Fujitsu MPC3045AH, MPC3065AH User Manual
MPC3045AH
MPC3065AH
DISK DRIVES
PRODUCT MANUAL
C141-E056-02EN
REVISION RECORD
Edition Date published Revised contents
01 May, 1998
02 Dec., 1998 Pages 1-4, 4-14, 5-9, 5-16, 5-30, 5-35, 5-37, 5-52 to 5-54, 5-63, 5-64, 5-69, 5-81, 6-8, 6-9 to 6-23
revised.
Specification No.: C141-E056-**EN
The contents of this manual is subject to
change without prior notice.
All Rights Reserved.
Copyright 1998 FUJITSU LIMITED
C141-E056-02EN i
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PREFACE
This manual describes the MPC3045AH/MPC3065AH, a 3.5-inch hard disk drive with a BUILT-IN
controller that is compatible with the ATA interface.
This manual explains, in detail, how to incorporate the hard disk drives into user systems.
This manual assumes that users have a basic knowledge of hard disk drives and their application in
computer systems.
This manual consists of the following six chapters:
Chapter 1 DEVICE OVERVIEW
Chapter 2 DEVICE CONFIGURATION
Chapter 3 INSTALLATION CONDITIONS
Chapter 4 THEORY OF DEVICE OPERATION
Chapter 5 INTERFACE
Chapter 6 OPERATIONS
In this manual, disk drives may be referred to as drives or devices.
C141-E056-01EN iii
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of
an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or
just a signal word.
The following are the alert signals and their meanings:
This indicates a hazarous situation likely to result in serious personal
injury if the user does not perform the procedure correctly.
This indicates a hazarous situation could result in personal injury if the
user does not perform the porocedure correctly.
This indicates a hazarous situation could result in minor or moderate
personal injury if the user does not perform the procedure correctly.
This alert signal also indicates that damages to the product or other
property, may occur if the user does not perform the procedure
correctly.
This indicates information that could help the user use the product more
efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space
precedes and follows the alert message to show where the alert message begins and ends. The
following is an example:
(Example)
IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-3 interface
The main alert messages in the text are also listed in the “Important Alert Items.”
iv C141-E056-01EN
LIABILITY EXCEPTION
"Disk drive defects" refers to defects that involve adjustment, repair, or replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or
mishandling, inappropriate operating environments, defects in the power supply or cable, problems of
the host system, or other causes outside the disk drive.
C141-E056-01EN v
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CONTENTS
page
CHAPTER 1 DEVICE OVERVIEW ................................................................................... 1 - 1
1.1 Features ..........................................................................................................................1 - 1
1.1.1 Functions and performance ................................................................ ............................ 1 - 1
1.1.2 Adaptability.................................................................................................................... 1 - 2
1.1.3 Interface.......................................................................................................................... 1 - 2
1.2 Device Specifications ..................................................................................................... 1 - 4
1.2.1 Specifications summary.................................................................................................. 1 - 4
1.2.2 Model and product number ............................................................................................ 1 - 5
1.3 Power Requirements....................................................................................................... 1 - 5
1.4 Environmental Specifications......................................................................................... 1 - 8
1.5 Acoustic Noise ............................................................................................................... 1 - 8
1.6 Shock and Vibration.......................................................................................................1 - 9
1.7 Reliability.......................................................................................................................1 - 9
1.8 Error Rate ....................................................................................................................... 1 - 10
1.9 Media Defects................................................................ .................................................1 - 10
CHAPTER 2 DEVICE CONFIGURATION ....................................................................... 2 - 1
2.1 Device Configuration ................................................................ .....................................2 - 1
2.2 System Configuration..................................................................................................... 2 - 3
2.2.1 ATA interface.................................................................................................................2 - 3
2.2.2 1 drive connection..........................................................................................................2 - 3
2.2.3 2 drives connection......................................................................................................... 2 - 4
CHAPTER 3 INSTALLATION CONDITIONS ................................................................. 3 - 1
3.1 Dimensions..................................................................................................................... 3 - 1
3.2 Mounting........................................................................................................................3 - 3
3.3 Cable Connections................................................................ ..........................................3 - 7
3.3.1 Device connector............................................................................................................3 - 7
3.3.2 Cable connector specifications ....................................................................................... 3 - 8
3.3.3 Device connection..........................................................................................................3 - 8
3.3.4 Power supply connector (CN1) ................................................................ ...................... 3 - 9
3.4 Jumper Settings .............................................................................................................. 3 - 9
C141-E056-02EN vii
3.4.1 Location of setting jumpers............................................................................................3 - 9
3.4.2 Factory default setting....................................................................................................3 - 10
3.4.3 Jumper configuration................................................................ ......................................3 - 10
CHAPTER 4 THEORY OF DEVICE OPERATION .........................................................4 - 1
4.1 Outline............................................................................................................................ 4 - 1
4.2 Subassemblies ................................................................................................................4 - 1
4.2.1 Disk................................................................................................................................4 - 1
4.2.2 Head ............................................................................................................................... 4 - 2
4.2.3 Spindle............................................................................................................................ 4 - 2
4.2.4 Actuator.......................................................................................................................... 4 - 2
4.2.5 Air filter.......................................................................................................................... 4 - 2
4.3 Circuit Configuration...................................................................................................... 4 - 3
4.4 Power-on Sequence ........................................................................................................ 4 - 5
4.5 Self-calibration ............................................................................................................... 4 - 7
4.5.1 Self-calibration contents.................................................................................................4 - 7
4.5.2 Execution timing of self-calibration ............................................................................... 4 - 8
4.5.3 Command processing during self-calibration.................................................................4 - 8
4.6 Read/write Circuit........................................................................................................... 4 - 9
4.6.1 Read/write preamplifier (PreAMP)................................................................................. 4 - 9
4.6.2 Write circuit................................................................ ....................................................4 - 9
4.6.3 Read circuit..................................................................................................................... 4 - 11
4.6.4 Time base generator circuit............................................................................................. 4 - 13
4.7 Servo Control ................................................................ .................................................4 - 14
4.7.1 Servo control circuit ....................................................................................................... 4 - 15
4.7.2 Data-surface servo format...............................................................................................4 - 18
4.7.3 Servo frame format......................................................................................................... 4 - 18
4.7.4 Actuator motor control ................................................................................................... 4 - 19
4.7.5 Spindle motor control..................................................................................................... 4 - 20
CHAPTER 5 INTERFACE................................................................................................... 5 - 1
5.1 Physical Interface ........................................................................................................... 5 - 2
5.1.1 Interface signals.............................................................................................................. 5 - 2
5.1.2 Signal assignment on the connector ............................................................................... 5 - 3
5.2 Logical Interface............................................................................................................. 5 - 6
5.2.1 I/O registers....................................................................................................................5 - 6
C141-E056-02ENviii
5.2.2 Command block registers............................................................................................... 5 - 8
5.2.3 Control block registers ................................................................ ...................................5 - 13
5.3 Host Commands.............................................................................................................5 - 13
5.3.1 Command code and parameters......................................................................................5 - 14
5.3.2 Command descriptions...................................................................................................5 - 16
5.3.3 Error posting................................................................ ...................................................5 - 63
5.4 Command Protocol......................................................................................................... 5 - 64
5.4.1 Data transferring commands from device to host...........................................................5 - 64
5.4.2 Data transferring commands from host to device...........................................................5 - 66
5.4.3 Commands without data transfer.................................................................................... 5 - 68
5.4.4 Other commands............................................................................................................. 5 - 69
5.4.5 DMA data transfer commands........................................................................................ 5 - 69
5.5 Ultra DMA feature set .................................................................................................... 5 - 71
5.5.1 Overview........................................................................................................................5 - 71
5.5.2 Phases of operation................................................................ .........................................5 - 72
5.5.3 Ultra DMA data in commands........................................................................................ 5 - 72
5.5.3.1 Initiating an Ultra DMA data in burst.............................................................................5 - 72
5.5.3.2 The data in transfer................................................................ .........................................5 - 73
5.5.3.3 Pausing an Ultra DMA data in burst............................................................................... 5 - 73
5.5.3.4 Terminating an Ultra DMA data in burst........................................................................5 - 74
5.5.4 Ultra DMA data out commands...................................................................................... 5 - 76
5.5.4.1 Initiating an Ultra DMA data out burst...........................................................................5 - 76
5.5.4.2 The data out transfer................................................................ .......................................5 - 77
5.5.4.3 Pausing an Ultra DMA data out burst............................................................................. 5 - 77
5.5.4.4 Terminating an Ultra DMA data out burst......................................................................5 - 78
5.5.5 Ultra DMA CRC rules.................................................................................................... 5 - 80
5.5.6 Series termination required for Ultra DMA....................................................................5 - 81
5.6 Timing............................................................................................................................5 - 82
5.6.1 PIO data transfer............................................................................................................. 5 - 82
5.6.2 Multiword data transfer .................................................................................................. 5 - 83
5.6.3 Ultra DMA data transfer................................................................ .................................5 - 84
5.6.3.1 Initiating an Ultra DMA data in burst.............................................................................5 - 84
5.6.3.2 Ultra DMA data burst timing requirements....................................................................5 - 85
5.6.3.3 Sustained Ultra DMA data in burst................................................................................. 5 - 87
5.6.3.4 Host pausing an Ultra DMA data in burst ...................................................................... 5 - 88
5.6.3.5 Device terminating an Ultra DMA data in burst............................................................. 5 - 89
C141-E056-02EN ix
5.6.3.6 Host terminating an Ultra DMA data in burst................................................................. 5 - 90
5.6.3.7 Initiating an Ultra DMA data out burst...........................................................................5 - 91
5.6.3.8 Sustained Ultra DMA data out burst............................................................................... 5 - 92
5.6.3.9 Device pausing an Ultra DMA data out burst.................................................................5 - 93
5.6.3.10Host terminating an Ultra DMA data out burst...............................................................5 - 94
5.6.3.11Device terminating an Ultra DMA data in burst............................................................. 5 - 95
5.6.4 Power-on and reset ......................................................................................................... 5 - 96
CHAPTER 6 OPERATIONS................................................................................................6 - 1
6.1 Device Response to the Reset................................................................ ......................... 6 - 1
6.1.1 Response to power-on .................................................................................................... 6 - 2
6.1.2 Response to hardware reset ................................................................ ............................ 6 - 3
6.1.3 Response to software reset.............................................................................................. 6 - 4
6.1.4 Response to diagnostic command ................................................................ .................. 6 - 5
6.2 Address Translation........................................................................................................ 6 - 6
6.2.1 Default parameters..........................................................................................................6 - 6
6.2.2 Logical address............................................................................................................... 6 - 7
6.3 Power Save.....................................................................................................................6 - 8
6.3.1 Power save mode............................................................................................................ 6 - 8
6.3.2 Power commands ................................................................ ...........................................6 - 10
6.4 Defect Management........................................................................................................ 6 - 10
6.4.1 Spare area ....................................................................................................................... 6 - 11
6.4.2 Alternating defective sectors ................................................................ .......................... 6 - 11
6.5 Read-Ahead Cache.........................................................................................................6 - 14
6.5.1 Data buffer configuration ...............................................................................................6 - 14
6.5.2 Caching operation........................................................................................................... 6 - 15
6.5.3 Usage of read segment.................................................................................................... 6 - 16
6.6 Write Cache.................................................................................................................... 6 - 22
C141-E056-02ENx
FIGURES
page
1.1 Current fluctuation (Typ.) when power is turned on....................................................... 1 - 7
2.1 Disk drive outerview ................................................................ ......................................2 - 1
2.2 Configuration of disk media heads................................................................................. 2 - 2
2.3 1 drive system configuration .......................................................................................... 2 - 3
2.4 2 drives configuration..................................................................................................... 2 - 4
3.1 Dimensions..................................................................................................................... 3 - 2
3.2 Orientation...................................................................................................................... 3 - 3
3.3 Limitation of side-mounting........................................................................................... 3 - 4
3.4 Mounting frame structure...............................................................................................3 - 4
3.5 Surface temperature measurement points ....................................................................... 3 - 5
3.6 Service area .................................................................................................................... 3 - 6
3.7 Connector locations........................................................................................................3 - 7
3.8 Cable connections........................................................................................................... 3 - 8
3.9 Power supply connector pins (CN1)............................................................................... 3 - 9
3.10 Jumper location .............................................................................................................. 3 - 9
3.11 Factory default setting....................................................................................................3 - 10
3.12 Jumper setting of master or slave device........................................................................3 - 10
3.13 Jumper setting of Cable Select ................................................................ ....................... 3 - 11
3.14 Example (1) of Cable Select...........................................................................................3 - 11
3.15 Example (2) of Cable Select...........................................................................................3 - 11
4.1 Head structure................................................................ .................................................4 - 2
4.2 MPC30xxAH Block diagram ......................................................................................... 4 - 4
4.3 Power-on operation sequence.........................................................................................4 - 6
4.4 Read/write circuit block diagram.................................................................................... 4 - 10
4.5 Frequency characteristic of programmable filter ............................................................ 4 - 11
4.6 PR4 signal transfer ......................................................................................................... 4 - 12
4.7 Block diagram of servo control circuit ........................................................................... 4 - 15
4.8 Physical sector servo configuration on disk surface ....................................................... 4 - 16
4.9 Servo frame format.........................................................................................................4 - 18
5.1 Execution example of READ MULTIPLE command .................................................... 5 - 19
5.2 Read Sector(s) command protocol..................................................................................5 - 65
5.3 Protocol for command abort...........................................................................................5 - 66
C141-E056-02EN xi
5.4 WRITE SECTOR(S) command protocol........................................................................ 5 - 67
5.5 Protocol for the command execution without data transfer ............................................ 5 - 68
5.6 Normal DMA data transfer.............................................................................................5 - 70
5.7 Ultra DMA termination with pull-up or pull-down ........................................................ 5 - 81
5.8 PIO data transfer timing.................................................................................................. 5 - 82
5.9 Multiword DMA data transfer timing (mode 2) ............................................................. 5 - 83
5.10 Initiating an Ultra DMA data in burst.............................................................................5 - 84
5.11 Sustained Ultra DMA data in burst................................................................................. 5 - 87
5.12 Host pausing an Ultra DMA data in burst ...................................................................... 5 - 88
5.13 Device terminating an Ultra DMA data in burst............................................................. 5 - 89
5.14 Host terminating an Ultra DMA data in burst................................................................. 5 - 90
5.15 Initiating an Ultra DMA data out burst...........................................................................5 - 91
5.16 Sustained Ultra DMA data out burst............................................................................... 5 - 92
5.17 Device pausing an Ultra DMA data out burst.................................................................5 - 93
5.18 Host terminating an Ultra DMA data out burst............................................................... 5 - 94
5.19 Device terminating an Ultra DMA data out burst........................................................... 5 - 95
5.20 Power-on Reset Timing..................................................................................................5 - 96
6.1 Response to power-on .................................................................................................... 6 - 2
6.2 Response to hardware reset ................................................................ ............................ 6 - 3
6.3 Response to software reset.............................................................................................. 6 - 4
6.4 Response to diagnostic command ................................................................ .................. 6 - 5
6.5 Address translation (example in CHS mode).................................................................. 6 - 7
6.6 Address translation (example in LBA mode) .................................................................6 - 8
6.7 Sector slip processing.....................................................................................................6 - 11
6.8 Track slip processing......................................................................................................6 - 12
6.9 Automatic Alternate assignment..................................................................................... 6 - 13
6.10 Data buffer configuration ...............................................................................................6 - 14
C141-E056-02ENxii
TABLES
page
1.1 Specifications .................................................................................................................1 - 4
1.2 Model names and product numbers................................................................................ 1 - 5
1.3 Current and power dissipation........................................................................................ 1 - 6
1.4 Environmental specifications.......................................................................................... 1 - 8
1.5 Acoustic noise specification ........................................................................................... 1 - 8
1.6 Shock and vibration specification...................................................................................1 - 9
3.1 Surface temperature measurement points and standard values.......................................3 - 5
3.2 Cable connector specifications ....................................................................................... 3 - 8
4.1 Self-calibration execution timechart...............................................................................4 - 8
4.2 Write precompensation algorithm ................................................................ .................. 4 - 9
4.3 Write clock frequency and transfer rate of each zone.....................................................4 - 14
5.1 Interface signals.............................................................................................................. 5 - 2
5.2 Signal assignment on the interface connector................................................................. 5 - 3
5.3 I/O registers .................................................................................................................... 5 - 7
5.4 Command code and parameters......................................................................................5 - 14
5.5 Information to be read by IDENTIFY DEVICE command ............................................ 5 - 30
5.6 Features register values and settable modes ...................................................................5 - 34
5.7 Diagnostic code..............................................................................................................5 - 37
5.8 Features Register values (subcommands) and functions ................................................ 5 - 48
5.9 Format of device attribute value data.............................................................................. 5 - 50
5.10 Format of insurance failure threshold value data............................................................ 5 - 51
5.11 Contents of security password........................................................................................ 5 - 55
5.12 Contents of SECURITY SET PASSWORD data ........................................................... 5 - 60
5.13 Relationship between combination of Identifier and Security level,
and operation of the lock function.................................................................................. 5 - 60
5.14 Command code and parameters......................................................................................5 - 63
5.15 Recommended series termination for Ultra DMA..........................................................5 - 81
5.16 Ultra DMA data burst timing requirements....................................................................5 - 85
6.1 Default parameters.......................................................................................................... 6 - 6
C141-E056-02EN xiii
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CHAPTER 1 DEVICE OVERVIEW
1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
Overview and features are described in this chapter, and specifications and power requirement are
described.
The MPC3045AH, MPC3065AH is a 3.5-inch hard disk drive with a built-in ATA controller. The disk
drive is compact and reliable.
1.1 Features
1.1.1 Functions and performance
(1) Compact
The disk has 1, 2 or 3 disks of 95 mm (3.5 inches) diameter, and its height is 25.4 mm (1
inch).
(2) Large capacity
The disk drive can record up to 2,170 MB (formatted) on one disk using the 8/9 PRML
recording method and 15 recording zone technology. The MPC3045AH and MPC3065AH
have a formatted capacity of 4,551 MB and 6,510 MB respectively.
(3) High-speed Transfer rate
The disk drive has an internal data rate up to 19.18 MB/s. The disk drive supports an external
data rate up to 16.7 MB/s or 33.3 MB/s (ultra DMA mode).
C141-E056-01EN 1 - 1
(4) Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly increases the
positioning speed. The average positioning time is 9 ms (at read).
1.1.2 Adaptability
(1) Power save mode
The power save mode feature for idle operation, stand by and sleep modes makes the disk
drive ideal for applications where power consumption is a factor.
(2) Wide temperature range
The disk drive can be used over a wide temperature range (5°C to 55°C).
(3) Low noise and vibration
In Ready status, the noise of the disk drive is only about 3.9 bels (MPC3065AH, Typical
Sound Power per ISO7779 and ISO9296).
1.1.3 Interface
(1) Connection to interface
With the built-in ATA interface controller, the disk drive can be connected to an ATA
interface of a personal computer.
(2) 256-KB data buffer
The disk drive uses a 512-KB data buffer to transfer data between the host and the disk media.
In combination with the read-ahead cache system described in item (3) and the write cache
described in item (6), the buffer contributes to efficient I/O processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the subsequent
data block and writes it to the data buffer (read ahead operation). This cache system enables
fast data access. The next disk read command would normally cause another disk access.
But, if the read ahead data corresponds to the data requested by the next read command, the
data in the buffer can be transferred instead.
(4) Master/slave
The disk drive can be connected to ATA interface as daisy chain configuration. Drive 0 is a
master device, drive 1 is a slave device.
C141-E056-01EN1 - 2
(5) Error correction and retry by ECC
If a recoverable error occurs, the disk drive itself attempts error recovery. The 24-byte ECC
has improved buffer error correction for correctable data errors.
(6) Write cache
When the disk drive receives a write command, the disk drive posts the command completion
at completion of transferring data to the data buffer completion of writing to the disk media.
This feature reduces the access time at writing.
C141-E056-01EN 1 - 3
1.2 Device Specifications
1.2.1 Specifications summary
Table 1.1 shows the specifications of the disk drive.
Formatted Capacity (*1) 4551.96 MB 6510.55 MB
Number of Heads 4 6
Number of Cylinders
(User + Alternate & SA)
Bytes per Sector 512
Recording Method 8/9 PRML
Track Density 11,000 TPI
Bit Density 162,754 BPI
Rotational Speed 7,200 rpm ± 0.5%
Average Latency 4.17 ms
Positioning time
• Minimum
• Average
• Maximum
Start/Stop time
• Start (0 rpm to Drive
Read)
• Stop (at Power Down)
Interface ATA–3
Data Transfer Rate
• To/From Media 12.65 to 19.18 MB/s
• To/From Host 16.7 MB/s Max. (burst PIO mode 4, burst DMA mode
Data buffer 512 KB
Physical Dimensions
(Height × Width × Depth)
Weight 600 g
*1: Capacity under the LBA mode and the CHS mode.
Under the CHS mode (normal BIOS specification), formatted capacity, number of
cylinders, number of heads, and number of sectors are as follows.
Table 1.1 Specifications
MPC3045AH MPC3065AH
10,424 + 83
2.0 ms typical
(Read) 9 ms typical, (Write) 10 ms typical
(Read) 18 ms typical, (Write) 19 ms typical
Typical: 8 sec., Maximum: 16 sec.
Typical: 20 sec.,Maximum: 30 sec.
(Maximum Cable length: 0.46 m)
2),
33.3 MB/s Max. (burst ultra DMA mode 2)
26.1 mm max. × 101.6 mm × 146.0 mm
(1.03” max. × 4.0” × 5.75”)
Model Formatted Capacity No. of Cylinder No. of Heads No. of Sectors
MPC3045AH 4551.96 9,408 15 63
MPC3065AH 6510.55 13,456 15 63
C141-E056-02EN1 - 4
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers.
Table 1.2 Model names and product numbers
Model Name Capacity
(user area)
MPC3045AH 4551.96 No. 6-32UNC CA01742-B641
MPC3065AH 6510.55 No. 6-32UNC CA01742-B661
1.3 Power Requirements
(1) Input Voltage
• + 5 V ±5 %
• + 12 V ±8 %
(2) Ripple
+12 V +5 V
Maximum 200 mV (peak to peak) 100 mV (peak to peak)
Frequency DC to 1 MHz DC to 1 MHz
Mounting
Screw
Order No. Others
C141-E056-01EN 1 - 5
(3) Current Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation.
Table 1.3 Current and power dissipation
Mode of
Operation
Model All Models All Models All Models
Spin up 1300
Idle (Ready) (*3) 300 380 5.50
R/W (On Track) (*4) 300 430 5.75
Seek (Random) (*5) 510 430 8.27
Standby 4 150 0.8
Sleep 4 150 0.8
Typical RMS current (*1) [mA]
+12 V +5 V
500
1500 peak
600 peak
Typical Power (*2) [watts]
18.1
*1 Current is typical rms except for spin up.
*2 Power requirements reflect nominal values for +12V and +5V power.
*3 Idle mode is in effect when the drive is not reading, writing, seeking, or executing any
commands. A portion of the R/W circuitry is powered down, the spindle motor is up to
speed and the Drive ready condition exists.
*4 R/W mode is defined as 50% read operations and 50% write operations on a single
physical track.
*5 Seek mode is defined as continuous random seek operations with minimum controller
delay.
C141-E056-01EN1 - 6
(4) Current fluctuation (Typ.) when power is turned on
Note:
Maximum current is 1.5 A and is continuance is 1.5 seconds
Figure 1.1 Current fluctuation (Typ.) when power is turned on
(5) Power on/off sequence
The voltage detector circuit monitors +5 V and +12 V. The circuit does not allow a write
signal if either voltage is abnormal. This prevents data from being destroyed and eliminates
the need to be concerned with the power on/off sequence.
C141-E056-01EN 1 - 7
1.4 Environmental Specifications
Table 1.4 lists the environmental specifications.
Table 1.4 Environmental specifications
Temperature
• Operating
• Non-operating
• Thermal Gradient
Humidity
• Operating
• Non-operating
• Maximum Wet Bulb
Altitude (relative to sea level)
• Operating
• Non-operating
1.5 Acoustic Noise
5°C to 55°C (ambient)
5°C to 60°C (disk enclosure surface)
–40°C to 60°C
20°C/h or less
8% to 80%RH (Non-condensing)
5% to 85%RH (Non-condensing)
29°C
–60 to 3,000 m (–200 to 10,000 ft)
–60 to 12,000 m (–200 to 40,000 ft)
Table 1.5 lists the acoustic noise specification.
Table 1.5 Acoustic noise specification
Sound Power
per ISO 7779 and ISO9296
(Typical at 1m)
Sound Pressure
(Typical at 1m)
Idle mode
(DRIVE READY)
Seek mode (Random) 4.4 bels
Idle mode
(DRIVE READY)
Seek mode (Random) 40 dBA
Model
MPC3045AH
MPC3065AH
3.9 bels
34 dBA
C141-E056-01EN1 - 8
1.6 Shock and Vibration
Table 1.6 lists the shock and vibration specification.
Table 1.6 Shock and vibration specification
Vibration (swept sine, one octave per minute)
• Operating
• Non-operating
Shock (half-sine pulse, 11 ms duration)
• Operating
• Non-operating
1.7 Reliability
(1) Mean time between failures (MTBF)
The mean time between failures (MTBF) is 500,000 H or more (operation: 24 hours/day, 7
days/week).
5 to 300 Hz, 0.5G-0-peak
(without non-recovered errors)
5 to 400 Hz, 4G-0-peak (no damage)
10G (without non-recovered errors)
75G (no damage)
This does not include failures occurring during the first three months after installation.
MTBF is defined as follows:
MTBF= (H)
"Disk drive defects" refers to defects that involve repair, readjustment, or replacement. Disk
drive defects do not include failures caused by external factors, such as damage caused by
handling, inappropriate operating environments, defects in the power supply host system, or
interface cable.
(2) Mean time to repair (MTTR)
The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance
staff member.
(3) Service life
In situations where management and handling are correct, the disk drive requires no overhaul
for five years when the DE surface temperature is less than 48°C. When the DE surface
temperature exceeds 48°C, the disk drives requires no overhaul for five years or 20,000 hours
of operation, whichever occurs first. Refer to item (3) in Subsection 3.2 for the measurement
point of the DE surface temperature.
Total operation time in all fields
number of device failure in all fields
C141-E056-01EN 1 - 9
(4) Data assurance in the event of power failure
Except for the data block being written to, the data on the disk media is assured in the event of
any power supply abnormalities. This does not include power supply abnormalities during
disk media initialization (formatting) or processing of defects (alternative block assignment).
1.8 Error Rate
Known defects, for which alternative blocks can be assigned, are not included in the error rate
count below. It is assumed that the data blocks to be accessed are evenly distributed on the
disk media.
(1) Unrecoverable read error
Read errors that cannot be recovered by maximum 126 times read retries without user's retry
and ECC corrections shall occur no more than 10 times when reading data of 10
retries are executed according to the disk drive's error recovery procedure, and include read
retries accompanying head offset operations.
(2) Positioning error
Positioning (seek) errors that can be recovered by one retry shall occur no more than 10 times
in 107 seek operations.
1.9 Media Defects
Defective sectors are replaced with alternates when the disk is formatted prior to shipment
from the factory (low level format). Thus, the host sees a defect-free device.
Alternate sectors are automatically accessed by the disk drive. The user need not be concerned
with access to alternate sectors.
Chapter 6 describes the low level format at shipping.
15
bits. Read
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CHAPTER 2 DEVICE CONFIGURATION
2.1 Device Configuration
2.2 System Configuration
2.1 Device Configuration
Figure 2.1 shows the disk drive. The disk drive consists of a disk enclosure (DE), read/write
preamplifier, and controller PCA. The disk enclosure contains the disk media, heads, spindle
motors actuators, and a circulating air filter.
Figure 2.1 Disk drive outerview
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(1) Disk
The outer diameter of the disk is 95 mm. The inner diameter is 25 mm. The number of disks
used varies with the model, as described below. The disks are rated at over 40,000 start/stop
operations.
MPC3045AH: 2 disks
MPC3065AH: 3 disks
(2) Head
The heads are of the contact start/stop (CSS) type. The head touches the disk surface while the
disk is not rotating and automatically lifts when the disk starts.
Figure 2.2 illustrates the configuration of the disks and heads of each model. In the disk
surface, servo information necessary for controlling positioning and read/write and user data
are written. Numerals 0 to 5 indicate read/write heads.
Spindle
Actuator
MPC3065AH ModelMPC3045AH Model
Spindle
Actuator
3
2
1
0
(3) Spindle motor
The disks are rotated by a direct drive Hall-less DC motor.
(4) Actuator
The actuator uses a revolving voice coil motor (VCM) structure which consumes low power
and generates very little heat. The head assembly at the tip of the actuator arm is controlled
and positioned by feedback of the servo information read by the read/write head. If the power
is not on or if the spindle motor is stopped, the head assembly stays in the specific CSS zone
on the disk and is fixed by a mechanical lock.
5
4
3
2
1
0
Figure 2.2 Configuration of disk media heads
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(5) Air circulation system
The disk enclosure (DE) is sealed to prevent dust and dirt from entering. The disk enclosure
features a closed loop air circulation system that relies on the blower effect of the rotating
disk. This system continuously circulates the air through the recirculation filter to maintain
the cleanliness of the air in the disk enclosure.
(6) Read/write circuit
The read/write circuit uses a LSI chip for the read/write preamplifier. It improves data
reliability by preventing errors caused by external noise.
(7) Controller circuit
The controller circuit consists of an LSI chip to improve reliability. The high-speed
microprocessor unit (MPU) achieves a high-performance AT controller.
2.2 System Configuration
2.2.1 ATA interface
Figures 2.3 and 2.4 show the ATA interface system configuration. The drive has a 40-pin PC
AT interface connector and supports the PIO transfer till 16.7 MB/s (ATA-3, Mode 4), the
DMA transfer till 16.7 MB/s (ATA-3, Multiword mode 2), and the ultra DMA transfer till 33.3
MB/s (ATA-4, Ultra DMA mode 2).
2.2.2 1 drive connection
Host
AT bus
(Host interface)
HA
(Host adaptor)
ATA interface
Figure 2.3 1 drive system configuration
Disk drive
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2.2.3 2 drives connection
Host
HA
(Host adaptor)
AT bus
(Host interface)
ATA interface
Note:
When the drive that is not conformed to ATA is connected to the disk drive is above
configuration, the operation is not guaranteed.
Figure 2.4 2 drives configuration
IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-3 interface.
Disk drive #0
Disk drive #1
At high speed data transfer (PIO mode 3, mode 4, DMA mode 2 or
ultra DMA mode 2), occurrence of ringing or crosstalk of the signal
lines (AT bus) between the HA and the disk drive may be a great
cause of the obstruction of system reliability. Thus, it is necessary
that the capacitance of the signal lines including the HA and cable
does not exceed the ATA-3 and ATA-4 standard, and the cable
length between the HA and the disk drive should be as short as
possible.
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CHAPTER 3 INSTALLATION CONDITIONS
3.1 Dimensions
3.2 Mounting
3.3 Cable Connections
3.4 Jumper Settings
3.1 Dimensions
Figure 3.1 illustrates the dimensions of the disk drive and positions of the mounting screw
holes. All dimensions are in mm.
C141-E056-01EN 3 - 1
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