GE Digital RXi2-UP Specifications

GE Power

RXi2-UP Industrial PC

The Next Generation of
Ruggedized Computing

GE’s Automation & Controls has
developed the next generation of its
powerful, expandable, and reliable
industrial computers (IPC). RXi2 IPCs
offer new processor choices, increased
and faster storage, improved graphics,
and enhanced security features.
Regardless of the processor you choose,
the RXi2 family of IPCs (EP, XP & UP)
offer all the functionality in the same
shared chassis.

The RXi2-UP IPC delivers compact,
rugged, mid-to high-range performance
computing capabilities to run HMI,
historian, and analytics applications right
at the machine to enable improved real­time control of operations and better
integration into plant-wide systems.

Combining outstanding computing
capabilities with the added
expandability of 0, 1, 2 or 4 PCI Express

slots and CFast storage, the RXi2-UP
is ideal for a range of demanding
industrial applications.

High-Performance
Computing

GE selected the latest Intel processors
based on their unmatched performance.
The RXi2-UP IPC has up to 32GB of ECC
RAM, 5 Gigabit Ethernet interfaces, and
industrial grade SSD disk storage to
complete the high-performance design.

These features make the RXi2-UP IPC the
perfect platform for running GE’s Proficy
software applications or other industrial
EDGE applications right at the machine,
even in the harshest environments.

The RXi2-UP IPC provides additional
application flexibility with both mini PCI
Express and low-profile PCI Express slots.
This expandability combined with advanced

*

CPUs delivers high-performance, computing.

The core of the RXi2-UP IPC architecture
is GE’s rugged COM Express modular
CPU platform. GE incorporates patented
thermal monitoring technology with
sophisticated passive cooling techniques to
provide the highest-performance, fanless
industrial computing platform that can
operate at peak computing performance
in extended temperature ranges without
having to throttle the CPU.

Greater Uptime

All aspects of the RXi2-UP IPC have
been engineered for reliability in harsh
environments, from the use of all industrial
grade components to its fanless design.
To help keep data and operations secure,
the RXi2-UP utilizes Trusted Platform
Module (TPM) and Microsoft Secure Boot
technology. Security coupled with RXi2­UP’s strong shock and vibration resistance

FEATURE BENEFIT

7th Generation Intel® Core™
i3, i5, i7 and Xeon

Fanless operation • A robust, reliable solution with no moving parts and minimized dust contamination

5 Gigabit Ethernet ports (four with Time
SYNC IEEE1588 and 802.1AS)

0, 1, 2 or 4 PCIe Expansion slots • Add new functionality on demand to support specific application needs

Patented CPU Cooling Technology

®

CPUs

• Delivers high-performance computing for applications that load, manipulate and store large
amounts of data, or handle multiple communication ports in real-time

• Network implementation flexibility

• Multiple high-speed Ethernet links for communication-centric applications with support for
deterministic transfer of data/commands

• Offers 100% CPU performance even as temperatures rise ensuring that your process always
stays in control

and available RAID storage options, in a
RAID-0 or RAID-1 configuration, makes the
RXi2-UP competitive in the IPC market.

Enhanced Productivity &
Lower TCO

The RXi2-UP IPC combines high
performance with reliability, enhancing
productivity and reducing cost of ownership.

The RXi2-UP IPC delivers low TCO through
features such as compact size, reduced
maintenance, low power consumption,
and ease of future performance upgrades
enabled by our innovative rugged COM
Express CPU architecture.

Specifications

Processor

®

• Intel

Core™ i3-7100E Processor,

35W 2c 2.7GHz 3MB cache

®

core™ i3-7102E Processor,

• Intel
25W 2c 1.9GHz 3MB cache

®

Core™ i5-7442EQ Processor,

• Intel
25W 4c 2.1GHz (-2.9GHz) 6MB no ECC

®

Core™ i7-7820EQ Processor,

• Intel
35/45W 4c 3.0GHz (-3.7GHz) 8MB no ECC

®

XEON® Processor E3-1505M v6,

• Intel
35/45W 4c 3.0GHz (-4.0GHz) 8MB

®

XEON® Processor E3-1505L v6,

• Intel
25W 4c 2.2GHz (-3.0GHz) 8MB

®

XEON® Processor E3-1501M v6,

• Intel
45W 4c 2.9GHz (-3.6GHz) 6MB

Memory

• Up to 32GB DDR4-2400

• Soldered, with ECC (depending on CPU)

Storage Interfaces

• Primary storage device – M.2 PCI Express Gen3 x4 or
M.2 SATA Gen3

• Secondary storage option – Twin 2.5" SATA drive bays,
hot swap and RAID enabled

• CFast slot, user accessible, supp orts boot, hot plug

Ethernet

• Four 1-gigabit Ethernet channels – RJ-45 standard,
SFP optional

• One 1-gigabit Ethernet channel w/ remote management
capability – RJ45

Wireless Communication

• LTE modem option using Mini-PCIE with UIM card holder

• Wifi/Bluetooth radio option using M.2 expansion slot

Video/Graphics Interface

• Twin DisplayPort++ 1.2 for a total of
3 independent displays

USB Interface

• Four USB 3.0 external

• Two USB 2.0 internal

Serial Communications

• 2 to 4 channels

• Two RS232, two RS422/485

Expansion

• Mini-PCIE card site for NvSR AM card, LTE modem,
or other

• M.2 communications slot for WiFi and Bluetooth

• PCI Express expansion slots:
– Zero

• One Gen3 x4

• Two Gen2 x4

– Four 1 Gen2 x4, 3 Gen2 x1

Non-Volatile Memory

• 512 KB, 1MB or 2MB NVSRAM

• Storage for process relevant data

• NVSRAM option uses mini-PCIE slot

LED

• Power, TPM, Temperature, SATA

• Ethernet Link/Activity

• One User Defined LED

Others

• Timers – Legacy PC-AT, HPE T

• Twin Watchdog Timers (OS, application)

• Thermal monitoring

• RTC with Lithium coin cell batter y

Power

• Input – 24V DC (±25%) with protection

Environmental

All values under typical conditions without added
expansion slot cards.

Extended temperature variants are available upon request.

The maximum extended temperature ranges mentioned
in the table below are achievable with a spe cific choice of
CPU and storage, and without extension cards ins talled
in the system.

For detailed information please read the manual.

Range Operating Storage

Standard 0°C to +60°C

Extended -40°C to +70°C

1

At 100% CPU load temperature range requires vertical orientation of the heat
sink fins at free convection.

2

Operating temperature is dependent on the CPU and SSD choice, application

software, orientation of the heat sink fins at free convection. For detailed
recommendations please contact support team.

3

Extended Temperature Range available upon request

4

RAID when using HDD Drives brings Operating Temperature limits down to a

maximum of 40°C

1

-40°C to +85°C

2

-40°C to +85°C

Operating Storage

Humidity

Altitude

BIOS

• UEFI AMI Aptio

5-95% @ +40°C 5-95% @ +40°C

6,600 ft. (2.0 km) 40000 ft. (12 km)

®

5

Dimensions (H x W x D)

• 0 slot
– 252 x 203 x 108.5 mm (9.92 x 8 x 4.24 in)
– Weight – 3,9kg

• 1 slot
– 252 x 203 x 132 mm (9.92 x 8 x 4.24 in)
– Weight – 4 ,2kg

• 2 slot
– 252 x 203 x 155.5 mm (9.92 x 8 x 6.13 in)
– Weight – 4 ,4kg

• 4 slot
– 252 x 203 x 195.5 mm (9.92 x 8 x 7.7 in)
– Weight – 4 ,7kg

Mechanical

• Rugged aluminum and stainless steel housing for
optimal thermal management and durability

• IP20 – Protec tion against par ticles

• Flat and Slim (B ook) mounting orientation options

Software Support

• Microsof t

• Linux

• VXWorks

®

Windows® 10 Professional 64-Bit

®

Kernel 4.9 (upon request)

®

7.0 (upon request)

Safety

• UL1950, CE class A, FCC-A