FUJITSU SIEMENS M9400 Schematics

5
D D
4
3
2
1
Inventec Corporation R&D Division
C C
Board name : Mother Board Schematic Project : M11D (Santa Rosa)
Version : 0.1
B B
A A
5
Initial Date : March 22 , 2007
4
3
Inventec Corporation
Inventec Corporation
Inventec Corporation
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
Title
Title
Title
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
2
Date: Sheet of
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
1
Title
Title
Title
1
1
1
Rev
Rev
Rev
AX1
AX1
AX1
8
7
6
Schematic Page Description
Santa Rosa Schematic Ver : 0.1
5
4
3
2
1
D D
1. Title
2. Schematic Page DESCR
3. Block Diagram
4. Annotations
5. Schematic Modify
6. Timing Diagram
7. DDRII Layout Guideline
8. Merom Processor(1/2)
9. Merom Processor(2/2)
10. CPU Core Power
11. CPU Thermal
12. Crestline Host(1/6)
13. Crestline DMI/Graph(2/6)
C C
14. Crestline DDRII(3/6)
15. Crestline Power(4/6)
16. Crestline Power(5/6)
17. Crestline Ground(6/6)
18. Clock Generator
19. DDRII SDRAM SO-DIMM0
20. DDRII SDRAM SO-DIMM1
25. LCD / CRT
26. DVI / TV-OUT
27. SATA / ODD / Docking
28. MiniCard / NewCard
29. LAN (88E8055B0)
30. USB / CardReader
31. KBC ITE8512F
32. Audio Codec ALC262/AMP
33. Audio MIC / Super I/O
34. Board CON
35. Adaptor in/Charge
36. Dual Battery
37. 5VLA/5VA/3VA
38. 3VS/5VS/1.25VS/1.05VS
39. 1.5VS/1.8V
40. GPU_Core
41. Audio Board
42. USB Board
43. Glidepad Board
21. ICH8M CPU/IDE/SATA(1/4)
22. ICH8M PCI/PCIE/DMI/USB(2/4)
23. ICH8M GPIO(3/4)
24. ICH8M Power/GND(4/4)
PCI & IRQ & DMA Description :
B B
IDSEL CHIP CHIPPCIINT REQ
BUSMASTER
CHIP
USB & PCI-Express Description :
USB DEVICE DEVICEPCI-E Port 0 Port 1 Port 2
A A
Port 3 Port 4
System System System System Mini Card(3G)
8
USB DEVICE Port 5 Port 6 Port 7 Port 8 Port 9
Docking Express Card Card Reader Web Cam Bluetooth
PCI-E
Port 1
Express Card
Port 2
LAN
Port 3
Mini Card(WLAN)
Port 4
Mini Card(3G) None
Port 5
7
6
Port 6
DEVICE None
5
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Schematic Page DESCR
Schematic Page DESCR
Schematic Page DESCR
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
4
3
2
Friday, June 01, 2007
1
Rev
Rev
Rev
AX1
AX1
AX1
2
2
2
8
7
6
System Block Diagram :
5
4
3
2
1
CPU
FAN
D D
LCD
P.25
CRT
P.25
P.11
S-OUT
P.26
Docking
P.27
LVDS
TVO
RGB_CRT RGB
RGB_DOCK
Thermal
G784
CRT_SW
P.26
HDD
Thermal
SATA 150
P.27
C C
ODD
PATA 100
P.27
USB0USB1USB2USB3
System3
System2System3
USB Board
P.42P.30P.30P.30
USB 2.0/1.1
USB5USB6
B B
Docking
UMTS
P.28P.27
USB4
WLAN
P.28
USB 2.0/1.1
USB10
Bluetooth
P.34
4 IN 1
Slot
Web Cam
Cardreader
GL827
USB7USB8USB9
New CardCardreader
P.28P.30P.25
P.30 P.30
uFCPGA 478pin
Merom
P.8-9P.11
FSB 1.05V 667/800MHz
MCH
965GM/GML FCBGA 1299pin
35mmx35mm
Crestline GM
P.12-17
DMI x4
31mmx31mm
ICH
mBGA 676pin
ICH8M
EHCI#1
Support S0~S3 state
EHCI#2
Support S0~S2 state
P.21-24
DDR2 1.8V 533/667MHz
DDR2 1.8V 533/667MHz
PCI-Express x1 2.5GHz
PCI-Express x1 2.5GHz
PCI-Express x1 2.5GHz
PCI-Express x1 2.5GHz
HDA 24MHz
MDC1.5
P.34
RJ11
LPC 3.3V 33MHz
PMU&KBC
ITE8512F
P.31
SPI
SODIMM0
SODIMM1
P.19 P.20
GbE
88E8055
Port#2
P.29
IntMic Stereo
P.34
Analog In
P.41
PS/2
Docking
P.27
KB
P.31
Flash ROM
P.31
Glide Pad
RJ45
P.29
New Card
Port#1
Audio
Out
Codec
ALC262
Out
Super I/O
IT8305E
P.32
Serial port
Parallel port
PLL
ICS9LPRS365AGLF
P.18
MiniCard #1
Out
Out IN
IN
UMTS/Robson
Port#4
Docking
P.27
80Port
P.28P.33
P.27
P.28
Docking
P.28
AMP
Analog Out
166MHz+/­100MHz+/­48MHz 33MHz 14MHz 27MHz/96MHz+/-
SIM Slot
P.28
MiniCard #2
WLAN/Robson
Port#3
P.28
SPK
P.P32
P.34
P.42
x2 x8 x1 x7 x1 x1
A A
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
8
7
6
5
4
3
Date: Sheet of
2
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
Block Diagram
Block Diagram
Block Diagram
1
Rev
Rev
Rev
AX1
AX1
AX1
3
3
3
8
7
6
5
4
3
2
1
4. Net name Description :
Voltage Rails
DCIN +5VLA 5.0V always on power rail by LATCH or ACIN
D D
+3VA 3.3V always on power rail by ECPWON +5VS
+1.8VS 1.8V switched power rail by SLP_S3#_3R VCC_CORE
+1.05VS +1.25VS 1.25V switched power rail by SLP_S3#_3R +1.5VS
Primary DC system power supply
5.0V always on power rail by ECPWON+5VA
5.0V switched power rail by SLP_S3#_3R
3.3V switched power rail by SLP_S3#_3R+3VS
Core Voltage for CPU
1.05V power rail for AGTL+ termination/Core for GMCH by SLP_S3#_3R
1.5V power rail for CPU PLL/DMI;PCIE;DDRII DLLs for GMCH/Core;PCIE
Power Rail
VCC_CORE
+1.05VS
+1.5VS
for ICH8m by SLP_S3#_3R
+1.8V
0.9VDDT_DDRII
Part Naming Conventions
C
=
Capacitor
CN
C C
D F L Q R RP U Y
Connector
=
Diode
=
Fuse
=
Inductor
= =
Transistor Resistor
=
Resistor Pack
=
Arbitrary Logic Device
=
Crystal and Osc
=
1.8V power rail for DDRII by SLP_S5#_3R
0.9V DDRII Termination Voltage by SLP_S3#_3R
+1.8V
0.9VDDT_DDRII:
+2.5VS
+3VS
Net Name Suffix
# =
Active Low signal
5. Board Stack up Description
PCB Layers
B B
Layer 1 Layer 2 Layer 3
Component Side, Microstrip signal Layer Ground Plane Stripline Layer Power PlaneLayer 4
Layer 5
Power Plane Layer 6 Stripline Layer Layer 7 Layer 8
Host Clock
PCI-E Clock
DDR2 CLK
A A
DDR2 Strobe
DMI Bus
PCIE Bus
SDVO
SATA
USB
LVDS
Lan
Differential Impedance for Microstrip(5-mils) Differential Impedance for Stripline(4-mils)
95 ohm +/- 20% 100 ohm +/- 20%
95 ohm +/- 20% 100 ohm +/- 20%
70 ohm +/- 20% 70 ohm +/- 20%
85 ohm +/- 20%
95 ohm +/- 20%
95 ohm +/- 20% 100 ohm +/- 20%
95 ohm +/- 20%
90 ohm +/- 20%
95 ohm +/- 20% 100 ohm +/- 20%
8
Ground Plane
Solder Side,Microstrip signal Layer
90 ohm +/- 20%
100 ohm +/- 20%95 ohm +/- 20%
100 ohm +/- 20%
100 ohm +/- 20%
95 ohm +/- 20%
100 ohm +/- 20%
7
6
5
1.8VS
+3VA
+5VS
+5VA
+5VLA
4
Destination
Merom
HFM:
LFM: Merom: AGTL+ termination 965GM: Core 965GM: AGTL+ termination ICH8m: Merom PLL 965GM: PCIE 965GM: LVDS 965GM: TVDAC 965GM: Various PLLS analog supply 965GM: DDR DLLS,DDRII,FSB HSIO ICH8m: ICH8m: ICH8m: ICH8m: Mini Card: Express Card: 965GM: DDRII System Memory SO-DIMM: DDRII Terminator:
965GM: PCIE analog 965GM: LVDS analog 965GM: LVDS I/O 965GM: CRT DAC
965GM: HV CMOS 965GM: TVDAC analog ICH8m: ICH8m: ICH8m: ICH8m: ICH8m: Mini Card: UMTS Express Card: CLK Generator: ICS9LPRS365AGLF Mini Card: WirelessLan Bluetooth: Super I/O: IT8305E Azalia Codec: ALC262 Azalia MDC: HDD: SATA
DVI: Sil1364
Thermal Sensor: Lan: Marvell 88E8055B0 Azalia MDC: EC: ITE8512F ICH8m: RTC Flash ROM: BIOS LCD: Cardreader: GL827 Azalia Codec: ALC262 FAN: HDD: SATA ODD: PATA Audio AMP: G1432 Woofer AMP: None Inverter:
USB: x 3 ports
Control Power
3
Voltage
1.3319V~1.4375V~1.4591V
0.9221V~0.9625V~0.9739V
0.997V~1.05V~1.102V
1.0V~1.05V~1.1V
0.9475V~1.05V~1.1025V
1.425V~1.5V~1.575V
1.425V~1.5V~1.575V
1.425V~1.5V~1.575V
1.425V~1.5V~1.575V
1.425V~1.5V~1.575V
1.425V~1.5V~1.575V
1.7V~1.8V~1.9V
0.855V~0.9V~0.945V
2.32V~2.5V~2.625V
2.375V~2.5V~2.625V
2.375V~2.5V~2.625V
2.32V~2.5V~2.625V
3.135V~3.3V~3.465V
3.135V~3.3V~3.465V
3.135V~3.3V~3.465V
3.0V~3.3V~3.6V
3.0V~3.3V~3.6V
3.0V~3.3V~3.6V
4.75V~5.0V~5.25V
4.75V~5.0V~5.25V
5VA 1.5A
2
S0 Current
36A
2.5A
4.6A
1.4A
120mA
1.5A 60mA 24mA 320mA
1.885A
3.1A
1.0A
2mA 10mA 60mA 70mA
40mA 120mA
400mA
1.0A
Max: 1.0A ; R/W: 460mA ; STDBY: 70mA Max: 1.8A ; R/W: 900mA ; STDBY: 45mA
Inventec Corporation
Inventec Corporation
Inventec Corporation
<OrgAddr4>
<OrgAddr4>
<OrgAddr4> Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
ANNOTATIONS
ANNOTATIONS
ANNOTATIONS
1
Rev
Rev
Rev
AX1
AX1
AX1
4
4
4
5
4
3
2
1
Schematic modify Item and History :
V0.1 First release
V0.1 to AX1
D D
1.For FAN PWM Control Change C259 From 0.01uF to NU
Change C538 From 1uF to NU Change R118 From 47Kohm to 1Kohm Change R119 From 4.7Kohm to 0 ohm Change R415 From 10 ohm to NU
2.For Power sequence issue (VRMPWRGD From CORECLK_EN Change to VCORE_GD) Change R131 From NU to 0 ohm
Change R133 From 100K ohm to NU Change U13 From TC7SZ04FU to NU
3.For Power sequence issue (Delay VCORE_GD to PM_ICH_PWROK ) ADD C1202 to 0.1uF
ADD R1116 to 100K ohm ADD D34 BAT54C-7
4.For VESA Specification Requirement (MB Side)
C C
B B
Change C5,C6,C8 From 22pF to 18pF Change L3,L4,L5 From 17ohm 600mA to 10ohm 500mA Change C9,C10,C11 From 10pF to NU Change R4,R5,R6 From 200ohm to 220ohm
5.For VESA Specification Requirement (Docking Side) Change R266,R267,R268 From 200ohm to 220ohm
6.For Serial RING Wake (Change from to EC) Change RING# single connect to U9 IT8512E Pin119
Change U4 MAX3243 Pin26 From 3VS to 3VA
7.For Audio Change Speaker single change connect to pin35,36
Change Heardphone single change connect to pin39,41 Change R586 From 5.1Kohm to 39.2Kohm DEL R584,R580,R588,R589,C679,U46
8.For EMI Requirement ADD C1206~C1251 0.1uF in 3VA,5VA,DCIN,VADPTR_DOCK
ADD C1204,C1205 1000pF in SW Board connecter ADD L1105~L1108 in Speaker connecter Change Q29,Q30,Q32,Q33 From FDS6676AS to FDMS8670S ADD C1252~C1254 0.1uF in USB_VCC1
9.For SATA Eye issue Change C587,C591 From 3300pF to 3900pF
10.For Docking DVI
TX2 Change to CN28 Pin 13,14 TX1 Change to CN28 Pin 16,17 TX0 Change to CN28 Pin 19,20 TXC Change to CN28 Pin 22,23
A A
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
5
4
3
2
Date: Sheet of
Schematic Modify
Schematic Modify
Schematic Modify
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
1
Rev
Rev
Rev
AX1
AX1
AX1
5
5
5
5
4
SYSTEM POWER ON/OFF SEQUENCE
3
2
1
Power on/off sequence AC insert(First)
Power on sequence Power off sequence
SW OFF:
D D
RTCVCC
5VLA
5VAUXON
3VA,5VA
5VA must be powered up before 3VA, or after 3VA within 0.7V
10ms
1.5VA,2.5VA
SW ON:
PWR_SWIN#
RSMRST#
PWR_BTN#
SUSB#
SUSC#
1.8V
5VS,3VS
1.5VS,2.5VS
C C
0.9VS_DIMM
VR_ON
+VCCP
VCCP_PWRGD
VCORE_GD
CPU_PWRGOOD
ALL_SYSPWRGD
PLT_RST#
RTCVCC
3VLA,5VLA
PWR_SWIN#
LATCH_ON
3VA,5VA
1.5VA,2.5VA

MRST#
PWR_BTN#
SUSB#
SUSC#
1.8V
1.5VS,2.5VS
0.9VS_DIMM
VR_ON
+VCCP
VCCP_PWRGD
VCORE_GD
CPU_PWRGOOD
ALL_SYSPWRGD
PLT_RST#
Power on/off sequence AC insert(S4)
Power on sequence Power off sequence
RTCVCC
B B
3VLA,5VLA
5VAUXON
3VA,5VA
PWR_SWIN#
1.5VA,2.5VA
RSMRST#
PWR_BTN#
SUSB#
SUSC#
1.8V
5VS,3VS
1.5VS,2.5VS
0.9VS_DIMM
A A
VR_ON
+VCCP
VCCP_PWRGD
VCORE_GD
CPU_PWRGOOD
ALL_SYSPWRGD
PLT_RST# PLT_RST#
5
4
RTCVCC
3VLA,5VLA
PWR_SWIN#
LATCH_ON
3VA,5VA
1.5VA,2.5VA
RSMRST#
PWR_BTN#
SUSB#
SUSC#
1.8V_DIMM
5VS,3VS
1.5VS,2.5VS
0.9VS_DIMM
VR_ON
+VCCP
VCCP_PWRGD
VCORE_GD
CPU_PWRGOOD
ALL_SYSPWRGD
3
Battery only Power on/off sequence
Power on sequence Power off sequence
5VS,3VS
Suspend resume sequence(S3)
Power on sequence Power off sequence
2
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
Custom
Custom
Custom
Date: Sheet of
Date: Sheet of 43
Date: Sheet of 43
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
Timing Diagram
Timing Diagram
Timing Diagram
1
6
6
6
Rev
Rev
Rev
AX1
AX1
AX1
43
5
4
DDRII Layout Guideline :
3
2
1
Crestline DDRII Layout Guidelines
DDRII Signal Groups
Group Signal Name
D D
Data
M_A_DQ[63..0]/M_B_DQ[63..0] M_A_DM[7..0]/M_B_DM[7..0] M_A_DQS[7..0]/M_A_DQS#[7..0] M_B_DQS[7..0]/M_B_DQS#[7..0]
M_A_A[13..0]/M_B_A[13..0]Address M_A_BS[2..0]/M_B_BS[2..0] M_A_RAS#/M_B_RAS# M_A_CAS#/M_B_CAS# M_A_WE#/M_B_WE#
M_CS#[3..0]Control M_CKE[3..0] M_ODT[3..0]
Clock M_CLK_DDR[3..0]
M_CLK_DDR#[3..0]
SA_RCVEN#/SB_RCVEN#FeedBack
CLK group : M_CLK_DDR[3..0],M_CLK_DDR#[3..0]
GMCH
P1P1L0L0L1L1L2L2S1
C C
Topology
Reference Plane
Single Ended Trace Impedance
Differential Mode Impedance
Minimum Serpentine Spacing Inner Layer : 12 mils
Package Length Range - P1 350 mils ~ 625 mils
Min. Serpentine Spacing 25 mils
Trace Length Limit - L0 (MS)
Trace Length Limit - L1 (SL)
(Breakout length segment)
B B
Stub Length S1-Stub from via to SO-DIMM Max = 200 mils (Breakin)
MB Length Limits - L0 + L1 + L2 + S1 Min = 500 mils
Maximim Via Count 2 (Per side)
SCK to SCK# Length Matching Match total length to within 5 mils
Clock to Clock Length Match (Total Length) Breakout Exceptions (Reduce geometries for GMCH break-out region)
Breakin Exceptions (Reduce geometries for SO-DIMM break-in region)
Feedback group : SA_RCVENIN#],SA_RCVENOUT#,SB_RCVENIN#],SB_RCVENOUT#
These signals are routed internally on the GMCH package and don't require any routing on the MB. As a result, can be left as NC.
A A
4/4/12 7/4/16 8/5/15
Escape
Breakout Breakin
5
SLMS SL MS
Length Matching and Length Formulas
Signal Group Minimum Length Maximum Length
Control-to-Clock
Command-to-Clock
Strobe-to-Clock
Data-to-Strobe
Clock - 1.0"
Clock - 1.0"
Clock - 0.5"
Strobe - 220mils
SO-DIMM
S1
Differential Pair Point-to-Point
Ground
42 +/- 15%
70 +/- 20%
Outer Layer : 15 mils
Nominal Trace Width : 5mils, 4mils
Length Limit: Max = 50 mils (Escape)
Min. Trace Spacing : 5mils, 4mils
Length Limit: Max = 700 mils
Nominal Trace Width : 4mils
Min. Trace Spacng (pair) : 4mils
Min. Trace Spacng (Other) : 12 mils
Max = 4000 mils
Max = 4500 milsTotal Length - P1 + L0 + L1 + L2 + S1
Total Length for Channel A : X0 Total Length for Channel B : X1
Match Channel A clocks to X0 +/- 20mils Match Channel A clocks to X1 +/- 20mils
Inner Layer : 4/12 mils to other DDR2 Outer Layer : 5/15 mils to other DDR2
Max. breakout length is 500 mils
CK to CK# spacing rule waived at connector spacing of 15 mils to other DDR2
Max. breakin length is 200 mils
Clock - 0.0"
Clock + 1.0"
Clock + 1.0"
Strobe - 180mils
4
Control group : SM_CKE[3..0],SM_CS#[3..0],SM_ODT[3..0]
GMCH
P1
4/4/12
Escape
L1
Breakout SL
L2
L0
MS SL/MS
L3
SL/MS
S1
MS
Vtt
8/5/15
7/4/16
SO-DIMM
Topology
Reference Plane
Characteristic Trace Impedance
Nominal Trace Width
Minimum CTRL Trace Spacing
Minimum Spacing to Other DDR2
Minimum Isolation Spacing to non-DDR2
Package Length P1
Trace Length Limit - L0
Trace Length Limit - L1
Stub Length S1-Stub from via to SO-DIMM
MB Length Limits - L0 + L1 + L2 + S1 ­From GMCH ball to SO-DIMM pad Total Length - P1 + L0 + L1 + L2 + S1 ­From GMCH die to SO-DIMM pad
Parallel Termination Resistor 56 +/- 5%
Maximim Via Count
CTRL to SCK/SCK# Length Matching (Total Length including package) Breakout Exceptions (Reduce geometries for GMCH break-out region)
Command group : SA_MA[13..0],SB_MA[13..0],SA_BS[2..0],SB_BS[2..0],SA_RAS#, SB_RAS#,SA_CAS#,SB_CAS#,SA_WE#,SB_WE#
GMCH
P1
Escape
L0
4/4
Breakout
Point-to-Point with parallel termination
Ground
55 +/- 15%
Inner Layer : 4 mils Outer Layer : 5 mils
Inner Layer : 8 mils Outer Layer : 10 mils
Inner Layer : 12 mils Outer Layer : 15 mils
25 mils
750 mils +/- 200 mils
Max = 50 mils (Escape)
Max = 500 mils (Breakout)
Max = 200 mils (Breakin)
Min = 500 mils Max = 4500 mils
Max = 5000 mils
Max = 1500 milsTrace Length L3
3
(CLK-1.0") </= CTRL </= (CLK-0.0")
Inner Layer : 4 mils spacing allowed Outer Layer : 5 mils spacing allowed Max. breakout length is 500 mils
4/6,5/10
4/6,5/10
L1
L3
L2
SL/MS
SL/MSMS SL
S1
MS
Vtt
SO-DIMM
Topology
Reference Plane
Characteristic Trace Impedance
Nominal Trace Width
Minimum CMD Bus Trace Spacing
Minimum Spacing to Other DDR2
Minimum Isolation Spacing to non-DDR2
Package Length P1
Trace Length Limit - L0
Trace Length Limit - L1
Stub Length S1-Stub from via to SO-DIMM
MB Length Limits - L0 + L1 + L2 + S1 ­From GMCH ball to SO-DIMM pad Total Length - P1 + L0 + L1 + L2 + S1 ­From GMCH die to SO-DIMM pad Trace Length L3
Parallel Termination Resistor
Maximim Via Count
CTRL to SCK/SCK# Length Matching (Total Length including package) Breakout Exceptions (Reduce geometries for GMCH break-out region)
Point-to-Point with parallel termination
Ground
55 +/- 15%
Inner Layer : 4 mils Outer Layer : 5 mils
Inner Layer : 6 mils Outer Layer : 10 mils
Inner Layer : 12 mils Outer Layer : 15 mils
25 mils
750 mils +/- 350 mils
Max = 50 mils (Escape)
Max = 500 mils (Breakout)
Max = 200 mils (Breakin)
Min = 500 mils Max = 4500 mils
Max = 5000 mils
Max = 1500 mils
56 +/- 5%
3
(CLK-1.0") </= CMD </= (CLK+1.0")
Inner Layer : 4 mils spacing allowed Outer Layer : 5 mils spacing allowed Max. breakout length is 500 mils
3
Data group : SA_DQ[63..0],SB_DQ[63..0],SA_DM[7..0],SB_DM[7..0]
4/6
GMCH
P1 L0
4/4
Escape
L1
L2
Breakout
MS SLSL MS
S1
SO-DIMM
Topology
Reference Plane
Characteristic Trace Impedance
Nominal Trace Width
Minimum DQ Bus Trace Spacing
Minimum Serpentine Spacing Same as DQ-to-DQ routing
Minimum Spacing to Other DDR2
Minimum Isolation Spacing to non-DDR2
Package Length P1
Trace Length Limit - L0
Trace Length Limit - L1
Stub Length S1-Stub from via to SO-DIMM
MB Length Limits - L0 + L1 + L2 + S1 ­From GMCH ball to SO-DIMM pad Total Length - P1 + L0 + L1 + L2 + S1 ­From GMCH die to SO-DIMM pad Trace Length L3
Maximim Via Count
DQ/DM to DQS Length Matching (Total Length including package)
Breakout Exceptions (Reduce geometries for GMCH break-out region)
Point-to-Point
Ground
55 +/- 15%
Inner Layer : 4 mils Outer Layer : 5 mils
Inner Layer : 6 mils Outer Layer : 8 mils
Inner Layer : 12 mils Outer Layer : 15 mils
25 mils
750 mils +/- 350 mils
Max = 50 mils (Escape)
Max = 500 mils (Breakout)
Max = 200 mils (Breakin)
Min = 500 mils Max = 4500 mils
Max = 5000 mils
Max = 1500 mils
2
Match DQ/DM to [SDQS - 200mils] +/- 20mils, per byte lane Inner Layer : 4 mils spacing allowed
Outer Layer : 5 mils spacing allowed Max. breakout length is 500 mils
Data Strobe group : SA_DQS[7..0],SA_DQS[7..0]#,SB_DQS[7..0],SB_DQS[7..0]#
SO-DIMM
5/5/10
4/4/12
GMCH
P1
P1
Topology
Reference Plane
Single Ended Trace Impedance
Differential Mode Impedance
Nominal Trace Width
Nominal DQS to DQS# Spacing (edge to edge)
Minimum Serpentine Spacing
Minimum Spacing to Other DDR2
Minimum Isolation Spacing to non-DDR2
Package Length Range - P1
Trace Length Limit - L0
Trace Length Limit - L1
Stub Length S1-Stub from via to SO-DIMM
MB Length Limits - L0 + L1 + L2 + S1 ­From GMCH ball to SO-DIMM pad Total Length - P1 + L0 + L1 + L2 + S1 ­From GMCH die to SO-DIMM pad Maximim Via Count
DQS to DQS# Length Matching
Clock to Clock Length Match (Total Length include package) Breakout Exceptions (Reduce geometries for GMCH break-out region)
Breakin Exceptions (Reduce geometries for SO-DIMM break-in region)
Escape
L0
L0
4/4/8
L2
L1
L2
L1
Breakout SL SL MS
Differential Pair Point-to-Point
Ground
55 +/- 15%
85 +/- 20%
Inner Layer : 4 mils Outer Layer : 5 mils
Inner Layer : 4 mils Outer Layer : 5 mils
Inner Layer : 12 milsMinimum DQS to DQ Spacing Outer Layer : 15 mils
Inner Layer : 8 mils Outer Layer : 10 mils
Inner Layer : 12 mils Outer Layer : 15 mils
25 mils
750 mils +/- 350 mils
Max = 50 mils (Escape)
Max = 500 mils (Breakout)
Max = 200 mils (Breakin)
Min = 500 mils Max = 4500 mils
Max = 5000 mils
2 (Per side)
Match total length to within 5 mils
(CLK-0.5") </= DQS </= (CLK+1.0")
Inner Layer : 8 mils to other DDR2 Outer Layer : 10 mils to other DDR2 Max. breakout length is 500 mils
DQS to DQS# spacing rule waived at connector spacing of 10 mils to other DDR2
Max. breakin length is 200 mils
2
S1
S1
Breakin
Inventec Corporation
Inventec Corporation
Inventec Corporation
<OrgAddr4>
<OrgAddr4>
<OrgAddr4> Title
Title
Title
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
Date: Sheet of
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
DDRII Layout Guideline
DDRII Layout Guideline
DDRII Layout Guideline
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
1
7
7
7
Rev
Rev
Rev
AX1
AX1
AX1
A
CN8A
H_A#3 H_A#4 H_A#5 H_A#6 H_A#7 H_A#8 H_A#9 H_A#10 H_A#11 H_A#12 H_A#13 H_A#14
H_A#[35..3]
H_A#15 H_A#16
H_REQ#0 H_REQ#1 H_REQ#2 H_REQ#3 H_REQ#4
H_A#17 H_A#18 H_A#19 H_A#20 H_A#21 H_A#22 H_A#23 H_A#24 H_A#25 H_A#26 H_A#27 H_A#28 H_A#29 H_A#30 H_A#31 H_A#32 H_A#33 H_A#34 H_A#35
4 4
3 3
H_A#[35..3]<12>
H_ADSTB#0<12>
H_REQ#[4..0]<12>
H_ADSTB#1<12>
H_A20M#<21>
H_FERR#<21>
H_IGNNE#<21>
H_STPCLK#<21>
H_INTR<21>
H_NMI<21>
H_SMI#<21>
H_A#[35..3]
H_REQ#[4..0]
H_A#[35..3]<12>
No stub on H_STPCLK test point
CN8A
J4
A[3]#
L5
A[4]#
L4
A[5]#
K5
A[6]#
M3
A[7]#
N2
A[8]#
J1
A[9]#
N3
A[10]#
P5
A[11]#
P2
A[12]#
L2
A[13]#
P4
A[14]#
P1
A[15]#
R1
A[16]#
M1
ADSTB[0]#
K3
REQ[0]#
H2
REQ[1]#
K2
REQ[2]#
J3
REQ[3]#
L1
REQ[4]#
Y2
A[17]#
U5
A[18]#
R3
A[19]#
W6
A[20]#
U4
A[21]#
Y5
A[22]#
U1
A[23]#
R4
A[24]#
T5
A[25]#
T3
A[26]#
W2
A[27]#
W5
A[28]#
Y4
A[29]#
U2
A[30]#
V4
A[31]#
W3
A[32]#
AA4
A[33]#
AB2
A[34]#
AA3
A[35]#
V1
ADSTB[1]#
A6
A20M#
A5
FERR#
C4
IGNNE#
D5
STPCLK#
C6
LINT0
B4
LINT1
A3
SMI#
M4
RSVD[01]
N5
RSVD[02]
T2
RSVD[03]
V3
RSVD[04]
B2
RSVD[05]
C3
RSVD[06]
D2
RSVD[07]
D22
RSVD[08]
D3
RSVD[09]
F6
RSVD[10]
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
6026B0056801
6026B0056801
Rout to TP via and place gnd via w/in 100mils
A#[32-39], APM#[0-1]:Leave escape routing on for future functionality
ICH
ICH
ADS#
ADDR GROUP 0 ADDR GROUP 1
ADDR GROUP 0 ADDR GROUP 1
BNR#
BPRI#
DEFER#
DRDY# DBSY#
BR0#
IERR#
INIT#
LOCK#
CONTROL
CONTROL
RESET#
RS[0]# RS[1]# RS[2]#
TRDY#
HITM#
BPM[0]# BPM[1]# BPM[2]# BPM[3]#
PRDY# PREQ#
TRST#
DBR#
XDP/ITP SIGNALS
XDP/ITP SIGNALS
THERMAL
THERMAL
PROCHOT#
THERMDA THERMDC
THERMTRIP#
H CLK
H CLK
BCLK[0] BCLK[1]
RESERVED
RESERVED
B
H1 E2 G5
H5 F21 E1
F1
H_IERR#
D20 B3
H4 C1
F3 F4 G3 G2
G6
HIT#
E4 AD4
AD3 AD1 AC4 AC2 AC1 AC5
TCK
AA6
TDI
AB3
TDO
AB5
TMS
AB6 C20
D21 A24 B25
C7
A22 A21
R319 56-5%-1/16W-0402R319 56-5%-1/16W-0402
R249 SHORT-0402-5MILR249 SHORT-0402-5MIL
XDP_BPM#5 XDP_TCK XDP_TDI XDP_TDO XDP_TMS XDP_TRST# XDP_DBRESET#
H_ADS# <12> H_BNR# <12>
H_BPRI# <12> H_DEFER# <12>
H_DRDY# <12> H_DBSY# <12>
H_BREQ#0 <12>
H_INIT# <21>
H_LOCK# <12>
H_CPURST# <12> H_RS#0 <12> H_RS#1 <12> H_RS#2 <12> H_TRDY# <12>
H_HIT# <12> H_HITM# <12>
1.05VS<9,12,15,16,18,21,24,38>
R318
R318 75-1%-1/16W-0402
75-1%-1/16W-0402
1.05VS <9,12,15,16,18,21,24,38>
R244
R244
54.9-1%-1/16W-0402_NU
54.9-1%-1/16W-0402_NU
H_PROCHOT# <10> H_THERMDA <11> H_THERMDC <11>
PM_THRMTRIP# <13,21>
CLK_CPU_BCLK <18> CLK_CPU_BCLK# <18>
C
1.05VS <9,12,15,16,18,21,24,38>
D
Topology : FERR#
VCCP
L4
L2
VCCP L1
Rtt
VCCP
CPU IMVP6
Rtt
ICH7mCPU
L2+L1 L3 Strip-line
L2
0" - 3.0" Micro-strip0.5" - 12"
0.5" - 12"L1
0" - 3.0"
Rtt
0.5" - 6.5"
0.5" - 6.5"
Topology : PWRGOOD
CPU
ICH7m
L1
Transmission Line
L1
0.5" - 12"
Micro-strip
0.5" - 12" Strip-line
Topology : INTR , NMI , A20M# , DPSLP# , IGNNE# , INIT# , SMI# , STPCLK#
Transmission Line
L1CPU ICH7m
L1
Topology : THERMTRIP#
GMCHL2CPU ICH8m
0.5" - 12" Micro-strip
Strip-line
0.5" - 12"
VCCP
L3
RttL1 L4
Rtt
L1 L2
1" - 12"
1" - 12" 1" - 6"
Rtt Transmission Line
56 +/-5%
56 +/-5%
Strip-line
0" - 3.0"
0" - 3.0"
Rtt Transmission LineL2L1
Micro-strip70 +/-5%0.5" - 6.5"
70 +/-5%0.5" - 6.5"
L3 L4
0" - 3.0"
0" - 3.0"
Topology : CPUSLP#
GMCH
L1
Topology : RESET#
GMCH
L1
L3
L1+L3
1" - 6" 0" - 3.0"
1" - 12"
1" - 12"
0" - 3.0"
0" - 3.0"
Rss
24 +/-5%
24 +/-5%
E
L1CPU
0.5" - 12"
0.5" - 12"
L1
1" - 6"
1" - 6"
Transmission Line
Micro-strip
Strip-line
Transmission LineCPU
Micro-strip
Strip-line
Rtt
56 +/-5%
56 +/-5%
Transmission LineL4
Micro-strip
Strip-line0" - 3.0"
Should be connect to ICH8 and Calistoga without T-ing(no stub)
XDP P/U & P/D
XDP_DBRESET#
XDP_TMS XDP_TDI XDP_BPM#5
XDP_TRST# XDP_TCK
R316 1K-5%-1/16W-0402R316 1K-5%-1/16W-0402
R247 39.2-1%-1/16W-0402R247 39.2-1%-1/16W-0402 R245 150-1%-1/16W-0402R245 150-1%-1/16W-0402 R246 54.9-1%-1/16W-0402R246 54.9-1%-1/16W-0402
R248 649-1%-1/16W-0402R248 649-1%-1/16W-0402 R240 27-5%-1/10W-0603R240 27-5%-1/10W-0603
7/4 MODIFY
3VS <10,11,13,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
1.05VS <9,12,15,16,18,21,24,38>
FSB Common Clock Signal Layout Guide :
H_ADS# , H_BNR# , H_BPRI# , H_BR0# , H_DBSY# , H_DEFER# , H_DPWR# , H_DRDY# , H_HIT# , H_HITM# , H_LOCK# ,H_ RS#[2..0] , H_TRDY# , H_CPURST#.
Transmission Line Type Total Trace Length Normal Impedance Spacing (mils)
Strip-line(Int. Layer)
Micro-strip(Ext. Layer)
1.0 ~ 6.5 inch
55+/-15%
W=4 & S=8 mils
W=5 & S=10 mils
H_D#[63..0]<12>
2 2
H_DSTBN#0<12>
H_DSTBP#0<12>
H_DINV#0<12>
H_D#[63..0]<12>
1.05VS<9,12,15,16,18,21,24,38>
R314
R314
1K-1%-1/16W-0402
1K-1%-1/16W-0402
R315
R315
2K-1%-1/16W-0402
1 1
2K-1%-1/16W-0402
A
H_DSTBN#1<12>
H_DSTBP#1<12>
H_DINV#1<12>
Zo=55ohm, 0.5" max for GTLREF, Space any other switch signals away from GTLREF with a minimum of 25mils.
Don't allow the GTLREF routing to create splits or discontinuities in the reference planes of the FSB signals
H_D#[63..0]
H_D#[63..0]
1K-5%-1/16W-0402_NU
1K-5%-1/16W-0402_NU R299
R299 R317
R317
1K-5%-1/16W-0402_NU
1K-5%-1/16W-0402_NU C431
C431
0.1uF 10V 10% 0402 X5R_NU
0.1uF 10V 10% 0402 X5R_NU
CLK_BSEL0<18>
H_TEST2
CN8B
CN8B
H_D#0
E22
H_D#1 H_D#2 H_D#3 H_D#4 H_D#5 H_D#6 H_D#7 H_D#8 H_D#9 H_D#10 H_D#11 H_D#12 H_D#13 H_D#14 H_D#15
H_D#16 H_D#17 H_D#18 H_D#19 H_D#20 H_D#21 H_D#22 H_D#23 H_D#24 H_D#25 H_D#26 H_D#27 H_D#28 H_D#29 H_D#30 H_D#31
GTLREF COMP0 H_TEST1
H_TEST4
D[0]#
F24
D[1]#
E26
D[2]#
AD26
AF26
G22
F23
G25
E25
E23
K24
G24
J24
J23
H22
F26
K22
H23
J26
H26
H25
N22
K25
P26
R23
L23
M24
L22
M23
P25
P23
P22
T24
R24
L25
T25
N25
L26
M26
N24
C23
D25
C24
AF1
A26
B22
B23
C21
DATA GRP 0 DATA GRP 1
DATA GRP 0 DATA GRP 1
D[3]# D[4]# D[5]# D[6]# D[7]# D[8]# D[9]# D[10]# D[11]# D[12]# D[13]# D[14]# D[15]# DSTBN[0]# DSTBP[0]# DINV[0]#
D[16]# D[17]# D[18]# D[19]# D[20]# D[21]# D[22]# D[23]# D[24]# D[25]# D[26]# D[27]# D[28]# D[29]# D[30]# D[31]# DSTBN[1]# DSTBP[1]# DINV[1]#
GTLREF
MISC
MISC
TEST1 TEST2 TEST3 TEST4 TEST5 TEST6
BSEL[0] BSEL[1] BSEL[2]
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
6026B0056801
6026B0056801
B
D[32]# D[33]# D[34]# D[35]# D[36]# D[37]# D[38]# D[39]# D[40]# D[41]# D[42]# D[43]# D[44]#
DATA GRP 2DATA GRP 3
DATA GRP 2DATA GRP 3
D[45]# D[46]#
D[47]# DSTBN[2]# DSTBP[2]#
DINV[2]#
D[48]#
D[49]#
D[50]#
D[51]#
D[52]#
D[53]#
D[54]#
D[55]#
D[56]#
D[57]#
D[58]#
D[59]#
D[60]#
D[61]#
D[62]#
D[63]# DSTBN[3]# DSTBP[3]#
DINV[3]# COMP[0]
COMP[1] COMP[2] COMP[3]
DPRSTP#
DPSLP#
DPWR#
PWRGOOD
SLP#
Y22 AB24 V24 V26 V23 T22 U25 U23 Y25 W22 Y23 W24 W25 AA23 AA24 AB25 Y26 AA26 U22
AE24 AD24 AA21 AB22 AB21 AC26 AD20 AE22 AF23 AC25 AE21 AD21 AC22 AD23 AF22 AC23 AE25 AF24 AC20
R26 U26 AA1 Y1
E5 B5 D24 D6 D7 AE6
PSI#
H_D#[63..0] H_D#32 H_D#33 H_D#34 H_D#35 H_D#36 H_D#37 H_D#38 H_D#39 H_D#40 H_D#41 H_D#42 H_D#43 H_D#44 H_D#45 H_D#46 H_D#47
H_D#[63..0] H_D#48 H_D#49 H_D#50 H_D#51 H_D#52 H_D#53 H_D#54 H_D#55 H_D#56 H_D#57 H_D#58 H_D#59 H_D#60 H_D#61 H_D#62 H_D#63
R312 27.4-1%-1/16W-0402R312 27.4-1%-1/16W-0402
COMP1
R313 54.9-1%-1/16W-0402R313 54.9-1%-1/16W-0402
COMP2
R243 27.4-1%-1/16W-0402R243 27.4-1%-1/16W-0402
COMP3
R242 54.9-1%-1/16W-0402R242 54.9-1%-1/16W-0402
H_DPRSTP# <10,13,21> H_DPSLP# <21> H_DPWR# <12> H_PWRGD <21> H_CPUSLP# <12> PSI# <10>
H_PWRGD rise time : Max : 15ns
H_D#[63..0] <12>
H_DSTBN#2 <12> H_DSTBP#2 <12> H_DINV#2 <12>
H_D#[63..0] <12>
H_DSTBN#3 <12> H_DSTBP#3 <12> H_DINV#3 <12>
Comp0,2 connect with Zo=27.4ohm, make trace length shorter than 0.5" and width is 18mils.
Comp1,3 connect with Zo=55ohm, make trace length shorter than 0.5" and width is 5mils
C
FSB Source Synchronous Data Length Variation and Strobe Matching Requirements :
Signals Name
H_D#[15..0] , H_DINV#0
H_D#[31..16] , H_DINV#1
H_D#[47..32] , H_DINV#2
H_D#[63..48] , H_DINV#3
FSB Source Synchronous Data Signal Routing Topology#1 :
Signal Name
H_DINV#[3..0]
H_DATA#[63..0]
H_DSTBN#[3..0]
H_DSTBP#[3..0]
FSB Source Synchronous Address Length Variation and Strobe Matching Requirements :
H_A#[16..3] , H_REQ#[4..0]
H_A#[35..17]
*** No length matching requirements exist between H_ADSTB#0 and H_ADSTB#1
FSB Source Synchronous Address Signal Routing :
Signal Name
H_A#[35..3]
H_REQ#[4..0]
H_ADSTB#[1..0]
Signals Matching
+/- 100 mils
+/- 100 mils
+/- 100 mils
Transmission Line Type
Strip-line
Strip-line
Strip-line
Strip-line
Signals MatchingSignals Name
+/- 200 mils
+/- 200 mils
Transmission Line Type
Strip-line
Strip-line
D
Strobes associated with the group Strobe-to-Strobe Complement Matching
H_DSTBP#0, H_DSTBN#0
H_DSTBP#1, H_DSTBN#1
H_DSTBP#2, H_DSTBN#2
H_DSTBP#3, H_DSTBN#3
Total Trace Length
0.5 ~ 5.5 inch
0.5 ~ 5.5 inch
0.5 ~ 5.5 inch
0.5 ~ 5.5 inch
Strobes associated with the group
H_ADSTB#0
H_ADSTB#1
Total Trace Length Normal Impedance
0.5 ~ 6.5 inch
0.5 ~ 6.5 inch
0.5 ~ 6.5 inch
Normal Impedance
55+/-15%
55+/-15%
55+/-15%
55+/-15%
55+/-15%
55+/-15%
55+/-15%Strip-line
+/- 25 mils+/- 100 mils
+/- 25 mils
+/- 25 mils
+/- 25 mils
Width & Spacing (mils)
Data-to-Data,Strobe-to-strobe Strobe-to-Data
W=4 & S=8 mils
W=4 & S=8 mils
W=4 & S=4 mils
W=4 & S=4 mils
Strobe to Assoc. Address Signal Matching
+/- 200 mils
+/- 200 mils
Width & Spacing (mils)
W=4 & S=8 mils
W=4 & S=8 mils
W=4 & S=12 mils
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Merom Processor(1/2)
Merom Processor(1/2)
Merom Processor(1/2)
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
N/A
N/A
W=4 & S=12 mils
W=4 & S=12 mils
Rev
Rev
Rev
AX1
AX1
AX1
8
8
E
8
A
B
C
D
E
Place these inside socket cavity on L8 (North side secondary)
4 4
3 3
VCORE_CPU<10>
Place these inside socket cavity on L1 (North side Primary)
C381
C381
C357
C357
C366
C366
C363
C363
C373
C373
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
C66 10uF 6.3V 10% 0805 X5RC66 10uF 6.3V 10% 0805 X5R
C92 10uF 6.3V 10% 0805 X5RC92 10uF 6.3V 10% 0805 X5R
C35 10uF 6.3V 10% 0805 X5RC35 10uF 6.3V 10% 0805 X5R
C87 10uF 6.3V 10% 0805 X5RC87 10uF 6.3V 10% 0805 X5R
C78 10uF 6.3V 10% 0805 X5RC78 10uF 6.3V 10% 0805 X5R
North side secondary
C94 T330uF 2V 9m 7343 PANASONIC_NU+C94 T330uF 2V 9m 7343 PANASONIC_NU
C80 T330uF 2V 9m 7343 PANASONIC_NU+C80 T330uF 2V 9m 7343 PANASONIC_NU
C27 T330uF 2V 9m 7343 PANASONIC+C27 T330uF 2V 9m 7343 PANASONIC
+
+
+
2 2
Place these inside socket cavity on L8 (South side secondary)
C382 10uF 6.3V 10% 0805 X5RC382 10uF 6.3V 10% 0805 X5R C93 10uF 6.3V 10% 0805 X5RC93 10uF 6.3V 10% 0805 X5R
C369 10uF 6.3V 10% 0805 X5RC369 10uF 6.3V 10% 0805 X5R
C374 10uF 6.3V 10% 0805 X5RC374 10uF 6.3V 10% 0805 X5R
C364 10uF 6.3V 10% 0805 X5RC364 10uF 6.3V 10% 0805 X5R
C358 10uF 6.3V 10% 0805 X5RC358 10uF 6.3V 10% 0805 X5R
Place these inside socket cavity on L1 (South side Primary)
C36 10uF 6.3V 10% 0805 X5RC36 10uF 6.3V 10% 0805 X5R
C79 10uF 6.3V 10% 0805 X5RC79 10uF 6.3V 10% 0805 X5R
C67 10uF 6.3V 10% 0805 X5RC67 10uF 6.3V 10% 0805 X5R
South side secondary
C37 T330uF 2V 9m 7343 PANASONIC+C37 T330uF 2V 9m 7343 PANASONICC88 10uF 6.3V 10% 0805 X5RC88 10uF 6.3V 10% 0805 X5R
C81 T330uF 2V 9m 7343 PANASONIC+C81 T330uF 2V 9m 7343 PANASONIC+C99 T330uF 2V 9m 7343 PANASONIC+C99 T330uF 2V 9m 7343 PANASONIC
+
+
CN8C
CN8C
A7
VCC[001]
VCC[068]
VCC[002]
VCC[069]
VCC[003]
VCC[070]
VCC[004]
VCC[071]
VCC[005]
VCC[072]
VCC[006]
VCC[073]
VCC[007]
VCC[074]
VCC[008]
VCC[075]
VCC[009]
VCC[076]
VCC[010]
VCC[077]
VCC[011]
VCC[078]
VCC[012]
VCC[079]
VCC[013]
VCC[080]
VCC[014]
VCC[081]
VCC[015]
VCC[082]
VCC[016]
VCC[083]
VCC[017]
VCC[084]
VCC[018]
VCC[085]
VCC[019]
VCC[086]
VCC[020]
VCC[087]
VCC[021]
VCC[088]
VCC[022]
VCC[089]
VCC[023]
VCC[090]
VCC[024]
VCC[091]
VCC[025]
VCC[092]
VCC[026]
VCC[093]
VCC[027]
VCC[094]
VCC[028]
VCC[095]
VCC[029]
VCC[096]
VCC[030]
VCC[097]
VCC[031]
VCC[098]
VCC[032]
VCC[099]
VCC[033]
VCC[100] VCC[034] VCC[035]
VCCP[01] VCC[036]
VCCP[02] VCC[037]
VCCP[03] VCC[038]
VCCP[04] VCC[039]
VCCP[05] VCC[040]
VCCP[06] VCC[041]
VCCP[07] VCC[042]
VCCP[08] VCC[043]
VCCP[09] VCC[044]
VCCP[10] VCC[045]
VCCP[11] VCC[046]
VCCP[12] VCC[047]
VCCP[13] VCC[048]
VCCP[14] VCC[049]
VCCP[15] VCC[050]
VCCP[16] VCC[051] VCC[052]
VCCA[01] VCC[053]
VCCA[02] VCC[054] VCC[055]
VID[0]
VCC[056]
VID[1]
VCC[057]
VID[2]
VCC[058]
VID[3]
VCC[059]
VID[4]
VCC[060]
VID[5]
VCC[061]
VID[6] VCC[062] VCC[063] VCC[064]
VCCSENSE VCC[065] VCC[066] VCC[067]
VSSSENSE
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
6026B0056801
6026B0056801
AA10 AA12 AA13 AA15 AA17 AA18 AA20
AC10 AB10 AB12 AB14 AB15 AB17 AB18
A9 A10 A12 A13 A15 A17 A18 A20
B7
B9 B10 B12 B14 B15 B17 B18 B20
C9 C10 C12 C13 C15 C17 C18
D9 D10 D12 D14 D15 D17 D18
E7
E9 E10 E12 E13 E15 E17 E18 E20
F7
F9 F10 F12 F14 F15 F17 F18 F20 AA7 AA9
AB9
AB20 AB7 AC7 AC9 AC12 AC13 AC15 AC17 AC18 AD7 AD9 AD10 AD12 AD14 AD15 AD17 AD18 AE9 AE10 AE12 AE13 AE15 AE17 AE18 AE20 AF9 AF10 AF12 AF14 AF15 AF17 AF18 AF20
G21 V6 J6 K6 M6 J21 K21 M21 N21 N6 R21 R6 T21 T6 V21 W21
B26 C26
AD6 AF5 AE5 AF4 AE3 AF3 AE2
AF7
AE7
H_VID0 <10> H_VID1 <10> H_VID2 <10> H_VID3 <10> H_VID4 <10> H_VID5 <10> H_VID6 <10>
Route VCCSENSE and VSSSENSE traces at 27.4 ohms with 50mil spacing. Place PU and PD within 1 inch of CPU
C350 0.1uF 10V 10% 0402 X7RC350 0.1uF 10V 10% 0402 X7R
C398 0.1uF 10V 10% 0402 X7RC398 0.1uF 10V 10% 0402 X7R
C368 0.1uF 10V 10% 0402 X7RC368 0.1uF 10V 10% 0402 X7R
C399 0.1uF 10V 10% 0402 X7RC399 0.1uF 10V 10% 0402 X7R
Close to CPU pin B26
C433
C433
0.01uF 16V 10% 0402 X7R
0.01uF 16V 10% 0402 X7R
VCORE_CPU<10>
R260
R260 100-1%-1/16W-0402
100-1%-1/16W-0402
R259
R259 100-1%-1/16W-0402
100-1%-1/16W-0402
C349 0.1uF 10V 10% 0402 X7RC349 0.1uF 10V 10% 0402 X7R
C367 0.1uF 10V 10% 0402 X7RC367 0.1uF 10V 10% 0402 X7R
20mil
160mil
1.05VS <8,12,15,16,18,21,24,38>
C442
C442
+
+
T220uF 2V 15m 7343 PANASONIC
T220uF 2V 15m 7343 PANASONIC
Place these inside socket cavity on L8 (North side secondary)
1.5VS<16,21,22,24,28,38,39>
C436
C436 10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
VCCSENSE <10> VSSSENSE <10>
18mil 7mil space
CN8D
CN8D
A4
VSS[001]
A8
VSS[002]
A11
VSS[003]
A14
VSS[004]
A16
VSS[005]
A19
VSS[006]
A23
VSS[007]
AF2
VSS[008]
B6
VSS[009]
B8
VSS[010]
B11
VSS[011]
B13
VSS[012]
B16
VSS[013]
B19
VSS[014]
B21
VSS[015]
B24
VSS[016]
C5
VSS[017]
C8
VSS[018]
C11
VSS[019]
C14
VSS[020]
C16
VSS[021]
C19
VSS[022]
C2
VSS[023]
C22
VSS[024]
C25
VSS[025]
D1
VSS[026]
D4
VSS[027]
D8
VSS[028]
D11
VSS[029]
D13
VSS[030]
D16
VSS[031]
D19
VSS[032]
D23
VSS[033]
D26
VSS[034]
E3
VSS[035]
E6
VSS[036]
E8
VSS[037]
E11
VSS[038]
E14
VSS[039]
E16
VSS[040]
E19
VSS[041]
E21
VSS[042]
E24
VSS[043]
F5
VSS[044]
F8
VSS[045]
F11
VSS[046]
F13
VSS[047]
F16
VSS[048]
F19
VSS[049]
F2
VSS[050]
F22
VSS[051]
F25
VSS[052]
G4
VSS[053]
G1
VSS[054]
G23
VSS[055]
G26
VSS[056]
H3
VSS[057]
H6
VSS[058]
H21
VSS[059]
H24
VSS[060]
J2
VSS[061]
J5
VSS[062]
J22
VSS[063]
J25
VSS[064]
K1
VSS[065]
K4
VSS[066]
K23
VSS[067]
K26
VSS[068]
L3
VSS[069]
L6
VSS[070]
L21
VSS[071]
L24
VSS[072]
M2
VSS[073]
M5
VSS[074]
M22
VSS[075]
M25
VSS[076]
N1
VSS[077]
N4
VSS[078]
N23
VSS[079]
N26
VSS[080]
P3
VSS[081]
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
SCKT CPU 478P PZ4782K-274M-41 FOXCONN
6026B0056801
6026B0056801
VSS[082] VSS[083] VSS[084] VSS[085] VSS[086] VSS[087] VSS[088] VSS[089] VSS[090] VSS[091] VSS[092] VSS[093] VSS[094] VSS[095] VSS[096] VSS[097] VSS[098] VSS[099] VSS[100] VSS[101] VSS[102] VSS[103] VSS[104] VSS[105] VSS[106] VSS[107] VSS[108] VSS[109] VSS[110] VSS[111] VSS[112] VSS[113] VSS[114] VSS[115] VSS[116] VSS[117] VSS[118] VSS[119] VSS[120] VSS[121] VSS[122] VSS[123] VSS[124] VSS[125] VSS[126] VSS[127] VSS[128] VSS[129] VSS[130] VSS[131] VSS[132] VSS[133] VSS[134] VSS[135] VSS[136] VSS[137] VSS[138] VSS[139] VSS[140] VSS[141] VSS[142] VSS[143] VSS[144] VSS[145] VSS[146] VSS[147] VSS[148] VSS[149] VSS[150] VSS[151] VSS[152] VSS[153] VSS[154] VSS[155] VSS[156] VSS[157] VSS[158] VSS[159] VSS[160] VSS[161] VSS[162] VSS[163]
P6 P21 P24 R2 R5 R22 R25 T1 T4 T23 T26 U3 U6 U21 U24 V2 V5 V22 V25 W1 W4 W23 W26 Y3 Y6 Y21 Y24 AA2 AA5 AA8 AA11 AA14 AA16 AA19 AA22 AA25 AB1 AB4 AB8 AB11 AB13 AB16 AB19 AB23 AB26 AC3 AC6 AC8 AC11 AC14 AC16 AC19 AC21 AC24 AD2 AD5 AD8 AD11 AD13 AD16 AD19 AD22 AD25 AE1 AE4 AE8 AE11 AE14 AE16 AE19 AE23 AE26 A2 AF6 AF8 AF11 AF13 AF16 AF19 AF21 A25 AF25
1 1
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Merom Processor(2/2)
Merom Processor(2/2)
Date: Sheet of
Date: Sheet of
A
B
C
D
Date: Sheet of
Merom Processor(2/2)
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
E
Rev
Rev
Rev
AX1
AX1
AX1
9
9
9
5
D D
2.2K-5%-1/16W-0402
2.2K-5%-1/16W-0402
C C
H_VID0<9> H_VID1<9> H_VID2<9> H_VID3<9> H_VID4<9> H_VID5<9> H_VID6<9>
B B
R605 10K-5%-1/16W-0402_NUR605 10K-5%-1/16W-0402_NU
8770GND
R608 10K-5%-1/16W-0402_NUR608 10K-5%-1/16W-0402_NU
R607 10K-5%-1/16W-0402_NUR607 10K-5%-1/16W-0402_NU
R606 10K-5%-1/16W-0402_NUR606 10K-5%-1/16W-0402_NU
8770GND
8770GND
8770GND
8770GND
VCORE_GD<13,23>
CORECLK_EN#<23>
R609 10K-5%-1/16W-0402_NUR609 10K-5%-1/16W-0402_NU
R610 10K-5%-1/16W-0402_NUR610 10K-5%-1/16W-0402_NU
R611 10K-5%-1/16W-0402_NUR611 10K-5%-1/16W-0402_NU
PSI#<8> VR_ON<31> H_DPRSTP#<8,13,21>
PM_DPRSLPVR<13,23>
8770GND
8770GND
8770GND
8770VCC
4
R391
R391
R612 SHORT-0402-5MILR612 SHORT-0402-5MIL R388 SHORT-0402-5MILR388 SHORT-0402-5MIL
R613 SHORT-0402-5MILR613 SHORT-0402-5MIL
C513 470pF 50V 10% 0402 X7RC513 470pF 50V 10% 0402 X7R
R396 71.5K 1% 1/10W 0603R396 71.5K 1% 1/10W 0603
C511
C511
0.22uF 10V 10% 0603 X7R
0.22uF 10V 10% 0603 X7R
R393
R393 10K-5%-1/16W-0402
10K-5%-1/16W-0402
H_PROCHOT#<8>
TP1TP1
5VA <24,27,30,34,37,38,39,40>
R376
R376
10-5%-1/10W-0603
10-5%-1/10W-0603
8770VCC
C502
C502
2.2uF 10V 10% 0805 X5R
2.2uF 10V 10% 0805 X5R
3VS <8,11,13,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
8770GND
19
U31
R392
R392
2.2K-5%-1/16W-0402
2.2K-5%-1/16W-0402
8770GND
1
U31
2 1
31 32 33 34 35 36 37
3 38 40 39
9
7
8770REF
11 18
41
6
5
4
MAX8770GTL+ TQFN 40P MAXIM
MAX8770GTL+ TQFN 40P MAXIM
6019B0130201
6019B0130201
8770GND
PWRGD CLKEN
D0 D1 D2 D3 D4 D5 D6
PSI SHDN DPRSTP DPRSLPVR
CCV
TIME
REF GND
EP
THRM
VRHOT POUT
VCC
R102
R102
SHORT-0402-40MIL
SHORT-0402-40MIL
25
TON
VDD
BST1
LX1 DH1 DL1
PGND1
FB
CCI
GNDS
CSN1 CSP1
CSP2 CSN2
DH2 DL2 LX2
BST2
PGND2
C494
C494 10uF 6.3V 10% 0805 X5R
10uF 6.3V 10% 0805 X5R
8 30 28 29 26 27
12
10
13
16 17
14 15
21 24 22 20 23
R394
R394 200K 1% 1/16W 0402
200K 1% 1/16W 0402
R369 2.2-5%-1/10W-0603R369 2.2-5%-1/10W-0603
R384 3.9K 1% 1/10W 0603R384 3.9K 1% 1/10W 0603
10K-5%-0603-NTC_NU
10K-5%-0603-NTC_NU
5.11K-1%-1/10W-0603_NU
5.11K-1%-1/10W-0603_NU R387
R387
20K-1%-1/16W-0402
20K-1%-1/16W-0402
R395
R395
C514
C514
470pF 50V 10% 0402 X7R
470pF 50V 10% 0402 X7R
8770CSN1 8770CSP1
8770CSP2 8770CSN2
R370 2.2-5%-1/10W-0603R370 2.2-5%-1/10W-0603
3
0.22uF 25V 10% 0603 X5R
0.22uF 25V 10% 0603 X5R C496
C496
R385
R385
8770GND
8770GND
0.22uF 25V 10% 0603 X5R
0.22uF 25V 10% 0603 X5R
100-1%-1/16W-0402
100-1%-1/16W-0402 R386
R386
C508
C508 1000pF 50V 10% 0402 X7R
1000pF 50V 10% 0402 X7R
R383
R383
100-1%-1/16W-0402
100-1%-1/16W-0402
C505
C505 1000pF 50V 10% 0402 X7R
1000pF 50V 10% 0402 X7R
C497
C497
4
Q32
Q32
Q33
Q33
5
4
4
4
61
789
D
D
Q34
Q34
S
S
2
3
61
5
789
D
D S
S
2
3
VCCSENSE <9>
VSSSENSE <9>
61
5
789
D
D S
S
2
61
5
789
D
D S
S
2
2
DCIN<27,35,36,37,39,40>
10UF 25V 10% 1206 X5R
10UF 25V 10% 1206 X5R
L51
L51
0.36uH 20% 25.5A 11.5X10X4
0.36uH 20% 25.5A 11.5X10X4
R304
R304
2.67K 1% 1/10W 0603
2.67K 1% 1/10W 0603
R308
R308
2.1K 1% 1/10W 0603
2.1K 1% 1/10W 0603
C427
C427
0.22uF 10V 10% 0603 X7R
0.22uF 10V 10% 0603 X7R
FDMS8690 30V 19.8A 8P_NU
FDMS8690 30V 19.8A 8P_NU
Q30
Q30
FDMS8670S 30V 20A 8P
FDMS8670S 30V 20A 8P
8770CSP2 8770CSN2
DCIN
C477
C477
10K-5%-0603-NTC
10K-5%-0603-NTC R320
R320
10UF 25V 10% 1206 X5R
10UF 25V 10% 1206 X5R
C475
C475
L52
L52
0.36uH 20% 25.5A 11.5X10X4
0.36uH 20% 25.5A 11.5X10X4
R305
R305
2.67K 1% 1/10W 0603
2.67K 1% 1/10W 0603
R309
R309
2.1K 1% 1/10W 0603
2.1K 1% 1/10W 0603
C428
C428
0.22uF 10V 10% 0603 X7R
0.22uF 10V 10% 0603 X7R
C478
C478 10UF 25V 10% 1206 X5R
10UF 25V 10% 1206 X5R
DCIN<27,35,36,37,39,40>
10UF 25V 10% 1206 X5R
10UF 25V 10% 1206 X5R
C476
C476
10K-5%-0603-NTC
10K-5%-0603-NTC R321
R321
+
+
C480 T5.6uF 25V 100m 3528 SANYO_NU
C480 T5.6uF 25V 100m 3528 SANYO_NU
+
+
C479 T5.6uF 25V 100m 3528 SANYO_NU
C479 T5.6uF 25V 100m 3528 SANYO_NU
VCORE_CPU<9>
FDMS8690 30V 19.8A 8P_NU
61
5
789
D
D S
S
2
3
61
5
789
D
D S
S
2
3
5
4
5
4
FDMS8690 30V 19.8A 8P_NU
Q35
Q35
Q29
Q29 FDMS8670S 30V 20A 8P
FDMS8670S 30V 20A 8P
8770CSP1 8770CSN1
61
789
D
D
Q36
Q36
S
S
2
3
61
789
D
D S
S
2
3
FDMS8690 30V 19.8A 8P
FDMS8690 30V 19.8A 8P
4
FDMS8670S 30V 20A 8P
FDMS8670S 30V 20A 8P
4
FDMS8690 30V 19.8A 8P
FDMS8690 30V 19.8A 8P
Q37
Q37
3
FDMS8670S 30V 20A 8P
FDMS8670S 30V 20A 8P
3
1
A A
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
Custom
Custom
Custom
Date: Sheet of 4310
Date: Sheet of 4310
5
4
3
2
Date: Sheet of 4310
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
CPU Core Power
CPU Core Power
CPU Core Power
1
Rev
Rev
Rev
AX1
AX1
AX1
8
D D
7
6
5
4
3
2
1
THERMAL SENSOR
3VS<8,10,13,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
C435
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
10mil
THRM#<31>
C C
H_THERMDA<8> H_THERMDC<8>
C435
H_THERMDC
R322
R322 10K-5%-1/16W-0402
10K-5%-1/16W-0402
C437 2200pF 50V 5% 0603 X7RC437 2200pF 50V 5% 0603 X7R
U27
U27
1
VDD
2
DXP
3
DXN
ALERT#
THERM#4GND
G784P81U MSOP 8P
G784P81U MSOP 8P
6019B0221201
6019B0221201
SCLK
SDATA
THRMSCK
8
THRMSDAH_THERMDA
7 6 5
THRMSCK <31> THRMSDA <31>
10mil
B B
B Change
5VS<24,25,26,27,30,31,32,33,34,38>
A A
8
7
6
Fan control
FDN338P 20V 1.6A SOT3
FDN338P 20V 1.6A SOT3
C259
0.01uF 16V 10% 0402 X7R_NU
C259
0.01uF 16V 10% 0402 X7R_NU 1K-5%-1/16W-0402
1K-5%-1/16W-0402
C243
C243
10UF 25V 10% 1206 X5R
10UF 25V 10% 1206 X5R
FANCTL1<31>
Q40
Q40
S D
S
S
D
D
G
G
R118
R118
G
0-5%-1/16W-0402
0-5%-1/16W-0402
R119
R119
Q8
Q8
B
NPN PDTC144EU 50V 100mA SOT223
NPN PDTC144EU 50V 100mA SOT223
E C
5
30mil
5VS_FAN
R415
10-5%-1/16W-0402_NU
R415
10-5%-1/16W-0402_NU
CN17
CN17
1
G1
1
G1
2
2
3
FAN_TACH1<31>
C537
3300pF 50V 10% 0402 X7R_NU
C537
3300pF 50V 10% 0402 X7R_NU
C538
1uF 6.3V 10% 0402 X5R_NU
C538
1uF 6.3V 10% 0402 X5R_NU
4
CN 3P 3702-F03C-02R ENTERY
CN 3P 3702-F03C-02R ENTERY
3
6012B0191701
6012B0191701
G2
G2
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
3
Date: Sheet of
2
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
CPU Thermal
CPU Thermal
CPU Thermal
1
Rev
Rev
Rev
AX1
AX1
AX1
10
9
8
7
6
5
4
3
2
1
H H
1.05VS<8,9,15,16,18,21,24,38>
R54
R54
54.9-1%-1/16W-0402
G G
F F
54.9-1%-1/16W-0402
H_SCOMP#
1.05VS<8,9,15,16,18,21,24,38> 1.05VS<8,9,15,16,18,21,24,38>
R46
R46
54.9-1%-1/16W-0402
54.9-1%-1/16W-0402
H_SCOMP
H_RCOMP
R32
R32
24.9-1%-1/16W-0402
24.9-1%-1/16W-0402
10mil
R24
R24 221-1%-1/16W-0402
221-1%-1/16W-0402
R25
R25 100-1%-1/16W-0402
100-1%-1/16W-0402
10mil
H_SWING
H_D#[63..0]<8>
C58
C58
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
H_D#[63..0]
Trace should be 10-mil wide with 20-mil spacing
E E
D D
H_SWING H_RCOMP
H_SCOMP H_SCOMP#
H_CPURST#<8>
1.05VS<8,9,15,16,18,21,24,38>
C C
R18
R18 1K-1%-1/16W-0402
1K-1%-1/16W-0402
H_CPUSLP#<8>
H_AVREF
U7A
U7A
H_D#0
E2
H_D#1 H_D#2 H_D#3 H_D#4 H_D#5 H_D#6 H_D#7 H_D#8 H_D#9 H_D#10 H_D#11 H_D#12 H_D#13 H_D#14 H_D#15 H_D#16 H_D#17 H_D#18 H_D#19 H_D#20 H_D#21 H_D#22 H_D#23 H_D#24 H_D#25 H_D#26 H_D#27 H_D#28 H_D#29 H_D#30 H_D#31 H_D#32 H_D#33 H_D#34 H_D#35 H_D#36 H_D#37 H_D#38 H_D#39 H_D#40 H_D#41 H_D#42 H_D#43 H_D#44 H_D#45 H_D#46 H_D#47 H_D#48 H_D#49 H_D#50 H_D#51 H_D#52 H_D#53 H_D#54 H_D#55 H_D#56 H_D#57 H_D#58 H_D#59 H_D#60 H_D#61 H_D#62 H_D#63
H_D#_0
G2
H_D#_1
G7
H_D#_2
M6
H_D#_3
H7
H_D#_4
H3
H_D#_5
G4
H_D#_6
F3
H_D#_7
N8
H_D#_8
H2
H_D#_9
M10
H_D#_10
N12
H_D#_11
N9
H_D#_12
H5
H_D#_13
P13
H_D#_14
K9
H_D#_15
M2
H_D#_16
W10
H_D#_17
Y8
H_D#_18
V4
H_D#_19
M3
H_D#_20
J1
H_D#_21
N5
H_D#_22
N3
H_D#_23
W6
H_D#_24
W9
H_D#_25
N2
H_D#_26
Y7
H_D#_27
Y9
H_D#_28
P4
H_D#_29
W3
H_D#_30
N1
H_D#_31
AD12
H_D#_32
AE3
H_D#_33
AD9
H_D#_34
AC9
H_D#_35
AC7
H_D#_36
AC14
H_D#_37
AD11
H_D#_38
AC11
H_D#_39
AB2
H_D#_40
AD7
H_D#_41
AB1
H_D#_42
Y3
H_D#_43
AC6
H_D#_44
AE2
H_D#_45
AC5
H_D#_46
AG3
H_D#_47
AJ9
H_D#_48
AH8
H_D#_49
AJ14
H_D#_50
AE9
H_D#_51
AE11
H_D#_52
AH12
H_D#_53
AJ5
H_D#_54
AH5
H_D#_55
AJ6
H_D#_56
AE7
H_D#_57
AJ7
H_D#_58
AJ2
H_D#_59
AE5
H_D#_60
AJ3
H_D#_61
AH2
H_D#_62
AH13
H_D#_63
B3
H_SWING
C2
H_RCOMP
W1
H_SCOMP
W2
H_SCOMP#
B6
H_CPURST#
E5
H_CPUSLP#
B9
H_AVREF
A9
H_DVREF
Crestline FBGA 1299P INTEL 6019B0412201
Crestline FBGA 1299P INTEL 6019B0412201
H_A#_3 H_A#_4 H_A#_5 H_A#_6 H_A#_7 H_A#_8
H_A#_9 H_A#_10 H_A#_11 H_A#_12 H_A#_13 H_A#_14 H_A#_15 H_A#_16 H_A#_17 H_A#_18 H_A#_19 H_A#_20 H_A#_21 H_A#_22 H_A#_23 H_A#_24 H_A#_25 H_A#_26 H_A#_27 H_A#_28 H_A#_29 H_A#_30 H_A#_31 H_A#_32 H_A#_33 H_A#_34 H_A#_35
H_ADS# H_ADSTB#_0 H_ADSTB#_1
H_BNR#
H_BPRI#
H_BREQ#
H_DEFER#
HOST
HOST
H_DBSY#
HPLL_CLK
HPLL_CLK#
H_DPWR#
H_DRDY#
H_HIT#
H_HITM# H_LOCK# H_TRDY#
H_DINV#_0 H_DINV#_1 H_DINV#_2 H_DINV#_3
H_DSTBN#_0 H_DSTBN#_1 H_DSTBN#_2 H_DSTBN#_3
H_DSTBP#_0 H_DSTBP#_1 H_DSTBP#_2 H_DSTBP#_3
H_REQ#_0 H_REQ#_1
H_REQ#_2 H_REQ#_3
H_REQ#_4
H_RS#_0
H_RS#_1
H_RS#_2
B11 C11 M11 C15 F16 L13 G17 C14 K16 B13 L16 J17 B14 K19 P15 R17 B16 H20 L19 D17 M17 N16 J19 B18 E19 B17 B15 E17 C18 A19 B19 N19
G12 H17 G20 C8 E8 F12 D6 C10 AM5 AM7 H8 K7 E4 C6 G10 B7
K5 L2 AD13 AE13
M7 K3 AD2 AH11
L7 K2 AC2 AJ10
M14 E13 A11 H13 B12
E12 D7 D8
H_A#4 H_A#5 H_A#6 H_A#7 H_A#8 H_A#9 H_A#10 H_A#11 H_A#12 H_A#13 H_A#14 H_A#15 H_A#16 H_A#17 H_A#18 H_A#19 H_A#20 H_A#21 H_A#22 H_A#23 H_A#24 H_A#25 H_A#26 H_A#27 H_A#28 H_A#29 H_A#30 H_A#31 H_A#32 H_A#33 H_A#34 H_A#35
H_REQ#0 H_REQ#1 H_REQ#2 H_REQ#3 H_REQ#4
H_A#3
J13
H_A#[35..3]
H_REQ#[4..0]
H_A#[35..3] <8>
H_ADS# <8> H_ADSTB#0 <8> H_ADSTB#1 <8> H_BNR# <8> H_BPRI# <8> H_BREQ#0 <8> H_DEFER# <8> H_DBSY# <8> CLK_MCH_BCLK <18> CLK_MCH_BCLK# <18> H_DPWR# <8> H_DRDY# <8> H_HIT# <8> H_HITM# <8> H_LOCK# <8> H_TRDY# <8>
H_DINV#0 <8> H_DINV#1 <8> H_DINV#2 <8> H_DINV#3 <8>
H_DSTBN#0 <8> H_DSTBN#1 <8> H_DSTBN#2 <8> H_DSTBN#3 <8>
H_DSTBP#0 <8> H_DSTBP#1 <8> H_DSTBP#2 <8> H_DSTBP#3 <8> H_REQ#[4..0] <8>
H_RS#0 <8> H_RS#1 <8> H_RS#2 <8>
10mil
R28
R19
R19 2K-1%-1/16W-0402
2K-1%-1/16W-0402
C38
C38
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
R28 0-5%-1/16W-0402
0-5%-1/16W-0402
H_DVREF
B B
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
A A
10
9
8
7
6
5
4
3
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
Date: Sheet of
Crestline Host(1/6)
Crestline Host(1/6)
Crestline Host(1/6)
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
2
1
Rev
Rev
Rev
AX1
AX1
AX1
10
9
8
7
6
5
4
3
2
1
U7B
U7B
P36
RSVD1
P37
H H
C372
Add for Intel ref design v1.3
C372
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
G G
F F
MCH_BSEL0<18> MCH_BSEL1<18> MCH_BSEL2<18>
E E
PM_BMBUSY#<23>
D D
H_DPRSTP#<8,10,21> PM_EXTTS#0<19> PM_EXTTS#1<20>
PLT_RST#<22,31> PM_THRMTRIP#<8,21> PM_DPRSLPVR<10,23>
VCORE_GD<10,23>
PM_ICH_PWROK<23,25>
NC_MCH_CFG3 NC_MCH_CFG4 MCH_CFG5 NC_MCH_CFG6 NC_MCH_CFG7 NC_MCH_CFG8 MCH_CFG9 NC_MCH_CFG10 NC_MCH_CFG11 MCH_CFG12 MCH_CFG13 NC_MCH_CFG14 NC_MCH_CFG15 MCH_CFG16 NC_MCH_CFG17 MCH_CFG18 MCH_CFG19 MCH_CFG20
PM_EXTTS#0 PM_EXTTS#1
R327 100-1%-1/16W-0402R327 100-1%-1/16W-0402
R390 0-5%-1/16W-0402R390 0-5%-1/16W-0402 R614 0-5%-1/16W-0402_NUR614 0-5%-1/16W-0402_NU
Please Layout in Top Side
C C
B Change
3VS <8,10,11,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
R277
R277 10K-5%-1/16W-0402
10K-5%-1/16W-0402 R276
R276 10K-5%-1/16W-0402
10K-5%-1/16W-0402
PM_EXTTS#0
PM_EXTTS#1
RSVD2
R35
RSVD3
N35
RSVD4
AR12
RSVD5
AR13
RSVD6
AM12
RSVD7
AN13
RSVD8
J12
RSVD9
AR37
RSVD10
AM36
RSVD11
AL36
RSVD12
AM37
RSVD13
D20
RSVD14
H10
RSVD20
B51
RSVD21
BJ20
RSVD22
BK22
RSVD23
BF19
RSVD24
BH20
RSVD25
BK18
RSVD26
BJ18
RSVD27
BF23
RSVD28
BG23
RSVD29
BC23
RSVD30
BD24
RSVD31
BH39
RSVD34
AW20
RSVD35
BK20
RSVD36
B44
RSVD39
C44
RSVD40
A35
RSVD41
B37
RSVD42
B36
RSVD43
B34
RSVD44
C34
RSVD45
P27
CFG_0
N27
CFG_1
N24
CFG_2
C21
CFG_3
C23
CFG_4
F23
CFG_5
N23
CFG_6
G23
CFG_7
J20
CFG_8
C20
CFG_9
R24
CFG_10
L23
CFG_11
J23
CFG_12
E23
CFG_13
E20
CFG_14
K23
CFG_15
M20
CFG_16
M24
CFG_17
L32
CFG_18
N33
CFG_19
L35
CFG_20
G41
PM_BM_BUSY#
L39
PM_DPRSTP#
L36
PM_EXT_TS#_0
J36
PM_EXT_TS#_1
AW49
PWROK
AV20
RSTIN#
N20
THERMTRIP#
G36
DPRSLPVR
BJ51
NC_1
BK51
NC_2
BK50
NC_3
BL50
NC_4
BL49
NC_5
BL3
NC_6
BL2
NC_7
BK1
NC_8
BJ1
NC_9
E1
NC_10
A5
NC_11
C51
NC_12
B50
NC_13
A50
NC_14
A49
NC_15
BK2
NC_16
Crestline FBGA 1299P INTEL
Crestline FBGA 1299P INTEL
DDR MUXINGCLK
DDR MUXINGCLK
CFGRSVD
CFGRSVD
DMI
DMI
PM
PM
GRAPHICS VID
GRAPHICS VID
ME
ME
NC
NC
MISC
MISC
SM_RCOMP_VOH SM_RCOMP_VOL
DPLL_REF_CLK
DPLL_REF_CLK#
DPLL_REF_SSCLK
DPLL_REF_SSCLK#
SDVO_CTRL_CLK
SDVO_CTRL_DATA
CRESTLINE (965GM) Strapping:
B B
A A
MCH_CFG18
R292 1K-5%-1/16W-0402_NUR292 1K-5%-1/16W-0402_NU
MCH_CFG19
R270 4.02K-1%-1/16W-0402R270 4.02K-1%-1/16W-0402
MCH_CFG20
R291 4.02K-1%-1/16W-0402_NUR291 4.02K-1%-1/16W-0402_NU
MCH_CFG5
R283 4.02K-1%-1/16W-0402_NUR283 4.02K-1%-1/16W-0402_NU
MCH_CFG9
R280 2.2K-5%-1/16W-0402_NUR280 2.2K-5%-1/16W-0402_NU
MCH_CFG16
R293 4.02K-1%-1/16W-0402_NUR293 4.02K-1%-1/16W-0402_NU
MCH_CFG12
R288 4.02K-1%-1/16W-0402_NUR288 4.02K-1%-1/16W-0402_NU
MCH_CFG13
R279 4.02K-1%-1/16W-0402_NUR279 4.02K-1%-1/16W-0402_NU
10
3VS<8,10,11,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
9
MCH_CFG5
MCH_CFG9 (PCIE Graphic Lane)
MCH_CFG16 (FSB Dynamic ODT)
MCH_CFG18 (VCC Select)
MCH_CFG19 (DMI Lane Reversal)
MCH_CFG20
8
AV29
SM_CK_0
BB23
SM_CK_1
BA25
SM_CK_3
AV23
SM_CK_4
AW30
SM_CK#_0
BA23
SM_CK#_1
AW25
SM_CK#_3
AW23
SM_CK#_4
BE29
SM_CKE_0
AY32
SM_CKE_1
BD39
SM_CKE_3
BG37
SM_CKE_4
BG20
SM_CS#_0
BK16
SM_CS#_1
BG16
SM_CS#_2
BE13
SM_CS#_3
BH18
SM_ODT_0
BJ15
SM_ODT_1
BJ14
SM_ODT_2
BE16
SM_ODT_3
SM_RCOMP
SM_RCOMP#
SM_VREF_0 SM_VREF_1
PEG_CLK
PEG_CLK#
DMI_RXN_0 DMI_RXN_1 DMI_RXN_2 DMI_RXN_3
DMI_RXP_0 DMI_RXP_1 DMI_RXP_2 DMI_RXP_3
DMI_TXN_0 DMI_TXN_1 DMI_TXN_2 DMI_TXN_3
DMI_TXP_0 DMI_TXP_1 DMI_TXP_2 DMI_TXP_3
BL15 BK14
BK31 BL31
AR49 AW4
B42 C42 H48 H47
K44 K45
AN47 AJ38 AN42 AN46
AM47 AJ39 AN41 AN45
AJ46 AJ41 AM40 AM44
AJ47 AJ42 AM39 AM43
M_RCOMP M_RCOMP#
M_RCOMP_VOH M_RCOMP_VOL
M_VREF
DMI_TXN3 DMI_TXN2 DMI_TXN1 DMI_TXN0
DMI_TXP3 DMI_TXP2 DMI_TXP1 DMI_TXP0
DMI_RXN3 DMI_RXN2 DMI_RXN1 DMI_RXN0
DMI_RXP3 DMI_RXP2 DMI_RXP1 DMI_RXP0
Change 0,1,2,3 to 3,2,1,0.
E35
GFX_VID_0
A39
GFX_VID_1
C38
GFX_VID_2
B39
GFX_VID_3
E36
GFX_VR_EN
AM49
CL_CLK
AK50
CL_DATA
AT43
CL_PWROK
AN49
CL_RST# CL_VREF
CLK_REQ#
ICH_SYNC#
TEST_1 TEST_2
6019B0412201
6019B0412201
MCH_CLVREF
AM50
H35 K36 G39 G40
MCH_TEST1
A37
MCH_TEST2
R32
Low
DMIx2
Reverse Lane
Dynamic ODT Disable
1.05V
Normal Lanes Reversed
Only SDVO or PCIE x1 is operation
M_CLK_DDR0 <19> M_CLK_DDR1 <19> M_CLK_DDR2 <20> M_CLK_DDR3 <20>
M_CLK_DDR#0 <19> M_CLK_DDR#1 <19> M_CLK_DDR#2 <20> M_CLK_DDR#3 <20>
M_CKE0 <19> M_CKE1 <19> M_CKE2 <20> M_CKE3 <20>
M_CS#0 <19> M_CS#1 <19> M_CS#2 <20> M_CS#3 <20>
M_ODT0 <19> M_ODT1 <19> M_ODT2 <20> M_ODT3 <20>
DREFCLK <18> DREFCLK# <18> DREFSSCLK <18> DREFSSCLK# <18>
CLK_PCIE_3GPLL <18> CLK_PCIE_3GPLL# <18>
DFGT_VID_0 <40> DFGT_VID_1 <40> DFGT_VID_2 <40> DFGT_VID_3 <40>
ALL_SYSPWRGD <23,31> CL_RST#0 <23>
7
20mil
M_VREF <19,20,39>
DMI_TXN[3..0]
DMI_TXP[3..0]
DMI_RXN[3..0]
DMI_RXP[3..0]
CL_CLK0 <23> CL_DATA0 <23>
SDVO_CTRL_CLK <26>
SDVO_CTRL_DATA <26> CLK_MCH_OE# <18> MCH_ICH_SYNC# <23>
High
DMIx4
Normal Operation
Dynamic ODT Enable
1.5V
Only SDVO or PCIE x1 with PEG port
Route M_OCDCMOP 0&1 as short as possible
DMI_TXN[3..0] <22>
DMI_TXP[3..0] <22>
DMI_RXN[3..0] <22>
DMI_RXP[3..0] <22>
1
C449
C449
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
TP4TP4
M_VREF
C441
C441
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
CRT_DDC_CLK<25> CRT_DDC_DATA<25> CRT_HSYNC<25>
CRT_VSYNC<25>
1.8V<15,16,19,20,26,39,40>
R91
R91
R90
R90
10mil
MCH_CLVREF
C139
C139
0.1uF 10V 10% 0402 X7R
0.1uF 10V 10% 0402 X7R
MCH_TEST1 MCH_TEST2
R22
R22
0-5%-1/16W-0402
0-5%-1/16W-0402
6
LCM_DDCPCLK<25> LCM_DDCPDATA<25>
LUMA<26> CHROMA<26>
CRT_BLUE<26> CRT_GREEN<26> CRT_RED<26>
M_RCOMP
20-1%-1/16W-0402
20-1%-1/16W-0402
M_RCOMP#
20-1%-1/16W-0402
20-1%-1/16W-0402
1.25VM_AXD <16>
R66
R66 1K-1%-1/16W-0402
1K-1%-1/16W-0402
R65
R65 392-1%-1/16W-0402
392-1%-1/16W-0402
R298
R298 20K-1%-1/16W-0402
20K-1%-1/16W-0402
5
R286 0-5%-1/16W-0402_NUR286 0-5%-1/16W-0402_NU
INV_PWM<25,31> BL_ENA<25>
LVDS_VDDEN<25>
LVDS_TXCLK_LN<25> LVDS_TXCLK_LP<25>
LVDS_TXOUT_L0N<25> LVDS_TXOUT_L1N<25> LVDS_TXOUT_L2N<25>
LVDS_TXOUT_L0P<25> LVDS_TXOUT_L1P<25> LVDS_TXOUT_L2P<25>
R281 75-1%-1/16W-0402R281 75-1%-1/16W-0402 R284 110 1% 1/16 0402R284 110 1% 1/16 0402 R289 110 1% 1/16 0402R289 110 1% 1/16 0402 R287 120-5%-1/16W-0402R287 120-5%-1/16W-0402 R290 120-5%-1/16W-0402R290 120-5%-1/16W-0402 R282 120-5%-1/16W-0402R282 120-5%-1/16W-0402
R272 30.1-0.5%-1/16W-0402R272 30.1-0.5%-1/16W-0402 R271 30.1-0.5%-1/16W-0402R271 30.1-0.5%-1/16W-0402
R285 SHORT-0402-5MILR285 SHORT-0402-5MIL
R294 2.37K-1%-1/16W-0402R294 2.37K-1%-1/16W-0402
TP5TP5
CRT_BLUE CRT_GREEN CRT_RED
10mil
NC_LVDS_TXOUT_U0N NC_LVDS_TXOUT_U1N NC_LVDS_TXOUT_U2N
NC_LVDS_TXOUT_U0P NC_LVDS_TXOUT_U1P NC_LVDS_TXOUT_U2P
3VS <8,10,11,16,18,19,20,21,22,23,24,25,26,27,28,29,31,32,33,34,38,39,40>
R274 10K-5%-1/16W-0402R274 10K-5%-1/16W-0402
R275 10K-5%-1/16W-0402R275 10K-5%-1/16W-0402
U7C
U7C
J40
L_BKLT_CTRL
H39
L_BKLT_EN
E39
L_CTRL_CLK
E40
L_CTRL_DATA
C37
L_DDC_CLK
D35
L_DDC_DATA
K40
L_VDD_EN
L41
L_VBG
1
LVDS_TXCLK_LN
LVDS_TXCLK_LP NC_LVDS_TXCLK_UN NC_LVDS_TXCLK_UP
LVDS_TXOUT_L0N
LVDS_TXOUT_L1N
LVDS_TXOUT_L2N
LVDS_TXOUT_L0P
LVDS_TXOUT_L1P
LVDS_TXOUT_L2P
TP6TP6 TP7TP7
REFSET
R273
R273
1.3K-1%-1/16W-0402
1.3K-1%-1/16W-0402
1K-1%-1/16W-0402
1K-1%-1/16W-0402
3.01K 1% 1/16 0402
3.01K 1% 1/16 0402
1K-1%-1/16W-0402
1K-1%-1/16W-0402
LVDS_IBG
L43
LVDS_VBG
N41
LVDS_VREFH
N40
LVDS_VREFL
D46
LVDSA_CLK#
C45
LVDSA_CLK
D44
LVDSB_CLK#
E42
LVDSB_CLK
G51
LVDSA_DATA#_0
E51
LVDSA_DATA#_1
F49
LVDSA_DATA#_2
C48
LVDSA_DATA#_3
G50
LVDSA_DATA_0
E50
LVDSA_DATA_1
F48
LVDSA_DATA_2
D47
LVDSA_DATA_3
G44
LVDSB_DATA#_0
B47
LVDSB_DATA#_1
B45
LVDSB_DATA#_2
E44
LVDSB_DATA_0
A47
LVDSB_DATA_1
A45
LVDSB_DATA_2
E27
TVA_DAC
G27
TVB_DAC
K27
TVC_DAC
F27
TVA_RTN
J27
TVB_RTN
L27
TVC_RTN
M35
1
TV_DCONSEL_0
P33
1
TV_DCONSEL_1
H32
CRT_BLUE
G32
CRT_BLUE#
K29
CRT_GREEN
J29
CRT_GREEN#
F29
CRT_RED
E29
CRT_RED#
K33
CRT_DDC_CLK
G35
CRT_DDC_DATA
F33
CRT_HSYNC
C32
CRT_TVO_IREF
E33
CRT_VSYNC
Crestline FBGA 1299P INTEL
Crestline FBGA 1299P INTEL
As close as possible to GMCH and Minimum spacing of 20 mils away from any toggle signals When the display is completely white , the RGB voltage is between 665mV to 770mV by VESA
Spec
If meet , CRT_IREF resistor value is optimal
Place 150ohm termination resistor close to GMCH
1.8V <15,16,19,20,26,39,40>
R93
R93
0.01uF 16V 10% 0402 X7R
0.01uF 16V 10% 0402 X7R
M_RCOMP_VOH
C168
C168
C165
R92
R92
R94
R94
C165
2.2uF 10V 10% 0805 X5R
2.2uF 10V 10% 0805 X5R
M_RCOMP_VOL
C169
C169
C166
C166
2.2uF 10V 10% 0805 X5R
2.2uF 10V 10% 0805 X5R
0.01uF 16V 10% 0402 X7R
0.01uF 16V 10% 0402 X7R
4
VCC_PEG<16>
R300
R300
24.9-1%-1/16W-0402
24.9-1%-1/16W-0402
PEG_COMP
N43
PEG_COMPI
M43
PEG_COMPO
J51
PEG_RX#_0
L51
PEG_RX#_1
N47
PEG_RX#_2
T45
PEG_RX#_3
T50
PEG_RX#_4
U40
PEG_RX#_5
Y44
PEG_RX#_6
Y40
PEG_RX#_7
AB51
PEG_RX#_8
LVDS
LVDS
TV VGA
TV VGA
PCI-EXPRESS GRAPHICS
PCI-EXPRESS GRAPHICS
3
PEG_RX#_9 PEG_RX#_10 PEG_RX#_11 PEG_RX#_12 PEG_RX#_13 PEG_RX#_14 PEG_RX#_15
PEG_RX_0 PEG_RX_1 PEG_RX_2 PEG_RX_3 PEG_RX_4 PEG_RX_5 PEG_RX_6 PEG_RX_7 PEG_RX_8
PEG_RX_9 PEG_RX_10 PEG_RX_11 PEG_RX_12 PEG_RX_13 PEG_RX_14 PEG_RX_15
PEG_TX#_0 PEG_TX#_1 PEG_TX#_2 PEG_TX#_3 PEG_TX#_4 PEG_TX#_5 PEG_TX#_6 PEG_TX#_7 PEG_TX#_8 PEG_TX#_9
PEG_TX#_10 PEG_TX#_11 PEG_TX#_12 PEG_TX#_13 PEG_TX#_14 PEG_TX#_15
PEG_TX_0
PEG_TX_1
PEG_TX_2
PEG_TX_3
PEG_TX_4
PEG_TX_5
PEG_TX_6
PEG_TX_7
PEG_TX_8
PEG_TX_9 PEG_TX_10 PEG_TX_11 PEG_TX_12 PEG_TX_13 PEG_TX_14 PEG_TX_15
6019B0412201
6019B0412201
W49 AD44 AD40 AG46 AH49 AG45 AG41
J50 L50 M47 U44 T49 T41 W45 W41 AB50 Y48 AC45 AC41 AH47 AG49 AH45 AG42
C404 0.1uF 10V 10% 0402 X7RC404 0.1uF 10V 10% 0402 X7R
N45 U39
C397 0.1uF 10V 10% 0402 X7RC397 0.1uF 10V 10% 0402 X7R
U47 N51
C384 0.1uF 10V 10% 0402 X7RC384 0.1uF 10V 10% 0402 X7R
R50 T42
C378 0.1uF 10V 10% 0402 X7RC378 0.1uF 10V 10% 0402 X7R
Y43 W46 W38 AD39 AC46 AC49 AC42 AH39 AE49 AH44
C407 0.1uF 10V 10% 0402 X7RC407 0.1uF 10V 10% 0402 X7R
M45 T38
C402 0.1uF 10V 10% 0402 X7RC402 0.1uF 10V 10% 0402 X7R
T46 N50
C386 0.1uF 10V 10% 0402 X7RC386 0.1uF 10V 10% 0402 X7R
R51 U43
C380 0.1uF 10V 10% 0402 X7RC380 0.1uF 10V 10% 0402 X7R
W42 Y47 Y39 AC38 AD47 AC50 AD43 AG39 AE50 AH43
Inventec Corporation
Inventec Corporation
Inventec Corporation
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
Date: Sheet of
Friday, June 01, 2007
2
SDVOB_INT- <26>
SDVOB_INT+ <26>
SDVOB_RED- <26>
SDVOB_GREEN- <26>
SDVOB_BLUE- <26>
SDVOB_CLK- <26>
SDVOB_RED+ <26> SDVOB_GREEN+ <26> SDVOB_BLUE+ <26>
SDVOB_CLK+ <26>
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Crestline DMI/Graph2/6)
Crestline DMI/Graph2/6)
Crestline DMI/Graph2/6)
Rev
Rev
Rev
AX1
AX1
AX1
1
10
9
8
7
6
5
4
3
2
1
H H
G G
M_A_DQ[63..0]<19>
F F
E E
D D
C C
M_A_DQ[63..0]
M_A_DQ0 M_A_DQ1 M_A_DQ2 M_A_DQ3 M_A_DQ4 M_A_DQ5 M_A_DQ6 M_A_DQ7 M_A_DQ8 M_A_DQ9 M_A_DQ10 M_A_DQ11 M_A_DQ12 M_A_DQ13 M_A_DQ14 M_A_DQ15 M_A_DQ16 M_A_DQ17 M_A_DQ18 M_A_DQ19 M_A_DQ20 M_A_DQ21 M_A_DQ22 M_A_DQ23 M_A_DQ24 M_A_DQ25 M_A_DQ26 M_A_DQ27 M_A_DQ28 M_A_DQ29 M_A_DQ30 M_A_DQ31 M_A_DQ32 M_A_DQ33 M_A_DQ34 M_A_DQ35 M_A_DQ36 M_A_DQ37 M_A_DQ38 M_A_DQ39 M_A_DQ40 M_A_DQ41 M_A_DQ42 M_A_DQ43 M_A_DQ44 M_A_DQ45 M_A_DQ46 M_A_DQ47 M_A_DQ48 M_A_DQ49 M_A_DQ50 M_A_DQ51 M_A_DQ52 M_A_DQ53 M_A_DQ54 M_A_DQ55 M_A_DQ56 M_A_DQ57 M_A_DQ58 M_A_DQ59 M_A_DQ60 M_A_DQ61 M_A_DQ62 M_A_DQ63
U7D
U7D
AR43
SA_DQ_0
AW44
SA_DQ_1
BA45
SA_DQ_2
AY46
SA_DQ_3
AR41
SA_DQ_4
AR45
SA_DQ_5
AT42
SA_DQ_6
AW47
SA_DQ_7
BB45
SA_DQ_8
BF48
SA_DQ_9
BG47
SA_DQ_10
BJ45
SA_DQ_11
BB47
SA_DQ_12
BG50
SA_DQ_13
BH49
SA_DQ_14
BE45
SA_DQ_15
AW43
SA_DQ_16
BE44
SA_DQ_17
BG42
SA_DQ_18
BE40
SA_DQ_19
BF44
SA_DQ_20
BH45
SA_DQ_21
BG40
SA_DQ_22
BF40
SA_DQ_23
AR40
SA_DQ_24
AW40
SA_DQ_25
AT39
SA_DQ_26
AW36
SA_DQ_27
AW41
SA_DQ_28
AY41
SA_DQ_29
AV38
SA_DQ_30
AT38
SA_DQ_31
AV13
SA_DQ_32
AT13
SA_DQ_33
AW11
SA_DQ_34
AV11
SA_DQ_35
AU15
SA_DQ_36
AT11
SA_DQ_37
BA13
SA_DQ_38
BA11
SA_DQ_39
BE10
SA_DQ_40
BD10
SA_DQ_41
BD8
SA_DQ_42
AY9
SA_DQ_43
BG10
SA_DQ_44
AW9
SA_DQ_45
BD7
SA_DQ_46
BB9
SA_DQ_47
BB5
SA_DQ_48
AY7
SA_DQ_49
AT5
SA_DQ_50
AT7
SA_DQ_51
AY6
SA_DQ_52
BB7
SA_DQ_53
AR5
SA_DQ_54
AR8
SA_DQ_55
AR9
SA_DQ_56
AN3
SA_DQ_57
AM8
SA_DQ_58
AN10
SA_DQ_59
AT9
SA_DQ_60
AN9
SA_DQ_61
AM9
SA_DQ_62
AN11
SA_DQ_63
Crestline FBGA 1299P INTEL 6019B0412201
Crestline FBGA 1299P INTEL 6019B0412201
DDR SYSTEM MEMORY A
DDR SYSTEM MEMORY A
SA_BS_0 SA_BS_1 SA_BS_2
SA_CAS#
SA_DM_0 SA_DM_1 SA_DM_2 SA_DM_3 SA_DM_4 SA_DM_5 SA_DM_6 SA_DM_7
SA_DQS_0 SA_DQS_1 SA_DQS_2 SA_DQS_3 SA_DQS_4 SA_DQS_5 SA_DQS_6
SA_DQS_7 SA_DQS#_0 SA_DQS#_1 SA_DQS#_2 SA_DQS#_3 SA_DQS#_4 SA_DQS#_5 SA_DQS#_6 SA_DQS#_7
SA_MA_0 SA_MA_1 SA_MA_2 SA_MA_3 SA_MA_4 SA_MA_5 SA_MA_6 SA_MA_7 SA_MA_8
SA_MA_9 SA_MA_10 SA_MA_11 SA_MA_12 SA_MA_13 SA_MA_14
SA_RAS#
SA_RCVEN#
SA_WE#
BB19 BK19 BF29
BL17 AT45
BD44 BD42 AW38 AW13 BG8 AY5 AN6
AT46 BE48 BB43 BC37 BB16 BH6 BB2 AP3 AT47 BD47 BC41 BA37 BA16 BH7 BC1 AP2
BJ19 BD20 BK27 BH28 BL24 BK28 BJ27 BJ25 BL28 BA28 BC19 BE28 BG30 BJ16 BJ29
BE18 AY20
BA19
M_A_DM0 M_A_DM1 M_A_DM2 M_A_DM3 M_A_DM4 M_A_DM5 M_A_DM6 M_A_DM7
M_A_DQS0 M_A_DQS1 M_A_DQS2 M_A_DQS3 M_A_DQS4 M_A_DQS5 M_A_DQS6 M_A_DQS7 M_A_DQS#0 M_A_DQS#1 M_A_DQS#2 M_A_DQS#3 M_A_DQS#4 M_A_DQS#5 M_A_DQS#6 M_A_DQS#7
M_A_A0 M_A_A1 M_A_A2 M_A_A3 M_A_A4 M_A_A5 M_A_A6 M_A_A7 M_A_A8 M_A_A9 M_A_A10 M_A_A11 M_A_A12 M_A_A13
M_A_BS0 <19> M_A_BS1 <19> M_A_BS2 <19>
M_A_DM[7..0]
M_A_DQS[7..0]
M_A_DQS#[7..0]
M_A_A[14..0]
1
TP9TP9
M_A_CAS# <19> M_A_DM[7..0] <19>
M_A_DQS[7..0] <19>
M_A_DQS#[7..0] <19>
M_A_A[14..0] <19>
M_A_RAS# <19>
M_A_WE# <19>
M_B_DQ[63..0]<20>
M_B_DQ[63..0]
M_B_DQ0 M_B_DQ1 M_B_DQ2 M_B_DQ3 M_B_DQ4 M_B_DQ5 M_B_DQ6 M_B_DQ7 M_B_DQ8 M_B_DQ9 M_B_DQ10 M_B_DQ11 M_B_DQ12 M_B_DQ13 M_B_DQ14 M_B_DQ15 M_B_DQ16 M_B_DQ17 M_B_DQ18 M_B_DQ19 M_B_DQ20 M_B_DQ21 M_B_DQ22 M_B_DQ23 M_B_DQ24 M_B_DQ25 M_B_DQ26 M_B_DQ27 M_B_DQ28 M_B_DQ29 M_B_DQ30 M_B_DQ31 M_B_DQ32 M_B_DQ33 M_B_DQ34 M_B_DQ35 M_B_DQ36 M_B_DQ37 M_B_DQ38 M_B_DQ39 M_B_DQ40 M_B_DQ41 M_B_DQ42 M_B_DQ43 M_B_DQ44 M_B_DQ45 M_B_DQ46 M_B_DQ47 M_B_DQ48 M_B_DQ49 M_B_DQ50 M_B_DQ51 M_B_DQ52 M_B_DQ53 M_B_DQ54 M_B_DQ55 M_B_DQ56 M_B_DQ57 M_B_DQ58 M_B_DQ59 M_B_DQ60 M_B_DQ61 M_B_DQ62 M_B_DQ63
U7E
U7E
AP49
SB_DQ_0
AR51
SB_DQ_1
AW50
SB_DQ_2
AW51
SB_DQ_3
AN51
SB_DQ_4
AN50
SB_DQ_5
AV50
SB_DQ_6
AV49
SB_DQ_7
BA50
SB_DQ_8
BB50
SB_DQ_9
BA49
SB_DQ_10
BE50
SB_DQ_11
BA51
SB_DQ_12
AY49
SB_DQ_13
BF50
SB_DQ_14
BF49
SB_DQ_15
BJ50
SB_DQ_16
BJ44
SB_DQ_17
BJ43
SB_DQ_18
BL43
SB_DQ_19
BK47
SB_DQ_20
BK49
SB_DQ_21
BK43
SB_DQ_22
BK42
SB_DQ_23
BJ41
SB_DQ_24
BL41
SB_DQ_25
BJ37
SB_DQ_26
BJ36
SB_DQ_27
BK41
SB_DQ_28
BJ40
SB_DQ_29
BL35
SB_DQ_30
BK37
SB_DQ_31
BK13
SB_DQ_32
BE11
SB_DQ_33
BK11
SB_DQ_34
BC11
SB_DQ_35
BC13
SB_DQ_36
BE12
SB_DQ_37
BC12
SB_DQ_38
BG12
SB_DQ_39
BJ10
SB_DQ_40
BL9
SB_DQ_41
BK5
SB_DQ_42
BL5
SB_DQ_43
BK9
SB_DQ_44
BK10
SB_DQ_45
BJ8
SB_DQ_46
BJ6
SB_DQ_47
BF4
SB_DQ_48
BH5
SB_DQ_49
BG1
SB_DQ_50
BC2
SB_DQ_51
BK3
SB_DQ_52
BE4
SB_DQ_53
BD3
SB_DQ_54
BJ2
SB_DQ_55
BA3
SB_DQ_56
BB3
SB_DQ_57
AR1
SB_DQ_58
AT3
SB_DQ_59
AY2
SB_DQ_60
AY3
SB_DQ_61
AU2
SB_DQ_62
AT2
SB_DQ_63
Crestline FBGA 1299P INTEL 6019B0412201
Crestline FBGA 1299P INTEL 6019B0412201
DDR SYSTEM MEMORY B
DDR SYSTEM MEMORY B
SB_BS_0 SB_BS_1 SB_BS_2
SB_CAS# SB_DM_0
SB_DM_1 SB_DM_2 SB_DM_3 SB_DM_4 SB_DM_5 SB_DM_6 SB_DM_7
SB_DQS_0 SB_DQS_1 SB_DQS_2 SB_DQS_3 SB_DQS_4 SB_DQS_5 SB_DQS_6
SB_DQS_7 SB_DQS#_0 SB_DQS#_1 SB_DQS#_2 SB_DQS#_3 SB_DQS#_4 SB_DQS#_5 SB_DQS#_6 SB_DQS#_7
SB_MA_0 SB_MA_1 SB_MA_2 SB_MA_3 SB_MA_4 SB_MA_5 SB_MA_6 SB_MA_7 SB_MA_8
SB_MA_9 SB_MA_10 SB_MA_11 SB_MA_12 SB_MA_13 SB_MA_14
SB_RAS#
SB_RCVEN#
SB_WE#
AY17 BG18 BG36
BE17 AR50
BD49 BK45 BL39 BH12 BJ7 BF3 AW2
AT50 BD50 BK46 BK39 BJ12 BL7 BE2 AV2 AU50 BC50 BL45 BK38 BK12 BK7 BF2 AV3
BC18 BG28 BG25 AW17 BF25 BE25 BA29 BC28 AY28 BD37 BG17 BE37 BA39 BG13 BE24
AV16 AY18
BC17
M_B_DM0 M_B_DM1 M_B_DM2 M_B_DM3 M_B_DM4 M_B_DM5 M_B_DM6 M_B_DM7
M_B_DQS0 M_B_DQS1 M_B_DQS2 M_B_DQS3 M_B_DQS4 M_B_DQS5 M_B_DQS6 M_B_DQS7 M_B_DQS#0 M_B_DQS#1 M_B_DQS#2 M_B_DQS#3 M_B_DQS#4 M_B_DQS#5 M_B_DQS#6 M_B_DQS#7
M_B_A0 M_B_A1 M_B_A2 M_B_A3 M_B_A4 M_B_A5 M_B_A6 M_B_A7 M_B_A8 M_B_A9 M_B_A10 M_B_A11 M_B_A12 M_B_A13 M_B_A14M_A_A14
M_B_BS0 <20> M_B_BS1 <20> M_B_BS2 <20>
M_B_DM[7..0]
M_B_DQS[7..0]
M_B_DQS#[7..0]
M_B_A[14..0]
1
TP10TP10
M_B_CAS# <20> M_B_DM[7..0] <20>
M_B_DQS[7..0] <20>
M_B_DQS#[7..0] <20>
M_B_A[14..0] <20>
M_B_RAS# <20>
M_B_WE# <20>
B B
Inventec Corporation
Inventec Corporation
Inventec Corporation
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree
Inventec Buliding,66 Hou-Kang Stree Shin-Lin District, Taipei 111, Taiwan
Shin-Lin District, Taipei 111, Taiwan
A A
10
9
8
7
6
5
4
3
Shin-Lin District, Taipei 111, Taiwan
<OrgAddr4>
<OrgAddr4>
<OrgAddr4>
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
TEL:+886-2-2881-0721
Title
Title
Title
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
M11D (Merom+Crestline+ICH8M)
Document Number
Document Number
Document Number
Size
Size
Size
C
C
C
Date: Sheet of
Date: Sheet of
Date: Sheet of
Friday, June 01, 2007
Friday, June 01, 2007
Friday, June 01, 2007
2
Crestline DDRII(3/6)
Crestline DDRII(3/6)
Crestline DDRII(3/6)
1
Rev
Rev
Rev
AX1
AX1
AX1
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