GE Medium Voltage GP Type G Drives, 2300 V User Manual
g
ACMVAC2-G
GEH-6385
GE Industrial Systems
™
Innovation Series
Medium Voltage – GP Type G Drives
Reference and Troubleshooting
2300 V Drives
g
Publication: GEH-6385
Issued: 2000-06-29
ACMVAC2-G
GE Industrial Systems
™
Innovation Series
Medium Voltage – GP Type G Drives
Reference and Troubleshooting
2300 V Drives
© 2000 General Electric Company, USA.
All rights reserved.
Printed in the United States of America.
These instructions do not purport to cover all details or variations in equipment, nor to
provide every possible contingency to be met during installation, operation, and
maintenance. If further information is desired or if particular problems arise that are not
covered sufficiently for the purchaser’s purpose, the matter should be referred to GE
Industrial Systems, Salem, Virginia, USA.
This document contains proprietary information of General Electric Company, USA and is
furnished to its customer solely to assist that customer in the installation, testing,
operation, and/or maintenance of the equipment described. This document shall not be
reproduced in whole or in part nor shall its contents be disclosed to any third party without
the written approval of GE Industrial Systems.
Document Identification: GEH-6385, original release
Technical Writer/Editor: Teresa Davidson
The Innovation Series is a trademark of the General Electric Company, USA.
Microsoft is a registered trademark of the Microsoft Corporation.
Windows is a registered trademark of the Microsoft Corporation.
Modbus is a trademark of Modicon.
Profibus is trademark of Profibus International
Genius is a registered trademark of GE Fanuc Automation North America, Inc.
••••
Safety Symbol Legend
Indicates a procedure, condition, or statement that, if not
strictly observed, could result in personal injury or death.
Indicates a procedure, condition, or statement that, if not
strictly observed, could result in damage to or destruction of
equipment.
Note Indicates an essential or important procedure, condition, or statement.
GEH-6385 Reference and Troubleshooting, 2300 V Drives Safety Symbol Legend
a
••••
This equipment contains a potential hazard of electric shock
or burn. Only personnel who are adequately trained and
thoroughly familiar with the equipment and the instructions
should install, operate, or maintain this equipment.
Isolation of test equipment from the equipment under test
presents potential electrical hazards. If the test equipment
cannot be grounded to the equipment under test, the test
equipment’s case must be shielded to prevent contact by
personnel.
To minimize hazard of electrical shock or burn, approved
grounding practices and procedures must be strictly followed.
To prevent personal injury or equipment damage caused by
equipment malfunction, only adequately trained personnel
should modify any programmable machine.
b
Safety Symbol Legend Innovation Series Medium Voltage GP – Type G Drives GEH-6385
••••
Contents
Chapter 1 Overview 1-1
Chapter 2 Faults and Troubleshooting 2-1
Chapter 3 Paramters/Functions 3-1
Introduction...................................................................................................................... 1-1
Using Toolbox Help for Reference and Troubleshooting ................................................... 1-2
Related Documents........................................................................................................... 1-3
How to Get Help............................................................................................................... 1-3
Introduction...................................................................................................................... 2-1
Types of Faults.................................................................................................................2-2
Fault Indication................................................................................................................. 2-2
Fault Descriptions............................................................................................................. 2-3
Introduction...................................................................................................................... 3-1
Diagnostic and Utility Functions ....................................................................................... 3-4
Diagnostic and Utility Overview ................................................................................ 3-4
Capture Buffer ........................................................................................................... 3-4
General Purpose Constants........................................................................................3-10
General Purpose Filters.............................................................................................3-11
Oscillator..................................................................................................................3-12
Position Feedback.....................................................................................................3-13
Predefined Constants.................................................................................................3-14
Signal Level Detector (SLD).....................................................................................3-15
Simulator..................................................................................................................3-18
Control Diagnostic Variables.....................................................................................3-19
Line Simulator..........................................................................................................3-19
Drive Configuration Functions.........................................................................................3-20
Intelligent Part Number (IPN) ...................................................................................3-20
Primary Motor & Application Data ...........................................................................3-21
General Setup Functions ..................................................................................................3-24
Keypad Overview .....................................................................................................3-24
Keypad Contrast Adjustment.....................................................................................3-25
Keypad Meter Configuration.....................................................................................3-25
Keypad Security Configuration .................................................................................3-27
Language and Units Presentation...............................................................................3-28
Language Display .....................................................................................................3-29
I/O Functions...................................................................................................................3-30
Analog and Digital I/O Testing .................................................................................3-30
Analog Inputs/Outputs and Mapping .........................................................................3-32
Digital Inputs/Outputs and Mapping..........................................................................3-33
LAN Functions................................................................................................................3-34
LAN Overview .........................................................................................................3-34
Frame Phaselock Loop..............................................................................................3-34
LAN Configuration and Health .................................................................................3-35
GEH-6385 Reference and Troubleshooting, 2300 V Drives Contents
i
••••
LAN Signal Map.......................................................................................................3-38
Motor Control Functions..................................................................................................3-44
Motor Control Overview...........................................................................................3-44
Flux Curve................................................................................................................3-45
Leakage Inductance Curve ........................................................................................3-46
Line Transfer ............................................................................................................3-46
Motor Equivalent Circuit...........................................................................................3-48
Motor Temperature Estimation..................................................................................3-49
Power Dip Protection................................................................................................3-49
Tach Loss Detection..................................................................................................3-50
Protective Functions ........................................................................................................3-52
Custom User Faults...................................................................................................3-52
DC Link Protection ...................................................................................................3-52
Ground Fault Protection (Fast)..................................................................................3-54
Hardware Fault Strings .............................................................................................3-55
Heatsink Thermal Protection .....................................................................................3-56
Line-Line Voltage Protection ....................................................................................3-58
Motor Overtemperature Detection .............................................................................3-59
Phase Current Protection...........................................................................................3-60
Timed Overcurrent Detection....................................................................................3-61
Transformer Overtemperature Detection....................................................................3-65
Motor Ground Protection ..........................................................................................3-66
Phase Imbalance Monitor..........................................................................................3-68
Line Monitor.............................................................................................................3-70
Phase Lock Loop ......................................................................................................3-72
Sequencer Functions........................................................................................................3-74
Sequencer Overview .................................................................................................3-74
Fault Reset Logic......................................................................................................3-74
Sequencer Permissives..............................................................................................3-76
Stopping Commands and Modes ...............................................................................3-78
Sequencer Commands...............................................................................................3-82
Sequencer Status.......................................................................................................3-85
Main Contactor Configuration...................................................................................3-87
Speed Reference Functions ..............................................................................................3-89
Critical Speed Avoidance..........................................................................................3-89
Local Speed Reference..............................................................................................3-90
Minimum Speed Limit..............................................................................................3-91
Remote Speed Reference...........................................................................................3-92
Speed Reference Generation .....................................................................................3-93
Speed Reference Ramp .............................................................................................3-94
Speed Reference Reverse ..........................................................................................3-97
Speed/Torque Control Functions......................................................................................3-99
Droop .......................................................................................................................3-99
Motor Control Interface...........................................................................................3-100
Speed Control Fault Check......................................................................................3-103
Speed Feedback Calculation....................................................................................3-105
Speed/Torque Overview..........................................................................................3-106
Speed/Torque Regulator..........................................................................................3-107
System Data Parameters.................................................................................................3-112
Exec time/Chop freq ...............................................................................................3-112
Motor ctrl alg sel.....................................................................................................3-112
Motor efficiency .....................................................................................................3-113
Motor service factor................................................................................................3-114
Motor winding cfg ..................................................................................................3-114
Preflux Forcing.......................................................................................................3-114
ii
Contents Innovation Series Medium Voltage GP Type – G Drives GEH-6385
••••
Chapter 4 Wizards 4-1
Introduction...................................................................................................................... 4-1
Cell Test Wizard............................................................................................................... 4-4
Cell Test Options....................................................................................................... 4-4
Running the Fiber-Optic Test ..................................................................................... 4-5
Running the Bridge Cell Test ..................................................................................... 4-8
DAC Setup......................................................................................................................4-10
Drive Commissioning......................................................................................................4-11
Drive Commissioning: Overview...............................................................................4-11
Drive Commissioning: Intelligent Part Number .........................................................4-11
Drive Commissioning: Drive Units............................................................................4-11
Drive Commissioning: AC Source Selection..............................................................4-12
Drive Commissioning: Motor Nameplate Data ..........................................................4-12
Drive Commissioning: Motor Crossover Voltage.......................................................4-13
Drive Commissioning: Motor Protection Class..........................................................4-13
Drive Commissioning: Motor Poles...........................................................................4-13
Drive Commissioning: Motor Data Sheet ..................................................................4-13
Drive Commissioning: Motor Data Sheet - Equivalent Circuit Data...........................4-14
Drive Commissioning: Motor Data Sheet - Flux Curve..............................................4-15
Drive Commissioning: Motor and Process Speed Referencing...................................4-15
Drive Commissioning: Tachometer Support ..............................................................4-16
Drive Commissioning: Tachometer Pulses Per Revolution.........................................4-16
Drive Commissioning: Tachometer Loss Protection...................................................4-16
Drive Commissioning: Stopping Configuration .........................................................4-17
Drive Commissioning: Flying Restart........................................................................4-17
Drive Commissioning: X-Stop Configuration............................................................4-18
Drive Commissioning: X-Stop Ramp Time ...............................................................4-18
Drive Commissioning: Run Ready Permissive String.................................................4-19
Drive Commissioning: Starting and Stopping the Drive .............................................4-19
Drive Commissioning: Manual Reference..................................................................4-19
Drive Commissioning: Maximum Speed References..................................................4-20
Drive Commissioning: Jog Speed Setpoints...............................................................4-20
Drive Commissioning: Reference Ramp Bypass ........................................................4-20
Drive Commissioning: Reference Ramp Mode..........................................................4-20
Drive Commissioning: Reference Ramp Speed Independent Rates.............................4-21
Drive Commissioning: Reference Ramp Speed Independent Rate Set Selection .........4-21
Drive Commissioning: Reference Ramp Programmed Acceleration Rates ..................4-22
Drive Commissioning: Reference Ramp Programmed Acceleration Speeds................4-22
Drive Commissioning: Reference Ramp Programmed Deceleration Rates ..................4-22
Drive Commissioning: Reference Ramp Programmed Deceleration Speeds................4-23
Drive Commissioning: DDI Increment and Decrement Rates (Local Mode) ...............4-23
Drive Commissioning: Speed/Torque Regulator Configuration..................................4-23
Drive Commissioning: Speed/Torque Regulator Modes.............................................4-23
Drive Commissioning: Torque Regulator Reference and Output ................................4-24
Drive Commissioning: Torque with Speed Override Reference and Output................4-24
Drive Commissioning: Torque with Speed Override Speed Error...............................4-24
Drive Commissioning: Torque with Speed Override Stopping Behavior.....................4-25
Drive Commissioning: Torque and Current Limits.....................................................4-25
Drive Commissioning: Torque and Current Limits Uniform.......................................4-25
Drive Commissioning: Failed Calculation .................................................................4-26
Drive Commissioning: Torque and Current Limit Selection.......................................4-26
Drive Commissioning: Normal Torque and Current Limits........................................4-26
Drive Commissioning: Alternate Torque and Current Limits......................................4-26
Drive Commissioning: Motoring Torque Limits ........................................................4-26
Drive Commissioning: Generating Torque Limits......................................................4-26
GEH-6385 Reference and Troubleshooting, 2300 V Drives Contents
iii
••••
Drive Commissioning: Current Limits.......................................................................4-27
Drive Commissioning: Power Dip Ride-Through.......................................................4-27
Drive Commissioning: Parameter Calculation............................................................4-27
Drive Commissioning: Simulator Mode.....................................................................4-27
Drive Commissioning: Hardware Fault Strings in Simulator Mode ............................4-27
Drive Commissioning: Simulator Mechanical Configuration......................................4-27
Drive Commissioning: Exit Reminder .......................................................................4-28
Drive Commissioning: Conclusion............................................................................4-28
Line Transfer Tuneup ......................................................................................................4-28
Line Transfer Tuneup: Overview...............................................................................4-28
Line Transfer Tuneup: Motor Transfer Data ..............................................................4-28
Line Transfer Tuneup: Motor Capture Data...............................................................4-29
Line Transfer Tuneup: Operation ..............................................................................4-29
Motor Control Tuneup.....................................................................................................4-31
Motor Control Tuneup: Equivalent Circuit ................................................................4-31
Motor Control Tuneup: Measurements ......................................................................4-32
Motor Control Tuneup: Operation .............................................................................4-32
Panel Meter Setup............................................................................................................4-32
Per Unit Setup .................................................................................................................4-32
Line Protection Setup.......................................................................................................4-33
Line Protection: Introduction.....................................................................................4-33
Line Protection: Default Settings...............................................................................4-33
Line Protection: Overvoltage.....................................................................................4-33
Line Protection: Undervoltage...................................................................................4-33
Line Protection: Overfrequency.................................................................................4-34
Line Protection: Underfrequency...............................................................................4-34
Line Protection: Conclusion......................................................................................4-34
Pulse Test........................................................................................................................4-34
Pulse Test: Introduction ............................................................................................4-34
Pulse Test: Analog Output Configuration ..................................................................4-35
Pulse Test: Bridge State Configuration......................................................................4-35
Pulse Test: Timer Configuration................................................................................4-37
Pulse Test: Operation................................................................................................4-37
Remaining Parameter Setup .............................................................................................4-37
Simulator Setup...............................................................................................................4-38
Simulator Setup: Introduction....................................................................................4-38
Simulator Setup: Simulator Mode..............................................................................4-38
Simulator Setup: Hardware Fault String Override......................................................4-38
Simulator Setup: Simulator Mechanical Configuration...............................................4-38
Simulator Setup: Conclusion.....................................................................................4-38
Speed Regulator Tuneup..................................................................................................4-39
Speed Regulator Tuneup: Model ...............................................................................4-39
Speed Regulator Tuneup: System Inertia ...................................................................4-39
Speed Regulator Tuneup: Inertia Measurement Command.........................................4-39
Speed Regulator Tuneup: Speed Regulator Mode ......................................................4-40
Speed Regulator Tuneup: Manual Regulator Tuneup.................................................4-40
Speed Regulator Tuneup: 1st Order Response............................................................4-40
Speed Regulator Tuneup: 2nd Order Response ..........................................................4-40
Speed Regulator Tuneup: 2nd Order Response with Stiffness Filter ...........................4-41
Speed Regulator Tuneup: Calculate Speed Regulator Gains Command ......................4-41
iv
Contents Innovation Series Medium Voltage GP Type – G Drives GEH-6385
••••
Chapter 5 Signal Mapping 5-1
Introduction...................................................................................................................... 5-1
LAN Interfaces................................................................................................................. 5-2
Parameter Configuration for Signal Mapping .................................................................... 5-3
Variable Mapping............................................................................................................. 5-4
Applying the LAN Heartbeat Echo Feature ....................................................................... 5-5
Application of Feedback Signals ....................................................................................... 5-6
Variable Maps .................................................................................................................. 5-6
Real Variable Map..................................................................................................... 5-7
Boolean Variable Map ............................................................................................... 5-8
Appendix A Function Block Diagrams A-1
Introduction......................................................................................................................A-1
Index
GEH-6385 Reference and Troubleshooting, 2300 V Drives Contents
v
Chapter 1 Overview
Introduction
This document provides reference and troubleshooting information for the 2300 V
model of the Innovation Series™ Medium Voltage – GP Type G drives. The purpose
of the document is to assist installation and maintenance technicians in
understanding the drive’s diagnostic and configuration software, as well as using
fault codes to troubleshoot drive problems.
Chapter 1 defines the document contents. Its purpose is to present a general product
overview for the reader, as follows:
Section Page
Introduction ........................................................................................................ 1-1
Using Toolbox Help for Reference and Troubleshooting...................................... 1-2
Related Documents ............................................................................................. 1-3
How to Get Help ................................................................................................. 1-3
Notes .................................................................................................................. 1-4
Chapter 2, Faults and Troubleshooting, lists and defines drive fault messages,
with troubleshooting suggestions if a fault occurs.
Chapter 3, Functions/Parameters, lists and describes the drive application program
functions, including input parameters, output variables, and configuration.
Chapter 4, Wizards, describes in detail the automated Windows-based “forms” that
guide the user through drive configuration and tuneup.
Chapter 5, Signal Mapping, describes LAN interfaces and parameter configuration
for variable signal mapping.
Note The information in Chapters 2, 3, and 4 is duplicated from the GE Control
System Toolbox’s online Help files. This document, GEH-6385, is provided as
assistance when the toolbox is not available or was not purchased with the drive
system. (Refer to Using Toolbox Help for Reference and Troubleshooting in this
chapter.)
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 1 Overview
••••
1-1
Using Toolbox Help for Reference and Troubleshooting
g
GE document GEH-6401
describes toolbox features
and use.
The GE Control System Toolbox is an optionally purchased drive configuration
program used to tune and commission the drive as needed for each application. The
toolbox provides Microsoft® Windows®-based menus, block diagrams, dialog
boxes, and wizards on a PC-based drive interface.
When you choose Help on the toolbox main menu bar, a drop-down menu provides
several options for finding information.
Organized Help topics, a Help Index tab,
and a Find tab for searching the Help
database.
How to find information in Help and how to
customize the toolbox Help features.
Information about faults, functions, wizards,
and special messages.
Information about the drive and toolbox
version, installation notes (compatibilities),
and requirements.
From that menu, select Product Help to access online help files that contain the
fault, function, and wizard information provided in this manual.
Help Topics: Innovation Series ACMVAC4-G Help
Drive firmware and associated
reference files may change with
product upgrades and revisions.
The information provided in this
document, GEH-6385, is current
at the time of its issue. However,
the toolbox Help files provided
with your drive may be a more
current representation of your
drive confi
uration.
Send a toolbox "bug" report or
enhancement request directly to GE
(requires that e-mail is installed).
Additional information about the toolbox
and GE contacts (requires access to the
GE intranet).
Identifies toolbox release, version, and
platform information.
1-2
••••
Chapter 1 Overview Innovation Series Medium Voltage GP Type - G Drives GEH-6385
Related Documents
If needed for supplementary information, refer to the following documents for the
Innovation Series Medium Voltage – GP Type G drives, as applicable:
GEH-6381, Installation and Startup
GEH-6382, User’s Guide
GEH-6401, Control System Toolbox
How to Get Help
If help is needed beyond the instructions provided in the documentation, contact GE
as follows:
GE Industrial Systems
Product Service Engineering
1501 Roanoke Blvd.
“+” indicates the
international access code
required when calling from
outside of the USA.
Salem, VA 24153-6492 USA
Phone: + 1 800 533 5885 (United States, Canada, Mexico)
Fax: + 1 540 387 8606 (All)
+ 1 540 378 3280 (International)
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 1 Overview
••••
1-3
Notes
1-4
••••
Chapter 1 Overview Innovation Series Medium Voltage GP Type - G Drives GEH-6385
Chapter 2 Faults and Troubleshooting
Introduction
For information on using the
keypad refer to the drive
User's Guide, GEH-6382.
GEH-6401 describes the
toolbox.
The drive software includes selftest diagnostics to aid in troubleshooting. When
these tests detect an unfavorable condition, they output fault indications to the
drive’s operator interfaces: the door-mounted Drive Diagnostic Interface (DDI,
referred to as the keypad) or a connected PC running the GE Control System
Toolbox (the toolbox). An operator can then use either interface to examine the fault
and clear it, as applicable.
This chapter lists and defines the relevant fault messages for the drive, with
troubleshooting suggestions. It is organized as follows:
Section Page
Introduction ........................................................................................................ 2-1
Types of Faults ................................................................................................... 2-2
Fault Indication................................................................................................... 2-2
Fault Descriptions............................................................................................... 2-3
This equipment contains a potential hazard of electric shock
or burn. Only adequately trained persons who are
thoroughly familiar with the equipment and the instructions
should maintain this equipment.
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-1
Types of Faults
Fault Indication
There are currently two types of fault conditions:
• Alarm faults indicate conditions that you should note, but that are not serious
enough to automatically shut down or trip the drive. If the condition goes away,
some alarm faults clear themselves and the display then identifies the alarm as
brief. Otherwise, you must stop the drive to clear this type of fault.
• Trip faults indicate a more serious condition that needs to be corrected.
Therefore, it trips the drive. The drive should not be restarted until the condition
is corrected.
You can clear most faults by selecting Clear Faults on the drive’s keypad or in the
(optional) toolbox program.
The DSPX board is the
IS200DSPX Digital Signal
Processor, located in the
drive control rack.
The drive indicates a fault condition on the keypad, toolbox display, and on the
DSPX board.
On the keypad, a fault icon appears in the right side of the display: The operator can
then use the keypad to access the fault/alarm description (see Figure 5-1) and to clear
the fault.
Fault No.
50 Trip HtSink temp low,
108 Brief DC bus voltage
12 Trip Gnd flt,
113 Trip Invalid board
Fault Behavior
Figure 2-1. Sample Fault Display Screen on Keypad
ACTIVE FAULT
--- RESET FAULTS NOW --
The toolbox uses a Windows-based PC display. When a fault occurs, the word
Alarm or Trip appears in the lower right corner of the screen. You can view a
description and clear the fault using the toolbox functions. (GE publication GEH6401 describes these tools and this feature.)
The DSPX Fault LED displays at the front of the drive’s control rack. This red
indicator is on solid for a fault and flashes for an alarm.
A fault is identified by an assigned number and abbreviated description. Both of
these are displayed when an operator examines a fault using the keypad (see Figure
2-1) or the toolbox.
Abbreviated Description
Fault Icon:
Flashing = fault
Not flashing (on steady) = alarm
Table 2-1 lists the drive faults and their probable cause.
2-2
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
Fault Descriptions
Note When troubleshooting leads to a hardware inspection or component
replacement, be sure to follow the procedures described in the drive User’s Guide,
GEH-6382. This will help ensure that the equipment operates correctly.
Table 2-1. Fault Definitions and Probable Cause
No. Name Type Description
When troubleshooting leads to a hardware inspection or
component replacement, be sure to follow the procedures
described in the drive User’s Guide, GEH-6382. This will help
prevent damage caused by incorrect installation and ensure
that the equipment operates correctly.
1 CPFP isolation lost Trip
2 Illegal seq state Trip
The CPFP isolation lost trip fault is hardware generated. The CPFP power
supply isolation card is indicating that power supply isolation to the phase
modules has been compromised. The CPFP card is designed to provide
control power to circuit cards in the high voltage compartment. This card has
a double voltage barrier that isolates the phases from each other and from the
control. This fault indicates that one of these voltage barriers has failed. This
is a dangerous situation since failure of the second barrier could cause
dangerous voltages to conduct into the control cabinet or cause a phasephase short on the CPFP card. The fault is generated when the status light
conducted via fiber from the CPFP goes out. The fiber connects CPFP (PWR
OK) to FOSA (SPARE-R). Check that the fiber is installed correctly.
Disconnect the fiber from FOSA and look for the status light traveling up the
fiber. If you do not see a light then the problem is on CPFP. If there is light
then the problem is on FOSA or BICM.
Primary causes:
CPFP power supply failure
Fiber not connected
Possible board failures:
CPFP
FOSA
BICM
Possible wiring faults:
Power distribution wiring to CPFP.
The Illegal seq state trip fault occurs when the sequencer state (variable
Sequencer state) is unrecognized. This trip may occur during system
development but should not occur in the field.
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-3
No. Name Type Description
3 Cont failed to close Trip
4 Local flt Trip The Local flt trip fault occurs when the local permissive circuit is open and a
5 Tool requested trip Trip The Tool requested trip trip fault is generated from the engineering monitor
6 Run cmd during init Alarm
The Cont failed to close trip fault occurs when contactor A is commanded to
open or close and fails to do so within the allowed time (defined by parameter
MA pickup time).
Primary causes:
The contactor A feedback is missing or bad.
Possible configuration faults:
The allowed time for contactor A to open and close is too short. The allowed
time is represented by parameter MA pickup time.
Contactor A feedback is enabled when no contactor is present in the system.
In the absence of the contactor, parameter MA contactor fbk should be set
equal to Disable.
Related functions:
Main Contactor Configuration
Run request, Jog request, Full flux request, or diagnostic test (cell test, pulse
test, autotune) request is issued.
Possible wiring faults:
The connections to ATBA terminal board locations 8 (L115), 10 (L24), and 12
(LCOM) are missing or damaged.
The connection to backplane connector J2 is missing or damaged.
issuing the “uf” command. It is for test purposes only.
The Run cmd during init alarm occurs when a Run request, Jog request, Full
flux request, or diagnostic test (cell test, pulse test, autotune) request is issued
during drive initialization. When the alarm occurs, the request to perform a
drive action is ignored.
Primary causes:
The external application layer issues a request to perform a drive action during
drive initialization.
An external input (i.e. digital input) used to request a drive action was high
during drive initialization.
7 Over speed Trip
8 Timed over current Trip The Timed over current trip fault occurs when one of the squared phase
9 EE flash corrupted Trip
The Over speed trip fault occurs when the magnitude of speed (variable
Speed reg fbk) is greater than the over speed threshold (parameter Over
speed flt level).
Primary causes:
Motor speed is too high.
Possible configuration faults:
Parameter Over speed flt level is set too low.
Related functions:
Speed Control Fault Check
currents (variables Ia^2 filtered, Ib^2 filtered, and Ic^2 filtered) in the timed
over current detection model exceeds the timed over current threshold level.
This fault indicates that the motor has exceeded its thermal limit.
The EE flash corrupted trip fault occurs when the memory containing the drive
parameters is determined to be bad during drive initialization.
EE flash corrupted requires a hard reset to clear.
Possible board failures:
DSPX
2-4
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
No. Name Type Description
10
Run cmd w high
flux
11 EE erase failed Alarm
12 Gnd flt, coarse Trip
13 Vdc Fbk voltage
trim
14 Cap buf f in it failed Alarm The capture buffer initialization has failed to allocate enough memory to run
15 MA cont not closed Trip
Alarm
Alarm The Vdc Fbk voltage trim alarm occurs when the automatic Vdc feedback trim
The Run cmd w high flux alarm occurs when a Run request, Jog request, Full
flux request, or diagnostic test (cell test, pulse test, autotune) request is issued
and the variable Flux reference is greater than 2 percent rated flux (100%
Flux).
Primary causes:
An attempt is made to restart the drive quickly. Normally four rotor time
constants are required to allow the flux to decay after the drive stops running.
Related functions:
Sequencer Permissives
The EE erase failed trip fault occurs when the preparation of memory for the
next parameter save operation fails to happen satisfactorily. The next
parameter save operation is expected to be invalid, and the integrity of future
parameter save operations are in doubt.
EE erase failed requires a hard reset to clear.
Possible board failures:
DSPX
The Gnd flt, coarse trip fault occurs when a large ground current is detected.
The trip fault occurs when the magnitude of the sum of the three phase
currents is too large.
function on the BICM is not functioning correctly. You will not receive this
warning unless you are using drive firmware version V02.21.00B or higher
AND you have a BICMH1AB version card or higher. Older versions of
software and hardware suffer from Vdc feedback inaccuracy, which can lead
to problems in some circumstances. Getting the trim function to operate
properly is important to optimum performance of the drive. There are several
situations that can lead to this alarm.
First, make sure you have run the Cell Test Wizard (either fiber optic test or
bridge cell test) at least once when the DC link is fully discharged (<100V).
This wizard calibrates the DC bus feedback and saves a parameter in the
drive. This procedure does not need to be repeated unless hardware has
changed in the drive or the previously saved parameter was overwritten by a
parameter downloaded from the toolbox. If this procedure has not been
performed then this alarm is generated.
Second, make sure that JP1 on the BICMH1AB card has been moved to the
non-default position. This jumper enables the circuit that this alarm is
concerned with. The jumper JP1 being in the dashed-box indicates the nondefault position. The jumper being in the solid box indicates the default
position. The default position is used only when the card is placed in drives
that have software versions prior to V02.21.00B
If both if these steps fail to clear this alarm then your BICM card may be
defective.
Primary board failures
BICM
the capture buffer. The capture buffer has been disabled and will not run.
However the drive should operate normally.
A new version of firmware is required to correct this problem.
The MA cont not closed trip fault occurs when the MA feedback indicates that
the MA contactor is open when it is commanded to close.
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-5
No. Name Type Description
16 Illegal req for xfer Alarm
17 Transfer req
aborted
18 Tune up failed Trip
19 Ext ref out of range Alarm
20 TOC pending Alarm The TOC pending alarm occurs when one of the squared phase currents
21 System flt Trip
Trip The Transfer req aborted trip fault occurs when the motor control is unable to
The Illegal req for xfer alarm occurs when a motor transfer command is issued
and a trip fault is present in the drive. The alarm may also occur when a motor
transfer command is issued at the same time a diagnostic test (cell test, pulse
test, autotune) is active.
Primary causes:
The external application layer issues an inappropriate motor transfer request.
synchronize to the utility line in the allotted time in response to a motor transfer
request.
The Tune up failed trip fault occurs when an attempt to run the motor control
tune up or the speed regulator tune up fails.
Primary causes:
The external application layer issues an inappropriate motor control tune up
request or speed regulator tune up request.
An attempt by the motor control tune up or the speed regulator tune up to
initialize the diagnostic message stack fails.
The Ext ref out of range alarm occurs when the external line reference voltage
is outside of the allowable range.
(variables Ia^2 filtered, Ib^2 filtered, and Ic^2 filtered) in the timed over current
detection model exceeds the timed over current alarm level.
This alarm indicates that the motor is nearing its thermal limit.
The System flt trip fault occurs when the system permissive circuit is open and
a Run request, Jog request, Full flux request, or diagnostic test (cell test, pulse
test, autotune) request is issued.
Possible wiring faults:
The connections to ATBA terminal board locations 2 (S115), 4 (S24), and 6
(SCOM) are missing or damaged..
22
Run before MA
closed
23 Flying restrt disabl Trip The Flying restrt disabl trip fault occurs when a Run request, Jog request, Full
Trip
The Run before MA closed trip fault occurs when a Run request, Jog request,
or Full flux request is issued to the motor control sequencer before contactor A
is closed.
Related functions:
Sequencer Permissives
Main Contactor Configuration
flux request, or diagnostic test (cell test, pulse test, autotune) request is issued
when the motor is not at zero speed.
Flying restrt disabl can be turned off and the drive allowed to start when the
motor is not at zero speed by placing the drive in flying restart mode. Flying
restart mode is enabled by setting parameter Flying restart equal to Enable fly
restart.
Related functions:
Sequencer Permissives
2-6
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
No. Name Type Description
24 Power dip Trip
25 Cur reg in limit
26 Volt reg in lim it Alarm
28 R1 meas in limit Alarm
29 R2 meas in limit Alarm The R2 meas in limit alarm occurs when the online calculation of rotor
Alarm The Cur reg in limit alarm occurs when the X and/or Y current regulator output
The Power dip trip fault occurs when the DC link voltage feedback (variable
DC bus voltage) falls below the power dip level and remains below the power
dip level longer than the power dip time.
The power dip time is configurable through parameter Power dip control.
If the DC link voltage feedback is at some moments below the power dip level
and at some moments above the power dip level, the trip fault can occur. If
over any time interval the DC link feedback spends more time below the power
dip level than above the power dip level, and the time difference is greater
than the power dip time, Power dip occurs.
Possible configuration faults:
Power dip functionality is disabled because param eter Power dip control is set
incorrectly. To enable power dip functionality parameter Power dip control
should be set equal to 0.500 sec (Enable).
Related functions:
Power Dip Protection
enter limits for more than 1 sec. It is cleared when the X and/or Y current
regulator come out of limit for more than of equal to 1 sec.
Primary causes:
The tachometer feedback is bad.
Large motor parameters errors.
Motor inverter connection opens while running.
Power dip.
Loss of current feedback.
The Volt reg in limit alarm occurs when the X and/or Y voltage regulator output
enter limits for more than 1 sec. It is cleared when the X and/or Y voltage
regulator come out of limit for more than of equal to 1 sec.
Primary causes:
Motor inverter connection opens while running.
Power dip.
Loss of voltage feedback.
The R1 meas in limit alarm occurs when the total primary resistance measured
during drive pre-flux is outside of a reasonable bound. The total primary
resistance consists of the stator and cable resistances. When the fault
condition is present, the motor control does not use the resistance
measurement.
resistance exceeds the positive or negative saturation level. The saturation
levels are 80 percent and -40 percent.
Primary causes:
The rotor resistance calculation is incorrect due a large error in motor
parameters.
30 Tach loss trip Trip The Tach loss trip fault occurs when the difference between the tachometer
feedback (variable Motor speed) and the estimated speed (variable Calculated
speed) is too large.
The trip fault can be disabled by setting parameter Tach loss fault mode equal
to Trip.
Primary causes:
The tachometer feedback is bad.
The estimated speed is incorrect due to large errors in motor parameters.
Related functions:
Tach Loss Detection
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-7
No. Name Type Description
31 Tach loss alarm Alarm
32 IOC phase A Trip The IOC phase A trip fault is hardware generated. The trip fault occurs when
33 IOC phase B Trip
34 IOC phase C Trip
The Tach loss alarm occurs when the difference between the tachometer
feedback (variable Motor speed) and the estimated speed (variable Calculated
speed) is too large.
When the alarm occurs, the drive dynamically switches to tachless control
mode. The drive continues tachless operation until the fault is cleared by an
operator.
Tach loss fault mode can be used to change the fault behavior to trip if
required.
Primary causes:
The tachometer feedback is bad.
The estimated speed is incorrect due to large errors in motor parameters.
Related functions:
Tach Loss Detection
the current measured by the phase A shunt exceeds the instantaneous
overcurrent threshold, which is positive or negative 250 percent rated shunt
current. It also occurs within 25 microseconds when the phase A current
experiences a step change of 100 percent rated shunt. When either condition
is detected, the power bridge IGBT gating is disabled immediately.
Possible board failures:
SHCA
FOSA
BICM
HFPA (FU4)
Possible wiring faults:
Connections between FOSA and SHCA.
The IOC phase B trip fault is hardware generated. The trip fault occurs when
the current measured by the phase B shunt exceeds the instantaneous
overcurrent threshold, which is positive or negative 250 percent rated shunt
current. It also occurs within 25 microseconds when the phase B current
experiences a step change of 100 percent rated shunt. When either condition
is detected, the power bridge IGBT gating is disabled immediately.
Possible board failures:
SHCA
FOSA
BICM
HFPA (FU4)
Possible wiring faults:
Connections between FOSA and SHCA.
The IOC phase C trip fault is hardware generated. The trip fault occurs when
the current measured by the phase C shunt exceeds the instantaneous
overcurrent threshold, which is positive or negative 250 percent rated shunt
current. It also occurs within 25 microseconds when the phase C current
experiences a step change of 100 percent rated shunt. When either condition
is detected, the power bridge IGBT gating is disabled immediately.
Possible board failures:
SHCA
FOSA
BICM
HFPA (FU4)
Possible wiring faults:
Connections between FOSA and SHCA.
2-8
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
No. Name Type Description
36
BICM card clock
fail
37
Rack pwr supply
lost
38 DC bus imbalance Trip The DC bus imbalance trip fault occurs when the magnitude of the upper and
39
DC pos bus over
volt
40
DC neg bus over
volt
41 DC bus over
voltage
Trip
Trip
Trip
Trip
Trip The DC bus over voltage trip fault occurs when the DC link voltage feedback
The BICM card clock fail trip fault occurs when FPGA logic on the BICM
cannot detect the presence of either one of its clock signals. One of the clocks
it is looking for is generated by a crystal on the BICM itself and the other is
transmitted via the rack backplane from DSPX.
Primary causes:
Card or connector failure.
Possible board failures:
BICM
DSPX
CABP (Backplane)
The Rack pwr supply lost trip fault occurs when logic on the BICM cannot
detect the presence of one of the power supplies being generated by RAPA.
The power supplies monitored include P5, P15, N15 and I24. These supplies
are distributed via the backplane to control cards including BICM. I24 is also
brought to ATBA for use in customer I/O.
Primary causes:
Short across one of the monitored power supplies
Power supply module failure
Possible board failures:
BICM
RAPA
CABP (Backplane)
lower half of the DC bus circuits in the bridge differ by more than 10% of
nominal. A typical Nominal DC bus voltage would be 3500V so a difference of
around 350V would trigger this trip fault.
If the fault occurs immediately after but not during a DC bus charge cycle
completes then a ground fault in the input section of the drive should be
suspected. Check the transformer secondary windings and the input line filter
assemblies for a ground.
Primary causes:
One or more failed bleeder resistors (BRES1-6).
A ground fault in the input rectifier section
A ground fault in a transformer secondary winding.
The DC pos bus over volt trip fault is hardware generated. The trip fault
occurs when the positive DC link voltage is too large.
Possible board failures:
FOSA
DSPX
The DC neg bus over volt trip fault is hardware generated. The trip fault
occurs when the negative DC link voltage is too large.
Possible board failures:
FOSA
DSPX
(variable DC bus voltage) is too large.
The main purpose of the trip fault is to detect excessive and potentially
dangerous DC link voltages. When the over voltage condition is detected the
power bridge is shut off immediately.
Possible board failures:
FOSA
DSPX
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-9
No. Name Type Description
42
DC bus under
voltage
43 Ground flt alm, LP Alarm The Ground flt alm, LP alarm occurs when a large ground current is detected
44 Ground flt, LP Trip
45 AC filter fuse blown Alarm The AC filter fuse blown alarm occurs when the BICM Motor Ground
Trip
The DC bus under voltage trip fault occurs when the DC link voltage feedback
(variable DC bus voltage) is too low.
The trip fault only occurs when the drive is running.
Possible board failures:
FOSA
DSPX
by the BICM Motor Ground Protection.
The alarm occurs when the BICM ground current (variable Gnd cur signal) is
greater than the BICM ground current alarm level (parameter Gnd signal alarm
on).
Ground flt alm, LP clears when the BICM ground current drops below the
BICM ground current alarm turn off level (parameter Gnd signal alarm off).
The alarm can be disabled by inhibiting BICM Motor Ground Protection
functionality. Set parameter Detector mode equal to Disable.
Possible configuration faults:
The value of the BICM ground current alarm level, represented by parameter
Gnd signal alarm on, is too low.
Possible board failures:
VATF-MID
FOSA
BICM
DSPX
The Ground flt, LP trip fault occurs when a large ground current is detected by
the BICM Motor Ground Protection.
The trip fault occurs when the BICM ground current (variable Gnd cur signal)
is greater than the BICM ground current trip fault level (parameter Gnd signal
trip lv l).
Ground flt, LP can be disabled by inhibiting BICM Motor Ground Protection
functionality. Set parameter Detector mode equal to Disable.
Possible configuration faults:
The value of the BICM ground current fault threshold, represented by
parameter Gnd signal trip lvl, is too low.
Possible board failures:
VATF-MID
FOSA
BICM
DSPX
Protection detects that the MOV fuse has blown. The trip fault occurs when
the BICM fuse circuit is open.
AC filter fuse blown can be disabled by inhibiting BICM Motor Ground
Protection functionality. Set parameter Detector mode equal to Disable.
Possible board failures:
VATF-MID
FOSA
BICM
DSPX
2-10
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
No. Name Type Description
46 X stop Trip
47
Run req & xstop
open
48 BICM card temp
low
49 HtSink DB temp
low
Trip
Trip The BICM card temp low trip fault occurs when the sensor on BICM measures
Trip The HtSink DB temp low trip fault occurs when the dynamic brake heatsink
The X stop trip fault occurs when the X stop circuit is open and when X stop is
configured as a trip fault. X stop is configured as a trip fault when parameter X
stop mode is set equal to Trip flt stop. Any other setting for parameter X stop
mode disables the X stop trip fault.
The state of the X stop circuit is determined by the value of the variable to
which parameter X stop request sel points. The X stop trip fault can be
disabled, along with all other X stop behavior, by setting parameter X stop
request sel equal to Unused.
Related functions:
Stopping Commands and Modes
The Run req & xstop open trip fault occurs when the X stop circuit is open, the
drive is stopped, and one of the following requests is issued: Run request, Jog
request, or Full flux request.
The state of the X stop circuit is determined by the value of the variable to
which parameter X stop request sel points. The trip fault can be disabled,
along with all other X stop behavior, by setting parameter X stop request sel
equal to Unused.
Related functions:
Sequencer Permissives
Stopping Commands and Modes
a temperature that is –20C or below.
BIC ambient temp is the variable being monitored to generate this fault.
Primary causes:
Failed thermal sensor on BICM.
Ambient temperature is too low.
Possible board failures:
BICM
temperature (variable DB heat sink temp) is too low.
The main purpose of this trip fault is to detect the absence of the thermal
sensor input from the heatsink.
Primary causes:
The DB heatsink thermal sensor input is not present.
No power to TFBA card or TFBA card failure.
Possible board failures:
BICM
TFBA
CPFP
Possible wiring faults:
Thermal sensor input to TFBA is missing or damaged.
Related functions:
Heatsink Thermal Protection
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-11
No. Name Type Description
50
HtSink DS temp
low
51 HtSink A temp low Trip
52 HtSink B temp low Trip The HtSink B temp low trip fault occurs when when heatsink B temperature
53 HtSink C temp low Trip
54 Ambient temp low Trip The Ambient temp low trip fault occurs when the ambient temperature
55 AC line fuse blown Trip
56 DB resistor
overload
Trip
Trip The DB resistor overload trip fault occurs when the dynamic braking resistor
The HtSink DS temp low trip fault occurs when the diode source heatsink
temperature (variable DS heat sink temp) is too low.
The main purpose of the fault is to detect the absence of the therm al sensor
input from the heatsink.
Primary causes:
The DS heatsink thermal sensor input is not present.
No power to TFBA card or TFBA card failure.
Possible board failures:
BICM
TFBA
CPFP
Possible wiring faults:
Thermal sensor input to TFBA is missing or damaged
Related functions:
Heatsink Thermal Protection
The HtSink A temp low trip fault occurs when heatsink A temperature (variable
Heat sink A temp) is too low.
Related functions:
Heatsink Thermal Protection
(variable Heat sink B temp) is too low.
Related functions:
Heatsink Thermal Protection
The HtSink C temp low trip fault occurs when when heatsink C temperature
(variable Heat sink C temp) is too low.
Related functions:
Heatsink Thermal Protection
(variable Bridge ambient temp) is too low.
The main purpose of the trip fault is to detect the absence of the ambient
thermal sensor input.
Primary causes:
The ambient thermal sensor input is not present.
Possible board failures:
BICM
Possible wiring faults:
The thermal sensor input to backplane connector J4 pins 7 and 8 is missing or
damaged.
The AC line fuse blown trip fault occurs when one of the fuses feeding the
diode source assembly opens.
Primary causes:
Loss of I24 supply on CTBC feeding this string .
Shorted diode in source bridge.
thermal model indicates that the dynamic braking package has exceeded its
rating.
Primary causes:
Incorrect configuration of DB thermal model.
DB resistor package has not been sized correctly for application.
2-12
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
No. Name Type Description
57 DB resistor hot Alarm
58 Motor reac parms
bad
63 BICM card over
temp
64
HtSink DB over
temp
65 HtSink DS over
temp
66 HtSink A over temp Trip
67 HtSink B over temp Trip The HtSink B over temp trip fault occurs when heatsink B temperature
Trip The Motor reac parms bad trip fault occurs when the primary motor reactance
Fault The BICM card over temp trip fault occurs when the sensor on BICM
Trip
Trip The HtSink DS over temp trip fault occurs when the diode source heatsink
The DB resistor hot alarm occurs when the dynamic braking resistor thermal
model indicates that the dynamic braking package is approaching its rating.
Primary causes:
Incorrect configuration of DB thermal model.
DB resistor package is marginal for application.
parameters have values that are not appropriate relative to one another.
Primary causes:
Internal calculations are performed using Starting react Xst, Magnetizing react
Xm, Stator lkg react X1,and Rotor lkg react X2. The relationship between
these parameters should be: (Rotor lkg react X2 || Magnetizing react Xm) +
Stator lkg react X1 > Starting react Xst.
This should be corrected before attempting to run the drive.
measures a temperature above 60C. The drive control electronics cannot
operate reliably above this temperature. Reset the fault after the temperature
drops below 60C.
BIC ambient temp is the variable being monitored to generate this fault.
Primary causes:
Blocked air flow to control rack.
Control rack cooling fan failure.
Ambient temperature is too high.
Possible board failures:
BICM
The HtSink DB over temp trip fault occurs when the dynamic brake heatsink
temperature (variable DB heat sink temp) is too high.
Related functions:
Heatsink Thermal Protection
temperature (variable DS heat sink temp) is too high.
The bridge turns off in response to the fault to protect the IGBTs from thermal
damage.
Primary causes:
Airflow to the heatsink is not sufficient.
Blower is not operating correctly.
Possible board failures:
BICM
Related functions:
Heatsink Thermal Protection
The HtSink A over temp trip fault occurs when heatsink A temperature
(variable Heat sink A temp) is too high.
Related functions:
Heatsink Thermal Protection
(variable Heat sink B temp) is too high.
Related functions:
Heatsink Thermal Protection
GEH-6385 Reference and Troubleshooting, 2300 V Drives Chapter 2 Faults and Troubleshooting
••••
2-13
No. Name Type Description
68 HtSink C over temp Trip
69 BICM card hot Alarm The BICM card hot alarm occurs when the sensor on BICM measures a
70 HtSink DB temp hot Alarm
71 HtSink DS temp hot Alarm The HtSink DS temp hot alarm occurs when the diode source heatsink
72 HtSink A temp hot Alarm
73 HtSink B temp hot Alarm The HtSink B temp hot alarm occurs when heatsink B temperature (variable
The HtSink C over temp trip fault occurs when heatsink C temperature
(variable Heat sink C temp) is too high.
Related functions:
Heatsink Thermal Protection
temperature that is hot. The sensed temperature is above 55C and the control
electronics are operating outside of their design parameters. If the
temperature continues to rise and exceeds 60C, the drive will trip. This
warning is generated in order to allow time for corrective action to be taken.
BIC ambient temp is the variable being monitored to generate this alarm.
Primary causes:
Blocked air flow to control rack.
Control rack cooling fan failure.
Ambient temperature is too high.
Possible board failures:
BICM
The HtSink DB temp hot alarm occurs when the dynamic brake heatsink
temperature (variable DB heat sink temp) is high.
Related functions:
Heatsink Thermal Protection
temperature (variable DS heat sink temp) is high.
Related functions:
Heatsink Thermal Protection
The HtSink A temp hot alarm occurs when heatsink A temperature (variable
Heat sink A temp) is high.
Related functions:
Heatsink Thermal Protection
Heat sink B temp) is high.
Related functions:
Heatsink Thermal Protection
74 HtSink C temp hot Alarm The HtSink C temp hot alarm occurs when heatsink C temperature (variable
Heat sink C temp) is high.
Related functions:
Heatsink Thermal Protection
75
Switchgear not
ready
76 HtSink DB rise high Alarm
2-14
••••
Chapter 2 Faults and Troubleshooting Innovation Series Medium Voltage GP Type - G Drives GEH-6385
Alarm
The Switchgear not ready alarm occurs when the permissive string to close
the main switchgear is not present. This permissive string ends at BTBH(8)
and includes customer contacts used to open the main. The primary purpose
of the alarm is to prevent charging of the DC bus until the switchgear is ready
to close.
Primary causes:
Switchgear not racked in.
Customer switchgear permissive not met.
The HtSink DB rise high alarm occurs when the dynamic brake heatsink
temperature (variable DB heat sink temp) is too far above the ambient
temperature (variable Bridge ambient temp).
Related functions:
Heatsink Thermal Protection
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