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MHT2040AH
User Manual
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Fujitsu MHT2040AH User Manual

C141-E195-02EN
MHT2080AH, MHT2060AH, MHT2040AH
DISK DRIVES
PRODUCT MANUAL

FOR SAFE OPERATION

Handling of This Manual
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THI S PRODUCT. INCORRECT USE OF THE PRO DUCT MAY RESULT IN INJURY OR DAMAGE TO USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU assumes no liability to any party for any damage caused by any error or omission contained in this manual, its updates or supplements, whether such errors or omissions result from negligence, accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the application or use of any product or system in accordance with the descriptions or instructions contained herein; including any liability for incidental or consequential damages arising therefrom. FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work, personal devices and household appliances. This product is not intended for special uses (atomic controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for life support, or weapons firing controls) where particularly high reliability requirements exist, where the pertinent levels of safety are not guaranteed, or where a failure or operational error could threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers considering the use of these products for mission-critical applications must have safety-assurance measures in place beforehand. Moreover, they are requested to consult our sales representative before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2003

Revision History

(1/1)
Edition Date
01 2003-06-20 02 2003-10-28 Table 1.2 (Altered)
Table 1.5 (Altered)
Revised section (*1)
(Added/Deleted/Altered)
Details
Change of the order No. Change of the acoustic noise
specification
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.
C141-E195-02EN
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This manual describes about MHT2080AH/MHT2060AH/MHT2040AH out of the disk drive, 2.5-inch hard disk drives. These drives have a built-in controller that is compatible with the ATA interface.
This manual describes the specifications and functions of the drives and explains in detail how to incorporate the drives into user systems. This manual assumes that the reader has a basic knowledge of hard disk drives and their implementations in computer systems.
This manual consists of seven chapters and sections explaining the special terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview

Preface

This chapter gives an overview of the disk drive and describes their features.
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the disk drive and the configuration of the systems in which they operate.
CHAPTER 3 Installation Condit i ons
This chapter describes the external dimensions, installation conditions, and switch settings of the disk drive.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the disk drive.
CHAPTER 5 Interface
This chapter describes the interface specifications of the disk drive.
CHAPTER 6 Operations
This chapter describes the operations of the disk drive.
Glossary
The glossary describes the technical terms that need to be understood to read this manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
C141-E195-02EN i
Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property may occur if the user does not perform the procedure correctly.
This indicates information that could help the user use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An disk drive device is sometimes simply referred to as a "hard disk drive," "HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples: X'17B9', 17B9h, 17B9H, or 17B9H.
Binary numbers are represented as shown in the following examples: 010 or 010b.
ii C141-E195-02EN
Preface
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are needed. Please write your opinions or requests on the Comment at the back of this manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the host system, or other causes outside the disk drive.
C141-E195-02EN iii
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Important A lert Items

Important A lert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. Also, damage to the product or other property, may occur if the user does not perform the procedure correctly.
Task Alert message Page
Normal Operation Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk drive is not affected by external magnetic fields. Damage: Do not press the cover of the disk drive. Pressing it too hard, the cover and the spindle motor contact, which may cause damage to the disk drive.
Static: When handling the device, disconnect the body ground (500 kΩ or greater). Do not touch the printed circuit board, but hold it by the edges.
3-7
C141-E195-02EN v
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Manual Organization

MHT2080AH, MHT2060AH,
MHT2040AH
DISK DRIVES
PRODUCT MANUAL
(C141-E195)
<This manual>
MHT2080AH, MHT2060AH,
MHT2040AH
DISK DRIVES
MAINTENANCE MANUAL
(C141-F065)
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
• Maintenance and Diagnosis
• Removal and Replacement Procedure
C141-E195-02EN vii
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Contents

CHAPTER 1 Device Overview........................................................................1-1
1.1 Features...................................................................................................1-2
1.1.1 Functions and performance...................................................................1-2
1.1.2 Adaptability...........................................................................................1-2
1.1.3 Interface.................................................................................................1-3
1.2 Device Specifications..............................................................................1-4
1.2.1 Specifications summary........................................................................1-4
1.2.2 Model and product number...................................................................1-5
1.3 Power Requirements ...............................................................................1-5
1.4 Environmental Specifications .................................................................1-8
1.5 Acoustic Noise........................................................................................1-9
1.6 Shock and Vibration................................................................................1-9
1.7 Reliability..............................................................................................1-10
1.8 Error Rate..............................................................................................1-11
1.9 Media Defects.......................................................................................1-11
1.10 Load/Unload Function ..........................................................................1-11
1.11 Advanced Power Management..............................................................1-12
CHAPTER 2 Device Configuration ................................................................2-1
2.1 Device Configuration..............................................................................2-2
2.2 System Configuration..............................................................................2-3
2.2.1 ATA interface .......................................................................................2-3
2.2.2 1 drive connection.................................................................................2-3
2.2.3 2 drives connection ...............................................................................2-4
C141-E195-02EN ix
Contents
CHAPTER 3 Installation Conditions ............................................................. 3-1
3.1 Dimensions..............................................................................................3-2
3.2 Mounting.................................................................................................3-3
3.3 Cable Connections...................................................................................3-9
3.3.1 Device connector...................................................................................3-9
3.3.2 Cable connector specifications............................................................3-10
3.3.3 Device connection...............................................................................3-10
3.3.4 Power supply connector (CN1)...........................................................3-10
3.4 Jumper Settings .....................................................................................3-11
3.4.1 Location of setting jumpers.................................................................3-11
3.4.2 Factory default setting.........................................................................3-12
3.4.3 Master drive-slave drive setting..........................................................3-12
3.4.4 CSEL setting........................................................................................3-13
3.4.5 Power Up in Standby setting...............................................................3-14
CHAPTER 4 Theory of Device Operation..................................................... 4-1
4.1 Outline.....................................................................................................4-2
4.2 Subassemblies..........................................................................................4-2
4.2.1 Disk........................................................................................................4-2
4.2.2 Spindle...................................................................................................4-2
4.2.3 Actuator.................................................................................................4-2
4.2.4 Air filter.................................................................................................4-3
4.3 Circuit Configuration ..............................................................................4-3
4.4 Power-on Sequence .................................................................................4-6
4.5 Self-calibration........................................................................................4-7
4.5.1 Self-calibration contents........................................................................4-7
4.5.2 Execution timing of self-calibration......................................................4-8
4.5.3 Command processing during self-calibration........................................4-8
4.6 Read/write Circuit...................................................................................4-9
4.6.1 Read/write preamplifier (PreAMP).......................................................4-9
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Contents
4.6.2 Write circuit ..........................................................................................4-9
4.6.3 Read circuit .........................................................................................4-10
4.6.4 Digital PLL circuit..............................................................................4-11
4.7 Servo Control ........................................................................................4-12
4.7.1 Servo control circuit............................................................................4-12
4.7.2 Data-surface servo format...................................................................4-14
4.7.3 Servo frame format..............................................................................4-16
4.7.4 Actuator motor control........................................................................4-17
4.7.5 Spindle motor control..........................................................................4-18
CHAPTER 5 Interface .....................................................................................5-1
5.1 Physical Interface....................................................................................5-2
5.1.1 Interface signals ....................................................................................5-2
5.1.2 Signal assignment on the connector......................................................5-3
5.2 Logical Interface .....................................................................................5-6
5.2.1 I/O registers...........................................................................................5-7
5.2.2 Command block registers......................................................................5-8
5.2.3 Control block registers........................................................................5-13
5.3 Host Commands....................................................................................5-14
5.3.1 Command code and parameters..........................................................5-14
5.3.2 Command descriptions........................................................................5-18
5.3.3 Error posting......................................................................................5-107
5.4 Command Protocol..............................................................................5-109
5.4.1 PIO Data transferring commands from device to host......................5-109
5.4.2 PIO Data transferring commands from host to device......................5-112
5.4.3 Commands without data transfer ......................................................5-114
5.4.4 Other commands ...............................................................................5-115
5.4.5 DMA data transfer commands..........................................................5-115
5.5 Ultra DMA Feature Set.......................................................................5-118
5.5.1 Overview...........................................................................................5-118
5.5.2 Phases of operation ...........................................................................5-119
5.5.3 Ultra DMA data in commands..........................................................5-119
C141-E195-02EN xi
Contents
5.5.3.1 Initiating an Ultra DMA data in burst.............................................5-119
5.5.3.2 The data in transfer..........................................................................5-120
5.5.3.3 Pausing an Ultra DMA data in burst...............................................5-120
5.5.3.4 Terminating an Ultra DMA data in burst........................................5-121
5.5.4 Ultra DMA data out commands ........................................................5-124
5.5.4.1 Initiating an Ultra DMA data out burst...........................................5-124
5.5.4.2 The data out transfer........................................................................5-124
5.5.4.3 Pausing an Ultra DMA data out burst.............................................5-125
5.5.4.4 Terminating an Ultra DMA data out burst......................................5-126
5.5.5 Ultra DMA CRC rules.......................................................................5-128
5.5.6 Series termination required for Ultra DMA......................................5-129
5.6 Timing.................................................................................................5-130
5.6.1 PIO data transfer................................................................................5-130
5.6.2 Multiword data transfer.....................................................................5-131
5.6.3 Ultra DMA data transfer ...................................................................5-132
5.6.3.1 Initiating an Ultra DMA data in burst.............................................5-132
5.6.3.2 Ultra DMA data burst timing requirements ....................................5-133
5.6.3.3 Sustained Ultra DMA data in burst.................................................5-136
5.6.3.4 Host pausing an Ultra DMA data in burst.......................................5-137
5.6.3.5 Device terminating an Ultra DMA data in burst.............................5-138
5.6.3.6 Host terminating an Ultra DMA data in burst.................................5-139
5.6.3.7 Initiating an Ultra DMA data out burst...........................................5-140
5.6.3.8 Sustained Ultra DMA data out burst...............................................5-141
5.6.3.9 Device pausing an Ultra DMA data out burst.................................5-142
5.6.3.10 Host terminating an Ultra DMA data out burst...............................5-143
5.6.3.11 Device terminating an Ultra DMA data out burst...........................5-144
5.6.4 Power-on and reset............................................................................5-145
CHAPTER 6 Operations.................................................................................6-1
6.1 Device Response to the Reset .................................................................6-2
6.1.1 Response to power-on...........................................................................6-2
6.1.2 Response to hardware reset...................................................................6-3
6.1.3 Response to software reset....................................................................6-5
6.1.4 Response to diagnostic command .........................................................6-6
xii C141-E195-02EN
Contents
6.2 Power Save..............................................................................................6-7
6.2.1 Power save mode...................................................................................6-7
6.2.2 Power commands..................................................................................6-9
6.3 Defect Processing....................................................................................6-9
6.3.1 Spare area..............................................................................................6-9
6.3.2 Alternating processing for defective sectors.......................................6-10
6.4 Read-ahead Cache.................................................................................6-12
6.4.1 DATA buffer structure........................................................................6-12
6.4.2 Caching operation ...............................................................................6-13
6.4.3 Using the read segment buffer............................................................6-15
6.4.3.1 Miss-hit .............................................................................................6-15
6.4.3.2 Sequential Hit....................................................................................6-16
6.4.3.3 Full hit...............................................................................................6-17
6.4.3.4 Partial hit...........................................................................................6-18
6.5 Write Cache...........................................................................................6-19
6.5.1 Cache operation...................................................................................6-19
Glossary...........................................................................................................GL-1
Acronyms and Abbreviations.........................................................................AB-1
Index ................................................................................................................. IN-1
C141-E195-02EN xiii
Contents

Illustrations

Figures

Figure 1.1 Negative voltage at +5 V when power is turned off ..........................1-6
Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on ............1-8
Figure 2.1
Figure 2.2 1 drive system configuration..............................................................2-3
Figure 2.3 2 drives configuration.........................................................................2-4
Figure 3.1
Figure 3.2 Orientation..........................................................................................3-3
Figure 3.3 Mounting frame structure...................................................................3-4
Figure 3.4 Location of breather ...........................................................................3-5
Figure 3.5 Surface temperature measurement points ..........................................3-6
Figure 3.6 Service area ........................................................................................3-7
Figure 3.7 Handling cautions...............................................................................3-8
Figure 3.8 Connector locations............................................................................3-9
Figure 3.9 Cable connections ............................................................................3-10
Figure 3.10 Power supply connector pins (CN1) ................................................3-11
Figure 3.11 Jumper location................................................................................3-11
Figure 3.12 Factory default setting......................................................................3-12
Figure 3.13 Jumper setting of master or slave drive............................................3-12
Figure 3.14 CSEL setting.....................................................................................3-13
Figure 3.15 Example (1) of Cable Select.............................................................3-13
Figure 3.16 Example (2) of Cable Select.............................................................3-14
Figure 4.1
Figure 4.2 Circuit Configuration .........................................................................4-5
Figure 4.3 Power-on operation sequence.............................................................4-6
Figure 4.4 Read/write circuit block diagram.......................................................4-9
Figure 4.5 Frequency characteristic of programmable filter.............................4-10
Figure 4.6 Block diagram of servo control circuit.............................................4-12
Figure 4.7 Physical sector servo configuration on disk surface........................4-15
Figure 4.8 Servo frame format...........................................................................4-16
Figure 5.1
Figure 5.2 Execution example of READ MULTIPLE command......................5-21
Figure 5.3 Read Sector(s) command protocol.................................................5-110
Disk drive outerview..........................................................................2-2
Dimensions.........................................................................................3-2
Power Supply Configuration..............................................................4-4
Interface signals..................................................................................5-2
xiv C141-E195-02EN
Contents
Figure 5.4 Protocol for command abort ..........................................................5-111
Figure 5.5 WRITE SECTOR(S) command protocol.......................................5-113
Figure 5.6 Protocol for the command execution without data transfer...........5-114
Figure 5.7 Normal DMA data transfer............................................................5-117
Figure 5.8 Ultra DMA termination with pull-up or pull-down.......................5-129
Figure 5.9 PIO data transfer timing.................................................................5-130
Figure 5.10 Multiword DMA data transfer timing (mode 2) ............................5-131
Figure 5.11 Initiating an Ultra DMA data in burst............................................5-132
Figure 5.12 Sustained Ultra DMA data in burst................................................5-136
Figure 5.13 Host pausing an Ultra DMA data in burst .....................................5-137
Figure 5.14 Device terminating an Ultra DMA data in burst............................5-138
Figure 5.15 Host terminating an Ultra DMA data in burst ...............................5-139
Figure 5.16 Initiating an Ultra DMA data out burst..........................................5-140
Figure 5.17 Sustained Ultra DMA data out burst..............................................5-141
Figure 5.18 Device pausing an Ultra DMA data out burst................................5-142
Figure 5.19 Host terminating an Ultra DMA data out burst .............................5-143
Figure 5.20 Device terminating an Ultra DMA data out burst..........................5-144
Figure 5.21 Power-on Reset Timing..................................................................5-145
Figure 6.1
Response to power-on........................................................................6-3
Figure 6.2 Response to hardware reset................................................................6-4
Figure 6.3 Response to software reset.................................................................6-5
Figure 6.4 Response to diagnostic command......................................................6-6
Figure 6.5 Sector slip processing ......................................................................6-10
Figure 6.6 Automatic alternating processing.....................................................6-11
Figure 6.7 Data buffer structure ........................................................................6-12
C141-E195-02EN xv
Contents

Tables

Table 1.1 Specifications .....................................................................................1-4
Table 1.2 Model names and product numbers.....................................................1-5
Table 1.3 Current and power dissipation ............................................................1-7
Table 1.4 Environmental specifications..............................................................1-8
Table 1.5 Acoustic noise specification................................................................1-9
Table 1.6 Shock and vibration specification.......................................................1-9
Table 3.1
Table 3.2 Cable connector specifications..........................................................3-10
Table 5.1
Table 5.2 I/O registers.........................................................................................5-7
Table 5.3 Command code and parameters ........................................................5-15
Table 5.4 Information to be read by IDENTIFY DEVICE command ..............5-34
Table 5.5 Features register values and settable modes......................................5-44
Table 5.6 Diagnostic code.................................................................................5-56
Table 5.7 Features Register values (subcommands) and functions ..................5-68
Table 5.8 Format of device attribute value data................................................5-72
Table 5.9 Format of insurance failure threshold value data..............................5-72
Table 5.10 Log Directory Data Format..............................................................5-77
Table 5.11 Data format of SMART Summary Error Log..................................5-78
Table 5.11.1 Data format of SMART Comprehensive Error Log.........................5-79
Table 5.12 SMART self-test log data format.....................................................5-80
Table 5.13 Selective self-test log data structure.................................................5-81
Table 5.14 Selective self-test feature flags.........................................................5-82
Table 5.15 Contents of security password..........................................................5-83
Table 5.16 Contents of SECURITY SET PASSWORD data ............................5-87
Table 5.17 Relationship between combination of Identifier
Table 5.18 DEVICE CONFIGURATION IDENTIFY data structure................5-94
Table 5.19 Operation of DOWNLOAD MICRO CODE .................................5-106
Table 5.20 Example of rewriting procedure of data 384 KBytes
Table 5.21 Command code and parameters .....................................................5-107
Table 5.22 Recommended series termination for Ultra DMA.........................5-129
Table 5.23 Ultra DMA data burst timing requirements ..................................5-133
Table 5.24 Ultra DMA sender and recipient timing requirements...................5-135
Surface temperature measurement points and standard values...........3-6
Signal assignment on the interface connector.....................................5-3
and Security level, and operation of the lock function.....................5-88
(30000h Bytes) of microcode........................................................5-106
xvi C141-E195-02EN

CHAPTER 1 Device Overview

1.1 Features
1.2 Device Specifications
1.3 Power Requirements
1.4 Environmental Specifications
1.5 Acoustic Noise
1.6 Shock and Vibration
1.7 Reliability
1.8 Error Rate
1.9 Media Defects
1.10 Load/Unload Function
1.11 Advanced Power Management
Overview and features are described in this chapter, and specifications and power requirement are described.
The disk drive is 2.5-inch hard disk drive with built-in disk controllers. These disk drives use the AT-bus hard disk interface protocol and are compact and reliable.
C141-E195-02EN 1-1
Device Overview

1.1 Features

1.1.1 Functions and performance

The following features of the disk drive is described.
(1) Compact
The disk drive has 1 disk or 2 disks of 65 mm (2.5 inches) diameter, and its height is 9.5 mm (0.374 inch).
(2) Large capacity
The disk drive can record up to 40 GB (formatted) on one disk using the 60/63 RLL recording method and 30 recording zone technology. The disk drive has a formatted capacity of 80 GB (MHT2080AH), 60 GB (MHT2060AH), and 40 GB (MHT2040AH) respectively.
(3) High-speed Transfer rate
The disk drives have an internal data rate up to 55.4 MB/s. The disk drive supports an external data rate up to 100 MB/s (U-DMA mode 5).
(4) Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly increases the positioning speed. The average positioning time is 12 ms (at read).

1.1.2 Adaptability

(1) Power save mode
The power save mode feature for idle operation, stand by and sleep modes makes The disk drives ideal for applications where power consumption is a factor.
(2) Wide temperature range
The disk drives can be used over a wide temperature range (5 °C to 55 °C).
(3) Low noise and vibration
In Ready status, the noise of the disk drives is only 25 dBA (measured at 0.3 m apart from the drive under the idle mode).
(4) High resistance against shock
The Load/Unload mechanism is highly resistant against non-operation shock up to 8820 m/s
1-2 C141-E195-02EN
2
(900G).
1.1 Features

1.1.3 Interface

(1) Connection to ATA interface
The disk drives have built-in controllers compatible with the ATA interface.
(2) 8 MB data buffer
The disk drives use a 8 MB data buffer to transfer data between the host and the disk media.
In combination with the read-ahead cache system described in item (3) and the write cache described in item (7), the buffer contributes to efficient I/O processing.
(3) Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the subsequent data block and writes it to the data buffer (read ahead operation). This cache system enables fast data access. The next disk read command would normally cause another disk access. But, if the read ahead data corresponds to the data requested by the next read command, the data in the buffer can be transferred instead.
(4) Master/slave
The disk drives can be connected to ATA interface as daisy chain configuration. Drive 0 is a master device, drive 1 is a slave device.
(5) Error correction and retry by ECC
If a recoverable error occurs, the disk drives themselves attempt error recovery. The ECC has improved buffer error correction for correctable data errors.
(6) Self-diagnosis
The disk drives have a diagnostic function to check operation of the controller and disk drives. Executing a diagnostic function of the smart command invokes self­diagnosis.
(7) Write cache
When the disk drives receive a write command, the disk drives post the command completion at completion of transferring data to the data buffer completion of writing to the disk media. This feature reduces the access time at writing.
C141-E195-02EN 1-3
Device Overview

1.2 Device Specifications

1.2.1 Specifications summary

Table 1.1 shows the specifications of the disk drives.
Table 1.1 Specifications (1/2)
MHT2080AH MHT2060AH MHT2040AH
Format Capacity (*1) 80 GB 60 GB 40 GB Number of Sectors (User) 156,301,488 117,210,240 78,140,160 Bytes per Sector 512 Rotational Speed 5,400 rpm ± 1% Average Latency 5.56 ms Positioning time (read and seek)
• Minimum (Track-Track)
• Average
• Maximum (Ful l)
Start time 4.0 sec (typ.) Interface ATA-6 (Max. Cable length: 18inches (0.46 m))
Data Transfer Rate
• To/From Media
• To/From Host
Data Buffer Size 4 MB Physical Dimensions
(Height × Width × Depth) Weight 99 g (max)
*1: Capacity under the LBA mode.
1.5 ms (typ.)
Read: 12ms (typ.)
22 ms (typ.)
(equipped with expansion function)
55.4 MB/s Max.
100 MB/s Max (U-DMA mode5)
9.5 mm × 100.0 mm × 70.0 mm
1-4 C141-E195-02EN
1.3 Power Requirements
Table 1.1 lists the formatted capacity, number of logical cylinders, number
of heads, and number of sectors of every model for which the CHS mode has been selected using the BIOS setup utility on the host.
Table 1.1 Specifications (2/2)
Model Capacity (*1) No. of Cylinder No. of Heads No. of Sectors
MHT2080AH 8.45 GB 16,383 16 63 MHT2060AH 8.45 GB 16,383 16 63 MHT2040AH 8.45 GB 16,383 16 63 *1 On using for the units of BIOS parameter.
1.2.2 Model and product number
Table 1.2 lists the model names and product numbers of the disk drive.
Table 1.2 Model names and product numbers
Model Name
MHT2080AH 80 GB M3 depth 3 CA06377-B048 MHT2060AH 60 GB M3 depth 3 CA06377-B046 MHT2040AH 40 GB M3 depth 3 CA06377-B024/(B034)
Capacity
(user area)
Mounting screw Order No.

1.3 Power Requirements

(1) Input Voltage
• + 5 V ± 5 %
(2) Ripple
+5 V Maximum 100 mV (peak to peak) Frequency DC to 1 MHz
C141-E195-02EN 1-5
Device Overview
(3) A negative voltage like the bottom figure isn't to occur at +5 V when power is turned off and, a
thing with no ringing.
Permissible level: −0.2 V
5
4
3
2
Voltage [V]
1
0
-1
0 100 200 300 400 500 600 700 800
Time [ms]
Figure 1.1 Negative voltage at +5 V when power is turned off
1-6 C141-E195-02EN
1.3 Power Requirements
(4) Current Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation (typical).
Table 1.3 Current and power dissipation
Typical RMS Current Typical Power (*3) Spin up (*1) 1.0 A 5.0 W Idle 170 mA 0.85 W R/W (on track) (*2) Read 460 mA / Write 460mA Read 2.3 W / Write 2.3 W Seek (*5) 500 mA 2.5 W Standby 50 mA 0.25 W Sleep 20 mA 0.1 W Energy
Efficiency (*4)
MHT2080AH (CA06377-B048):
—
rank E 0.011W/GB
MHT2060AH (CA06377-B046)
: rank E 0.014 W/GB
MHT2040AH (CA06377-B034)
: rank E 0.021W/GB
MHT2040AH (CA06377-B024)
: rank D 0.021 W/GB
*1 Current at starting spindle motor. *2 Current and power level when the operation (command) that accompanies a
transfer of 63 sectors is executed 3 times in 100 ms *3 Power requirements reflect nominal values for +5 V power. *4 Energy efficiency based on the Law concerning the Rational Use of Energy
indicates the value obtained by dividing power consumption by the storage
capacity. (Japan only) *5 The seek average current is specified based on three operations per 100
msec.
(5) Current fluctuation (Typ.) at +5 V when power is turned on
C141-E195-02EN 1-7
Device Overview
Figure 1.2 Current fluctuation (Typ.) at +5 V when power is turned on
(6) Power on/off sequence
The voltage detector circuits monitor +5 V. The circuits do not allow a write signal if either voltage is abnormal. These prevent data from being destroyed and eliminates the need to be concerned with the power on/off sequence.

1.4 Environmental Specifications

Table 1.4 lists the environmental specifications.
Table 1.4 Environmental specif ications
Item Specification Temperature
• Operating
• Non-operating
• Thermal Gradient
Humidity
• Operating
• Non-operating
• Maximum Wet Bulb
Altitude (relative to sea level)
• Operating
• Non-operating
5 °C to 55 °C (ambient) 5 °C to 60 °C (disk enclosure surface) –40 °C to 65 °C 20 °C/h or less
8 % to 90 % RH (Non-condensing) 5 % to 95 % RH (Non-condensing) 29 °C (Operating)
40 °C (Non-operating)
–300 to 3,000 m –300 to 12,000 m
1-8 C141-E195-02EN
1.5 Acoustic Noise

1.5 Acoustic Noise

Table 1.5 lists the acoustic noise specification.
Table 1.5 Acoustic noise specificati on
Item Specification (typ.)
• Idle mode (DRIVE READY) Sound Power Sound Pressure (at 0.3m)
2.2 B [MHT2040AH]
2.8 B [MHT2080AH/MHT2060AH/MHT2040AH (*1)] 25 dB(A) [MHT2040AH] 34 dB(A) [MHT2080AH/MHT2060AH/MHT2040AH (*1)]
* 1 In case of model “CA06377-B034”.

1.6 Shock and Vibration

Table 1.6 lists the shock and vibration specification.
Table 1.6 Shock and vibration specification
Item Specification Vibration (Swept sine, 1/4 octave per minute)
• Operating
• Non-operating
2
5 to 500 Hz, 9.8m/s
0-peak (1G 0-peak)
(without non-recovered errors)
2
5 to 500 Hz, 49m/s
0-peak (5G 0-peak)
(no damage)
Shock (half-sine pulse)
• Operating
• Non-operating
2
2207 m/s
0-peak (225G 0-peak) 2ms duration (without non-recovered errors)
2
8820 m/s
0-peak (900G 0-peak)
1ms duration
2
1176 m/s
0-peak (120G 0-peak)
11ms duration (no damage)
C141-E195-02EN 1-9
Device Overview

1.7 Reliability

(1) Mean time between failures (MTBF)
Conditions of 300,000 h Power-on time 250H/month or less 3000H/years
or less Operating time 20 % or less of power-on time Environment 5 to 55 °C/8 to 90 %
But humidity bulb temperature
29 °C or less
MTBF is defined as follows: Total operation time in all fields
MTBF= (H) number of device failure in all fields (*1)
*1 “Disk drive defects” refers to defects that involve repair, readjustment, or
replacement. Disk drive defects do not include failures caused by external factors, such as damage caused by handling, inappropriate operating environments, defects in the power supply host system, or interface cable.
(2) Mean time to repair (MTTR)
The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance staff member.
(3) Service life
In situations where management and handling are correct, the disk drive requires no overhaul for five years when the DE surface temperature is less than 48 °C. When the DE surface temperature exceeds 48 °C, the disk drives requires no overhaul for five years or 20,000 hours of operation, whichever occurs first. Refer to item (3) in Subsection 3.2 for the measurement point of the DE surface temperature. Also the operating conditions except the environment temperature are based on the MTBF conditions.
(4) Data assurance in the event of power failure
Except for the data block being written to, the data on the disk media is assured in the event of any power supply abnormalities. This does not include power supply abnormalities during disk media initialization (formatting) or processing of defects (alternative block assignment).
1-10 C141-E195-02EN
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