audio devices (see Table 31).

AC65/AC75_hd_v00.372 Page 100 of 118 2006-08-03

Gemalto M2M AC75 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1.2 Terms and Abbreviations

1.3.1 SAR Requirements Specific to Portable Mobiles

2.1 Key Features at a Glance

2.2 AC65/AC75 System Overview

3.2.1 Minimizing Power Losses

3.2.3 Monitoring Power Supply by AT Command

3.3 Power-Up / Power-Down Scenarios

3.3.1 Turn on AC65/AC75

3.3.1.1 Turn on AC65/AC75 Using Ignition Line IGT

3.3.1.3 Turn on AC65/AC75 Using the VCHARGE Signal

3.3.1.4 Reset AC65/AC75 via AT+CFUN Command

3.3.1.5 Reset or Turn off AC65/AC75 in Case of Emergency

3.3.2 Signal States after Startup

3.3.3 Turn off AC65/AC75

3.3.3.1 Turn off AC65/AC75 Using AT Command

3.3.3.2 Leakage Current in Power-Down Mode

3.3.3.3 Turn on/off AC65/AC75 Applications with Integrated USB

3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions

3.3.4.3 Monitoring the Board Temperature of AC65/AC75

3.3.4.4 Undervoltage Shutdown if Battery NTC is Present

3.3.4.5 Undervoltage Shutdown if no Battery NTC is Present

3.4 Automatic EGPRS/GPRS Multislot Class Change

3.5.3 Battery Pack Requirements

3.5.5 Implemented Charging Technique

3.5.6 Operating Modes during Charging

3.6.1 Network Dependency of SLEEP Modes

Power Saving

3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7

3.6.3 Timing of the RTSx Signal in CYCLIC SLEEP Mode 9

3.7 Summary of State Transitions (Except SLEEP Mode)

3.10 Serial Interface ASC0

3.11 Serial Interface ASC1

3.15.2.2 Differential Microphone Input

3.15.2.3 Line Input Configuration with OpAmp

3.15.4 Digital Audio Interface (DAI)

3.16.1 Using the GPIO10 Pin as Pulse Counter

3.17.2 Using the SYNC Pin to Control a Status LED

3.17.3 Behavior of the RING0 Line (ASC0 Interface only)

5 Electrical, Reliability and Radio Characteristics

5.1 Absolute Maximum Ratings

5.5 Pin Assignment and Signal Description

5.6 Power Supply Ratings

5.7 Electrical Characteristics of the Voiceband Part

5.7.1 Setting Audio Parameters by AT Commands

5.7.2 Audio Programming Model

5.7.3 Characteristics of Audio Modes

5.7.4 Voiceband Receive Path

5.7.5 Voiceband Transmit Path