Fujitsu MHW2060AC, MHW2040AC User Manual

C141-E258-03EN

MHW2060AC, MHW2040AC

DISK DRIVES

PRODUCT MANUAL

FOR SAFE OPERATION

Handling of This Manual

This manual contains important information for using this product. Read thoroughly before using the product. Use this product only after thoroughly reading and understanding especially the section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.

FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering damage to their property. Use the product according to this manual.

IMPORTANT NOTE TO USERS

READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT. INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO USERS, BYSTANDERS OR PROPERTY.

While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU assumes no liability to any party for any damage caused by any error or omission contained in this manual, its updates or supplements, whether such errors or omissions result from negligence, accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the application or use of any product or system in accordance with the descriptions or instructions contained herein; including any liability for incidental or consequential damages arising therefrom. FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.

FUJITSU reserves the right to make changes to any products described herein without further notice and without obligation.

This product is designed and manufactured for use in standard applications such as office work, personal devices and household appliances. This product is not intended for special uses (atomic controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for life support, or weapons firing controls) where particularly high reliability requirements exist, where the pertinent levels of safety are not guaranteed, or where a failure or operational error could threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers considering the use of these products for mission-critical applications must have safety-assurance measures in place beforehand. Moreover, they are requested to consult our sales representative before embarking on such specialized use.

The contents of this manual may be revised without prior notice.

The contents of this manual shall not be disclosed in any way or reproduced in any media without the express written permission of Fujitsu Limited.

Revision History

(1/1)

Edition Date

01 2007-02-28 — —

02 2007-06-15 Entire manual (added)

03 2007-08-24 Entire manual (added) Addition of description for

Revised section (*1)

(Added/Deleted/Altered)

Details

Addition of description for CA06821-B902.

MHW2060AC

*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

C141-E258

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This manual describes MHW2060AC, and MHW2040AC models of the MHW Series, 2.5-inch hard disk drives. This drive has a built-in controller that is compatible with the ATA interface.

This manual describes the specifications and functions of the drive and explains in detail how to incorporate the drive into user systems. This manual assumes that the reader has a basic knowledge of hard disk drive and their implementations in computer systems.

This manual consists of seven chapters and sections explaining the special terminology and abbreviations used in this manual:

Overview of Manual

CHAPTER 1 Device Overview

This chapter gives an overview of the disk drive and describes their features.

CHAPTER 2 Device Configuration

Preface

This chapter describes the internal configurations of the disk drive and the configuration of the systems in which they operate.

CHAPTER 3 Installation Conditions

This chapter describes the external dimensions, installation conditions, and switch settings of the disk drive.

CHAPTER 4 Theory of Device Operation

This chapter describes the operation theory of the disk drive.

CHAPTER 5 Interface

This chapter describes the interface specifications of the disk drive.

CHAPTER 6 Operations

This chapter describes the operations of the disk drive.

Glossary

The glossary describes the technical terms that need to be understood to read this manual.

Acronyms and Abbreviations

This section gives the meanings of the definitions used in this manual.

C141-E258 i

Preface

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property may occur if the user does not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

Data corruption: Avoid mounting the disk drive near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.

The main alert messages in the text are also listed in the “Important Alert Items.”

Operating Environment

This product is designed considering its application in car navigation systems.

Conventions

An MHW series device is sometimes simply referred to as a "hard disk drive," "HDD," "drive," or "device" in this document.

Decimal numbers are represented normally.

Hexadecimal numbers are represented as shown in the following examples: X'17B9', 17B9h, 17B9

Binary numbers are represented as shown in the following examples: 010 or 010b.

ii C141-E258

, or 17B9H.

Preface

Representation of the data storage capacity in this manual

One gigabyte (GB) = one billion bytes; accessible capacity will be less and actual capacity depends on the operating environment and formatting.

Attention

Please forward any comments you may have regarding this manual.

To make this manual easier for users to understand, opinions from readers are needed. Please write your opinions or requests on the Comment at the back of this manual and forward it to the address described in the sheet.

Liability Exception

“Disk drive defects” refers to defects that involve adjustment, repair, or replacement.

Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the host system, or other causes outside the disk drive.

Compliance with Administration on the Control of Pollution Caused by Electronic Information Products of the People's Republic of China

This product is shipped as a component to manufacture the final products. Therefore, the packaging material code provided in GB18455-2001 is not marked on any packaging part of this product.

C141-E258 iii

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Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. Also, damage to the product or other property, may occur if the user does not perform the procedure correctly.

Task Alert message Page

Normal Operation

Data corruption: Avoid mounting the disk near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields. Damage: Do not press the cover of the disk drive. Pressing it too hard, the cover and the spindle motor contact, which may cause damage to the disk drive.

Static: When handling the device, disconnect the body ground (500 kΩ or greater). Do not touch the printed circuit board, but hold it by the edges.

Damage: Interface cable connection Take note of the following precaution about plugging an interface cable (socket) into the interface connector of the disk drive and plugging the connector into a host receptacle:

− When plugging together the disk drive interface connector and the host receptacle or interface cable connector (socket), do not apply more than 10 kgf of force in the connection direction once they are snugly and securely in position.

3-6

3-9

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Manual Organization

MHW2060AC, MHW2040AC

DISK DRIVES

PRODUCT MANUAL

(C141-E258)

MHW2060AC, MHW2040AC

DISK DRIVES

MAINTENANCE MANUAL

(C141-F086)

• Device Overview

• Device Configuration

• Installation Conditions

• Theory of Device Operation

• Interface

• Operations

• Maintenance and Diagnosis

• Removal and Replacement Procedure

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CHAPTER 1 Device Overview ....................................................................... 1-1

1.1 Features ..............................................................................................................1-2

1.1.1 Functions and performance .....................................................................1-2

1.1.2 Adaptability ............................................................................................. 1-2

1.1.3 Interface...................................................................................................1-3

1.2 Device Specifications .........................................................................................1-4

1.2.1 Specifications summary...........................................................................1-4

1.2.2 Model and product number .....................................................................1-6

1.3 Power Requirements........................................................................................... 1-7

1.4 Environmental Specifications........................................................................... 1-10

1.5 Acoustic Noise .................................................................................................1-11

1.6 Shock and Vibration......................................................................................... 1-11

1.7 Reliability .........................................................................................................1-12

1.8 Error Rate ......................................................................................................... 1-13

1.9 Media Defects................................................................................................... 1-13

1.10 Load/Unload Function.................................................................................... 1-13

1.10.1 Recommended power-off sequence.....................................................1-14

1.11 Advanced Power Management (APM)...........................................................1-14

CHAPTER 2 Device Configuration................................................................ 2-1

2.1 Device Configuration .........................................................................................2-2

2.2 System Configuration.........................................................................................2-3

2.2.1 ATA interface..........................................................................................2-3

2.2.2 1 drive connection ................................................................................... 2-3

2.2.3 2 drives connection.................................................................................. 2-4

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Contents

CHAPTER 3 Installation Conditions..............................................................3-1

3.1 Dimensions .........................................................................................................3-2

3.2 Mounting ............................................................................................................3-3

3.3 Cable Connections..............................................................................................3-8

3.3.1 Device connector .....................................................................................3-8

3.3.2 Cable connector specifications ................................................................3-9

3.3.3 Device connection ...................................................................................3-9

3.3.4 Power supply connector (CN1) .............................................................3-10

3.4 Jumper Settings.................................................................................................3-10

3.4.1 Location of setting jumpers ...................................................................3-10

3.4.2 Factory default setting ...........................................................................3-11

3.4.3 Master drive-slave drive setting.............................................................3-11

3.4.4 CSEL setting..........................................................................................3-12

3.4.5 Power up in standby setting...................................................................3-13

CHAPTER 4 Theory of Device Operation...................................................... 4-1

4.1 Outline ................................................................................................................4-2

4.2 Subassemblies.....................................................................................................4-2

4.2.1 Disk..........................................................................................................4-2

4.2.2 Spindle.....................................................................................................4-2

4.2.3 Actuator ...................................................................................................4-2

4.2.4 Air filter ...................................................................................................4-3

4.3 Circuit Configuration..........................................................................................4-3

4.4 Power-on Sequence ............................................................................................4-6

4.5 Self-calibration ...................................................................................................4-7

4.5.1 Self-calibration contents .......................................................................... 4-7

4.5.2 Execution timing of self-calibration ........................................................4-8

4.5.3 Command processing during self-calibration..........................................4-8

4.6 Read/write Circuit...............................................................................................4-9

4.6.1 Read/write preamplifier (PreAMP) .........................................................4-9

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4.6.2 Write circuit............................................................................................. 4-9

4.6.3 Read circuit............................................................................................ 4-10

4.6.4 Digital PLL circuit................................................................................. 4-11

4.7 Servo Control ...................................................................................................4-12

4.7.1 Servo control circuit ..............................................................................4-12

4.7.2 Data-surface servo format .....................................................................4-15

4.7.3 Servo frame format................................................................................ 4-17

4.7.4 Actuator motor control ..........................................................................4-18

4.7.5 Spindle motor control............................................................................ 4-19

CHAPTER 5 Interface..................................................................................... 5-1

5.1 Physical Interface ...............................................................................................5-2

5.1.1 Interface signals....................................................................................... 5-2

5.1.2 Signal assignment on the connector ........................................................ 5-3

5.2 Logical Interface................................................................................................. 5-6

5.2.1 I/O registers .............................................................................................5-7

5.2.2 Command block registers........................................................................ 5-8

5.2.3 Control block registers ..........................................................................5-13

5.3 Host Commands ............................................................................................... 5-14

5.3.1 Command code and parameters.............................................................5-14

5.3.2 Command descriptions ..........................................................................5-18

(1) RECALIBRATE (X’10’ to X’1F’)................................................. 5-20

(2) READ SECTOR(S) (X’20’ or X’21’) ............................................ 5-21

(3) WRITE SECTOR(S) (X’30’ or X’31’)........................................... 5-23

(4) WRITE VERIFY (X’3C’)............................................................... 5-25

(5) READ VERIFY SECTOR(S) (X’40’ or X’41’)............................. 5-26

(6) SEEK (X’70’ to X’7F’) .................................................................. 5-27

(7) EXECUTE DEVICE DIAGNOSTIC (X’90’) ................................ 5-28

(8) INITIALIZE DEVICE PARAMETERS (X’91’) ........................... 5-30

(9) DOWNLOAD MICROCODE (X’92’)........................................... 5-31

(10) STANDBY IMMEDIATE (X’94’ or X’E0’) ............................... 5-33

(11) IDLE IMMEDIATE (X’95’ or X’E1’) / UNLOAD

IMMEDIATE (X’95’ or X’E1’).................................................... 5-34

(12) STANDBY (X’96’ or X’E2’) ....................................................... 5-36

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Contents

(13) IDLE (X’97’ or X’E3’)................................................................. 5-37

(14) CHECK POWER MODE (X’98’ or X’E5’)................................. 5-39

(15) SLEEP (X’99’ or X’E6’) .............................................................. 5-40

(16) SMART (X’B0) ............................................................................5-41

(17) DEVICE CONFIGURATION (X'B1').......................................... 5-58

(18) READ MULTIPLE (X’C4’) ......................................................... 5-63

(19) WRITE MULTIPLE (X’C5’) .......................................................5-65

(20) SET MULTIPLE MODE (X’C6’) ................................................ 5-67

(21) READ DMA (X’C8’ or X’C9’) ....................................................5-69

(22) WRITE DMA (X’CA’ or X’CB’)................................................. 5-71

(23) READ BUFFER (X’E4’) ..............................................................5-73

(24) FLUSH CACHE (X’E7’).............................................................. 5-74

(25) WRITE BUFFER (X’E8’) ............................................................ 5-75

(26) IDENTIFY DEVICE (X’EC’) ......................................................5-76

(27) IDENTIFY DEVICE DMA (X’EE’) ............................................ 5-77

(28) SET FEATURES (X’EF’) ............................................................ 5-89

(29) SECURITY SET PASSWORD (X’F1’)....................................... 5-93

(30) SECURITY UNLOCK(X’F2’) ..................................................... 5-95

(31) SECURITY ERASE PREPARE (X’F3’)...................................... 5-97

(32) SECURITY ERASE UNIT (X’F4’).............................................. 5-98

(33) SECURITY FREEZE LOCK (X’F5’) .......................................... 5-99

(34) SECURITY DISABLE PASSWORD (X’F6’) ........................... 5-101

(35) READ NATIVE MAX ADDRESS (X’F8’) ............................... 5-103

(36) SET MAX (X’F9’)...................................................................... 5-104

(37) READ SECTOR(S) EXT (X’24’): Option (customizing) .........5-110

(38) READ DMA EXT (X’25’): Option (customizing) .................... 5-111

(39) READ NATIVE MAX ADDRESS EXT (X’27’): Option

(customizing) ............................................................................... 5-112

(40) READ MULTIPLE EXT (X’29’): Option (customizing).......... 5-113

(41) READ LOG EXT (X'2F') [Optional command

(Customize)] ................................................................................ 5-114

(42) WRITE SECTOR(S) EXT (X’34’): Option (customizing)........ 5-116

(43) WRITE DMA EXT (X’35’): Option (customizing) ..................5-117

(44) SET MAX ADDRESS EXT (X’37’): Option

(customizing) ............................................................................... 5-118

(45) WRITE MULTIPLE EXT (X’39’): Option (customizing)........ 5-120

(46) WRITE DMA FUA EXT (X’3D’): Option (customizing)......... 5-121

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Contents

(47) WRITE LOG EXT (X’3F’) [Optional command

(Customize)] ................................................................................ 5-122

(48) READ VERIFY SECTOR(S) EXT (X’42): Option

(customizing)............................................................................... 5-124

(49) WRITE MULTIPLE FUA EXT (X’CE’): Option

(customizing)............................................................................... 5-125

(50) FLUSH CACHE EXT (X’EA’): Option (customizing)............. 5-126

5.3.3 Error posting........................................................................................5-127

5.4 Command Protocol.........................................................................................5-129

5.4.1 PIO Data transferring commands from device to host ........................ 5-129

5.4.2 PIO Data transferring commands from host to device ........................ 5-132

5.4.3 Commands without data transfer.........................................................5-134

5.4.4 Other commands..................................................................................5-135

5.4.5 DMA data transfer commands............................................................. 5-135

5.5 Ultra DMA Feature Set ..................................................................................5-137

5.5.1 Overview ............................................................................................. 5-137

5.5.2 Phases of operation.............................................................................. 5-138

5.5.3 Ultra DMA data in commands.............................................................5-138

5.5.4 Ultra DMA data out commands...........................................................5-143

5.5.5 Ultra DMA CRC rules.........................................................................5-147

5.5.6 Series termination required for Ultra DMA ........................................5-148

5.6 Timing ............................................................................................................5-149

5.6.1 PIO data transfer.................................................................................. 5-149

5.6.2 Multiword data transfer .......................................................................5-150

5.6.3 Ultra DMA data transfer...................................................................... 5-151

5.6.4 Power-on and reset ..............................................................................5-164

CHAPTER 6 Operations ................................................................................. 6-1

6.1 Device Response to the Reset............................................................................. 6-2

6.1.1 Response to power-on .............................................................................6-2

6.1.2 Response to hardware reset ..................................................................... 6-3

6.1.3 Response to software reset ......................................................................6-5

6.1.4 Response to diagnostic command............................................................6-6

6.2 Power Save ......................................................................................................... 6-7

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Contents

6.2.1 Power save mode .....................................................................................6-7

6.2.2 Power commands.....................................................................................6-9

6.3 Defect Processing ...............................................................................................6-9

6.3.1 Spare area ................................................................................................6-9

6.3.2 Alternating processing for defective sectors..........................................6-10

6.4 Read-ahead Cache ............................................................................................6-12

6.4.1 DATA buffer structure ..........................................................................6-12

6.4.2 Caching operation.................................................................................. 6-13

6.4.3 Using the read segment buffer...............................................................6-15

6.5 Write Cache ......................................................................................................6-18

6.5.1 Cache operation .....................................................................................6-18

Glossary ...........................................................................................................GL-1

Acronyms and Abbreviations .........................................................................AB-1

Index .................................................................................................................. IN-1

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Illustrations

Figures

Figure 1.1 Permissible range of +5V rise slope .....................................................1-7

Figure 1.2 The example of negative voltage waveform at +5 V when

power is turned off............................................................................... 1-8

Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on .............1-10

Figure 2.1 Disk drive outer view ...........................................................................2-2

Figure 2.2 1 drive system configuration ................................................................2-3

Figure 2.3 2 drives configuration...........................................................................2-4

Figure 3.1 Dimensions ........................................................................................... 3-2

Figure 3.2 Mounting frame structure .....................................................................3-3

Figure 3.3 Location of breather .............................................................................3-4

Figure 3.4 Surface temperature measurement points............................................. 3-5

Figure 3.5 Service area ..........................................................................................3-6

Figure 3.6 Handling cautions................................................................................. 3-7

Figure 3.7 Connector locations ..............................................................................3-8

Figure 3.8 Cable connections................................................................................. 3-9

Figure 3.9 Power supply connector pins (CN1)................................................... 3-10

Figure 3.10 Jumper location ................................................................................3-10

Figure 3.11 Factory default setting ......................................................................3-11

Figure 3.12 Jumper setting of master or slave drive ............................................3-11

Figure 3.13 CSEL setting..................................................................................... 3-12

Figure 3.14 Example (1) of cable select ..............................................................3-12

Figure 3.15 Example (2) of cable select ..............................................................3-13

Figure 4.1 Power supply configuration.................................................................. 4-4

Figure 4.2 Circuit configuration ............................................................................4-5

Figure 4.3 Power-on operation sequence............................................................... 4-6

Figure 4.4 Read/write circuit block diagram..........................................................4-9

Figure 4.5 Frequency characteristic of programmable filter................................ 4-10

Figure 4.6 Block diagram of servo control circuit ...............................................4-12

Figure 4.7 Physical sector servo configuration on disk surface...........................4-16

Figure 4.8 Servo frame format.............................................................................4-17

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Contents

Figure 5.1 Interface signals .................................................................................... 5-2

Figure 5.2 Execution example of READ MULTIPLE command........................5-63

Figure 5.3 READ SECTOR(S) COMMAND protocol......................................5-130

Figure 5.4 Protocol for command abort .............................................................5-131

Figure 5.5 WRITE SECTOR(S) command protocol .........................................5-133

Figure 5.6 Protocol for the command execution without data transfer..............5-135

Figure 5.7 Normal DMA data transfer...............................................................5-136

Figure 5.8 Ultra DMA termination with pull-up or pull-down .......................... 5-148

Figure 5.9 PIO data transfer timing....................................................................5-149

Figure 5.10 Multiword DMA data transfer timing (mode 2) .............................5-150

Figure 5.11 Initiating an Ultra DMA data in burst.............................................5-151

Figure 5.12 Sustained Ultra DMA data in burst.................................................5-155

Figure 5.13 Host pausing an Ultra DMA data in burst ......................................5-156

Figure 5.14 Device terminating an Ultra DMA data in burst.............................5-157

Figure 5.15 Host terminating an Ultra DMA data in burst ................................5-158

Figure 5.16 Initiating an Ultra DMA data out burst...........................................5-159

Figure 5.17 Sustained Ultra DMA data out burst...............................................5-160

Figure 5.18 Device pausing an Ultra DMA data out burst.................................5-161

Figure 5.19 Host terminating an Ultra DMA data out burst ..............................5-162

Figure 5.20 Device terminating an Ultra DMA data out burst...........................5-163

Figure 5.21 Power-on reset timing.....................................................................5-164

Figure 6.1 Response to power-on...........................................................................6-3

Figure 6.2 Response to hardware reset...................................................................6-4

Figure 6.3 Response to software reset....................................................................6-5

Figure 6.4 Response to diagnostic command.........................................................6-6

Figure 6.5 Sector slip processing .........................................................................6-10

Figure 6.6 Automatic alternating processing .......................................................6-11

Figure 6.7 Data buffer structure ........................................................................... 6-12

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Tables

Table 1.1 Specifications.........................................................................................1-5

Table 1.2 Examples of model names and product numbers...................................1-6

Table 1.3 Current and power dissipation ............................................................... 1-9

Table 1.4 Environmental specifications...............................................................1-10

Table 1.5 Acoustic noise specification ................................................................1-11

Table 1.6 Shock and vibration specifications ......................................................1-11

Table 1.7 Advanced Power Management ............................................................ 1-15

Table 3.1 Surface temperature measurement points and standard values..............3-5

Table 3.2 Cable connector specifications ..............................................................3-9

Table 5.1 Signal assignment on the interface connector........................................5-3

Table 5.2 I/O registers............................................................................................ 5-7

Table 5.3 Command code and parameters ........................................................... 5-15

Table 5.4 Diagnostic code.................................................................................... 5-28

Table 5.5 Operation of DOWNLOAD MICROCODE........................................ 5-32

Table 5.6 Example of rewriting procedure of data 512 KBytes

(40000h Bytes) of microcode.............................................................. 5-32

Table 5.7 Features register values (subcommands) and functions....................... 5-42

Table 5.8 Format of device attribute value data................................................... 5-46

Table 5.9 Format of insurance failure threshold value data.................................5-46

Table 5.10 Off-line data collection status ............................................................5-49

Table 5.11 Self-test execution status....................................................................5-49

Table 5.12 Off-line data collection capability .....................................................5-50

Table 5.13 Failure prediction capability flag .......................................................5-50

Table 5.14 Error logging capability .....................................................................5-51

Table 5.15 Log directory data format ..................................................................5-51

Table 5.16 Data format of SMART Summary Error Log.................................... 5-53

Table 5.17 Data format of SMART Comprehensive Error Log ..........................5-54

Table 5.18 SMART self-test log data format....................................................... 5-55

Table 5.19 Selective self-test log data structure...................................................5-56

Table 5.20 Selective self-test feature flags ..........................................................5-57

Table 5.21 DEVICE CONFIGURATION IDENTIFY data structure ................5-61

Table 5.22 Information to be read by IDENTIFY DEVICE command............... 5-78

Table 5.23 Features register values and settable modes.......................................5-89

Table 5.24 Contents of SECURITY SET PASSWORD data ..............................5-93

Table 5.25 Relationship between combination of Identifier and Security

level, and operation of the lock function ...........................................5-93

Table 5.26 Contents of security password ......................................................... 5-101

Table 5.27 Command code and parameters ....................................................... 5-127

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Table 5.28 Recommended series termination for Ultra DMA ...........................5-148

Table 5.29 Ultra DMA data burst timing requirements .....................................5-152

Table 5.30 Ultra DMA sender and recipient timing requirements.....................5-154

xviii C141-E258

CHAPTER 1 Device Overview

1.1 Features

1.2 Device Specifications

1.3 Power Requirements

1.4 Environmental Specifications

1.5 Acoustic Noise

1.6 Shock and Vibration

1.7 Reliability

1.8 Error Rate

1.9 Media Defects

1.10 Load/Unload Function

1.11 Advanced Power Management (APM)

Overview and features are described in this chapter, and specifications and power requirement are described.

The disk drive is 2.5-inch hard disk drive with built-in disk controller. This disk drive uses the AT-bus hard disk interface protocol and are compact and reliable.

C141-E258 1-1

Device Overview

1.1 Features

1.1.1 Functions and performance

The following features of the disk drive are described.

(1) Compact

The disk drive has up to 1 disk of 65 mm (2.5 inches) diameter, and its height is

9.5 mm (0.374 inch).

(2) Environmental Protection

The disk drive complies with the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (RoHS) directive issued by European Union (EU).

(3) Large capacity

The disk drive can record up to 60 GB (formatted) on one disk using the RLL recording method and 30 recording zone technology. The disk drive has a formatted capacity of 60 GB (MHW2060AC) and 40 GB (MHW2040AC) respectively.

(4) High-speed Transfer rate

The disk drive has an internal data rate up to 48.9 MB/s. The disk drive supports an external data rate up to 100 MB/s (U-DMA mode 5).

(5) Average positioning time

Use of a rotary voice coil motor in the head positioning mechanism greatly increases the positioning speed. The average positioning time is 12 ms (at read).

1.1.2 Adaptability

(1) Power save mode

The power save mode feature for Idle operation, Standby and Sleep modes and automatically power down by APM function makes the disk drive ideal for mobile use where power consumption is a factor.

(2) Wide temperature range

The disk drive can be used over a wide temperature range (-30 °C to 90 °C or

-20 °C to 85 °C at DE surface for each model).

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1.1 Features

(3) Low noise and vibration

In Ready status (while the device is waiting for any commands), the Sound Power level of the disk drive in idle mode is 1.5 B. The Sound Pressure level is 17 dB, as measured 0.3 m from the drive in Idle mode.

(4) High resistance against shock

The Load/Unload mechanism is highly resistant against non-operation shock up to 8820 m/s

(900G).

1.1.3 Interface

(1) Connection to ATA interface

The disk drive has built-in controller compatible with the ATA interface.

(2) Data buffer

The disk drive uses a data buffer to transfer data between the host and the disk media.

In combination with the read-ahead cache system described in item (3) and the write cache described in item (7), the buffer contributes to efficient I/O processing.

(3) Read-ahead cache system

After the execution of a disk read command, the disk drive automatically reads the subsequent data block and writes it to the data buffer (read ahead operation). This cache system enables fast data access. The next disk read command would normally cause another disk access. But, if the read ahead data corresponds to the data requested by the next read command, the data in the buffer can be transferred instead.

(4) Master/slave

The disk drive can be connected to ATA interface as daisy chain configuration. Drive 0 is a master device, drive 1 is a slave device.

(5) Error correction and retry by ECC

If a recoverable error occurs, the disk drive itself attempts error recovery. The ECC has improved buffer error correction for correctable data errors.

(6) Self-diagnosis

The disk drive has a diagnostic function to check operation of the controller and disk drive. Executing a diagnostic function of the smart command invokes self-diagnosis.

(7) Write cache

When the disk drive receives a write command, the disk drive posts the command completion at completion of transferring data to the data buffer completion of writing to the disk media. This feature reduces the access time at writing.

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Device Overview

(8) Drive-specific function (specification)

The disk drive measures the environment temperature. When the temperature becomes about -20ºC or lower, some of the functions of internal drive operation are automatically changed. The functions to be changed are listed below.

1) Receiving Write-related commands (writing data into user areas)

The disk drive disables the Write cache function, which is described at (7), writes data into user areas, and automatically performs the data verify operation (Read check) for those areas.

2) SMART operation

While the SMART function is enabled, a SMART attribute value or other data may be written into the system area of the disk drive for periodic information storage. When the temperature becomes lower than the specified value, however, the data is only updated in the memory of the disk drive and not written into the system area (temporarily suspended).

1.2 Device Specifications

1.2.1 Specifications summary

Table 1.1 shows the specifications of the disk drive.

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1.2 Device Specifications

Table 1.1 Specifications (1 of 2)

MHW2060AC MHW2040AC

Format Capacity (*1) 60 GB 40 GB

Number of Sectors (User) 117,210,240 78,140,160

Bytes per Sector 512 bytes

Rotational Speed 4,200 rpm ± 1%

Average Latency 7.14 ms

Positioning time (read and seek)

Minimum (Track-Track)

Average

Maximum (Full)

Start time 3.5 sec (typ.)

Interface ATA-6/ATA-7 (Max. Cable length: 18inches (0.46 m))

(equipped with expansion function)

Data Transfer Rate (*2)

To/From Media

To/From Host

Data Buffer Size (*3) 8 MB (8,388,608 bytes)

Physical Dimensions (Height × Width × Depth)

Weight 96 g (max)

*1: One gigabyte (GB) = one billion bytes; accessible capacity will be less and actual capacity

depends on the operating environment and formatting.

*2: 1MB is equal to 1,000,000 bytes.

*3: 1MB is equal to 1,048,576 bytes; the actual buffer capacity for data transfer will be less. Refer

to the Section 6.4 in this manual.

100 MB/s Max (U-DMA mode5)

9.5 mm × 100.0 mm × 70.0 mm

1.5 ms (typ.)

Read: 12ms (typ.)

22 ms (typ.)

48.9 MB/s Max.

Table 1.1 lists the formatted capacity, number of logical cylinders, number

of heads, and number of sectors of every model for which the CHS mode has been selected using the BIOS setup utility on the host.

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Device Overview

Table 1.1 Specifications (2 of 2)

Model Capacity (*) No. of Cylinder No. of Heads No. of Sectors

MHW2060AC 8.45 GB 16,383 16 63

MHW2040AC 8.45 GB 16,383 16 63

(*) One gigabyte (GB) = one billion bytes; accessible capacity will be less and

actual capacity depends on the operating environment and formatting.

1.2.2 Model and product number

Table 1.2 lists the model name and product number of the disk drive.

The model name does not necessarily correspond to the product number as listed in Table 1.2 since some models have been customized and have specifications that are different from those for the standard model.

If a disk drive is ordered as a replacement drive, the product number must be the same as that of the drive being replaced.

Table 1.2 Examples of model names and product numbers

Model Name

MHV2060AC 60 GB M3 Depth 3 CA06821-B906

MHV2040AC 40 GB M3 Depth 3 CA06821-B900/B902

(*) One gigabyte (GB) = one billion bytes; accessible capacity will be less and

Capacity (*)

(user area)

actual capacity depends on the operating environment and formatting.

Mounting screw Order No.

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1.3 Power Requirements

(1) Input Voltage

• + 5 V ± 5 %

(2) Ripple

+5 V

Maximum 100 mV (peak to peak)

Frequency DC to 1 MHz

(3) Slope of an input voltage at rise

The following figure shows the restriction of the slope which is +5 V input voltage at rise. The permissible range of +5 V slope is from 1V/20 under the voltage range is between 2.0 V and 4.5 V.

µsec to 1V/20 msec,

Figure 1.1 Permissible range of +5V rise slope

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Device Overview

(4) A negative voltage like the bottom figure isn't to occur at +5 V when power is turned off

and, a thing with no ringing.

Permissible level: −0.2 V

Voltage [V]

-1

0 100 200 300 400 500 600 700 800

Time [ms]

Figure 1.2 The example of negative voltage waveform at +5 V

when power is turned off

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