Fujitsu MHV2060AH, MHV2040AH, MHV2080AH, MHV2100AH User Manual
C141-E217-01EN
MHV2100AH, MHV2080AH
MHV2060AH, MHV2040AH
DISK DRIVE
PRODUCT MANUAL
FOR SAFE OPERATION
Handling of This Ma nual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Us e th e product according t o t hi s m anual .
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RES ULT IN INJURY OR DAMA GE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought t o ens ure t h e accuracy of all i nform at i on i n t hi s m anual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any o t h er cau s e. In ad dition, FUJITSU assumes no liability with respect to the
application or use of any product or sy st em i n accordance wi t h t he des cript i ons or i n st ruct i ons
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIM S ALL WAR R ANTIES R E GAR DING THE INF OR MATION
CONTAINED HEREIN, WHETHER EXP R ES S E D, IM P LIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further
notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls , aeronautic o r s p ace s y s t em s , mass tran s p or t v ehicle operatin g co n t ro l s , medical dev i ces
for life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in p l ace b efo rehan d . Moreover, they are request ed to consul t o ur s ales representat i v e
before embarkin g o n s uch s p eci al ized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2004
Revision History
(1/1)
Edition Date
01 2004-11-15
Revised section (*1)
(Added/Deleted/Altered)
Details
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.
C141-E217
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This manual describes MHV2100AH, MHV2080AH, MHV2060AH,
MHV2040AH model of the MHV Series, 2.5-inch hard disk drives. These drives
have a built-in controller that is compatible with the ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overvie w
Preface
This chapter gives an overview of the disk drive and describes their features.
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the disk drive and the
configuration of the systems in which they operate.
CHAPTER 3 Installa tion Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the disk drive.
CHAPTER 4 Theory of Devi ce Operation
This chapter describes the operation theory of the disk drive.
CHAPTER 5 Interface
This chapt er d es cri b es t h e i n t erface s p eci fi cat i o n s o f t h e d i s k dr i v e.
CHAPTER 6 Operations
This chapter describes the operations of the disk drive.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
C141-E217 i
Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert
signal also indicates that damages to the product or
other property may occur if the user does not perform
the procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An MHV series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9
Binary numbers are represented as shown in the following examples: 010 or
010b.
ii C141-E217
, or 17B9H.
H
Preface
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of
this manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.
C141-E217 iii
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Important Aler t Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the pro ced u re co rrect l y .
Task Alert message Page
Normal Operatio n
Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is n o t affect ed b y ex t ern al m ag n et i c fi elds.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩ or greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7
C141-E217 v
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Manual Organization
MHV2100AH, MHV2080AH
MHV2060AH, MHV2040AH
DISK DRIVE
PRODUCT MANUAL
(C141-E217)
<This manual>
MHV2100AH, MHV2080AH
MHV2060AH, MHV2040AH
DISK DRIVE
MAINTENANCE MANUAL
(C141-F071)
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Devi ce Operation
• Interface
• Operations
• Maintenance and Diagnosis
• Removal an d R ep lacement Pro ced u re
C141-E217 vii
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Contents
CHAPTER 1 Device Overview....................................................................... 1-1
1.1 Features ......................................................................................................... 1-2
1.1.1 Functions and performance.................................................................. 1-2
1.1.2 Adaptability......................................................................................... 1-2
1.1.3 Interface..............................................................................................1-3
1.2 Device Specifications..................................................................................... 1-4
1.2.1 Specifications summary....................................................................... 1-4
1.2.2 Model and product number.................................................................. 1-5
1.3 Power Requirements ......................................................................................1-6
1.4 Environmental Specifications......................................................................... 1-8
1.5 Acoustic Noise............................................................................................... 1-9
1.6 Shock and Vibration....................................................................................... 1-9
1.7 Reliability.................................................................................................... 1-10
1.8 Error Rate.................................................................................................... 1-11
1.9 Media Defects.............................................................................................. 1-11
1.10 Load/Unload Function................................................................................ 1-11
1.11 Advanced Power Management ................................................................... 1-12
CHAPTER 2 Device Configuration................................................................ 2-1
2.1 Device Configuration..................................................................................... 2-2
2.2 System Configuration.....................................................................................2-3
2.2.1 ATA interface ...................................................................................... 2-3
2.2.2 1 drive connection ...............................................................................2-3
2.2.3 2 drives connection.............................................................................. 2-4
C141-E217 ix
Contents
CHAPTER 3 Installation Conditions .............................................................3-1
3.1 Dimensions .................................................................................................... 3-2
3.2 Mounting....................................................................................................... 3-3
3.3 Cable Connections......................................................................................... 3-9
3.3.1 Device connector ................................................................................. 3-9
3.3.2 Cable connector specifications........................................................... 3-10
3.3.3 Device connection............................................................................. 3-10
3.3.4 Power supply connector (CN1).......................................................... 3-11
3.4 Jumper Settings............................................................................................3-11
3.4.1 Location of setting jumpers ............................................................... 3-11
3.4.2 Factory default setting....................................................................... 3-12
3.4.3 Master drive-slave drive setting......................................................... 3-12
3.4.4 CSEL setting..................................................................................... 3-13
3.4.5 Power up in standby setting............................................................... 3-14
CHAPTER 4 Theory of Device Operation .....................................................4-1
4.1 Outline........................................................................................................... 4-2
4.2 Subassemblies................................................................................................ 4-2
4.2.1 Disk .................................................................................................... 4-2
4.2.2 Spindle................................................................................................ 4-2
4.2.3 Actuator .............................................................................................. 4-2
4.2.4 Air filter.............................................................................................. 4-3
4.3 Circuit Configuration..................................................................................... 4-3
4.4 Power-on Sequence........................................................................................ 4-6
4.5 Self-calibration .............................................................................................. 4-7
4.5.1 Self-calibration contents...................................................................... 4-7
4.5.2 Execution timing of self-calibration..................................................... 4-8
4.5.3 Command processing during self-calibration....................................... 4-8
4.6 Read/write Circuit .......................................................................................... 4-9
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Contents
4.6.1 Read/write preamplifier (PreAMP) ...................................................... 4-9
4.6.2 Write circuit ........................................................................................ 4-9
4.6.3 Read circuit....................................................................................... 4-10
4.6.4 Digital PLL circuit............................................................................. 4-11
4.7 Servo Control............................................................................................... 4-12
4.7.1 Servo control circuit.......................................................................... 4-12
4.7.2 Data-surface servo form at .................................................................. 4-15
4.7.3 Servo frame format ............................................................................ 4-17
4.7.4 Actuator motor control....................................................................... 4-18
4.7.5 Spindle motor control........................................................................ 4-19
CHAPTER 5 Interface..................................................................................... 5-1
5.1 Physical Interface ........................................................................................... 5-2
5.1.1 Interface signals................................................................................... 5-2
5.1.2 Signal assignment on the connector.....................................................5-3
5.2 Logical Interface............................................................................................ 5-6
5.2.1 I/O registers......................................................................................... 5-7
5.2.2 Command block registers.................................................................... 5-8
5.2.3 Control block registers....................................................................... 5-13
5.3 Host Commands........................................................................................... 5-14
5.3.1 Command code and parameters..........................................................5-14
5.3.2 Command descriptions ...................................................................... 5-18
(1) RECALIBRATE (X’10’ to X’1F’) ...............................................5-20
(2) READ SECTOR(S) (X’20’ or X’21’)...........................................5-21
(3) WRITE SECTOR(S) (X’30’ or X’31’) .........................................5-23
(4) WRITE VERIFY (X’3C’).............................................................5-25
(5) READ VERIFY SECTOR(S) (X’40’ or X’41’)............................5-26
(6) SEEK (X’70’ to X’7F’)................................................................5-27
(7) EXECUTE DEVICE DIAGNOSTIC (X’90’) ...............................5-28
(8) INITIALIZE DEVICE PARAMETERS (X’91’)...........................5-30
(9) DOWNLOAD MICROCODE (X’92’)..........................................5-31
(10) STANDBY IMMEDIATE (X’94’ or X’E0’) ...............................5-33
C141-E217 xi
Contents
(11) IDLE IMMEDIATE (X’95’ or X’E1’) / UNLOAD
IMMEDIATE (X’95’ or X’E1’)..................................................5-34
(12) STANDBY (X’96’ or X’E2’) ..................................................... 5-36
(13) IDLE (X’97’ or X’E3’)...............................................................5-37
(14) CHECK POWER MODE (X’98’ or X’E5’) ................................5-39
(15) SLEEP (X’99’ or X’E6’)............................................................ 5-40
(16) SMART (X’B0).........................................................................5-41
(17) DEVICE CONFIGURATION (X'B1')........................................5-58
(18) READ MULTIPLE (X’C4’)....................................................... 5-63
(19) WRITE MULTIPLE (X’C5’) .....................................................5-65
(20) SET MULTIPLE MODE (X’C6’) ..............................................5-67
(21) READ DMA (X’C8’ or X’C9’)..................................................5-69
(22) WRITE DMA (X’CA’ or X’CB’)...............................................5-71
(23) READ BUFFER (X’E4’)............................................................5-73
(24) FLUSH CACHE (X’E7’) ...........................................................5-74
(25) WRITE BUFFER (X’E8’) ..........................................................5-75
(26) IDENTIFY DEVICE (X’EC’) ....................................................5-76
(27) IDENTIFY DEVICE DMA (X’EE’)...........................................5-77
(28) SET FEATURES (X’EF’)..........................................................5-89
(29) SECURITY SET PASSWORD (X’F1’) .....................................5-93
(30) SECURITY UNLOCK(X’F2’)...................................................5-95
(31) SECURITY ERASE PREPARE (X’F3’)....................................5-97
(32) SECURITY ERASE UNIT (X’F4’)............................................5-98
(33) SECURITY FREEZE LOC K (X’F 5’).........................................5-99
(34) SECURITY DISABLE PASSWORD (X’F6’) ..........................5-101
(35) READ NATIVE MAX ADDRESS (X’F8’) ..............................5-103
(36) SET MAX (X’F9’)...................................................................5-104
(37) READ SECTOR(S) EXT (X’24’): Option (customizing).........5-110
(38) READ DMA EXT (X’25’): Option (customizing)...................5-111
(39) READ NATIVE MAX ADDRESS EXT (X’27’): Opti on
(customizing) ............................................................................5-112
(40) READ MULTIPLE EXT (X’29’): Option (customizing) .........5-113
(41) READ LOG EXT (X'2F') [Optional command
(Customize)].............................................................................5-114
(42) WRITE SECTOR(S) EXT (X’34’): Option (customizing).......5-116
(43) WRITE DMA EXT (X’35’): Option (customizing)..................5-117
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Contents
(44) SET MAX ADDRESS EXT (X’37’): Opti on
(customizing) ...........................................................................5-118
(45) WRITE MULTIPLE EXT (X’39’): Option (customizing)........5-120
(46) WRITE DMA FUA EXT (X’3D’): Option (customizing)........5-121
(47) WRITE LOG EXT (X’3F’) [Opti o nal com m and
(Customize)]............................................................................5-122
(48) READ VERIFY SECTOR (S) EXT (X’42): Option
(customizing) ...........................................................................5-124
(49) WRITE MULTIPLE FUA EXT (X’CE’): Opti on
(customizing) ...........................................................................5-125
(50) FLUSH CACHE EXT (X’EA’): Op t io n
(customizing)............................................................................5-126
5.3.3 Error posting.................................................................................... 5-127
5.4 Command Protocol.................................................................................... 5-129
5.4.1 PIO Data transferring commands from device to host ...................... 5-129
5.4.2 PIO Data transferring commands from host to device ...................... 5-132
5.4.3 Commands without data transfer...................................................... 5-134
5.4.4 Other commands.............................................................................. 5-135
5.4.5 DMA data transfer commands ......................................................... 5-135
5.5 Ultra DMA Feature Set.............................................................................. 5-137
5.5.1 Overview......................................................................................... 5-137
5.5.2 Phases of operation.......................................................................... 5-138
5.5.3 Ultra DMA data in commands ......................................................... 5-138
5.5.3.1 Initiating an Ultra DMA data in burst.................................... 5-138
5.5.3.2 The data in transfer............................................................... 5-139
5.5.3.3 Pausing an Ultra DMA data in burst ..................................... 5-139
5.5.3.4 Terminating an Ultra DMA data in burst............................... 5-140
5.5.4 Ultra DMA data out commands ....................................................... 5-143
5.5.4.1 Initiating an Ultra DMA data out burst.................................. 5-143
5.5.4.2 The data out transfer ............................................................. 5-144
5.5.4.3 Pausing an Ultra DMA data out burst.................................... 5-144
5.5.4.4 Terminating an Ultra DMA data out burst............................. 5-145
5.5.5 Ultra DMA CRC rules..................................................................... 5-147
5.5.6 Series termination required for Ultra DMA ...................................... 5-148
5.6 Timing....................................................................................................... 5-149
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Contents
5.6.1 PIO data transfer...............................................................................5-149
5.6.2 Multiword data transfer....................................................................5-150
5.6.3 Ultra DMA data transfer...................................................................5-151
5.6.3.1 Initiating an Ultra DMA data in burst ....................................5-151
5.6.3.2 Ultra DMA data burst timing requirements............................5-152
5.6.3.3 Sustained Ultra DMA data in burst........................................5-155
5.6.3.4 Host pausing an Ultra DMA data in burst ..............................5-156
5.6.3.5 Device terminating an Ultra DMA data in burst.....................5-157
5.6.3.6 Host terminating an Ultra DMA data in burst.........................5-158
5.6.3.7 Initiating an Ultra DMA data out burst ..................................5-159
5.6.3.8 Sustained Ultra DMA data out burst......................................5-160
5.6.3.9 Device pausing an Ultra DMA data out burst.........................5-161
5.6.3.10 Host terminating an Ultra DMA data out burst.....................5-162
5.6.3.11 Device terminating an Ultra DMA data out burst.................5-163
5.6.4 Power-on and reset...........................................................................5-164
CHAPTER 6 Operations .................................................................................6-1
6.1 Device Response to the Reset......................................................................... 6-2
6.1.1 Response to power-on ......................................................................... 6-2
6.1.2 Response to hardware reset.................................................................. 6-3
6.1.3 Response to software reset................................................................... 6-5
6.1.4 Response to diagnostic command........................................................ 6-6
6.2 Power Save.................................................................................................... 6-7
6.2.1 Power save mode................................................................................. 6-7
6.2.2 Power commands ................................................................................ 6-9
6.3 Defect Processing........................................................................................... 6-9
6.3.1 Spare area............................................................................................ 6-9
6.3.2 Alternating processing for defective sectors....................................... 6-10
6.4 Read-ahead Cache........................................................................................ 6-12
6.4.1 DATA buffer structure....................................................................... 6-12
6.4.2 Caching operation.............................................................................. 6-13
6.4.3 Using the read segment buffer........................................................... 6-15
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Contents
6.4.3.1 Miss-hit.................................................................................. 6-15
6.4.3.2 Sequential hit.......................................................................... 6-16
6.4.3.3 Full hit.................................................................................... 6-17
6.4.3.4 Partial hit................................................................................ 6-18
6.5 Write Cache................................................................................................. 6-19
6.5.1 Cache operation................................................................................. 6-19
Glossary........................................................................................................... GL-1
Acronyms and Abbreviations........................................................................ AB-1
Index ..................................................................................................................IN-1
C141-E217 xv
Contents
Illustrations
Figures
Figure 1.1 Negative voltage at +5 V when power is turned off........................... 1-6
Figure 1.2 Current fluctuation (Typ.) at +5 V when power is
turned on........................................................................................ 1-8
Figure 2.1 Disk drive outer view........................................................................ 2-2
Figure 2.2 1 drive system configuration............................................................. 2-3
Figure 2.3 2 drives configuration....................................................................... 2-4
Figure 3.1 Dimensions....................................................................................... 3-2
Figure 3.2 Orientation ....................................................................................... 3-3
Figure 3.3 Mounting frame structure..................................................................3-4
Figure 3.4 Location of breather.......................................................................... 3-5
Figure 3.5 Surface temperature meas ur em en t p oints .......................................... 3-6
Figure 3.6 Service area...................................................................................... 3-7
Figure 3.7 Handling cautions............................................................................. 3-8
Figure 3.8 Connector locations.......................................................................... 3-9
Figure 3.9 Cable connections........................................................................... 3-10
Figure 3.10 Power supply connector pins (CN1).............................................. 3-11
Figure 3.11 Jumper location............................................................................ 3-11
Figure 3.12 Factory default setting .................................................................. 3-12
Figure 3.13 Jumper setting of master or slave drive ......................................... 3-12
Figure 3.14 CSEL setting................................................................................ 3-13
Figure 3.15 Example (1) of cable select........................................................... 3-13
Figure 3.16 Example (2) of cable select........................................................... 3-14
Figure 4.1 Power supply configuration.............................................................. 4-4
Figure 4.2 Circuit configuration......................................................................... 4-5
Figure 4.3 Power-on operation sequence............................................................ 4-6
Figure 4.4 Read/write circuit block diagram ...................................................... 4-9
Figure 4.5 Frequency characteristic of programmable filter.............................. 4-10
Figure 4.6 Block diagram of servo control circuit............................................ 4-12
Figure 4.7 Physical sector servo configuration on disk surface......................... 4-16
Figure 4.8 Servo frame format......................................................................... 4-17
Figure 5.1 Interface sig n al s................................................................................ 5-2
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Figure 5.2 Execution example of READ MULTIPLE command...................... 5-63
Figure 5.3 READ S EC TOR (S ) C OMM AND prot ocol ................................... 5-130
Figure 5.4 Protocol for command abort.......................................................... 5-131
Figure 5.5 WRITE SECTOR(S) command protocol ....................................... 5-133
Figure 5.6 Protocol for the command execution without data
transfer ....................................................................................... 5-135
Figure 5.7 Normal DMA data transfer............................................................5-136
Figure 5.8 Ultra DMA termination with pull-up or pull-down........................ 5-148
Figure 5.9 PIO data transfer timing................................................................ 5-149
Figure 5.10 Multiword DMA data transfer timing (mode 2)........................... 5-150
Figure 5.11 Initiating an Ultra DMA data in burst.......................................... 5-151
Figure 5.12 Sustained Ultra DMA data in burst ............................................. 5-155
Figure 5.13 Host pausing an Ultra DMA data in burst.................................... 5-156
Figure 5.14 Device terminating an Ultra DMA data in burst.......................... 5-157
Figure 5.15 Host terminating an Ultra DMA data in burst.............................. 5-158
Figure 5.16 Initiating an Ultra DMA data out burst........................................ 5-159
Figure 5.17 Sustained Ultra DMA data out burst............................................ 5-160
Figure 5.18 Device pausing an Ultra DMA data out burst.............................. 5-161
Figure 5.19 Host terminating an Ultra DMA data out burst............................ 5-162
Figure 5.20 Device terminating an Ultra DMA data out burst ........................ 5-163
Figure 5.21 Power-on reset timing................................................................. 5-164
Figure 6.1 Response to power-on....................................................................... 6-3
Figure 6.2 Response to hardware reset ...............................................................6-4
Figure 6.3 Response to software reset ................................................................6-5
Figure 6.4 Response to diagnostic command...................................................... 6-6
Figure 6.5 Sector slip processing ..................................................................... 6-10
Figure 6.6 Automatic alternating processing.................................................... 6-11
Figure 6.7 Data buffer structure....................................................................... 6-12
C141-E217 xvii
Contents
Tables
Table 1.1 Specifications.....................................................................................1-4
Table 1.2 Examples of model names and product numbers ................................ 1-5
Table 1.3 Current and power dissipation............................................................ 1-7
Table 1.4 Environmental specifications ............................................................. 1-8
Table 1.5 Acoustic noise specification............................................................... 1-9
Table 1.6 Shock and vibration specification....................................................... 1-9
Table 1.7 Advanced Power Management......................................................... 1-13
Table 3.1 Surface temperatu re measurement p o i n t s an d s t an d ard
values................................................................................................ 3-6
Table 3.2 Cable connector specifications......................................................... 3-10
Table 5.1 Signal as si gnm ent on th e i nt erface connector ..................................... 5-3
Table 5.2 I/O registers....................................................................................... 5-7
Table 5.3 Command code and parameters........................................................ 5-15
Table 5.4 Diagnostic code ................................................................................ 5-28
Table 5.5 Operation of DOWNLOAD MICR OC ODE ..................................... 5-32
Table 5.6 Example of rewriting procedure of data 512 KBytes
(40000h Bytes) of microcode........................................................... 5-32
Table 5.7 Features register values (subcommands) and functions .................... 5-42
Table 5.8 Format of device attribute value data................................................ 5-46
Table 5.9 Format of insurance failure threshold value data............................... 5-46
Table 5.10 Off-line data collection status ......................................................... 5-49
Table 5.11 Self-test execution status................................................................ 5-49
Table 5.12 Off-line data collection capability................................................... 5-50
Table 5.13 Failure prediction capability flag.................................................... 5-50
Table 5.14 Error logging capability ................................................................. 5-51
Table 5.15 Log directory data format............................................................... 5-51
Table 5.16 Data format of SMART Summary Error Log................................. 5-53
Table 5.17 Data format of SMART Comprehensive Error Log ........................ 5-54
Table 5.18 SMART self-test log data format.................................................... 5-55
Table 5.19 Selective self-test log data structure................................................ 5-56
Table 5.20 Selective self-test feature flags ....................................................... 5-57
Table 5.21 DEVICE CONFIGURATION IDENTIFY data structure................ 5-61
Table 5.22 Information to be read by IDENTIFY DEVICE
command ....................................................................................... 5-78
Table 5.23 Features register values and settable modes.................................... 5-89
Table 5.24 Contents of SECURITY SET PASSWORD data............................ 5-93
Table 5.25 Relationship between combination of Identifier and
Security level, and operation of the lock function ........................... 5-93
xviii C141-E217
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Table 5.26 Contents of security password...................................................... 5-101
Table 5.27 Command code and parameters ................................................... 5-127
Table 5.28 Recommended series termination for Ultra DMA......................... 5-148
Table 5.29 Ultra DMA data burst timing requirements ................................... 5-152
Table 5.30 Ultra DMA sender and recipient timing requirements................... 5-154
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CHAPTER 1 Device Overview
1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
1.10 Load/Unload Function
1.11 Advanced Power Management
Overview and featu res are d es cri b ed i n t h i s ch ap t er, and specifi cat i o n s and p o wer
requirement are described.
The disk drive is 2.5-inch hard disk drives with built-in disk controllers. These
disk dri v es us e t h e AT -b us h ard d i s k i nterface protocol and are co m p act an d
reliable.
C141-E217 1-1
Device Overview
1.1 Features
1.1.1 Functions and performance
The following features of the disk drive are described.
(1) Compact
The disk drive has up to 2 disks of 65 mm (2.5 inches) diameter, and its height is
9.5 mm (0.374 inch).
(2) Green product
The disk drive is lead (Pb)-free products and the European Parliament and Council
Directive on the Res t ri cti on of t h e use of cert ai n Hazardous S ubs t ances i n
electrical and electronic equipment (the RoHS Directive) compliant.
(3) Large capacity
The disk drive can record up to 50 GB (formatted) on one disk using the RLL
recording method and 30 recording zone technology. The disk drive has a
formatted capacity of 100 GB (MHV2100AH), 80 GB (MHV2080AH), 60 GB
(MHV2060AH) and 40 GB (MHV2040AH) respectively.
(4) High-speed Transfer rate
The disk drive (the MHV Series) has an internal data rate up to 59.4 MB/s. The
disk drive supports an external data rate up to 100 MB/s (U-DMA mode 5).
(5) Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly
increases the positioning speed. The average positioning time is 12 ms (at read).
1.1.2 Adaptability
(1) Power save mode
The power save mode feature for Idle operation, Standby and Sleep modes and
automatically power down by APM function makes the disk drive ideal for mobile
use where power consumption is a factor.
(2) Wide temperature range
The disk drive can be used over a wide temperature range (5 °C to 55 °C).
(3) Low noise and vibration
In Ready status (while the device is waiting for any commands), the Sound Power
level of the disk drives in idle mode is 2.2B [MHV2040AH]/2.6B [MHV2060AH,
1-2 C141-E217
1.1 Features
MHV2080AH, MHV2100AH]. The Sound Pressure level is
22dB [MHV2040AH]/28dB [MHV2060AH, MHV2080AH, MHV2100AH], as
measured 0.3 m from the drive in Idle mode.
(4) High resistance against shock
The Load/Unload mechanism is highly resistant against non-operation shock up to
8820 m/s
2
(900G).
1.1.3 Interface
(1) Connection to ATA interface
The disk drive has built-in controllers compatible with the ATA interface.
(2) Data buffer
The disk drive uses 8MB data buffer to transfer data between the host and the disk
media.
In combination with t h e read -ah ead cach e s y s t em d es cri b ed i n i t em (3 ) an d the
write cache describ ed i n item (7), t he b u ffer co nt ributes to efficient I/O
processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the
subsequent data block a nd wr ite s it to the da ta buff e r ( re a d a h e a d ope ra tion) . This
cache system enables fast data access. The next disk read command would normally
cause another disk access. But, if the read ahead data corresponds to the data requested
by the next read command, the data in the buffer can be transferred instead.
(4) Master/slave
The disk d ri v e can b e con n ect ed t o ATA interface as dais y ch ai n con fi g u rat ion.
Drive 0 is a m as t er d ev i ce, drive 1 i s a s l av e d evice.
(5) Error correction and retry by ECC
If a recoverable error occurs , the disk d ri ve itself att em pts error recovery. The
ECC has im p ro ved b uffer erro r co rrect i o n fo r co rrect ab l e dat a erro rs .
(6) Self-diagnosis
The disk drive has a dia gnostic func tion to c h e c k ope ra tion of the c ontr olle r a nd disk
drive. Executing a diagnostic f unc tion of the sma r t c omma nd invoke s se lf - dia gnosis.
(7) Write cache
When the di s k dr i v e recei v es a wri t e co m m an d , the dis k d rive posts t h e co m m an d
completion at completion of transferring data to the data buffer completion of
writing t o t h e d i s k m ed i a. This featu re red u ces t h e acces s time at writing.
C141-E217 1-3
Device Overview
1.2 Device Specifications
1.2.1 Specifications summary
Table 1.1 shows the specifications of the disk drives.
Table 1.1 Specifications (1 of 2)
Format Capacity (*1) 100 GB 80GB 60GB 40GB
Number of Sectors (User) 195,371,568 156,301,488 117,210,240 78,140,160
Bytes per Sector 512 bytes
Rotational Speed 5,400 rpm ± 1%
Average Latency 5.56 ms
Positioning time (read and
seek)
• Minimum (Track-Track)
• Average
• Maximum (Full)
Start time 4.0 sec (typ.)
Interface ATA-6 (Max. Cable length: 18inches (0.46 m))
Data Transfer Rate (*1)
• To/From Media
MHV2100AH MHV2080AH MHV2060AH MHV2040AH
1.5 ms (typ.)
Read: 12ms (typ.)
22 ms (typ.)
(equipped with expansion function)
59.4 MB/s Max.
• To/From Host
Data Buffer Size (*2) 8MB (8,388,608 bytes)
Physical Dimensions
(Height × Width × Depth)
Weight 101 g (max) 96 g (max)
*1: 1GB is equal to 1,000,000,000 bytes and 1MB is equal to 1,000,000 bytes.
*2: 1MB is equal to 1,048,576 bytes.
1-4 C141-E217
100 MB/s Max (U-DMA mode5)
9.5 mm × 100.0 mm × 70.0 mm
1.2 Device Specifications
Table 1.1 lists the formatted capacity, number of logical cylinders, number
of heads, and number of sectors of every model for which the CHS mode
has been selected using the BIOS setup utility on the host.
Table 1.1 Specifications (2 of 2)
Model Capacity No. of Cylinder No. of Heads No. of Sectors
MHV2100AH 8.45 GB 16,383 16 63
MHV2080AH 8.45 GB 16,383 16 63
MHV2060AH 8.45 GB 16,383 16 63
MHV2040AH 8.45 GB 16,383 16 63
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers of the disk drive.
The model name does not necessarily correspond to the product number as listed
in Table 1.2 since some models have been customized and have specifications that
are different from t ho s e fo r t h e s t an dard m o del .
If a disk drive is ordered as a repl acem ent dri ve, the product number mus t be th e
same as that of the dri ve b ei n g rep l aced .
Table 1.2 Examples of mode l names and product numbers
Model Name
MHV2100AH 100GB M3 Depth 3 CA06531-B040/B140
MHV2080AH 80GB M3 Depth 3 CA06531-B048/B148
MHV2060AH 60GB M3 Depth 3 CA06531-B036/B136
MHV2040AH 40GB M3 Depth 3 CA06531-B024/B124
Capacity
(user area)
Mounting screw Order No.
C141-E217 1-5
Device Overview
1.3 Power Requirements
(1) Input Voltage
• + 5 V ± 5 %
(2) Ripple
+5 V
Maximum 100 mV (peak to peak)
Frequency DC to 1 MHz
(3) A negative voltage like the bottom figure isn't to occur at +5 V when power is turned
off and, a thing with no ringing.
Permissible level: −0.2 V
5
4
3
2
Voltage [V]
1
0
-1
0 100 200 300 400 500 600 700 800
Time [ms]
Figure 1.1 Negative voltage at +5 V when power is turned off
1-6 C141-E217
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