The MB90350-series with 1 channel FULL-CAN* interface and FLASH ROM is especially designed f or automotive
and industrial applications. Its main feature is the on-board CAN Interface, which conf orm to V2.0 P art A and Part
B, while supporting a very flexible message buffer scheme and so off ering more functions than a normal full CAN
approach. With the new 0.35 µm CMOS technology, Fujitsu now offers on-chip FLASH-ROM program memory
up to 128 Kbytes. An internal voltage booster removes the necessity for a second programming voltage.
DS07-13737-2E
An on board voltage regulator provides 3 V to the internal MCU core. This creates a major advantage in terms
of EMI and power consumption.
The internal PLL clock frequency multiplier provides an internal 42 ns instruction cycle time from an external
4 MHz clock.
The unit features a 4 channel Output Compare Unit and 6 channel Input Capture Unit with 2 separate 16-bit free
running timers. 2 channels UART constitute additional functionality for communication purposes.
* : Controller Area Network (CAN) - License of Robert Bosch GmbH
Note : F
■■■■
2
MC stands for FUJITSU Flexible Microcontroller, a registered trademark of FUJITSU LIMITED.
PACKAGE
64-pin Plastic LQFP
(FPT-64P-M09)
MB90350 Series
FEATURES
■■■■
••••
Clock
• Built-in PLL clock frequency multiplication circuit
• Selection of machine clocks (PLL clocks) is allow ed among frequency division by two on oscillation cloc k, and
multiplication of 1 to 6 times of oscillation clock (for 4 MHz oscillation clock, 4 MHz to 24 MHz).
• Operation by sub-clock (up to 50 kHz : 100 kHz oscillation clock divided by two) is allowed. (devices without
S-suffix only)
• Minimum ex ecution time of instruction : 42 ns (when operating with 4-MHz oscillation clock, and 6-time multiplied PLL clock).
• Built-in clock modulation circuit
••••
16 Mbyte CPU memory space
• 24-bit internal addressing
••••
External Bus Interface
• 4 MByte external memory space
••••
Instruction system best suited to controller
• Wide choice of data types (bit, byte, word, and long word)
• Wide choice of addressing modes (23 types)
• Enhanced multiply-divide instructions and RETI instructions
• Enhanced high-precision computing with 32-bit accumulator
••••
Instruction system compatible with high-level language (C language) and multitask
0.35 µm CMOS with regulator for internal power supply +
Flash memory charge pump for programming voltage
3.5 V - 5.5 V : at normal operating (not using A/D converter)
4.0 V - 5.5 V : at using A/D converter/Flash programming
4.5 V - 5.5 V : at using external bus
Yes
0.35 µm CMOS with
regulator for internal
power supply
5 V ± 10%
Temperature range−40 °C to +105 °C (125 °C up to 16 MHz machine clock)
PackageLQFP-64PGA-299
2 channels3 channels
UART
Wide range of baud rate settings using a dedicated reload timer
Special synchronous options for adapting to different synchronous serial protocols
LIN functionality working either as master or slave LIN device
2
I
C (400 kbit/s) 1 channel1 channel
A/D
Converter
16-bit Reload Timer
(4 channels)
10-bit or 8-bit resolution
Conversion time : Min 3 µs include sample time (per one channel)
Operation clock frequency : fsys/2
Supports External Event Count function
Supports 8-bit and 16-bit operation modes
8-bit reload counters × 12
8-bit reload registers for L pulse width × 12
8-bit reload registers for H pulse width × 12
A pair of 8-bit reload counters can be configured as one 16-bit reload counter or as
8-bit prescaler + 8-bit reload counter
Operation clock freq. : fsys, fsys/2
Conforms to CAN Specification Version 2.0 Part A and B
Automatic re-transmission in case of error
Automatic transmission responding to Remote Frame
Prioritized 16 message buffers for data and ID’s
Supports multiple messages
Flexible configuration of acceptance filtering :
Full bit compare/Full bit mask/Two partial bit masks
Supports up to 1 Mbps
MB90V340A-101/102
External Interrupt
(8 channels)
Can be used rising edge, falling edge, starting up by H/L level input, external interrupt,
extended intelligent I/O services (EI
2
OS) and DMA
D/A converter1 channel
Subclock
(up to100 kHz)
devices with ‘S’-suffix and MB90V340A-102 : without subclock
devices without ‘S’-suffix and MB90V340A-101 : with subclock
Virtually all external pins can be used as general purpose I/O port
All push-pull outputs
I/O Ports
Bit-wise settable as input/output or peripheral signal
Settable as CMOS schmitt trigger/ automotive inputs (default)
TTL input level settable for external bus (30 terminals only for external bus)
P62 to P67
AN2 to AN7Analog input pins for A/D converter.
PPG4, 6, 8,
A, C, E
P50
AN8Analog input pin for A/D converter.
SIN2Serial data input pin for UART2.
P51
AN9Analog input pin for A/D converter.
SOT2Serial data output pin for UART2.
P52
AN10Analog input pin for A/D converter.
SCK2Serial data output pin for UART2.
P53
AN11Analog input pin for A/D converter.
TIN3Event input pin for reload timer3.
P54
AN12Analog input pin for A/D converter.
TOT3Output pin for reload timer3.
P55, P56
AN13, AN14Analog input pins for A/D converter.
P42
IN6Data sample input pin for input capture ICU6.
RX1RX input pin for CAN1.
INT9RExternal interrupt request input pin for INT9.
P43
IN7Data sample input pin for input capture ICU7.
TX1TX output pin for CAN1.
P40, P41F
X0A, X1AB
Circuit
type
Oscillation output pin.
A
EReset input pin.
General purpose I/O ports.
I
Output pins for PPGs.
General purpose I/O port.
O
General purpose I/O port.
I
General purpose I/O port.
I
General purpose I/O port.
I
General purpose I/O port.
I
General purpose I/O ports.
I
General purpose I/O port.
F
General purpose I/O port.
F
General purpose I/O ports
(devices with S-suffix and MB90V340A-101) .
Oscillation input pins for sub clock
(devices without S-suffix and MB90V340A-102) .
Function
(Continued)
7
MB90350 Series
Pin No.
LQFP64*
24 to 31
32
33
34
35
36
37
38
Pin name
P00 to P07
AD00 to AD07
INT8 to INT15External interrupt request input pins for INT8 to INT15.
P10
AD08
TIN1Event input pin for reload timer1.
P11
AD09
TOT1Output pin for reload timer1.
P12
AD10
SIN3Serial data input pin for UART3.
INT11RExternal interrupt request input pin for INT11
P13
AD11
SOT3Serial data output pin for UART3.
P14
AD12
SCK3Clock input/output pin for UART3.
P15
AD13
P16
AD14
Circuit
type
G
G
G
N
G
G
N
G
Function
General purpose I/O ports.The register can be set to select whether to use
a pull-up resistor.This function is enabled in single-chip mode.
Input/output pins of external address data bus lower 8 bit. This function is
enabled when the external bus is enabled.
General purpose I/O port.The register can be set to select whether to use
a pull-up resistor.This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 8.
This function is enabled when external bus is enabled.
General purpose I/O.The register can be set to select whether to use a
pull-up resistor.This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 9. This function is enabled when external bus is enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 10. This function is
enabled when external bus is enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 11.
This function is enabled when external bus is enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 12.
This function is enabled when external bus is enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 13.
This function is enabled when external bus is enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 14.
This function is enabled when external bus is enabled.
(Continued)
8
MB90350 Series
Pin No.
LQFP64*
39
40 to 43
44
51
52
53
54
Pin name
P17
AD15
P20 to P23
A16 to A19
PPG9, PPGB,
PPGD, PPGF
P24
A20
IN0Data sample input pin for input capture ICU0.
P25
A21
IN1Data sample input pin for input capture ICU1.
ADTGTrigger input pin for A/D converter.
P44
SDA0Serial data I/O pin for I
FRCK0Input pin for the 16-bit I/O Timer 0
P45
SCL0Serial clock I/O pin for I
FRCK1Input for the 16-bit I/O Timer 1
P30
ALE
IN4Data sample input pin for input capture ICU4.
Circuit
type
G
G
G
G
H
H
G
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Input/output pin for external bus address data bus bit 15.
This function is enabled when external bus is enabled.
General purpose I/O ports. The register can be set to select whether to use
a pull-up resistor. In external bus mode, the pin is enabled as a generalpurpose I/O port when the corresponding bit in the external address output
control register (HACR) is 1.
Output pins for A16 to A19 of the external address bus.
When the corresponding bit in the external address output control register
(HACR) is 0, the pins are enabled as high address output pins A16 to A19.
Output pins for PPGs.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. In external bus mode, the pin is enabled as a generalpurpose I/O port when the corresponding bit in the external address output
control register (HACR) is 1.
Output pins for A20 of the external address bus. When the corresponding
bit in the external address output control register (HACR) is 0, the pin is
enabled as high address output pins A20.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. In external bus mode, the pin is enabled as a generalpurpose I/O port when the corresponding bit in the external address output
control register (HACR) is 1.
Output pin for A21 of the external address bus. When the corresponding bit
in the external address output control register (HACR) is 0, the pin is enabled as high address output pin A21.
General purpose I/O port
2
C 0
General purpose I/O port.
2
C 0
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Address latch enable output pin. This function is enabled when external bus
is enabled.
Function
(Continued)
9
MB90350 Series
10
Pin No.
LQFP64*
55
56
57
58
59
60
61
Pin name
P31
RD
IN5Data sample input pin for input capture ICU5.
P32
WR
/WRL
INT10RExternal interrupt request input pin for INT10.
P33
WRH
P34
HRQ
OUT4Waveform output pin for output compare OCU4.
P35
HAK
OUT5Waveform output pin for output compare OCU5.
P36
RDY
OUT6Waveform output pin for output compare OCU6.
P37
CLK
OUT7Waveform output pin for output compare OCU7.
Circuit
type
G
G
G
G
G
G
G
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled in single-chip mode.
Read strobe output pin for data bus. This function is enabled when external
bus is enabled.
General purpose I/O port. The register can be set to select whether to use
pull-up resistor. This function is enabled either in single-chip mode or with
the WR
Write strobe output pin for the data bus. This function is enabled when both
the external bus and the WR
write-strobe 8 lower bits of the data bus in 16-bit access. WR
write-strobe 8 bits of the data bus in 8-bit access.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled either in single-chip mode or with
the WRH
Write strobe output pin for the 8 higher bits of the data bus. This function is
enabled when the external bus is enabled, when the external bus 16-bit
mode is selected, and when the WRH
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled either in single-chip mode or with
the hold function disabled.
Hold request input pin. This function is enabled when both the external bus
and the hold function are enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled either in single-chip mode or with
the hold function disabled.
Hold acknowledge output pin. This function is enabled when both the
external bus and the hold function are enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled either in single-chip mode or with
the external ready function disabled.
Ready input pin. This function is enabled when both the external bus and
the external ready function are enabled.
General purpose I/O port. The register can be set to select whether to use
a pull-up resistor. This function is enabled either in single-chip mode or with
the CLK output disabled.
CLK output pin. This function is enabled when both the external bus and
CLK output are enabled.
/WRL pin output disabled.
pin output disabled.
Function
/WRL pin output are enabled. WRL is used to
output pin is enabled.
is used to
(Continued)
(Continued)
Pin No.
Pin name
LQFP64*
P60, P61
62, 63
Circuit
type
I
Function
General purpose I/O ports.
AN0, AN1Analog input pins for A/D converter.
64AV
CCKVCC power input pin for analog circuits.
Reference voltage input for the A/D converter. This power supply must be
2AVRHL
1AV
SSKVSS power input pin for analog circuits.
turned on or off while a voltage higher than or equal to AVRH is applied to
AV
CC.
22, 23MD1, MD0CInput pins for specifying the operating mode.
21MD2DInput pins for specifying the operating mode.
49V
CCPower (3.5 V to 5.5 V) input pin.
18, 48VSSPower (0 V) input pins.
50CK
This is the power supply stabilization capacitor pin. It should be connected
to a higher than or equal to 0.1 µF ceramic capacitor.
• CMOS hysteresis inputs (With the standby-time input shutdown function)
• Automotive input (With the standb y-time
input shutdown function)
pull-up control
pull-up
resistor
Pout
• CMOS level output
(I
OL = 4 mA, IOH=−4 mA)
• CMOS hysteresis inputs (With the standby-time input shutdown function)
• Automotive input (With the standb y-time
input shutdown function)
Nout
G
R
Hysteresis inputs
Automotive inputs
TTL input
Standby control for
input shutdown
• TTL input (With the standby-time input
shutdown function)
• Programmalble pullup resistor: 50 kΩ
approx.
• CMOS level output
(I
Pout
OL = 3 mA, IOH=−3 mA)
• CMOS hysteresis inputs (With the standby-time input shutdown function)
Nout
H
R
• Automotive input (With the standb y-time
input shutdown function)
Hysteresis inputs
Automotive inputs
Standby control for
input shutdown
(Continued)
13
MB90350 Series
TypeCircuitRemarks
• CMOS level output(I
Pout
Nout
R
I
Hysteresis inputs
Automotive inputs
Standby control for
input shutdown
Analog input
• CMOS hysteresis inputs (With the standby-time input shutdown function)
• Automotive input (With the standb y-time
input shutdown function)
• A/D analog input
• Power supply input protection circuit
OL = 4 mA)
K
• A/D converter reference voltage power
ANE
supply input pin, with the protection circuit
L
AVR
ANE
• Flash devices do not have a protection
circuit against V
CC for pin AVRH
(Continued)
14
MB90350 Series
(Continued)
TypeCircuitRemarks
pull-up control
pull-up
registor
Pout
Nout
N
R
CMOS inputs
Automotive inputs
TTL input
Standby control for
input shutdown
• CMOS level output
(I
OL = 4 mA, IOH=−4 mA)
• CMOS inputs (With the standby-time
input shutdown function)
• Automotive input (With the standby-time
input shutdown function)
• TTL input (With the standby-time input
shutdown function)
• Programmable pull-up registor:50 kΩ
approx
• CMOS level output
(I
Pout
OL = 4 mA, IOH=−4 mA)
• CMOS inputs (With the standby-time
input shutdown function)
Nout
R
O
CMOS inputs
Automotive inputs
Standby control for
input shutdown
Analog input
• Automotive input (With the standby-time
input shutdown function)
• A/D analog input
15
MB90350 Series
HANDLING DEVICES
■■■■
Special care is required for the following when handling the device :
• Prev e nting latch-up
• Treatment of unused pins
• Using external clock
• Precautions for when not using a sub clock signal
• Notes on during operation of PLL clock mode
• Power supply pins (V
• Pull-up/down resistors
• Crystal Oscillator Circuit
• Turning-on Sequence of Power Supply to A/D Converter and Analog Inputs
• Connection of Unused Pins of A/D Converter
• Notes on Energization
• Stabilization of power supply voltage
• Initialization
• Port0 to port3 output during Power-on (External-bus mode)
• Notes on using CAN Function
• Flash security Function
CC/VSS)
1.Preventing latch-up
CMOS IC chips may suffer latch-up under the following conditions
• A voltage higher than V
• A voltage higher than the rated voltage is applied between VCC and VSS.
•The AV
Latch-up may increase the power supply current drastically, causing thermal damage to the device.
For the same reason, also be careful not to let the analog power-supply v oltage (AV
power-supply voltage.
CC power supply is applied before the VCC voltage.
CC or lower than VSS is applied to an input or output pin.
:
CC, A VRH) e xceed the digital
2.Handling unused pins
Leaving unused input pins open may result in misbehavior or latch up and possible permanent damage of the
device. Therefore they must be pulled up or pulled down through resistors. In this case those resistors should
be more than 2 kΩ .
Unused bidirectional pins should be set to the output state and can be left open, or the input state with the above
described connection.
3.Using external clock
To use external clock, drive the X0 pin and leave X1 pin open.
MB90350 Series
X0
Open
X1
4.Precautions for when not using a sub clock signal
If you do not connect pins X0A and X1A to an oscillator, use pull-down handling on the X0A pin, and leave the
X1A pin open.
16
MB90350 Series
5.Notes on during operation of PLL clock mode
If the PLL clock mode is selected, the microcontroller attempt to be working with the self-oscillating circuit ev en
when there is no external oscillator or external clock input is stopped. Performance of this operation, however,
cannot be guaranteed.
6.Power supply pins (VCC/VSS)
• If there are multiple VCC and VSS pins, from the point of view of de vice design, pins to be of the same potential
are connected inside of the device to prevent such malfunctioning as latch up.
To reduce unnecessary radiation, prevent malfunctioning of the strobe signal due to the rise of ground level,
and observe the standard for total output current, be sure to connect the V
and ground externally.
• Connect VCC and VSS to the device from the current supply source at a low impedance.
• As a measure against power supply noise, connect a capacitor of about 0.1 µF as a bypass capacitor between
V
CC and VSS in the vicinity of VCC and VSS pins of the device
CC and VSS pins to the power supply
Vcc
Vss
Vss
Vcc
Vss
Vcc
MB90350
Series
Vss
Vcc
Vss
Vcc
7.Pull-up/down resistors
The MB90350 Series does not support internal pull-up/down resistors (P ort 0 to Port 3: built-in pull-up resistors).
Use external components where needed.
8.Crystal Oscillator Circuit
Noises around X0 or X1 pins may be possible causes of abnormal operations. Make sure to provide bypass
capacitors via shortest distance from X0, X1 pins, crystal oscillator (or ceramic resonator) and ground lines, and
make sure, to the utmost effort, that lines of oscillation circuit do not cross the lines of other circuits.
It is highly recommended to provide a printed circuit board art work surrounding X0 and X1 pins with a ground
area for stabilizing the operation.
9.Turning-on Sequence of Power Supply to A/D Converter and Analog Inputs
Make sure to turn on the A/D converter power supply (AVCC, AVRH) and analog inputs (AN0 to AN14) after
turning-on the digital power supply (V
CC) .
Turn-off the digital power after turning off the A/D converter supply and analog inputs. In this case, make sure
that the voltage does not exceed AVRH or AV
CC (turning on/off the analog and digital power supplies simulta-
neously is acceptable).
10. Connection of Unused Pins of A/D Converter if A/D Converter is used
Connect unused pins of A/D converter to AVCC= VCC, AVSS= AVRH = VSS.
17
MB90350 Series
11. Notes on Energization
To prevent the internal regulator circuit from malfunctioning, set the voltage rise time during energization at 50
or more µs (0.2 V to 2.7 V)
12. Stabilization of power supply voltage
A sudden change in the supply voltage may cause the de vice to malfunction e ven within the specified VCC supply
voltage operating range. Therefore, the V
CC supply voltage should be stabilized.
For reference, the supply voltage should be controlled so that V
commercial frequencies (50 Hz to 60 Hz) fall below 10% of the standard V
CC ripple variations (peak-to-peak value) at
CC supply voltage and the coefficient
of fluctuation does not exceed 0.1 V/ms at instantaneous power switching.
13. Initialization
In the device, there are internal registers which are initialized only by a pow er-on reset. T o initialize these registers,
turn on the power again.
14. Port 0 to port 3 output during Power-on (External-bus mode)
As shown below, when power is turned on in External-Bus mode, there is a possibility that output signal of
Port 0 to Port 3 might be unstable.
1/2 VCC
VCC
Port0 to Port3
Port0 to Port3 outputs
might be unstable
Port0 to Port3 outputs = Hi-Z
15. Notes on using CAN Function
To use CAN function, please set ’1’ to DIRECT bit of CAN Direct Mode Register (CDMR).
If DIRECT bit is set to ’0’ (initial value), wait states will be performed when accessing CAN registers.
Please refer to Hardware Manual of MB90350 series for detail of CAN Direct Mode Register.
16. Flash security Function
The security byte is located in the area of the flash memory.
If protection code 01
Therefore please do not write 01
Please refer to following table for the address of the security bit.
MB90F352Embedded 1 Mbit Flash MemoryFE0001
18
H is written in the security bit, the flash memory is in the protected state by security.
H in this address if you do not use the security function.
Flash memory sizeAddress for security bit
H
BLOCK DIAGRAMS
■■■■
• MB90V340A-101/102
X0,X1
X0A,X1A
RST
*
Clock
Controller
MB90350 Series
16LX
CPU
SOT4 to SOT2
SCK4 to SCK2
SIN4 to SIN2
AVCC
AVSS
AN14 to AN0
AVRH
ADTG
DA00
PPGF to PPG8,
PPG6, PPG4,
PPG2, PPG0
SDA0
SCL0
RAM 30 K
Prescaler
3 ch
UART
3 ch
10-bit ADC
15 ch
10-bit
DAC
1 ch
8/16-bit
PPG
12/8 ch
2
C
I
Interface
1 ch
FMC-16 Bus
IO Timer 0
Input
Capture
6 ch
Output
Compare
4 ch
IO Timer 1
CAN
Controller
2 ch
16-bit Reload
Timer 4 ch
External
Bus
Interface
External
Interrupt
FRCK0
IN7 to IN4,
IN1 to IN0
OUT7 to OUT4
FRCK1
RX2 to RX1
TX2 to TX1
TIN3, TIN1
TOT3, TOT1
AD15 to AD00
A21 to A16
ALE
RD
WRL
WRH
HRQ
HAK
RDY
CLK
INT15 to INT8
(INT11R to INT9R)
* : MB90V340A-102
DMAC
19
MB90350 Series
• MB90F352/S, MB90352/S
X0,X1
X0A,X1A*
RST
Clock
Controller
16LX
CPU
SOT3, SOT2
SCK3, SCK2
SIN3, SIN2
AVCC
AVSS
AN14 to AN0
AVRH
ADTG
PPGF to PPG8
PPG6, PPG4
SDA0
SCL0
RAM
4 K
ROM/Flash
128 K
Prescaler
2 ch
UART
2 ch
10-bit ADC
15 ch
8/16-bit
PPG
10/6 ch
2
C
I
Interface
1 ch
FMC-16 Bus
IO Timer 0
Input
Capture
6 ch
Output
Compare
4 ch
IO Timer 1
CAN
Controller
1 ch
16-bit Reload
Timer 4 ch
External
Bus
Interface
External
Interrupt
FRCK0
IN7 to IN4,
IN1, IN0
OUT7 to OUT4
FRCK1
RX1
TX1
TIN3, TIN1
TOT3, TOT1
AD15 to AD00
A21 to A16
ALE
RD
WRL
WRH
HRQ
HAK
RDY
CLK
INT15 to INT8
(INT11R to INT9R)
* : Only for devices without ‘S’ Suffix
20
DMAC
MEMORY MAP
■■■■
MB90350 Series
MB90V340A-101/102
FFFFFF
H
FF0000
FEFFFF
FE0000
FDFFFF
00FFFF
008000
007FFF
007900
0078FF
ROM (FF bank)
H
H
ROM (FE bank)
H
H
H
(image of FF bank)
H
H
H
H
MB90F352/S
MB90352/S
FFFFFF
H
FF0000
FEFFFF
FE0000
FDFFFF
ROM (FF bank)
H
H
ROM (FE bank)
H
H
External access
area
C00100
H
C000FF
H
00FFFF
008000
007FFF
007900
H
H
H
H
ROM
(image of FF bank)
ROM
PeripheralPeripheral
RAM 30 K
001100
H
0010FF
H
RAM 4 K
000100
0000EF
000000
H
External access area
H
H
000100
0000EF
000000
H
H
PeripheralPeripheral
H
: No access
Note : The high-order portion of bank 00 gives the image of the FF bank ROM to make the small model of the C
compiler effective. Since the low-order 16 bits are the same, the table in ROM can be referenced without
using the far specification in the pointer declaration.
For example, an attempt to access 00C000
H accesses the value at FFC000H in ROM.
The ROM area in bank FF exceeds 32 Kbytes, and its entire image cannot be shown in bank 00.
The image between FF8000
FF7FFF
H is visible only in bank FF.
H and FFFFFFH is visible in bank 00, while the image between FF0000H and
61
62HTimer Control Status Register 1TMCSR1R/W
63
64
65HTimer Control Status Register 2TMCSR2R/WXXXX0000
66
67
68HA/D Control Status Register 0ADCS0R/W
69
6A
Output Compare Control Status
H
Register 7
HTimer Control Status Register 0TMCSR0R/W
HTimer Control Status Register 0TMCSR0R/WXXXX0000
HTimer Control Status Register 1TMCSR1R/WXXXX0000
HTimer Control Status Register 2TMCSR2R/W
OCS7R/W0XX00000
16-bit Reload Timer
00000000
0
16-bit Reload Timer
00000000
1
16-bit Reload Timer
00000000
2
HTimer Control Status Register 3TMCSR3R/W
HTimer Control Status Register 3TMCSR3R/WXXXX0000
16-bit Reload Timer
3
00000000
000XXXX0
HA/D Control Status Register 1ADCS1R/W0000000X
HData Register 0ADCR0R00000000
A/D Converter
6BHData Register 1ADCR1RXXXXXX00
6C
HA/D Setting Register 0ADSR0R/W00000000
6D
HA/D Setting Register 1ADSR1R/W00000000
6E
HReserved
6FHROM Mirroring RegisterROMMWROM MirrorXXXXXXX1
70
H to 7FHReserved
80
H to 8FH Reserved for CAN Interface 1. Refer to “■ CAN CONTROLLERS”
HExternal Address Output Control RegisterHACRW00000000
HBus Control Signal Selection RegisterECSRW0000000X
HWatchdog Timer Control RegisterWDTCR,WWatchdog TimerXXXXX111
Abbrevia-
tion
ARSRW
AccessResource nameInitial value
0011XX00
External Memory
Access
A9HTimebase Timer Control RegisterTBTCW,R/WTime base timer1XX00100
AA
HWatch Timer Control RegisterWTCR,R/WWatch timer1X001000
AB
HReserved
ACHDMA Enable Register LDERLR/W
00000000
DMA
AD
HDMA Enable Register HDERHR/W00000000
Flash Control Status Register
AE
(Flash Devices only. Otherwise
H
FMCSR,R/WFlash Memory000X0000
reserved)
AF
HReserved
B0
HInterrupt Control Register 00ICR00W,R/W
B1
HInterrupt Control Register 01ICR01W,R/W00000111
00000111
B2HInterrupt Control Register 02ICR02W,R/W00000111
B3
HInterrupt Control Register 03ICR03W,R/W00000111
B4
HInterrupt Control Register 04ICR04W,R/W00000111
B5
HInterrupt Control Register 05ICR05W,R/W00000111
B6HInterrupt Control Register 06ICR06W,R/W00000111
B7
HInterrupt Control Register 07ICR07W,R/W00000111
Interrupt Control
B8
HInterrupt Control Register 08ICR08W,R/W00000111
B9HInterrupt Control Register 09ICR09W,R/W00000111
BA
HInterrupt Control Register 10ICR10W,R/W00000111
BB
HInterrupt Control Register 11ICR11W,R/W00000111
BCHInterrupt Control Register 12ICR12W,R/W00000111
BD
HInterrupt Control Register 13ICR13W,R/W00000111
BE
HInterrupt Control Register 14ICR14W,R/W00000111
BFHInterrupt Control Register 15ICR15W,R/W00000111
Notes : • The peripheral resources sharing the ICR register have the same interrupt level.
• When two peripheral resources share the ICR register, only one can use Extended Intelligent I/O Service
at a time.
• When either of the two peripheral resources sharing the ICR register specifies Extended Intelligent I/O
Service, the other one cannot use interrupts.
Maximum Clamp CurrentICLAMP−4.0+4.0mA *4
Total Maximum Clamp CurrentΣ|ICLAMP|40mA *4
“L” level maximum output currentI
OL15mA *3
“L” level average output currentIOLAV4mA*3
“L” level maximum overall output currentΣIOL100mA *3
“L” level average overall output currentΣI
OLAV50mA *3
“H” level maximum output currentIOH−15mA *3
“H” level average output currentIOHAV−4mA*3
“H” level maximum overall output currentΣI
OH−100mA *3
“H” level average overall output currentΣIOHAV−50mA *3
Power consumptionP
Operating temperatureT
Storage temperatureT
D
A
STG−55+150 °C
Rating
UnitRemarks
MinMax
+105 °C < T
240mW
Normal operation : maximum
frequency 16 MHz
−40 °C < T
320mW
Normal operation : maximum
frequency 24 MHz
−40+105°C
−40+125°C*5
(VSS= AVSS= 0 V)
1
1
A≤+125 °C,
A≤+105 °C,
(Continued)
40
MB90350 Series
(Continued)
*1:Set AVCC and VCC to the same voltage. Make sure that AVCC does not exceed VCC and that the voltage at the
analog inputs does not exceed AV
*2:V
I and VO should not exceed VCC+ 0.3 V. VI should not exceed the specified ratings. However if the maximun
current to/from an input is limited by some means with external components, the I
rating.
*3:Applicable to pins: P00 to P07, P10 to P17, P20 to P25, P30 to P37, P40 to P45, P50 to P56, P60 to P67
*4: • Applicable to pins: P00 to P07, P10 to P17, P20 to P25, P30 to P37, P40 to P45,
P50 to P56 (for evaluation : P50 to P55) , P60 to P67
• Use within recommended operating conditions.
• Use at DC voltage (current)
• The +B signal should always be applied a limiting resistance placed between the +B signal and the
microcontroller.
• The value of the limiting resistance should be set so that when the +B signal is applied the input current to
the microcontroller pin does not exceed rated values, either instantaneously or for prolonged periods.
• Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input
potential may pass through the protective diode and increase the potential at the V
other devices.
• Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0 V) , the power
supply is provided from the pins, so that incomplete operation may result.
• Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting
supply voltage may not be sufficient to operate the power-on reset.
• Care must be taken not to leave the +B input pin open.
• Sample recommended circuits:
CC when the power is switched on.
CLAMP rating supercedes the VI
CC pin, and this may affect
• Input/output equivalent circuits
Protective diode
VCC
B input (0 V to 16 V)
+
*5 : If used exceeding T
Limiting
resistance
R
A=+105 °C, be sure to contact Fujitsu for reliability limitations.
P-ch
N-ch
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
41
MB90350 Series
2.Recommended Conditions
ParameterSymbol
CC,
Power supply voltage
Smooth capacitorC
Operating temperatureT
V
AV
CC
S0.11.0µF
A
(VSS= AVSS= 0 V)
Value
MinTypMax
UnitRemarks
4.05.05.5VUnder normal operation
3.55.05.5V
Under normal operation, when not using the
A/D converter and not Flash programming.
4.55.05.5VWhen External bus is used.
3.05.5VMaintains RAM data in stop mode
Use a ceramic capacitor or capacitor of bet-
ter AC characteristics. Capacitor at the VCC
should be greater than this capacitor.
−40+105 °C
−40+125 °C*
* : If used exceeding T
A=+105 °C, be sure to contact Fujitsu for reliability limitations.
C
C
S
C Pin Connection Diagram
Operation guaranteed range
24
(MHz)
16
CP
Internal clock f
− 40105125
Operation temperature T
A
(°C)
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
42
3.DC Characteristics
Parameter
Input H
voltage
(At V
CC=
5 V ± 10%)
Input L
voltage
CC=
(At V
5 V ± 10%)
Output H
voltage
Output H
voltage
Output L
voltage
Output L
voltage
Sym-
bol
IHS0.8 VCCVCC + 0.3V
V
IHA0.8 VCCVCC + 0.3V
V
V
IHT2.0VCC + 0.3V
IHS0.7 VCCVCC + 0.3V
V
IHI0.7 VCCVCC + 0.3V
V
V
IHR0.8 VCCVCC+ 0.3V
V
IHMVCC− 0.3VCC + 0.3VMD input pin
ILSVSS− 0.30.2 VCCV
V
ILAVSS− 0.30.5 VCCV
V
V
ILTVSS− 0.30.8V
ILSVSS− 0.30.3 VCCV
V
ILIVSS− 0.30.3 VCCV
V
V
ILRVSS− 0.30.2 VCCV
V
ILMVSS− 0.3VSS+ 0.3VMD input pin
Normal
OH
V
outputs
I2C current
OHI
V
outputs
Normal
OL
V
outputs
I2C current
OLI
V
outputs
(TA=−40 °C to +105 °C, VCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(TA=−40 °C to +125 °C, VCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
PinCondition
VCC= 4.5 V,
I
OH=−4.0 mA
VCC= 4.5 V,
I
OH=−3.0 mA
VCC= 4.5 V,
IOL= 4.0 mA
VCC= 4.5 V,
IOL= 3.0 mA
MB90350 Series
Value
MinTypMax
CC− 0.5V
V
CC− 0.5V
V
0.4V
0.4V
UnitRemarks
Port inputs if CMOS
hysteresis input levels
are selected (except
P12, P15, P44, P45,
P50)
Port inputs if
AUTOMOTIVE input
levels are selected
Port inputs if TTL input
levels are selected
P12, P15, P50 inputs if
CMOS input levels are
selected
P44, P45 inputs if
CMOS hysteresis input
levels are selected
RST
input pin (CMOS
hysteresis)
Port inputs if CMOS
hysteresis input levels
are selected (except
P12, P15, P44, P45,
P50)
Port inputs if
AUTOMOTIVE input
levels are selected
Port inputs if TTL
input levels are selected
P12, P15, P50 inputs if
CMOS input levels are
selected
P44, P45 inputs if
CMOS hysteresis input
levels are selected
RST
input pin (CMOS
hysteresis)
(Continued)
43
MB90350 Series
(Continued)
Parameter
Input leak currentI
Pull-up
resistance
Pull-down
resistance
Power supply
current*
Input capacityC
Sym-
bol
ILVCC = 5.5 V, VSS< VI< VCC−11µA
P00 to P07,
P10 to P17,
R
UP
P20 to P25,
P30 to P37,
RST
R
DOWNMD22550100kΩ
I
CC
I
CCS
I
CTS
CTSPLL6
I
CCL
I
CCLS
I
CCT
I
CCH
I
Other than C, AVCC, AVSS,
IN
AVRH, VCC, VSS,
(TA=−40 °C to +105 °C, VCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(T
A=−40 °C to +125 °C, VCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
PinCondition
Value
MinTypMax
Unit Remarks
2550100kΩ
Except
Flash
devices
VCC= 5.0 V,
Internal frequency : 24 MHz,
5065mA MB90F352
At normal operation.
V
CC= 5.0 V,
Internal frequency : 24 MHz,
6580mA MB90F352
At writing FLASH memory.
V
CC= 5.0 V,
Internal frequency : 24 MHz,
7085mA MB90F352
At erasing FLASH memory.
VCC= 5.0 V,
Internal frequency : 24 MHz,
2535mA MB90F352
At Sleep mode.
VCC= 5.0 V,
Internal frequency : 2 MHz,
0.30.8mA MB90F352
At Main Timer mode
VCC= 5.0 V,
VCC
Internal frequency : 24 MHz,
At PLL Timer mode,
47mA MB90F352
external frequency = 4 MHz
VCC = 5.0 V,
Internal frequency: 8 kHz,
At sub operation
T
A = +25°C
170360µA MB90F352
VCC = 5.0 V,
Internal frequency: 8 kHz,
At sub sleep
T
A = +25°C
2050µA MB90F352
VCC = 5.0 V,
Internal frequency: 8 kHz,
At watch mode
T
A = +25°C
1035µA MB90F352
VCC= 5.0 V,
At Stop mode,
T
A=+25°C
725µA MB90F352
515pF
* : The power supply current is measured with an extern al clock.
44
4.AC Characteristics
(1) Clock Timing
ParameterSymbolPin
Clock frequency
Clock cycle time
t
P
Input clock pulse width
Input clock rise and fall
time
Internal operating
clock frequency
(machine clock)
Internal operating
clock cycle time
(machine clock)
WH, PWLX010ns
WHL, PWLLX0A515.2µs
P
t
CR, tCFX0 5nsWhen using external clock
MB90350 Series
(T
A=−40 °C to +105 °C, VCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(T
A=−40 °C to +125 °C, VCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
Value
MinTypMax
f
C
CLX0A, X1A—32.768100kHz
f
t
CYL
CYLLX0A, X1A1030.5—µs
X0, X1316MHz When using an oscillation circuit
X0324MHz When using an external clock*
X0, X162.5333nsWhen using an oscillation circuit
X041.67333nsWhen using an external clock
24
f
CP1.5
16
f
CPL8.19250kHzWhen using sub clock
41.67
t
CP
666ns
62.5
CPL20122.1µsWhen using sub clock
t
UnitRemarks
Duty ratio is about 30% to 70%.
When using main clock at
T
MHz
A≤+105 °C
When using main clock at
A≤+125 °C
T
When using main clock at
T
A≤+105 °C
When using main clock at
A≤+125 °C
T
* : When selecting the PLL clock, the range of clock frequency is limited. Use this product within range as
mentioned in “Relation among external clock frequency and machine clock frequency”.
tCYL
X0
PWHPWL
tCFtCR
tCYLL
X0A
PWHLPWLL
tCFtCR
0.8 VCC
0.2 VCC
0.8 VCC
0.2 VCC
Clock Timing
45
MB90350 Series
Guaranteed operation range
5.5
4.0
3.5
Guaranteed PLL operation range
(V)
CC
Power supply voltage
V
1.5
4
Machine clock f
(MHz)
CP
Guaranteed A/D Converter
operation range
24
Guaranteed operation range of MB90350 series
Guaranteed oscillation frequency range
24
x 6
x 4
x 3
x 2x 1
4.0
1.5
12
16
8
3
4
8
External clock f
12
(MHz) *
C
16
Internal clock
f
(MHz)
CP
* : When using the oscillation circuit, the maximum oscillation clock frequency is 16 MHz
External clock frequency and Machine clock frequency
46
x 1/2
(PLL off)
24
(2) Reset Standby Input
ParameterSymbolPin
Reset input
time
RSTLRST
t
MB90350 Series
(T
A=−40 °C to +105 °C, VCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(T
A=−40 °C to +125 °C, VCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
Value
MinMax
500nsUnder normal operation
Oscillation time of oscillator*
+ 100 µs
UnitRemarks
In Stop mode, Sub Clock
µs
mode, Sub Sleep mode
and Watch mode
100µs
In Main timer mode and
PLL timer mode
* : Oscillation time of oscillator is the time that the amplitude reaches 90%.
In the crystal oscillator, the oscillation time is between several ms to tens of ms. In FAR / ceramic oscillators,
the oscillation time is between hundreds of µs to sev eral ms . With an e xternal clock, the oscillation time is 0 ms.
Under normal operation:
t
RSTL
RST
0.2 V
CC
In Stop mode, Sub Clock mode, Sub Sleep mode, Watch mode:
tRSTL
RST
0.2 VCC0.2 VCC
90% of
amplitude
X0
0.2 V
CC
Internal operation
clock
Internal reset
Oscillation time
of oscillator
100 µs
Oscillation stabilization
waiting time
Instruction execution
47
MB90350 Series
(3) Power On Reset
(T
A=−40 °C to +105 °C, VCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(T
A=−40 °C to +125 °C, VCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
ParameterSymbolPinCondition
Value
UnitRemarks
MinMax
Power on rise timet
Power off timet
VCC
VCC
3 V
VSS
RVCC
0.0530ms
OFFVCC1msDue to repetitive operation
tR
2.7 V
0.2 V0.2 V0.2 V
tOFF
If you change the power supply voltage too rapidly, a power on reset may occur.
We recommend that you startup smoothly by restraining voltages when changing
the power supply voltage during operation, as shown in the figure below. Perform
while not using the PLL clock. However, if voltage drops are within 1 V/s, you can
operate while using the PLL clock.
We recommend a rise of
Holds RAM data
50 mV/ms maximum.
(4) Clock Output Timing
ParameterSymbolPinCondition
Cycle timet
CLK ↑ → CLK ↓t
CLK
48
(T
A=−40 °C to +105 °C, VCC= 5.0 V ± 10%, VSS= 0.0 V, fCP≤ 24 MHz)
CYCCLK
CHCLCLK
tCHCL
2.4 V
Value
UnitRemarks
MinMax
62.5nsf
41.76nsfCP = 24 MHz
20nsf
13nsf
CYC
t
2.4 V
0.8 V
CP= 16 MHz
CP= 16 MHz
CP= 24 MHz
(5) Bus Timing (Read)
Parameter
Sym-
bol
MB90350 Series
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, VSS = 0.0 V, fCP≤ 24 MHz)
PinCondition
Value
Unit Remarks
MinMax
ALE pulse widtht
LHLLALE
tCP/2 − 10ns
ALE, A21 to
Valid address ⇒ ALE ↓ timet
AVLL
A16, AD15
t
CP/2 − 20ns
to AD00
ALE ↓⇒ Address valid timet
LLAX
ALE, AD15
to AD00
tCP/2 − 15ns
A21 toA16,
Valid address ⇒ RD
↓ timetAVRL
AD15 to
tCP− 15ns
AD00, RD
Valid address ⇒ Valid data
input
RD
pulse widthtRLRHRD3 tCP/2 − 20ns
t
AVDV
RD ↓⇒ Valid data inputtRLDV
RD
↑⇒ Data hold timetRHDX
RD
↓⇒ ALE ↑ timetRHLHRD, ALEtCP/2 − 15ns
RD
↑⇒ Address valid timetRHAX
A21 to A16,
AD15 to
AD00
RD, AD15 to
AD00
RD, AD15 to
AD00
RD, A21 to
A16
5 t
CP/2 − 60ns
3 tCP/2 − 50ns
0ns
tCP/2 − 10ns
A21 to A16,
Valid address ⇒ CLK ↑ timet
AVCH
AD15 to
t
CP/2 − 16ns
AD00, CLK
RD
↓⇒ CLK ↑ timetRLCHRD, CLKtCP/2 − 15ns
ALE ↓⇒ RD
↓ timetLLRLALE, RDtCP/2 − 15ns
49
MB90350 Series
t
AVCH
t
RLCH
CLK
ALE
RD
A21 to A16
AD15 to AD00
2.4 V
2.4 V
0.8 V
2.4 V
0.8 V
2.4 V
t
AVLL
t
LHLL
Address
t
AVRL
t
LLAX
2.4 V
0.8 V
t
t
AVDV
LLRL
0.8 V
2.4 V
0.8 V
2.4 V
t
RLDV
t
RLRH
VIH
VIL
2.4 V
Read data
t
RHDX
t
RHLH
2.4 V
t
RHAX
2.4 V
0.8 V
VIH
VIL
50
MB90350 Series
(6) Bus Timing (Write)
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, VSS = 0.0 V, fCP≤ 24 MHz)
ParameterSymbolPinCondition
A21 to A16,
Valid address ⇒ WR
↓ timetAVWL
AD15 to AD00,
WR
WR
pulse widthtWLWHWR3 tCP/2 − 20ns
Value
MinMax
CP−15ns
t
UnitRemarks
Valid data output ⇒ WR
time
WR ↑⇒ Data hold timetWHDX
WR
↑⇒ Address valid timetWHAX
WR
↑⇒ ALE ↑ timetWHLHWR, ALEtCP/2 − 15ns
↑
tDVWH
AD15 to AD00,
WR
AD15 to AD00,
WR
A21 to A16,
WR
3 tCP/2 − 20ns
15ns
tCP/2 − 10ns
WR ↓⇒ CLK ↑ timetWLCHWR, CLKtCP/2 − 15ns
t
WLCH
CLK
ALE
WR (WRL, WRH)
t
AVWL
2.4 V
0.8 V
t
WLWH
2.4 V
t
WHLH
2.4 V
A21 to A16
AD15 to AD00
2.4 V
0.8 V
2.4 V
0.8 V
Address
2.4 V
0.8 V
t
DVWH
Write data
t
WHAX
2.4 V
0.8 V
t
WHDX
2.4 V
0.8 V
51
MB90350 Series
(7) Ready Input Timing
Parameter
Sym-
bol
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, VSS = 0.0 V, fCP≤ 24 MHz)
Pin
Test
Condition
Rated Value
UnitsRemarks
MinM ax
RDY setup timet
RYHSRDY
RDY hold timet
RYHHRDY0ns
Note : If the RDY setup time is insufficient, use the auto-ready function.
CLK
ALE
RD/WR
t
RYHS
IH
RDY
When WAIT is not used.
V
45nsf
32nsf
2.4 V
t
RYHH
IH
V
CP= 16 MHz
CP= 24 MHz
52
RDY
When WAIT is used.
IL
V
(8) Hold Timing
ParameterSymbolPinCondition
MB90350 Series
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, VSS = 0.0 V, fCP≤ 24 MHz)
Value
MinMax
UnitsRemarks
Pin floating ⇒ HAK
time
↓
tXHALHAK
30t
HAK
↑ time ⇒ Pin valid
time
tHAHVHAKtCP2 tCPns
Note : There is more than 1 cycle from when HRQ reads in until the HAK
HAK
Each pin
2.4V2.4V
0.8V
t
XHAL
0.8V
High-Z
CPns
is changed.
2.4V
t
HAHV
0.8V
53
MB90350 Series
(9) UART 2/3
ParameterSymbolPinCondition
Serial clock cycle timet
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, fCP≤ 24 MHz, VSS = 0.0 V)
(T
A = –40°C to +125°C, VCC = 5.0 V±10 %, fCP≤ 16 MHz, VSS = 0.0 V)
SCYCSCK2, SCK3
Value
MinMax
8 t
CP*ns
Unit Remarks
SCK ↓→ SOT delay timet
Valid SIN → SCK ↑t
SCK ↑ → Valid SIN hold timet
Serial clock “H” pulse widtht
Serial clock “L” pulse widtht
SLOV
IVSH
SHIX
SHSLSCK2, SCK3
SLSHSCK2, SCK34 tCP*ns
SCK ↓→ SOT delay timetSLOV
Valid SIN → SCK ↑t
SCK ↑→ Valid SIN hold timet
IVSH
SHIX
* : Refer to “ (1) Clock timing” rating for t
SCK2, SCK3,
SOT2, SOT3
SCK2, SCK3,
SIN0 to SIN4
SCK2, SCK3,
SIN2, SIN3
SCK2, SCK3,
SOT2, SOT3
SCK2, SCK3,
SIN2, SIN3
SCK2, SCK3,
SIN2, SIN3
CP (internal operating clock cycle time).
Notes : • AC characteristic in CLK synchronized mode.
• C
L is load capacity value of pins when testing.
• t
CP is the machine cycle (Unit : ns)
Internal clock
operation output
pins are
L= 80 pF + 1 TTL
C
External clock
operation output
pins are
C
L= 80 pF + 1 TTL
−80+80ns
100ns
60ns
CP*ns
4 t
150ns
60ns
60ns
54
SCK
SOT
SIN
t
SCYC
2.4 V
0.8 V
t
SLOV
2.4 V
0.8 V
t
IVSH
IH
V
IL
V
Internal Shift Clock Mode
t
SHIX
0.8 V
IH
V
IL
V
SCK
MB90350 Series
t
SLSH
IL
IL
V
t
SLOV
V
t
SHSL
IH
IH
V
V
SOT
SIN
(10) Trigger Input Timing
ParameterSymbolPinCondition
Input pulse width
TRGH
t
tTRGL
External Shift Clock Mode
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, fCP≤ 24 MHz, VSS = 0.0 V)
(T
A = –40°C to +125°C, VCC = 5.0 V±10 %, fCP≤ 16 MHz, VSS = 0.0 V)
INT8 to INT15,
INT9R to INT11R,
ADTG
2.4 V
0.8 V
V
V
t
IVSH
IH
IL
5 t
t
SHIX
IH
V
IL
V
Value
MinMax
CPns
UnitRemarks
INT8 to INT15,
INT9R to INT11R,
ADTG
IH
IH
V
t
TRGH
V
IL
IL
V
t
TRGL
V
55
MB90350 Series
(11) Timer Related Resource Input Timing
ParameterSymbolPinCondition
t
TIWHTIN1, TIN3,
Input pulse width
TIN1, TIN3,
IN0, IN1,
IN4 to IN7
TIWL
t
IN0, IN1,
IN4 to IN7
IH
V
(T
A = –40°C to +105°C, VCC = 5.0 V±10 %, fCP≤ 24 MHz, VSS = 0.0 V)
(T
A = –40°C to +125°C, VCC = 5.0 V±10 %, fCP≤ 16 MHz, VSS = 0.0 V)
Value
UnitRemarks
MinMax
t
TIWH
4 t
IH
V
CPns
IL
V
t
TIWL
IL
V
(12) Timer Related Resource Output Timing
(T
(T
ParameterSymbolPinCondition
TOT1, TOT3,
CLK ↑⇒ T
OUT change timetTO
PPG4, PPG6,
PPG8 to PPGF
CLK
2.4 V
TOT1, TOT3,
PPG4, PPG6
PPG8 to PPGF
A = –40°C to +105°C, VCC = 5.0 V±10 %, fCP≤ 24 MHz, VSS = 0.0 V)
A = –40°C to +125°C, VCC = 5.0 V±10 %, fCP≤ 16 MHz, VSS = 0.0 V)
“H” width of the SCL clocktHIGH4.00.6µs
Set-up time for a repeated START condition
SCL↑→SDA↓
Data hold time
SCL↓→SDA↓↑
Data set-up time
SDA↓↑→SCL↑
Set-up time for STOP condition
SCL↑→SDA↑
Bus free time between a STOP and START
condition
t
SUSTA4.70.6µs
R = 1.7 kΩ,
t
HDDAT03.45*
t
SUDAT250100ns
C = 50 pF*
1
2
00.9*3µs
tSUSTO4.00.6µs
t
BUS4.71.3µs
*1 : R,C : Pull-up resistor and load capacitor of the SCL and SDA lines.
*2 : The maximum t
*3 : A Fast-mode I
t
SUDAT≥ 250 ns must then be met.
HDDAT have only to be met if the device does not stretch the “L” width (tLOW) of the SCL signal.
2
C -bus device can be used in a Standard-mode I2C-bus system, but the requirement
*4 : For use at over 100 kHz, set the machine clock to at least 6 MHz.
SDA
t
LOW
SCL
tHDSTAtHDDAT
tSUDAT
tHIGH
tHDSTA
tSUSTAtSUSTO
tBUS
57
MB90350 Series
5.A/D Converter
(TA=−40 °C to +105 °C, 3.0 V ≤ AVRH, VCC= AVCC= 5.0 V ± 10%, fCP≤ 24 MHz, VSS= AVSS= 0 V)
(TA=−40 °C to +125 °C, 3.0 V ≤ AVRH, VCC= AVCC= 5.0 V ± 10%, fCP≤ 16 MHz, VSS= AVSS= 0 V)
* : IF A/D convertor is not operating, a current when CPU is stopped is applicable (V
Note : The accuracy gets worse as
|AVRH − AVSS| becomes smaller.
58
CC= AVCC= AVRH = 5.0 V) .
MB90350 Series
6.Definition of A/D Converter Terms
Resolution : Analog variation that is recognized by an A/D converter.
Non linearity
error
Differential
linearity error
Total error : Difference between an actual value and an ideal value. A total error includes zero transition
Zero reading
voltage
Full scale
reading voltage
: Deviation between a line across zero-transition line ( “00 0000 0000” ← → “00 0000 0001” )
and full-scale transition line ( “11 1111 1110” ← → “11 1111 1111” ) and actual conversion
characteristics.
: Deviation of input voltage, which is required for changing output code by 1 LSB, from an ideal
value.
error, full-scale transition error, and linear error.
: Input voltage which results in the minimum conversion value.
: Input voltage which results in the maximum conversion value.
Total error
3FF
3FE
3FD
004
Digital output
003
002
001
Actual conversion
characteristics
Ideal characteristics
0.5 LSB
AV
SSAVRH
Analog input
NT− {1 LSB × (N − 1) + 0.5 LSB}
V
Total error of digital output “N” =
1 LSB = (Ideal value)
AVRH − AV
1024
VOT (Ideal value) = AVSS+ 0.5 LSB [V]
1.5 LSB
{1 LSB × (N − 1) + 0.5 LSB}
NT
V
(Actually-measured value)
Actual conversion
characteristics
1 LSB
SS
[V]
[LSB]
V
FST (Ideal value) = AVRH − 1.5 LSB [V]
V
NT : A voltage at which digital output transitions from (N − 1) to N.
(Continued)
59
MB90350 Series
(Continued)
Non linearity errorDifferential linearity error
3FF
3FE
3FD
004
Digital output
003
002
001
Actual conversion
characteristics
{1 LSB × (N − 1)
OT}
+ V
Actual conversion
characteristics
Ideal characteristics
OT (actual measurement value)
V
AV
SSAVRHAVSSAVRH
V
FST (actual
measurement
value)
V
NT (actual
measurement value)
N + 1
N
Digital output
N − 1
N − 2
Actual conversion
characteristics
Analog inputAnalog input
Ideal
characteristics
(N + 1) T
V
(actual measurement
VNT
(actual measurement value)
Actual conversion
characteristics
value)
Non linearity error of digital output N =
Differential linearity error of digital output N =
1 LSB =
OT : Voltage at which digital output transits from “000H” to “001H.”
V
V
FST : Voltage at which digital output transits from “3FEH” to “3FFH.”
V
NT− {1 LSB × (N − 1) + VOT}
1 LSB
V (
N+1) T− VNT
1 LSB
VFST− VOT
1022
−1 LSB [LSB]
[V]
[LSB]
60
MB90350 Series
7.Notes on A/D Converter Section
Use the device with external circuits of the following output impedance for analog inputs :
Recommended output impedance of external circuits are : Approx. 1.5 kΩ or lower (4.0 V ≤ AV
CC≤ 5.5 V,
sampling period ≤ 0.5 µs)
If an external capacitor is used, in consideration of the effect by tap capacitance caused by external capacitors
and on-chip capacitors, capacitance of the external one is recommended to be sever al thousand times as high
as internal capacitor.
If output impedance of an external circuit is too high, a sampling period for an analog voltage ma y be insufficient.
• Analog input circuit model
Analog input
R
Comparator
C
4.5 V ≤ AVCC≤ 5.5 V : R := 2.52 kΩ, C := 10.7 pF
4.0 V ≤ AV
CC < 4.5 V : R := 13.6 kΩ, C := 10.7 pF
Note : Use the values in the figure only as a guideline.
8.Flash Memory Program/Erase Characteristics
ParameterConditions
Sector erase time
MinTypMax
115s
Value
UnitRemarks
Excludes programming
prior to erasure
A=+25 °C
Chip erase time9s
Word (16 bit width)
programming time
T
V
CC= 5.0 V
163,600µs
Excludes programming
prior to erasure
Except for the overhead
time of the system
Program/Erase cycle10,000cycle
Flash Data Retention
Time
Average
T
A=+85 °C
20Years*
* : This value comes from the technology qualification.
(Using Arrhenius equation to translate high temperature measurements into normalized value at +85 °C)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness including plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
0.145±0.055
(.0057±.0022)
32
0.10(.004)
0.10(.004)
Details of "A" part
+0.20
–0.10
17
0.13(.005)
1.50
.059
0.50±0.20
"A"
M
(.020±.008)
0.60±0.15
(.024±.006)
0~8˚
+.008
–.004
(Mounting height)
0.25(.010)
0.10±0.10
(.004±.004)
(Stand off)
C
2003 FUJITSU LIMITED F64018S-c-3-5
Dimensions in mm (inches)
Note : The values in parentheses are reference values.
63
MB90350 Series
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
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property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0405
FUJITSU LIMITED Printed in Japan
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