Mobile AMD Athlon XP with ATI
MOBILITY-U1 /ALI 1535+ core logic chip
22
2002-08-12
REV:0.5
11
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
A
B
C
D
Title
SizeDocument NumberRev
Date:Sheet
Compal Electronics, Inc.
COVER SHEET
LA-1481 M/B
!"#, $%
14, 2002
147
E
0.5
of
Page 2
A
File Name : LA-1481 M/B
CPU Bypass &
Fan Control
44
page 4
CPUFID/VID
TV-OUT Conn
B
page 5,32,33
CRT Conn
page 14
page 14
C
Mobile AMD AthlonXP
Model-8 OPGA
CPU SOCKET
page 3,4
System Bus
400MHz
HD#(0..63)HA#(3..31)
ATI MOBILITY-U1
596 Graphics embedded
BGA
page6,7,8,9,10
Thermal Sensor
NE1617ICS951403
Memory
BUS(DDR)
2.5V DDR 200/266 MHz
D
Clock Generator
page 3
DDR-SO - D IMM X 2
BANK 0, 1, 2, 3
E
Block Diagram
page 13
page 11,12
LCD Conn
page 15
IDSEL:AD16
(PIRQC#,GNT#0,REQ#0)
33
IEEE 1394
VT6306
page 21
Mini PCI
port
page 25
IDSEL:AD31
(PIRQB#,GNT#1,REQ#1)
RJ11
Conn.&Jack
page 25
PCI BUS
IDSEL:AD17
(PIRQC#,GNT#3,REQ#3)
LAN CTRL
RTL 8100BL
page 20
22
RJ45 Jack
page 25
Power On/Off
Reset & RTC
page 26,30,18
DC/DC Interface
IDSEL:AD20
(PIRQA/B#,GNT#2,REQ#2)
CardBus Controller
ENE CB1420
Slot 1
page 23
14M_5V
EC NS87591L
Touch Pad
page 24
page 27
Suspend
page 31
11
Power Circuit DC/DC
page 34,35,36,37,38,39
A
EC I/O Buffer
page 28
BIOS
page 28page 30
B
3.3V 33MHz
page 22
Slot 0
page 23
S/W BD conn
Int.KBD
page 26
page 26
PS/2 conn
AC-LINK
+5VALW
USB
Port 2
page 29
LPC BUS
3.3V 33MHz
ALI 1535+
page 16,17
3.3V 48MHz
+5VALW
Port 0,1
page 29
3.3V 24.576MHz
3.3V ATA100
USB
SERIALPARALLEL
page 29page 29
FDD
page 26
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
AMD Socket-A processors will not
implement a pin at location AH6.
VR_ON27,36,39
CONTROL ON/OFF
+5VS
0.22UF_0603
R221 0
C161
C158
0.1UF
VCCA for cpu internal PLL power source!
U9
8
SD#
4
VIN
1
Cnoise
3
GND
SENSE/ADJ
VOUT
ERROR#
DELAY
SI9182DH-25
5
6
7
2
C526
0.22UF_0603
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
(2.5V Output)
2.5V,if 1GHz need 200mA
@4.7UF_10V_0805
+2.5_A+2.5_B
12
12
C151
C152
39PF
L41 0_0805
>20mil>20mil
12
C156
39PF
L40 0_0805
12
C160
39PF
+VCCA2.5
>20mil
C155
39PF
+3VALW
Near socket-A
pin AJ23
R7410
C84
39PF
R292 470K_0603
CPUDET#27
C81
39PF
12
C520
39PF
+VCCP2.5
+CPU_CORE
+VCCP2.5 30
Compal Electronics, Inc.
Title
AMD AthlonXP SOCKET_ A-2
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
C35
1UF_10V_0603
14, 2002
OPTION
1UF_10V_0603
C26
C38
1UF_10V_0603
447
of
C39
1UF_10V_0603
0.3
Page 5
A
Layout note :
Place close to CPU, Use 2~3 vias per PAD.
Place .22uF caps underneath balls on solder side.
Place 10uF caps on the peripheral near balls.
Use 2~3 vias per PAD.
B
C
D
E
Layout note :
Place close to CPU power and
ground pin as possible
(<1inch)
Please place these cap in the socket cavity area
11
+CPU_CORE
12
option
CB83
10UF_6.3V_1206
Please place these cap on the socket north side
+CPU_CORE
12
CB25
10UF_6.3V_1206
+CPU_CORE
12
22
10UF_6.3V_1206
+CPU_CORE
12
CB12
CB31
10UF_6.3V_1206
12
CB10
10UF_6.3V_1206
12
CB26
10UF_6.3V_1206
12
CB34
10UF_6.3V_1206
12
CB30
10UF_6.3V_1206
12
CB36
10UF_6.3V_1206
12
CB28
10UF_6.3V_1206
12
CB37
10UF_6.3V_1206
12
CB9
10UF_6.3V_1206
option
Please place these cap on the socket south side
+CPU_CORE
12
CB40
10UF_6.3V_1206
+CPU_CORE
33
12
10UF_6.3V_1206
+CPU_CORE
12
10UF_6.3V_1206
CB1
CB29
12
CB32
10UF_6.3V_1206
12
CB38
10UF_6.3V_1206
12
CB33
10UF_6.3V_1206
12
CB6
10UF_6.3V_1206
12
CB13
10UF_6.3V_1206
12
CB5
10UF_6.3V_1206
12
CB19
10UF_6.3V_1206
12
CB21
10UF_6.3V_1206
12
CB11
10UF_6.3V_1206
12
CB8
10UF_6.3V_1206
12
CB27
10UF_6.3V_1206
option
+CPU_CORE
12
CE3
+
330UF_D2_2.5V_15m
+CPU_CORE
12
CE11
+
330UF_D2_2.5V_15m
+CPU_CORE+CPU_CORE
12
C114
39PF
+CPU_CORE
12
C111
0.22UF_0603
+CPU_CORE
12
C93
0.22UF_0603
+CPU_CORE
12
C78
0.22UF_0603
+CPU_CORE
12
C45
39PF
Used ESR 15m ohm cap total ESR=1.875m ohm
12
CE16
+
330UF_D2_2.5V_15m
12
CE6
+
330UF_D2_2.5V_15m
12
12
C102
39PF
12
C32
39PF
12
C87
C85
39PF
39PF
12
12
C75
C123
0.22UF_0603
0.22UF_0603
12
12
C117
C131
0.22UF_0603
0.22UF_0603
12
C74
0.22UF_0603
12
12
C137
C361
39PF
39PF
Distribute evenly on approximately
one-inch spacing along the VccCore
plane edge .
12
+
330UF_D2_2.5V_15m
12
+
330UF_D2_2.5V_15m
12
12
C88
39PF
12
C132
0.22UF_0603
12
C76
0.22UF_0603
NOTE: Must put inside
the CPU socket
12
12
C365
C438
39PF
39PF
CE7
CE12
C403
39PF
12
C362
0.22UF_0603
12
C414
0.22UF_0603
12
C415
39PF
12
CE5
+
330UF_D2_2.5V_15m
12
CE15
+
330UF_D2_2.5V_15m
12
12
C416
39PF
12
C405
39PF
12
C392
0.22UF_0603
12
C363
0.22UF_0603
12
C356
39PF
12
C354
39PF
12
C125
0.22UF_0603
12
C378
0.22UF_0603
12
C86
39PF
12
C99
39PF
place close to the bulk
decoupling 330UF CAP per item
C366
39PF
12
C396
0.22UF_0603
12
C387
0.22UF_0603
12
C126
0.22UF_0603
12
C381
0.22UF_0603
12
C77
0.22UF_0603
12
C413
0.22UF_0603
+CPU_CORE
12
12
12
C73
C121
39PF
44
39PF
C138
39PF
12
C119
39PF
EMI Clip HOLE for CPU
PT2
12
AMD_CPU_EMI_CLIP
A
PT3
12
AMD_CPU_EMI_CLIP
PT4
12
AMD_CPU_EMI_CLIP
PT5
12
AMD_CPU_EMI_CLIP
B
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C406
C382
C371
C376
0.1UF
C359
0.1UF
C423
@0.1UF
C393
@0.1UF
D
C370
0.1UF
0.1UF
0.1UF
C
0.1UF
Compal Electronics, Inc.
Title
ATI MOBILITY U1_PCI BUS I/F
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
847
E
of
0.3
Page 9
A
B
C
D
E
Note: AVSSQ & AVS SN requ ire separate d irect con nectio ns to G ND plan e ( se p a ra te v i as ).
Note: A2VSSQ & A2VSSN require separate direct connections to GND plane (separate vias).
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
0: REQ/GNT3 USED AS REQ/GNT
1: REQ/GNT3 USED AS PCICLKS
AD0AD20
ATI 6/19
R4344.7K_0603
R4610K_0603
CBE#38,16,20,21,22,25
CBE#3
R70@4.7K_0603
R183@10K_0603
CBE#08,16,20,21,22,25
PCI_ACT_REQ#8,17
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Layout:average placement the CAP
near the +1.25VS power plane .
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
A
B
C
D
Title
Clock Generator
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
E
1347
of
0.3
Page 14
A
11
RED9
GREEN9
BLUE9
R392
75_1%_0603
HSYNC9
VSYNC9
CRTVDD
22
R387
@10K
12
75_1%_0603
12
12
12
R393
75_1%_0603
12
R389
@10K
+12VS
@@ @
12
12
C338
R394
@22PF
S
Q44
G
2N7002
2
12
R388100K
C337
@22PF
D
13
Q45
2N7002
S
G
2
L3
12
FCM2012C-800_0805
L4
12
FCM2012C-800_0805
L5
12
FCM2012C-800_0805
12
C336
@22PF
12
FBM-11-160808-121
D
12
13
FBM-11-160808-121
B
+5VS
D27
DAN217
1
2
R_RED
R_GREEN
R_BLUE
12
C1
18PF
L1
L2
D28
DAN217
1
2
3
12
C4
68PF
3
12
C2
18PF
12
C5
68PF
CRTVDD
D29
DAN217
1
2
12
C3
18PF
POLYSWITCH_0.5A
3
C329
100PF
F1
12
CRTVDD_1
DDC_MD2
C
MSEN#27,28
C6
220PF
12
D1
21
RB411D
12
C7
220PF
C11
0.1UF
D
W=40mils
12
11
12
13
14
10
15
6
1
7
2
8
3
9
4
5
JP15
CRT-15P
R8
2.2K
CRTVDD
12
12
R9
2.2K
+3VS
12
12
R536
R535
2.2K
2.2K
Q1
2N7002
D
S
Q2
2N7002
D
13
2
G
13
S
G
2
12
R70
DDCDATA 9,15
DDCCLK 9,15
+3VS
E
CRT Connector
TV-Out Connector
33
12
C2347PF
LUMA9
CRMA9
COMPS9
44
LUMA
CRMAR_CRMA
COMPS
12
R13
75_1%_0603
A
12
R2
75_1%_0603
12
R6
75_1%_0603
12
C25
150PF
12
12
FBM-11-160808-121
12
C1347PF
12
FBM-11-160808-121
C14
150PF
L11
L6
12
C42
150PF
B
D4
DAN217
2
R_LUMA
D3
DAN217
1
1
3
2
D2
DAN217
1
+3VS
3
2
3
S-Video
JP14
1
2
3
4
5
6
7
S CONN._suyin
12
C12
270PF
12
C15
270PF
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
C
EMI PAD around RAM DOOR
PAD4
PAD-2.5X3
H1
HOLEA
1
H16
HOLEA
1
1
1
1
FM1
CF2
CF9
H4
HOLEA
H17
HOLEA
1
1
PAD5
1
PAD-2.5X3
H3
HOLEA
1
1
H10
H13
HOLEA
HOLEA
1
FM2
FM3
1
CF4
1
CF10
CF11
1
1
1
1
1
H2
HOLEA
1
FM4
1
PAD2
PAD-2.5X3
H5
HOLEA
1
H6
HOLEA
1
FM5
1
CF31CF61CF7
CF12
1
H9
HOLEA
H8
HOLEA
1
FM6
PAD1
PAD-2.5X3
1
H7
HOLEA
1
H12
HOLEA
1
1
H18
HOLEA
1
CF8
1
H15
HOLEA
1
H19
HOLEA
1
1
H11
HOLEA
1
1
1
CF13
D
Cable guide
PAD6
PAD-3X3.5
PAD3
1
PAD-2.5X3
H14
HOLEA
1
H20
HOLEB
1
CF1
1
1
CF5
Compal Electronics, Inc.
Title
CRT & TVout Connector
SizeDocument NumberRev
LA-1481 M/B
Date:Sheet
!"#, $%
1
14, 2002
PAD7
PAD-3X3.5
1
PAD-3X3.5
E
PAD8
1447
1
0.3
of
Page 15
10
DDCCLK9,14
HH
DDCCLK
TXOUT_L0+9
TXOUT_L1+9
TXOUT_U0-9
TXOUT_U0+9
TXCLKOUT_U-9
TXCLKOUT_U+9
GG
PID0
PID010,28
PID1PID2
PID110,28
PID2
PID210,28
PID3
PID310,28
FF
9
LCDVDD_C
R25@0
TXOUT_L0-9
TXOUT_L1-9
+3VS
RP2
45
36
27
18
8P4R_10K_0804
12
TXOUT_L0ÂTXOUT_L0+
TXOUT_L1ÂTXOUT_L1+
TXOUT_U0ÂTXOUT_U0+
TXCLKOUT_UÂTXCLKOUT_U+
PID3
PID2
PID1
PID0
+12VS
PID3
PID1
PID0
8
JP2
1
21
2
22
3
23
4
24
5
25
6
26
7
27
8
28
9
29
10
30
11
31
12
32
13
33
14
34
15
35
16
36
17
37
18
38
19
39
20
40
JST BM40B-SRDS
SW3
4
3
2
1
SW DIP-4
R1@0
5
6
7
8
7
TXOUT_L2ÂTXOUT_L2+
TXCLKOUT_LÂTXCLKOUT_L+
TXOUT_U1ÂTXOUT_U1+
TXOUT_U2ÂTXOUT_U2+
DISPOFF#
L25
HB-1M2012-121JT
L26 HB-1M2012-121JT
CB31UF_10V_0603
CB24.7UF_10V_0805
TXOUT_L2- 9
TXOUT_L2+ 9
TXCLKOUT_L- 9
TXCLKOUT_L+ 9
TXOUT_U1- 9
TXOUT_U1+ 9
TXOUT_U2- 9
TXOUT_U2+ 9
12
LCDVDD_C
DAC_BRIG 27
INVT_PWM 27
12
12
C4480.1UF
12
12
+
EMI request
H
DDCDATA
B+
LCDVDD
DDCDATA 9,14
BKOFF#27
LVDS_BLON#9
6
HB-1M2012-121JT
HB-1M2012-121JT
D9
FB1
FB2
CB22
10UF_10V_1206
+3VS
RB751V
21
13
2
G
Q60
2N7002
R110
10K
DISPOFF#
D
S
12
+
5
CB4
1UF_10V_0603
12
LCDVDD_C
C16
0.1UF
4
12
C41
3
2
1
0.1UF
+3VSLCDVDD
LCDVDD+12VS
12
R33
1K
EE
Q10
2N7002
13
D
2
G
S
R58
100K
100K
Q12
2N7002
C70
0.047UF
C51
0.1UF
R52
150K
13
D
2
G
S
R59
13
Q9
SI2302DS
2
+
CB18
4.7UF_10V_0805
+
CB17
4.7UF_10V_0805
13
2
Q11
DTC124EK
22K
22K
Compal Electroni c s, Inc.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
LAYOUT:RP78,RP80,CP1,CP2 close to SB(U10)
LAYOUT:RP79,RP81 close to USB Conn.
OVCUR#2 29
OVCUR#3
R14310K
12
+3VALW
+3VS+3VS+5VALW
D12
E12
A13
H5W8V8U9Y7
ZZ
SMIJ
USBP0-
SLEEPJ
USBP0+
USBCLK
STPCLKJ
W7V7U8T8T6U5U6
USBP1-
USBP2-
USBP1+
USBP2+
USBP3+
T5
R6
USBP3-
OVCRJ0
OVCRJ1
OVCRJ2
OVCRJ3
F15
R13
R7
R14
R8
VCCR_3E
VCCR_3E
VCCR_3E
VCCR_5D
VCCR_5D
P15
F14
F6
P6N6F7
VCC_G
VCC_3C
VCC_3C
VCC_3C
VCC_3C
+3VS +5VS
G15
K16
VCC_F
VCC_F
VCC_3B
+5VS
IDEDA8
IDEDA4
IDEDA7
IDEDA9
IDEDA5
IDEDA3
IDEDA13
IDEDA12
IDEDA15
IDEDA14
G18
G16
E10
R15
G6
N15
VCC_5A
VCC_5A
VCC_5A
F19
VCC_5A
VCC_5A
PIDED15
PIDED14
PIDED13
IDEDA6
IDEDA10
IDEDA11
F17
E20
E18
D19
C20
B20
D18
D20
E19
PIDED9
PIDED8
PIDED7
PIDED6
PIDED5
PIDED12
PIDED11
PIDED10
PIDED4
USB
PRIMARY IDE
ALIM1535
SECONDARY IDE
INTBJ_S0
INTCJ_S1
INTDJ_S2
INTEJ
INTFJ
PHLDAJ
PHOLDJ
C11
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
+3VS
U17D
14
74LVC14
98
3
R554@0
10
11
12
1
2
3
4
5
6
7
8
9
U32
PWR#
X1
X2
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
GND
@DS1685
R567
12
@0
12
24
VCC
23
SQW
22
VBAUX
21
RCLR#
20
VBAT
19
IRQ#
18
KS#
17
RD#
16
GND
15
WR#
14
ALE
13
CS#
+3VALW
R562
10K
12
All parts no build in until RTC IC build in .
R560 no build in , even if RTC IC build .
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
CBE#1 8,16,20,22,25
PAR 8,16,20,22,25
PERR# 16,20,22,25
C97
0.1UF
12
C100
0.1UF
U4
1
A0
2
A1
3
A2
45
GND SDA
24C02-27
XTPBIAS0
XTPA0+
XTPA0ÂXTPB0+
XTPB0-
54.9_1%_0603
C115
0.1UF
54.9_1%_0603
R54
C80
270PF
VCC
WC#
SCL
12
12
12
8
7
6
R17
C133
0.1UF
+3VS
EECK_LAN
EEDI_LAN
54.9_1%_0603
12
12
12
R16
R53
54.9_1%_0603
R57
5.1K_1%_0603
C134
0.1UF
12
R134
510
12
C135
0.1UF
12
C44
0.33UF_16V_0805
L15
1
2
3
45
IEEE1394-CMF
+3VS
12
12
C128
C129
0.1UF
0.1UF
JP10
6
6
5
C_XTPA0+
8
C_XTPA0-
7
C_XTPB0+
6
C_XTPB0-
5
4
4
3
3
2
2
1
1
1394_FOXCONN
Compal Electronics, Inc.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Compal Electronics, Inc.
Title
CARD BUS SOCKET
SizeDocument NumberRev
B
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
2347
of
0.3
Page 24
A
BEEP#27
11
22
13
U7D
74LVC125
1211
+3VALW POWER
PCM_SPK#22
+3VS
12
R342
100K_1%_0603
12
10K_1%_0603
SPKR17
R339
C215
0.22UF_0603
B
12
+3VS
14
12
U17A
74LVC14
+3VALW POWER
+3VS
14
34
U17B
74LVC14
+3VALW POWER
+3VS
14
56
U17C
74LVC14
+3VALW POWER
CB51
1UF_10V_0603
CB50
1UF_10V_0603
CB52
1UF_10V_0603
12
12
R304560
12
12
R324560
12
12
R335560
C
MONO_IN
12
R303
10K
21
D26
RB751V
D
E
F
G
H
AC97 CODECALC202CONN
MOD_AUDIO_MON25
33
INT_MIC26
Q41
@2N7002
44
A
R3630
R3650
Q42
@SI2304DS
S
G
2
13
D
S
12
12
D
13
2
G
12
R364
@33K
INTMIC
R368
12
@100K
DRV0#17,26
+12VS
MIC_MUTE 27
B
MOD_AUDIO_MONR
Q62
DTC124EK
+3VS
2
DRV_0#
22K
22K
DRV0#
13
AC97_BCLK17,25
HPLUG27
AC97_RST#17,25
AC97_SYNC17,25
AC97_SDOUT17,25
AC97_SDIN017
MOD_AUDIO_MONR
CHARGING_LED#28
POWER1_LED#28
POWER2_LED#28
0_0805
12
L45
C
MD_MIC25
CD_AGND19
CDROM_L19
CDROM_R19
PS2_DATA27
PS2_CLK27
EC_MUTE27
FULL_LED#28
ACT_LED#19
+5VALW
+3VALW
MONO_IN
MOD_AUDIO_MONR
+3VS
INTMIC
EC_MUTE
DRV_0#
+5VS
12
R351
D
0
JP6
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
19
20
20
21
21
22
22
23
23
24
24
25
25
26
26
27
27
28
28
29
29
30
30
CODEC CONN
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
SHBM=1: Enable shared memory with host BIOS
TRIS=1: While in IRE and OBD, float all the
signals for clip-on ISE use
KBA1
KBA2
KBA3
JP7
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
@96212-1011S
KBA5
12
12
12
EC_TINIT#
EC_TCK
EC_TDO
EC_TDI
EC_TMS
BD_ID0
BD_ID1
BD_ID2
PCI_PME# 20,22,25,28
+3VALW
IRQ8# 17,18
+3VALW
R343@10K
R250@10K
R26210K
12
ECAGNDBATT_TEMP
I/O Address
Reserved
ENV0 ENV1
00
0011
11
(ENV1)
(BADDR0)
(BADDR1)
(SHBM)
21
BD_ID0
BD_ID1
BD_ID2
+5VALW
E
2F2E
TRIS
0
0
0
0
+3VALW
R30610K
R31410K
R323@10K
R32610K
RB751VD23
R33810K
R24610K
R268@10K
ACIN 16,34,37AC_IN17
12
12
12
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
R348
20K
2
13
Q36
R346
12
1K
2N7002
FWR# 27
SUS_STAT# 6,17
FLASH# 17
SMB_EC_CK127,36
SMB_EC_DA127,36
+5VALW
C225
12
0.1UF
Title
SizeDocument NumberRev
Date:Sheet
U19
8
VCC
7
WC
6
SCL
5
SDA
NM24C164
GND
12
R355
1K
Compal Electronics , Inc.
BIOS & EC I/O Po rt
LA-1481 M/B
!"#, $%
14, 2002
+5VALW
12
R357
10K
1
A0
2
A1
3
A2
4
12
R356
1K
2847
0.3
of
Page 29
A
B
C
D
E
Printer Port / U SB
USB2_DÂUSB2_D+
USB_2
F2
+5VALW
OVCUR#216
EVERFUSE_1.1A
12
C79
1000PF
11
L19
12
FBM-11-451616-800T
12
R56
470K_0603
12
R55
560K_0603
12
C24
0.1UF
USB2_D- 16
USB2_D+ 16
USB2_VCC
USB2_D-R_USB2_D-
+
CE1
150UF_10V_E
FBM-11-451616-800T
USB Port
12
C20
0.1UF
1
2
3
4
JP11
VCC
DÂD+
GND
2551A-04G2T
L14 FBM-11-160808-121
12
R_USB2_D+USB2_D+R_USB1_D+
12
L13FBM-11-160808-121
USBGND2
12
L16
JP13
VCC
D-
D+
GND
2551A-04G2T
1
2
3
4
USBGND1
12
C22
0.1UF
USB1_D+16
USB1_D-16
L7 FBM-11-160808-121
12
L10
FBM-11-451616-800T
USB1_D-R_USB1_D-
12
USB1_D+
12
L12 FBM-11-160808-121
USB1_D+
USB1_D-
USB1_VCC
CE2
150UF_10V_E
+
L30
FBM-11-451616-800T
12
C8
0.1UF
560K_0603
USB_1
12
EVERFUSE_1.1A
R80
470K_0603
12
12
C83
1000PF
F5
+5VALW
OVCUR#1 16
12
R79
USB0_DÂUSB0_D+
JP12
1
VCC
D+
GND
2551A-04G2T
22
33
+5V_PRN
SLCTIN#
LPT_INIT#
LPTERR#
AFD/3M#
+5V_PRN
44
R_USB0_D-
2
D-
R_USB0_D+
3
USBGND0
4
12
C18
0.1UF
LPD[0..7]17
LPTINIT#17
LPTSLCTIN#17
RP72
FD0
1
FD1
2
FD2
3
FD3
4
5
10P8R_2.7K
RP73
1
2
3
4
5
10P8R_2.7K
10
11
12
13
14
15
16
RP71
16P8R_68
LPD3
LPD2
LPD1
LPD0
LPD7FD7
LPD6
LPD5
LPD4
12
12
12
LPD[0..7]
12
R38033
12
R37933
FD3
89
FD2
7
FD1
6
FD0
5
4
FD6
3
FD5
2
FD4
1
L9
FBM-11-160808-121
L8
FBM-11-160808-121
L31
FBM-11-451616-800T
+5V_PRN
10
9
8
7
6
+5V_PRN
10
9
8
7
6
LPT_INIT#
SLCTIN#
FD7
FD6
FD5
FD4
LPTACK#
LPTBUSY
LPTPE
LPTSLCT
USB0_D- 16
USB0_D+ 16
USB0_DÂUSB0_D+
Parallel Port
LPTSTB#17
LPTAFD#17
USB0_VCC
CE4
+
150UF_10V_E
L34
FBM-11-451616-800T
12
C19
0.1UF
+5VS
LPTSTB#
12
R38233
12
R38333
LPTERR#17
LPTACK#17
LPTBUSY17
LPTPE17
LPTSLCT17
USB_0
12
12
12
D30
21
RB420D
+5V_PRN_1
AFD/3M#
FD0
LPTERR#
FD1
LPT_INIT#
FD2
SLCTIN#
FD3
FD4
FD5
FD6
FD7
LPTACK#
LPTBUSY
LPTPE
LPTSLCT
EVERFUSE_1.1A
R93
470K_0603
R95
560K_0603
+5V_PRN
w=40mils
F6
12
12
R381
1K
w=40mils
+5VALW
C101
1000PF
JP16
LPTCN-25-SUYIN
1
14
2
15
3
16
4
17
5
18
6
19
7
20
8
21
9
22
10
23
11
24
12
25
13
OVCUR#0 16
+5V_PRN
12
AFD/3M#
LPTERR#
LPT_INIT#
SLCTIN#
LPTACK#
LPTBUSY
LPTPE
LPTSLCT
FD0
FD1
FD2
FD3
FD4
FD5
FD6
FD7
C328
0.1UF
CP8
18
27
36
45
8P4C-220PF
CP7
18
27
36
45
8P4C-220PF
CP9
18
27
36
45
8P4C-220PF
CP10
18
27
36
45
8P4C-220PF
DCDA#17
DSRA#17
DTRA#17
RTSA#17
CTSA#17
TXDA17
RIA#17
RXDA17
12
R288
10K
PCM_RI#22
RING#27
MODEM_RI#25
C331
0.1UF_0805
C9
25V
0.47UF_0805
DTRA#DTR#1
TXDA
CTSA#
RIA#
RXDA
DCDA#
DSRA#
RIA1
SUSP#27,31,38
D24
RB751V
D25
RB751V
Q23
2N7002
+5VALW
C330
0.1UF
28
C1+
24
C1-
1
C2+
2
C2-
14
TIN1
13
TIN2
12
TIN3
19
ROUT1
18
ROUT2
17
ROUT3
16
ROUT4
15
ROUT5
20
ROUTB2
23
FORCEON
22
FORCEOFF#
U1MAX3243
+3VALW+3VALW
12
R271
10K
21
21
13
RIA1
2
DCDA#
RIA#
CTSA#
DSRA#
SERIAL PORT
26
25V
C327
27
V+
VCC
0.47UF_0805
25V
C10
3
V-
0.47UF_0805
9
TOUT1
RTS#1RTSA#
10
TOUT2
TXD1
11
TOUT3
CTS#1
4
RIN1
RI#1
5
RIN2
RXD1
6
RIN3
DCD#1
7
RIN4
DSR#1
8
RIN5
21
INVLD#
25
GND
(1)
DCD#1
(6)
DSR#1
(2)
RXD1
(7)
RTS#1
(3)
TXD1
(8)
CTS#1
(4)
DTR#1
(9)
RI#1
(5)
RTS#1
RXD1
DSR#1
DCD#1
DTR#1
CTS#1
TXD1
RI#1
R1251K
RXDA
RP74
18
27
36
45
@8P4R_4.7K_0804
JP17
COM-DB9
1
6
2
7
3
8
4
9
5
CP12
18
27
36
45
8P4C-220PF
CP11
18
27
36
45
8P4C-220PF
12
+3VS
Compal Electronics, Inc.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
A
B
C
D
Title
Printer/COM/USB Port
SizeDocument NumberRev
LA-1481 M/B
Date:Sheet
!"#, $%
14, 2002
2947
E
of
0.5
Page 30
+VCCP2.5
+CPU_CORE
12
R576
12
R577
10K_0603
12
C537
0.047UF_0603
10K_0603
12
C538
0.047UF_0603
R572
4.7K_0603
2
2
+5VS
12
31
31
R569
4.7K_0603
Q64
MMBT2222A
Q65
MMBT2222A
+3VS
12
13
D
Q63
2
G
2N7002
S
+3VS+3VS
+3VS+3VS+3VS
12
C534
0.47UF_0603
14
12
U33A
74LVC14
14
34
+2.5VS
13
D
2
G
S
U33B
74LVC14
R216
1K
Q20
2N7002
R573
12
20K_0603
12
R579
47K
56
12
C535
0.47UF_0603
NB_PWRGD 6
14
U33C
74LVC14
+3VS
14
98
+CPU_CORE
12
13
D
2
G
S
R354
820
R571
47_0603
U33D
74LVC14
Q39
2N7002
VR_POK_1
12
R574
12
20K_0603
CPU_PWROK 3
+3VS+3VS
14
1110
12
C536
0.47UF_0603
U33E
74LVC14
14
1312
U33F
74LVC14
R575
12
47_0603
PWRGD 17,18
12
R578
10K
1312
C222
0.047UF_0603
14
U17F
74LVC14
14
U17E
VR_POK_1CPU_SVID
74LVC14
1110
12
CPU_SVID 33
+5VS
EVERFUSE_1.1A
2
D8
DAN217
4516
D32
DAN217
L39
1
1
3
2
3
KB_AS
12
C96
1000PF
12
CB-1608D-800T
12
CB-1608D-800T
+5VS
+5VS
EXT_CLK27
EXT_DATA27
F8
+5VS
+5VS
KB_VCC
W=40milsW=40mils
12
CHB4516G750
KBD_DATA27
KBD_CLK27
2
D31
DAN217
3
2
D7
DAN217
3
1
1
L50
12
CB-1608D-800T
12
L38
CB-1608D-800T
12
L49
L37
0603
C90
220PF
PS2 CONN.
12
CB35
4.7UF_10V_0805
12
12
C105
220PF
JP18
KBD/PS2_6
4
2
1
C379
220PF
12
C380
220PF
C324 1UF_0603
563
1K_0603
12
C104
220PF
12
R374
+3VALW
147
1
2
U8D
13
12
74HCT08
U24A
3
74LVC32
11
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
Compal Electronics , Inc.
Title
POWER GOOD & PS2 Connector
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
3047
of
0.5
Page 31
A
B
C
D
E
+1.8VS+1.8VALW
U16
SI4800
D
S
D
S
D
S
D
G
CB98
10UF_10V_1206
1
2
3
4
8
7
6
5
11
12
+2.5V to +2.5VS Transfer
22
+12VALW
12
R289
100K
33
SUSP
Q55
2N7002
13
2
G
12
R295
12
C456
0.01UF
4.7UF_10V_0805
D
1M_0603
S
+1.8VALW to +1.8VS Transfe r
12
C213
0.1UF
RUNON
12
CB97
22UF_10V_1206
+12VS
12
C206
0.1UF
12
R529
10K
+2.5V
12
CB78
1UF_10V_0603
13
D
Q40
2
G
SI2306DS
S
+2.5VS
12
CB68
1UF_10V_0603
+5VALW to +5VS Transfer
+5VALW
U11
SI4800
D
D
D
D
RUNON
12
S
S
S
G
+5VALW
12
1
2
3
4
CE8
+
100UF_D_16V
CB94
8
7
6
5
+5VALW
+5VS
12
R307
470
Q58
13
2N7002
SUSP
2
SYSON#38
R5420
SYSON27
+12VALW TO +12VS
Transfer
2
+12VALW
13
12
CB96
1UF_25V_0805
12
CB46
1UF_25V_0805
Q57
NDS352P
+12VS
+12VALW
12
C223
0.1UF
SUSP#
12
12
C189
CB45
22UF_10V_1206
0.1UF
12
R463
470
Q22
13
2N7002
SUSP
2
12
R349
100K
VON
12
R352
51K
13
Q38
2
2N7002
12
@0.1UF
SUSP#27,29,38
SYSON#
C525
+3VALW
+12VALW
12
R287
47K
13
Q53
2
2N7002
12
+12VALW
12
R283
R528
@10K
10K
SUSP
13
Q54
2
2N7002
12
+3VALW+3VS
U14
SI4800
8
D
S
7
D
S
6
D
S
44
12
CE9
+
100UF_D_16V
5
D
G
12
CB95
10UF_10V_1206
A
+3VALW to +3VS Transfer
1
2
3
12
4
CB49
22UF_10V_1206
RUNON
12
12
R301
C198
15_0603
0.1UF
Q56
13
2N7002
SUSP
2
Compal Electronics, Inc.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
B
C
D
Title
DC/DC Circuit s
SizeDocument NumberRev
LA-1481 M/B
Date:Sheet
!"#, $%
14, 2002
31
47
E
of
0.3
Page 32
CPU FID ISOLATION
+3VS
+3VS
SUSPEN POWER
Place near
AD16
AD17
AD18
AD19
NB ATI-U1
R3963.3K
R3953.3K
R3973.3K
R3913.3K
ClkDiv[3]
FID[3]
0000
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1111
AD[0..31]8,10,16,20,21,22,25
AD[0..31]
RP76
8P4R_10K_0804
18
27
36
45
ClkDiv[2]
ClkDiv[1]
FID[2]
FID[1]
00
0
0
1
1
1
1
0
0
0
0
1
1
11
1
1
0
0
1
1
0
0
1
1
0
0
ClkDiv[0]
FID[0]
111.5
0
1
0
1
0
1
0
1
0
1
0
1
0
FIDJMP0
FIDJMP1
FIDJMP2
FIDJMP3
Processor Clock
and SYSCLK
Frequency Ratio
11
12
12.5
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
10
10.5
R390
10K
2
2
2
FIDEN
2
+2.5VS
RP75
8P4R_3.9K_0804
18
27
36
45
13
D
Q46
2N7002
G
S
13
D
Q48
2N7002
G
S
13
D
Q49
2N7002
G
S
13
D
Q47
2N7002
G
S
FID0
FID1
FID2
FID3
FID[0..3] 3
Decoupling Between Planes
+3VS+CPU_CORE
C36
0.1UF
C447
0.1UF
D
1
23
G
S
2N7002
WARNING: PRELIMINARY
SCHEMATICS. FOR REFERENC E
PURPOSES ONLY. DESIGN HAS NOT
BEEN BUILT OR VERIFIED.
NOTE: All resistors are 5% 0603, and all capacitors are 10% 0603 unless otherwise noted.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPART MENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
For Mobil Athl on Model 6
& Mobil Duron Model 7
For Mobile Duron Model 3
Athlon/Duron
4
U7B
74LVC125
56
R317 3.9KR319
RP38
18
27
36
45
8P4R_3.9K_0804
PVID0
PVID1
PVID2
PVID3
PVID4
R3160
SVID_GATE
R315
1K
SVID_GATE : HI GH
SVID_GATE : LOW
+3VS
13
D
Q29
2
2N7002
G
S
+2.5VS
SVID[0..4]4
K7 PGA IO only 2.5 volt. tolerant
+5VALW+2.5VS
R467@10K
3.9K
G
2
13
D
S
Q24
2N7002
G
2
13
D
S
Q25
2N7002
G
2
13
D
S
Q26
2N7002
G
2
13
D
S
Q27
2N7002
G
2
13
D
S
Q28
2N7002
This disables the
CPU's VIDs from
being passed
through during
sleep state.
2
G
RP40
18
27
36
45
8P4R_3.9K_0804
R344 3.9K
RP100 @8P4R_10K_0804
13
D
Q31
2N7002
S
SVID0
12
18
27
36
45
VID0
VID1
VID2
VID3
VID4
13
D
Q32
2
G
S
SVID1
2N7002
13
D
Q33
2
G
S
SVID2
2N7002
13
D
Q34
2
G
S
SVID3
2N7002
13
D
2
G
S
SVID4
VID1 39
VID2 39
VID3 39
VID4 39
Q35
2N7002
Compal Electronics, Inc.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
A
B
C
D
Title
VID
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
E
3347
of
0.3
Page 34
A
B
C
D
Vin Detector
P1
PCN1
3
1
3
2
2DC-S315-B01
PD2
IN4148
11
22
VIN
P1
1
2
EC10QS04
VIN+
12
PD1
PR8
1K_1206
12
PR10
1K_1206
12
PR11
1K_1206
12
12
1000PF_0603_50V
FBM-L18-453215-900LMA 90T_1812
PC1
B++
PL1
12
PC2
100PF_0402_50V
PC3
1000PF_0603_50V
VIN
PC4
100PF_0402_50V
PC6
1000PF_0603_50V
84.5K_0402_1%
12
VIN
PD4
IN4148
12
PD5
21
PZD3
RLZ4.3B
RB751V
100K_0402
12
PR21
22K_0402
12
PR20
VS+
12
TP0610T
12
ON_G
PC12
0.22UF_1206_25V
PQ1
13
2
VMB
33
CHGRTCP
51ON#26
VIN_L
PR18
33_1206
12
12
PC11
0.1UF_0603_50V
VS
MAINPWO N36,37
ACON35
PD3
1
2
3
RB715F
High 18.784 17.901 17.077 V
Low 17.877 17.043 16.195 V
VIN
0.01UF_0603_50V
12
PR3
PR5
12
22K_0402_1%
12
PC7
0.01UF_0402_16V
12
DIN
PR6
20K_0402_1%
VS
12
PR13
10K_0402
PRG
(6.0V)
PZD2
RLZ6.2C
21
12
ACIN
Precharge detector
16.615.915.2
13.4812.9312.09
BAT ONLY
PR1
1M_0402_1%
12
VS
PC5
3
2
12
PR9
10K_0402
PU1B
LM393M
7
PC9
1000PF_0603_50V
PU1A
84
LM393M
+
-
RTCVREF
(3.3V)
PR12
1M_0402_1%
5
+
6
-
12
1
12
PC10
0.01UF_0402_16V
PR16
10K_0402
12
RTCVREF
3.3V
PQ2
2N7002
VS
12
PR2
10K_0402
12
12
PRG++
13
D
S
PQ3
DTC115EUA
PZD1
RLZ4.3B
PR17
215K_0402_1%
2
G
12
PR7
10K_0402
13
PR4
1K_0402
12
B++
12
PR14
499K_0402_1%
PRG+
12
PR15
499K_0402_1%
PR19
47K_0402
100K
100K
PACIN
2
12
ACIN 16,27,37
PACIN 35
12
PC8
1000PF_0603_50V
PACINPRG+_G
+5VALWP
Precharge detector
(3.3V)
RTCVREF
44
CHGRTC
12
PR23
200_0805
PC14
10UF_1206_10V
A
S-81233SG(SOT-23)
3
3
PU2
2
2
1
1
CHGRTCP
PR22
200_0805
CHGRTCP+
PC13
1UF_0805_50V
21
PZD4
RLZ16B
B
8.5978.2477.904
6.3106.1015.683
C
Title
DCIN & DETECTOR
SizeDocument NumberRev
B
BFY2600.2
!"#, $%
Date:Sheetof
14, 2002
D
3447
Page 35
A
B
C
D
11
PQ4
SI4835DY
ACOFF#
8
7
5
PD6
1SS355
12
PR33
10K_0402
12
VIN
12
PR25
20K_0402
22
PACIN34
ACON34
IREF=1.235*Ich arge
P2P3
PQ5
1
2
36
4
SI4835DY
1
2
36
12
4
PR26
200K_0402
L_1
12
PR30
150K_0402
8
7
5
ADP_I27
L_1T
13
D
PQ9
2N7002
2
G
S
PC20
0.1UF_0402_10V
12
12
PR35
13K_0603_1%
12
(1.73V)
12
PR34
24K_0402_1%
(5.0V)
PC23
0.1UF_0402_10V
12
IREF=0.6175 ~ 3.3V
12
PR53
2.2K_0402
12
PR39
147K_0603_0.1%
PU4A
LM358A
1
PR43
100K_0402_1%
VS
84
3
+
2
-
12
PC30
0.1UF_0603_50V
L_8
PR54
200K_0402_1%
12
PC27
0.1UF_0402_10V
VMB
12
L_7
12
12
PR48
604K_0402_1%
PR49
1M_0402_1%
IREF27
33
OVP voltage : LI-MH8 CELL(4S2P)
VMB : 18.0V--> BATT_OVP : 2.0V
(BAT_OVP voltage = 0.110865 *VMB)
BATT_OVP27
44
0.1UF_0402_10V
PC33
12
A
PR127
0_0402
4700PF_0603_50V
Iadp=0~3.5A
PR24
0.02_2512_1%
PR32
10K_0603_1%
PR36 10K_0603_1%
12
12
PC21
PR37 10K_0603_1%
12
12
PC24
2200PF_0603_50V
PR41 10K_0603_1%
PC34
0.01UF_0603_50V
B
B+
12
24
0_0603_5%
23
22
21
20
0.1UF_0603_50V
VH
19
18
12
17
PR38 68K_0402
16
PR42 47K_0603_1%
15
12
CHARGE
14
13
PL2
PR31
PC22
12
12
12
PR29
12
0_0603_5%
L_3
L_4
12
PC26
12
1500PF_50V
12
PR44
1K_0402
PR46
49.9K_0603_0.1%
PC15
10UF_1210_25V
PC18
2200PF_0402_25V
12
12
PC19
0.1UF_0603_50V
PC25
0.1UF_0603_50V
(4.2V)
12
12
PC16
4.7UF_1210_25V
L_5
12
PR45
47K_0402
PC17
0.1UF_0603_50V
12
FSTCHG27
PD8
EC31QS04
12
PU3
MB3878
1
-INC2
12
12
2
OUTC2
3
+INE2
4
-INE2
5
FB2
6
VREF
7
FB1
8
-INE1
9
+INE1
10
OUTC1
11
OUTD
12
-INC1
FBM-L18-453215-900LMA 90T_1812
+INC2
GND
CS
VCC(o)
OUT
VH
VCC
RT
-INE3
FB3
CTL
+INC1
B++
36
241
PQ7
FDS4435
578
LXCHRG
PL3
SLF12565T-22uH
12
12
L_6
12
PR47
150K_0603_0.1%
12
PC112 @22P_0603_50V
ACOFF#
12
0.02_2512_1%
PR40
PQ6
SI4835DY
1
2
36
12
13
100K
100K
4
L_2
PR27
10K_0402
2
PQ8
DTC115EKA
8
7
5
12
PR28
47K_0402
ACOFF27
CC=0(0.5 A) ~ 2.5 A
CV=16.825V (8 CELLS )
12
PC28
10UF_1210_25V
VIN
BATT+
12
PC29
4.7UF_1210_25V
CHARGE 36
+2.5VP
(1.25V)
SDREF7,11
PR51
0_0402
PC32
10UF_1206_10V
12
PR50
L_9
C
10K_0603_0.5%
12
PR52
10K_0603_0.5%
PU4B
LM358A
5
+
7
12
6
-
SDREF_L
PC121
0.1UF_0402_10V
PC31
0.1UF_0402_10V
Title
CHARGER
SizeDocument NumberRev
B
BFY2600.2
!"#, $%
Date:Sheetof
14, 2002
D
3547
Page 36
A
B
C
D
PJP1
3MM
21
+5VALW+5VALWP+12VALW
+12VALWP
PJP4
3MM
+3VALWP
11
21
+1.8VALWP+1.25VS
+3VALW
PJP2
2MM
PJP5
2MM
21
+1.8VALW
21
+1.25VP
PJP3
4MM
PJP6
3MM
21
+2.5V+2.5VP
PH1 under CPU botten side :
CPU thermal protection at 90(91)+-3 degree C
21
Recovery at 50(51)+-3 degree C
RTCVREF
PC84
0.1UF_0402_10V
PR57
1000PF_0603_50V
7
PR76
470K_0402
3
2
VS
84
+
-
VS
PR73
10K_0402
1
PU5A
LM393M
PR64
470K_0402
OTP_B
21
PZD6
RLZ3.6B
PR59
10K_0402
OTP_C
21
PZD5
RLZ3.6B
PD13
1SS355
PC43
0.1UF_0402_10V
PQ11
DTC115EKA
12
PC35
0.1UF_0603_50V
PD9
OTP
12
1SS355
PC40
0.1UF_0402_10V
100K
2
100K
OTP
100K
2
VR_ON
13
PQ12
DTC115EKA
100K
2
4,27,39
100K
100K
PTH1
10K_1%
L_10
PR55
100K_0402_1%
PR60
1K_0402_1%
47K_0402_1%
rev
PC37
1000PF_0603_50V
VMB
FBM-L18-453215-900LMA 90T_1812
12
PL4
12
BATT+
12
PC36
0.1UF_0603_50V
+3VALWP
PR56
@100K_0402_1%
CPU
*
PR58
3.65K_0402_1%
LI/NIMH# 27
PR61
22
PR66
1K_0402
12
PR67
1K_0402
PCN2
1
2
3
4
5
6
7
8
SUYIN_25037A-08G1-C
33
44
VMB
AB/I
VSB
TS
12
PR68
25.5K_0402_1%
12
*
PR69
100_0402
*
12
PR70
100_0402
1
PD12
@BAS40-04
@1K_0402_1%
12
PR63
BATT_TEMP
1
3
3
1
3
2
2
2
@1K_0402_1%
PD10
@BAS40-04
PD11
@BAS40-04
SMB_EC_DA1 27,28
SMB_EC_CK1 27,28
+3VALWP
BATT_TEMP 27
+3VALWP
0.1UF_0402_10V
BATTERY
PC42
0.1UF_0402_10V
3.65K_0402_1%
PC38
PR71
L_11T
L_10T
PH2 near main Battery CONN :
BAT. thermal protection at 85(86)+-3 degree C
Recovery at 50(51) degree C
RTCVREF
L_11
19.1K_0402_1%
PTH2
10K_1%
PR75
PR62
18.2K_0402_1%
249K_0402_1%
PR74
1K_0402_1%
PR65
PC41
0.1UF_0402_10V
PR7247K_0402_1%
rev
PC39
84
5
+
6
-
PU5B
LM393M
CHARGE
13
PQ10
DTC115EKA
MAINPWON
13
35
34,37
Title
BATTERY CONN / OTP
SizeDocument NumberRev
B
BFY2600.2
!"#, $%
A
B
C
Date:Sheetof
14, 2002
D
3647
Page 37
A
11
B++
12
PC47
0.1UF_0603_50V
12
PC48
PC49
2200PF_50V
10UF_1210_25V
SI4814DY
1
2
3
4
G1
D1
D1
S1/D2
G2
S1/D2
S1/D2
S2
PQ13
+3.3V Ipeak = 6.66A ~ 10A
12
12
PL5
SLF12565T-100M
22
12
PR82
+3VALWP
12
+
PC59
150UF_D_6.3V_FP
33
0.012_2512_1%
12
PD16
+
EP10QY03
PC60
21
150UF_D_6.3V_FP
12
12
PR87
3.57K_0402_1%
PR90
10K_0402_1%
PC57
47PF_0402_50V
L_BT3
PR83
1M_0402
12
12
PC61
FB3_L
33PF_0402_50V
0.1UF_0603_50V
8
7
6
5
DH3
B
PC46
12
DL3
LX3
ACIN16,27,34
PR78
0_0603_5%
12
CSH3
12
PR86
10K_0402
@300K_0402
VS
12
PR120
47K_0402
12
PC67
0.047UF_0603_50V
DAP202U
12
L_12L_13
12
22
V+
PU6
MAX1632
PD15
2
3
1
12
PC51
4.7UF_1206_10V
21
4
12OUT
VL
5
VDD
18
BST5
16
DH5
17
LX5
19
DL5
20
PGND
14
CSH5
13
CSL5
12
FB5
15
SEQ
9
REF
6
SYNC
11
RST#
GND
8
VL
BST31BST51
L_14
12
PR88
12
PD25
1SS355
PR79
10_1206
12
PC55
0.1UF_0603_50V
25
BST3
27
DH3
26
LX3
24
DL3
1
CSH3
2
CSL3
3
FB3
10
SKIP#
23
SHDN#
7
TIME/ON5
28
RUN/ON3
PC65
680PF_0402_50V
PR121
47K_0402
VS
12
MAINPWON
12
PC68
0.047UF_0402_16V
C
VL
+12VALWP
PC56
4.7UF_1210_25V
MAINPWON 34,36
12
12
PR92
@0_0402
12
PR137
0_0402
BST51+
LX5
2.5VREF
PC62
4.7UF_1206_10V
12
PC50
0.1UF_0603_50V
12
PR80
0_0603_5%
12
L_15
VL
FB5_L
PC52
2200PF_50V
12
PR81
0_0603_5%
12
D
PC45
470PF_0805_100V
B++
12
PC53
0.1UF_0603_50V
DH5
CSH5
33PF_0402_50V
12
PC54
DL5
PC66
12VDD
10UF_1210_25V
12
PR77
22_1206
12
SI4814DY
1
D1
2
D1
S1/D2
3
G2
S1/D2
4
S1/D2
S2
PR89
10.5K_0402_1%
G1
PQ14
FLYBACKSNB
12
12
E
PR126
2.7K_1206
12
PC44
2.2UF_1206_25V
12
12
PD14
EC11FS2
14
32
PT1
CST12057T-100M5R0-T
8
7
6
5
12
PC58
47PF_0402_50V
L_BT5
12
PR84
2M_0402
PD17
EP10QY03
PR91
10K_0402_1%
21
12
12
12
+
+
150UF_D_6.3V_FP
PC63
+5V Ipeak = 6.66A ~ 10A
PR85
0.012_2512_1%
+5VALWP
47UF_D_6.3V_PC
PC64
44
Title
3.3V / 5V / 12V
SizeDocument NumberRev
BFY260
Date:Sheet
!"#, $%
A
B
C
D
14, 2002
3747
E
0.2
of
Page 38
A
D
S
S
1
12
PR149
10K_0402
PU11A
LM393M
3
3
6
2
1
G
D
6
2
1
G
PQ16
SI3445DV
EC31QS04
L_16
VL
84
3
+
2
-
PQ21
SI3445DV
S
45
G
3
L_17
1
4700PF_0402_25V
PQ15
@SI3445DV
PD19
PC74
0.1UF_0402_10V
D
6
2
1
PD23
EC31QS04
VL
84
3
+
2
-
PC118
LX2.5
12
12
PD28
@EC31QS04
LA3
LA2
12
PC75
4700PF_0402_25V
PQ19
DTC115EUA
LX1.8
12
PC103
0.1UF_0402_10V
12
SLF12565T-4R2N
12
PR150
@2M
12
PC73
@0.1UF_0603_50V
13
100K
100K
TPRH6D38-5R0M
12
12
PR145
@2M
191K_0402_1%
12
PC115
@0.1UF_0603_50V
LB3
12
*
PR151
261K_0402_1%
PL6
191K_0402_1%
PL9
LB2
+5VALWP
11
PD18
PC72
PQ18
2SA1036K
+3VALWP
12
12
31
12
PC104
PQ23
2SA1036K
RB751V
12
12
PC71
10UF_1210_25V
2200PF_0402_25V
22
33
PC117
4.7UF_1206_16V
2200PF_0402_25V
44
PR152
1K_0402
2
PD22
RB751V
12
12
12
31
PQ17
HMBT2222A
2
HMBT2222A
PR111
1K_0402
2
PU11B
LM393M
A
13
PU7B
LM393M
PQ22
2
LB1
7
7
LA1
12
13
+
-
45
45
PR114
10K_0402
*
PU7A
LM393M
5
+
6
-
5
6
12
PR148
PR115
47K_0402
12
2
PR146
B
12
13
100K
B
12
PC69
VL
12
PR147
@47K
12
100K
2
PQ24
@DTC115EKA
(+2.5V +-5%)
+2.5VP
12
12
+
PC70
470PF_0402_50V
220UF_D_4V_FP
2.5VREF
12
PR116
0_0402
SYSON#LA2_G
(+1.8V+-5%)
+1.8VALWP
12
PR113
100K_0402_1%
PC116
470PF_0402_50V
SYSON#
12
+
PC119
150UF_D_4V_FP
2.5VREF
C
D
+2.5VP
PR112
10_0805
PC76
0.1UF_0402_10V
12
12
1.5VCC
1
VCC1
VCC2
16
12
SYSON#31
PVDD2
PGND2
AGND2
VFB
VCCQ
AGND
15
13
12
11
10
9
12
PC79
4.7UF_1206_16V
+2.5VP
12
PC82
0.1UF_0402_10V
Title
SizeDocument NumberRev
B
Date:Sheetof
SUSP#27,29,31
+2.5VP
12
4.7UF_1206_16V
12
PR109
100K_0402
2
PQ20
DTC115EUA
PC78
100K
100K
2
PVDD1
PU8
314
VL1VL2
CM8500IT
4
PGND1
5
AGND1
SD
6
SD
7
VIN/2
12
PC83
1000PF_0603_50V
8
AGSEN
13
Layout : "Compensation network close to FB pin"
C
21
PD20
@EP10QY03
PC77
0.1UF_0402_10V
+1.25VP
PL8
LX1.25
TPRH6D38-5R0M
12
PD21
@EP10QY03
12
PC81
1000PF_0603_50V
PR108
100K_0402
PR110
1K_0402
12
12
+
PC80
12
12
DDR /2.5V / 1.8V
BFY2600.2
!"#, $%
14, 2002
D
3847
220UF_D_4V_FP
Page 39
A
B
C
D
E
F
G
H
PQ33
IR7811A
SI4362DY
PQ25
IR7811A
L_21
PQ29
CPUB+
578
36
578
578
CPUB+
PC109
2200PF_0603_50V
578
36
578
36
578
12
241
241
12
PR100
100_0402
PQ34
IR7811A
241
PQ30
SI4362DY
36
241
PR153
@0_0402
12
CPUB+
PQ26
IR7811A
PL10
SSC-1206-0R5
12
PD27
EC31QS04
12
+
PC105
PC106
10UF_1210_25V
100UF_EC_25V
CM+
12
PC120
10PF_0402_50V
CPUB+
PC107
4.7UF_1210_25V
PR97
0_0402
12
12
+CPU_CORE
PR117
0.001_2512_5%
COREFB+
PC108
4.7UF_1210_25V
+CPU_CORE
PC95
2200PF_0603_50V
12
+5VALWP
PC150
1UF_0805_16V
CPUVDD
11
VR_ON4,27,36
120K_0603_1%
PR107
12
470PF_0603_50V
PC99
22
12
@0.47UF_0805_10V
VGATE
VID033
VID133
VID233
VID333
VID433
PC114
PR130
100K_0603
12
PC101
12
0.22UF_0603_16V
PR134
0_0603
PR132
PR131
100K_0603
12
PR139
100K_0402_1%
+2VREF
12
100K_0603
12
PR119
+5VS
PR133
100K_0603
12
100K_0603
12
143K_0603_1%
PR142
@0_0402
+3VALWP
PR135 100K_0603
+5VALWPCOREFB-
12
PC113
PR138
220K_0603_1%
12
PR141
12
2
3
0_0402
21
12
PR125
0_0402
12
20
PR122
0_0402
12
19
PR94
0_0402
12
18
PR123
17
12
0_0402
PR124
6
12
8
1612
12
PR95
0_0402
@1000PF_0603_50V
21
PR144
12
20_0805
15
7
VDD
VCC
SKP/SDN#
TIME
D0
D1
D2
D3
D4
CC
TON
A/B#VGATE
BST
PU10
MAX1717A
GND
FBSREF
GNDS
ILIM
10
PC100
0.22UF_0603_16V
12
1
V+
22
24
DH
23
LX
14
DL
13
4
FB
59
11
PD24
1SS355
B++
FBM-L18-453215-900LMA 90T_1812
PC102
12
0.1UF_0603_50V
PC91
12
0.1UF_0603_50V
PC93
1000PF_0603_50V
+2VREF
12
12
PR143
@0_0402
PR154
@0_0603
PR140
12
0_0402
PL7
PC85
10UF_1210_25V
PC90
@2200PF_0402_25V
12
PC86
4.7UF_1210_25V
12
PR96
2.2_0603_1%
12
4.7UF_1210_25V
PC87
36
36
241
578
36
L_24
241
E
+2VREF
*
*
PR102
33
PC96
0.1UF_0402_10V
PR103
200_0402
12
PR104
200_0402
12
12
PR105
200_0402
12
PR106
200_0402
44
A
48.7K_0402_1%
PR101
20K_0402_1%
PC97
4700PF_0402_25V
PC98
4700PF_0402_25V
PR136
53.6K_0402_1%
PR99
20K_0402_1%
L_26
L_29
L_30
L_31
B
L_18
PR98
PC94
1000PF_0603_50V
PU9MAX1887
1
215
3
4
5
6
7
8
33K_0402_1%
PC92
270PF_0402_50V
L_25
ILIM
TRIGV+
CM+
CMÂCSÂCS+
COMP
GND
LIMIT
BST
VDD
PGND
LX
DH
DL
C
16
14
13
12
11
10
9
L_19
CPUVDD
0.1UF_0603_50V
L_28
PC89
L_23
21
1UF_0805_16V
PC88
PD26
1SS355
PR93
2.2_0603_1%
12
D
PQ27
SI4362DY
*
241
PQ28
SI4362DY
578
36
241
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY
OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL AND TRADE
SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE
CUSTODY OF THE COMPETENT DIVISION OF R&D DEPARTMENT EXCEPT AS
AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR
THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY
THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,
SSC-1206-0R5
12
PD7
EC31QS04
PL11
PR118
0.001_2512_5%
CS+
F
12
+CPU_CORE
+CPU_CORE
COMPAL ELECTRONICS, INC
Title
+CPU_CORE
SizeDocument NumberRev
B
Date:Sheet
BFY2600.2
!"#, $%
14, 2002
G
H
3947
of
Page 40
A
Voltage Rails
VIN
Note : ON* means that this power plane is ON only with AC power a vaila ble, o th erw ise it is OFF .
Adapter power supply (19V)
B+
+CPU_CORE
11
22
+3VS
Core voltage for CPU
3.3V always on power rail
3.3V switched power rail
B
S1S3S5Power PlaneDescription
N/A
N/AN/A
ON+3VALW
ON
N/A
N/AAC or battery power rail for power circuit.
LAN
CardBus_A SLOT
CardBus_B SLOT
Mini-PCI
Mini-PCI LAN
IEEE-1394 Controller
IDSEL#
AD20
AD22
AD22
AD27
AD31
AD21
3
2
2
1
0PIRQA
InterruptsREQ#/GNT #
PIRQB
PIRQA
PIRQA
PIRQB1
PIRQD
33
P.S:Default Resistor & Capacitor's package are 0402.
Default 8P4R package is0402.
44
Compal Electronics, Ltd.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
A
B
C
D
Title
Notes
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
E
4047
of
0.3
Page 41
5
4
3
2
1
Power PIR
Item
1
2
DD
3
4
5
6
7
8
CC
9
10
11
Fixed IssueReason for changePagePhaseMB_Ver.Modify item
12
13
BB
14
15
16
17
18
AA
Title
Power PIR
SizeDocument NumberRev
LA-1481 M/B
5
4
3
Date:Sheet
!"#, $%
2
14, 2002
4147
of
1
0.2
Page 42
5
4
3
2
1
BCY26 A-TEST Modify <91.05.20.~91.06.27.
>
1.Modify the resistors' value for AMD recommend <Page 3> 91.05.22.
-Change R151,R157 from 10ohm to 10Kohm . (Modify CKT&BOM)
2.Modify the schematic for ATI DC_STOP# related <Page 6> 91.05.22.
DD
-Change R210 from @1Kohm to 1Kohm . (Modify CKT&BOM)
3.Modify the Pull Low/High resistors' value to meet Compal rule <Page 17,18> 91.05.22.
-Change R122,R123,R164,R179,R266 from 10Kohm to 4.7Kohm . (Modify CKT&BOM)
-Change R239,R257 from @10Kohm to @4.7Kohm . (Modify CKT onl y)
-Change R142 from 100Kohm to 4.7Kohm . (Modify CKT&BOM)
-Change R165,R170 from @100Kohm to @4.7Kohm . (Modify CKT onl y)
-Change RP23 from 8P4R_10K_0804ohm to 8P4R_4.7K_0804ohm . (Modify CKT&BOM)
-Change R214 from 4.7Kohm to 10Kohm . (Modify CKT&BOM)
4.Modify the schematic for IDE related <Page 19> 91.05.22.
-Change D16 from RB751V to @RB751V . (Modify CKT&BOM)
-Change R101,R371 from 330ohm to 10Kohm . (Modify CKT&BOM)
5.Modify the material for shortage and layout size <Page 19> 91.05.24.
CC
-Change R14 from 60_1%_0603 to 60.4_1%_0603 . (Modify CKT&BOM)
-Change R441,R442 from 60_1%_0603 to 60.4_1% . (Modify CKT&BOM)
A-TEST SMT BUILT
6.Correct CPU schematic <Page 4> 91.05.20.
-Connect U27.AM6 or U27.AE7 to GND . (Modify CKT& Layout)
7.Modify the schematic for PWRGD timing <Page 30> 91.05.29.
-Remove Q21(2N7002) , and then short Q21.1 and Q2 1.3 . (Modify CKT,BOM and Layout)
8.Modify the schematic for ATI strapping recommend <Page 10> 91.05.29.
-Change R43 from 10K_0603 to @10K_0603 . (Modify CKT&BO M)
-Change R67 from @10K_0603 to 10K_0603 . (Modify CKT&BO M)
-Change R433 from @10K_0603 to 10K_0603 . (Modify CKT&B OM)
-Change R434 from 10K_0603 to @10K_0603 . (Modify CKT&B OM)
BB
9.Add the By-Pass Capacitors for improving CPUCLK differential signals <Page 13> 91.05.29.
-Change C197,C201 from @10PF to 10PF . (Modify CKT&BO M)
10.Add the By-Pass Capacitor to improve SDAT A IN V AL # l ay ou t le ng th is su e < Pa g e 3> 91 .0 5. 29 .
-Add a 20PF Capacitor between CPU socket(U27.AN33) and GND. (Mo dify CKT,BOM and Layout)
11.Modify the schematic for ENE (ENE has internal clock already)<Page 22> 91.05.29.
-Change R358 from 0ohm to @0ohm . (Modify CKT&BOM)
12.Modify the schematic for delay CPURST# timing (Change the signal issued from NB to SB)
<Page 6,16> 91.05.29.
-Change R137 from 0ohm to @0ohm . (Modify CKT&BOM)
-Change R205 from @0ohm to 0ohm . (Modify CKT&BOM)
13.Change the value for powergood related<Page 30> 91.05.29.
-Change R224 from 10K_0603ohm to 20K_0603ohm . (Modify CKT&BOM)
14.Change the power source for ALI recommend . <Page 16> 91.06.01.
AA
-Change R153.1's connection from +3VALW to +3VS . (Modi fy CKT&Layout)
15.Change the power source of DDCDATA/DDCCLK for ATI recommen d . < P a g e 14> 91.06 . 01 .
-Change R8.2 and R9.2's connection to Q1.1 and Q2.1 . (Modify CKT&Layout)
-Add R? and R? (2.2Kohm) from DDCDATA/CLK to +3VS . (Modify CKT,BOM and Lay out)
-Change R7 from 100K to 33ohm and connection from +12VS to +3VS . (Modify C KT,BOM and Layout)
5
4
16.Change the SUSP# and CLK GEN PWR_DWN# related schematic to improve the
leakage issue . <Page 31,13> 91.06.03.
-Connect to +3VALW by adding R528 10Kohm . (Modify CKT,BOM and Layout)
-Change R322 from 0ohm to @0ohm . (Modify CKT&BOM)
-Change R321 from @10Kohm to 10Kohm . (Modify CKT&BOM)
17.Modify LVDS_BLON# related schematic for LCD backlight issue . <Page 15,27> 91.06.03.
-Disconnect U12.4 and LVDS_BLON# and then jump a wire from U12.4 t o Q11. 2 .
(Temp solution for A-TEST rework)
18.Modify the signal RUNON related schematic for ATI recommend power sequence
(+1.8VS early to +3VS) . <Page 31> 91.06.03.
-Cut RUNON signal to C213.1 and then connect to +12VS by ad ding R529 10Kohm .
(Modify CKT,BOM and Layout)
19.Modify the signal DC_STOP# related schematic for ATI recommend . <Page 6> 91.06.03.
-Change Q51 from 2N7002 to @2N7002 . (Modify CK T&BOM)
-Change R211 from 4.7Kohm to @4.7Kohm . (Modify CKT&BOM)
20.Modify the schematic for AMD recommend and layout improve . <Page 3,4> 91.06.07.
-Change R451 from 1Kohm to 510ohm . (Modify CKT&BOM)
-Add R530 75ohm between Q17.2 and the signal FERR . (Modi fy CKT,BOM and Layout)
-Add C518 1UF_0603 from VREF_SYS to +CPUCORE . (Modify CKT,BOM and Layout)
-Add C519 @1UF_0603 from VREF_SYS to GND . (Modify CKT&Layout )
-Add CB106 4.7UF_0805 from U27.AJ23(+VCCA2.5) to GND . (Modify CKT,BOM and Layout)
-Add C520 39PF from +VCCP2.5 to GND . (Modify CKT,BOM and Layout)
-Del Q50(@MMBT3904) . (Modify CKT,BOM and Layout)
21.Modify the schematic for the signal "LVDS_BLON#" related . <Page 9,27> 91.06.08.
-Change the netname from LVDS_BLON to LVDS_BLON# . (Modify CKT onl y)
-Add Q60(2N7002) and R531(10Kohm) pull high bet ween U3.D2 and
LVDS_BLON# . (Modify CKT,BOM and Layout)
22.Cut the MVREF_DIM to MVREF_DIM1 and MVREF_DIM2 for ATI recommend . <Page 11>
91.06.08.
-Add the MVREF_DIM1 related schematic(R532,R533,R534,C521,C522,C523)
. (Modify CKT,BOM and Layout)
23.Modify ISA pull high resistors' value . <Page 18> 91.06.08.
-Change RP36,RP26,RP34 from 10P8R_10K to 10P8R_47K . (Modify CKT,BOM and Layout )
24.Modify IDERST# related schematic . <Page 19> 91.06.08.
-Del D16,D17(RB751V) and then short the location . (Modify CKT, BOM and Layout)
-Disconnect U8.1 and U8.5 and then add R537 (10Kohm ) from U8.5 to +5VS .
(Modify CKT,BOM and Layout)
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
----PLEASE SEE NEXT PAGE
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Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(1)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
Date:Sheet
14, 2002
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0.3
of
Page 43
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BCY26 A-TEST Modify <91.05.20.~91.06.27.
>
25.Modify PCLK_PCM related schematic . <Page 22,27> 91.06.08.
-Add the 2N7002 related schematic (add Q61,R538,R539) between the signal PCLK_PCM and
U29.A10/R524.1 . (Modify CKT,BOM and Layout)
DD
-Del R199(@0ohm) and reconnect U12.165 to PCMCLKE . (Modify CKT,BOM and Layout)
26.Modify PM_CLKRUN# related schem at ic . <P ag e 22 > 91 .0 6.0 8.
-Add R543 (@0ohm) between U29.B15 and PM_CLKRUN# . (Modify CKT,BOM and Layout)
27.Modify PCM_SUSP# related schematic . <Page 22> 91.06.08.
-Del D35(RB751V) and then short the location . (Modify CKT, BOM and Layout)
28.Modify PWRGD related schematic . <Page 30> 91.06.08.
-Del U10(MAX809SEUR) . (Modify CKT,BOM and Layout)
-Add U31(7SH08) related schematic (Add R540,R541,C524) . (Modify CKT,BOM an d Layout)
29.Modify SYSON related schematic for 2.5V and 3V timing delay . <Page 31> 91.06.08.
-Add R542(0ohm) from SYSON to Q53.2 and add C525(@0.1UF) between Q53.2 and GND .
(Modify CKT,BOM and Layout)
30.Modify CPU internal PLL power source related schematic . <Page 4> 91.06.08.
CC
-Change U9 from SI9183BT-25 to SI9182DH-25 and the related sc hematic (Add
C526,Del C164,C158) . (Modify CKT,BOM and Layo ut)
31.Modify SB Pull High/Low related schematic for ALI updated . <Page 17> 91.06.10.
-Add R545,R546,R547,R548(10Kohm) from U6.U3/R5/U2/T4 to +5VS .
(Modify CKT,BOM and Layout)
-Add R544,R549(1Kohm) from U6.E4/Y5 to GND . (Modify CKT,BOM an d Layout)
32.Modify NB Pull Low resistors' value related schematic. <Page 10> 91.06.11.
-Change R62,R63,R65,R66,R67,R68,R71,R72,R73,R155R148,R161,R167,R175,R184,R427,
R430,R432,R436,R438,R440 from 10K_0603 to 4.7K_0603 . (Modify CKT&BO M)
-Change R64,R69,R70,R194,R434 from @10K_0603 to @4.7K_0603 . (Modify CKT &BOM)
33.Modify LAN LED signals related schematic. <Page 20> 91.06.11.
-Change U21.80's connection from LED_YELP to LED2_YELN . (Modify CKT&Layout)
-Change U21.79's connection from LED1_GRNP to LED1_GRNN . (Modify CKT&Layo ut)
BB
-Change R518.1's connection from LED2_YELN to LED2_YELP . (Modify CKT&Layout )
-Change R492.1's connection from LED1_GRNN to LED1_GRNP . (Modify CKT&Layo ut)
34.Modify NB Pull High/Low resistors' related schematic. <Page 10> 91.06.11.
-Change R160 from 10K_0603 to @10K_0603 . (Modify CKT&B OM)
35.Modify NB VDD related schematic. <Page 9> 91.06.11.
-Change R391,R395,R396,R397 from 1Kohm to 3.3Kohm . (Modify CKT&BOM)
36.Modify NB strap input related schematic. <Page 10> 91.06.12.
-Change R61 from 2.2K_0603 to 3.3K_0603 . (Modify CKT &BOM)
-Change R37 from 8.2K_0603 to 5.6K_0603 . (Modify CKT &BOM)
37.Modify VGATE related schematic . <Page 30> 91.06.12.
-Change R225 from 10K_0603 to @10K_0603 . (Modify CKT&B OM)
38.Modify CPU VID related schematic . <Page 33> 91.06.12.
AA
-Change R467 from 10Kohm to @10Kohm . (Modify CKT&BOM)
-Change RP100 from 8P4R_10K_0804 to @8P4R_10K_0804 . (Modify CKT&BOM)
39.Modify VR_POK_1 timing related schematic . <Page 30> 91.06.12.
-Change C222 from 0.1UF_0603 to 0.047U F_0603 .
(Modify CKT&BOM)
5
4
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
40.Modify RJ-45&11 related schematic for EMI recommend . <Page 25> 91.06.12.
-Change VH1 from DSSA-P3100SB to @DSSA-P3100SB . (Modify CKT&BOM)
-Connect LANGND and GND by add R550(0_0603ohm) . (Modify CKT,BOM an d Layout)
41.Modify BIOS FLASH# related schematic for Compal HW1 recommend . <Page 25> 91.06.12.
-Change R346 from 100Kohm to 1Kohm , and then change its connecti on from +12VS to
SUS_STAT# . (Modify CKT,BOM and Layout)
42.Modify PWRGD related schematic . <Page 30> 91.06.08.
-Add U31(74LVC08) related schematic (Add C527,R551,R541) . (Modify CKT,BOM an d Layout)
43.Modify CPU Bypass Cap. related schematic for cost down . <Page 5> 91.06.14.
-Del CE13,CE14(220UF_D2_4V_25m) . (Modify CKT,BOM and Layout)
-Change CE3,CE16,CE7,CE5,CE11,CE6,CE12,CE15 from 220UF_D2_4V_25m to
330UF_D2_2.5V_15m . (Modify CKT&BOM)
44.Modify NB DC_STOP# related schematic after A-TEST verified . <Page 6> 91.06.14.
-Del DC_STOP# related schematic (Del R458,R459,R460,CB93,Q51,Q 52) .
(Modify CKT,BOM and Layout)
45.Modify NB XTLOUT related schematic after A-TEST verified . <Page 9> 91.06.14.
-Del U3.A9(XTLOUT) related schematic (Del R28,X1,C54,C58,JOPEN3 ) .
(Modify CKT,BOM and Layout)
46.Modify IRQ8# power source . <Page 17> 91.06.14.
-Change R186.2's connection from +5VALW to +3VALW . (Mo dify CKT&Layout)
47.Modify CODEC Connector's related schematic for FDD active LED function . <Page 24>
91.06.14.
-Change JP6.16 from AGND to GND . (Modify CKT&Layout)
-Change JP6.27 from LED2 to DRV_0# . (Modify CKT&Lay out)
-Add Q62(DTC124EK) . (Modify CKT,BOM and La yout)
-Change Q41 from 2N7002 to @2N7002 . (Modify CKT &BOM)
-Change Q42 from SI2304DS to @SI2304DS . (Modify CKT& BOM)
-Change R368 from 100Kohm to @100Kohm . (Modify CKT&BOM)
48.Modify JP8's library and related schematic for customer request . <Page 26> 91.06.14.
-Modify the JP8 Internal Keyboard's related schematic (Del Q43,R376,R362,R 375,R377,R378) .
(Modify CKT,BOM and Layout)
49.Modify EC_SMD/EC_SMC related schematic . <Page 27> 91.06.14.
-Change RP42.7/RP42.8's connection from +5VALW to +3VS and RP42.5/ RP42.6 keep +5VALW
still . (Modify CKT&Layout)
50.Modify CPU Thermal related schematic . <Page 3> 91.06.14.
-Add R552(150ohm) between +3VS and C377.1 . (Modif y CKT,BOM and Layout)
-Del Q50(@MMBT3904) . (Modify CKT,BOM and Layout)
51.Modify SMI# related schematic for noise issue . <Page 3> 91.06.14.
-Add C528(@560PF) between SMI# and GND . (Modify CKT,BOM and Layout)
Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(2)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
3
2
Date:Sheet
14, 2002
1
4347
0.3
of
Page 44
5
4
3
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1
BCY26 A-TEST Modify <91.05.20.~91.06.27.
>
52.Modify VR_POK related schematic . <Page 28,30> 91.06.14.
-Add the 2N7002 related schematic (add R553,Q63) b etween the signal VGATE and
U31.2 . (Modify CKT,BOM and Layout)
DD
-Add the net POK_EN from U23.12 to Q63.2 . (Modify CKT,BOM and Layout)
53.Modify MOD_AUDIO_MONR rel ate d sc hem ati c . < Pag e 24 > 91 .06 .17.
-Change R363 from 20Kohm to 0ohm . (Modify CKT&BOM)
-Change R364 from 33Kohm to @33Kohm . (Modify CKT&BOM)
54.Modify USB ports' power source related schematic . <Page 29> 91.06.17.
-Del F7,F3,F4(@POLYSWITCH_0.75A) to +5VS . (Modify CKT,BO M and Layout)
-Change F2,F5,F6 from POLYSWITCH_0.75A to EVERFUSE_1.1A . (Modify CKT&BOM)
55.Modify RTC related schematic from IRQ8 to SIRQ . <Page 17> 91.06.17.
-Add R554(@0ohm) between RTC and IRQ8# . (Modify CKT,BOM and Layout)
-Change R186.2's connection from +3VALW to GND . (Modi fy CKT&Layout)
56.Modify SCI# related schematic from RUM_EN T 1 t o O FF _C D PW R . < Pa ge 17 > 9 1. 06 .1 7.
-Add R555(0ohm) between SCI# and OFFCDPWR . (Modify C KT,BOM and Layout)
CC
-Change D18 from RB751V to @RB751V . (Modify CKT,BOM and La yout)
-Change R142 from 4.7Kohm to @4.7Kohm . (Modify CKT&BOM)
57.Change the SUSP# related schematic to improve the leakage issue by SW timing delay .
<Page 31> 91.06.17.
-Change R528 from 10Kohm to @10Kohm . (Modify CKT&BOM)
58.Change the VGATE related schematic to avoid the power issue by power team .
<Page 30>91.0 6. 17 .
-Change R553 from @0_0603ohm to 0_0603ohm . (Modify CKT&BOM)
-Change Q63 from 2N7002 to @2N7002 . (Modify CKT &BOM)
59.Change the ATI CAL related schematic for ATI updated . <Page 6>91.06.18.
-Change R14 from 60.4_1%_0603ohm to 30_1%_0603ohm . (Modify CKT&BOM)
60.Change the RJ45 jack related schematic for Safety team request . <Page 25>91.06.19.
-Change JP20.13,JP20.14(RJ-45 & RJ-11)'s connection fro m LANGND to NC .
BB
(Modify CKT&Layout)
-Change JP20.9,JP20.12(RJ-45 & RJ-11)'s connection from NC to LANGND .
(Modify CKT&Layout)
61.Cancel modify RTC related schematic from IRQ8 to SIRQ action . <Page 17> 91.06.19.
-Del R554(@0ohm) , and then short RTC and IRQ8# directly . (Modif y CKT,BOM and Layout)
-Change R186.2's connection from GND to +5VALW . (Modi fy CKT&Layout)
62.Cancel modify SCI# related schematic from RUM_ENT1 to OFF_CDPWR action . <Page 17>
91.06.19.
-Del R555(0ohm) between SCI# and OFFCDPWR . (Modify CKT, BOM and Layout)
-Change D18 from @RB751V to RB751V . (Modify CKT,BOM and La yout)
-Change R142 from @4.7Kohm to 4.7Kohm . (Modify CKT&BOM)
63.Modify ISA BUS pull high resistors' value for RTC related . <Page 18> 91.06.19.
AA
-Change RP36,RP26,RP34 from 10P8R_47K to 10P8R_10K . (Modify CKT&BOM)
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
5
4
64.Modify RTC related schematic to fix the RTC fail isssue . <Page 17,18,24> 91.06.19.
-Change CB39 from 22UF_10V_1206 to 10UF_6.3V_1206 . (Modify CKT&BOM)
-Del Q15(MMBT3906),Q16(3904),R162(10Kohm),R156(51Kohm),R158(10Kohm) .
(Modify CKT,BOM and Layout)
-Add RTC chip (U32,DS1685) related schematic(Add U32,C529,C530,C531,C532,R554,
R555,R556,R557,R558,R559,R560,R561,R562,J3,J4,X8) . (Modify CKT,BOM an d Layout)
65.Modify ATI strap input related schematic for ATI updated . <Page 10> 91.06.19.
-Change R433 from 10K_0603 to @10K_0603 . (Modify CKT&B OM)
-Change R434 from @4.7K_0603 to 4.7K_0603 . (Modify C KT&BOM)
-Change R427 from 4.7K_0603 to 2.2K_0603 . (Modify CK T&BOM)
66.Modify ATI VDD related schematic . <Page 9> 91.06.19.
-Change L17,L18,L48 from BLM21A601SPT to HB-1M2012-121JT . (Modify CKT&BOM)
67.Modify ATI NB_VREFSYS related schematic for noise issue improved . <Page 6> 91.06.20.
-Change C140 from 0.047UF to 0.1UF . (Modify CKT& BOM)
-Add C533(0.1UF) between +CPU_CORE and NB_VREFSYS . (Modify CKT,BOM a nd Layout)
68.Del some +2.5VDD related CAP for cost down and free space . <Page 20> 91.06.20.
-Del C508(1000PF),C514 and C485(0.1UF) . (Modify CKT,BOM and Layout)
69.Modify RTC related schematic for ALI recommend . <Page 17,18,27> 91.06.21.
-Change RP8 from 8P4R_4.7K_0804 to @8P4R_4.7K_0804 . (Modify CKT&BOM)
-Change the net name from RTC to IRQ8# . (Modify CKT&Layout)
-Change R186 from 4.7Kohm to @4.7Kohm . (Modify CKT&BOM)
-Add Q15(MMBT3906),Q16(3904),R162,R156,R158 . (Modify CKT,BOM an d Layout)
-Add "@" mark to D38,U32,C529,R530,C531,C532,R554,R555,R558,R559,R556,R 557,
R561,R562,R566,X8 for SMT no build in . (Modify CKT&BOM)
-Del RTC net to U12.23 . (Modify CKT&Layout)
-Add R565(0ohm) between the net PC7 and IRQ8# . (Modify CKT,BOM and Layout)
-Change R325 from 100Kohm to 10Kohm . (Modify CKT&BOM)
70.Modify LREST1# related schematic for EC recommend . <Page 27> 91.06.21.
-Del Q30(@2N7002) . (Modify CKT&Layout)
71.Modify +3VS transfer related schematic . <Page 31> 91.06.21.
-Change R301 from 75ohm to 15_0603ohm . (Modify CKT,BOM and La yout)
72.Modify LAN power related schematic . <Page 20> 91.06.21.
-Change L51,L52 from 4.7UH_80mA to 0_0805ohm . (Modify CKT&BOM)
73.Modify RTC related schematic for SW team request . <Page 18> 91.06.24.
-Add R567(@0ohm) between U32.13 and U17.8 . (Modify CKT&Layout)
-Del "@" mark to D38,U32,C529,R530,C531,C532,R555,R558,R559,R556,R557,R561,R562,X8
for SMT no build in . (Modify CKT&BOM)
-Exchange J3 and R555's location and connection . (Modif y CKT&Layout)
-Change CB39 from 22UF_10V_1206 to 10UF_6.3V_1206 . (Modify CKT&BOM)
74.Modify AC97 Codec related schematic for EMI team request . <Page 13> 91.06.24.
-Change C181 from @10PF to 1000PF . (Modify CKT&BO M)
-Change R278 from 22ohm to 0ohm . (Modify CKT&BOM)
Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(3)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
3
2
Date:Sheet
14, 2002
1
4447
0.3
of
Page 45
5
4
3
2
1
BCY26 A-TEST Modify <91.05.20.~91.06.27.
>
75.Modify CLK GEN VDD related schematic for EMI team request to improve 400MHz noise .
<Page 13> 91.06.24.
-Change JOPEN4(Short) to L53(HB-1M2012-121JT) . (Modify CKT,BO M and Layout)
76.Modify VREF_SYS related schematic for ATI recommend . <Page 3> 91.06.25.
DD
-Change C149 from 0.01UF to 0.047UF . (Modify CKT&B OM)
77.Modify S2K_VREF related schematic for ATI recommend . <Page 6> 91.06.25.
-Change R149,R150 from 100_1%ohm to 60.4_1%ohm . (Modify CKT&BOM)
B-TEST BOM RELEASE
BFY26 B-TEST Modify <91.06.27.~91.07.29.
>
78.Modify VREF_SYS related schematic for noise improved . <Page 3> 91.06.25.
-Change C519 from @1UF_0603 to 1UF_0603 . (Modify CKT&BOM )
79.Modify CPU LCL related schematic for timing delay improved . <Page 3> 91.06.25.
-Change C40 from 5PF to @5PF . (Modify CKT&BOM)
80.Modify EC PCMCLKE related schematic for EC team request . <Page 27> 91.06.26.
-Change U12.36's connection from LED2 to PCMCLKE . (Modify CKT&Layout )
CC
-Change U12.165's connection from PCMCLKE to PCRST# and add R199(0ohm) be tween them .
(Modify CKT,BOM and Layout)
81.Modify Serial Port related schematic for CAP size. <Page 29> 91.06.26.
-Change C331 from 0.1UF to 0.1UF_0805 . (Modify CKT,BOM and Layout)
82.Modify VR_POK related schematic. <Page 30> 91.06.26.
-Change R225 from @10K_0603 to 10K_0603 . (Modify CKT&B OM)
-Change R553 from 0_0603 to @0_0603 . (Modify CKT &BOM)
-Change Q63 from @2N7002 to 2N7002 . (Modify CK T&BOM)
83.Modify CLK GEN related schematic for CAP removed because layout improve the timing issue .
<Page 13> 91.06.27.
-Change C201 and C197 from 10PF to @10PF . (Modify CKT& BOM)
-Change R400 from @0ohm to SS@10Kohm . (Modify CKT&BOM)
-Change R10 from SS@10ohm to @10ohm . (Modify CKT&BOM)
-Change C21 from SS@22PF to @22PF . (Modify CKT&BOM )
85.Modify CLK GEN related schematic for AC97 Codec clock signal disable . <Page 13> 91.06.27.
-Change R278 from 0ohm to @22ohm . (Modify CKT&BOM)
-Change C181 from 1000PF to @10PF . (Modify CKT&BO M)
86.Modify Crystal CAP value for internal review . <Page 13> 91.06.27.
-Change C180 and C186 from 10PF to 12PF . (Modify CKT&B OM)
87.Modify SODIMM2 CAP for cost down . <Page 7> 91.06.27.
-Change C230 from 150UF_D2_6.3V to @150UF_D2_6.3V . (Modify CKT&BOM)
88.Modify CRT connector related schematic . <Page 14> 91.06.27.
-Change R7 from 33ohm to 0ohm . (Modify CKT&BOM)
AA
89.Modify Crystal CAP value for internal review . <Page 17> 91.06.27.
-Change C130 and C113 from 10PF to 12PF . (Modify CKT&B OM)
90.Modify PCLK_PCM related schematic . <Page 22> 91.06.27.
-Change R538 from 10Kohm to 100Kohm . (Modify CKT&BOM)
5
4
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
91.Modify BD_ID setting related schematic . <Page 27> 91.06.27.
-Change R343,R250,R268 from 10Kohm to @10Kohm . (Modify CKT&BOM)
92.Modify CAP value for cost down . <Page 6,7,8,13,20,21,25> 91.06.28.
-Change CB20,CB42,CB16,CB92,CB7,CB90,CB91,CB43,CB44,CB82 from 22U_10V_1206
to 10U_10V_1206 . (Modify CKT&BOM)
B-TEST BOM EN1 RELEASE
93.Modify Spread Spectrum for Pin Define Error on S0/S1 . <Page 8> 91.07.03.
-Change R400 from SS@10Kohm to @10Kohm . (Modify CKT&BOM)
-Change R385 from @10Kohm to SS@10Kohm . (Modify CKT&BOM)
*Must modify schematic and layout w h e n C-TEST .
94.Modify Crystal PPM value because of R TC f un ct io n . <P a ge 18 > 9 1. 07 .0 3.
-Change X8 from 32.768KHZ to 32.768KHZ_10PPM . (Modify CKT&BOM)
95.Modify +RTCVCC power source related schematic . <Page 18> 91.07.03.
-Change D38 from RB751V to @RB751V . (Modify CKT&BOM)
96.Modify IDE connector related schematic . <Page 19> 91.07.03.
-Change R369,R20 from 10Kohm to @10Kohm . (Modify CKT&BOM)
-Change R373,R247 from @100Kohm to 100Kohm . (Modify CKT&BOM)
97.Modify DDR related resistors' val ue f or A TI r ec om men d . <Pa ge 12> 91. 07 .17 .
-Change R359,R360,R361,R501,R502,R503,R506,R507,R508 from 33ohm to 56ohm .
(Modify CKT&BOM)
-Change RP63,RP64,RP65 from 33ohm_8P4R_0804 to 56ohm_8P4R_0804 .
(Modify CKT&BOM)
98.Modify VREF_SYS related schematic to improve the noise issue for ATI recommend .
<Page 3> 91.07.18.
-Change C518 from 1UF_0603 to 0.047UF_0603 . (Modify CKT&BOM )
-Change C519 from 1UF_0603 to @1UF_0603 . (Modify CKT&BOM )
-Change C147 from 0.1UF to @0.1UF . (Modify CKT&BOM)
99.Modify NB_VREFSYS related schematic to improve the noise issue for ATI recommend .
<Page 6> 91.07.18.
-Change C533,C140 from 0.1UF to 0.047UF . (Modify CKT&B OM)
100.Modify SDCLK_NB _ EX T r e la te d s ch em at ic to im p ro ve th e c lo ck qu al it y fo r A T I r ec om me nd .
<Page 9,13> 91.07.18.
-Change C346 from 100PF to @100PF . (Modify CKT&BO M)
-Change R294 from 22ohm to 10ohm . (Modify CKT&BOM)
101.Modify LCD_DIGON r el at e d s ch em at ic to f ix th e w hi te sc r ee n i ss ue te mp or a ry . < P ag e 9 >
91.07.22.
-Change R531 from 10Kohm to @10Kohm . (Modify CKT&BOM)
-Change Q60 from 2N7002 to @2N7002 . (Modify CK T&BOM)
-Jump a wire from U3.D1 to Q60.1 . (REWORK)
Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(4)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
3
2
Date:Sheet
14, 2002
1
4547
of
0.3
Page 46
5
4
3
2
1
BFY26 B-TEST Modify <91.06.27.~91.07.29.
>
102.Modify CP UC L K r e la te d s ch e ma ti c f or q ua li t y i mp ro v ed . < Pa ge 13 > 91 .0 7. 22 .
-Change C201,C197 from @10PF to 5PF_0.25% . (Modify CK T and BOM)
103.Modify +RTCVCC rel at ed sc he ma ti c t o f i x t he po we r s ou r ce is su e t em po ra r y . <P ag e 2 7>
91.07.22.
DD
-Del R345(0ohm_0603) and jump a wire from R345.1 to D10.1 . (Modif y BOM and REWORK)
104.Modify PW R GD r el at ed s ch em at ic f or B -T E ST im pr o ve d t e mp or ar y . < P ag e 3 0> 91 .0 7. 22 .
-Jump the Q20.1's pin and connect Q20.1's pin to R224.1 . (REWORK)
106.Modify LCD_DIGON rel at ed s ch em at i c t o f ix t he wh it e s cr e en is s ue te mp o ra r y . <P ag e 9, 15 ,2 7>
91.07.22.
-Change Q60 from @2N7002 to 2N7002 . (Modify CK T&BOM)
-Cancel the wire from U3.D1 to Q60.1 . ( REWORK)
-Del R531 and redefine the Q60's related connection . (Modify CKT,BOM and Layout)
CC
-Change U12.4's connection from LVDS_BLON# to LCD_DIGON . (Modify CK T&Layout)
107.Modify HDD related s ch ema ti c f or C -T ES T i mp ro ve . < Pa ge 19 > 9 1.0 7. 23 .
-Change JP9.44's connection from +5VS to NC . (Modify CKT&Layout)
108.Modify ENE CardBus Ct r l I C r e la te d s ch ema t ic f o r n ew ver s io n p ha se in pr ep ar ed .
<Page 22> 91.07.23.
-Add R568(0ohm) between Q61.3 and Q61.1 . (Modify CKT,BOM and Layout)
-Change R538 from 100Kohm to @100Kohm . (Modify CKT&BOM)
-Change Q61 from 2N7002 to @2N7002 . (Modify CK T&BOM)
-Change R539 from 10Kohm to @10Kohm . (Modify CKT&BOM)
109.Modify CPUCLK related CA P va lu e f or q ua li t y i mp ro ve d . < Pa ge 13 > 9 1. 0 7. 23 .
-Change C201,C197 from 5PF_0.25% to 10PF . (Modify CKT& BOM)
110.Modify SDCLK_NB_EX T d a mp in g r es is t or 's va lu e f or q ua li ty im pr o ve d . <P ag e 13 > 9 1. 07 .2 3.
BB
-Change R282 from 51ohm to 39ohm . (Modify CKT& BOM)
111.Del REFCLK0_AC97 related signal net on M/B for EM I r eq ue st . <P ag e 1 3, 24 > 9 1. 07 .2 3.
-Del R278(@22ohm) and C181(@10PF) . (Modify CKT&Laout )
-Del REFCLK0_AC97 related signal net on M/B . (Modify CKT and Layout)
112.Modify m o de m r e la te d s c he ma ti c fo r EM I r e qu es t . < Pa ge 2 5> 91 .0 7. 2 3.
-Change C445,C449 from 220PF_3KV_1808 to @220PF_3KV_1808 . (Modify CKT and BOM )
113.Modify +RTCVCC relate d s ch em at ic to fi x t h e p ow er so ur ce is su e . < Pa ge 27 > 9 1. 07 .2 3.
-Add D39(RB751V) between U12.161 and K . (Modi fy CKT,BOM and Layout)
-Change R345 from 0ohm_0603 to @0ohm_0603 . (Modify CKT and BO M)
114.Modify ADP _I r el at ed sc h em at ic fo r cl ea r . < Pa ge 27 > 91 .0 7. 23 .
-Del ADP_I related signal net on M/B . (Modify CKT and Layout)
-Del R233(@2Mohm_0603) and C169(@0.22UF_0603) . (Modify CKT and Lay out)
AA
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
5
4
115.Modify ALi Chip PCIRST# r el at ed sc he ma ti c f o r v ol ta ge le ak ag e i ss ue fi x . <P a ge 16 > 9 1. 07 .2 3.
-Change the part from U31D(74LVC08) to U5(7SH08) and modify the r elated net connection .
(Modify CKT,BOM and Layout)
116.Modify PWRGD related schematic to make time delay meet spec. . <Page 13,30> 91.07.23.
-Del U31(74LVC08),R553(@0_0603),R223(@10K),R227(4.7K),C527(1UF_0603),R224(20K _0603),
C167(1UF_0603),R551(10K),R540(20K),C524(1UF_0603),R541(10K),R3 22(@0) ;
add U33(74LVC14),R576,R577(10K_0603),C537,C538(0.047UF_0603),Q64,Q65(MMBT2222A ),
R569,R572(4.7K_0603),C534,C535,C536(0.47UF_0603),R573,R574(20K_06 03),
R570,R571,R575(47_0603) and modify the related net connection . (Modify CK T,BOM and Layout)
117.Modify FERR related r es is t or 's va lu e . <P a ge 3> 91 .0 7. 23 .
-Change R530 from 75ohm to 33ohm . (Modify CKT and BOM )
118.Modify AMD_CPU_EMI_CLIP 's library for SMT process when C-T E ST . <P a g e 5 > 9 1 .07.23.
-Left PT2,PT3,PT4,PT5 only and update their PCBFootPrint and library . (Modif y CKT,BOM and
Layout)
119.Add TEST_CHIP on TOP/BOTTOM side for te st o n C -T E ST . < P ag e 1 8> 91. 07 .2 3.
-Add U34,U35(TEST_CHIP) ON TOP/BOTTOM SIDE . (Modify CKT&Layou t)
120.Modify CP UC L K r e la te d s ch e ma ti c f or q ua li t y i mp ro v ed . < Pa ge 13 > 91 .0 7. 24 .
-Change C201,C197 from 10PF to 5PF_0.25% . (Modify CKT and BOM)
121.Add J5 for CMOS r ef la sh us ed . < P ag e 2 7> 91 .0 7. 24 .
-Add J5 between K to GND . (Modify CKT&Layout)
122.Del the net 1394_PME# because the fu nc t io n d is ab le . < P ag e 2 1> 91 .0 7. 24 .
-Del the signal net 1394_PME# from U2.37 . (Modify CKT&Layou t)
123.Modify ATI N B c hi p C A L r e la te d s ch em at i c f or A TI re co m me nd . < Pa ge 6> 91 .0 7. 25 .
-Add C539,C540(0.01UF) from U3.A16 and U3.B16 to GND . (Modify CKT, BOM and Layout)
124.Modify FERR related r es is t or 's va lu e . <P a ge 3> 91 .0 7. 25 .
-Change R530 from 33ohm to 75ohm . (Modify CKT and BOM )
125.Modify PWRGD related schematic to make time delay meet spec. . <Page 30> 91.07.25.
-Modify Q20 and Q39 related connection . (Modify CKT and Layout)
-Del R570(47ohm_0603),R347(10Kohm),Q37(DTC124EK) . (Modify CKT,BOM and Layout)
126.Add some C AP f or SB q ua li ty . <P ag e 1 6> 91 .0 7. 25 .
-Add C541,C542,C543,C544(0.1UF) between +3VS and GND . (Mo dify CKT,BOM and Layout)
-Add C545,C546(0.1UF) between +5VS and GND . (Mo dify CKT,BOM and Layout)
127.Add ADP_I relate d s ch em at ic fo r Po we r te am re qu e st . < Pa ge 27 > 9 1. 07 .2 5.
-Add ADP_I related signal net on M/B . (Modify CKT and Layout)
-Add R233(2Mohm_0603) and C169(0.22UF_0603) . (Modify CKT and La yout)
128.Del CPU so c ke t r el at e d t es t p o in t r e la te d t o a vo i d p ow er no i se coupling . <Page 3> 91.07.26.
-Del TP6,TP7,TP8 . (Modify CKT&Layout)
129.Modify MVREF_DIM2 related re si st or s ' s iz e f or l ay ou t s pa ce . < P ag e 1 1> 91 .0 7. 26 .
-Change R464,R466 from @1K_1%_0603 to @1K_1% . (Modify CKT, BOM and Layout)
-Change R465 from 0ohm_0603 to 0ohm . (Modify CKT,BOM and La yout)
Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(5)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
3
2
Date:Sheet
14, 2002
1
4647
of
0.4
Page 47
5
4
3
2
1
BFY26 B-TEST Modify <91.06.27.~91.07.29.
>
130.Modify SADDINCLK# related schematic fo r Jas on r equ es t . <P ag e 3 > 9 1. 07. 29 .
-Change L20,L21 from NL252018T-010J to 0ohm_0805 . (Modify CKT and BOM)
131.Modify NB Clock Termination related schematic to meet chip loading timing with CPU .
<Page 9> 91.07.29.
DD
-Change R401,R402,R411,R407 from 10ohm to @10ohm . (Modify CKT and BO M)
132.Modify Power Good related schematic to meet timing request . <Page 30> 91.07.30.
-Change R216's connection from +2.5V to +2.5VS . (Mo dify CKT&Layout)
-Change R216 from 4.7Kohm to 1Kohm . (Modify CKT&BOM)
-Add R579(47Kohm) between NB_PWRGD and GND . (Modify CK T,BOM and Layout)
-Add R578(10Kohm) between PWRGD and GND . (Modify CKT,BOM and Layout)
133.Modify SB related schematic for power source . <Page 16> 91.07.30.
-Change U5.5s connection from +3VS to +3VALW . (Mod ify CKT&Layout)
C-TEST BOM EN1 R ELEASE
134.Modify Power Good related schematic to meet timing request . <Page 30> 91.07.30.
-Del R224(20Kohm_0603) and R225(10Kohm_0603) . (Modify CKT,BOM and Layout)
135.Modify EC_PCLK by-pass CAP. related for P C IC LK t im in g d el ay . < P ag e 1 3> 91 .0 8. 09 .
CC
-Change C208 from @10PF to 27PF . (Modify CKT a nd BOM)
136.Add PCIRST# by-pass CAP. . <P ag e 1 6> 91 .0 8. 09 .
-Add C547(100PF) between PCIRST# and GND . (Modify CKT,BOM and Layout)
137.Correct Q63(2N70 0 2 ) ' s c onnection . <Page 30> 91.08.09.
-Change Q63.1's connection from GND to R569.2 . (M odify CKT&Layout)
-Change Q63.3's connection from R569.2 to GND . (M odify CKT&Layout)
138.Del the net 1394_PME # f or s ch em at ic cl ea r . <P a ge 28 > 9 1. 08 .0 9.
-Del the net 1394_PME# . (Modify CKT&Layout)
139.Modify +2.5_A's by- p as s C A P. fo r ma te r ia l s av in g . <P a ge 4> 91 .0 8. 09 .
-Change C152 from 4.7UF_10V_0805 to @4.7UF_10V_0805 . (Modify CKT an d BOM)
140.Modify LED_YELP and LED1_GRNP's resistor value fo r SE D re qu es t . <P a ge 20 > 9 1. 08 .09 .
-Change R518,R492 from 200ohm_0603 to 560ohm_0603 . (Modify CKT and BOM)
BB
141.Modify External RT C r el at e d s ch em at ic fo r th e f un ct i on re mo ve d . < Pa ge 18 ,2 7> 91 .0 8. 09 .
-Change U32 from DS1685 to @DS1685 . (Modify CKT and BOM)
-Change X8 from 32.768KHZ_10PPM to @32.768KHZ_10PPM . (Modify CKT and BOM)
-Change D39 from RB751V to @RB751V . (Modify CKT and BO M)
-Change R345 from @0_0603 to 0_0603 . (Modify CK T and BOM)
142.Modify FSB_100/ 1 33# related schematic for the function removed . <Page 10,13> 91.08.11.
-Change R334 from 8.2Kohm to @8.2Kohm . (Modify CKT and BOM)
-Change Q3,Q4,Q5,Q6 from 2N7002 to @2N7002 . (Modify CKT and BOM)
-Change R3 from 100Kohm to @100Kohm . (Modify CKT and BOM)
-Change R4,R12 from 10Kohm to @10Kohm . (Modify CKT and BOM)
143.Change REFCLK1_NB voltage level from +3. 3 V to +1. 8 V to me e t ATI's SPEC . <Page 13>
91.08.11.
AA
-Change R272 from 33ohm to 75ohm . (Modify CKT and BOM )
-Change C172 from @10PF to 100ohm . (Modify CKT and BOM)<Next versi on will relayout to fix that>
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE
USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC.
5
4
144.Modify +RTCV C C r e la te d s ch em at i c f or c le ar . < P ag e 1 8> 91 .0 8. 11 .
-Change Q15 from MMBT3906 to @MMBT3906 . (Modify CKT and BOM)
-Change Q16 from 3904 to @3904 . (Modify CKT and BOM)
-Change D38 from @RB751V to RB751V . (Modify CKT and BO M)
-Change R158,R162 from 10K to @10K . (Modify CKT a nd BOM)
-Change R156 from 51K to @51K . (Modify CKT and BOM)
145.Modify DDR related schematic for quality improved . <Page 7,11,12> 91.08.12.
-Change R279,R285,R464 from @1K_1% to 1K_1% . (Modify CK T and BOM)
-Change R280,R533 from 0ohm_0603 to @0ohm_0603 . (Modify CKT and BO M)
-Change R465 from 0ohm to @0ohm . (Modify CKT and B OM)
-Change R466 from @1Kohm_1% to 866ohm_1% . (Modify CKT and B OM)
-Change R534 from @1Kohm_1%_0603 to 866ohm_1%_0603 . (Modify CKT and B OM)
-Change R532 from @1K_1%_0603 to 1K_1%_0603 . (Modify CK T and BOM)
-Change C235,C236,C237,C238,C239,C240,C245,C246,C247,C248,C258,C259,C260,C261,C262,
C263,C264,C265,C266,C267,C268,C269,C270 from 47PF to @47PF . (Modify CKT and BOM)
146.Modify ENE CB142 0 r el at ed s ch em at ic fo r E N E r e co mm en d . <P ag e 2 2> 91 .0 8. 12 .
-Change R479,R480,R485,R489 from 22Kohm to @22Kohm . (Modify CKT and BOM)
Compal Electronics, Inc.
Title
H/W2 EE Dept. PIR SHEET(6)
SizeDocument NumberRev
LA-1481 M/B
!"#, $%
3
2
Date:Sheet
14, 2002
1
4747
0.5
of
Page 48
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