Fujitsu MPA3043AT, MPA3017AT, MPA3052AT, MPA3035AT, MPA3026AT User Manual
MPA3017AT
MPA3026AT
MPA3035AT
MPA3043AT
MPA3052AT
DISK DRIVES
PRODUCT MANUAL
C141-E034-02EN
REVISION RECORD
Edition Date published Revised contents
01 Jan., 1997
02 August, 1997
Specification No.: C141-E034-**EN
The contents of this manual is subject to change
without prior notice.
All Rights Reserved.
Copyright
1997 FUJITSU LIMITED
C141-E034-02EN i
PREFACE
This manual describes the MPA3017AT/MPA3026AT/MPA3035AT/MPA3043AT/MPA3052AT, a
3.5-inch hard disk drive with a BUILT-IN controller that is compatible with the ATA interface.
This manual explains, in detail, how to incorporate the hard disk drives into user systems.
This manual assumes that users have a basic knowledge of hard disk drives and their application in
computer systems.
This manual consists of the following six chapters:
Chapter 1 DEVICE OVERVIEW
Chapter 2 DEVICE CONFIGURATION
Chapter 3 INSTALLATION CONDITIONS
Chapter 4 THEORY OF DEVICE OPERATION
Chapter 5 INTERFACE
Chapter 6 OPERATIONS
Chapter 7 MISCELLANEOUS
In this manual, disk drives may be referred to as drives or devices.
C141-E034-02EN iii
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of an
alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a
signal word.
The following are the alert signals and their meanings:
This indicates a hazarous situation likely to result in serious personal
injury if the user does not perform the procedure correctly.
This indicates a hazarous situation could result in personal injury if the
user does not perform the porocedure correctly.
This indicates a hazarous situation could result in minor or moderate
personal injury if the user does not perform the procedure correctly. This
alert signal also indicates that damages to the product or other property,
may occur if the user does not perform the procedure correctly.
This indicates information that could help the user use the product more
efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space
precedes and follows the alert message to show where the alert message begins and ends. The following is
an example:
(Example)
IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-3 interface
The main alert messages in the text are also listed in the “Important Alert Items.”
iv C141-E034-02EN
LIABILITY EXCEPTION
"Disk drive defects" refers to defects that involve adjustment, repair, or replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or
mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the
host system, or other causes outside the disk drive.
C141-E034-02EN v
CONTENTS
page
CHAPTER 1 DEVICE OVERVIEW
1.1 Features.................................................................................................................................1 - 1
1.1.1 Functions and performance................................................................................................... 1 - 1
1.1.2 Adaptability ..........................................................................................................................1 - 2
1.1.3 Interface................................................................................................................................ 1 - 2
1.2 Device Specifications ........................................................................................................... 1 - 4
1.2.1 Specifications summary........................................................................................................ 1 - 4
1.2.2 Model and product number................................................................................................... 1 - 5
1.3 Power Requirements.............................................................................................................1 - 5
1.4 Environmental Specifications...............................................................................................1 - 8
1.5 Acoustic Noise...................................................................................................................... 1 - 8
1.6 Shock and Vibration............................................................................................................. 1 - 9
1.7 Reliability............................................................................................................................. 1 - 9
1.8 Error Rate.............................................................................................................................1 - 10
1.9 Media Defects....................................................................................................................... 1 - 10
CHAPTER 2 DEVICE CONFIGURATION
......................................................................................... 1 - 1
............................................................................. 2 - 1
2.1 Device Configuration............................................................................................................2 - 1
2.2 System Configuration ........................................................................................................... 2 - 4
2.2.1 ATA interface....................................................................................................................... 2 - 4
2.2.2 1 drive connection ................................................................................................................ 2 - 4
2.2.3 2 drives connection............................................................................................................... 2 - 5
CHAPTER 3 INSTALLATION CONDITIONS
3.1 Dimensions........................................................................................................................... 3 - 1
3.2 Mounting ..............................................................................................................................3 - 3
3.3 Cable Connections................................................................................................................3 - 7
3.3.1 Device connector..................................................................................................................3 - 7
3.3.2 Cable connector specifications .............................................................................................3 - 8
3.3.3 Device connection ................................................................................................................ 3 - 8
3.3.4 Power supply connector (CN1)............................................................................................. 3 - 9
3.4 Jumper Settings.....................................................................................................................3 - 9
....................................................................... 3 - 1
C141-E034-02EN vii
3.4.1 Location of setting jumpers .................................................................................................. 3 - 9
3.4.2 Factory default setting .......................................................................................................... 3 - 10
3.4.3 Jumper configuration............................................................................................................ 3 - 10
CHAPTER 4 THEORY OF DEVICE OPERATION............................................................... 4 - 1
4.1 Outline.................................................................................................................................. 4 - 1
4.2 Subassemblies....................................................................................................................... 4 - 1
4.2.1 Disk....................................................................................................................................... 4 - 1
4.2.2 Head...................................................................................................................................... 4 - 2
4.2.3 Spindle.................................................................................................................................. 4 - 3
4.2.4 Actuator................................................................................................................................4 - 3
4.2.5 Air filter................................................................................................................................ 4 - 3
4.3 Circuit Configuration............................................................................................................ 4 - 4
4.4 Power-on Sequence ..............................................................................................................4 - 6
4.5 Self-calibration .....................................................................................................................4 - 8
4.5.1 Self-calibration contents ....................................................................................................... 4 - 8
4.5.2 Execution timing of self-calibration......................................................................................4 - 9
4.5.3 Command processing during self-calibration........................................................................ 4 - 9
4.6 Read/write Circuit.................................................................................................................4 - 10
4.6.1 Read/write preamplifier (PreAMP)....................................................................................... 4 - 10
4.6.2 Write circuit.......................................................................................................................... 4 - 10
4.6.3 Read circuit........................................................................................................................... 4 - 12
4.6.4 Time base generator circuit...................................................................................................4 - 14
4.7 Servo Control........................................................................................................................4 - 15
4.7.1 Servo control circuit ............................................................................................................. 4 - 16
4.7.2 Data-surface servo format..................................................................................................... 4 - 19
4.7.3 Servo frame format............................................................................................................... 4 - 19
4.7.4 Actuator motor control ......................................................................................................... 4 - 20
4.7.5 Spindle motor control...........................................................................................................4 - 21
CHAPTER 5 INTERFACE ........................................................................................................ 5 - 1
5.1 Physical Interface.................................................................................................................. 5 - 2
5.1.1 Interface signals.................................................................................................................... 5 - 2
5.1.2 Signal assignment on the connector...................................................................................... 5 - 3
5.2 Logical Interface................................................................................................................... 5 - 6
5.2.1 I/O registers ..........................................................................................................................5 - 6
C141-E034-02ENviii
5.2.2 Command block registers .....................................................................................................5 - 8
5.2.3 Control block registers.......................................................................................................... 5 - 13
5.3 Host Commands....................................................................................................................5 - 13
5.3.1 Command code and parameters............................................................................................5 - 14
5.3.2 Command descriptions ......................................................................................................... 5 - 16
5.3.3 Error posting......................................................................................................................... 5 - 54
5.4 Command Protocol............................................................................................................... 5 - 55
5.4.1 Data transferring commands from device to host ................................................................. 5 - 55
5.4.2 Data transferring commands from host to device ................................................................. 5 - 57
5.4.3 Commands without data transfer .......................................................................................... 5 - 59
5.4.4 Other commands................................................................................................................... 5 - 60
5.4.5 DMA data transfer commands..............................................................................................5 - 60
5.5 Ultra DMA feature set.......................................................................................................... 5 - 62
5.5.1 Overview .............................................................................................................................. 5 - 62
5.5.2 Phases of operation............................................................................................................... 5 - 63
5.5.3 Ultra DMA data in commands.............................................................................................. 5 - 63
5.5.4 Ultra DMA data out commands............................................................................................ 5 - 67
5.5.5 Ultra DMA CRC rules.......................................................................................................... 5 - 71
5.5.6 Series termination required for Ultra DMA.......................................................................... 5 - 72
5.6 Timing ..................................................................................................................................5 - 73
5.6.1 PIO data transfer................................................................................................................... 5 - 73
5.6.2 Single word DMA data transfer............................................................................................ 5 - 75
5.6.3 Multiword data transfer ........................................................................................................5 - 76
5.6.4 Ultra DMA data transfer....................................................................................................... 5 - 77
5.6.5 Power-on and reset ............................................................................................................... 5 - 89
CHAPTER 6 OPERATIONS...................................................................................................... 6 - 1
6.1 Device Response to the Reset............................................................................................... 6 - 1
6.1.1 Response to power-on........................................................................................................... 6 - 2
6.1.2 Response to hardware reset...................................................................................................6 - 3
6.1.3 Response to software reset.................................................................................................... 6 - 4
6.1.4 Response to diagnostic command......................................................................................... 6 - 5
6.2 Address Translation..............................................................................................................6 - 6
6.2.1 Default parameters................................................................................................................6 - 6
6.2.2 Logical address..................................................................................................................... 6 - 7
6.3 Power Save........................................................................................................................... 6 - 8
C141-E034-02EN ix
6.3.1 Power save mode.................................................................................................................. 6 - 8
6.3.2 Power commands..................................................................................................................6 - 10
6.4 Defect Management.............................................................................................................. 6 - 10
6.4.1 Spare area ............................................................................................................................. 6 - 11
6.4.2 Alternating defective sectors.................................................................................................6 - 11
6.5 Read-Ahead Cache ...............................................................................................................6 - 13
6.5.1 Data buffer configuration......................................................................................................6 - 13
6.5.2 Caching operation................................................................................................................. 6 - 14
6.5.3 Usage of read segment..........................................................................................................6 - 15
6.6 Write Cache.......................................................................................................................... 6 - 22
C141-E034-02ENx
FIGURES
page
1.1 Current fluctuation (Typ.) at +5V when power is turned on................................................. 1 - 7
2.1 Disk drive outerview............................................................................................................. 2 - 1
2.2 Configuration of disk media heads ....................................................................................... 2 - 3
2.3 1 drive system configuration................................................................................................. 2 - 4
2.4 2 drives configuration........................................................................................................... 2 - 5
3.1 Dimensions...........................................................................................................................3 - 2
3.2 Orientation............................................................................................................................ 3 - 3
3.3 Limitation of side-mounting ................................................................................................. 3 - 4
3.4 Mounting frame structure ..................................................................................................... 3 - 4
3.5 Surface temperature measurement points ............................................................................. 3 - 5
3.6 Service area .......................................................................................................................... 3 - 6
3.7 Connector locations.............................................................................................................. 3 - 7
3.8 Cable connections.................................................................................................................3 - 8
3.9 Power supply connector pins (CN1)..................................................................................... 3 - 9
3.10 Jumper location..................................................................................................................... 3 - 9
3.11 Factory default setting .......................................................................................................... 3 - 10
3.12 Jumper setting of master or slave device .............................................................................. 3 - 10
3.13 Jumper setting of Cable Select.............................................................................................. 3 - 11
3.14 Example (1) of Cable Select................................................................................................. 3 - 11
3.15 Example (2) of Cable Select................................................................................................. 3 - 11
4.1 Head structure....................................................................................................................... 4 - 2
4.2 MPA30xxAT Block diagram................................................................................................ 4 - 5
4.3 Power-on operation sequence............................................................................................... 4 - 7
4.4 Read/write circuit block diagram.......................................................................................... 4 - 11
4.5 Frequency characteristic of programmable filter..................................................................4 - 12
4.6 PR4 signal transfer................................................................................................................ 4 - 13
4.7 Block diagram of servo control circuit ................................................................................. 4 - 16
4.8 Physical sector servo configuration on disk surface ............................................................. 4 - 17
4.9 Servo frame format............................................................................................................... 4 - 19
5.1 Interface signals.................................................................................................................... 5 - 2
5.2 Execution example of READ MULTIPLE command...........................................................5 - 19
5.3 Read Sector(s) command protocol........................................................................................ 5 - 56
C141-E034-02EN xi
5.4 Protocol for command abort................................................................................................. 5 - 57
5.5 WRITE SECTOR(S) command protocol..............................................................................5 - 58
5.6 Protocol for the command execution without data transfer................................................... 5 - 59
5.7 Normal DMA data transfer................................................................................................... 5 - 61
5.8 Ultra DMA termination with pull-up or pull-down............................................................... 5 - 72
5.9 PIO data transfer timing........................................................................................................5 - 74
5.10 Single word DMA data transfer timing................................................................................. 5 - 75
5.11 Multiword DMA data transfer timing (mode 2).................................................................... 5 - 76
5.12 Initiating an Ultra DMA data in burst................................................................................... 5 - 77
5.13 Sustained Ultra DMA data in burst....................................................................................... 5 - 80
5.14 Host pausing an Ultra DMA data in burst............................................................................. 5 - 81
5.15 Device terminating an Ultra DMA data in burst................................................................... 5 - 82
5.16 Host terminating an Ultra DMA data in burst....................................................................... 5 - 83
5.17 Initiating an Ultra DMA data out burst................................................................................. 5 - 84
5.18 Sustained Ultra DMA data out burst..................................................................................... 5 - 85
5.19 Device pausing an Ultra DMA data out burst....................................................................... 5 - 86
5.20 Host terminating an Ultra DMA data out burst..................................................................... 5 - 87
5.21 Device terminating an Ultra DMA data out burst................................................................. 5 - 88
5.22 Power on Reset Timing.........................................................................................................5 - 89
6.1 Response to power-on...........................................................................................................6 - 2
6.2 Response to hardware reset................................................................................................... 6 - 3
6.3 Response to software reset....................................................................................................6 - 4
6.4 Response to diagnostic command......................................................................................... 6 - 5
6.5 Address translation (example in CHS mode)........................................................................ 6 - 7
6.6 Address translation (example in LBA mode)........................................................................ 6 - 8
6.7 Sector slip processing........................................................................................................... 6 - 11
6.8 Alternate cylinder assignment...............................................................................................6 - 12
6.9 Data buffer configuration...................................................................................................... 6 - 13
C141-E034-02ENxii
TABLES
page
1.1 Specifications........................................................................................................................1 - 4
1.2 Model names and product numbers......................................................................................1 - 5
1.3 Current and power dissipation..............................................................................................1 - 6
1.4 Environmental specifications................................................................................................1 - 8
1.5 Acoustic noise specification ................................................................................................. 1 - 8
1.6 Shock and vibration specification......................................................................................... 1 - 9
3.1 Surface temperature measurement points and standard values.............................................3 - 5
3.2 Cable connector specifications ............................................................................................. 3 - 8
4.1 Self-calibration execution timechart.....................................................................................4 - 9
4.2 Write precompensation algorithm......................................................................................... 4 - 10
4.3 Write clock frequency and transfer rate of each zone........................................................... 4 - 15
5.1 Signal assignment on the interface connector....................................................................... 5 - 3
5.2 I/O registers.......................................................................................................................... 5 - 7
5.3 Command code and parameters............................................................................................ 5 - 14
5.4 Information to be read by IDENTIFY DEVICE command..................................................5 - 30
5.5 Features register values and settable modes.......................................................................... 5 -
5.6 Diagnostic code....................................................................................................................5 - 37
5.7 Features register values (subcommands) and functions........................................................5 - 48
5.8 Format of device attribute value data.................................................................................... 5 - 50
5.9 Format of insurance failure threshold value data.................................................................. 5 - 51
5.10 Command code and parameters............................................................................................ 5 - 54
5.11 Recommended series termination for Ultra DMA................................................................ 5 - 72
5.12 Ultra DMA data burst timing requirements .......................................................................... 5 - 78
6.1 Default parameters................................................................................................................ 6 - 6
34
C141-E034-02EN xiii
CHAPTER 1 DEVICE OVERVIEW
1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
Overview and features are described in this chapter, and specifications and power requirement are
described.
The MPA3017AT/MPA3026AT/MPA3035AT/MPA3043AT/MPA3052AT is a 3.5-inch hard disk drive
with a built-in ATA controller. The disk drive is compact and reliable.
1.1 Features
1.1.1 Functions and performance
(1) Compact
The disk has 1, 2 or 3 disks of 95 mm (3.5 inches) diameter, and its height is 25.4 mm (1 inch).
(2) Large capacity
The disk drive can record up to 1,750 MB (formatted) on one disk using the (8/9) PRML recording
method and 15 recording zone technology. The MPA3017AT, MPA3026AT, MPA3035AT,
MPA3043AT and MPA3052AT have a formatted capacity of 1,750 MB, 2,625 MB, 3,500 MB,
4,375MB and 5,250MB respectively.
(3) High-speed Transfer rate
The disk drive has an internal data rate up to 14.96 MB/s. The disk drive supports an external data
rate up to 16.7 MB/s or 33.3 MB/s (ultra DMA mode).
C141-E034-02EN 1 - 1
(4) Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly increases the
positioning speed. The average positioning time is 10 ms (at read).
1.1.2 Adaptability
(1) Power save mode
The power save mode feature for idle operation, stand by and sleep modes makes the disk drive
ideal for applications where power consumption is a factor.
(2) Wide temperature range
The disk drive can be used over a wide temperature range (5°C to 55°C).
(3) Low noise and vibration
In Ready status, the noise of the disk drive is only about 35 dBA (measured at 1 m apart from the
drive under the idle mode).
1.1.3 Interface
(1) Connection to interface
With the built-in ATA interface controller, the disk drive can be connected to an ATA interface of
a personal computer.
(2) 128-KB data buffer
The disk drive uses a 128-KB data buffer to transfer data between the host and the disk media.
In combination with the read-ahead cache system described in item (3) and the write cache
described in item (6), the buffer contributes to efficient I/O processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the subsequent data
block and writes it to the data buffer (read ahead operation). This cache system enables fast data
access. The next disk read command would normally cause another disk access. But, if the read
ahead data corresponds to the data requested by the next read command, the data in the buffer can
be transferred instead.
(4) Master/slave
The disk drive can be connected to ATA interface as daisy chain configuration. Drive 0 is a
master device, drive 1 is a slave device.
C141-E034-02EN1 - 2
(5) Error correction and retry by ECC
If a recoverable error occurs, the disk drive itself attempts error recovery. The 18-byte ECC has
improved buffer error correction for correctable data errors.
(6) Write cache
When the disk drive receives a write command, the disk drive posts the command completion at
completion of transferring data to the data buffer completion of writing to the disk media. This
feature reduces the access time at writing.
C141-E034-02EN 1 - 3
1.2 Device Specifications
1.2.1 Specifications summary
Table 1.1 shows the specifications of the disk drive.
Table 1.1 Specifications
MPA3017AT MPA3026AT MPA3035AT MPA3043AT MPA3052AT
Formatted Capacity (*1) 1750.00 MB 2625.00 MB 3500.00 MB 4375.00 MB 5250.01 MB
Number of Heads 23456
Number of Cylinders
(User + Alternate & SA)
Bytes per Sector 512
Recording Method (8/9) PRML
Track Density 9202 TPI
Bit Density 137,285 BPI
Rotational Speed 5400 rpm ± 0.5%
Average Latency 5.56 ms
Positioning time
• Minimum
• Average
• Maximum
Start/Stop time
• Start (0 rpm to Driv e Re ad)
• Stop (at Power Down)
Interface ATA–3
Data Transfer Rate
• To/From Media 8.019 to 14.964 MB/s
• To/From Host 16.7 MB/s Max. (burst PIO mode 4, burst DMA mode 2),
Data buffer 128 MB
Physical Dimensions
(Height × Width × Depth)
Weight 600 g
(Read) 10 ms typical, (Write) 12 ms typical
(Read) 19 ms typical, (Write) 20 ms typical
Typical: 10 sec., Maximum: 16 sec.
Typical: 20 sec., Maximum: 26 sec.
(Maximum Cable length: 0.46 m)
33.3 MB/s Max. (burst ultra DMA mode 2)
25.4 mm × 101.6 mm × 146.0 mm
8,713 + 84
3 ms typical
(1.0” × 4.0” × 5.75”)
*1: Capacity under the LBA mode.
Under the CHS mode (normal BIOS specification), formatted capacity, number of cylinders, number
of heads, and number of sectors are as follows.
Model Formatted Capacity No. of Cylinder No. of Heads No. of Sectors
MPA3017AT 1749.56 3,390 16 63
MPA3026AT 2624.86 5,086 16 63
MPA3035AT 3499.13 6,780 16 63
MPA3043AT 4374.88 9,042 15 63
MPA3052AT 5249.66 10,850 15 63
C141-E034-02EN1 - 4
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers.
Table 1.2 Model names and product numbers
Model Name Capacity
(user area)
MPA3017AT 1749.56 MB No. 6-32UNC CA01602-B321
MPA3026AT 2624.86 MB No. 6-32UNC CA01602-B331
MPA3035AT 3499.13 MB No. 6-32UNC CA01602-B341
MPA3043AT 4374.42 MB No. 6-32UNC CA01602-B351
MPA3052AT 5249.72 MB No. 6-32UNC CA01602-B361
MPA3017AT 1749.56 MB No. 6-32UNC CA01602-B421 UDMA33 version
MPA3026AT 2624.86 MB No. 6-32UNC CA01602-B431 UDMA33 version
MPA3035AT 3499.13 MB No. 6-32UNC CA01602-B441 UDMA33 version
MPA3043AT 4374.42 MB No. 6-32UNC CA01602-B451 UDMA33 version
MPA3052AT 5249.72 MB No. 6-32UNC CA01602-B461 UDMA33 version
1.3 Power Requirements
(1) Input Voltage
Mounting Screw Order No. Others
• + 5 V ±5 %
• + 12 V ±5 %
(2) Ripple
Maximum 200 mV (peak to peak) 100 mV (peak to peak)
Frequency DC to 1 MHz DC to 1 MHz
+12 V +5 V
C141-E034-02EN 1 - 5
(3) Current Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation.
Table 1.3 Current and power dissipation
Mode of
Operation
Model MPA
Spin up 1.3 A
Idle (Ready) (*3) 0.120 A 0.155 A 0.185 A 0.443 A 3.66 watts 4.08 watts 4.44 watts
R/W (On Track)
(*4)
Seek (Random)
(*5)
Standby 0.01 A 0.400 A 2.12 watts
Sleep 0.01 A 0.350 A 1.87 watts
3017AT
0.130 A 0.160 A 0.190 A 0.620 A 4.66 watts 5.02 watts 5.38 watts
0.370 A 0.380 A 0.425 A 0.520 A 7.04 watts 7.16 watts 7.70 watts
Typical RMS current (*1)
+12 V +5 V
MPA
3026AT
MPA
3035AT
1.5 A peak
MPA
3043AT
MPA
3052AT
All Models MPA
0.6 A peak
0.520 A
3017AT
Typical Power (*2)
MPA
3026AT
MPA
3035AT
18.2 watts
MPA
3043AT
MPA
3052AT
*1 Current is typical rms except for spin up.
*2 Power requirements reflect nominal values for +12V and +5V power.
*3 Idle mode is in effect when the drive is not reading, writing, seeking, or executing any
commands.
*4 R/W mode is defined as 50% read operations and 50% write operations on a single physical
track.
*5 Seek mode is defined as continuous random seek operations with minimum controller delay.
C141-E034-02EN1 - 6
(4) Current fluctuation (Typ.) at +5V when power is turned on
Note:
Maximum current is 1.5 A and is continuance is 1.5 seconds
Figure 1.1 Current fluctuation (Typ.) at +5V when power is turned on
(5) Power on/off sequence
The voltage detector circuit monitors +5 V and +12 V. The circuit does not allow a write signal if
either voltage is abnormal. This prevents data from being destroyed and eliminates the need to be
concerned with the power on/off sequence.
C141-E034-02EN 1 - 7
1.4 Environmental Specifications
Table 1.4 lists the environmental specifications.
Table 1.4 Environmental specifications
Temperature
• Operating
• Non-operating
• Thermal Gradient
Humidity
• Operating
• Non-operating
• Maximum Wet Bulb
Altitude (relative to sea level)
• Operating
• Non-operating
1.5 Acoustic Noise
5°C to 55°C (ambient)
5°C to 60°C (disk enclosure surface)
–40°C to 60°C
20°C/h or less
8% to 80%RH (Non-condensing)
5% to 85%RH (Non-condensing)
29°C
–60 to 3,000 m (–200 to 10,000 ft)
–60 to 12,000 m (–200 to 40,000 ft)
Table 1.5 lists the acoustic noise specification.
Sound Pressure
• Idle mode (DRIVE READY)
• Seek mode (Random)
Table 1.5 Acoustic noise specification
35 dBA typical at 1 m
40 dBA typical at 1 m
C141-E034-02EN1 - 8
1.6 Shock and Vibration
Table 1.6 lists the shock and vibration specification.
Table 1.6 Shock and vibration specification
Vibration (swept sine, one octave per minute)
• Operating
• Non-operating
Shock (half-sine pulse, 11 ms duration)
• Operating
• Non-operating
1.7 Reliability
(1) Mean time between failures (MTBF)
The mean time between failures (MTBF) is 500,000 H or more (operation: 24 hours/day, 7
days/week).
This does not include failures occurring during the first three months after installation.
5 to 300 Hz, 0.5G-0-peak
(without non-recovered errors)
5 to 400 Hz, 4G-0-peak (no damage)
10G (without non-recovered errors)
75G (no damage)
MTBF is defined as follows:
MTBF= (H)
"Disk drive defects" refers to defects that involve repair, readjustment, or replacement. Disk drive
defects do not include failures caused by external factors, such as damage caused by handling,
inappropriate operating environments, defects in the power supply host system, or interface cable.
(2) Mean time to repair (MTTR)
The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance staff
member.
(3) Service life
In situations where management and handling are correct, the disk drive requires no overhaul for
five years when the DE surface temperature is less than 48°C. When the DE surface temperature
exceeds 48°C, the disk drives requires no overhaul for five years or 20,000 hours of operation,
whichever occurs first. Refer to item (3) in Subsection 3.2 for the measurement point of the DE
surface temperature.
Total operation time in all fields
number of device failure in all fields
C141-E034-02EN 1 - 9
(4) Data assurance in the event of power failure
Except for the data block being written to, the data on the disk media is assured in the event of any
power supply abnormalities. This does not include power supply abnormalities during disk media
initialization (formatting) or processing of defects (alternative block assignment).
1.8 Error Rate
Known defects, for which alternative blocks can be assigned, are not included in the error rate
count below. It is assumed that the data blocks to be accessed are evenly distributed on the disk
media.
(1) Unrecoverable read error
Read errors that cannot be recovered by maximum 126 times read retries without user's retry and
ECC corrections shall occur no more than 10 times when reading data of 10
executed according to the disk drive's error recovery procedure, and include read retries
accompanying head offset operations.
(2) Positioning error
Positioning (seek) errors that can be recovered by one retry shall occur no more than 10 times in
7
seek operations.
10
1.9 Media Defects
Defective sectors are replaced with alternates when the disk is formatted prior to shipment from the
factory (low level format). Thus, the host sees a defect-free device.
Alternate sectors are automatically accessed by the disk drive. The user need not be concerned
with access to alternate sectors.
Chapter 6 describes the low level format at shipping.
15
bits. Read retries are
C141-E034-02EN1 - 10
CHAPTER 2 DEVICE CONFIGURATION
2.1 Device Configuration
2.2 System Configuration
2.1 Device Configuration
Figure 2.1 shows the disk drive. The disk drive consists of a disk enclosure (DE), read/write
preamplifier, and controller PCA. The disk enclosure contains the disk media, heads, spindle
motors actuators, and a circulating air filter.
Figure 2.1 Disk drive outerview
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(1) Disk
The outer diameter of the disk is 95 mm. The inner diameter is 25 mm. The number of disks used
varies with the model, as described below. The disks are rated at over 40,000 start/stop
operations.
MPA3017AT: 1 disk
MPA3026AT: 2 disks
MPA3035AT: 2 disks
MPA3043AT: 3 disks
MPA3052AT: 3 disks
(2) Head
The heads are of the contact start/stop (CSS) type. The head touches the disk surface while the
disk is not rotating and automatically lifts when the disk starts.
Figure 2.2 illustrates the configuration of the disks and heads of each model. In the disk surface,
servo information necessary for controlling positioning and read/write and user da ta are written.
Numerals 0 to 5 indicate read/write heads.
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MPA3017 Model
Spindle
1
0
MPA3026AT Model
Spindle
2
1
0
MPA3043AT Model
Spindle
Actuator
Actuator
Actuator
MPA3035AT Model
Spindle
3
2
1
0
MPA3052AT Model
Spindle
Actuator
Actuator
4
3
2
1
0
(3) Spindle motor
The disks are rotated by a direct drive Hall-less DC motor.
(4) Actuator
The actuator uses a revolving voice coil motor (VCM) structure which consumes low power and
generates very little heat. The head assembly at the edge of the actuator arm is controlled and
positioned by feedback of the servo information read by the read/write head. If the power is not on
or if the spindle motor is stopped, the head assembly stays in the specific CSS zone on the disk and
is fixed by a mechanical lock.
5
4
3
2
1
0
Figure 2.2 Configuration of disk media heads
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(5) Air circulation system
The disk enclosure (DE) is sealed to prevent dust and dirt from entering. The disk enclosure
features a closed loop air circulation system that relies on the blower effect of the rotating disk.
This system continuously circulates the air through the circulatio n filter to maintain the c leanliness
of the air within the disk enclosure.
(6) Read/write circuit
The read/write circuit uses a LSI chip for the read/write preamplifier. It improves data reliability
by preventing errors caused by external noise.
(7) Controller circuit
The controller circuit consists of an LSI chip to improve reliability. The high-speed
microprocessor unit (MPU) achieves a high-performance AT controller.
2.2 System Configuration
2.2.1 ATA interface
Figures 2.3 and 2.4 show the ATA interface system configuration. The drive has a 40-pin PC AT
interface connector and supports the PIO transfer till 16.7 MB/s (ATA-3, Mode 4), the DMA
transfer till 16.7 MB/s (ATA-3, Multiword mode 2), and the ultra DMA transfer till (ATA-4,
Mode 4).
2.2.2 1 drive connection
Host
AT bus
(Host interface)
HA
(Host adaptor)
Disk drive
ATA interface
Figure 2.3 1 drive system configuration
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2.2.3 2 drives connection
Host
HA
(Host adaptor)
Disk drive #0
AT bus
(Host interface)
Disk drive #1
ATA interface
Note:
When the drive that is not conformed to ATA is connected to the disk drive is above
configuration, the operation is not guaranteed.
Figure 2.4 2 drives configuration
IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-3 interface.
At high speed data transfer (PIO mode 3, mode 4, DMA mode 2 or
ultra DMA mode), occurrence of ringing or crosstalk of the signal lines
(AT bus) between the HA and the disk drive may be a great cause of the
obstruction of system reliability. Thus, it is necessary that the
capacitance of the signal lines including the HA and cable does not
exceed the ATA-3 and ATA-4 standard, and the cable length between
the HA and the disk drive should be as short as possible.
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CHAPTER 3 INSTALLATION CONDITIONS
3.1 Dimensions
3.2 Mounting
3.3 Cable Connections
3.4 Jumper Settings
3.1 Dimensions
Figure 3.1 illustrates the dimensions of the disk drive and po sitions of the mounting screw holes.
All dimensions are in mm.
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Figure 3.1 Dimensions
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3.2 Mounting
(1) Orientation
Figure 3.2 illustrates the allowable orientations for the disk drive. The mounting angle can vary
±5° from the horizontal.
gravity
(a) Horizontal mounting (b) Vertical mounting –1 (c) Vertical mounting –2
(2) Frame
The disk enclosure (DE) body is connected to signal ground (SG) and the mounting frame is also
connected to signal ground. These are electrically shorted.
Note:
Use No.6-32UNC screw for the mounting screw and the screw length should satisfy the
specification in Figure 3.4.
(3) Limitation of side-mounting
When the disk drive is mounted using the screw holes on both side of the disk drive, use two screw
holes shown in Figure 3.3.
Do not use the center hole. For screw length, see Figure 3.4.
Figure 3.2 Orientation
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