Fujitsu MHV2060BH, MHV2080BH, MHV2100BH, MHV2120BH, MHV2040BH User Manual 2
C141-E224-02EN
MHV2120BH, MHV2100BH, MHV2080BH
MHV2060BH, MHV2040BH
DISK DRIVES
PRODUCT MANUAL
FOR SAFE OPERATION
Handling of This Manual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the
application or use of any product or system in accordance with the descriptions or instructions
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION
CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further
notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices
for life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2005
Revision History
(1/1)
Edition Date
01 2005-04-28
02 2005-11-10
Entire manual (Added) Addition of MHV2120BH model.
Section 5.2.3.8, 5.2.3.9 (Added) Addition of description for "PIO
Section 5.3 (Added) Addition of UNLOAD
Revised section (*1)
(Added/Deleted/Altered)
Details
Setup - Device to Host" and "Set
Device Bits - Device to Host."
IMMEDIATE command.
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.
C141-E224
This page is intentionally left blank.
This manual describes MHV2120BH, MHV2100BH, MHV2080BH, MHV2060BH,
MHV2040BH model of the MHV Series, 2.5-inch hard disk drives. These drives
have a built-in controller that is compatible with the Serial-ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview
This chapter gives an overview of the disk drive and describes their features.
Preface
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the disk drive and the
configuration of the systems in which they operate.
CHAPTER 3 Installation Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the disk drive.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the disk drive.
CHAPTER 5 Interface
This chapter describes the interface specifications of the disk drive.
CHAPTER 6 Operations
This chapter describes the operations of the disk drive.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
C141-E224 i
Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert
signal also indicates that damages to the product or
other property may occur if the user does not perform
the procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An MHV series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9
, or 17B9H.
H
Binary numbers are represented as shown in the following examples: 010 or 010b.
Serial-ATA may be referred to as "SATA".
ii C141-E224
Preface
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of
this manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.
C141-E224 iii
This page is intentionally left blank.
Important Alert Items
Important Alert Messages
The important alert messag es in th is manu al are as fol l ows :
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Normal Operation
Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is not affected by external magnetic fields.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩ or greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7
C141-E224 v
This page is intentionally left blank.
Manual Organization
MHV2120BH, MHV2100BH,
MHV2080BH, MHV2060BH,
MHV2040BH
DISK DRIVES
PRODUCT MANUAL
(C141-E224)
<This manual>
MHV2120BH, MHV2100BH,
MHV2080BH, MHV2060BH,
MHV2040BH
DISK DRIVES
MAINTENANCE MANUAL
(C141-F074)
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
• Maintenance and Diagnosis
• Removal and Replacement Procedure
C141-E224 vii
This page is intentionally left blank.
Contents
CHAPTER 1 Device Overview........................................................................1-1
1.1 Features ..............................................................................................................1-2
1.1.1 Functions and performance.....................................................................1-2
1.1.2 Adaptability.............................................................................................1-2
1.1.3 Interface...................................................................................................1-3
1.2 Device Specifications.........................................................................................1-4
1.2.1 Specifications summary ..........................................................................1-4
1.2.2 Model and product number .....................................................................1-5
1.3 Power Requirements...........................................................................................1-6
1.4 Environmental Specifications ............................................................................1-9
1.5 Acoustic Noise .................................................................................................1-10
1.6 Shock and Vibration.........................................................................................1-10
1.7 Reliability.........................................................................................................1-11
1.8 Error Rate .........................................................................................................1-12
1.9 Media Defects...................................................................................................1-12
1.10 Load/Unload Function....................................................................................1-12
1.10.1 Recommended power-off sequence ...................................................1-13
1.11 Advanced Power Management (APM) ..........................................................1-13
1.12 Interface Power Management (IPM).............................................................1-15
1.12.1 Host-initiated interface power management (HIPM).........................1-15
1.12.2 Device-initiated interface power management (DIPM).....................1-15
1.13 Restriction of Use of Hazardous Substances.................................................1-16
C141-E224 ix
Contents
CHAPTER 2 Device Configuration ................................................................2-1
2.1 Device Configuration........................................................................................2-2
2.2 System Configuration........................................................................................2-3
2.2.1 SATA interface.....................................................................................2-3
2.2.2 Drive connection...................................................................................2-3
CHAPTER 3 Installation Conditions..............................................................3-1
3.1 Dimensions........................................................................................................3-2
3.2 Mounting...........................................................................................................3-3
3.3 Connections with Host System .........................................................................3-9
3.3.1 Device connector...................................................................................3-9
3.3.2 Signal segment and power supply segment........................................3-10
3.3.3 Connector specifications for host system ...........................................3-10
3.3.4 SATA interface cable connection.......................................................3-11
3.3.5 Note about SATA interface cable connection ....................................3-11
CHAPTER 4 Theory of Device Operation......................................................4-1
4.1 Outline................................................................................................................4-2
4.2 Subassemblies ....................................................................................................4-2
4.2.1 Disk .........................................................................................................4-2
4.2.2 Spindle.....................................................................................................4-2
4.2.3 Actuator...................................................................................................4-2
4.2.4 Air filter...................................................................................................4-3
4.3 Circuit Configuration .........................................................................................4-3
4.4 Power-on Sequence............................................................................................4-6
4.5 Self-calibration...................................................................................................4-7
4.5.1 Self-calibration contents..........................................................................4-7
4.5.2 Execution timing of self-calibration .......................................................4-8
4.5.3 Command processing during self-calibration .........................................4-8
x C141-E224
Contents
4.6 Read/write Circuit.............................................................................................. 4-9
4.6.1 Read/write preamplifier (PreAMP).........................................................4-9
4.6.2 Write circuit ............................................................................................4-9
4.6.3 Read circuit...........................................................................................4-10
4.6.4 Digital PLL circuit................................................................................4-11
4.7 Servo Control...................................................................................................4-12
4.7.1 Servo control circuit.............................................................................. 4-12
4.7.2 Data-surface servo format.....................................................................4-15
4.7.3 Servo frame format ...............................................................................4-17
4.7.4 Actuator motor control.......................................................................... 4-18
4.7.5 Spindle motor control ...........................................................................4-19
CHAPTER 5 Interface..................................................................................... 5-1
5.1 Physical Interface..............................................................................................5-2
5.1.1 Interface signals.................................................................................... 5-2
5.1.2 Signal interface regulation....................................................................5-4
5.1.2.1 Out of band signaling.................................................................5-4
5.1.2.2 Primitives descriptions.............................................................5-5
5.1.3 Electrical specifications........................................................................5-7
5.1.4 Connector pinouts...............................................................................5-10
5.1.5 P11 function........................................................................................5-11
5.1.5.1 Staggered Spin-up....................................................................5-11
5.1.5.2 Driving Ready LED.................................................................5-11
5.1.6 Hot Plug..............................................................................................5-13
5.2 Logical Interface.............................................................................................5-14
5.2.1 Communication layers........................................................................ 5-15
5.2.2 Outline of the Shadow Block Register ...............................................5-16
5.2.3 Outline of the frame information structure (FIS)...............................5-17
5.2.3.1
5.2.3.2 Register - Host to Device.........................................................5-17
5.2.3.3 Register - Device to Host.........................................................5-18
5.2.3.4 DMA Active - Device to Host .................................................5-18
5.2.3.5 DMA Setup - Device to Host or Host to Device
C141-E224 xi
FIS types .................................................................................. 5-17
(Bidirectional).......................................................................... 5-19
Contents
5.2.3.6 BIST Active - Bidirectional.....................................................5-20
5.2.3.7 Data - Host to Device or Device to Host (Bidirectional).........5-21
5.2.3.8 PIO Setup – Device to Host .....................................................5-21
5.2.3.9 Set Device Bits – Device to Host.............................................5-23
5.2.4 Shadow block registers .......................................................................5-24
5.3 Host Commands..............................................................................................5-29
5.3.1 Command code and parameters..........................................................5-29
5.3.2 Command descriptions........................................................................5-32
(1) RECALIBRATE (X’10’ to X’1F’) ............................................... 5-33
(2) READ SECTOR(S) (X’20’ or X’21’).........................................5-34
(3) WRITE SECTOR(S) (X’30’ or X’31’)........................................5-36
(4) WRITE VERIFY (X’3C’)............................................................5-38
(5) READ VERIFY SECTOR(S) (X’40’ or X’41’) ..........................5-40
(6) SEEK (X’70’ to X’7F’).................................................................5-42
(7) EXECUTE DEVICE DIAGNOSTIC (X’90’)...............................5-43
(8) INITIALIZE DEVICE PARAMETERS (X’91’)..........................5-44
(9) DOWNLOAD MICROCODE (X’92’) .........................................5-45
(10) STANDBY IMMEDIATE (X’94’ or X’E0’)................................ 5-47
(11) IDLE IMMEDIATE (X’95’ or X’E1’) /UNLOAD
IMMEDIATE (X’95’ or X’E1’)....................................................5-48
(12) STANDBY (X’96’ or X’E2’)........................................................5-50
(13) IDLE (X’97’ or X’E3’) ................................................................. 5-51
(14) CHECK POWER MODE (X’98’ or X’E5’) .................................5-53
(15) SLEEP (X’99’ or X’E6’)..............................................................5-54
(16) SMART (X’B0’) ...........................................................................5-55
(17) DEVICE CONFIGURATION (X'B1')..........................................5-72
(18) READ MULTIPLE (X’C4’)..........................................................5-77
(19) WRITE MULTIPLE (X’C5’)........................................................5-80
(20) SET MULTIPLE MODE (X’C6’).................................................5-82
(21) READ DMA (X’C8’ or X’C9’) ....................................................5-84
(22) WRITE DMA (X’CA’ or X’CB’).................................................5-86
(23) READ BUFFER (X’E4’) ..............................................................5-88
(24) FLUSH CACHE (X’E7’) .............................................................5-89
(25) WRITE BUFFER (X’E8’)............................................................. 5-90
(26) IDENTIFY DEVICE (X’EC’).......................................................5-91
xii C141-E224
Contents
(27) IDENTIFY DEVICE DMA (X’EE’) ........................................... 5-92
(28) SET FEATURES (X’EF’)........................................................... 5-104
(29) SECURITY SET PASSWORD (X’F1’).....................................5-110
(30) SECURITY UNLOCK(X’F2’) ................................................... 5-112
(31) SECURITY ERASE PREPARE (X’F3’).................................... 5-114
(32) SECURITY ERASE UNIT (X’F4’)............................................ 5-115
(33) SECURITY FREEZE LOCK (X’F5’) ........................................ 5-116
(34) SECURITY DISABLE PASSWORD (X’F6’) ........................... 5-118
(35) READ NATIVE MAX ADDRESS (X’F8’) ............................... 5-120
(36) SET MAX (X’F9’)...................................................................... 5-121
(37) READ SECTOR (S) EXT (X’24’).............................................. 5-127
(38) READ DMA EXT (X’25’).......................................................... 5-128
(39) READ NATIVE MAX ADDRESS EXT (X’27’)....................... 5-129
(40) READ MULTIPLE EXT (X’29’) ............................................... 5-130
(41) READ LOG EXT (X'2F')............................................................ 5-131
(42) WRITE SECTOR (S) EXT (X’34’)............................................ 5-135
(43) WRITE DMA EXT (X’35’)........................................................ 5-136
(44) SET MAX ADDRESS EXT (X’37’) .......................................... 5-137
(45) WRITE MULTIPLE EXT (X’39’) ............................................. 5-139
(46) WRITE LOG EXT (X'3F').......................................................... 5-140
(47) READ VERIFY SECTOR (S) EXT (X’42’) ............................. 5-142
(48) FLUSH CACHE EXT (X’EA’) ................................................. 5-143
(49) WRITE MULTIPLE FUA EXT (X'CE')..................................... 5-144
(50) WRITE DMA FUA EXT (X'3D') ............................................... 5-145
(51) READ FP DMA QUEUED (X'60')............................................. 5-146
(52) WRITE FP DMA QUEUED (X'61')...........................................5-147
5.3.3 Error posting.....................................................................................5-148
5.4 Command Protocol ....................................................................................... 5-150
5.4.1 Non-data command protocol ............................................................5-150
5.4.2 PIO data-in command protocol.........................................................5-152
5.4.3 PIO data-out command protocol.......................................................5-153
5.4.4 DMA data-in command protocol...................................................... 5-155
5.4.5 DMA data-out command protocol.................................................... 5-156
5.4.6 Native Command Queuing protocol.................................................5-157
C141-E224 xiii
Contents
5.5 Power-on and COMRESET ..........................................................................5-160
CHAPTER 6 Operations .................................................................................6-1
6.1 Reset and Diagnosis ..........................................................................................6-2
6.1.1 Response to power-on...........................................................................6-2
6.1.2 Response to COMRESET.....................................................................6-4
6.1.2.1 Software settings preservation ...................................................6-5
6.1.2.2 COMRESET preservation requirements....................................6-5
6.1.3 Response to a software reset.................................................................6-7
6.2 Power Save........................................................................................................6-8
6.2.1 Power save mode ..................................................................................6-8
6.2.2 Power commands................................................................................6-10
6.3 Power Save Controlled by Interface Power Management (IPM)....................6-11
6.3.1 Power save mode of the interface.......................................................6-11
6.4 Read-ahead Cache...........................................................................................6-13
6.4.1 Data buffer structure...........................................................................6-13
6.4.2 Caching operation...............................................................................6-14
6.4.3 Using the read segment buffer............................................................6-16
6.4.3.1 Miss-hit ....................................................................................6-16
6.4.3.2 Sequential hit............................................................................6-17
6.4.3.3 Full hit......................................................................................6-17
6.4.3.4 Partial hit..................................................................................6-19
6.5 Write Cache.....................................................................................................6-20
6.5.1 Cache operation...................................................................................6-20
Glossary ...........................................................................................................GL-1
Acronyms and Abbreviations.........................................................................AB-1
Index ................................................................................................................. IN-1
xiv C141-E224
Contents
Illustrations
Figures
Figure 1.1 Permissible range of +5V rise slope ....................................................1-6
Figure 1.2 Negative voltage at +5 V when power is turned off............................1-7
Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on ..............1-9
Figure 2.1 Disk drive outerview............................................................................2-2
Figure 2.2 Drive system configuration..................................................................2-3
Figure 3.1 Dimensions...........................................................................................3-2
Figure 3.2 Orientation ...........................................................................................3-3
Figure 3.3 Mounting frame structure ....................................................................3-4
Figure 3.4 Location of breather............................................................................. 3-5
Figure 3.5 Surface cover temperature measurement points..................................3-6
Figure 3.6 Service area..........................................................................................3-7
Figure 3.7 Handling cautions ................................................................................3-8
Figure 3.8 Connector locations..............................................................................3-9
Figure 3.9 Power supply pins (CN1)................................................................... 3-10
Figure 4.1 Power supply configuration.................................................................4-4
Figure 4.2 Circuit configuration............................................................................ 4-5
Figure 4.3 Power-on operation sequence ..............................................................4-6
Figure 4.4 Read/write circuit block diagram.........................................................4-9
Figure 4.5 Frequency characteristic of programmable filter............................... 4-10
Figure 4.6 Block diagram of servo control circuit ..............................................4-12
Figure 4.7 Physical sector servo configuration on disk surface..........................4-16
Figure 4.8 Servo frame format ............................................................................4-17
Figure 5.1 Interface signals ...................................................................................5-2
Figure 5.2 Example of the circuit for driving Ready LED..................................5-12
Figure 5.3 Conceptual diagram of communication layers .................................. 5-14
Figure 5.4 Register - Host to Device FIS layout.................................................5-17
Figure 5.5 Register - Device to Host FIS layout.................................................5-18
Figure 5.6 DMA Active - Device to Host FIS layout..........................................5-18
Figure 5.7 DMA Setup - Device to Host or Host to Device FIS layout.............. 5-19
Figure 5.8 BIST Active - Bidirectional FIS layout .............................................5-20
Figure 5.9 Data FIS (Bidirectional) layout.......................................................... 5-21
Figure 5.10 PIO Setup - Device to Host FIS layout............................................ 5-21
C141-E224 xv
Contents
Figure 5.11 Set Device Bits FIS ..........................................................................5-23
Figure 5.12 Execution example of READ MULTIPLE command .....................5-78
Figure 5.13 Non-data command protocol..........................................................5-151
Figure 5.14 PIO data-in command protocol......................................................5-153
Figure 5.15 PIO data-out command protocol....................................................5-154
Figure 5.16 DMA data-in command protocol ...................................................5-155
Figure 5.17 DMA data-out command protocol .................................................5-156
Figure 5.18 READ FP DMA QUEUED command protocol.............................5-158
Figure 5.19 WRITE FP DMA QUEUED command protocol...........................5-159
Figure 5.20 Power-on sequence.........................................................................5-160
Figure 5.21 COMRESET sequence...................................................................5-161
Figure 6.1 Response to power-on
(when the host is powered on earlier than the device)......................6-2
Figure 6.2 Response to power-on
(when the device is powered on earlier than the host)......................6-3
Figure 6.3 Response to COMRESET ....................................................................6-4
Figure 6.4 Response to a software reset ................................................................6-7
Figure 6.5 Data buffer structure...........................................................................6-13
xvi C141-E224
Contents
Tables
Table 1.1 Specifications .......................................................................................1-4
Table 1.2 Examples of model names and product numbers..................................1-5
Table 1.3 Current and power dissipation...............................................................1-8
Table 1.4 Environmental specifications................................................................1-9
Table 1.5 Acoustic noise specification................................................................1-10
Table 1.6 Shock and vibration specification .......................................................1-10
Table 1.7 Advanced Power Management............................................................ 1-14
Table 1.8 Interface power management ..............................................................1-16
Table 3.1 Surface temperature measurement points and standard values............. 3-6
Table 3.2 The recommended connector specifications for the host
system .................................................................................................3-10
Table 5.1 Physical Layer Electrical Requirements ............................................... 5-7
Table 5.2 Connector pinouts................................................................................5-10
Table 5.3 Requirements for P11 as an output pin. .............................................. 5-11
Table 5.4 Shadow Block Register .......................................................................5-16
Table 5.5 BIST combinations..............................................................................5-20
Table 5.6 Command code and parameters ......................................................... 5-29
Table 5.7 Diagnostic code...................................................................................5-43
Table 5.8 Operation of DOWNLOAD MICROCODE .......................................5-45
Table 5.9 Example of rewriting procedure of data 512K Bytes
(80000h Bytes) of microcode ............................................................5-46
Table 5.10 Features Field values (subcommands) and functions .......................5-56
Table 5.11 Format of device attribute value data................................................5-60
Table 5.12 Format of guarantee failure threshold value data.............................. 5-60
Table 5.13 Off-line data collection status ........................................................... 5-63
Table 5.14 Self-test execution status...................................................................5-63
Table 5.15 Off-line data collection capability..................................................... 5-64
Table 5.16 Failure prediction capability flag ......................................................5-64
Table 5.17 Drive error logging capability...........................................................5-64
Table 5.18 Log Directory Data Format...............................................................5-65
Table 5.19 Data format of SMART Summary Error Log ..................................5-66
Table 5.20 Data format of SMART Comprehensive Error Log..........................5-68
Table 5.21 SMART self-test log data format......................................................5-69
Table 5.22 Selective self-test log data structure.................................................. 5-70
Table 5.23 Selective self-test feature flags..........................................................5-71
Table 5.24 DEVICE CONFIGURATION IDENTIFY data structure ................5-75
Table 5.25 Information to be read by IDENTIFY DEVICE command .............5-93
C141-E224 xvii
Contents
Table 5.26 Features field values and settable modes ........................................5-104
Table 5.27 Contents of SECURITY SET PASSWORD data............................5-110
Table 5.28 Relationship between combination of Identifier and
Security level, and operation of the lock function.........................5-110
Table 5.29 Contents of security password.........................................................5-118
Table 5.30 Data format of Read Log Ext log page 10h.....................................5-133
Table 5.31 Tag field information.......................................................................5-133
Table 5.32 Data format of Read Log Ext log page 11h.....................................5-134
Table 5.33 Counter Identifier information ........................................................5-134
Table 5.34 Command code and parameters ......................................................5-148
xviii C141-E224
CHAPTER 1 Device Overview
1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
1.10 Load/Unload Function
1.11 Advanced Power Management (APM)
1.12 Interface Power Management (IPM)
1.13 Restriction of Use of Hazardous Substances
Overview and features are described in this chapter, and specifications and power
requirement are described.
The disk drive is 2.5-inch hard disk drives with built-in disk controllers. These
disk drives use the SATA interface protocol which has a high-speed interface data
transfer rate.
C141-E224 1-1
Device Overview
1.1 Features
1.1.1 Functions and performance
The following features of the disk drive are described.
(1) Compact
The disk drive has up to 2 disks of 65 mm (2.5 inches) diameter, and its height is
9.5 mm (0.374 inch).
(2) Green product
The disk drive complies with the RoHS Directive.
RoHS Directive: Directive 2002/95/EC of European Parliament and of the
Council of 27 January 2003 on the Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment.
(3) Large capacity
The disk drive can record up to 60 GB (formatted) on one disk using the RLL
recording method and 30 recording zone technology. The disk drive has a
formatted capacity of 120 GB (MHV2120BH), 100 GB (MHV2100BH), 80 GB
(MHV2080BH), 60 GB (MHV2060BH) and 40 GB (MHV2040BH) respectively.
(4) High-speed Transfer rate
The disk drive (the MHV2xxxBH Series) has an internal data rate up to
61.3 MB/s. The disk drive supports an external data rate 1.5Gbps (150MB/s)
(Serial-ATA Generation-1). And the disk drive realizes a high performance by
high-speed transfer rate combined with Native Command Queuing (NCQ).
(5) Aver age posit ioning t im e
Use of a rotary voice coil motor in the head positioning mechanism greatly
increases the positioning speed. The average positioning time is 12 ms (at read).
1.1.2 Adaptability
(1) Power save mode
The disk drive is ideal for applications since it supports the power save mode
function that works in each of the Idle, Standby, and Sleep modes and has the
Partial and Slumber interface power management functions. And automatically
power down by APM function makes the disk drive ideal for mobile use where
power consumption is a factor.
(2) Wide tem perature range
The disk drive can be used over a wide temperature range (5 °C to 55 °C)
1-2 C141-E224
1.1 Features
(3) Low noise and vibration
In Ready status (while the device is waiting for any commands), the Sound Power
level of the disk drives in idle mode is 2.6B. The Sound Pressure level is 28dB,
as measured 0.3 m from the drive in Idle mode.
(4) High resist ance against shock
The Load/Unload mechanism is highly resistant against non-operation shock up
to 8820 m/s
2
(900G).
1.1.3 Interface
(1) Connect ion t o SATA int erface
The disk drive has built-in controllers compatible with the SATA interface.
(2) Data buffer
The disk drive uses 8MB data buffer to transfer data between the host and the disk
media.
In combination with the read-ahead cache system described in item (3) and the
write cache described in item (6), the buffer contributes to efficient I/O
processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the
subsequent data block and writes it to the data buffer (read ahead operation). This
cache system enables fast data access. The next disk read command would normally
cause another disk access. But, if the read ahead data corresponds to the data
requested by the next read command, the data in the buffer can be transferred instead.
(4) Error correction and retry by ECC
If a recoverable error occurs, the disk drive itself attempts error recovery. The
ECC has improved buffer error correction for correctable data errors.
(5) Self-diagnosis
The disk drive has a diagnostic function to check operation of the controller and disk
drive. Executing a diagnostic function of the smart command invokes self-diagnosis.
(6) Write cache
When the disk drive receives a write command, the disk drive posts the command
completion at completion of transferring data to the data buffer completion of
writing to the disk media. This feature reduces the access time at writing.
C141-E224 1-3
Device Overview
1.2 Device Specifications
1.2.1 Specifications summary
Table 1.1 shows the specifications of the disk drives.
Table 1.1 Specifications (1/2)
Format Capacity (*1, *2) 120 GB 100 GB 80 GB 60 GB 40 GB
Number of Sectors (User) 234,441,648 195,371,568 156,301,488 117,210,240 78,140,160
Bytes per Sector 512 bytes
Rotational Speed 5,400 rpm ± 1%
Average Latency 5.56 ms
Positioning time (read and seek)
• Minimum (Track-Track)
• Average
• Maximum (Full)
Start time 4.0 sec (typ.)
Interface Compliant with ATA/ATAPI-7, SATA II Ext to SATA1.0a,
Data Transfer Rate (*2)
• To/From Media
• To/From Host
MHV2120BH MHV2100BH MHV2080BH MHV2060BH MHV2040BH
1.5 ms (typ.)
Read: 12 ms (typ.)
22 ms (typ.)
SATA II Electrical Spec.1.0
61.3MB/s Max.
1.5 Gbps (150 MB/s)
Data Buffer Size (*3) 8 MB (8,388,608 bytes)
Physical Dimensions
(Height × Width × Depth)
Weight 101 g (max)
9.5 mm × 100.0 mm × 70.0 mm (*4)
*1: Capacity under the LBA mode.
*2: 1 GB is equal to 1,000,000,000 bytes and 1 MB is equal to 1,000,000 bytes.
*3: 1 MB is equal to 1,048,576 bytes.
*4: The value of Depth (=100.0 mm) does not include PCBA (Printed Circuit Board Assembly).
For details, see Section 3.1.
1-4 C141-E224
1.2 Device Specifications
Table 1.1 lists the formatted capacity, number of logical cylinders, number
of heads, and number of sectors of every model for which the CHS mode
has been selected using the BIOS setup utility on the host.
Table 1.1 Specifications (2/2)
Model Capacity No. of Cylinder No. of Heads No. of Sectors
MHV2120BH 8.45 GB 16,383 16 63
MHV2100BH 8.45 GB 16,383 16 63
MHV2080BH 8.45 GB 16,383 16 63
MHV2060BH 8.45 GB 16,383 16 63
MHV2040BH 8.45 GB 16,383 16 63
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers of the disk drive.
The model name does not necessarily correspond to the product number as listed
in Table 1.2 since some models have been customized and have specifications
that are different from those for the standard model.
If a disk drive is ordered as a replacement drive, the product number must be the
same as that of the drive being replaced.
Table 1.2 Examples of model names and product numbers
Model Name
MHV2120BH 120 GB M3 Depth 3 CA06672-B042
MHV2100BH 100 GB M3 Depth 3 CA06672-B040/B140
MHV2080BH 80 GB M3 Depth 3 CA06672-B038/B048/B148
MHV2060BH 60 GB M3 Depth 3 CA06672-B026/B136
MHV2040BH 40 GB M3 Depth 3 CA06672-B124
Capacity
(user area)
Mounting screw Order No.
C141-E224 1-5
Device Overview
1.3 Power Requirements
(1) Input Voltage
• + 5 V ± 5 %
• It is unnecessary for this drive to supply +3.3 V and +12 V power supplies.
(2) Ripple
+5 V
Maximum 100 mV (peak to peak)
Frequency DC to 1 MHz
(3) Slope of an input volt age at rise
The following figure shows the restriction of the slope which is +5 V input
voltage at rise. The permissible range of +5 V slope is from 1V/20
µsec to
1V/20 msec, under the voltage range is between 2.0V and 4.5V.
4.5V
(The slope limitation
refers only to this range.)
2.0V
Input Voltage [V]
0V
Time [sec]
Slope : S = V / T [V/sec]
S : 1V/20us to 1V/20ms
V
T
Figure 1.1 Permissible range of +5V rise slope
1-6 C141-E224
1.3 Power Requirements
(4) A negative voltage like the bottom figure isn't to occur at +5 V when power is turned
off and, a thing with no ringing.
Permissible level: − 0.2 V
5
4
3
2
Voltage [V]
1
0
-1
0 100 200 300 400 500 600 700 800
Time [ms]
Figure 1.2 Negative voltage at +5 V when power is turned off
C141-E224 1-7
Device Overview
(5) Cur r ent Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation (typical).
Table 1.3 Current and power dissipation
Typical RMS Current Typical Power (*3)
Spin up (*1)
Idle (*6)
R/W (on track) (*2)
Seek (*5)
Standby (*6)
Sleep (*6)
Energy
Efficiency (*4)
1.0 A 5.0 W
120 mA 0.60 W
380 mA 1.9 W
420 mA 2.1 W
26 mA 0.13 W
26 mA 0.13 W
0.0050 W/GB (rank E / MHV2120BH)
0.0060 W/GB (rank E / MHV2100BH)
—
0.0075 W/GB (rank E / MHV2080BH)
0.0100 W/GB (rank E / MHV2060BH)
0.0150 W/GB (rank D / MHV2040BH)
*1 Maximum current and power at starting spindle motor.
*2 Current and power level when the operation (command) that accompanies a
transfer of 63 sectors is executed 3 times in 100 ms
*3 Power requirements reflect typical values for +5 V power.
*4 Energy efficiency based on the Law concerning the Rational Use of Energy
indicates the value obtained by dividing power consumption by the storage
capacity. (Japan only)
*5 The seek average current is specified based on three operations per 100
msec.
*6 IPM mode: Slumber mode.
1-8 C141-E224
Loading...