Fujitsu siemens D1184 Technical Manual

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TECHNISCHES HANDBUCH
TECHNISCHES HANDBUCH
TECHNISCHES HANDBUCHTECHNISCHES HANDBUCH
TECHNICAL MANUALTECHNICAL MANUAL
SYSTEMBAUGRUPPE D1184
SYSTEMBAUGRUPPE D1184
SYSTEMBAUGRUPPE D1184SYSTEMBAUGRUPPE D1184 SYSTEM BOARD D1184
SYSTEM BOARD D1184
SYSTEM BOARD D1184SYSTEM BOARD D1184
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Sie haben ...
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... technische Fragen oder Probleme? Wenden Sie sich bitte an:
unsere Hotline:
Mo-Fr: 9 - 18 Uh Sa: 9 - 14 Uh Tel.: ++49 (0) 180 3777 000
Ihren zuständigen Vertriebspartne
Ihr Verkaufsstelle
Weitere Informationen finden Sie im Handbuch "Sicherheit, Garantie und Ergonomie". Aktuelle Informationen zu unseren Produkten, Tipps, Updates usw. finden Sie im Internet:
http://www.fujitsu-siemens.com
Are there ...
... any technical problems or other questions you need clarified? Please contact:
your sales partne
your sales outlet
You will find further information in the manual "Safety, Guarantee and Ergonomics". The latest information on our products, tips, updates, etc., can be found on the Internet under:
http://www.fujitsu-siemens.com
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Dieses Handbuch wurde auf Recycling-Papier gedruckt. This manual has been printed on recycled paper. Ce manuel est imprimé sur du papier recyclé. Este manual ha sido impreso sobre papel reciclado. Questo manuale è stato stampato su carta da riciclaggio. Denna handbok är tryckt på recyclingpapper. Dit handboek werd op recycling-papier gedrukt.
Herausgegeben von/Published by Fujitsu Siemens Computers GmbH
A26361-D1184-Z120-1-7419
Bestell-Nr./Order No.: Printed in the Federal Republic of Germany AG 0900 09/00
A26361-D1184-Z120-1-7419
A26361-D1184-Z120-1-7419A26361-D1184-Z120-1-7419
A26361-D1184-Z120-1-7419
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Systembaugruppe D1184 System Board D1184
Technisches Handbuch Technical Manual
Deutsch
English
Ausgabe September 2000 September 2000 edition
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Intel, Pentium und Celeron sind eingetragene Warenzeichen und MMX und OverDrive sind Warenzeichen der Intel Corporation, USA.
Microsoft, MS, MS-DOS und Windows sind eingetragene Warenzeichen der Microsoft Corporation.
PS/2 und OS/2 Warp sind eingetragene Warenzeichen von International Business Machines, Inc.
Alle weiteren genannten Warenzeichen sind Warenzeichen oder eingetragene Warenzeichen der jeweiligen Inhaber und werden als geschützt anerkannt.
Copyright ã Fujitsu Siemens Computers GmbH 2000 Alle Rechte vorbehalten, insbesondere (auch auszugsweise) die der Übersetzung, des
Nachdrucks, der Wiedergabe durch Kopieren oder ähnliche Verfahren. Zuwiderhandlungen verpflichten zu Schadenersatz. Alle Rechte vorbehalten, insbesondere für den Fall der Patenterteilung oder GM-Eintragung. Liefermöglichkeiten und technische Änderungen vorbehalten. Dieses Handbuch wurde erstellt von
cognitas. Gesellschaft für Technik-Dokumentation mbH www.cognitas.de
Intel, Pentium and Celeron are registered trademarks and MMX and OverDrive are trademarks of Intel Corporation, USA.
Microsoft, MS, MS-DOS and Windows are registered trademarks of Microsoft Corporation. PS/2 and OS/2 Warp are registered trademarks of International Business Machines, Inc. All other trademarks referenced are trademarks or registered trademarks of their respective
owners, whose protected rights are acknowledged. All rights, including rights of translation, reproduction by printing, copying or similar methods,
even of parts are reserved. Offenders will be liable for damages. All rights, including rights created by patent grant or registration of a utility model or design,
are reserved. Delivery subject to availability. Right of technical modification reserved. This manual was produced by
cognitas. Gesellschaft für Technik-Dokumentation mbH www.cognitas.de
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Contents

Introduction........................................................................................................................................ 1
Notational conventions ..............................................................................................................1
Important notes .................................................................................................................................1
Information on boards................................................................................................................2
Features............................................................................................................................................3
Interfaces and connectors .........................................................................................................5
Temperature monitoring / system monitoring.............................................................................7
Hard disk connection.................................................................................................................8
LAN port....................................................................................................................................8
Possible screen resolution.........................................................................................................9
PCI bus interrupts......................................................................................................................9
Settings with switches and jumpers.................................................................................................10
Recovering System BIOS - switch 2........................................................................................10
Write protection for floppy disks - switch 3...............................................................................10
Add-on modules..............................................................................................................................11
Installing / removing processor................................................................................................12
Upgrading main memory..........................................................................................................13
Upgrading GPA memory..........................................................................................................14
Installing network board with WOL...........................................................................................14
Replacing the lithium battery....................................................................................................15
Glossary..........................................................................................................................................16
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Introduction

Depending on the configuration of your system board, some of the hardware components described may not be available.
i
You may find further information in the description "BIOS Setup". Further information to drivers is provided in the readme files on hard disk or on the supplied drivers
diskettes or on the "Drivers & Utilities" or "ServerStart" CD.

Notational conventions

The meanings of the symbols and fonts used in this manual are as follows:
Pay particular attention to texts marked with this symbol. Failure to observe this warning endangers your life, destroys the system, or may lead to loss of data.
!
Supplementary information, remarks and tips follow this symbol.
i
Ê Texts which follow this symbol describe activities that must be performed in the order shown.
Ë This symbol means that you must enter a blank space at this point.
Ú
Ú This symbol means that you must press the Enter key.
ÚÚ
Texts in this typeface are screen outputs.
Texts in this bold typeface are the entries you make via the keyboard.
Texts in italics indicate commands or menu items. "Quotation marks" indicate names of chapters and terms that are being emphasized.

Important notes

Store this manual close to the device. If you pass on the device to third parties, you should also pass on this manual.
Be sure to read this page carefully and note the information before you open the device.
!
You cannot access the components of the system board without first opening the device. How to dismantle and reassemble the device is described in the Operating Manual accompanying the device.
Please note the information provided in the chapter "Safety" in the Operating Manual of the device.
Incorrect replacement of the lithium battery may lead to a risk of explosion. It is therefore essential to observe the instructions in the chapter „Add-on modules“-„Replacing the
lithium battery“.
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Important notes
The shipped version of this board complies with the requirements of the EEC directive 89/336/EEC "Electromagnetic compatibility".
Compliance was tested in a typical PC configuration. When installing the board, refer to the specific installation information in the
Operating Manual or Technical Manual of the receiving device.
Connecting cables for peripherals must be adequately insulated to avoid interference.
Components can become very hot during operation. Make sure you do not touch components when making extensions to the system board. There is a danger of burns!
!
The warranty is invalidated if the device is damaged during the installation or replacement of system expansions. Information on which system expansions you can
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use is available from your sales outlet or the customer service center.

Information on boards

To prevent damage to the system board or the components and conductors on it, please take great care when you insert or remove boards. Take care above all to ensure that extension boards are slotted in straight without damaging components or conductors on the system board, or any other components, for example EMI spring contacts.
Be especially careful with the locking mechanisms (catches, centering pins etc.) when you replace the system board or components on it, for example memory modules or processors.
Never use sharp objects (screwdrivers) for leverage.
Boards with electrostatic sensitive devices (ESD) are identifiable by the label shown.
When you handle boards fitted with ESDs, you must observe the following points under all circumstances:
You must always discharge yourself (e. g. by touching a grounded
object) before working.
The equipment and tools you use must be free of static charges.
Pull out the power plug before inserting or pulling out boards containing
ESDs.
Always hold boards with ESDs by their edges.
Never touch pins or conductors on boards fitted with ESDs.
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Features

Features
The components and connectors marked are not necessarily present on the system board.
System board in ATX format
PGA 370 Celeron processor with 66 /100 MHz Front Side Bus for PGA 370 socket and
Pentium III with 100 / 133 MHz Front Side Bus for PGA 370 socket.
Celeron and Pentium III processors support MMX technology and Intel Streaming SIMD Extensions. Size and frequency of first-level cache and second-level cache are depending on the processor used.
Intel chipset 815
consisting of GMCH 82815, ICH 82801 and FWH82802
Intel 82559 LAN controller (10/100 Mbit/s) with RJ45 interface
WOL with Magic Packetä is supported, as is booting from LAN with Bootix LAN BootP or Intel PXE.
AC'97 Audio Codec
internal: Stereo CD-In, Stereo AUX-In external: Mono Micro-In, Stereo Line-In, Game/Midi-Port, Stereo Line-Out (max. 2 x 0,5 W/8 )
Fujitsu Siemens system monitoring and temperature monitoring
3 DIMM slots for 32 to 512 Mbyte main memory (SDRAM memory modules meet the
PC100/PC133 specification) without ECC
Flash BIOS
Energy saving functions:
APM and ACPI (requires an operating system that supports ACPI)
Switching on/off, standby mode, suspend mode via on/off switch
Switching on/off via software
Wake on RTC
Wake on LAN
Wake on PCI Cards
Wake on USB
Security functions:
Chipcard reader interface
Processor serial number
Detection of unauthorized opening of the housing
System, Setup and Keyboard password
parallel and serial ports can be deactivated
Floppy disk write-protection
Virus warning function for the boot hard disk
Virus protection function for the flash BIOS and the EEPROMs on the memory modules
5 PCI slots
PCI slots support 3.3 V main and auxiliary voltages.
1 AGP slot
The AGP slot supports the 1x, 2x and 4x AGP mode or GPA memory modules. AGP slot supports 3.3 V main and auxiliary voltages.
1 AMR slot
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Features
IDE hard disk controller connected to PCI bus for up to four IDE drives
(e.g. IDE hard disk drives, ATAPI CD-ROM drives) The IDE hard disk controller are ATA33/66, ultra DMA capable and support PIO modes 0-4.
Floppy disk drive controller (possible formats: 720 Kbyte, 1.44 Mbyte, 2.88 Mbyte)
The system board supports booting from a 120 Mbyte IDE floppy disk drive.
2D/3D graphics processor, 24 bit 230 MHz RAMDAC
GPA memory modules for enhanced 3D graphics performance is supported.
Monitor connector: Sub D
1 external parallel interface (ECP- and EPP-compatible)
1 external serial port (16C550 compatible with FIFO)
1 internal chipcard reader interface. As an alternative this interface can also be used as a
second serial port (16C550 compatible with FIFO). This port does not support the ring indicator signal.
1 internal WOL interface
2 external PS/2 interfaces for keyboard and mouse
2 external USB ports
1 internal USB interface
Real-time clock/calendar with integrated battery backup
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Interfaces and connectors

DIMM 3 DIMM 2 DIMM 1
Features
AGP
PCI 4
PCI 1
PCI 3
PCI 2
PCI 5
AMR
5 6 7
2314
1 = PS/2 mouse port 2 = PS/2 keyboard port 3 = LAN port 4 = USB ports 1 and 2 5 = Serial port 1
8
9a 9c9b
7 = VGA port 8 = Game/Midi port 9a = Audio Line-Out 9b = Audio Line-In 9c = Audio Micro-In
6 = Parallel port The components and connectors marked are not necessarily present on the system board.
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Features
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213456
14 13
12
1 = Serial chipcard reader interface or serial
port 2 2 = Power supply 3 = IDE drives 3 and 4 (secondary) 4 = Floppy disk drive 5 = IDE drives 1 and 2 (primary) 6 = Connector for control panel and
loudspeake
DIMM 3 DIMM 2 DIMM 1
AGP
PCI 4
PCI 1
PCI 2
11
PCI 3
10
PCI 5
AMR
7 = Fan 2 (e. g. for the processor) 8 = USB chipcard reade 9 = Wake On LAN 10 = CD audio input 11 = AUX audio input 12 = Fan 1 (e. g. for the processor) 13 = Power supply monitoring 14 = Cover monitoring
7 8
9
The components and connectors marked are not necessarily present on the system board.
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Features

Temperature monitoring / system monitoring

One goal of temperature and system monitoring is to reliably protect the computer hardware against damage caused by overheating. In addition, any unnecessary noise is also to be prevented with a reduced fan speed, and information is to be provided on the system state. The cover monitoring protects the system from unauthorized opening.
The temperature and system monitoring are controlled by an onboard controller developed by Fujitsu Siemens.
The following functions are supported:
Temperature monitoring:
Measurement of the processor temperature, measurement of the system temperature with an onboard temperature sensor, measurement of the device temperature with an optional temperature sensor (AUX).
Temperature control:
The temperature is controlled with the fan speed and/or by reducing the clock frequency of the processor. The clock frequency of the processor is dependent on the setting in the BIOS setup. Temperature-dependent processor speed control enables a reduced fan speed, decreasing noise.
Fan monitoring:
Fans that are no longer available, blocked or sticky fans are detected. Blocked or sticky fans are operated with 12 V pulse voltage. Fans removed while the system is switched off are signaled by the Display news LED when the system is switched on again and processed by the BIOS or the application.
Fan control:
The fans are regulated according to temperature (exception: auxiliary fan (AUX)).
Sensor monitoring:
A fault or removal of a temperature sensor is detected. In this case all fans affected by this sensor run at maximum speed to achieve the greatest possible protection of the hardware. Temperature sensors removed while the system is switched off are signaled by the Display news LED and processed by the BIOS or the application.
Cover monitoring:
Unauthorized opening of the cover is detected, even when the system is switched off. However, this will not be indicated until the system is operating again.
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Features
Voltage monitoring:
The voltages 12 V, 5 V and the CMOS battery are monitored. With hardware monitoring - regardless of the operating system and processor - the advantages
compared to conventional software monitoring are clear:
suitable for all operating systems and processor types
no additional load on processor (performance)
optimum temperature protection, even if process faults or faults are present in the
operating system
optimum noise reduction
Three different operating modes are available and can be configured in BIOS Setup - System Management.

Hard disk connection

An ultra ATA/66 hard disk must be connected with a cable especially designed for the ATA/66 mode.
Ê Connectthe blue marked end of the cable to the system board.

LAN port

This system board is equipped with the Intel 82559 LAN controller as an option. This LAN controller supports the transfer speeds 10 Mbit/s and 100 Mbit/s. The LAN controller is equipped with a 3 Kbyte transmission and receiving buffer (FIFO) and supports the WOL function through Magic Packetä.
It is also possible to boot a device without its own boot hard disk via LAN. Here Bootix LAN BootP and Intel PXE are supported.
The LAN RJ45 connector is equipped with a yellow and a green LED (light emitting diode).
1 = Yellow indicator
12
2 = Green indicator
Green a connection exists (e. g. to a hub). Yellow Link Mode: theLAN connection is active.
WOL mode: a Magic Packet
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TM
is being received.
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Features
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Possible screen resolution

Depending on the operating system used the screen resolutions in the following table refer to the screen controller on the system board.
If you are using an external screen controller, you will find details of supported screen resolutions in the Operating Manual or Technical Manual supplied with the controller.
Screen resolution Refresh rate (Hz) Horizontal-
rate (kHz) **
640x480 60 - 85 31,5 - 43,3 256 640x480 60 - 85 31,5 - 43,3 65 K 640x480 60 - 85 31,5 - 43,3 16,7 mio. 800x600 60 - 85 35,1 - 53,7 256 800x600 60 - 85 35,1 - 53,7 65 K
800x600 60 - 85 35,1 - 53,7 16,7 mio. 1024x768 60 - 85 48,8 - 68,7 256 1024x768 60 - 85 48,8 - 68,7 65 K 1024x768 60 - 85 48,8 - 68,7 16,7 mio. 1152x864 60 - 85 54,4 - 76,9 256 1152x864 60 - 85 54,4 - 76,9 65 K 1152x864 60 - 85 54,4 - 76,9 16,7 mio.
1280x1024 60 - 85 64,0 - 91,1 256 1280x1024 60 - 85 64,0 - 91,1 65 K 1280x1024 60 - 85 64,0 - 91,1 16,7 mio. 1600x1200 60 - 75 75,0 - 93,8 256
* no 16 color mode ** The horizontal rate values may have a tolerance range of ±0.3 kHz.
Max. number of
colors

PCI bus interrupts

The following table shows which PCI bus interrupts on the system board are assigned. PCI bus interrupt Component on system board:
B, C, D, A PCI bus slot 1 C, D, A, B PCI bus slot 2 D, A, B, C PCI bus slot 3 A, B, C, D PCI bus slot 4 B, C, D, A PCI bus slot 5
A, B AGP slot
D USB controller D LAN controlle A Graphics processor B SMBus B AC'97 Audio
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Settings with switches and jumpers

Settings with switches and jumpers
DIMM3 DIMM2 DIMM1
AGP
PCI 1
PCI 2
1234
ON
PCI 4
PCI 3
PCI 5
AMR
Switch 1 = must be set to off Switch 2 = System BIOS recovery
Switch 3 = Write-protection for floppy disk Switch 4 = must be set to off
The clock frequency of the processor is set automatically.
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Recovering System BIOS - switch 2

Switch 2 enables recovery of the old system BIOS after an attempt to update has failed. To restore the old system BIOS you need a Flash BIOS Diskette (please call our customer service center).
On The System BIOS executes from floppy drive A: and the inserted "Flash-BIOS-
Off Normal operation (default setting).

Write protection for floppy disks - switch 3

Switch 3 is used to define whether floppy disks can be written or deleted in the floppy disk drive. To write and delete floppy disks, the write-protection in BIOS Setup must be disabled (in menu Security, the field Diskette Write must be set to Enabled).
On The floppy disk drive is write-protected. Off Read, write and delete floppy disks is possible (default setting).
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Diskette" restores the System BIOS on the system board.
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Add-on modules

For all steps described in this chapter exit the suspend mode before switching off the device and then pull the power plug out of the power outlet!
!
Even when you have run down the device, parts of the device (e. g. memory modules, AGP and PCI extension boards) are still energized. Should this be the case, the voltage indicator LED glows. All AGP and PCI slots support 3.3 V main and auxiliary voltages.
Add-on modules
7
6 5
4
DIMM 3 DIMM 2
DIMM1
3
2
1
1 = USB power jumper (must always be
connected to 2-3) 2 = Slot for processor with heat sink 3 = Voltage indicator LED 4 = Location bank 1 for main memory 5 = Location bank 2 for main memory
AGP
PCI 4
PCI 1
PCI 3
PCI 2
9
PCI 5
AMR
810
6 = Location bank 3 for main memory 7 = Lithium battery 8 = AMR slot 9 = PCI slots 1, 2, 3, 4, 5 10 = AGP slot
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Add-on modules

Installing / removing processor

2
2
3
3
1
1
Ê Pushthe lever in the direction of the arrow (1) and lift it as far as it will go (2). Ê Removethe old processor from the socket (3). Ê Insertthe new processor in the socket so that the angled corner of the processor matches the
coding on the socket (A) with regard to the position (4).
The angled corner of the processor may be covered by the heat sink. In this case let yourself be guided by the marking in the rows of pins on the underside of the processor.
!
4
4
5
5
A
A
Ê Pushthe lever back down so that it snaps into place (5).
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Add-on modules

Upgrading main memory

These slots are suitable for 16, 32, 64, 128 and 256 Mbyte SDRAM memory modules of the DIMM format.
Memory modules with different memory capacities can be combined.
You may only use unbuffered 3.3V memory modules. Buffered memory modules are not permitted.
!
SDRAM memory modules must meet the PC100/PC133 specification. If PC133 memory modules are used it is only allowed to apply 3 single sided or 2 double sided memory modules.
Installing memory modules
2
2
Ê Flipthe holders on each side of the relevant location outwards. Ê Insertthe memory module into the location (1). Ê Atthe same time flip the lateral holders upwards until the memory module snaps in place (2).
Removing a memory module
1
1
Ê Flipthe holders to the right and left of the location outwards (1). Ê Pullthe memory module out of its location (2).
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Add-on modules

Upgrading GPA memory

The GPA memory (AIMM memory) improves the speed of the screen controller on the system board with 3D applications.
Ê Insertthe memory module into the AGP slot (1)

Installing network board with WOL

Ê Installthe network board as described in the operating manual for your unit. Ê Pushthe WOL cable onto the WOL plug connector of the system board.
To use the WOL functionality of a network board the power supply must provide a 5 V auxiliary voltage of at least 1 A. If the system board was not already
i
incorporated in a device when you bought it you must check whether your power supply can provide the auxiliary voltage.
You may find further information in the supplied description of the network board.
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Replacing the lithium battery

Incorrect replacement of the lithium battery may lead to a risk of explosion.
!
The lithium battery must be replaced with an identical battery or a battery type recommended by the manufacturer (CR2032).
Do not throw lithium batteries into the trashcan. It must be disposed of in accordance with local regulations concerning special waste.
Make sure that you insert the battery the right way round. The plus pole must be on the top!
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
VARNING
Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.
ADVARSEL
Lithiumbatteri - Explosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Lever det brugte batteri tilbage til leverandøren.
ADVARSEL
Explosionsfare ved feilaktig skifte av batteri. Benytt samme batteritype eller en tilsvarende type anbefalt av apparatfabrikanten. Brukte batterier kasseres i henhold til fabrikantens instruksjoner.
Add-on modules
1
+
+
2
+
3
+
Ê Liftthe contact (1) a few millimeters and remove the battery from its socket (2). Ê Inserta new lithium battery of the same type in the socket (3).
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Glossary

Glossary
The technical terms and abbreviations given below represent only a selection of the full list of common technical terms and abbreviations. Not all technical terms and abbreviations listed here are valid for the described system board.
ACPI Advanced Configuration and
Power Management Interface AC'97 Audio Codec '97 LAN Local Area Network AGP Accelerated Graphics Port LSA LAN Desk Service Agent AIMM AGP Inline Memory Module MCH Memory Controller Hub AMR Audio Modem Riser MMX MultiMedia eXtension AOL Alert On LAN P64H PCI64 Hub APM Advanced Power Management PCI Peripheral Component
ATA Advanced Technology
Attachment BIOS Basic Input Output System RAM Random Access Memory CAN Controller Area Network RAMDAC Random Access Memory Digital
CPU Central Processing Unit RDRAM Rambus Dynamic Random CNR Communication Network Riser RIMM Rambus Inline Memory Module
C-RIMM Continuity Rambus Inline
Memory Module DIMM Dual Inline Memory Module SB Soundblaster ECC Error Correcting Code SDRAM Synchronous Dynamic Random
EEPROM Electrical Erasable
Programmable Read Only
Memory FDC Floppy Disk Controller FIFO First-In First-Out SIMD Streaming Mode Instruction
FSB Front Side Bus SMBus System Management Bus FWH Firmware Hub SVGA Super Video Graphic Adapter GMCH Graphics and Memory Controller
Hub GPA Graphics Performance
Accelerator I2C Inter Integrated Circuit WOL Wake On LAN IAPC Instantly Available Power
Managed Desktop PC Design ICH I/O Controller Hub IDE Intelligent Drive Electronics IPSEC Internet Protocol Security
ISA Industrial Standard Architecture
Interconnect
PXE Preboot eXecution Environment
Analog Converter Access Memory
RTC Real Time Clock
Access Memory
SGRAM Synchronous Graphic Random
Access Memory
(Single Instruction Multiple Data)
USB Universal Serial Bus VGA Video Graphic Adapter
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