12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Industrial equipment
Compliant to RoHS II EU “Directive 2011/65/EU”
Compatible in a Pb-free or SnPb reflow environment
Compliant to IPC-9592 (September 2008), Category 2,
Class II
DOSA based
Wide Input voltage range (3Vdc-14.4Vdc)
Output voltage programmable from 0.6Vdc to 5.5Vdc
via external resistor
TM
Tunable Loop
response
Power Good signal
Fixed switching frequency
Output overcurrent protection (non-latching)
Overtemperature protection
Remote On/Off
Ability to sink and source current
Cost efficient open frame design
Small size: 12.2 mm x 12.2 mm x 8.5 mm
(0.48 in x 0.48 in x 0.335 in)
Wide operating temperature range [-40°C to
105°C(Ruggedized: -D), 85°C(Regular)]
UL* 60950-1Recognized, CSA
Certified, and VDE
ISO** 9001 and ISO 14001 certified manufacturing
facilities
to optimize dynamic output voltage
†
‡
0805:2001-12 (EN60950-1) Licensed
C22.2 No. 60950-1-03
The 12A Analog PicoDLynxTM power modules are non-isolated dc-dc converters that can deliver up to 12A of output current.
These modules operate over a wide range of input voltage (V
from 0.6Vdc to 5.5Vdc, programmable via an external resistor. Features include remote On/Off, adjustable output voltage, over
current and over temperature protection. The Tunable Loop
converter to match the load with reduced amount of output capacitance leading to savings on cost and PWB area.
= 3Vdc-14.4Vdc) and provide a precisely regulated output voltage
IN
TM
feature allows the user to optimize the dynamic response of the
Page 2
GE
Data Sheet
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All V
Continuous
Operating Ambient Temperature All T
(see Thermal Considerations section) -D version T
Storage Temperature All T
IN
A
A
stg
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
Calculated MTBF (IO=0.8I
, TA=40°C) Telecordia Issue 2 Method 1
Input Low Current
All
I
10
μA
Device Code with no suffix – Negative Logic (See Ordering
Information)
Case 1: On/Off input is enabled and then input power is
10% of V
)
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)
120/
130
General Specifications
Parameter Device Min Typ Max Unit
Case 3
O, max
Weight
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal Interface
(VIN=V
Signal referenced to GND)
IN, min
to V
; open collector or equivalent,
IN, max
All 16,817,995 Hours
2.33(0.082)
g (oz.)
Device is with suffix “4” – Positive Logic (See Ordering Information)
Logic High (Module ON)
Input High Current All IIH
Input High Voltage All VIH
Logic Low (Module OFF)
Input Low Voltage All VIL
IL
3.0
1 mA
V
Vdc
IN,max
-0.2
0.3 Vdc
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Logic High (Module OFF)
Input High Current All IIH――1 mA
Input High Voltage All VIH3.0 ―V
Vdc
IN, max
Logic Low (Module ON)
Input low Current All IIL――10 μA
Input Low Voltage All VIL-0.2 ―0.4 Vdc
Turn-On Delay and Rise Times
(VIN=V
applied (delay from instant at which VIN = V
Case 2: Input power is applied for at least one second and
then the On/Off input is enabled (delay from instant at
which Von/Off is enabled until V
IN, nom
, IO=I
o, set
to within ±1% of steady state)
O, max , VO
until Vo =
IN, min
All Tdelay ―5 ―msec
All Tdelay ―5 ―msec
o = 10% of Vo, set)
All Trise
―2 ―msec
Output voltage overshoot (TA = 25oC 3.0 % V
VIN= V
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
0
10
20
30
40
50
60
0.51.5
2.53.54.5
Ripple (mVp-p)
Output Voltage(Volts)
1x22uF E xt Cap
1x47uF E xt Cap
2x47uF E xt Cap
4x47uF E xt Cap
Design Considerations
Input Filtering
The 12A Analog PicoDLynxTM module should be
connected to a low ac-impedance source. A highly
inductive source can affect the stability of the module. An
input capacitance must be placed directly adjacent to the
input pin of the module, to minimize input ripple voltage
and ensure module stability.
To minimize input voltage ripple, ceramic capacitors are
recommended at the input of the module. Figure 37
shows the input ripple voltage for various output voltages
at 12A of load current with 2x22 µF or 3x22 µF ceramic
capacitors and an input of 12V.
250
200
2x22uF
3x22uF
Figure 38. Output ripple voltage for various output
voltages with external 1x22 µF, 1x47 µF, 2x47 µF or 4x47
µF ceramic capacitors at the output (12A load). Input
voltage is 12V.
Safety Considerations
150
100
50
Input Ripple Voltage (mVp-p)
Figure 37. Input ripple voltage for various output
voltages with 2x22 µF or 3x22 µF ceramic capacitors at
the input (12A load). Input voltage is 12V.
0.5 11.5 22.5 33.5 44.5 5
Output Voltage (Vdc)
Output Filtering
The 12A Analog PicoDLynxTM modules are designed for low
output ripple voltage and will meet the maximum output
ripple specification with 0.1 µF ceramic and 22 µF ceramic
capacitors at the output of the module. However, additional
output filtering may be required by the system designer for
a number of reasons. First, there may be a need to further
reduce the output ripple and noise of the module. Second,
the dynamic response characteristics may need to be
customized to a particular load step change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. Figure 38 provides output ripple
information for different external capacitance values at
various Vo and a full load current of 12A. For stable
operation of the module, limit the capacitance to less than
the maximum output capacitance as specified in the
electrical specification table. Optimal performance of the
module can be achieved by using the Tunable Loop
feature described later in this data sheet
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e.,
UL 60950-1 2nd, CSA C22.2 No. 60950-1-07, DIN EN 609501:2006 + A11 (VDE0805 Teil 1 + A11):2009-11; EN 609501:2006 + A11:2009-03.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input
must meet SELV requirements. The power module has
extra-low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a time delay
fuse with a maximum rating of 15 A in the positive input
lead
.
Data Sheet
Page 13
GE
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
VO(+)
TRIM
R
trim
LOAD
VIN(+)
ON/OFF
VS+
GND
PVX012 NEGATIVE LOGIC FIGURE
22K
Q4
Rpullup
I
ON/OFF
GND
VIN+
ON/OFF
22K
PWM Enable
+
_
ON/OFF
V
CSS
Q1
MODULE
0
2
4
6
8
10
12
14
16
0.5 1 1.5 2 2.5 3 3.5 4 4.55 5.5 6
Input Voltage (v)
Output Voltage (V)
Lower
Upper
Feature Descriptions
Remote On/Off
The 12A Analog PicoDLynxTM power modules feature an
On/Off pin for remote On/Off operation. Two On/Off logic
options are available. In the Positive Logic On/Off option,
(device code suffix “4” – see Ordering Information), the
module turns ON during a logic High on the On/Off pin and
turns OFF during a logic Low. With the Negative Logic
On/Off option, (no device code suffix, see Ordering
Information), the module turns OFF during logic High and ON
during logic Low. The On/Off signal should be always
referenced to ground. For either On/Off logic option, leaving
the On/Off pin disconnected will turn the module ON when
input voltage is present.
For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 39. When the external
transistor Q1 is in the OFF state, the internal PWM Enable
signal is pulled high through an internal resistor and the
external pullup resistor and the module is ON. When
transistor Q1 is turned ON, the On/Off pin is pulled low and
the module is OFF. A suggested value for R
TBA
Figure 39. Circuit configuration for using positive On/Off
logic.
For negative logic On/Off modules, the circuit configuration
is shown in Fig. 40. The On/Off pin should be pulled high with
an external pull-up resistor (suggested value for the 3V to
14.4V input range is 20Kohms). When transistor Q1 is in the
OFF state, the On/Off pin is pulled high, internal transistor Q4
is turned ON and the module is OFF. To turn the module ON,
Q1 is turned ON pulling the On/Off pin low, turning transistor
Q4 OFF resulting in the PWM Enable pin going high and the
module turning ON.
pullup
is TBD
Data Sheet
The module has monotonic start-up and shutdown behavior
for any combination of rated input voltage, output current
and operating temperature range.
Startup into Pre-biased Output
The modules can start into a prebiased output as long as
the prebias voltage is 0.5V less than the set output voltage.
Output Voltage Programming
The output voltage of the module is programmable to any
voltage from 0.6dc to 5.5Vdc by connecting a resistor
between the Trim and GND pins of the module. Certain
restrictions apply on the output voltage set point depending
on the input voltage. These are shown in the Output Voltage
vs. Input Voltage Set Point Area plot in Fig. 41. The Upper
Limit curve shows that for output voltages lower than 1V,
the input voltage must be lower than the maximum of
14.4V. The Lower Limit curve shows that for output voltages
higher than 0.6V, the input voltage needs to be larger than
the minimum of 3V.
Figure 41. Output Voltage vs. Input Voltage Set Point Area
plot showing limits where the output voltage can be set
for different input voltages.
Figure 40. Circuit configuration for using negative On/Off
logic.
Figure 42. Circuit configuration for programming output
voltage using an external resistor.
Without an external resistor between Trim and GND pins,
the output of the module will be 0.6Vdc. To calculate the
value of the trim resistor, Rtrim for a desired output voltage,
should be as per the following equation:
Page 14
GE
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
()
Ω
−
=k
Vo
Rtrim
6.0
12
V
O, set
(V)
Rtrim (KΩ)
0.6
Open
0.9
40
1.0
30
1.2
20
1.5
13.33
1.8
10
2.5
6.316
3.3
4.444
5.0
2.727
Vo
MODULE
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
MODULE
Rtrim1
for
Digital
GND (PIN 7)
SIG_GND
TRIM
Rtrim2
for
Analog
Rtrim is the external resistor in kΩ
Vo is the desired output voltage. Table 1 provides Rtrim
values required for some common output voltages.
Table 1
Data Sheet
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back
into its specified range.
Overtemperature Protection
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. The unit will
shutdown if the overtemperature threshold of 120(Q1) /
o
130(L1)
C(typ) is exceeded at the thermal reference point T
. Once the unit goes into thermal shutdown it will then wait
to cool before attempting to restart.
Input Undervoltage Lockout
ref
Remote Sense
The power module has a Remote Sense feature to minimize
the effects of distribution losses by regulating the voltage at
the SENSE pin. The voltage between the SENSE pin and
VOUT pin should not exceed 0.5V.
Voltage Margining
Output voltage margining can be implemented in the
module by connecting a resistor, R
to the ground pin for margining-up the output voltage and
by connecting a resistor, R
output pin for margining-down. Figure 43 shows the circuit
configuration for output voltage margining. The POL
Programming Tool, available at www.lineagepower.com
under the Downloads section, also calculates the values of
R
margin-up
margin. Please consult your local GE technical
representative for additional details.
Figure 43. Circuit Configuration for margining Output
voltage.
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
Power Good
The module provides a Power Good (PGOOD) signal that is
implemented with an open-drain output to indicate that the
output voltage is within the regulation limits of the power
module. The PGOOD signal will be de-asserted to a low state
if any condition such as overtemperature, overcurrent or
loss of regulation occurs that would result in the output
voltage going ±10% outside the setpoint value. The PGOOD
terminal can be connected through a pullup resistor
(suggested value 100KΩ) to a source of 5VDC or lower.
Dual Layout
Identical dimensions and pin layout of Analog and Digital
PicoDLynx modules permit migration from one to the other
without needing to change the layout. To support this, 2
separate Trim Resistor locations have to be provided in the
layout. For the digital modules, the resistor is connected
between the TRIM pad and SGND and in the case of the
analog module it is connected between TRIM and GND
(PVX012 / PDT012)
Caution – Do not connect SIG_GND to GND elsewhere in the
layout
Figure 44. Layout to support either Analog or Digital
PicoDLynx on the same pad.
Page 15
GE
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
µ
1x47µF
Polymer
3x47µF
Polymer
1x47
F
F
R
330
330
270
270
220
180
C
∆V
MODULE
VOUT
SENSE
TRIM
GND
RTUNE
CTUNE
RTrim
C O
Tunable Loop
TM
The 12A PicoDLynxTM modules have a feature that optimizes
transient response of the module called Tunable Loop
TM
.
External capacitors are usually added to the output of the
module for two reasons: to reduce output ripple and noise
(see Figure 38) and to reduce output voltage deviations from
the steady-state value in the presence of dynamic load
current changes. Adding external capacitance however
affects the voltage control loop of the module, typically
causing the loop to slow down with sluggish response.
Larger values of external capacitance could also cause the
module to become unstable.
The Tunable Loop
voltage control loop to match the filter network connected
to the output of the module. The Tunable Loop
TM
allows the user to externally adjust the
TM
is
implemented by connecting a series R-C between the SENSE
and TRIM pins of the module, as shown in Fig. 45. This R-C
allows the user to externally adjust the voltage loop
feedback compensation of the module.
Data Sheet
Table 2. General recommended values of of R
C
for Vin=12V and various external ceramic capacitor
TUNE
combinations.
Co 1x47
R
TUNE
C
TUNE
F 2x47µF 4x47µF 6x47µF 10x47µF 20x47µF
330 330 330 330 270 180
100pF 560pF 1500pF 2200pF 3900pF 6800pF
Table 3. Recommended values of R
TUNE
and C
transient deviation of 2% of Vout for a 6A step load with
Vin=12V.
Vo 5V 3.3V 2.5V 1.8V 1.2V 0.6V
µF +
Co
5x47µF
TUNE
TUNE
1500pF 2700pF 3300pF 5600pF 10nF 47nF
99mV 58mV 47mV 34mV 24mV 12mV
+
330µF
+
330µF
2x330µ
Polymer
1x47µF +
3x330µF
Polymer
Note: The capacitors used in the Tunable Loop tables are
47 μF/3 mΩ ESR ceramic and 330 μF/12 mΩ ESR polymer
capacitors.
TUNE
TUNE
and
to obtain
3x47µF +
6x330µ
Polymer
Figure. 45. Circuit diagram showing connection of R
and C
Recommended values of R
to tune the control loop of the module.
TUNE
TUNE
and C
for different output
TUNE
TUME
capacitor combinations are given in Tables 2 and 3. Table 2
shows the recommended values of R
TUNE
and C
TUNE
for
different values of ceramic output capacitors up to 1000uF
that might be needed for an application to meet output
ripple and noise requirements. Selecting R
TUNE
and C
TUNE
according to Table 2 will ensure stable operation of the
module.
In applications with tight output voltage limits in the
presence of dynamic current loading, additional output
capacitance will be required. Table 3 lists recommended
values of R
TUNE
and C
in order to meet 2% output
TUNE
voltage deviation limits for some common output voltages
in the presence of a 6A to 12A step change (50% of full load),
with an input voltage of 12V.
Please contact your GE technical representative to obtain
more details of this feature as well as for guidelines on how
to select the right value of external R-C to tune the module
for best transient performance and stable operation for
other output capacitance values or input voltages other
than 12V.
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
Air
flow
x
Power Module
Wind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Figure 46. Thermal Test Setup.
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will result
in an increase in reliability. The thermal data presented here is
based on physical measurements taken in a wind tunnel. The
test set-up is shown in Figure 46. The preferred airflow
direction for the module is in Figure 47.
Data Sheet
Figure 47. Preferred airflow direction and location of
hot-spot of the module (Tref).
The thermal reference points, T
also shown in Figure 45. For reliable operation the temperature
at Q1 should not exceed 120
should not exceed 130oC. The output power of the module
should not exceed the rated power of the module (Vo,set x
Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
PSD Level
(G2/Hz)
PSD Level
(G2/Hz)
PSD Level
(G2/Hz)
10
1.14E-03
170
2.54E-03
690
1.03E-03
30
5.96E-03
230
3.70E-03
800
7.29E-03
40
9.53E-04
290
7.99E-04
890
1.00E-03
50
2.08E-03
340
1.12E-02
1070
2.67E-03
90
2.08E-03
370
1.12E-02
1240
1.08E-03
110
7.05E-04
430
8.84E-04
1550
2.54E-03
130
5.00E-03
490
1.54E-03
1780
2.88E-03
140
8.20E-04
560
5.62E-04
2000
5.62E-04
PSD Level
(G2/Hz)
PSD Level
(G2/Hz)
PSD Level
(G2/Hz)
10
0.00803
170
0.01795
690
0.00727
30
0.04216
230
0.02616
800
0.05155
40
0.00674
290
0.00565
890
0.00709
50
0.01468
340
0.07901
1070
0.01887
90
0.01468
370
0.07901
1240
0.00764
110
0.00498
430
0.00625
1550
0.01795
130
0.03536
490
0.01086
1780
0.02035
140
0.0058
560
0.00398
2000
0.00398
Shock and Vibration
The ruggedized (-D version) of the modules are designed to withstand elevated levels of shock and vibration to be able to operate
in harsh environments. The ruggedized modules have been successfully tested to the following conditions:
Non operating random vibration:
Random vibration tests conducted at 25C, 10 to 2000Hz, for 30 minutes each level, starting from 30Grms (Z axis) and up to 50Grms
(Z axis). The units were then subjected to two more tests of 50Grms at 30 minutes each for a total of 90 minutes.
Operating shock to 40G per Mil Std. 810F, Method 516.4 Procedure I:
The modules were tested in opposing directions along each of three orthogonal axes, with waveform and amplitude of the shock
impulse characteristics as follows:
All shocks were half sine pulses, 11 milliseconds (ms) in duration in all 3 axes.
Units were tested to the Functional Shock Test of MIL-STD-810, Method 516.4, Procedure I - Figure 516.4-4. A shock magnitude of
40G was utilized. The operational units were subjected to three shocks in each direction along three axes for a total of eighteen
shocks.
Operating vibration per Mil Std 810F, Method 514.5 Procedure I:
The ruggedized (-D version) modules are designed and tested to vibration levels as outlined in MIL-STD-810F, Method 514.5, and
Procedure 1, using the Power Spectral Density (PSD) profiles as shown in Table 1 and Table 2 for all axes. Full compliance with
performance specifications was required during the performance test. No damage was allowed to the module and full compliance
to performance specifications was required when the endurance environment was removed. The module was tested per MIL-STD810, Method 514.5, Procedure I, for functional (performance) and endurance random vibration using the performance and
endurance levels shown in Table 4 and Table 5 for all axes. The performance test has been split, with one half accomplished before
the endurance test and one half after the endurance test (in each axis). The duration of the performance test was at least 16
minutes total per axis and at least 120 minutes total per axis for the endurance test. The endurance test period was 2 hours
minimum per axis.
Table 4: Performance Vibration Qualification - All Axes
Frequency (Hz)
Table 5: Endurance Vibration Qualification - All Axes
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
PIN
FUNCTION
PIN
FUNCTION
1
ON/OFF
10
PGOOD
2
VIN
11
NC
3
GND
12
NC
4
VOUT
13
NC
5
VS+ (SENSE)
14
NC
6
TRIM
15
NC
7
GND
16
NC
8
NC
17
NC
9
NC
16
17
11
8 9 7
15
14
12
13
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
PIN
FUNCTION
PIN
FUNCTION
1
ON/OFF
10
PGOOD
2
VIN
11
NC
4
VOUT
13
NC
5
VS+ (SENSE)
14
NC 6 TRIM
15
NC
8
NC
17
NC 9 NC
16
17
11
8 7 15
12
13
9
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
12A Analog PicoDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Surface Mount Information
Pick and Place
The 12VAnalog PicoDLynxTM 12A modules use an open
frame construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able
to withstand reflow temperatures of up to 300
also carries product information such as product code,
serial number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Variables such as nozzle size, tip
style, vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended inside nozzle diameter for reliable operation
is 3mm. The maximum nozzle outer diameter, which will
safely fit within the allowable component spacing, is 7 mm.
o
C. The label
Data Sheet
recommended profile requires testing to verify results and
performance.
MSL Rating
The 12VAnalog PicoDLynxTM 12A modules have a MSL
rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly is
attempted, components may fall off the module during the
second reflow process.
Lead Free Soldering
The 12VAnalog PicoDLynxTM 12A modules are lead-free (Pbfree) and RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions below
may result in the failure of or cause damage to the modules
and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). For questions regarding LGA, solder volume; please
contact GE for special manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 48.Soldering outside of the
Figure 48. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to Board Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).