Fujitsu MHT2060AT, MHT2040AT, MHT2080AT, MHT2020AT, MHT2030AT User Manual
C141-E192-01EN
MHT2080AT, MHT2060AT, MHT2040AT
MHT2030AT, MHT2020AT
DISK DRIVES
PRODUCT MANUAL
FOR SAFE OPERATION
Handling of This Manual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the
application or use of any product or system in accordance with the descriptions or instructions
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION
CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further
notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices
for life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2002
Revision History
(1/1)
Edition Date
01 2003-01-20
Revised section (*1)
(Added/Deleted/Altered)
Details
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.
C141-E192-01EN
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This manual describes the MHT Series, 2.5-inch hard disk drives. These drives
have a built-in controller that is compatible with the ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview
This chapter gives an overview of the MHT Series and describes their features.
CHAPTER 2 Device Configuration
Preface
This chapter describes the internal configurations of the MHT Series and the
configuration of the systems in which they operate.
CHAPTER 3 Installation Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the MHT Series.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the MHT Series.
CHAPTER 5 Interface
This chapter describes the interface specifications of the MHT Series.
CHAPTER 6 Operations
This chapter describes the operations of the MHT Series.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
C141-E192-01EN i
Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert
signal also indicates that damages to the product or
other property may occur if the user does not perform
the procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An MHT series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9H, or 17B9H.
Binary numbers are represented as shown in the following examples: 010 or
010b.
ii C141-E192-01EN
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of
this manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.
Preface
C141-E192-01EN iii
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Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Normal Operation
Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is not affected by external magnetic fields.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩ or greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7
C141-E192-01EN v
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Manual Organization
MHT2080AT, MHT2060AT,
MHT2040AT
MHT2030AT, MHT2020AT
DISK DRIVES
PRODUCT MANUAL
(C141-E192)
<This manual>
MHT2080AT, MHT2060AT,
MHT2040AT
MHT2030AT, MHT2020AT
DISK DRIVES
MAINTENANCE MANUAL
(C141-F063)
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
• Maintenance and Diagnosis
• Removal and Replacement Procedure
C141-E192-01EN vii
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Contents
Device Overview ................................................................................................ 1-1
1.1 Features................................................................................................... 1-2
1.1.1 Functions and performance................................................................... 1-2
1.1.2 Adaptability .......................................................................................... 1-2
1.1.3 Interface ................................................................................................ 1-3
1.2 Device Specifications ............................................................................. 1-4
1.2.1 Specifications summary........................................................................ 1-4
1.2.2 Model and product number................................................................... 1-5
1.3 Power Requirements ............................................................................... 1-5
1.4 Environmental Specifications................................................................. 1-8
1.5 Acoustic Noise........................................................................................ 1-9
1.6 Shock and Vibration ...............................................................................1-9
1.7 Reliability.............................................................................................. 1-10
1.8 Error Rate.............................................................................................. 1-11
1.9 Media Defects....................................................................................... 1-11
1.10 Load/Unload Function .......................................................................... 1-11
1.11 Advanced Power Management ............................................................. 1-12
CHAPTER 2 Device Configuration................................................................ 2-1
2.1 Device Configuration.............................................................................. 2-2
2.2 System Configuration ............................................................................. 2-3
2.2.1 ATA interface ....................................................................................... 2-3
2.2.2 1 drive connection................................................................................. 2-3
2.2.3 2 drives connection ............................................................................... 2-4
C141-E192-01EN ix
Contents
CHAPTER 3 Installation Conditions..............................................................3-1
3.1 Dimensions.............................................................................................. 3-2
3.2 Mounting................................................................................................. 3-3
3.3 Cable Connections ..................................................................................3-9
3.3.1 Device connector...................................................................................3-9
3.3.2 Cable connector specifications ...........................................................3-10
3.3.3 Device connection............................................................................... 3-10
3.3.4 Power supply connector (CN1)........................................................... 3-11
3.4 Jumper Settings ..................................................................................... 3-11
3.4.1 Location of setting jumpers ................................................................3-11
3.4.2 Factory default setting.........................................................................3-12
3.4.3 Master drive-slave drive setting.......................................................... 3-12
3.4.4 CSEL setting .......................................................................................3-13
3.4.5 Power Up in Standby setting...............................................................3-14
CHAPTER 4 Theory of Device Operation......................................................4-1
4.1 Outline..................................................................................................... 4-2
4.2 Subassemblies .........................................................................................4-2
4.2.1 Disk .......................................................................................................4-2
4.2.2 Spindle ..................................................................................................4-2
4.2.3 Actuator................................................................................................. 4-2
4.2.4 Air filter ................................................................................................4-3
4.3 Circuit Configuration ..............................................................................4-3
4.4 Power-on Sequence.................................................................................4-6
4.5 Self-calibration........................................................................................ 4-7
4.5.1 Self-calibration contents .......................................................................4-7
4.5.2 Execution timing of self-calibration .....................................................4-8
4.5.3 Command processing during self-calibration .......................................4-9
4.6 Read/write Circuit................................................................................... 4-9
4.6.1 Read/write preamplifier (PreAmp) .......................................................4-9
x C141-E192-01EN
Contents
4.6.2 Write circuit.......................................................................................... 4-9
4.6.3 Read circuit......................................................................................... 4-11
4.6.4 Digital PLL circuit.............................................................................. 4-12
4.7 Servo Control........................................................................................ 4-13
4.7.1 Servo control circuit ........................................................................... 4-13
4.7.2 Data-surface servo format................................................................... 4-16
4.7.3 Servo frame format ............................................................................. 4-18
4.7.4 Actuator motor control ....................................................................... 4-19
4.7.5 Spindle motor control ......................................................................... 4-20
CHAPTER 5 Interface..................................................................................... 5-1
5.1 Physical Interface.................................................................................... 5-2
5.1.1 Interface signals .................................................................................... 5-2
5.1.2 Signal assignment on the connector...................................................... 5-3
5.2 Logical Interface..................................................................................... 5-6
5.2.1 I/O registers........................................................................................... 5-7
5.2.2 Command block registers ..................................................................... 5-8
5.2.3 Control block registers........................................................................ 5-13
5.3 Host Commands.................................................................................... 5-14
5.3.1 Command code and parameters.......................................................... 5-14
5.3.2 Command descriptions ....................................................................... 5-18
5.3.3 Error posting ..................................................................................... 5-107
5.4 Command Protocol ............................................................................. 5-109
5.4.1 PIO Data transferring commands from device to host...................... 5-109
5.4.2 PIO Data transferring commands from host to device...................... 5-111
5.4.3 Commands without data transfer...................................................... 5-113
5.4.4 Other commands............................................................................... 5-115
5.4.5 DMA data transfer commands.......................................................... 5-115
5.5 Ultra DMA Feature Set....................................................................... 5-118
5.5.1 Overview........................................................................................... 5-118
5.5.2 Phases of operation ........................................................................... 5-119
5.5.3 Ultra DMA data in commands.......................................................... 5-119
C141-E192-01EN xi
Contents
5.5.3.1 Initiating an Ultra DMA data in burst............................................. 5-119
5.5.3.2 The data in transfer .........................................................................5-120
5.5.3.3 Pausing an Ultra DMA data in burst...............................................5-120
5.5.3.4 Terminating an Ultra DMA data in burst........................................ 5-121
5.5.4 Ultra DMA data out commands........................................................ 5-124
5.5.4.1 Initiating an Ultra DMA data out burst........................................... 5-124
5.5.4.2 The data out transfer .......................................................................5-124
5.5.4.3 Pausing an Ultra DMA data out burst.............................................5-125
5.5.4.4 Terminating an Ultra DMA data out burst...................................... 5-126
5.5.5 Ultra DMA CRC rules ......................................................................5-128
5.5.6 Series termination required for Ultra DMA...................................... 5-129
5.6 Timing................................................................................................. 5-130
5.6.1 PIO data transfer ...............................................................................5-130
5.6.2 Multiword data transfer.....................................................................5-131
5.6.3 Ultra DMA data transfer ...................................................................5-132
5.6.3.1 Initiating an Ultra DMA data in burst............................................. 5-132
5.6.3.2 Ultra DMA data burst timing requirements.................................... 5-133
5.6.3.3 Sustained Ultra DMA data in burst................................................. 5-136
5.6.3.4 Host pausing an Ultra DMA data in burst ......................................5-137
5.6.3.5 Device terminating an Ultra DMA data in burst............................. 5-138
5.6.3.6 Host terminating an Ultra DMA data in burst ................................5-139
5.6.3.7 Initiating an Ultra DMA data out burst........................................... 5-140
5.6.3.8 Sustained Ultra DMA data out burst............................................... 5-141
5.6.3.9 Device pausing an Ultra DMA data out burst................................. 5-142
5.6.3.10 Host terminating an Ultra DMA data out burst ..............................5-143
5.6.3.11 Device terminating an Ultra DMA data out burst...........................5-144
5.6.4 Power-on and reset............................................................................5-145
CHAPTER 6 Operations .................................................................................6-1
6.1 Device Response to the Reset .................................................................6-2
6.1.1 Response to power-on........................................................................... 6-2
6.1.2 Response to hardware reset................................................................... 6-3
6.1.3 Response to software reset....................................................................6-5
6.1.4 Response to diagnostic command......................................................... 6-6
xii C141-E192-01EN
Contents
6.2 Power Save.............................................................................................. 6-7
6.2.1 Power save mode .................................................................................. 6-7
6.2.2 Power commands.................................................................................. 6-9
6.3 Defect Processing ...................................................................................6-9
6.3.1 Spare area.............................................................................................. 6-9
6.3.2 Alternating processing for defective sectors ......................................6-10
6.4 Read-ahead Cache................................................................................. 6-12
6.4.1 DATA buffer structure ....................................................................... 6-12
6.4.2 Caching operation............................................................................... 6-13
6.4.3 Using the read segment buffer............................................................ 6-15
6.4.3.1 Miss-hit.............................................................................................6-15
6.4.3.2 Sequential Hit ...................................................................................6-16
6.4.3.3 Full hit............................................................................................... 6-17
6.4.3.4 Partial hit........................................................................................... 6-18
6.5 Write Cache ..........................................................................................6-19
6.5.1 Cache operation .................................................................................. 6-19
Glossary............................................................................................................GL-1
Acronyms and Abbreviations ........................................................................ AB-1
Index ..................................................................................................................IN-1
C141-E192-01EN xiii
Contents
Figures
Illustrations
Figure 1.1 Negative voltage at +5 V when power is turned off..........................1-6
Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on ............1-8
Figure 2.1 Disk drive outerview..........................................................................2-2
Figure 2.2 1 drive system configuration..............................................................2-3
Figure 2.3 2 drives configuration ........................................................................2-4
Figure 3.1 Dimensions.........................................................................................3-2
Figure 3.2 Orientation .........................................................................................3-3
Figure 3.3 Mounting frame structure ..................................................................3-4
Figure 3.4 Location of breather...........................................................................3-5
Figure 3.5 Surface temperature measurement points.......................................... 3-6
Figure 3.6 Service area........................................................................................3-7
Figure 3.7 Handling cautions ..............................................................................3-8
Figure 3.8 Connector locations ...........................................................................3-9
Figure 3.9 Cable connections ............................................................................3-10
Figure 3.10 Power supply connector pins (CN1)................................................ 3-11
Figure 3.11 Jumper location................................................................................3-11
Figure 3.12 Factory default setting......................................................................3-12
Figure 3.13 Jumper setting of master or slave drive ...........................................3-12
Figure 3.14 CSEL setting ....................................................................................3-13
Figure 3.15 Example (1) of Cable Select ............................................................3-13
Figure 3.16 Example (2) of Cable Select ............................................................3-14
Figure 4.1 Power Supply Configuration..............................................................4-4
Figure 4.2 Circuit Configuration......................................................................... 4-5
Figure 4.3 Power-on operation sequence ............................................................4-7
Figure 4.4 Read/write circuit block diagram..................................................... 4-10
Figure 4.5 Frequency characteristic of programmable filter.............................4-11
Figure 4.6 Block diagram of servo control circuit ............................................4-13
Figure 4.7 Physical sector servo configuration on disk surface........................4-17
Figure 4.8 Servo frame format ..........................................................................4-18
Figure 5.1 Interface signals .................................................................................5-2
Figure 5.2 Execution example of READ MULTIPLE command .....................5-21
xiv C141-E192-01EN
Contents
Figure 5.3 Read Sector(s) command protocol.................................................5-110
Figure 5.4 Protocol for command abort ..........................................................5-111
Figure 5.5 WRITE SECTOR(S) command protocol.......................................5-113
Figure 5.6 Protocol for the command execution without data transfer........... 5-114
Figure 5.7 Normal DMA data transfer ............................................................5-117
Figure 5.8 Ultra DMA termination with pull-up or pull-down .......................5-129
Figure 5.9 PIO data transfer timing.................................................................5-130
Figure 5.10 Multiword DMA data transfer timing (mode 2) ............................5-131
Figure 5.11 Initiating an Ultra DMA data in burst............................................5-132
Figure 5.12 Sustained Ultra DMA data in burst................................................5-136
Figure 5.13 Host pausing an Ultra DMA data in burst .....................................5-137
Figure 5.14 Device terminating an Ultra DMA data in burst............................5-138
Figure 5.15 Host terminating an Ultra DMA data in burst ............................... 5-139
Figure 5.16 Initiating an Ultra DMA data out burst..........................................5-140
Figure 5.17 Sustained Ultra DMA data out burst..............................................5-141
Figure 5.18 Device pausing an Ultra DMA data out burst................................ 5-142
Figure 5.19 Host terminating an Ultra DMA data out burst ............................. 5-143
Figure 5.20 Device terminating an Ultra DMA data out burst..........................5-144
Figure 5.21 Power-on Reset Timing..................................................................5-145
Figure 6.1 Response to power-on........................................................................ 6-3
Figure 6.2 Response to hardware reset................................................................6-4
Figure 6.3 Response to software reset.................................................................6-5
Figure 6.4 Response to diagnostic command ...................................................... 6-6
Figure 6.5 Sector slip processing ......................................................................6-10
Figure 6.6 Automatic alternating processing.....................................................6-11
Figure 6.7 Data buffer structure (2 MB Buffer)................................................6-12
C141-E192-01EN xv
Contents
Tables
Table 1.1 Specifications.....................................................................................1-4
Table 1.2 Model names and product numbers...................................................1-5
Table 1.3 Current and power dissipation ...........................................................1-7
Table 1.4 Environmental specifications.............................................................1-8
Table 1.5 Acoustic noise specification ..............................................................1-9
Table 1.6 Shock and vibration specification...................................................... 1-9
Table 3.1 Surface temperature measurement points and standard values..........3-6
Table 3.2 Cable connector specifications ........................................................3-10
Table 5.1 Signal assignment on the interface connector....................................5-3
Table 5.2 I/O registers........................................................................................5-7
Table 5.3 Command code and parameters....................................................... 5-15
Table 5.4 Information to be read by IDENTIFY DEVICE command .............5-34
Table 5.5 Features register values and settable modes ....................................5-44
Table 5.6 Diagnostic code................................................................................5-56
Table 5.7 Features Register values (subcommands) and functions................. 5-68
Table 5.8 Format of device attribute value data...............................................5-72
Table 5.9 Format of insurance failure threshold value data.............................5-72
Table 5.10 Log Directory Data Format..............................................................5-77
Table 5.11 Data format of SMART Summary Error Log.................................. 5-78
Table 5.11.1 Data format of SMART Comprehensive Error Log ........................5-79
Table 5.12 SMART self-test log data format.....................................................5-80
Table 5.13 Selective self-test log data structure ................................................5-81
Table 5.14 Selective self-test feature flags ........................................................5-82
Table 5.15 Contents of security password .........................................................5-83
Table 5.16 Contents of SECURITY SET PASSWORD data............................5-87
Table 5.17 Relationship between combination of Identifier and
Security level, and operation of the lock function...........................5-88
Table 5.18 DEVICE CONFIGURATION IDENTIFY data structure ...............5-94
Table 5.19 Operation of DOWNLOAD MICRO CODE................................. 5-106
Table 5.20 Example of rewriting procedure of data 384 KBytes
(30000h Bytes) of microcode.........................................................5-106
Table 5.21 Command code and parameters..................................................... 5-107
Table 5.22 Recommended series termination for Ultra DMA.........................5-129
Table 5.23 Ultra DMA data burst timing requirements...................................5-133
Table 5.24 Ultra DMA sender and recipient timing requirements ..................5-135
xvi C141-E192-01EN
CHAPTER 1 Device Overview
1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
1.10 Load/Unload Function
1.11 Advanced Power Management
Overview and features are described in this chapter, and specifications and power
requirement are described.
The MHT Series are 2.5-inch hard disk drives with built-in disk controllers.
These disk drives use the AT-bus hard disk interface protocol and are compact
and reliable.
C141-E192-01EN 1-1
Device Overview
1.1 Features
1.1.1 Functions and performance
The following features of the MHT Series are described.
(1) Compact
The MHT Series has 1 disk or 2 disks of 65 mm (2.5 inches) diameter, and its
height is 9.5 mm (0.374 inch).
(2) Large capacity
The disk drive can record up to 40 GB (formatted) on one disk using the 32/34
RLL recording method and 30 recording zone technology. The MHT Series has a
formatted capacity of 80 GB (MHT2080AT), 60 GB (MHT2060AT), 40 GB
(MHT2040AT), 30 GB (MHT2030AT) and 20 GB (MHT2020AT) respectively.
(3) High-speed Transfer rate
The disk drives (the MHT Series) have an internal data rate up to 41.3 MB/s. The
disk drive supports an external data rate up to 100 MB/s (U-DMA mode 5).
(4) Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly
increases the positioning speed. The average positioning time is 12 ms (at read).
1.1.2 Adaptability
(1) Power save mode
The power save mode feature for idle operation, stand by and sleep modes makes
The disk drives (the MHT Series) ideal for applications where power
consumption is a factor.
(2) Wide temperature range
The disk drives (the MHT Series) can be used over a wide temperature range
(5 °C to 55 °C).
(3) Low noise and vibration
In Ready status, the noise of the disk drives (the MHT Series) is only 24 dBA
(measured at 0.3 m apart from the drive under the idle mode).
(4) High resistance against shock
The Load/Unload mechanism is highly resistant against non-operation shock up
to 8820 m/s
2
(900G).
1-2 C141-E192-01EN
1.1.3 Interface
(1) Connection to ATA interface
The MHT-series disk drives have built-in controllers compatible with the ATA
interface.
(2) 2 MB data buffer
The disk drives (the MHT Series) use a 2 MB data buffer to transfer data between
the host and the disk media.
In combination with the read-ahead cache system described in item (3) and the
write cache described in item (7), the buffer contributes to efficient I/O
processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads
the subsequent data block and writes it to the data buffer (read ahead operation).
This cache system enables fast data access. The next disk read command would
normally cause another disk access. But, if the read ahead data corresponds to the
data requested by the next read command, the data in the buffer can be transferred
instead.
1.1 Features
(4) Master/slave
The disk drives (the MHT Series) can be connected to ATA interface as daisy
chain configuration. Drive 0 is a master device, drive 1 is a slave device.
(5) Error correction and retry by ECC
If a recoverable error occurs, the disk drives (the MHT Series) themselves attempt
error recovery. The ECC has improved buffer error correction for correctable
data errors.
(6) Self-diagnosis
The disk drives (the MHT Series) have a diagnostic function to check operation of
the controller and disk drives. Executing a diagnostic function of the smart
command invokes self-diagnosis.
(7) Write cache
When the disk drives (the MHT Series) receive a write command, the disk drives
post the command completion at completion of transferring data to the data buffer
completion of writing to the disk media. This feature reduces the access time at
writing.
C141-E192-01EN 1-3
Device Overview
1.2 Device Specifications
1.2.1 Specifications summary
Table 1.1 shows the specifications of the disk drives (MHT Series).
Table 1.1 Specifications (1/2)
MHT2080AT MHT2060AT MHT2040AT MHT2030AT MHT2020AT
Format Capacity (*1) 80 GB 60 GB 40 GB 30 GB 20 GB
Number of Sectors (User) 156,301,488 117,210,240 78,140,160 58,605,120 39,070,080
Bytes per Sector 512
Recording Method 32/34 MEEPRML
Rotational Speed 4,200 rpm ± 1%
Average Latency 7.14 ms
Positioning time (read and seek)
• Minimum (Track-Track)
• Average
• Maximum (Full)
Start time 3.5 sec (typ.)
Interface ATA-6 (Max. Cable length: 18inches (0.46 m))
(equipped with expansion function)
Data Transfer Rate
• To/From Media
• To/From Host
Data Buffer Size 2 MB
Physical Dimensions
(Height × Width × Depth)
Weight 99 g
*1: Capacity under the LBA mode.
100 MB/s Max (U-DMA mode5)
9.5 mm × 100.0 mm × 70.0 mm
1.5 ms (typ.)
Read: 12ms (typ.)
22 ms (typ.)
41.3 MB/s Max.
1-4 C141-E192-01EN
1.3 Power Requirements
Table 1.1 lists the formatted capacity, number of logical cylinders, number
of heads, and number of sectors of every model for which the CHS mode
has been selected using the BIOS setup utility on the host.
Table 1.1 Specifications (2/2)
Model Capacity (*1) No. of Cylinder No. of Heads No. of Sectors
MHT2080AT 8.45 GB 16,383 16 63
MHT2060AT 8.45 GB 16,383 16 63
MHT2040AT 8.45 GB 16,383 16 63
MHT2030AT 8.45 GB 16,383 16 63
MHT2020AT 8.45 GB 16,383 16 63
*1 On using for the units of BIOS parameter.
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers of the MHT Series.
Table 1.2 Model names and product numbers
Model Name
MHT2080AT 80 GB M3 depth 3 CA06297-B048
MHT2060AT 60 GB M3 depth 3 CA06297-B046
MHT2040AT 40 GB M3 depth 3 CA06297-B024
MHT2030AT 30 GB M3 depth 3 CA06297-B023
MHT2020AT 20 GB M3 depth 3 CA06297-B022
Capacity
(user area)
Mounting screw Order No.
1.3 Power Requirements
(1) Input Voltage
•
+ 5 V ± 5 %
(2) Ripple
+5 V
Maximum 100 mV (peak to peak)
Frequency DC to 1 MHz
C141-E192-01EN 1-5
Device Overview
(3) A negative voltage like the bottom figure isn't to occur at +5 V when power is turned off and, a
thing with no ringing.
Permissible level: −0.2 V
5
4
3
2
1
0
-1
0 100 200 300 400 500 600 700 800
Time [ms]
Figure 1.1 Negative voltage at +5 V when power is turned off
1-6 C141-E192-01EN
1.3 Power Requirements
(4) Current Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation (typical).
Table 1.3 Current and power dissipation
Typical RMS Current Typical Power (*3)
MHT Series MHT Series
Spin up (*1) 0.9 A 4.5 W
Idle 130 mA 0.65 W
R/W (on track) (*2) Read 400 mA / Write 420mA Read 2.0 W / Write 2.1 W
Seek (*5) 460 mA 2.3 W
Standby 50 mA 0.25 W
Sleep 20 mA 0.1 W
Energy
Efficiency (*4)
— 0.008 W/GB
(rank E / MHT2080AT)
0.011 W/GB
(rank E / MHT2060AT)
0.011 W/GB
(rank E / MHT2040AT)
0.022 W/GB
(rank D / MHT2030AT)
0.022 W/GB
(rank D / MHT2020AT)
*1 Current at starting spindle motor.
*2 Current and power level when the operation (command) that accompanies a
transfer of 63 sectors is executed 3 times in 100 ms
*3 Power requirements reflect nominal values for +5 V power.
*4 Energy efficiency based on the Law concerning the Rational Use of Energy
indicates the value obtained by dividing power consumption by the storage
capacity. (Japan only)
*5 The seek average current is specified based on three operations per 100
msec.
(5) Current fluctuation (Typ.) at +5 V when power is turned on
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Device Overview
Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on
(6) Power on/off sequence
The voltage detector circuits (the MHT Series) monitor +5 V. The circuits do not
allow a write signal if either voltage is abnormal. These prevent data from being
destroyed and eliminates the need to be concerned with the power on/off
sequence.
1.4 Environmental Specifications
Table 1.4 lists the environmental specifications.
Table 1.4 Environmental specifications
Item Specification
Temperature
• Operating
• Non-operating
• Thermal Gradient
Humidity
• Operating
• Non-operating
• Maximum Wet Bulb
Altitude (relative to sea level)
• Operating
• Non-operating
5 °C to 55 °C (ambient)
5 °C to 60 °C (disk enclosure surface)
–40 °C to 65 °C
20 °C/h or less
8 % to 90 % RH (Non-condensing)
5 % to 95 % RH (Non-condensing)
29 °C (Operating)
40 °C (Non-operating)
–300 to 3,000 m
–300 to 12,000 m
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1.5 Acoustic Noise
Table 1.5 lists the acoustic noise specification.
Table 1.5 Acoustic noise specification
Item Specification
Sound Pressure
• Idle mode (DRIVE READY) 24 dBA typical at 0.3 m
Note:
Measure the noise from the cover top surface.
1.6 Shock and Vibration
1.5 Acoustic Noise
Table 1.6 lists the shock and vibration specification.
Table 1.6 Shock and vibration specification
Item Specification
Vibration (Swept sine, 1/4 octave per minute)
• Operating
5 to 500 Hz, 9.8m/s
(without non-recovered errors)
5 to 500 Hz, 49m/s
• Non-operating
(no damage)
Shock (half-sine pulse)
• Operating
2207 m/s
2
0-peak (225G 0-peak)
2ms duration
• Non-operating
(without non-recovered errors)
8820 m/s
2
0-peak (900G 0-peak)
1ms duration
1176 m/s
2
0-peak (120G 0-peak)
11ms duration
(no damage)
2
0-peak (1G 0-peak)
2
0-peak (5G 0-peak)
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Device Overview
1.7 Reliability
(1) Mean time between failures (MTBF)
Conditions of 300,000 h Power-on time 250H/month or less 3000H/years
MTBF is defined as follows:
Total operation time in all fields
MTBF= (H)
number of device failure in all fields (*1)
*1 “Disk drive defects” refers to defects that involve repair, readjustment, or
replacement. Disk drive defects do not include failures caused by external
factors, such as damage caused by handling, inappropriate operating
environments, defects in the power supply host system, or interface cable.
or less
Operating time 20 % or less of power-on time
Environment 5 to 55 °C/8 to 90 %
But humidity bulb temperature
29 °C or less
(2) Mean time to repair (MTTR)
The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist
maintenance staff member.
(3) Service life
In situations where management and handling are correct, the disk drive requires
no overhaul for five years when the DE surface temperature is less than 48 °C.
When the DE surface temperature exceeds 48 °C, the disk drives requires no
overhaul for five years or 20,000 hours of operation, whichever occurs first.
Refer to item (3) in Subsection 3.2 for the measurement point of the DE surface
temperature. Also the operating conditions except the environment temperature
are based on the MTBF conditions.
(4) Data assurance in the event of power failure
Except for the data block being written to, the data on the disk media is assured in
the event of any power supply abnormalities. This does not include power supply
abnormalities during disk media initialization (formatting) or processing of
defects (alternative block assignment).
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