Fujitsu MHY2200BH, MHY2250BH, MHY2060BH, MHY2100BH, MHY2120BH User Manual

...

Download

C141-E262-01EN

MHY2250BH, MHY2200BH, MHY2160BH, MHY2120BH, MHY2100BH, MHY2080BH,

MHY2060BH, MHY2040BH

DISK DRIVES

PRODUCT/MAINTENANCE MANUAL

FOR SAFE OPERATION

Handling of This Manual

This manual contains important information for using this product. Read thoroughly before using the product. Use this product only after thoroughly reading and understanding especially the section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.

FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering damage to their property. Use the product according to this manual.

IMPORTANT NOTE TO USERS

READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT. INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO USERS, BYSTANDERS OR PROPERTY.

While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU assumes no liability to any party for any damage caused by any error or omission contained in this manual, its updates or supplements, whether such errors or omissions result from negligence, accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the application or use of any product or system in accordance with the descriptions or instructions contained herein; including any liability for incidental or consequential damages arising therefrom. FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.

FUJITSU reserves the right to make changes to any products described herein without further notice and without obligation.

This product is designed and manufactured for use in standard applications such as office work, personal devices and household appliances. This product is not intended for special uses (atomic controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for life support, or weapons firing controls) where particularly high reliability requirements exist, where the pertinent levels of safety are not guaranteed, or where a failure or operational error could threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers considering the use of these products for mission-critical applications must have safety-assurance measures in place beforehand. Moreover, they are requested to consult our sales representative before embarking on such specialized use.

The contents of this manual may be revised without prior notice.

The contents of this manual shall not be disclosed in any way or reproduced in any media without the express written permission of Fujitsu Limited.

Revision History

(1/1)

Edition Date

Revised section (*1)

(Added/Deleted/Altered)

01 2007-05-18

Details

*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

C141-E262

This page is intentionally

left blank.

Preface

Acronyms and Abbreviations

This section gives the meanings of the definitions used in this manual.

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property may occur if the user does not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

Data corruption: Avoid mounting the disk drive near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.

The main alert messages in the text are also listed in the "Important Alert Items."

Operating Environment

This product is designed for mobile system as notebook PCs, and to be used within environmental specification. (please refer to the Chapter 1 in this manual.)

ii C141-E262

This manual describes MHY2250BH, MHY2200BH, MHY2160BH, MHY2120BH, MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH model of the MHY Series, 2.5-inch hard disk drives. These drives have a built-in controller that is compatible with the Serial-ATA interface.

This manual describes the specifications and functions of the drives and explains in detail how to incorporate the drives into user systems. This manual assumes that the reader has a basic knowledge of hard disk drives and their implementations in computer systems.

This manual consists of seven chapters and sections explaining the special terminology and abbreviations used in this manual:

Overview of Manual

CHAPTER 1 Device Overview

This chapter gives an overview of the disk drive and describes their features.

Preface

CHAPTER 2 Device Configuration

This chapter describes the internal configurations of the disk drive and the configuration of the systems in which they operate.

CHAPTER 3 Installation Conditions

This chapter describes the external dimensions, installation conditions, and switch settings of the disk drive.

CHAPTER 4 Theory of Device Operation

This chapter describes the operation theory of the disk drive.

CHAPTER 5 Interface

This chapter describes the interface specifications of the disk drive.

CHAPTER 6 Operations

This chapter describes the operations of the disk drive.

CHAPTER 7 Maintenance and Diagnosis

This chapter explains the maintenance requirements, operation verification, troubleshooting, and removal/replacement of the disk drives.

Glossary

The glossary describes the technical terms that need to be understood to read this manual.

C141-E262 i

Preface

Conventions

An MHY series device is sometimes simply referred to as a "hard disk drive," "HDD," "drive," or "device" in this document.

Decimal numbers are represented normally. Hexadecimal numbers are represented as shown in the following examples:

X'17B9', 17B9h, 17B9 Binary numbers are represented as shown in the following examples: 010 or 010b. Serial-ATA may be referred to as "SATA".

, or 17B9H.

Representation of the data storage capacity

One gigabyte (GB) = one billion bytes; accessible capacity will be less and actual capacity depends on the operating environment and formatting.

Attention

Please forward any comments you may have regarding this manual.

To make this manual easier for users to understand, opinions from readers are needed. Please write your opinions or requests on the Comment at the back of this manual and forward it to the address described in the sheet.

Liability Exception

"Disk drive defects" refers to defects that involve adjustment, repair, or replacement.

Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the host system, or other causes outside the disk drive.

C141-E262 iii

Preface

Hot Plug

These drives support Hot Plug which is based on Serial ATA Revision 2.5 Specification.

However, the disk drive installation and removal notes on safety precautions with regard to hot-plugging vary depending on the specific requirements and environment-related conditions of the system to which the drive is connected by hot-plugging.

When using the drive under general conditions of use (i.e., without hot-plugging), observe the important alert messages and notes on safety precautions given in this manual.

For the electrical recommendation to the host system which supports hot-plugging with this drives, refer to Section 5.1.6.

Compliance with Administration on the Control of Pollution Caused by Electronic Information Products of the People's Republic of China

This product is shipped as a component to manufacture the final products. Therefore, the packaging material code provided in GB18455-2001 is not marked on any packaging part of this product.

iv C141-E262

Important Alert Items

Important Alert Messages

The important alert messag es in th is manu al are as fol l ows :

A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. Also, damage to the product or other property, may occur if the user does not perform the procedure correctly.

Task Alert message Page

Normal Operation

Maintenance

Data corruption: Avoid mounting the disk near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields. Damage: Do not press the cover of the disk drive. Pressing it too hard, the cover and the spindle motor contact, which may cause damage to the disk drive.

Static: When handling the device, disconnect the body ground (500 kΩ or greater). Do not touch the printed circuit

board, but hold it by the edges.

Static, Damage

1. Don’t install or remove a PCA or connect or disconnect a cable or connector plug when the drive is powered. This may give you an electric shock.

2. Keep away from mechanical assemblies in the unit during operation. This may cause injuries.

3. Avoid dangerous detergent when the disk drive is cleaned.

3-7

7-2

C141-E262 v

Important Alert Items

Task Alert message Page

Maintenance

Device damage

1. Before touching a PCA or the drive, wear a wrist strap and perform the human body grounding to discharge static electricity from your body. This will prevent irreparable damage to the PCA and the head of the drive.

2. Don’t install or remove a PCA or connect or disconnect a cable or connector plug when the drive is powered. This will prevent electrical damage to the disk drive.

3. Operating the disk drive with one or more PCA missing will be unpredictable. Only power the drive with all boards installed.

4. Avoid any detergent which may cause short circuits when cleaning assemblies.

5. Keep all vents open opened and unblocked. Avoid other conditions which may cause circuits to overheat.

6. Do not apply excessive force to the cover under any circumstances. Doing so may cause irreparable damage to the cover.

Device damage

The DE is completely sealed. Do not open the DE in the field.

7-2

7-3

Data corruption

When asking for repair, save all data stored in the disk drive

7-4 beforehand. Fujitsu Limited is not responsible for any loss of data during service and repair.

Device damage The disk enclosure (DE) must never to be opened in the field.

7-14

Opening the disk enclosure may cause irreparable damage.

Damage or Device damage

1. Perform any removal after the system power is

7-15 completely disconnected. The cable must not be disconnected and the screws that attach the drive must not be removed with the power ON.

2. Do not move the drive and attach or detach the connector until it comes to a complete stop (about 30 s after the power is turned OFF).

3. Perform the human body grounding to discharge any static electricity from your body. (Be sure to wear a wrist strap)

vi C141-E262

Manual Organization

MHY2250BH, MHY2200BH, MHY2160BH, MHY2120BH, MHY2100BH, MHY2080BH,

MHY2060BH, MHY2040BH

DISK DRIVES

PRODUCT/MAINTENANCE

MANUAL

(C141-E262)

• Device Overview

• Device Configuration

• Installation Conditions

• Theory of Device Operation

• Interface

• Operations

• Maintenance and Diagnosis

C141-E262 vii

This page is intentionally left blank.

CHAPTER 1 Device Overview ....................................................................... 1-1

1.1 Features ..............................................................................................................1-2

1.1.1 Functions and performance..................................................................... 1-2

1.1.2 Adaptability............................................................................................. 1-2

1.1.3 Interface .................................................................................................. 1-3

1.2 Device Specifications......................................................................................... 1-4

1.2.1 Specifications summary .......................................................................... 1-4

1.2.2 Model and product number..................................................................... 1-5

1.3 Power Requirements .......................................................................................... 1-7

1.4 Environmental Specifications ..........................................................................1-10

1.5 Acoustic Noise .................................................................................................1-11

1.6 Shock and Vibration......................................................................................... 1-11

1.7 Reliability......................................................................................................... 1-12

1.8 Error Rate......................................................................................................... 1-13

1.9 Media Defects .................................................................................................. 1-13

1.10 Load/Unload Function ...................................................................................1-13

1.10.1 Recommended power-off sequence.................................................... 1-14

1.11 Advanced Power Management (APM) .......................................................... 1-14

1.12 Interface Power Management (IPM) ............................................................. 1-16

1.12.1 Host-initiated interface power management (HIPM) .........................1-16

1.12.2 Device-initiated interface power management (DIPM)...................... 1-16

CHAPTER 2 Device Configuration................................................................ 2-1

2.1 Device Configuration......................................................................................... 2-2

C141-E262 ix

Contents

2.2 System Configuration.........................................................................................2-3

2.2.1 SATA interface........................................................................................2-3

2.2.2 Drive connection .....................................................................................2-3

CHAPTER 3 Installation Conditions..............................................................3-1

3.1 Dimensions.........................................................................................................3-2

3.2 Mounting ............................................................................................................3-3

3.3 Connections with Host System ..........................................................................3-9

3.3.1 Device connector.....................................................................................3-9

3.3.2 Signal segment and power supply segment ..........................................3-10

3.3.3 Connector specifications for host system..............................................3-10

3.3.4 SATA interface cable connection .........................................................3-11

3.3.5 Note about SATA interface cable connection....................................... 3-11

CHAPTER 4 Theory of Device Operation......................................................4-1

4.1 Outline................................................................................................................ 4-2

4.2 Subassemblies ....................................................................................................4-2

4.2.1 Disk .........................................................................................................4-2

4.2.2 Spindle..................................................................................................... 4-2

4.2.3 Actuator................................................................................................... 4-2

4.2.4 Air filter...................................................................................................4-3

4.3 Circuit Configuration .........................................................................................4-3

4.4 Power-on Sequence ............................................................................................4-6

4.5 Self-calibration................................................................................................... 4-8

4.5.1 Self-calibration contents..........................................................................4-8

4.5.2 Execution timing of self-calibration .......................................................4-9

4.5.3 Command processing during self-calibration .........................................4-9

4.6 Read/write Circuit ............................................................................................4-10

4.6.1 Read/write preamplifier (PreAMP).......................................................4-10

4.6.2 Write circuit...........................................................................................4-10

x C141-E262

Contents

4.6.3 Read circuit ........................................................................................... 4-11

4.6.4 Digital PLL circuit ................................................................................ 4-12

4.7 Servo Control ...................................................................................................4-13

4.7.1 Servo control circuit.............................................................................. 4-13

4.7.2 Data-surface servo format..................................................................... 4-15

4.7.3 Servo frame format ............................................................................... 4-17

4.7.4 Actuator motor control.......................................................................... 4-18

4.7.5 Spindle motor control ........................................................................... 4-19

CHAPTER 5 Interface..................................................................................... 5-1

5.1 Physical Interface............................................................................................... 5-2

5.1.1 Interface signals ...................................................................................... 5-2

5.1.2 Signal interface regulation ......................................................................5-4

5.1.3 Electrical specifications .......................................................................... 5-6

5.1.4 Connector pinouts ................................................................................... 5-7

5.1.5 P11 function ............................................................................................5-8

5.1.6 Hot Plug ................................................................................................5-10

5.2 Logical Interface .............................................................................................. 5-11

5.2.1 Communication layers ..........................................................................5-12

5.2.2 Outline of the Shadow Block Register.................................................. 5-13

5.2.3 Outline of the frame information structure (FIS) ................................. 5-14

5.2.4 Shadow block registers .........................................................................5-22

5.3 Host Commands............................................................................................... 5-27

5.3.1 Command code and parameters ............................................................5-27

5.3.2 Command descriptions.......................................................................... 5-30

(1) RECALIBRATE (X '10' to X '1F')................................................ 5-31

(2) READ SECTOR(S) (X '20' or X '21') ........................................... 5-32

(3) WRITE SECTOR(S) (X '30' or X '31') ......................................... 5-34

(4) WRITE VERIFY (X '3C') ............................................................. 5-36

(5) READ VERIFY SECTOR(S) (X '40' or X '41')............................ 5-38

(6) SEEK (X '70' to X '7F') ................................................................. 5-40

(7) EXECUTE DEVICE DIAGNOSTIC (X '90')............................... 5-41

(8) INITIALIZE DEVICE PARAMETERS (X '91') .......................... 5-42

C141-E262 xi

Contents

(9) DOWNLOAD MICROCODE (X '92').......................................... 5-43

(10) STANDBY IMMEDIATE (X '94' or X 'E0') ................................ 5-46

(11) IDLE IMMEDIATE (X '95' or X 'E1')/UNLOAD

IMMEDIATE (X '95' or X 'E1') .................................................... 5-47

(12) STANDBY (X '96' or X 'E2') ........................................................ 5-49

(13) IDLE (X '97' or X 'E3').................................................................. 5-50

(14) CHECK POWER MODE (X '98' or X 'E5').................................. 5-52

(15) SLEEP (X '99' or X 'E6') ..............................................................5-53

(16) SMART (X 'B0')............................................................................ 5-54

(17) DEVICE CONFIGURATION (X 'B1') .........................................5-84

(18) READ MULTIPLE (X 'C4').......................................................... 5-89

(19) WRITE MULTIPLE (X 'C5') ........................................................ 5-92

(20) SET MULTIPLE MODE (X 'C6')................................................. 5-94

(21) READ DMA (X 'C8' or X 'C9')..................................................... 5-96

(22) WRITE DMA (X 'CA' or X 'CB').................................................. 5-98

(23) READ BUFFER (X 'E4')............................................................. 5-100

(24) FLUSH CACHE (X 'E7') ............................................................ 5-101

(25) WRITE BUFFER (X 'E8')........................................................... 5-102

(26) IDENTIFY DEVICE (X 'EC')..................................................... 5-103

(27) IDENTIFY DEVICE DMA (X 'EE')........................................... 5-104

(28) SET FEATURES (X 'EF') ........................................................... 5-119

(29) SECURITY SET PASSWORD (X 'F1')...................................... 5-126

(30) SECURITY UNLOCK (X 'F2')................................................... 5-128

(31) SECURITY ERASE PREPARE (X 'F3') ....................................5-130

(32) SECURITY ERASE UNIT (X 'F4') ............................................ 5-131

(33) SECURITY FREEZE LOCK (X 'F5') ......................................... 5-132

(34) SECURITY DISABLE PASSWORD (X 'F6')............................ 5-134

(35) READ NATIVE MAX ADDRESS (X 'F8')................................ 5-136

(36) SET MAX (X 'F9') ...................................................................... 5-137

(37) READ SECTOR (S) EXT (X '24') ..............................................5-143

(38) READ DMA EXT (X '25') .......................................................... 5-144

(39) READ NATIVE MAX ADDRESS EXT (X '27') .......................5-145

(40) READ MULTIPLE EXT (X '29')................................................ 5-146

(41) READ LOG EXT (X '2F') ...........................................................5-147

(42) WRITE SECTOR (S) EXT (X '34') ............................................ 5-153

xii C141-E262

Contents

(43) WRITE DMA EXT (X '35') ........................................................ 5-154

(44) SET MAX ADDRESS EXT (X '37') .......................................... 5-155

(45) WRITE MULTIPLE EXT (X '39').............................................. 5-157

(46) WRITE DMA FUA EXT (X '3D') .............................................. 5-158

(47) WRITE LOG EXT (X '3F') ......................................................... 5-159

(48) READ VERIFY SECTOR (S) EXT (X '42')............................... 5-163

(49) WRITE UNCORRECTABLE EXT (X '39')............................... 5-164

(50) READ LOG DMA EXT (X '47')................................................. 5-166

(51) WRITE LOG DMA EX (X '57') ................................................. 5-167

(52) READ FP DMA QUEUED (X '60')............................................ 5-168

(53) WRITE FP DMA QUEUED (X '61') .......................................... 5-169

(54) WRITE MULTIPLE FUA EXT (X 'CE').................................... 5-170

(55) FLUSH CACHE EXT (X 'EA')................................................... 5-171

5.3.3 Error posting ....................................................................................... 5-172

5.4 Command Protocol ........................................................................................ 5-174

5.4.1 Non-data command protocol............................................................... 5-175

5.4.2 PIO data-in command protocol........................................................... 5-177

5.4.3 PIO data-out command protocol......................................................... 5-179

5.4.4 DMA data-in command protocol ........................................................5-181

5.4.5 DMA data-out command protocol ......................................................5-182

5.4.6 Native Command Queuing protocol ................................................... 5-183

5.5 Power-on and COMRESET ...........................................................................5-186

CHAPTER 6 Operations................................................................................. 6-1

6.1 Reset and Diagnosis ........................................................................................... 6-2

6.1.1 Response to power-on............................................................................. 6-2

6.1.2 Response to COMRESET ....................................................................... 6-4

6.1.3 Response to a software reset ...................................................................6-7

6.2 Power Save......................................................................................................... 6-8

6.2.1 Power save mode .................................................................................... 6-8

6.2.2 Power commands ..................................................................................6-10

6.3 Power Save Controlled by Interface Power Management (IPM) .................... 6-11

C141-E262 xiii

Contents

6.3.1 Power save mode of the interface .........................................................6-11

6.4 Read-ahead Cache ............................................................................................6-13

6.4.1 Data buffer structure..............................................................................6-13

6.4.2 Caching operation .................................................................................6-14

6.4.3 Using the read segment buffer ..............................................................6-16

6.5 Write Cache......................................................................................................6-20

6.5.1 Cache operation.....................................................................................6-20

CHAPTER 7 Maintenance and Diagnosis .....................................................7-1

7.1 Maintenance .......................................................................................................7-2

7.1.1 Rules for maintenance.............................................................................7-2

7.1.2 Maintenance requirements ......................................................................7-3

7.1.3 Maintenance levels..................................................................................7-5

7.1.4 Disk drive revision number ..................................................................... 7-6

7.1.5 Tools and test equipment.........................................................................7-8

7.1.6 Self-diagnostics .......................................................................................7-8

7.1.7 Test ..........................................................................................................7-8

7.2 Operation Confirmation ...................................................................................7-11

7.2.1 Operation test ........................................................................................7-11

7.2.2 Diagnostic test ....................................................................................... 7-11

7.3 Troubleshooting Procedure ..............................................................................7-12

7.3.1 Troubleshooting procedure ...................................................................7-12

7.3.2 Troubleshooting disk drive replaced in field ........................................7-12

7.3.3 Troubleshooting at factory ....................................................................7-14

7.4 Disk Drive Removal Procedure........................................................................7-15

7.5 Spare Disk Drive ..............................................................................................7-15

xiv C141-E262

Contents

Glossary............................................................................................................GL-1

Acronyms and Abbreviations ........................................................................ AB-1

Index ..................................................................................................................IN-1

C141-E262 xv

Contents

Illustrations

Figures

Figure 1.1 Permissible range of +5V rise slope.....................................................1-7

Figure 1.2 The example of negative voltage waveform at +5 V when

power is turned off ...............................................................................1-8

Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on.............1-10

Figure 2.1 Disk drive outerview ............................................................................2-2

Figure 2.2 Drive system configuration ..................................................................2-3

Figure 3.1 Dimensions...........................................................................................3-2

Figure 3.2 Mounting frame structure.....................................................................3-4

Figure 3.3 Location of breather .............................................................................3-5

Figure 3.4 Surface cover temperature measurement points ..................................3-6

Figure 3.5 Service area ..........................................................................................3-7

Figure 3.6 Handling cautions.................................................................................3-8

Figure 3.7 Connector locations..............................................................................3-9

Figure 3.8 Power supply pins (CN1) ...................................................................3-10

Figure 4.1 Power supply configuration..................................................................4-4

Figure 4.2 Circuit configuration ............................................................................4-5

Figure 4.3 Power-on operation sequence...............................................................4-7

Figure 4.4 Read/write circuit block diagram .......................................................4-10

Figure 4.5 Frequency characteristic of programmable filter ...............................4-11

Figure 4.6 Block diagram of servo control circuit...............................................4-13

Figure 4.7 Physical sector servo configuration on disk surface ..........................4-16

Figure 4.8 Servo frame format.............................................................................4-17

Figure 5.1 Interface signals....................................................................................5-2

Figure 5.2 Example of the circuit for driving Activity LED .................................5-9

Figure 5.3 Conceptual diagram of communication layers................................... 5-11

Figure 5.4 Register - Host to Device FIS layout .................................................5-15

Figure 5.5 Register - Device to Host FIS layout .................................................5-16

Figure 5.6 DMA Active - Device to Host FIS layout..........................................5-16

Figure 5.7 DMA Setup - Device to Host or Host to Device FIS layout ..............5-17

Figure 5.8 BIST Active - Bidirectional FIS layout..............................................5-18

Figure 5.9 Data FIS (Bidirectional) layout .......................................................... 5-19

xvi C141-E262

Contents

Figure 5.10 PIO Setup - Device to Host FIS layout ............................................5-19

Figure 5.11 Set Device Bits FIS ..........................................................................5-21

Figure 5.12 Execution example of READ MULTIPLE command ..................... 5-90

Figure 5.13 Non-data command protocol.......................................................... 5-176

Figure 5.14 PIO data-in command protocol ......................................................5-178

Figure 5.15 PIO data-out command protocol ....................................................5-180

Figure 5.16 DMA data-in command protocol ................................................... 5-181

Figure 5.17 DMA data-out command protocol ................................................. 5-182

Figure 5.18 READ FP DMA QUEUED command protocol............................. 5-184

Figure 5.19 WRITE FP DMA QUEUED command protocol........................... 5-185

Figure 5.20 Power-on sequence......................................................................... 5-186

Figure 5.21 COMRESET sequence................................................................... 5-187

Figure 6.1 Response to power-on (when the host is powered on earlier

than the device).................................................................................... 6-2

Figure 6.2 Response to power-on (when the device is powered on

earlier than the host) ............................................................................6-3

Figure 6.3 Response to COMRESET ....................................................................6-4

Figure 6.4 Response to a software reset ................................................................6-7

Figure 6.5 Data buffer structure ..........................................................................6-13

Figure 7.1 Disk drive revision number label ......................................................... 7-6

Figure 7.2 Display of disk drive revision number................................................. 7-7

Figure 7.3 Test flowchart....................................................................................... 7-9

C141-E262 xvii

Contents

Tables

Table 1.1 Specifications.........................................................................................1-4

Table 1.2 Examples of model names and product numbers ..................................1-6

Table 1.3 Current and power dissipation ............................................................... 1-9

Table 1.4 Environmental specifications ..............................................................1-10

Table 1.5 Acoustic noise specification ................................................................1-11

Table 1.6 Shock and vibration specification........................................................1-11

Table 1.7 Advanced Power Management ............................................................1-15

Table 1.8 Interface power management...............................................................1-17

Table 3.1 Surface temperature measurement points and standard values .............3-6

Table 5.1 Connector pinouts..................................................................................5-7

Table 5.2 Requirements for P11 as an output pin.................................................. 5-9

Table 5.3 Shadow Block Register........................................................................5-13

Table 5.4 BIST combinations ..............................................................................5-18

Table 5.5 Command code and parameters........................................................... 5-27

Table 5.6 Diagnostic code ...................................................................................5-41

Table 5.7 Operation of DOWNLOAD MICROCODE........................................ 5-44

Table 5.8 Example of rewriting procedure of data 640K Bytes

(A0000h Bytes) of microcode...........................................................5-45

Table 5.9 Features Field values (subcommands) and functions.......................... 5-55

Table 5.10 Format of device attribute value data ................................................5-59

Table 5.11 Format of guarantee failure threshold value data ..............................5-59

Table 5.12 Off-line data collection status............................................................ 5-62

Table 5.13 Self-test execution status ...................................................................5-62

Table 5.14 Off-line data collection capability ..................................................... 5-63

Table 5.15 Failure prediction capability flag.......................................................5-63

Table 5.16 Drive error logging capability ...........................................................5-64

Table 5.17 Log Directory Data Format ...............................................................5-64

Table 5.18 Data format of SMART Summary Error Log....................................5-65

Table 5.19 Data format of SMART Comprehensive Error Log.......................... 5-67

Table 5.20 SMART self-test log data format ......................................................5-68

Table 5.21 Selective self-test log data structure ..................................................5-69

Table 5.22 Selective self-test feature flags.......................................................... 5-70

Table 5.23 SCT command and the function ........................................................5-71

Table 5.24 Format of SCT STATUS Response...................................................5-73

Table 5.25 SCT STATUS code............................................................................5-75

Table 5.26 Action code........................................................................................ 5-77

Table 5.27 WRITE SAME................................................................................... 5-77

xviii C141-E262

Contents

Table 5.28 ERROR RECOVERY CONTROL.................................................... 5-78

Table 5.29 FEATURE CONTROL COMMAND ............................................... 5-79

Table 5.30 SCT DATA TABLE .......................................................................... 5-80

Table 5.31 HAD Temperature .............................................................................5-81

Table 5.32 DEVICE CONFIGURATION IDENTIFY data structure ................ 5-87

Table 5.33 Information to be read by IDENTIFY DEVICE command ...........5-105

Table 5.34 Features field values and settable modes ........................................5-119

Table 5.35 Contents of SECURITY SET PASSWORD data............................ 5-126

Table 5.36 Relationship between combination of Identifier and

Security level, and operation of the lock function.......................... 5-126

Table 5.37 Contents of security password......................................................... 5-134

Table 5.38 Data format of Read Log Ext log page 10h..................................... 5-149

Table 5.39 Tag field information....................................................................... 5-149

Table 5.40 Data format of Read Log Ext log page 11h..................................... 5-150

Table 5.41 Counter Identifier information ........................................................ 5-150

Table 5.42 Operation mode ............................................................................... 5-165

Table 5.43 Command code and parameters ...................................................... 5-172

Table 7.1 Status Field contents............................................................................ 7-10

Table 7.2 Disposition for Error Field contents.................................................... 7-10

Table 7.3 System level and field troubleshooting ............................................... 7-13

C141-E262 xix

This page is intentionally left blank.

CHAPTER 1 Device Overview

1.1 Features

1.2 Device Specifications

1.3 Power Requirements

1.4 Environmental Specifications

1.5 Acoustic Noise

1.6 Shock and Vibration

1.7 Reliability

1.8 Error Rate

1.9 Media Defects

1.10 Load/Unload Function

1.11 Advanced Power Management (APM)

1.12 Interface Power Management (IPM)

Overview and features are described in this chapter, and specifications and power requirement are described.

The disk drive is 2.5-inch hard disk drives with built-in disk controllers. These disk drives use the SATA interface protocol which has a high-speed interface data transfer rate.

C141-E262 1-1

Device Overview

1.1 Features

1.1.1 Functions and performance

The following features of the disk drive are described.

(1) Compact

The disk drive has up to 2 disks of 65 mm (2.5 inches) diameter, and its height is

9.5 mm (0.374 inch).

(2) Environmental Protection

The disk drive comply with the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (RoHS) directive issued by European Union (EU).

(3) Large capacity

The disk drive can record up to 125 GB (formatted) on one disk using the RLL recording method and 30 recording zone technology. The disk drive has a formatted capacity of 250GB(MHY2250BH), 200GB(MHY2200BH), 160GB(MHY2160BH), 120GB(MHY2120BH), 100GB(MHY2100BH), 80GB(MHY2080BH), 60GB(MHY2060BH), and 40GB(MHY2040BH) respectively.

(4) High-speed Transfer rate

The disk drive (the MHY2xxxBH Series) has an internal data rate up to

84.6 MB/s. The disk drive supports an external data rate 1.5 Gbps (150 MB/s) (Serial-ATA Generation-1). And the disk drive realizes a high performance by high-speed transfer rate combined with Native Command Queuing (NCQ).

(5) Average positioning time

Use of a rotary voice coil motor in the head positioning mechanism greatly increases the positioning speed. The average positioning time is 12.0 ms (at read).

1.1.2 Adaptability

(1) Power save mode

The disk drive is ideal for applications since it supports the power save mode function that works in each of the Idle, Standby, and Sleep modes and has the Partial and Slumber interface power management functions. And automatically power down by APM function makes the disk drive ideal for mobile use where power consumption is a factor.

1-2 C141-E262

1.1 Features

(2) Wide temperature range

The disk drive can be used over a wide temperature range (5 °C to 60 °C at DE surface).

(3) Low noise and vibration

In Ready status (while the device is waiting for any commands), the Sound Power level of the disk drives in idle mode is 2.0B [MHY2120BH, MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH] / 2.4B [MHY2250BH, MHY2200BH, MHY2160BH]. The Sound Pressure level is 22dB [MHY2120BH, MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH] / 28dB [MHY2250BH, MHY2200BH, MHY2160BH], as measured 0.3 m from the drive in Idle mode.

(4) High resistance against shock

The Load/Unload mechanism is highly resistant against non-operation shock up to 8820 m/s

(900G).

1.1.3 Interface

(1) Connection to SATA interface

The disk drive has built-in controllers compatible with the SATA interface.

(2) Data buffer

The disk drive uses the data buffer to transfer data between the host and the disk media.

In combination with the read-ahead cache system described in item (3) and the write cache described in item (6), the buffer contributes to efficient I/O processing.

(3) Read-ahead cache system

After the execution of a disk read command, the disk drive automatically reads the subsequent data block and writes it to the data buffer (read ahead operation). This cache system enables fast data access. The next disk read command would normally cause another disk access. But, if the read ahead data corresponds to the data requested by the next read command, the data in the buffer can be transferred instead.

(4) Error correction and retry by ECC

If a recoverable error occurs, the disk drive itself attempts error recovery. The ECC has improved buffer error correction for correctable data errors.

C141-E262 1-3

Device Overview

(5) Self-diagnosis

The disk drive has a diagnostic function to check operation of the controller and disk drive. Executing a diagnostic function of the smart command invokes self-diagnosis.

(6) Write cache

When the disk drive receives a write command, the disk drive posts the command completion at completion of transferring data to the data buffer completion of writing to the disk media. This feature reduces the access time at writing.

1.2 Device Specifications

1.2.1 Specifications summary

Table 1.1 shows the specifications of the disk drives.

Table 1.1 Specifications (1/2)

Format Capacity (*1, *2)

Number of Sectors (User)

Bytes per Sector 512 bytes

Rotational Speed 5,400 rpm ± 1%

Average Latency 5.56 ms

Positioning time (read and seek)

• Minimum (Track-Track)

• Average

• Maximum (Full)

Start time 4.0 sec (typ.)

Interface Compliant with ATA-8 ACS AST, Serial ATA Revision 2.5 Gen1i

Data Transfer Rate (*3)

• To/From Media

• To/From Host

Data Buffer Size (*4) 8 MB (8,388,608 bytes)

Physical Dimensions (Height × Width × Depth)

Weight 101 g (Max.) 96 g (Max.)

MHY2250BH MHY2200BH MHY2160BH MHY2120BH MHY2100BH MHY2080BH MHY2060BH MHY2040BH

250 GB 200 GB 160 GB 120 GB 100 GB 80 GB 60 GB 40 GB

488,397,168 390,721,968 312, 581, 808 234,441,648 195,371,568 156,301,488 117,210,240 78,140,160

1.5 ms (typ.)

Read: 12.0 ms (typ.)

22 ms (typ.)

84.6 MB/s Max.

1.5 Gbps (150 MB/s) (Gen1i)

9.5 mm × 100.0 mm × 70.0 mm (*5)

*1: Capacity under the LBA mode.

*2: One gigabyte (GB) = one billion bytes and One megabyte (MB) = one million bytes;

accessible capacity will be less and actual capacity depends on the operating environment and formatting.

*3: 1 GB is equal to 1,000,000,000 bytes and 1 MB is equal to 1,000,000 bytes.

1-4 C141-E262

1.2 Device Specifications

*4: 1 MB is equal to 1,048,576 bytes; the actual buffer capacity for data transfer will be less.

Refer to the Section 6.4 of this manual.

*5: The value of Depth (=100.0 mm) does not include PCBA (Printed Circuit Board Assembly).

For details, see Section 3.1.

Table 1.1 lists the formatted capacity, number of logical cylinders, number of heads, and number of sectors of every model for which the CHS mode has been selected using the BIOS setup utility on the host.

Table 1.1 Specifications (2/2)

Model Capacity (*1) No. of Cylinder No. of Heads No. of Sectors

MHY2250BH 8.45 GB 16,383 16 63 MHY2200BH 8.45 GB 16,383 16 63 MHY2160BH 8.45 GB 16,383 16 63 MHY2120BH 8.45 GB 16,383 16 63 MHY2100BH 8.45 GB 16,383 16 63 MHY2080BH 8.45 GB 16,383 16 63 MHY2060BH 8.45 GB 16,383 16 63 MHY2040BH 8.45 GB 16,383 16 63

*1: One gigabyte (GB) = one billion bytes; accessible capacity will be less and actual capacity

depends on the operating environment and formatting.

1.2.2 Model and product number

Table 1.2 lists the model names and product numbers of the disk drive.

The model name does not necessarily correspond to the product number as listed in Table 1.2 since some models have been customized and have specifications that are different from those for the standard model.

If a disk drive is ordered as a replacement drive, the product number must be the same as that of the drive being replaced.

C141-E262 1-5

Device Overview

Table 1.2 Examples of model names and product numbers

Model Name

MHY2250BH 250 GB M3 Depth 3 CA06889-B045 MHY2200BH 200 GB M3 Depth 3 CA06889-B040 MHY2160BH 160 GB M3 Depth 3 CA06889-B036 MHY2120BH 120 GB M3 Depth 3 CA06889-B022 MHY2100BH 100 GB M3 Depth 3 CA06889-B020 MHY2080BH 80 GB M3 Depth 3 CA06889-B028 MHY2060BH 60 GB M3 Depth 3 CA06889-B016 MHY2040BH 40 GB M3 Depth 3 CA06889-B014

*1: One gigabyte (GB) = one billion bytes; accessible capacity will be less and actual capacity

depends on the operating environment and formatting.

Capacity (*1)

(user area)

Mounting screw Order No.

1-6 C141-E262

1.3 Power Requirements

(1) Input Voltage

• + 5 V ± 5 %

• It is unnecessary for this drive to supply +3.3 V and +12 V power supplies.

(2) Ripple

+5 V Maximum 100 mV (peak to peak) Frequency DC to 1 MHz

(3) Slope of an input voltage at rise

The following figure shows the restriction of the slope which is +5 V input voltage at rise. The permissible range of +5 V slope is from 1V/20 µsec to 1V/20 msec, under the voltage range is between 2.0V and 4.5V.

Figure 1.1 Permissible range of +5V rise slope

C141-E262 1-7

Device Overview

(4) A negative voltage like the bottom figure isn't t o occur at +5 V when power is turned

off and, a thing with no ringing.

Permissible level: − 0.2 V

Voltage [V]

-1

0 100 200 300 400 500 600 700 800

Time [ms]

Figure 1.2 The example of negative voltage waveform at +5 V

when power is turned off

1-8 C141-E262

1.3 Power Requirements

(5) Current Requirements and Power Dissipation

Table 1.3 lists the current and power dissipation (typical).

Table 1.3 Current and power dissipation

Typical RMS Current Typical Power (*3)

Spin up (*1) 1.0 A 5.0 W Idle (*6) 120 mA 0.60 W R/W (on track) (*2) 380 mA 1.9 W Seek (*5) 420 mA 2.1 W Standby (*6) 26 mA 0.13 W Sleep (*6) 26 mA 0.13 W

e rank (0.0024 W/GB): MHY2250BH e rank (0.0030 W/GB): MHY2200BH

Energy Efficiency (*4)

e rank (0.0038 W/GB): MHY2160BH d rank (0.0050 W/GB): MHY2120BH

⎯

d rank (0.0060 W/GB): MHY2100BH d rank (0.0075 W/GB): MHY2080BH d rank (0.0100 W/GB): MHY2060BH

d rank (0.0150 W/GB): MHY2040BH *1 Maximum current and power at starting spindle motor. *2 Current and power level when the operation (command) that accompanies a

transfer of 63 sectors is executed 3 times in 100 ms *3 Power requirements reflect typical values for +5 V power. *4 Energy efficiency based on the Law concerning the Rational Use of Energy

indicates the value obtained by dividing power consumption by the storage

capacity. (Japan only) *5 The seek average current is specified based on three operations per 100

msec. *6 IPM mode: Slumber mode.

C141-E262 1-9

Device Overview

(6) Current fluctuation (Typ.) at +5 V when power is turned on

Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on

1.4 Environmental Specifications

Table 1.4 lists the environmental specifications.

Table 1.4 Environmental specificati ons

Item Specification Temperature

• Operating

• Non-operating

• Thermal Gradient

Humidity

• Operating

• Non-operating

• Maximum Wet Bulb

Altitude (relative to sea level)

• Operating

• Non-operating

5 °C to 55 °C (ambient) 5 °C to 60 °C (disk enclosure surface) –40 °C to 65 °C 20 °C/h or less

8 % to 90 % RH (Non-condensing) 5 % to 95 % RH (Non-condensing) 29 °C (Operating)

40 °C (Non-operating)

–300 to 3,000 m –300 to 12,000 m

1-10 C141-E262

1.5 Acoustic Noise

Table 1.5 lists the acoustic noise specification.

Table 1.5 Acoustic noise specification

Item Specification

• Idle mode (DRIVE READY)

Sound Power

Sound Pressure (at 0.3m)

2.0B [MHY2120BH, MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH]

2.4B [MHY2250BH, MHY2200BH, MHY2160BH]

22dB [MHY2120BH, MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH] 28dB [MHY2250BH, MHY2200BH, MHY2160BH]

Note:

Measure the noise from the cover top surface.

1.6 Shock and Vibration

Table 1.6 lists the shock and vibration specification.

Table 1.6 Shock and vibration specification

Item Specification

Vibration (Swept sine, 1/4 octave per minute)

• Operating

Non-operating

5 to 500 Hz, 9.8m/s

0-peak (1G 0-peak)

(without non-recovered errors)

5 to 500 Hz, 49m/s

0-peak (5G 0-peak)

(no damage)

Shock (half-sine pulse)

• Operating

• Non-operating

3185 m/s

0-peak (325G 0-peak) 2ms duration (without non-recovered errors)

8820 m/s

0-peak (900G 0-peak)

1ms duration

1176 m/s

0-peak (120G 0-peak)

11ms duration

(no damage)

C141-E262 1-11

Device Overview

1.7 Reliability

(1) Mean time between failures (MTBF)

Conditions of 300,000 h Power-on time 250H/month or less 3000H/years

or less Operating time 20 % or less of power-on time Temperature

Humidity

MTBF is defined as follows: Total operation time in all fields

MTBF= (H) number of device failure in all fields (*1)

*1 "Disk drive defects" refers to defects that involve repair, readjustment, or

replacement. Disk drive defects do not include failures caused by external factors, such as damage caused by handling, inappropriate operating environments, defects in the power supply host system, or interface cable.

5 to 60 °C (Disk Enclosure surface)

8 to 90 % (ambient)

But humidity bulb temperature

29 °C or less

(2) Mean time to repair (MTTR)

The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance staff member.

(3) Service life

In situations where management and handling are correct, the disk drive requires no overhaul for five years when the DE surface temperature is less than 48 °C. When the DE surface temperature exceeds 48 °C, the disk drives requires no overhaul for five years or 20,000 hours of operation, whichever occurs first. Refer to item (3) in Subsection 3.2 for the measurement point of the DE surface temperature. The operating conditions of Service life are based on the equal conditions with MTBF.

(4) Data assurance in the event of power failure

Except for the data block being written to, the data on the disk media is assured in the event of any power supply abnormalities. This does not include power supply abnormalities during disk media initialization (formatting) or processing of defects (alternative block assignment).

1-12 C141-E262

1.8 Error Rate

Known defects, for which alternative blocks can be assigned, are not included in the error rate count below. It is assumed that the data blocks to be accessed are evenly distributed on the disk media.

(1) Unrecoverable read error

Read errors that cannot be recovered by maximum read retries of drive without user's retry and ECC corrections shall occur no more than 1 time when reading data of 10 recovery procedure, and include read retries accompanying head offset operations.

(2) Positioning error

bits. Read retries are executed according to the disk drive's error

Positioning (seek) errors that can be recovered by one retry shall occur no more than 1 time in 10

seek operations.

1.9 Media Defects

Defective sectors are replaced with alternates when the disk drive is formatted prior to shipment from the factory (low level format). Thus, the hosts see a defect-free device.

Alternate sectors are automatically accessed by the disk drive. The user need not be concerned with access to alternate sectors.

1.10 Load/Unload Function

The Load/Unload function is a mechanism that loads the head on the disk and unloads the head from the disk.

The product supports a minimum of 600,000 Load/Unload cycles. Unload is a normal head unloading operation and the commands listed below are executed.

• STANDBY command issued

• STANDBY IMMEDIATE command issued

• SLEEP command issued

• IDLE IMMEDIATE command (with unload feature) issued

• Power Mode shifted with APM or APS feature.

• SLUMBER signal transferred

(PMREQ_S signal is transferred from the host or the drive, and the host responds with PMACK signal.)

C141-E262 1-13

Device Overview

Emergency Unload other than Unload is performed when the power is shut down while the heads are still loaded on the disk. The product supports the Emergency Unload a minimum of 20,000 times. When the power is shut down, the controlled Unload cannot be executed. Therefore, the number of Emergency other than Unload is specified.

1.10.1 Recommended power-off sequence

We recommend cutting the power supply of the HDD for this device after the Head Unload operation completes. The recommended power supply cutting sequence for this device is as follows:

1) Disk Flush

Flush Cache command execution.

2) Head Unload

Standby Immediate command execution.

3) Wait Status

Checking whether bit 7 of the status register was set to '0'. (wait to complete STANDBY IMMEDIATE command)

4) HDD power supply cutting

1.11 Advanced Power Management (APM)

The disk drive automatically shifts to the power saving mode according to the setting of the APM mode under the idle condition.

The APM mode can be chosen with a Sector Count register of the SET FEATURES (EF) command.

The disk drive complies with the three kinds of APM modes that a command from the host is required.

FR = 05h : Enable APM

SC = C0h - FEh : SC = 80h - BFh :

Mode-0 Active Idle → Low Power Idle Mode-1 Active Idle → Low Power Idle (Default)

SC = 01h - 7Fh :

FR = 85h : Disable APM (Set Mode-0)

Active Idle: The head is in a position of extreme inner in disk

1-14 C141-E262

Mode-2 Active Idle → Low Power Idle → Standby

medium. (VCM Lock)

1.11 Advanced Power Management (APM)

Low Power Idle: The head is unloaded from disk.

The spindle motor rotates.

Standby: The spindle motor stops.

In APM Mode-1, which is the APM default mode, the operation status shifts till it finally reaches "Low Power Idle."

Table 1.7 Advanced Power Management

APM Mode

Active Idle

(VCM Lock)

Low Power Idle

(Unload)

Standby

(Spin Off) Mode-0 0.2-1.2 sec 15 min. N/A Mode-1 0.1-0.2 sec 10.0-27.5 sec N/A Mode-2 0.1-0.2 sec 10.0-27.5 sec 10.0-40.0 sec

When the maximum time that the HDD is waiting for commands has been exceeded:

Mode-0: Mode shifts from Active condition to Active Idle in 0.2-1.2, and to Low

Power Idle in 15 minutes.

Mode-1: Mode shifts from Active condition to Active Idle in 0.1-0.2 seconds and

to Low Power Idle in 10.0-27.5 seconds.

Mode-2: Mode shifts from Active condition to Active Idle in 0.1-0.2 seconds and

to Low Power Idle in 10.0-27.5 seconds. After 10.0-40.0 seconds in Low Power Idle, the mode shifts to standby.

Remark:

The default values of these settings are reflected in the WORD 91 values of the IDENTIFY DEVICE command. Also, the APM mode is initialized to Mode-1 (default value) at power-off.

The above mentioned is time until shifting to each power mode based on point that the drive becomes a command waiting state.

C141-E262 1-15

Device Overview

1.12 Interface Power Management (IPM)

1.12.1 Host-initiated interface power management (HIPM)

When the disk drive is waiting for commands, it can enter one of three IPM modes as requested by the host. The three IPM modes are:

1) Partial mode: PMREQ_P is sent when the host requests the Partial mode.

2) Slumber mode: PMREQ_S is sent when the host requests the Slumber mode.

3) Active mode: When the serial ATA interface is in active state. There are three interface (I/F) power states: Active, Partial, and Slumber. As

requested by the host, the disk drive switches its I/F power state from the Active state to the Partial state, or from the Active state to the Slumber state.

1.12.2 Device-initiated interface power management (DIPM)

If this function is enabled by Set Features command, the disk drive shifts to two kinds of IPM modes automatically under the Idle condition.

1) Partial mode: PMREQ_P is sent when the disk drive requests the Partial mode.

2) Slumber mode: PMREQ_S is sent when the disk drive requests the Slumber mode.

I/F power states

1) Active state

The SATA interface is active, and data can be sent and received.

2) Partial state

The SATA interface is in the Power Down state. In this state, the interface is switched to the Partial state when a PMREQ_P signal is received from or sent to host. Because the return time to the Active state from the Partial state is specified as within 10 µs, the degree of the I/F Power Save mode is shallow so that this recovery time is satisfied.

3) Slumber state

The SATA interface is in the Power Down state. In this state, the interface is switched to the Slumber state when a PMREQ_S signal is received from or sent to host. Because the return time to the Active state from the Slumber state is specified as within 10 ms, the degree of the I/F Power Save mode is deep so that this recovery time is satisfied.

1-16 C141-E262

1.12 Interface Power Management (IPM)

Table 1.8 Interface power management

IPM Mode I/F power state Return time to active I/F condition

Active Active State Partial Partial State

Slumber Slumber State 5 to 10 ms maximum Power Down

5 to 10 µs maximum

−

Active

Power Down

C141-E262 1-17

This page is intentionally

left blank.

CHAPTER 2 Device Configuration

2.1 Device Configuration

2.2 System Configuration

This chapter describes the internal configurations of the hard disk drives and the configuration of the systems in which they operate.

C141-E262 2-1

Device Configuration

2.1 Device Configuration

Figure 2.1 shows the disk drive. The disk drive consists of a disk enclosure (DE), read/write preamplifier, and controller PCA. The disk enclosure contains the disk media, heads, spindle motor, actuator, and a circulating air filter.

(1) Disk

The outer diameter of the disk is 65 mm. The inner diameter is 20 mm.

(2) Head

The heads are of the load/unload (L/UL) type. The head unloads the disk out of while the disk is not rotating and loads on the disk when the disk starts.

(3) Spindle motor

The disks are rotated by a direct drive Sensor-less DC motor.

(4) Actuator

The actuator uses a revolving voice coil motor (VCM) structure which consumes low power and generates very little heat. The head assembly at the edge of the actuator arm is controlled and positioned by feedback of the servo information read by the read/write head. If the power is not on or if the spindle motor is stopped, the head assembly stays on the ramp out of the disk and is fixed by a mechanical lock.

Figure 2.1 Disk drive outerview

2-2 C141-E262

2.2 System Configuration

(5) Air circulation system

The disk enclosure (DE) is sealed to prevent dust and dirt from entering. The disk enclosure features a closed loop air circulation system that relies on the blower effect of the rotating disk. This system continuously circulates the air through the circulation filter to maintain the cleanliness of the air within the disk enclosure.

(6) Read/write circuit

The read/write circuit uses a LSI chip for the read/write preamplifier. It improves data reliability by preventing errors caused by external noise.

(7) Controller circuit

The controller circuit supports Serial-ATA interface, and it realized a high performance by integration into LSI.

2.2 System Configuration

2.2.1 SATA interface

Figure 2.2 shows the SATA interface system configuration. The disk drive complies with ATA-8 ACS AST, Serial ATA Revision 2.5 (Gen1i).

2.2.2 Drive connection

Operating System

Application 1

Application 2

Application 3

Driver

Serial ATA Adapter

Disk Drive

Figure 2.2 Drive system configuration

C141-E262 2-3

This page is intentionally

left blank.

CHAPTER 3 Installation Conditions

3.1 Dimensions

3.2 Mounting

3.3 Connections with Host System

This chapter gives the external dimensions, installation conditions, surface temperature conditions, cable connections, and switch settings of the hard disk drives.

C141-E262 3-1

Installation Conditions

3.1 Dimensions

Figure 3.1 illustrates the dimensions of the disk drive. All dimensions are in mm.

*1 The PCA and connectors are not included in these dimensions. *2 Dimension from the center of the user tap to the base of the connector pins *3 Length of the connector pins *4 Dimension from the outer edge of the user tap to the center of the connector

pins

*5 Dimension from the outer edge of the user tap to the innermost edge of the

connector pins

Figure 3.1 Dimensions

3-2 C141-E262

3.2 Mounting

For information on mounting, see the "FUJITSU 2.5-INCH HDD INTEGRATION GUIDANCE (C141-E144)."

(1) Orientation

The disk drives can be mounted in any direction.

(2) Frame

The MR head bias of the HDD disk enclosure (DE) is zero. The mounting frame is connected to Signal Ground (SG).

Use M3 screw for the mounting screw and the screw length should satisfy the specification in Figure 3.2.

The tightening torque must be 0.49N When attaching the HDD to the system frame, do not allow the

system frame to touch parts (cover and base) other than parts to which the HDD is attached.

•m (5kgf•cm).

C141-E262 3-3

Installation Conditions

(3) Limitation of mounting

Note) These dimensions are recommended values; if it is not possible to satisfy

them, contact us.

Bottom surface mounting

Side surface mounting

2.5 2.5

Frame of system cabinet

3.0 or less

2.5

Frame of system cabinet

Screw

3.0 or less

Details of A

Figure 3.2 Mounting frame structure

PCA

Screw

3-4 C141-E262

3.2 Mounting

Because of breather hole mounted to the HDD, do not allow this to close during mounting.

Locating of breather hole is shown as Figure 3.3. For breather hole of Figure 3.3, at least, do not allow its around

φ 3

to block.

Figure 3.3 Location of breather

C141-E262 3-5

Installation Conditions

(4) Ambient temperature

The temperature conditions for a disk drive mounted in a cabinet refer to the ambient temperature at a point 3 cm from the disk drive. The ambient temperature must satisfy the temperature conditions described in Section 1.4, and the airflow must be considered to prevent the DE surface cover temperature from exceeding 60

°C.

Provide air circulation in the cabinet such that the PCA side, in particular, receives sufficient cooling. To check the cooling efficiency, measure the surface cover temperatures of the DE. Regardless of the ambient temperature, this surface cover temperature must meet the standards listed in Table 3.1. Figure 3.4 shows the temperature measurement point.

Figure 3.4 Surface cover temperature measurement points

Table 3.1 Surface temperature measurement points and standard values

No. Measurement point Temperature

1 DE cover

°C max

3-6 C141-E262

3.2 Mounting

(5) Service area

Figure 3.5 shows how the drive must be accessed (service areas) during and after installation.

Mounting screw hole

Cable connection

Figure 3.5 Service area

Mounting screw hole

Data corruption: Avoid mounting the disk drive near strong

magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.

Damage: Do not press the cover of the disk drive. Pressing it too

hard, the cover and the spindle motor contact, which may cause damage to the disk drive.

Static: When handling the device, disconnect the body ground

Ω or greater). Do not touch the printed circuit board, but

(500 k hold it by the edges.

(6) Handling cautions

Please keep the following cautions, and handle the HDD under the safety environment.

C141-E262 3-7

Installation Conditions

ying

- General notes

ESD mat

Wrist strap

Use the Wrist stra

Do not hit HDD each other.

Do not to avoid fallin

lace HDD vertically

down.

Shock absorbing mat

Place the shock absorbing mat on the operation table, and place ESD mat on it.

Do not stack when carr

Do not dro

Figure 3.6 Handling cautions

- Installation

(1) Please use the driver of a low impact when you use an electric driver.

HDD is occasionally damaged by the impact of the driver.

(2) Please observe the tightening torque of the screw strictly.

⋅⋅⋅⋅⋅⋅ 0.49N • m (5 kgf • cm).

Recommended equipments

Contents Model Maker

Wrist strap JX-1200-3056-8 SUMITOMO 3M ESD

ESD mat SKY-8A (Color Seiden Mat) Achilles

Shock Low shock driver SS-6500 HIOS

3-8 C141-E262

3.3 Connections with Host System

3.3.1 Device connector

The disk drive has the SATA interface connectors listed below for connecting external devices. Figure 3.7 shows the locations of these connectors and terminals.

SATA interface and power connectors

PCA

Figure 3.7 Connector locations

C141-E262 3-9

Installation Conditions

3.3.2 Signal segment and power supply segment

Figure 3.8 shows each segment of the SATA interface connector and pin numbers.

View from the connector side

Power supply

segment

P1 pins in the power

supply segment

Signal segment

S1 pins in the signal

segment

Figure 3.8 Power supply pins (CN1)

3.3.3 Connector specifications for host system

The connector of host system for mating with the disk drive must be compliant with Serial-ATA Revision 2.5 specification. For detail of requirements about SATA interface connector, refer to the "Serial-ATA Revision 2.5."

View from the PCA side

The connection reliability per number of insertion/extractions varies with the condition of the connection with the host system. Therefore, we recommend that the customer evaluate the connector on the customer's system and select it from the connectors complying with the Serial ATA Revision 2.5 specification.

3-10 C141-E262

3.3 Connections with Host System

3.3.4 SATA interface cable connection

The cable that connects the disk drive to the host system must be compliant with the Serial ATA Revision 2.5 specification.

3.3.5 Note about SATA interface cable connection

Take note of the following precaution about plugging a SATA interface cable into the SATA interface connector of the disk drive and plugging the connector into a host receptacle:

When plugging together the disk drive SATA interface connector and the host receptacle or SATA interface cable connector, do not apply more than 10 kgf of force in the connection direction once they are snugly and securely in position.

Removing the cable without releasing the SATA interface Latch may lead to connector damage and the loss of the Latch function. Accordingly, be sure to remove the cable while releasing the Latch.

C141-E262 3-11

This page is intentionally

left blank.

CHAPTER 4 Theory of Device Operation

4.1 Outline

4.2 Subassemblies

4.3 Circuit Configuration

4.4 Power-on Sequence

4.5 Self-calibration

4.6 Read/write Circuit

4.7 Servo Control

This chapter explains basic design concepts of the disk drive. Also, this chapter explains subassemblies of the disk drive, each sequence, servo control, and electrical circuit blocks.

C141-E262 4-1

Theory of Device Operation

4.1 Outline

This chapter consists of two parts. First part (Section 4.2) explains mechanical assemblies of the disk drive. Second part (Sections 4.3 through 4.7) explains a servo information recorded in the disk drive and drive control method.

4.2 Subassemblies

The disk drive consists of a disk enclosure (DE) and printed circuit assembly (PCA).

The DE contains all movable parts in the disk drive, including the disk, spindle, actuator, read/write head, and air filter. For details, see Subsections 4.2.1 to 4.2.4.

The PCA contains the control circuits for the disk drive. The disk drive has one PCA. For details, see Sections 4.3.

4.2.1 Disk

The DE contains disks with an outer diameter of 65 mm and an inner diameter of 20 mm.

Servo data is recorded on each cylinder (total 162). Servo data written at factory is read out by the read head. For servo data, see Section 4.7.

4.2.2 Spindle

The spindle consists of a disk stack assembly and spindle motor. The disk stack assembly is activated by the direct drive sensor-less DC spindle motor, which has a speed of 5,400 rpm ±1%. The spindle is controlled with detecting a PHASE signal generated by counter electromotive voltage of the spindle motor at starting.

4.2.3 Actuator

The actuator consists of a voice coil motor (VCM) and a head carriage. The VCM moves the head carriage along the inner or outer edge of the disk. The head carriage position is controlled by feeding back the difference of the target position that is detected and reproduced from the servo information read by the read/write head.

4-2 C141-E262

4.2.4 Air filter

There are two types of air filters: a breather filter and a circulation filter.

The breather filter makes an air in and out of the DE to prevent unnecessary pressure around the spindle when the disk starts or stops rotating. When disk drives are transported under conditions where the air pressure changes a lot, filtered air is circulated in the DE.

The circulation filter cleans out dust and dirt from inside the DE. The disk drive cycles air continuously through the circulation filter through an enclosed loop air cycle system operated by a blower on the rotating disk.

4.3 Circuit Configuration

Figure 4.1 shows the power supply configuration of the disk drive, and Figure 4.2 shows the disk drive circuit configuration.

(1) Read/write circuit

4.3 Circuit Configuration

The read/write circuit consists of two circuits; read/write preamplifier (PreAMP) and read channel (RDC) which is integrated into LSI with MCU and HDC.

The PreAMP consists of the write current switch circuit, that flows the write current to the head coil, and the voltage amplifier circuit, that amplitudes the read output from the head.

The RDC is the read demodulation circuit using the Modified Extended Partial Response (MEEPR), and contains the Viterbi detector, programmable filter, adaptable transversal filter, times base generator, data separator circuits, RLL (Run Length Limited) encoder and servo demodulation circuit.

(2) Servo circuit

The position and speed of the voice coil motor are controlled by closed-loop servo using the servo information recorded on the data surface. The servo information is an analog signal converted to digital for processing by a MPU and then reconverted to an analog signal for control of the voice coil motor.

The MPU precisely sets each head on the track according on the servo information on the media surface.

(3) Spindle motor driver circuit

The circuit measures the interval of a PHASE signal generated by counterelectromotive voltage of a motor and controls the motor speed comparing target speed.

C141-E262 4-3

Theory of Device Operation

(4) Controller circuit

Major functions are listed below.

• Serial-ATA interface control and data transfer control

• Data buffer management

• Sector format control

• Defect management

• ECC control

• Error recovery and self-diagnosis

5.0V

S-DRAM SVC 3.3V

Generator Circuit

MCU & HDC & RDC

Integration

Figure 4.1 Power supply configuration

3.3V

1.2V

1.2V Generator Circuit

-3V Generator Circuit

PreAMP

-3.0V

4-4 C141-E262

PCA

4.3 Circuit Configuration

Serial-ATA Interface

Data Buffer

SDRAM

SVC

Shock

Sensor

Crystal

MCU & HDC & RDC

MCU

HDC

RDC

SP Motor

Media

VCM

HEAD

Figure 4.2 Circuit configuration

Thermistor

R/W Pre-Amp

C141-E262 4-5

Theory of Device Operation

4.4 Power-on Sequence

Figure 4.3 describes the operation sequence of the disk drive at power-on. The outline is described below.

a) After the power is turned on, the disk drive initializes its SATA interface

block.

b) The disk drive executes the MPU bus test, internal register read/write test,

and work RAM read/write test. When the self-diagnosis terminates

successfully, the disk drive starts the spindle motor. c) The disk drive executes self-diagnosis (data buffer read/write test). d) After confirming that the spindle motor has reached rated speed, the head

assembly is loaded on the disk. e) The disk drive positions the heads onto the SA area and reads out the system

information. f) The drive becomes ready. The host can issue commands. g) The disk drive executes self -calibration. This collects data for VCM torque

and mechanical external forces applied to the actuator, and updates the

calibrating value.

4-6 C141-E262

Power-on

4.4 Power-on Sequence

Start

SATA I/F Initialization

Self-diagnosis 1

- MPU bus test

- Internal regist er write/read test

- Work RAM write/read test

The spind le motor starts.

Self-diagnosis 2

- Data buffer write/ read test

Confirming spindle motor speed

Load the head assembly

Initial on-track and read out of system information

Drive ready state (command waiting state)

Execute self-calibration

End

Figure 4.3 Power-on operation sequence

C141-E262 4-7

Theory of Device Operation

4.5 Self-calibration

The disk drive occasionally performs self-calibration in order to sense and calibrate mechanical external forces on the actuator, and VCM torque. This enables precise seek and read/write operations.

4.5.1 Self-calibration contents

(1) Sensing and compensating for external forces

The actuator suffers from torque due to the FPC forces and winds accompanying disk revolution. The torque varies with the disk drive and the cylinder where the head is positioned. To execute stable fast seek operations, external forces are occasionally sensed.

The firmware of the drive measures and stores the force (value of the actuator motor drive current) that balances the torque for stopping head stably. This includes the current offset in the power amplifier circuit and DAC system.

The forces are compensated by adding the measured value to the specified current value to the power amplifier. This makes the stable servo control.

To compensate torque varying by the cylinder, the disk is divided into 13 areas from the innermost to the outermost circumference and the compensating value is measured at the measuring cylinder on each area at factory calibration. The measured values are stored in the SA cylinder. In the self-calibration, the compensating value is updated using the value in the SA cylinder.

(2) Compensating open loop gain

Torque constant value of the VCM has dispersion for each drive, and varies depending on the cylinder that the head is positioned. To realize the high speed seek operation, the value that compensates torque constant value change and loop gain change of the whole servo system due to temperature change is measured and stored.

For sensing, the firmware mixes the disturbance signal to the position signal at the state that the head is positioned to any cylinder. The firmware calculates the loop gain from the position signal and stores the compensation value against to the target gain as ratio.

For compensating, the direction current value to the power amplifier is multiplied by the compensation value. By this compensation, loop gain becomes constant value and the stable servo control is realized.

4-8 C141-E262

To compensate torque constant value change depending on cylinder, whole cylinders from most inner to most outer cylinder are divided into 13 partitions at calibration in the factory, and the compensation data is measured for representative cylinder of each partition. This measured value is stored in the SA area. The compensation value at self-calibration is calculated using the value in the SA area.

4.5.2 Execution timing of self-calibration

Self-calibration is performed once when power is turned on. After that, the disk drive does not perform self-calibration until it detects an error.

That is, self-calibration is performed each time one of the following events occur:

• In the case that the disk drive starts up normally, the first part of self-

calibration starts after a lapse of 100 msec. The execution of first part is about 150 msec. length. The remains is executed thereafter the transfer to Active-Idle state which takes about 200 msec. The latter is interrupted when the disk drive receives a Host command, and it resumes after next transfer to Active-Idle state.

4.5 Self-calibration

• The number of retries to write or seek data reaches the specified value.

• The error rate of data reading, writing, or seeking becomes lower than the

specified value.

4.5.3 Command processing during self-calibration

This enables the host to execute the command without waiting for a long time, even when the disk drive is performing self-calibration. The command execution wait time is about maximum 72 ms.

When the error rate of data reading, writing, or seeking becomes lower than the specified value, self-calibration is performed to maintain disk drive stability.

If the disk drive receives a command execution request from the host while performing self-calibration, it stops the self-calibration and starts to execute the command. In other words, if a disk read or write service is necessary, the disk drive positions the head to the track requested by the host, reads or writes data, and then restarts calibration after about 3 seconds.

If the error rate recovers to a value exceeding the specified value, self-calibration is not performed.

C141-E262 4-9

Theory of Device Operation

4.6 Read/write Circuit

The read/write circuit consists of the read/write preamplifier (PreAMP), the write circuit, the read circuit, and the time base generator in the read channel (RDC) block which is integrated into LSI. Figure 4.4 is a block diagram of the read/write circuit.

4.6.1 Read/write preamplifier (PreAMP)

PreAMP equips a read preamplifier and a write current switch, that sets the bias current to the MR device and the current in writing. Each channel is connected to each data head, and PreAMP switches channel by serial I/O. In the event of any abnormalities, including a head short-circuit or head open circuit, the write unsafe signal is generated so that abnormal write does not occur.

4.6.2 Write circuit

The write data is transferred from the hard disk controller (HDC) to the RDC in LSI. The write data is sent to the PreAMP as differential signal from LSI, and the data is written onto the media.

(1) Write precompensation

Write precompensation compensates, during a write process, for write nonlinearity generated at reading.

Figure 4.4 Read/write circuit bl ock di agram

4-10 C141-E262

4.6.3 Read circuit

The head read signal from the PreAMP is regulated by the automatic gain control (AGC) circuit. Then the output is converted into the sampled read data pulse by the programmable filter circuit and the flash digitizer circuit. This signal is converted into the read data by the decorder circuit based on the read data maximum-likelihood-detected by the Viterbi detection circuit.

(1) AGC circuit

The AGC circuit automatically regulates the output amplitude to a constant value even when the input amplitude level fluctuates. The AGC amplifier output is maintained at a constant level even when the head output fluctuates due to the head characteristics or outer/inner head positions.

(2) Programmable filter circuit

The programmable filter circuit has a low-pass filter function that eliminates unnecessary high frequency noise component and a high frequency boost-up function that equalizes the waveform of the read signal.

4.6 Read/write Circuit

-3 dB

Cut-off frequency of the low-pass filter and boost-up gain are controlled from the register in read channel block. The MPU optimizes the cut-off frequency and boost-up gain according to the transfer frequency of each zone.

Figure 4.5 shows the frequency characteristic sample of the programmable filter.

Figure 4.5 Frequency characteristic of programmable fi l t er

C141-E262 4-11

Theory of Device Operation

(3) FIR circuit

This circuit is 10-tap sampled analog transversal filter circuit that equalizes the head read signal to the Modified Extended Partial Response (MEEPR) waveform.

(4) A/D converter circuit

This circuit changes Sampled Read Data Pulse from the FIR circuit into Digital Read Data.

(5) Viterbi detection circuit

The sample hold waveform output from the flash digitizer circuit is sent to the Viterbi detection circuit. The Viterbi detection circuit demodulates data according to the survivor path sequence.

4.6.4 Digital PLL circuit

The drive uses constant density recording to increase total capacity. This is different from the conventional method of recording data with a fixed data transfer rate at all data area. In the constant density recording method, data area is divided into zones by radius and the data transfer rate is set so that the recording density of the inner cylinder of each zone is nearly constant. The drive divides data area into 30 zones to set the data transfer rate.

The MPU set the data transfer rate setup data (SD/SC) to the RDC block that includes the Digital PLL circuit to change the data transfer rate.

4-12 C141-E262

4.7 Servo Control

The actuator motor and the spindle motor are submitted to servo control. The actuator motor is controlled for moving and positioning the head to the track containing the desired data. To turn the disk at a constant velocity, the actuator motor is controlled according to the servo data that is written on the data side beforehand.

4.7.1 Servo control circuit

Figure 4.6 is the block diagram of the servo control circuit. The following describes the functions of the blocks:

(1)

MPU/HDC/RDC

(2)

Head

Servo burst capture

MPU core

(3)

DAC

SVC

(4)

Power Amp

4.7 Servo Control

VCM current

CSR: Current Sense Resister VCM: Voice Coil Motor

Figure 4.6 Block diagram of servo control circuit

Position Sense

(5)

Spindle motor control

(6)

Driver

(7)

CSR

VCM

Spindle motor

C141-E262 4-13

Theory of Device Operation

(1) Microprocessor unit (MPU)

The MPU executes startup of the spindle motor, movement to the reference cylinder, seek to the specified cylinder, and calibration operations.

The main internal operations of the MPU are shown below.

a. Spindle motor start

Starts the spindle motor and accelerates it to normal speed when power is

applied. b. Move head to reference cylinder

Drives the VCM to position the head at the any cylinder in the data area. The

logical initial cylinder is at the outermost circumference (cylinder 0). c. Seek to specified cylinder

Drives the VCM to position the head to the specified cylinder. d. Calibration

Senses and stores the thermal offset between heads and the mechanical forces

on the actuator, and stores the calibration value.

(2) Servo burst capture circuit

The servo burst capture circuit reproduces signals (position signals) that indicate the head position from the servo data on the data surface. From the servo area on the data area surface, via the data head, the burst signals of EVEN1, ODD, EVEN2 are output as shown in Figure 4.8 in subsequent to the servo mark, gray code that indicates the cylinder position, and index information. The servo signals do A/D-convert by Fourier-demodulator in the servo burst capture circuit. At that time the AGC circuit is in hold mode. The A/D converted data is recognized by the MPU as position information.

(3) D/A converter (DAC)

The control program calculates the specified data value (digital value) of the VCM drive current, and the value is converted from digital-to-analog so that an analog output voltage is sent to the power amplifier.

(4) Power amplifier

The power amplifier feeds currents, corresponding to the DAC output signal voltage to the VCM.

(5) Spindle motor control circuit

The spindle motor control circuit controls the sensor-less spindle motor. A spindle driver IC with a built-in PLL circuit that is on a hardware unit controls the sensor-less spindle motor.

4-14 C141-E262

(6) Driver circuit

The driver circuit is a power amplitude circuit that receives signals from the spindle motor control circuit and feeds currents to the spindle motor.

(7) VCM current sense resistor (CSR)

This resistor controls current at the power amplifier by converting the VCM current into voltage and feeding back.

4.7.2 Data-surface servo format

Figure 4.7 describes the physical layout of the servo frame. The three areas indicated by (1) to (3) in Figure 4.7 are described below.

(1) Inner guard band

This area is located inside the user area, and the rotational speed of the VCM can be controlled on this cylinder area for head moving.

(2) Data area

4.7 Servo Control

This area is used as the user data area and SA area.

(3) Outer guard band

This area is located at outer position of the user data area, and the rotational speed of the spindle can be controlled on this cylinder area for head moving.

C141-E262 4-15

Theory of Device Operation

Servo frame (190 servo frames per revolution)

CYLn + 1

W/R Recovery Servo Mark Gray Code

CYLn CYLn – 1 (n: even number)

W/R Recovery Servo Mark Gray Code

EVEN1

ODD

EVEN2

Post code (particular models only)

PAD

W/R Recovery Servo Mark Gray Code

Diameter

direction

Circumference

Direction

Erase: DC erase

area

Figure 4.7 Physical sector servo configuration on disk surf ace

4-16 C141-E262

4.7.3 Servo frame format

As the servo information, the IDD uses the phase signal servo generated from the gray code and servo EVEN and ODD. This servo information is used for positioning operation of radius direction and position detection of circumstance direction.

Basically, the servo frame consists of 5 blocks; write/read recovery, servo mark, gray code, Burst EVEN1, Burst ODD, Burst EVEN2, and PAD. Figure 4.8 shows the servo frame format.

4.7 Servo Control

Write/read recovery

(1) Write/read recovery

(2) Servo mark

(3) Gray code (including sector address bits)

Servo

mark

This area is used to absorb the write/read transient and to stabilize the AGC.

This area generates a timing for demodulating the gray code and positiondemodulating the burst signal by detecting the servo mark.

This area is used as cylinder address. The data in this area is converted into the binary data by the gray code demodulation circuit.

Gray code Burst

EVEN1

Figure 4.8 Servo frame format

Burst ODD

Burst EVEN2

Post

code

(particular

models

only)

PAD

(4) Burst Even1, Burst Odd, Burst Even2

These areas are used as position signals between tracks and the IDD control so that target phase signal is generated from Burst Even and Burst Odd.

(5) Post code (particular models only)

This area is used for the precise correction of the servo information which is recorded on the media.

(6) PAD

This area is used as a gap between servo and data.

C141-E262 4-17

Theory of Device Operation

4.7.4 Actuator motor control

The voice coil motor (VCM) is controlled by feeding back the servo data recorded on the data surface. The MPU fetches the position sense data on the servo frame at a constant interval of sampling time, executes calculation, and updates the VCM drive current.

The servo control of the actuator includes the operation to move the head to the reference cylinder, the seek operation to move the head to the target cylinder to read or write data, and the track-following operation to position the head onto the target track.

(1) Operation to move the head to the ref er ence cylinder

The MPU moves the head to the reference cylinder when the power is turned. The reference cylinder is in the data area.

When power is applied the heads are moved from the outside of media to the normal servo data zone in the following sequence:

a) Micro current is fed to the VCM to press the head against the outer direction. b) The head is loaded on the disk. c) When the servo mark is detected the head is moved slowly toward the inner

circumference at a constant speed. d) If the head is stopped at the reference cylinder from there. Track following

control starts.

(2) Seek operation

Upon a data read/write request from the host, the MPU confirms the necessity of access to the disk. If a read/write instruction is issued, the MPU seeks the desired track.

The MPU feeds the VCM current via the D/A converter and power amplifier to move the head. The MPU calculates the difference (speed error) between the specified target position and the current position for each sampling timing during head moving. The MPU then feeds the VCM drive current by setting the calculated result into the D/A converter. The calculation is digitally executed by the firmware. When the head arrives at the target cylinder, the track is followed.

(3) Track following operation

Except during head movement to the reference cylinder and seek operation under the spindle rotates in steady speed, the MPU does track following control. To position the head at the center of a track, the DSP drives the VCM by feeding micro current. For each sampling time, the VCM drive current is determined by filtering the position difference between the target position and the position clarified by the detected position sense data. The filtering includes servo compensation. These are digitally controlled by the firmware.

4-18 C141-E262

4.7.5 Spindle motor control

Hall-less three-phase twelve-pole motor is used for the spindle motor, and the PWM type current control circuit is used as the spindle motor driver (called SVC hereafter). The firmware operates on the MPU manufactured by Fujitsu. The spindle motor is controlled by sending several signals including the serial data from the MPU to the SVC. There are three modes for the spindle control; start mode, acceleration mode, and stable rotation mode.

(1) Start mode

When power is supplied, the spindle motor is started in the following sequence:

a) After the power is turned on, the MPU sends the serial data to the SVC to

charge the charge pump capacitor of the SVC.

b) When the charge pump capacitor is charged enough, the MPU sets the SVC

to the motor start mode. It moves to 3) or 5) step depending on the condition of spindle motor. It is treaded as the stop condition, it moves to the step 3). Whereas, it is treated as the free-wheeling condition, it moves to the step 5).

4.7 Servo Control

c) The phase of the current flowed in the motor is changed in the order of (V-

phase to U-phase), (W-phase to U-phase), (W-phase to V-phase), (U-phase to V-phase), (U-phase to W-phase), and (V-phase to W-phase) (after that, repeating this order). The above operations mean the generation of rotational magnetic field.

d) During phase switching, the spindle motor starts rotating in low speed, and

generates a back electromotive force. The SVC detects this back electromotive force and reports to the MPU using a PHASE signal for speed detection.

e) The MPU is waiting for a PHASE signal. When no phase signal is sent for a

specific period, the MPU resets the SVC and starts from the beginning. When a PHASE signal is sent, the SVC enters the acceleration mode.

(2) Acceleration mode

In this mode, the MPU stops the phase switching to the SVC. The SVC starts a phase switching by itself based on the back electromotive force. Then, rotation of the spindle motor accelerates. The MPU calculates a rotational speed of the spindle motor based on the PHASE signal from the SVC, and waits till the rotational speed reaches 5,400 rpm. When the rotational speed reaches 5,400 rpm, the SVC enters the stable rotation mode.

(3) Stable rotation mode

The SVC builds the PLL circuit into, and to become the rotational speed of the target, controls a stable rotation with hardware.

The firmware calculates time of one rotation from PHASE signal. PHASE signal is outputted from the SVC. And the firmware observes an abnormal rotation.

C141-E262 4-19

This page is intentionally

left blank.

CHAPTER 5 Interface

5.1 Physical Interface

5.2 Logical Interface

5.3 Host Commands

5.4 Command Protocol

5.5 Power-on and COMRESET

This chapter gives details about the interface, and the interface commands and timings.

C141-E262 5-1

Interface

−

5.1 Physical Interface

5.1.1 Interface signals

Figure 5.1 shows the interface signals.

TX data

RX data

ComWake

ComInit

Host analog front end

TX+

TX−

RX+

RX−

+5VDC

GND

Figure 5.1 Interface signals

TX+

RX+

Device analog front end

TX data

RX data

ComWake

ComReset

An explanation of each signal is provided below.

TX + / TX -

These signals are the outbound high speed differential signals that are connected to the serial ATA cable.

RX + / RX -

These signals are the inbound high speed differential signals that are connected to the serial ATA cable.

TxData

Serially encoded 10b data attached to the high speed serial differential line driver

5-2 C141-E262

5.1 Physical Interface

RxData

Serially encoded 10b data attached to the high speed serial differential line receiver

COMWAKE

Signal from the out of band detector that indicates the COMWAKE out of band signal is being detected.

COMRESET / COMINIT

Host: Signal from the out of band detector that indicates the COMINIT out

of band signal is being detected.

Device: Signal from the out of band detector that indicates the COMRESET

out of band signal is being detected.

5VDC/GND

5VDC: +5 V power supply to the disk drive

GND: Ground for each signal and +5 V power supply

C141-E262 5-3

Interface

5.1.2 Signal interface regulation

5.1.2.1 Out of band signaling

During OOB signaling transmissions, the differential and common mode levels of the signal lines shall comply with the same electrical specifications as for in-band data transmission, specified as follows.

COMRESET/COMINIT

COMWAKE

106.7 ns

106.7 ns 106.7 ns

320 ns

5-4 C141-E262

5.1 Physical Interface

5.1.2.2 Primitives descriptions

The following table contains the primitive mnemonics and a brief description of each.

Primitive Name Description

ALIGN Physical layer control Upon receipt of an ALIGN, the physical layer

readjusts internal operations as necessary to perform its functions correctly.

CONT Continue repeating

previous primitive

The CONT primitive allows long strings of repeated primitives to be eliminated. The CONT primitive implies that the previously received primitive be repeated as long as

another primitive is not received. EOF End of frame EOF marks the end of a frame. PMACK Power management

acknowledge

Sent in response to a PMREQ_S or

PMREQ_P when a receiving node is prepared

to enter a power mode state. HOLD Hold data transmission HOLD is transmitted in place of payload data

within a frame when the transmitter does not

have the next payload data ready for

transmission. HOLD is also transmitted on the

backchannel when a receiver is not ready to

receive additional payload data. HOLDA Hold acknowledge This primitive is sent by a transmitter as long

the HOLD primitive is received by its

companion receiver. PMNAK Power management

denial

Sent in response to a PMREQ_S or

PMREQ_P when a receiving node is not

prepared to enter a power mode state or when

power management is not supported. PMREQ_P Power management

request to partial

This primitive is sent continuously until

PMACK or PMNAK is received. When

PMACK is received, current node (host or

device) will stop PMREQ_P and enters the

Partial power management state.

PMREQ_S Power management

request to slumber

This primitive is sent continuously until

PMACK or PMNAK is received. When

PMACK is received, current node (host or

device) will stop PMREQ_S and enters the

Slumber power management state. R_ERR Reception error Current node (host or device) detected error in

received payload.

C141-E262 5-5

Interface

Primitive Name Description

R_IP Reception in progress Current node (host or device) is receiving

payload.

R_OK Reception with no error Current node (host or device) detected no

error in received payload.

R_RDY Receiver ready Current node (host or device) is ready to

receive payload.

SOF Start of frame Start of a frame. Payload and CRC follow to

EOF. SYNC Synchronization Synchronizing primitive - always idle. WTRM Wait for frame

termination

X_RDY Transmission data ready Current node (host or device) has payload

After transmission of any of the EOF, the

transmitter will transmit WTRM while

waiting for reception status from receiver.

ready for transmission.

5.1.3 Electrical specifications

For the electrical requirements of physical layer, refer to "Electrical specifications" section in the "Serial-ATA Revision 2.5."

5-6 C141-E262

5.1 Physical Interface

5.1.4 Connector pinouts

The pin definitions are shown in Table 5.1.

Table 5.1 Connector pinouts

Signal segment key S1 Gnd 2nd mate S2 A+ S3 AS4 Gnd 2nd mate

Signal

segment

S5 BS6 B+ S7 Gnd 2nd mate

"Key and spacing separate signal and power segments" P1 V33 P2 V33 P3 V33 P4 Gnd 1st mate P5 Gnd 2nd mate P6 Gnd 2nd mate P7 V5 5 V power, pre-charge, 2nd mate P8 V5 5 V power P9 V5 5 V power

P10 Gnd 2nd mate

Power

P11 Staggered

segment

P12 Gnd P13 V12 P14 V12

P15 V12 Power segment key Notes:

Spin-up Mode/ Activity LED

Differential signal pair A from Phy

Differential signal pair B from Phy

N.C.(Open) N.C.(Open) N.C.(Open)

• Staggered Spin-up mode detect for input

• Activity LED drive for output

For the specification of P11, see Section

5.1.5. (in next page) When the host system does not use these

function, the corresponding pin to be mated with P11 in the power cable receptacle connector shall be grounded.

1st mate N.C.(Open) N.C.(Open) N.C.(Open)

Note) Since applying a single external supply voltage of 5 V enables this

drive to operate it is unnecessary to supply +3.3 V and +12 V power supplies.

C141-E262 5-7

Interface

5.1.5 P11 function

The disk drive supports the following functions when P11 pin in the power supply segment of interface connector is used as an input or output pin.

P11 pin supports the functions as follows:

• Staggered Spin-up: Use P11 as an input pin

• Driving Activity LED: Use P11 as an output pin

The following is P11 setting and hardware requirement for these functions.

5.1.5.1 Staggered Spin-up

It is able to set whether the disk drive spins up at power on or not, by input voltage level of 11th pin at the power supply segment on the interface connector.

a) P11 → Open (no connection): Staggered Mode Enable.

The disk drive does not spin up until after successful Phy initialization at power on. (Default setting)

b) P11 → Grounded (0.8 V or less): Staggered Mode Disable.

The disk drive spins up at power on.

c) P11 → "High" level (The P11 line in the host system is pulled up by

resistor [recommended value: 1 to 5.1 kΩ] to power supply in the host system [Recommended voltage: 2V (3.3V or less)]: Staggered Mode Enable The drive does not spin up until after successful Phy initialization at power on.

5.1.5.2 Driving Activity LED

It is possible that the disk drive is able to drive P11 pin as output for indication of Activity LED.

a) P11 output level → "Low": It indicates that the command is in execution.

(LED is on)

b) P11 output level → "High": It indicates that the command is not

in execution. (LED is off)

It is necessary to meet the requirements for P11 as output pin in case of driving Activity LED.

5-8 C141-E262

5.1 Physical Interface

Table 5.2 Requirements for P11 as an output pin

Asserted Deasserted

ACT

≤ 0.7V ≥ 0.7V

- +50uA

Figure 5.2 Example of the circuit for driving Activity LED

C141-E262 5-9

Interface

5.1.6 Hot Plug

The disk drive is "Hot Plug Capable" which is based on Serial ATA Revision 2.5.

It is recommended to use the pre-charge resistor for protection from over current at +5V power supply circuit in the host system when the disk drive is hotplugged. (Refer to the Serial ATA Revision 2.5.)

The equivalent circuit of +5V power supply at Hot Plugging is in the following figure.

It is necessary to choose pre-charge resistor RL value, which is in permissible range of +5V power supply specification at the host system.

Refer to the equivalent circuit when the optimized value of pre-charge resistor R It is recommended to choose the minimum value which is in permissible range of +5V power supply specification at the host system. Because it is possible that rush current occurs again when P8, P9 pin connection after P7 (+5V pre-charge pin) connection dependent on the insertion speed.

5-10 C141-E262

5.2 Logical Interface

The host system and the device communicate with each other by sending and receiving serial data.

The host and the device have several dedicated communication layers between them. These layers have different functions, enabling communication between the different levels of layers within the host or device and between layers at the same level that link the host and device.

Figure 5.3 is a conceptual diagram of the communication layers.

Host: Software control Buffer Memory DMA engine(s)

Shadow Block Register

Transport Layer

Link Layer

Physical Layer

Host located layers

pplication

layer 4

Transport

layer 3

Link

layer 2

Physical

layer 1

Device: Software control Buffer memory DMA e n gi n e (s)

Block Register

Transport Layer

Link Layer

Physical Layer

Device located layers

Figure 5.3 Conceptual diagram of communication layers

C141-E262 5-11

Interface

5.2.1 Communication layers

Each of the layers is outlined below.

Physical layer

• Detects, sends, and receives band signals.

• Sends serial data to and receives it from the link layer.

Link layer

• Negotiates against mutual transfer requests between the host system and

device.

• Encodes serial data as 10- or 8-bit data, then converts it into DWORD data.

• Inserts auxiliary signals (SOF, CRC, and EOF), deletes auxiliary signals, and

communicates with the transport and physical layers.

Transport layer

• Exchanges data in communication with the link layer, and builds the frame

information structure (FIS).

• Contains a (Shadow) Block Register.

• Reflects the FIS contents to the Block Register.

5-12 C141-E262

5.2 Logical Interface

5.2.2 Outline of the Shadow Block Register

Each transport layer in the host system and device has a block register, which is called a Shadow Block Register in the host system, and a Block Register in the device.

These registers are used when the host system issues a command to the device.

Table 5.3 Shadow Block Register

Command Block registers

Read Write

Data Port

Error Features

Sector Count (exp) Sector Count Sector Count (exp) Sector Count

Sector Number (exp) Sector Number Sector Number (exp) Sector Number

Cylinder Low (exp) Cylinder Low Cylinder Low (exp) Cylinder Low

Cylinder High (exp) Cylinder High Cylinder High (exp) Cylinder High

Device / Head

Status Command

Control Block registers

Alternate Status Device Control

Note: Each of the Sector Count, Sector Number, Cylinder Low, and Cylinder

High fields has a higher-order field used for issuing the Ext command. The fields are called Sector Count exp, Sector Number exp, Cylinder Low exp, and Cylinder High exp, respectively. For information on writing data to these fields, see "Device Control Field."

C141-E262 5-13

Interface

5.2.3 Outline of the frame information structure (FIS)

The transport layer converts data written in a Block Register into the FIS, and sends it to the upper layer.

The FIS, which is generated in the transport layer, is explained below.

5.2.3.1 FIS types

The types of FIS are as follows (Each FIS is referred to as abbreviation in square brackets in this manual.):

• Register- Host to Device [RegHD]

• Register- Device to Host [RegDH]

• DMA Active – Device to Host [DMA Active]

• DMA Setup – Device to Host or Host to Device (Bidirectional)

[DMA Setup]

• Set Device Bits – Device to Host [SetDB]

• BIST Active – Bidirectional [BIST Active]

• PIO Setup – Device to Host [PIO Setup]

• Data – Host to Device or Device to Host (Bidirectional) [DATA]

5-14 C141-E262

5.2 Logical Interface

5.2.3.2 Register - Host to Device

The Register - Host to Device FIS has the following layout:

31 30 29 28 27 26 25 24 23 222120191817161514131211109 8 7 6 5 4 3 2 1 0

Features Command C R R Reserved (0) FIS Type (27h)

Device LBA High LBA Mid LBA Low

Features (exp) LBA High (exp) LBA Mid (exp) LBA Low (exp)

Control Reserved (0) Sector Count (exp) Sector Count

Reserved (0) Reserved (0) Reserved (0) Reserved (0)

Figure 5.4 Register - Host to Device FIS l ayout

The host system uses the Register - Host to Device FIS when information in the Register Block is transferred from the host system to the device. This is the mechanism for issuing the ATA command from the host system to the device.

C - To update the Command field, "1" would be set in this field; and to update the Device Control field, "0" would be set in the field.

If both C = 1 and SRST = 1 are set, operation is not guaranteed.

C141-E262 5-15

Interface

5.2.3.3 Register - Device to Host

The Register - Device to Host FIS has the following layout:

31 30 29 28 27 26 25 24 23 22 21 20191817161514131211109 8 7 6 5 4 3 2 1 0

Error Status R I R Reserved (0) FIS Type (34h)

Device LBA High LBA Mid LBA Low

Reserved (0) LBA High (exp) LBA Mid (exp) LBA Low (exp) (0)

Reserved (0) Reserved (0) Sector Count (exp) Sector Count

Reserved (0) Reserved (0) Reserved (0) Reserved (0)

Figure 5.5 Register - Device to Host FIS l ayout

The Register - Device to Host FIS is used when information concerning the Shadow Register Block in the host adapter is updated. This FIS indicates that the device has completed a command operation. Furthermore, this is a mechanism for changing information concerning the Shadow Register Block of the host adapter.

I - If this bit is set, an interrupt request is issued to the host system.

5.2.3.4 DMA Active - Device to Host

The DMA Active - Device to Host FIS has the following layout:

31 30 29 28 27 26 25 24 23 22 21 20191817161514131211109 8 7 6 5 4 3 2 1 0

Reserved (0) Reserved (0) R R R Reserved (0) FIS Type (39h)

Figure 5.6 DMA Active - Device to Host FIS layout

The host uses the DMA Active - Device to Host FIS layout. This FIS instructs the host to continue transferring DMA data from the host to the device.

5-16 C141-E262

5.2 Logical Interface

5.2.3.5 DMA Setup - Device to Host or Host to Device (Bidirect i onal)

The DMA Setup - Device to Host or Host to Device FIS has the following layout:

31 30 29 28 27 26 25 24 23 2221201918171615141312111098 7 6 5 4 3210

Reserved (0) Reserved (0) A I D Reserved (0) FIS Type (41h)

0 TAG

Reserved (0)

DMA Buffer Offset

DMA Transfer Count

Reserved (0)

Figure 5.7 DMA Setup - Device to Host or Host t o Device FIS layout

The DMA Setup - Device to Host or Host to Device FIS communicates the start of a first-party DMA access to the host system. This FIS is used to request the host system or device to set up the DMA controller before the start of a DMA data transfer.

A - Auto Active bit. If this bit is cleared ("0" is set for the bit), it indicates that a DMA Active FIS transfer is required before a Data FIS transfer.

D - Direction bit. If this bit is set ("1" is set for the bit), it indicates that the data transfer direction is from the device to the host system.

C141-E262 5-17

Interface

5.2.3.6 BIST Active - Bidirectional

The BIST Active - Bidirectional FIS has the following layout:

31 30 29 28 27 26 25 24 23 22 21 20191817161514131211109 8 7 6 5 4 3 2 1 0

Reserved (0) Pattern definition R R R Reserved (0) FIS Type (58h)

T A S LFPRV

Data [31:24] Data [23:16] Data [23:16] Data [7:0]

Figure 5.8 BIST Active - Bidirectional FIS layout

The BIST Active - Bidirectional FIS is used to set the receiver to Loop Back mode. This FIS can be sent by either the host system or device.

The following combinations of pattern definitions are supported:

Table 5.4 BIST combinations

T A S L F P V

Reg

Contents

- - - 1 - - 1 09h SATA Phy Analog Loopback Mode

- - - 1 - - - 10h Far End Retimed Loopback Mode

1 1 - - - - -

C0h No ALIGN Transmit_only Mode (Scramble ON)

(*1)

1 1 1 - - - - E0h No ALIGN Transmit_only Mode (Scramble OFF) 1 1 - - - 1 -

1 1 1 - - 1 -

C4h No ALIGN Transmit_only with primitive Mode

(Scramble ON) (*1)

E4h No ALIGN Transmit_only with primitive Mode

(Scramble OFF) 1 - - - - - - 80h ALIGN Transmit_only Mode (Scramble ON) (*1) 1 - 1 - - - - A0h ALIGN Transmit_only Mode (Scramble OFF)

1 - - - - 1 -

1 - 1 - - 1 -

84h ALIGN Transmit_only with primitive Mode

(Scramble ON) (*1)

A4h ALIGN Transmit_only with primitive Mode

(Scramble OFF)

5-18 C141-E262

5.2 Logical Interface

5.2.3.7 Data - Host to Device or Device to Host (Bidirectional )

This Data FIS has the following layout:

31 30 29 28 27 26 25 24 23 2221201918171615141312111098 7 6 5 4 3210

Reserved (0) Reserved (0) R R R Reserved (0) FIS Type (46h)

...

Figure 5.9 Data FIS (Bidirecti onal ) layout

The Data FIS is used for data transfers between the host system and device.

5.2.3.8 PIO Setup - Device to Host

Error Status R I D Reserved (0) FIS Type (5Fh)

N Dwords of data

(1 to 2048 Dwords)

Dev / Head Cyl High Cyl Low Sector Number

Reserved (0) Cyl High (exp) Cyl Low (exp) Sector Num (exp) (0)

E_Status Reserved (0) Sector Count (exp) Sector Count

Reserved (0) Transfer Count

Figure 5.10 PIO Setup - Device to Host FIS layout

The PIO Setup FIS is a device to host FIS, FIS Type 5Fh. The PIO Setup FIS is used by the device to provide the host adapter with the data transfer count and DRQ block status during the PIO data phase. This information allows the host adapter to control PIO data transfers. There are two command structure Response mappings into a Response FIS in the serial transport.

a) 48-bit command structure PIO Setup mapping b) 28-bit command structure PIO Setup mapping

C141-E262 5-19

Interface

FIS Type - Set to a value of 5Fh. Defines the rest of the FIS fields.

Defines the length of the FIS as five Dwords.

Cyl Low - Holds the contents of the cylinder low register of the

Command Block.

Cyl Low (exp) - Contains the contents of the expanded address field of the

Shadow Register Block.

Cyl High - Holds the contents of the cylinder high register of the

Command Block.

Cyl High (exp) - Contains the contents of the expanded address field of the

Shadow Register Block.

D - Indicates whether host memory is being written or read by

the device. 1 = write (device to host), 0 = read (host to device).

Dev / Head - Holds the contents of the device / head register of the

Command Block.

Dev / Head (exp) - Contains the contents of the expanded address field of the

Shadow Register Block.

E_Status - Contains the new value of the status register of the task file

block for correct synchronization of data transfers to host.

Error - Contains the new value of the Error register of the Command

Block at the conclusion of all subsequent Data to Device frames. I - Interrupt bit. This bit reflects the interrupt bit line of the device. R - Reserved (0) Sector Count - Holds the contents of the sector count register of the

Command Block. Sector Count (exp) - Contains the contents of the expanded address field of the

Shadow Register Block. Sector Number - Holds the contents of the sector number register of the

Command Block. Sector Num (exp) - Contains the contents of the expanded address field of the

Shadow Register Block. Status - Contains the new value of the status register of the

Command Block at the conclusion of all subsequent PIO

Data to Device frames. Transfer Count - Holds the number of bytes to be transferred in the

subsequent data FIS.

5-20 C141-E262

5.2 Logical Interface

5.2.3.9 Set Device Bits - Device to Host

Error R Status Hi R Status Lo R I R Reserved (0) FIS Type (A1h)

SActive 31:0

Figure 5.11 Set Device Bits FIS

The Set Device Bits -

Device to Host FIS is used by the device to load Shadow Command Block bits for which the device has exclusive write access. These bits are the eight bits of the Error register and six of the eight bits of the Status register. This FIS does not alter bit 7, BSY, or bit 3, DRQ, of the Shadow Status register.

FIS Type - Set to a value of A1h. Defines the rest of the FIS fields. Defines the

length of the FIS as two Dwords.

I - Interrupt Bit. This bit signals the host adapter to enter an interrupt

pending state if both the BSY bit and the DRQ bit in the shadow Status register are zero when the frame is received.

Error - Contains the new value of the Error register of the Shadow

Status-Hi - Contains the new value of bits 6, 5, and 4 of the Status register of

the Shadow Register Block.

Status-Lo - Contains the new value of bits 2,1, and 0 of the Status register of

the Shadow Register Block.

SActive - The SActive field of the Set Device Bits FIS communicates

successful completion notification for each of up to 32 queued commands. The field is bit-significant and the device sets bit positions to one for each command tag it is indicating successful completion notification for. The device may set more than one bit to one if it is explicitly aggregating successful status returns. The device shall only indicate completion notification for a command if it has completed successfully.

C141-E262 5-21

Interface

5.2.4 Shadow block registers

(1) Error Field

The Error Field indicates the status of the command executed by the device. The fields are valid when the ERR bit of the Status field is 1.

This register contains a diagnostic code after power is turned on, the COMRESET or the EXECUTIVE DEVICE DIAGNOSTIC command is executed.

• [Status at the completion of command execution other than diagnostic command]

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

X UNC X IDNF/ SFRW SFRR ABRT TK0NF AMNF X: Unused

- Bit 7: Unused

- Bit 6: Uncorrectable Data Error (UNC). This bit indicates that an uncorrectable data error has been encountered.

- Bit 5: Unused

- Bit 4: ID Not Found (IDNF). This bit indicates an error except for bad sector, uncorrectable error and SB not found.

Or, SATA Frame Error Write (SFRW) This bit indicates that a SATA communication error has been encountered during the write process. In this case, bit4 and bit2 are set both.

- Bit 3: SATA Frame Error Read (SF RR). This bit indicates that a SATA communication error has been encountered during the read process. In this case, bit3 and bit2 are set both.

- Bit 2: Aborted Command (ABRT). This bit indicates that the requested command was aborted due to a device status error (e.g. Not Ready, Write Fault) or the command code was invalid.

- Bit 1: Track 0 Not Found (TK0NF). This bit indicates that track 0 was not found during RECALIBRATE command execution.

- Bit 0: Address Mark Not Found (AMNF). This bit indicates that the SB Not Found error occurred.

[Diagnostic code]

- X '00': Format Unit is not completed.

- X '01': No Error Detected.

- X '02': HDC Diagnostic Error

- X '03': Data Buffer Diagnostic Error

- X '04': Memory Diagnostic Error

- X '05': Reading the system area is abnormal.

- X '06': Calibration is abnormal.

5-22 C141-E262

Fujitsu MHY2200BH, MHY2250BH, MHY2060BH, MHY2100BH, MHY2120BH User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

FOR SAFE OPERATION

Revision History

Preface

Important Alert Items

Manual Organization

Contents

Illustrations

Figures

Tables

CHAPTER 1 Device Overview

1.1 Features

1.1.1 Functions and performance

1.1.2 Adaptability

1.1.3 Interface

1.2 Device Specifications

1.2.1 Specifications summary

1.2.2 Model and product number

1.3 Power Requirements

1.4 Environmental Specifications

1.5 Acoustic Noise

1.6 Shock and Vibration

1.7 Reliability

1.8 Error Rate

1.9 Media Defects

1.10 Load/Unload Function

1.10.1 Recommended power-off sequence

1.11 Advanced Power Management (APM)

1.12 Interface Power Management (IPM)

1.12.1 Host-initiated interface power management (HIPM)

1.12.2 Device-initiated interface power management (DIPM)

CHAPTER 2 Device Configuration

2.1 Device Configuration

2.2 System Configuration

2.2.1 SATA interface

2.2.2 Drive connection

CHAPTER 3 Installation Conditions

3.1 Dimensions

3.2 Mounting

3.3 Connections with Host System

3.3.1 Device connector

3.3.2 Signal segment and power supply segment

3.3.3 Connector specifications for host system

3.3.4 SATA interface cable connection

3.3.5 Note about SATA interface cable connection

CHAPTER 4 Theory of Device Operation

4.1 Outline

4.2 Subassemblies

4.2.1 Disk

4.2.2 Spindle

4.2.3 Actuator

4.2.4 Air filter

4.3 Circuit Configuration

4.4 Power-on Sequence

4.5 Self-calibration

4.5.1 Self-calibration contents

4.5.2 Execution timing of self-calibration

4.5.3 Command processing during self-calibration

4.6 Read/write Circuit

4.6.1 Read/write preamplifier (PreAMP)

4.6.2 Write circuit

4.6.3 Read circuit

4.6.4 Digital PLL circuit

4.7 Servo Control

4.7.1 Servo control circuit

4.7.2 Data-surface servo format

4.7.3 Servo frame format

4.7.4 Actuator motor control

4.7.5 Spindle motor control

CHAPTER 5 Interface

5.1 Physical Interface

5.1.1 Interface signals

5.1.2 Signal interface regulation

5.1.3 Electrical specifications

5.1.4 Connector pinouts

5.1.5 P11 function

5.1.6 Hot Plug