Fujitsu MHT2080BH, MHT2040BH, MHT2060BH User Manual

C141-E203-01EN

MHT2080BH, MHT2060BH, MHT2040BH

DISK DRIVES

PRODUCT MANUAL

FOR SAFE OPERATION

Handling of This Manual

This manual contains important information for using this product. Read thoroughly before using the product. Use this product only after thoroughly reading and understanding especially the section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.

FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering damage to their property. Use the product according to this manual.

IMPORTANT NOTE TO USERS

READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT. INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO USERS, BYSTANDERS OR PROPERTY.

While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU assumes no liability to any party for any damage caused by any error or omission contained in this manual, its updates or supplements, whether such errors or omissions result from negligence, accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the application or use of any product or system in accordance with the descriptions or instructions contained herein; including any liability for incidental or consequential damages arising therefrom. FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.

FUJITSU reserves the right to make changes to any products described herein without further notice and without obligation.

This product is designed and manufactured for use in standard applications such as office work, personal devices and household appliances. This product is not intended for special uses (atomic controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for life support, or weapons firing controls) where particularly high reliability requirements exist, where the pertinent levels of safety are not guaranteed, or where a failure or operational error could threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers considering the use of these products for mission-critical applications must have safety-assurance measures in place beforehand. Moreover, they are requested to consult our sales representative before embarking on such specialized use.

The contents of this manual may be revised without prior notice.

The contents of this manual shall not be disclosed in any way or reproduced in any media without the express written permission of Fujitsu Limited.

Revision History

(1/1)

Edition Date

01 2004-02-27

Revised section (*1)

(Added/Deleted/Altered)

Details

*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

C141-E203-01EN

This page is intentionally left blank.

This manual describes MHT2080BH/ MHT2060BH/ MHT2040BH models of the MHT Series, 2.5-inch hard disk drives. These drives have a built-in controller that is compatible with the Serial-ATA interface.

This manual describes the specifications and functions of the drives and explains in detail how to incorporate the drives into user systems. This manual assumes that the reader has a basic knowledge of hard disk drives and their implementations in computer systems.

This manual consists of seven chapters and sections explaining the special terminology and abbreviations used in this manual:

Overview of Manual

CHAPTER 1 Device Overview

Preface

This chapter gives an overview of the disk drive and describes their features.

CHAPTER 2 Device Configuration

This chapter describes the internal configurations of the disk drive and the configuration of the systems in which they operate.

CHAPTER 3 Installation Conditions

This chapter describes the external dimensions, installation conditions, and switch settings of the disk drive.

CHAPTER 4 Theory of Device Operation

This chapter describes the operation theory of the disk drive.

CHAPTER 5 Interface

This chapter describes the interface specifications of the disk drive.

CHAPTER 6 Operations

This chapter describes the operations of the disk drive.

Glossary

The glossary describes the technical terms that need to be understood to read this manual.

Acronyms and Abbreviations

This section gives the meanings of the definitions used in this manual.

C141-E203-01EN i

Preface

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property may occur if the user does not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

Data corruption: Avoid mounting the disk drive near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.

The main alert messages in the text are also listed in the “Important Alert Items.”

Operating Environment

This product is designed to be used in offices or computer rooms.

Conventions

An MHT series device is sometimes simply referred to as a "hard disk drive," "HDD," "drive," or "device" in this document.

Decimal numbers are represented normally.

Hexadecimal numbers are represented as shown in the following examples: X'17B9', 17B9h, 17B9H, or 17B9H.

Binary numbers are represented as shown in the following examples: 010 or 010b.

Serial-ATA may be referred to as "SATA."

ii C141-E203-01EN

Preface

Attention

Please forward any comments you may have regarding this manual.

To make this manual easier for users to understand, opinions from readers are needed. Please write your opinions or requests on the Comment at the back of this manual and forward it to the address described in the sheet.

Liability Exception

“Disk drive defects” refers to defects that involve adjustment, repair, or replacement.

Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the host system, or other causes outside the disk drive.

C141-E203-01EN iii

This page is intentionally left blank.

Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. Also, damage to the product or other property, may occur if the user does not perform the procedure correctly.

Task Alert message Page

Normal Operation

Data corruption: Avoid mounting the disk drive near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.

Damage: Do not press the cover of the disk drive. Pressing it too hard, the cover and the spindle motor contact, which may cause damage to the disk drive.

Static: When handling the device, disconnect the body ground (500 kΩ or greater). Do not touch the printed circuit

board, but hold it by the edges.

3-7

C141-E203-01EN v

This page is intentionally left blank.

Manual Organization

MHT2080BH, MHT2060BH,

MHT2040BH

DISK DRIVES

PRODUCT MANUAL

(C141-E203)

MHT2080BH, MHT2060BH,

MHT2040BH

DISK DRIVES

MAINTENANCE MANUAL

(C141-F068)

• Device Overview

• Device Configuration

• Installation Conditions

• Theory of Device Operation

• Interface

• Operations

• Maintenance and Diagnosis

• Removal and Replacement Procedure

C141-E203-01EN vii

This page is intentionally left blank.

CHAPTER 1 Device Overview........................................................................1-1

1.1 Features .....................................................................................................1-2

1.1.1 Functions and performance...................................................................1-2

Adaptability...........................................................................................1-2

1.1.2

1.1.3 Interface ................................................................................................1-3

1.2 Device Specifications................................................................................1-4

1.2.1 Specifications summary........................................................................1-4

1.2.2 Model and product number...................................................................1-5

1.3 Power Requirements..................................................................................1-6

1.4 Environmental Specifications ...................................................................1-8

1.5 Acoustic Noise ..........................................................................................1-9

1.6 Shock and Vibration..................................................................................1-9

1.7 Reliability................................................................................................1-10

1.8 Error Rate ................................................................................................1-11

1.9 Media Defects..........................................................................................1-11

1.10 Load/Unload Function...........................................................................1-11

1.11 Advanced Power Management..............................................................1-12

1.12 Interface Power Management (IPM).....................................................1-14

1.12.1 Host-initiated Interface Power Management (HIPM)........................1-14

1.12.2 Device-initiated Interface Power Management (DIPM)....................1-14

CHAPTER 2 Device Configuration ................................................................2-1

2.1 Device Configuration................................................................................2-2

2.2 System Configuration................................................................................2-3

C141-E203-01EN ix

Contents

2.2.1 SATA interface..................................................................................... 2-3

2.2.2 Drive connection.................................................................................. 2-3

CHAPTER 3 Installation Conditions ............................................................. 3-1

3.1 Dimensions............................................................................................... 3-2

3.2 Mounting................................................................................................... 3-3

3.3 Connections with Host System................................................................. 3-9

3.3.1 Device connector.................................................................................. 3-9

3.3.2 Signal segment and power supply segment........................................ 3-10

3.3.3 Connector specifications for host system........................................... 3-10

3.3.4 SATA interface cable connection ...................................................... 3-11

3.3.5 Note about SATA interface cable connection.................................... 3-11

CHAPTER 4 Theory of Device Operation..................................................... 4-1

4.1 Outline ...................................................................................................... 4-2

4.2 Subassemblies........................................................................................... 4-2

4.2.1 Disk ...................................................................................................... 4-2

4.2.2 Spindle.................................................................................................. 4-2

4.2.3 Actuator................................................................................................ 4-2

4.2.4 Air filter................................................................................................ 4-3

4.3 Circuit Configuration................................................................................ 4-3

4.4 Power-on Sequence .................................................................................. 4-6

4.5 Self-calibration ......................................................................................... 4-7

4.5.1 Self-calibration contents....................................................................... 4-7

4.5.2 Execution timing of self-calibration..................................................... 4-8

4.5.3 Command processing during self-calibration...................................... 4-8

4.6 Read/write Circuit..................................................................................... 4-9

4.6.1 Read/write preamplifier (PreAMP)...................................................... 4-9

4.6.2 Write circuit.......................................................................................... 4-9

4.6.3 Read circuit......................................................................................... 4-10

x C141-E203-01EN

Contents

4.6.4 Digital PLL circuit..............................................................................4-11

4.7 Servo Control ..........................................................................................4-12

4.7.1 Servo control circuit............................................................................4-12

4.7.2 Data-surface servo format...................................................................4-14

4.7.3 Servo frame format.............................................................................4-16

4.7.4 Actuator motor control........................................................................4-17

4.7.5 Spindle motor control..........................................................................4-18

CHAPTER 5 Interface .....................................................................................5-1

5.1 Physical Interface......................................................................................5-2

5.1.1 Interface signals....................................................................................5-2

5.1.2 Signal interface regulation....................................................................5-4

5.1.2.1 Out of band signaling..........................................................................5-4

5.1.2.2 Primitives descriptions......................................................................5-5

5.1.3 Electrical specifications........................................................................5-6

5.1.4 Connector pinouts.................................................................................5-8

5.2 Logical Interface........................................................................................5-9

5.2.1 Communication layers........................................................................5-10

5.2.2 Outline of the Shadow Block Register................................................5-11

5.2.3 Outline of the frame information structure (FIS)................................5-12

5.2.3.1 FIS types ...........................................................................................5-12

5.2.3.2 Register - Host to Device..................................................................5-12

5.2.3.3 Register - Device to Host..................................................................5-13

5.2.3.4 DMA Active - Device to Host ..........................................................5-13

5.2.3.5 DMA Setup - Device to Host or Host to Device (Bidirectional)......5-14

5.2.3.6 BIST Active - Bidirectional..............................................................5-15

5.2.3.7 Data - Host to Device or Device to Host (Bidirectional)..................5-16

5.2.4 Shadow block registers .......................................................................5-17

5.3 Host Commands ......................................................................................5-22

5.3.1 Command code and parameters..........................................................5-22

C141-E203-01EN xi

Contents

5.3.2 Command descriptions....................................................................... 5-25

(1) RECALIBRATE (X’10’ to X’1F’)...........................................5-26

(2) READ SECTOR(S) (X’20’ or X’21’)....................................5-27

(3) READ LONG (X’22’ or X’23’) .............................................5-29

(4) WRITE SECTOR(S) (X’30’ or X’31’) ...................................5-30

(5) WRITE LONG (X’32’ or X’33’) .............................................5-32

(6) WRITE VERIFY (X’3C’) .......................................................5-34

(7) READ VERIFY SECTOR(S) (X’40’ or X’41’)......................5-36

(8) SEEK (X’70’ to X’7F’)............................................................5-38

(9) EXECUTE DEVICE DIAGNOSTIC (X’90’)..........................5-39

(10) INITIALIZE DEVICE PARAMETERS (X’91’).....................5-40

(11) DOWNLOAD MICROCODE (X’92’).....................................5-41

(12) STANDBY IMMEDIATE (X’94’ or X’E0’)...........................5-43

(13) IDLE IMMEDIATE (X’95’ or X’E1’).....................................5-44

(14) STANDBY (X’96’ or X’E2’)...................................................5-45

(15) IDLE (X’97’ or X’E3’).............................................................5-46

(16) CHECK POWER MODE (X’98’ or X’E5’) ............................5-48

(17) SLEEP (X’99’ or X’E6’).........................................................5-49

(18) SMART (X’B0’).......................................................................5-50

(19) DEVICE CONFIGURATION (X'B1') .....................................5-67

(20) READ MULTIPLE (X’C4’).....................................................5-71

(21) WRITE MULTIPLE (X’C5’)...................................................5-74

(22) SET MULTIPLE MODE (X’C6’)............................................5-76

(23) READ DMA (X’C8’ or X’C9’)................................................5-78

(24) WRITE DMA (X’CA’ or X’CB’) ............................................5-80

(25) READ BUFFER (X’E4’)..........................................................5-82

(26) FLUSH CACHE (X’E7’) ........................................................5-83

(27) WRITE BUFFER (X’E8’)........................................................5-84

(28) IDENTIFY DEVICE (X’EC’)..................................................5-85

(29) IDENTIFY DEVICE DMA (X’EE’).......................................5-86

(30) SET FEATURES (X’EF’) ........................................................5-97

(31) SECURITY SET PASSWORD (X’F1’).................................5-102

(32) SECURITY UNLOCK(X’F2’)...............................................5-104

(33) SECURITY ERASE PREPARE (X’F3’) ...............................5-106

(34) SECURITY ERASE UNIT (X’F4’) .......................................5-107

xii C141-E203-01EN

Contents

(35) SECURITY FREEZE LOCK (X’F5’) ................................... 5-108

(36) SECURITY DISABLE PASSWORD (X’F6’) ...................... 5-110

(37) READ NATIVE MAX ADDRESS (X’F8’)..........................5-112

(38) SET MAX (X’F9’)................................................................. 5-113

(39) READ SECTOR (S) EXT (X’24’)......................................... 5-119

(40) READ DMA EXT (X’25’)..................................................... 5-120

(41) READ NATIVE MAX ADDRESS EXT (X’27’).................. 5-121

(42) READ MULTIPLE EXT (X’29’) .......................................... 5-122

(43) READ LOG EXT (X'2F')....................................................... 5-123

(44) WRITE SECTOR (S) EXT (X’34’).......................................5-126

(45) WRITE DMA EXT (X’35’)................................................... 5-127

(46) SET MAX ADDRESS EXT (X’37’) ..................................... 5-128

(47) WRITE MULTIPLE EXT (X’39’) ........................................ 5-130

(48) WRITE LOG EXT (X'3F').....................................................5-131

(49) READ VERIFY SECTOR (S) EXT (X’42’) ........................ 5-133

(50) FLUSH CACHE EXT (X’EA’) ............................................ 5-134

(51) WRITE MULTIPLE FUA EXT (X'CE') ............................... 5-135

(52) WRITE DMA FUA EXT (X'3D') .......................................... 5-136

(53) READ FP DMA QUEUED (X'60')........................................ 5-137

(54) WRITE FP DMA QUEUED (X'61')......................................5-138

5.3.3 Error posting.....................................................................................5-139

5.4 Command Protocol ............................................................................... 5-141

5.4.1 Non-data command protocol............................................................5-141

5.4.2 PIO data-in command protocol.........................................................5-143

5.4.3 PIO data-out command protocol.......................................................5-144

5.4.4 DMA data-in command protocol......................................................5-146

5.4.5 DMA data-out command protocol....................................................5-147

5.4.6 Native Command Queuing protocol.................................................5-148

5.5 Power-on and COMRESET..................................................................5-151

CHAPTER 6 Operations................................................................................. 6-1

6.1 Reset and Diagnosis.................................................................................. 6-2

6.1.1 Response to power-on...........................................................................6-2

C141-E203-01EN xiii

Contents

6.1.2 Response to COMRESET.................................................................... 6-4

6.1.3 Response to a software reset ................................................................ 6-5

6.2 Power Save ............................................................................................... 6-6

6.2.1 Power save mode.................................................................................. 6-6

6.2.2 Power commands ................................................................................. 6-8

6.3 Interface Power Save................................................................................ 6-9

6.3.1 Power save mode of the interface ........................................................ 6-9

6.4 Read-ahead Cache .................................................................................. 6-11

6.4.1 Data buffer structure........................................................................... 6-11

6.4.2 Caching operation............................................................................... 6-12

6.4.3 Using the read segment buffer ........................................................... 6-14

6.4.3.1 Miss-hit............................................................................................. 6-14

6.4.3.2 Sequential hit.................................................................................... 6-15

6.4.3.3 Full hit.............................................................................................. 6-15

6.4.3.4 Partial hit.......................................................................................... 6-17

6.5 Write Cache............................................................................................ 6-18

6.5.1 Cache operation.................................................................................. 6-18

Glossary ....................................................................................................... GL-1

Acronyms and Abbreviations ........................................................................ AB-1

Index .................................................................................................................. IN-1

xiv C141-E203-01EN

Contents

Illustrations

Figures

Figure 1.1 Negative voltage at +5 V when power is turned off ............................1-6

Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on...............1-8

Figure 2.1 Disk drive outerview............................................................................2-2

Figure 2.2 Drive system configuration..................................................................2-3

Figure 3.1 Dimensions...........................................................................................3-2

Figure 3.2 Orientation............................................................................................3-3

Figure 3.3 Mounting frame structure.....................................................................3-4

Figure 3.4 Location of breather .............................................................................3-5

Figure 3.5 Surface cover temperature measurement points ..................................3-6

Figure 3.6 Service area ..........................................................................................3-7

Figure 3.7 Handling cautions.................................................................................3-8

Figure 3.8 Connector locations..............................................................................3-9

Figure 3.9 Power supply pins (CN1) ...................................................................3-10

Figure 4.1 Power Supply Configuration................................................................4-4

Figure 4.2 Circuit Configuration ...........................................................................4-5

Figure 4.3 Power-on operation sequence...............................................................4-6

Figure 4.4 Read/write circuit block diagram.........................................................4-9

Figure 4.5 Frequency characteristic of programmable filter...............................4-10

Figure 4.6 Block diagram of servo control circuit...............................................4-12

Figure 4.7 Physical sector servo configuration ( on disk surface........................4-15

Figure 4.8 Servo frame format.............................................................................4-16

Figure 5.1 Interface signals....................................................................................5-2

Figure 5.2 Conceptual diagram of communication layers.....................................5-9

Figure 5.3 Register - Host to Device FIS layout .................................................5-12

Figure 5.4 Register - Device to Host FIS layout .................................................5-13

Figure 5.5 DMA Active - Device to Host FIS layout..........................................5-13

Figure 5.6 DMA Setup - Device to Host or Host to Device FIS layout..............5-14

Figure 5.7 BIST Active - Bidirectional FIS layout..............................................5-15

Figure 5.8 Data FIS (Bidirectional) layout..........................................................5-16

Figure 5.9 Execution example of READ MULTIPLE command .......................5-72

Figure 5.10 Non-data command protocol..........................................................5-142

C141-E203-01EN xv

Contents

Figure 5.11 PIO data-in command protocol...................................................... 5-144

Figure 5.12 PIO data-out command protocol.................................................... 5-145

Figure 5.13 DMA data-in command protocol................................................... 5-146

Figure 5.14 DMA data-out command protocol................................................. 5-147

Figure 5.15 READ FP DMA QUEUED command protocol............................ 5-149

Figure 5.16 WRITE FP DMA QUEUED command protocol .......................... 5-150

Figure 5.17 Power-on sequence........................................................................ 5-151

Figure 5.18 COMRESET sequence .................................................................. 5-152

Figure 6.1 Response to power-on (when the host is powered

on earlier than the device)................................................................. 6-2

Figure 6.2 Response to power-on (when the device is powered

on earlier than the host).................................................................... 6-3

Figure 6.3 Response to COMRESET.................................................................... 6-4

Figure 6.4 Response to a software reset................................................................ 6-5

Figure 6.5 Data buffer structure.......................................................................... 6-11

xvi C141-E203-01EN

Contents

Tables

Table 1.1 Specifications ........................................................................................1-4

Table 1.2 Examples of model names and product numbers..................................1-5

Table 1.3 Current and power dissipation...............................................................1-7

Table 1.4 Environmental specifications ................................................................1-8

Table 1.5 Acoustic noise specification..................................................................1-9

Table 1.6 Shock and vibration specification..........................................................1-9

Table 1.7 Advanced power management.............................................................1-13

Table 1.8 Interface power management...............................................................1-15

Table 3.1 Surface temperature measurement points and standard values.............3-6

Table 3.2 The recommended connector specifications for the host system........3-10

Table 5.1 Physical Layer Electrical Requirements................................................5-6

Table 5.2 Connector pinouts..................................................................................5-8

Table 5.3 Shadow Block Register........................................................................5-11

Table 5.4 BIST combinations..............................................................................5-15

Table 5.5 Command code and parameters ..........................................................5-22

Table 5.6 Diagnostic code ...................................................................................5-39

Table 5.7 Operation of DOWNLOAD MICROCODE........................................5-41

Table 5.8 Example of rewriting procedure of data 384K Bytes

(30000h Bytes) of microcode.............................................................5-42

Table 5.9 Features Field values (subcommands) and functions..........................5-51

Table 5.10 Format of device attribute value data................................................5-55

Table 5.11 Format of guarantee failure threshold value data..............................5-55

Table 5.12 Off-line data collection status.............................................................5-58

Table 5.13 Self-test execution status...................................................................5-58

Table 5.14 Off-line data collection capability.....................................................5-59

Table 5.15 Failure prediction capability flag.......................................................5-59

Table 5.16 Drive error logging capability ...........................................................5-59

Table 5.17 Log Directory Data Format ...............................................................5-60

Table 5.18 Data format of SMART Summary Error Log....................................5-61

Table 5.19 Data format of SMART Comprehensive Error Log..........................5-63

Table 5.20 SMART self-test log data format ......................................................5-64

Table 5.21 Selective self-test log data structure..................................................5-65

Table 5.22 Selective self-test feature flags..........................................................5-66

Table 5.23 DEVICE CONFIGURATION IDENTIFY data structure.................5-70

Table 5.24 Information to be read by IDENTIFY DEVICE command ..............5-87

Table 5.25 Features field values and settable modes ..........................................5-97

Table 5.26 Contents of SECURITY SET PASSWORD data............................5-102

C141-E203-01EN xvii

Contents

Table 5.27 Relationship between combination of Identifier and Security

level, and operation of the lock function........................................ 5-102

Table 5.28 Contents of security password........................................................ 5-110

Table 5.29 Data format of Read Log Ext log page 10h.................................... 5-125

Table 5.30 Tag field information...................................................................... 5-125

Table 5.31 Command code and parameters ..................................................... 5-139

xviii C141-E203-01EN

CHAPTER 1 Device Overview

1.1 Features

1.2 Device Specifications

1.3 Power Requirements

1.4 Environmental Specifications

1.5 Acoustic Noise

1.6 Shock and Vibration

1.7 Reliability

1.8 Error Rate

1.9 Media Defects

1.10 Load/Unload Function

1.11 Advanced Power Management

1.12 Interface Power Management (IPM)

Overview and features are described in this chapter, and specifications and power requirement are described.

The disk drive is 2.5-inch hard disk drives with built-in disk controllers. These disk drives use the SATA interface protocol which has a high-speed interface data transfer rate.

C141-E203-01EN 1-1

Device Overview

1.1 Features

1.1.1 Functions and performance

The following features of the disk drive is described.

(1) Compact

The disk drive has 1 disk or 2 disks of 65 mm (2.5 inches) diameter, and its height is 9.5 mm (0.374 inch).

(2) Large capacity

The disk drive can record up to 40 GB (formatted) on one disk using the RLL recording method and 30 recording zone technology. The disk drive has a formatted capacity of 80 GB (MHT2080BH), 60 GB (MHT2060BH), 40 GB (MHT2040BH) respectively.

(3) High-speed Transfer rate

The disk drive (the MHT Series) has an internal data rate up to 53.9 MB/s. The disk drive supports an external data rate up to 1.5Gbps (Serial-ATA Generation-1).

(4) Aver age posit ioning t im e

Use of a rotary voice coil motor in the head positioning mechanism greatly increases the positioning speed. The average positioning time is 12 ms (at read).

1.1.2 Adaptability

(1) Power save mode

The disk drive is ideal for applications since it supports the power save mode function that works in each of the Idle, Standby and Sleep modes and has the Partial and Slumber interface power management functions.

(2) Wide tem perature range

The disk drive can be used over a wide temperature range (5 °C to 55 °C).

(3) Low noise and vibration

In Ready status (while the device is waiting for any commands), the Sound Power level of the disk drives in idle mode is 2.2 Bels [MHT2040BH]/2.8 Bels [MHT2080BH, MHT2060BH]. The Sound Pressure level is 25.0 dB [MHT2040BH]/34.0 dB [MHT2080BH, MHT2060BH] as measured 0.3 m from the drive in Idle mode.

(4) High resist ance against shock

The Load/Unload mechanism is highly resistant against non-operation shock up to 8820 m/s

(900G).

1-2 C141-E203-01EN

1.1 Features

1.1.3 Interface

(1) Connect ion t o SATA int e r f ace

The disk drive has built-in controllers compatible with the SATA interface.

(2) Data buffer

The disk drive use a 2MB or 8MB data buffer to transfer data between the host and the disk media.

In combination with the read-ahead cache system described in item (3) and the write cache described in item (6), the buffer contributes to efficient I/O processing.

(3) Read-ahead cache system

After the execution of a disk read command, the disk drive automatically reads the subsequent data block and writes it to the data buffer (read ahead operation). This cache system enables fast data access. The next disk read command would normally cause another disk access. But, if the read ahead data corresponds to the data requested by the next read command, the data in the buffer can be transferred instead.

(4) Error correction and retry by ECC

If a recoverable read error occurs, the disk drive itself attempt error recovery. The ECC has improved buffer error correction for correctable data errors.

(5) Self-diagnosis

The disk drive has a diagnostic function to check operation of the controller and disk drive. Executing a diagnostic function of the smart command invokes selfdiagnosis.

(6) Write cache

When the disk drive receives a write command, the disk drive posts the command completion at completion of transferring data to the data buffer completion of writing to the disk media. This feature reduces the access time at writing.

C141-E203-01EN 1-3

Device Overview

1.2 Device Specifications

1.2.1 Specifications summary

Table 1.1 shows the specifications of the disk drives.

Table 1.1 Specifications (1/2)

MHT2080BH MHT2060BH MHT2040BH

Format Capacity (*1, *2) 80 GB 60 GB 40 GB Number of Sectors (User) 156,301,488 sectors 117,210,240 sectors 78,140,160 sectors Bytes per Sector 512 bytes Rotational Speed 5,400 rpm ± 1% Average Latency 5.56 ms Positioning time

(read and seek)

• Minimum (Track-Track)

• Average

• Maximum (Full)

Start time 4.0 sec (typ.) Interface Compliant with ATA/ATAPI-7, SATA1.0a, and SATA II 1.0

Data Transfer Rate (*2)

• To/From Media

• To/From Host

Data Buffer Size (*3) 8MB Physical Dimensions

(Height × Depth × Width) Weight 99 g (max) *1: Capacity under the LBA mode.

1.5 ms (typ.)

Read: 12ms (typ.)

22 ms (typ.)

[Cable length: less than 1.0m (39.37 inchs)]

53.9 MB/s Max.

1.5Gbps Max (Serial-ATA Generation-1)

9.5 mm × 100.0 mm × 70.0 mm (*4)

*2: 1GB = 1,000,000,000 bytes, and 1 MB = 1,000,000 bytes. *3: 1MB = 1,048,576 bytes. *4: The value of Depth (=100.0 mm) does not include PCBA

(Printed Circuit Board Assembly). Refer to Section 3.1.

1-4 C141-E203-01EN

1.2 Device Specifications

Table 1.1 lists the formatted capacity, number of logical cylinders, number

of heads, and number of sectors of every model for which the CHS mode has been selected using the BIOS setup utility on the host.

Table 1.1 Specifications (2/2)

Model Capacity (*1) No. of Cylinder No. of Heads No. of Sectors

MHT2080BH 8.45 GB 16,383 16 63 MHT2060BH 8.45 GB 16,383 16 63 MHT2040BH 8.45 GB 16,383 16 63 *1 Indicates the storage capacity when the numbers of logical cylinders, heads, and sectors are

specified as shown in this table.

1.2.2 Model and product number

Table 1.2 lists the model names and product numbers of the disk drive.

The model name does not necessarily correspond to the product number as listed in Table 1.2 since some models have been customized and have specifications that are different from those for the standard model.

If a disk drive is ordered as a replacement drive, the product number must be the same as that of the drive being replaced.

Table 1.2 Examples of model names and product numbers

Model Name

MHT2080BH 80 GB M3 depth 3 CA06500-B048 MHT2060BH 60 GB M3 depth 3 CA06500-B046 MHT2040BH 40 GB M3 depth 3 CA06500-B024

Capacity

(user area)

Mounting screw Order No.

C141-E203-01EN 1-5

Device Overview

1.3 Power Requirements

(1) Input Voltage

• + 5 V ± 5 %

• It is unnecessary for this drive to supply +3.3V and +12V power supplies.

(2) Ripple

+5 V Maximum 100 mV (peak to peak) Frequency DC to 1 MHz

(3) A negative voltagelike the bottom figure isn't to occur at +5 V when power is turned off

and, a thing with no ringing.

Permissible level: −0.2 V

Voltage [V]

-1

0 100 200 300 400 500 600 700 800

Time [ms]

Figure 1.1 Negative voltage at +5 V when power i s t urned of f

1-6 C141-E203-01EN

1.3 Power Requirements

(4) Cur r ent Requirements and Power Dissipation

Table 1.3 lists the current and power dissipation (typical).

Table 1.3 Current and power dissipation

Typical RMS Current Typical Power (*3)

MHT2080BH, MHT2060BH,

MHT2040BH

MHT2080BH, MHT2060BH,

MHT2040BH Spin up (*1) 1.0 A 5.0 W Idle (*6) 170 mA 0.85 W R/W (on track) (*2) Read 460 mA / Write 460mA Read 2.3 W / Write 2.3 W Seek (*5) 500 mA 2.5 W Standby (*6) 50 mA 0.25 W Sleep (*6) 20 mA 0.1 W Energy

Efficiency (*4)

— 0.011 W/GB

(rank E / MHT2080BH)

0.014 W/GB

(rank E / MHT2060BH)

0.021 W/GB

(rank D / MHT2040BH)

*1 Maximum current and power at starting spindle motor. *2 Current and power level when the operation (command) that accompanies a

transfer of 63 sectors is executed 3 times in 100 ms. *3 Power requirements reflect nominal values for +5 V power. *4 Energy efficiency based on the Law concerning the Rational Use of Energy

indicates the value obtained by dividing power consumption by the storage

capacity. (Japan only) *5 The seek average current is specified based on three operations per

100 msec. *6 IPM mode: Slumber mode.

C141-E203-01EN 1-7

Device Overview

(5) Current fluctuation (Typ.) at +5 V when power is tur n ed on

Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on

(6) Power on/off sequence

The voltage detector circuits monitor +5 V. The circuits do not allow a write signal if either voltage is abnormal. These prevent data from being destroyed and eliminates the need to be concerned with the power on/off sequence.

1.4 Environmental Specifications

Table 1.4 lists the environmental specifications.

Table 1.4 Environmental specificati ons

Item Specification Temperature

• Operating

• Non-operating

• Thermal Gradient

Humidity

• Operating

• Non-operating

• Maximum Wet Bulb

Altitude (relative to sea level)

• Operating

• Non-operating

5 °C to 55 °C (ambient) 5 °C to 60 °C (disk cover surface) –40 °C to 65 °C 20 °C/h or less

8 % to 90 % RH (Non-condensing) 5 % to 95 % RH (Non-condensing) 29 °C (Operating)

40 °C (Non-operating)

–300 to 3,000 m –300 to 12,000 m

1-8 C141-E203-01EN

+ 234 hidden pages