The MB89630R series has been developed as a general-purpose version of the F2MC*-8L family consisting of
proprietary 8-bit, single-chip microcontrollers.
In addition to a compact instruction set, the microcontrollers contain a variety of peripheral functions such as
dual-clock control system, five operating speed control stages, a UART, timers, a PWM timer, a serial interface,
an A/D converter, an external interrupt, and a watch prescaler.
2
MC stands for FUJITSU Flexible Microcontroller.
*: F
FEATURES
■
• High-speed operating capability at low voltage
• Minimum execution time: 0.4 µs@3.5 V, 0.8 µs@2.7 V
2
•F
MC-8L family CPU core
Multiplication and division instructions
Instruction set optimized for controllers
• Five types of timers
8-bit PWM timer: 2 channels (Also usable as a reload timer)
8-bit pulse-width count timer (Continuous measurement capable, applicable to remote control, etc.)
16-bit timer/counter
21-bit timebase timer
•UART
CLK-synchronous/CLK-asynchronous data transfer capable (6, 7, and 8 bits)
• Serial interface
Switchable transfer direction to allows communication with various equipment.
• 10-bit A/D converter
Start by an external input capable
16-bit arithmetic operations
Test and branch instructions
Bit manipulation instructions, etc.
(Continued)
MB89630R Series
(Continued)
• External interrupt: 4 channels
Four channels are independent and capable of wake-up from low-power consumption modes (with an edge
detection function).
• Low-power consumption modes
Stop mode (Oscillation stops to minimize the current consumption.)
Sleep mode (The CPU stops to reduce the current consumption to approx. 1/3 of normal.)
Subclock mode
Watch mode
• Bus interface function
With hold and ready function
RAM size512 × 8 bits 768 × 8 bits 1024 × 8 bits 512 × 8 bi t s 1024 × 8 bits1 K
CPU functionsThe number of instructionns:136
PortsInput ports:5 (All also serve as peripherals.)
16 K × 8 bits
(internal
mask ROM)
Instruction bit length:8 bits
Instruction length:1 to 3 bytes
Data bit length:1, 8, 16 bits
Minimum execution time:0.4 to 6.4 µs/10 MHz, 61 µs@32.768 kHz
Interrupt processing time:3.6 to 57.6 µs/10 MHz, 562.5 µs@32.768 kHz
Output ports (N-ch open-drain):8 (All also serve as peripherals.)
I/O ports (N-ch open-drain):4 (All also serve as peripherals.)
Output ports (CMOS):8 (All also serve as bus control.)
I/O ports (CMOS):28 (27 ports also serve as bus pins and peripherals.)
Total: 53
24 K × 8 bits
(internal
mask ROM)
32 K × 8 bits
(internal
mask ROM)
External ROM
products
Fixed to external ROM
One-time
PROM
product
32 K × 8 bits
(Internal PROM, to be
programmed with
general-purpose
EPROM programmer)
EPROM
product
Piggyback/
evaluation
product (for
evaluation
and
development)
32 K × 8 bits
(external
ROM)
×8 bits
Clock timer21 bits × 1 (in main clock)/15 bits × 1 (at 32.768 kHz)
8-bit PWM
timer
8-bit pulse
width count
timer
16-bit timer/
counter
8-bit serial I/O 8 bits
UARTCapable of switching two I/O systems by software
Used also for wake-up from stop/sleep mode. (Edge detection is also permitted in stop mode.)
Standby modeSleep mode, stop mode, watch mode, and subclock mode
ProcessCMOS
Operating
voltage*
EPROM for use
* :Varies with conditions such as the operating frequency. (See section “■ Electrical Characteristics.”)
In the case of the MB89PV630, the voltage varies with the restrictions of the EPROM for use.
* :To convert pin pitches, an adapter socket (manufacturer: Sun Hayato Co., Ltd.) is available.
64SD-64QF2-8L: For conversion from (DIP-64P-M01, DIP-64C-A06, or MDP-64C-P02) to FPT-64P-M09
Inquiry: Sun Hayato Co., Ltd.: TEL (81)-3-3986-0403
FAX (81)-3-5396-9106
Note: For more information about each package, see section “■ Package Dimensions.”
4
MB89630R Series
DIFFERENCES AMONG PRODUCTS
■
1. Memory Size
Before e valuating using the piggyback product, verify its differences from the product that will actually be used.
Take particular care on the following points:
On the MB89P637/W637, the program area starts from address 8007
starts from 8000
• On the MB89P637/W637, addresses 8000
H.
H to 8006H comprise the option setting area, option settings can be
read by reading these addresses. On the MB89PV630/MB89637R, addresses 8000
H but on the MB89PV630 and MB89637R
H to 8006H could also be
used as a program ROM. However, do not use these addresses in order to maintain compatibility of the
MB89P637/W637.
• The stack area, etc., is set at the upper limit of the RAM.
• The external area is used.
2. Current Consumption
• In the case of the MB89PV630, add the current consumed by the EPROM which connected to the top socket.
• When operated at low speed, the product with an OTPROM (one-time PROM) or an EPROM will consume
more current than the product with a mask ROM. However, the current consumption in sleep/stop modes is
the same. (For more inf ormation, see sections “■ Electrical Characteristics” and “■ Example Characteristics.”)
3. Mask Options
Functions that can be selected as options and how to designate these options vary by the product.
Before using options check section “■ Mask Options.”
Take particular care on the following points:
• A pull-up resistor cannot be set for P50 to P53 on the MB89P637 and MB89W637.
• Options are fixed on the MB89PV630, MB89T635R, and MB89T637R.
4. Differences between the MB89630 and MB89630R Series
• Memory access area
There are no difference between the access area of MB89635/MB89635R, and that of MB89637/MB89637R.
The access area of MB89636 is different from that of the MB89636R when using in external bus mode.
Address
MB89636MB89636R
H to 007FHI/O areaI/O area
0000
0080
H to 037FHRAM areaRAM area
0380
H to 047FH
0480H to 7FFFHExternal area
External area
8000H to 9FFFHAccess prohibited
A000
H to FFFFHROM areaROM area
Memory area
Access prohibited
5
MB89630R Series
• Other specifications
Both MB89630 series and MB89630R is the same.
• Electrical specifications/electrical characteristics
Electrical specifications of the MB89630R series are the same as that of the MB89630 series.
Electrical characteristics of both the series are much the same.
CORRESPONDENCE BETWEEN THE MB89630 AND MB89630R SERIES
■
• The MB89630R series is the reduction version of the MB89630 series.
• The the MB89630 and MB89630R series consist of the following products:
MB89630 series MB89635MB89T635MB89636MB89637MB89T637
MB89630R series MB89635R MB89T635R MB89636R MB89637RMB89T637R
This pin is an N-ch open-drain output type with a
pull-up resistor, and a hysteresis input type.
“L” is output from this pin by an internal reset
source. The internal circuit is initialized by the
input of “L”.
56 to 4948 to 4149 to 42 P00/AD0 to
P07/AD7
FGeneral-purpose I/O ports
When an external bus is used, these ports
function as the multiplex pins of the lo w er address
output and the data I/O.
48 to 4140 to 3341 to 34 P10/A08 to
P17/A157
FGeneral-purpose I/O ports
When an external bus is used, these ports
function as an upper address output.
403233P20/BUFCHGeneral-purpose output port
When an external bus is used, this port can also
be used as a buffer control output by setting the
BCTR.
393132P21/HAK
HGeneral-purpose output port
When an external bus is used, this port can also
be used as a hold acknowledge by setting the
BCTR.
383031P22/HRQFGeneral-purpose output port
When an external bus is used, this port can also
be used as a hold request input by setting the
BCTR.
372930P23/RDYFGeneral-purpose output port
When an external bus is used, this port functions
as a ready input.
362829P24/CLKHGeneral-purpose output port
When an external bus is used, this port functions
as a clock output.
352728P25/WR
HGeneral-purpose output port
When an external bus is used, this port functions
as a write signal output.
342627P26/RD
HGeneral-purpose output port
When an external bus is used, this port functions
as a read signal output.
MB89636R, MB89637R, and MB89T637R
At an oscillation feedback resistor of approximately
1 MΩ@5.0 V
Standby control signal
B• Crystal or ceramic oscillation type (subclock)
X1A
MB89PV630, MB89P637, MB89W637, MB89635R,
MB89636R, and MB89637R with dual-clock system
X0A
At an oscillation feedback resistor of approximately
4.5 MΩ@5.0 V
Standby control signal
C•At an output pull-up resistor (P-ch) of approximately
R
P-ch
N-ch
50 kΩ@5.0 V
• Hysteresis input
D
E• Hysteresis input
R
• Pull-up resistor optional (except P70 and P71)
F• CMOS output
R
P-ch
P-ch
N-ch
•CMOS input
• Pull-up resistor optional (except P22 and P23)
(Continued)
13
MB89630R Series
(Continued)
TypeCircuitRemarks
G•CMOS output
• Hysteresis input
R
P-ch
P-ch
N-ch
• Pull-up resistor optional
H•CMOS output
P-ch
N-ch
I• Analog input
N-ch
Analog input
J•CMOS input
R
P-ch
N-ch
• Pull-up resistor optional
K• Hysteresis input
R
P-ch
N-ch
• Pull-up resistor optional
14
MB89630R Series
HANDLING DEVICES
■
1. Preventing Latchup
Latchup may occur on CMOS ICs if voltage higher than VCC or lower than VSS is applied to input and output pins
other than medium- and high-voltage pins or if higher than the voltage which shows on “1. Absolute Maximum
Ratings” in section “■ Electrical Characteristics” is applied between V
When latchup occurs, power supply current increases rapidly and might thermally damage elements. When
using, take great care not to exceed the absolute maximum ratings.
CC and VSS.
Also, tak e care to prev ent the analog po wer supply (AV
power supply (VCC) when the analog system power supply is turned on and off.
CC and A VR) and analog input from e xceeding the digital
2. Treatment of Unused Input Pins
Leaving unused input pins open could cause malfunctions. The y should be connected to a pull-up or pull-down
resistor.
3. Treatment of Power Supply Pins on Microcontrollers with A/D and D/A Converters
Connect to be AVCC = DAVC = VCC and AVSS = AVR = VSS even if the A/D and D/A converters are not in use.
4. Treatment of N.C. Pins
Be sure to leave (internally connected) N.C. pins open.
5. Power Supply Voltage Fluctuations
Although VCC power supply voltage is assured to oper ate within the rated range, a rapid fluctuation of the v oltage
could cause malfunctions, ev en if it occurs within the rated range. Stabilizing voltage supplied to the IC is therefore
important. As stabilization guidelines, it is recommended to control power so that V
value) will be less than 10% of the standard VCC value at the commercial frequency (50 Hz to 60 Hz) and the
transient fluctuation rate will be less than 0.1 V/ms at the time of a momentary fluctuation such as when power
is switched.
CC ripple fluctuations (P-P
6. Precautions when Using an External Clock
When an external clock is used, oscillation stabilization time is required ev en for power-on reset (option selection)
and wake-up from stop mode.
15
MB89630R Series
PROGRAMMING TO THE EPROM ON THE MB89P637
■
The MB89P637 is an OTPROM version of the MB89630 series.
1. Features
• 32-Kbytes PROM on chip
• Options can be set using the EPROM programmer.
• Equivalency to the MBM27C256A in EPROM mode (when programmed with the EPROM programmer)
2. Memory Space
Memory space in each mode is illustrated below.
0000H
0080H
0100H
0200H
0480H
8000H
8007H
Normal operating mode
I/O
RegisterRAM
External area
Option setting area
PROM
32 KB
EPROM mode
(Corresponding addresses
on the EPROM programmer)
H
0000
0007H
Option setting area
Program area
(EPROM)
32 KB
7FFF
FFFFH
H
3. Programming to the EPPROM
In EPROM mode, the MB89P637 functions equivalent to the MBM27C256A. This allows the PROM to be
programmed with a general-purpose EPROM programmer by using the dedicated socket adapter.
However, the electronic signature mode cannot be used.
When the operating ROM area for a single chip is 32 Kbytes (8007
as follows:
16
H to FFFFH) the EPROM can be programmed
MB89630R Series
•
Programming procedure
(1) Set the EPROM programmer to the MBM27C256A-20CZ and MBM27C256A-20TV.
(2) Load program data into the EPROM programmer at 0007
in the operating mode assign to 0000H to 7FFFH in EPROM mode).
H to 7FFFH. (Note that addresses 8000H to FFFFH
(3) Load option data into addresses 0000
H to 0006H of the EPROM programmer.
(For information about each corresponding option, see “8. OTPROM Option Bit Map.”)
(4) Program with the EPROM programmer.
4. Recommended Screening Conditions
High-temperature aging is recommended as the pre-assembly screening procedure for a product with a blanked
OTPROM microcomputer program.
Program, verify
Aging
+150°C, 48 Hrs.
Data verification
Assembly
5. Programming Yield
All bits cannot be programmed at Fujitsu shipping test to a blank ed O TPROM microcomputer, due to its nature.
For this reason, a programming yield of 100% cannot be assured at all times.
6. Erasure
In order to clear all locations of their programmed contents, it is necessary to expose the internal EPROM to an
ultraviolet light source. A dosage of 10 W -seconds/cm
dosage can be obtained by exposure to an ultraviolet lamp (wavelength of 2537 Angstroms (Å)) with intensity
of 12000 µW/cm
2
for 15 to 21 minutes. The internal EPROM should be about one inch from the source and all
filters should be removed from the UV light source prior to erasure.
It is important to note that the internal EPROM and similar devices, will erase with light sources having wave-
lengths shorter than 4000 Å. Although erasure time will be much longer than with UV source at 2537 Å,
nevertheless the exposure to fluorescent light and sunlight will eventually erase the internal EPROM, and
exposure to them should be prevented to realize maximum system reliability. If used in such an environment,
the package windows should be covered by an opaque label or substance.
2
is required to completely erase an internal EPROM. This
17
MB89630R Series
7. EPROM Programmer Socket Adapter
Part No.
Package
Compatible socket adapter
Sun Hayato Co., Ltd.
Inquiry: Sun Hayato Co., Ltd.: TEL : (81)-3-3986-0403
FAX: (81)-3-5396-9106
8. OTPROM Option Bit Map
Address
0000
H
0001H
H
0002
H
0003
H
0004
H
0005
0006H
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Vacancy
Readable
and writable
P07
Pull-up
1: No
0: Yes
P17
Pull-up
1: No
0: Yes
P37
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Vacancy
Readable
and writable
Vacancy
Readable
and writable
Vacancy
Readable
and writable
P06
Pull-up
1: No
0: Yes
P16
Pull-up
1: No
0: Yes
P36
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Vacancy
Readable
and writable
Vacancy
Readable
and writable
Vacancy
Readable
and writable
P05
Pull-up
1: No
0: Yes
P15
Pull-up
1: No
0: Yes
P35
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Vacancy
Readable
and writable
Vacancy
Readable
and writable
MB89P637-SHMB89P637PF
SH-DIP-64QFP-64
ROM-64SD-28DP-8LROM-64QF-28DP-8L
Single/dualclock system
1: Dual clock
0: Single clock
P04
Pull-up
1: No
0: Yes
P14
Pull-up
1: No
0: Yes
P34
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
P74
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Reset pin
output
1: Yes
0: No
P03
Pull-up
1: No
0: Yes
P13
Pull-up
1: No
0: Yes
P33
Pull-up
1: No
0: Yes
P43
Pull-up
1: No
0: Yes
P73
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Power-on
reset
1: Yes
0: No
P02
Pull-up
1: No
0: Yes
P12
Pull-up
1: No
0: Yes
P32
Pull-up
1: No
0: Yes
P42
Pull-up
1: No
0: Yes
P72
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Oscillation stabilization (/FCH)
11:218/FCH 01:217/FCH
10:214/FCH 00:24/FCH
P01
Pull-up
1: No
0: Yes
P11
Pull-up
1: No
0: Yes
P31
Pull-up
1: No
0: Yes
P41
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Vacancy
Readable
and writable
P00
Pull-up
1: No
0: Yes
P10
Pull-up
1: No
0: Yes
P30
Pull-up
1: No
0: Yes
P40
Pull-up
1: No
0: Yes
Vacancy
Readable
and writable
Reserved bit
Readable
and writable
Note: Each bit is set to ‘1’ as the initialized value.
18
MB89630R Series
PROGRAMMING TO THE EPROM WITH PIGGYBACK/EVALUATION DEVICE
■
1. EPROM for Use
MBM27C256A-20CZ, MBM27C256A-20TV
2. Programming Socket Adapter
To program to the PROM using an EPROM programmer, use the socket adapter (manufacturer: Sun Hayato
Co., Ltd.) listed below.
PackageAdapter socket part number
LCC-32 (Rectangle)ROM-32LC-28DP-YG
Inquiry: Sun Hayato Co., Ltd.: TEL: (81)-3-3986-0403
FAX: (81)-3-5396-9106
3. Memory Space
Memory space in each mode, such as 32-Kbyte PROM, option area is diagrammed below.
Address
0000H
0080H
0480H
8000H
8007H
FFFF
H
Single chip
I/O
RAM
Not available
Not available
PROM
32 KB
Corresponding addresses on the EPROM programmer
0000H
0007H
7FFF
H
4. Programming to the EPROM
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 0007H to 7FFFH.
The microcontrollers of the MB89630R series offer 64 Kbytes of memory for storing all of I/O, data, and program
areas. The I/O area is located at the lowest address. The data area is provided immediately above the I/O area.
The data area can be divided into register, stack, and direct areas according to the application. The program
area is located at exactly the opposite end of I/O area, that is, near the highest address. Provide the tables of
interrupt reset vectors and vector call instructions toward the highest address within the program area. The
memory space of the MB89630R series is structured as illustrated below.
• Memory space
MB89637R
MB89T637R
0000H
MB89PV630
0000
MB89635R
MB89T635R
H
0000
MB89636R
H
0000
MB89P637
MB89W637
H
I/O
RAM
512 B
Register
External area
1
ROM*
16 KB
0080H
0100H
0200H
0380
0480H
8000H
A000H
I/O
RAM
768 B
Register
H
*3
External area
*3
ROM*
24 KB
0080H
0100H
0200H
0480H
8000H
8007H
FFFF
I/O
RAM
1 KB
Register
External area
*2
External ROM
32 KB
H
0080H
0100H
0200H
0280H
C000H
FFFFH
*1: The ROM area is an external area depending on the mode.
The internal ROM cannot be used on the MB89T635R and MB89T637R.
I/O
0080H
RAM
1024 KB
0100H
Register
0200H
H
0480
External area
8000H
8007H
1
FFFFHFFFFH
*2
ROM*
32 KB
1
*2: Addresses 8000
this area for the MB89PV630 and MB89637R.
H to 8006H for the MB89P637 and MB89W637 comprise an option area, do not use
*3: The access is forbidden in the external bus mode.
21
MB89630R Series
2. Registers
The F2MC-8L family has two types of registers; dedicated registers in the CPU and general-purpose registers
in the memory. The following dedicated registers are provided:
Program counter (PC): A 16-bit register for indicating the instruction storage positions
Accumulator (A):A 16-bit temporary register for storing arithmetic operations, etc. When the
instruction is an 8-bit data processing instruction, the lower byte is used.
Temporary accumulator (T): A16-bit register which performs arithmetic operations with the accumulator
When the instruction is an 8-bit data processing instruction, the lower byte is used.
Index register (IX):A16-bit register for index modification
Extra pointer (EP): A16-bit pointer for indicating a memory address
Stack pointer (SP): A16-bit register for indicating a stack area
Program status (PS): A16-bit register for storing a register pointer, a condition code
16 bits
PC
A
T
IX
EP
SP
PS
: Program counter
: Accumulator
: Temporary accumulator
: Index register
: Extra pointer
: Stack pointer
: Program status
Initial value
FFFD
H
Indeterminate
Indeterminate
Indeterminate
IndeterminateIndeterminate
Indeterminate
I-flag = 0, IL1, IL0 = 11
The other bit values are indeterminate.
The PS can further be divided into higher 8 bits for use as a register bank pointer (RP) and the lower 8 bits for
use as a condition code register (CCR). (See the diagram below.)
• Structure of the program status register
10987632101514131211
RPPS
Vacancy Vacancy Vacancy
HIIL1, IL0NZVC
54
22
RPCCR
MB89630R Series
The RP indicates the address of the register bank currently in use. The relationship between the pointer contents
and the actual address is based on the conversion rule illustrated below.
• Rule for conversion of actual addresses of the general-purpose register area
R1
A4
R0
↓
↓
A3
Lower OP codes
b2
b1
b0
↓
↓
↓
A2
A1
A0
Generated addresses
“0”
↓
A15
“0”
↓
A14
“0”
↓
A13
“0”
↓
A12
“0”
↓
A11
“0”
↓
A10
“0”
A9
RP
“1”
R4
R3
R2
↓
↓
↓
↓
↓
A8
A7
A6
A5
The CCR consists of bits indicating the results of arithmetic operations and the contents of transfer data and
bits for control of CPU operations at the time of an interrupt.
H-flag: Set to ‘1’ when a carry or a borrow from bit 3 to bit 4 occurs as a result of an arithmetic operation.
Cleared to ‘0’ otherwise. This flag is for decimal adjustment instructions.
I-flag:Interrupt is enabled when this flag is set to ‘1’. Interrupt is disabled when the flag is cleared to ‘0’. Cleared
to ‘0’ at the reset.
IL1, IL0: Indicates the level of the interrupt currently allowed. Processes an interrupt only if its request level is
higher than the value indicated by this bit.
IL1IL0 Interrupt levelHigh-low
00
1
01
High
102
113
Low
N-flag: Set to ‘1’ if the MSB becomes to ‘1’ as the result of an arithmetic operation. Cleared to ‘0’ when the bit
is cleared to ‘0’.
Z-flag:Set to ‘1’ when an arithmetic operation results in 0. Cleared to ‘0’ otherwise.
V-flag:Set to ‘1’ if the complement on 2 overflows as a result of an arithmetic operation. Cleared to ‘0’ if the
overflow doesnot occur.
C-flag: Set to ‘1’ when a carry or a borrow from bit 7 occurs as a result of an arithmetic operation. Cleared to ‘0’
otherwise.
Set to the shift-out value in the case of a shift instruction.
23
MB89630R Series
y
The following general-purpose registers are provided:
General-purpose registers: An 8-bit register for storing data
The general-purpose registers are 8 bits and located in the register banks of the memory. One bank contains
eight registers and up to a total of 32 banks can be used on the MB89653A (RAM 512 × 8 bits). The bank
currently in use is indicated by the register bank pointer (RP).
24H(R/W)EIC1External interrupt control register 1
25
H(R/W)EIC2External interrupt control register 2
26
HVacancy
27HVacancy
28
H(R/W)CNTR1PWM timer control register 1
29
H(R/W)CNTR2PWM timer control register 2
2AH(R/W)CNTR3PWM timer control register 3
2B
H(W)COMR1PWM timer compare register 1
2C
H(W)COMR2PWM timer compare register 2
2DH(R/W)SMCUART serial mode control register
2E
H(R/W)SRCUART serial rate control register
2F
H(R/W)SSDUART serial status/data register
H
30
31
H to 7BHVacancy
7C
H(W)ILR1 Interrupt level setting register 1
(R)
(W)
SIDR
SODR
UART serial input data control register
UART serial output data control register
7DH(W)ILR2 Interrupt level settingregister 2
7E
H(W)ILR3 Interrupt level setting register 3
7F
HVacancy
Note: Do not use vacancies.
26
ELECTRICAL CHARACTERISTICS
■
1. Absolute Maximum Ratings
Parameter
Power supply voltage
MB89630R Series
(AVSS = VSS = 0.0 V)
Symbol
V
CCVSS – 0.3VSS + 7.0V*
AVCCVSS – 0.3VSS + 7.0V*
Value
UnitRemarks
Min.Max.
A/D converter reference input voltage AVRV
VIVSS – 0.3VCC + 0.3VExcept P50 to P53
Input voltage
V
I2VSS – 0.3VSS + 7.0VP50 to P53
OVSS – 0.3VCC + 0.3VExcept P50 to P53
V
Output voltage
VO2VSS – 0.3VSS + 7.0VP50 to P53
“L” level maximum output currentI
“L” level average output current I
“L” level total maximum output current∑I
“L” level total average output current ∑I
“H” level maximum output current I
“H” level average output currentI
“H” level total maximum output current∑I
“H” level total average output current ∑I
Power consumption P
OL20mA
OLAV4mA
OL100mA
OLAV40mA
OH–20mA
OHAV–4mA
OH–50mA
OHAV–20mA
D500mW
SS – 0.3VSS + 7.0V
AVR must not exceed
CC + 0.3 V”.
“AV
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Operating temperature T
A–40+85°C
Storage temperatureTstg–55+150°C
* :Use AVCC and VCC set at the same voltage.
Take care so that AV
CC does not exceed VCC, such as when power is turned on.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
27
MB89630R Series
2. Recommended Operating Conditions
Parameter
Power supply voltage
Symbol
V
CC
Value
UnitRemarks
Min.Max
2.2*6.0*V
2.7*6.0*V
(AVSS = VSS = 0.0 V)
Normal operation
assurance range*
MB89635R/637R
Normal operation
assurance range*
MB89PV630/P637/
W637/T635R/T637R
CC1.56.0V
AV
A/D converter reference input voltageAVR3.0AV
Operating temperature T
A–40+85°C
CCV
Retains the RAM state in
stop mode
* :These values vary with the operating frequency, instruction cycle, and analog assurance range. See Figure 1
and “5. A/D Converter Electrical Characteristics.”
Figure 1 Operating Voltage vs. Main Clock Operating Frequency
6
5
Operation assurance range
4
3
Operating voltage (V)
2
Analog accuracy assured in the
AV
CC
= 3.5 V to 6.0 V range
1
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0
Main clock operating frequency (at an instruction cycle of 4/F
4.0 2.00.80.4
Minimum execution time (instruction cycle) (µs)
Note: The shaded area is assured only for the MB89635R/636R/637R.
CH
) (MHz)
Figure 1 indicates the operating frequency of the external oscillator at an instruction cycle of 4/F
Since the operating voltage range is dependent on the instruction cycle, see minimum execution time if the
operating speed is switched using a gear.
28
CH.
MB89630R Series
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
29
MB89630R Series
3. DC Characteristics
Parameter
“H” level input
voltage
“L” level input
voltage
Open-drain
output pin
application
voltage
“H” level output
voltage
“L” level output
voltage
Input leakage
current
(Hi-z output
leakage current)
Symbol
V
IH1
V
IH2
V
IHS
V
IHS2
V
IL
V
ILS
V
D
V
OH
OL
V
I
LI
Pin nameCondition
P00 to P07, P10 to P17,
P22, P23, P31, P34,
P37, P41, P43,
P51 to P53
* :For information on tinst, see “(4) Instruction Cycle.”
PWC,
EC,
INT0 to INT3
ADST
0.2VCC
tIHIL1
tIHIL2
(tIHIL3)
0.8VCC
0.2
0.8VCC
VCC
tILIH1
tILIH2
(tILIH3)
0.8VCC
0.8VCC
0.2VCC
0.2
VCC
41
MB89630R Series
5. A/D Converter Electrical Characteristics
(AVCC = VCC = 3.5 V to 6.0 V, FCH = 10 MHz, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
ParameterSymbol
Pin
name
Value
UnitRemarks
Min.Typ.Max.
Resolution
——10bit
Linearity error——±2.0LSB
——
Differential linearity error——±1.5LSB
Total error——±3.0LSB
Zero transition voltageV
OT
AVSS – 1.5 LSB AVSS + 0.5 LSB AVSS + 2.5 LSB
mV
AN0 to
Full-scale transition
voltage
Interchannel disparity
FST
V
AN7
AVR – 3.5 LSB AVR – 1.5 LSB AVR + 0.5 LSB
mV
—— 4LSB
——
A/D mode conversion time—13.2—µs
Analog port input currentI
Analog input voltage
AIN
AN0 to
AN7
——10µA
0.0—AVRV
—
Reference voltage
Reference voltage
supply current
R—200µA AVR = 5.0 V
—
I
0.0—AV
CCV
At AVCC = VCC
At 10 MHz
oscillation
42
MB89630R Series
6. A/D Converter Glossary
• Resolution
Analog changes that are identifiable with the A/D converter
• Linearity error
The deviation of the straight line connecting the ze ro transition point (“00 0000 0000” ↔ “00 0000 0001”) with
the full-scale transition point (“11 1111 1110” ↔
• Differential linearity error
The deviation of input voltage needed to change the output code by 1 LSB from the theoretical value
• Total error (unit: LSB)
The difference between theoretical and actual conversion values caused by the zero transition error, full-scale
transition error, linearity error, quantization error, and noise
“11 1111 1111”) from actual conversion characteristics
3FF
3FE
3FD
004
Digital output
003
002
001
SS
AV
Theoretical I/O characteristics
VFST
VOT
1 LSB
0.5 LSB
Analog input
1 LSB =
VFST –VOT
1022
1.5 LSB
(V)
AVR
3FF
3FE
3FD
004
Digital output
003
002
001
Digital output N total error =
Actual conversion
value
{1 LSB × N + 0.5 LSB}
AV
SS
Total error
Actual conversion
value
Theoretical value
Analog input
V
NT – {1 LSB × N + 0.5 LSB}
VNT
AVR
1 LSB
(Continued)
43
MB89630R Series
(Continued)
004
003
002
Digital output
001
AVSS
Zero transition error
Actual conversion
value
V
OT (Actual measurement)
Analog input
Linearity error
Actual conversion
value
3FF
3FE
Digital output
3FD
3FC
Full-scale transition error
Theoretical value
Actual conversion
value
Actual conversion value
Analog input
Differential linearity error
FST
V
(Actual
measurement)
AVR
3FF
Actual conversion
3FE
3FD
004
Digital output
003
002
001
Digital output N linearity error =
value
{1 LSB × N + VOT}
Theoretical value
VOT (Actual measurement)
AVSS
Analog input
V
FST
(Actual
VNT
measurement)
Actual conversion value
NT – {1 LSB × N + VOT}
V
1 LSB
N + 1
Actual conversion
value
N
Digital output
N – 1
N – 2
AV
AVR
Digital output N differential linearity error =
SS
Theoretical value
VNT
Actual conversion value
Analog input
(N + 1)T –VNT
V
1 LSB
V(N + 1)T
AVR
– 1
44
MB89630R Series
7. Notes on Using A/D Converter
• Input impedance of the analog input pins
The output impedance of the external circuit for the analog input must satisfy the followingconditions.
If the output impedance of the external circuit is too high, an analog voltage sampling time might beinsufficient
(sampling time = 6 µs at 10MHz oscillation.) Therefore, it is recommended to keep the output impedance of the
external circuit below 10 kΩ .
•
Analog input circuit model
Analog input
RON2RON1
R
ON1:
Approx. 1.5 kΩ
R
Approx. 1.5 kΩ
ON2:
Approx. 60 pF
C
0:
Approx. 4 pF
C
1:
Note: The values mentioned here should be used as a guideline.
C1
•Error
The smaller the | AVR–AVss |, the greater the error would become relatively.
VIHS: Threshold as the input voltage in hysteresis
characteristics is set to “H” level
VILS: Threshold as the input voltage in hysteresis
characteristics is set to “L” level
46
(5) Power Supply Current (External Clock)
MB89630R Series
ICC (mA)
ICC1 vs. VCC, ICC2 vs. VCC
16
CH = 10MHz
14
F
TA = +25°C
12
10
8
6
4
2
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
2.0
ICCL (µA)
200
180
ICCL vs. VCC
TA = +25°C
160
140
120
100
80
60
40
20
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Divide by 4
(I
CC1)
Divide by 8
Divide by 16
Divide by 64
(ICC2)
V
CC (V)
V
CC (V)
ICCS (mA)
ICCS1 vs. VCC, ICCS2 vs. VCC
5.0
4.5
FCH = 10MHz
TA = +25°C
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
ICCLS (µA)
50
45
ICCLS vs. VCC
TA = +25°C
40
35
30
25
20
15
10
5
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Divide by 4
(I
CCS1)
Divide by 8
Divide by 16
Divide by 64
(I
CCS2)
V
CC (V)
V
CC (V)
(Continued)
47
MB89630R Series
(Continued)
I CCT (µA)
20
18
16
14
12
10
8
6
4
2
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
I CCT vs. V CC
TA = +25°C
(6) Pull-up Resistance
PULL (kΩ)
R
1000
V
CC (V)
R PULL vs. V CC
I CCH (µA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
TA = +25°C
I CCH vs. V CC
TA = +25°C
V
CC (V)
48
100
10
1
2345 6
V
CC (V)
MB89630R Series
INSTRUCTIONS (136 INSTRUCTIONS)
■
Execution instructions can be divided into the following four groups:
• Transfer
• Arithmetic operation
• Branch
•Others
Table 1 lists symbols used for notation of instructions.
Table 1 Instruction Symbols
SymbolMeaning
dirDirect address (8 bits)
offOffset (8 bits)
extExtended address (16 bits)
#vctVector table number (3 bits)
#d8Immediate data (8 bits)
#d16Immediate data (16 bits)
dir: bBit direct address (8:3 bits)
relBranch relative address (8 bits)
@Register indirect (Example: @A, @IX, @EP)
AAccumulator A (Whether its length is 8 or 16 bits is determined by the instruction in use.)
AHUpper 8 bits of accumulator A (8 bits)
ALLower 8 bits of accumulator A (8 bits)
TTemporary accumulator T (Whether its length is 8 or 16 bits is determined by the instruction in use.)
THUpper 8 bits of temporary accumulator T (8 bits)
TLLower 8 bits of temporary accumulator T (8 bits)
IXIndex register IX (16 bits)
EPExtra pointer EP (16 bits)
PCProgram counter PC (16 bits)
SPStack pointer SP (16 bits)
PSProgram status PS (16 bits)
drAccumulator A or index register IX (16 bits)
CCRCondition code register CCR (8 bits)
RPRegister bank pointer RP (5 bits)
RiGeneral-purpose register Ri (8 bits, i = 0 to 7)
×
( × )
(( × ))
Columns indicate the following:
Mnemonic: Assembler notation of an instruction
~:The number of instructions
#:The number of bytes
Operation: Operation of an instruction
TL, TH, AH:A content change when each of the TL, TH, and AH instructions is executed. Symbols in
N, Z, V, C:An instruction of which the corresponding flag will change. If + is written in this column,
OP code:Code of an instruction. If an instruction is more than one code, it is written according to
Indicates that the very × is the immediate data.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
Indicates that the contents of × is the target of accessing.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
The address indicated by the contents of × is the target of accessing.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
the column indicate the following:
•
“–” indicates no change.
• dH is the 8 upper bits of operation description data.
• AL and AH must become the contents of AL and AH prior to the instruction executed.
• 00 becomes 00.
the relevant instruction will change its corresponding flag.
the following rule:
Example: 48 to 4F ← This indicates 48, 49, ... 4F.
ADDC A,Ri
ADDC A,#d8
ADDC A,dir
ADDC A,@IX +off
ADDC A,@EP
ADDCW A
ADDC A
SUBC A,Ri
SUBC A,#d8
SUBC A,dir
SUBC A,@IX +off
SUBC A,@EP
SUBCW A
SUBC A
INC Ri
INCW EP
INCW IX
INCW A
DEC Ri
DECW EP
DECW IX
DECW A
MULU A
DIVU A
ANDW A
ORW A
XORW A
CMP A
CMPW A
RORC A
AND A,@EP
AND A,@IX +off
AND A,Ri
OR A
OR A,#d8
OR A,dir
OR A,@EP
OR A,@IX +off
OR A,Ri
CMP dir,#d8
CMP @EP,#d8
CMP @IX +off,#d8
CMP Ri,#d8
INCW SP
DECW SP
Mnemonic~#OperationTLTHAHN Z V COP code
BZ/BEQ rel
BNZ/BNE rel
BC/BLO rel
BNC/BHS rel
BN rel
BP rel
BLT rel
BGE rel
BBC dir: b,rel
BBS dir: b,rel
JMP @A
JMP ext
CALLV #vct
CALL ext
XCHW A,PC
RET
RETI
FUJITSU MICROELECTRONICS ASIA PTE LTD
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
Fax: +65-281-0220
http://www.fmap.com.sg/
All Rights Reserved.
The contents of this document are subject to change without
notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications,
and are not intended to be incorporated in devices for actual use.
Also, FUJITSU is unable to assume responsibility for
infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
The contents of this document may not be reproduced or copied
without the permission of FUJITSU LIMITED.
FUJITSU semiconductor devices are intended for use in
standard applications (computers, office automation and other
office equipments, industrial, communications, and
measurement equipments, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage,
or where extremely high levels of reliability are demanded
(such as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life
support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be
responsible for damages arising from such use without prior
approval.
Any semiconductor devices have inherently a certain rate of
failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your
facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating
conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required
for export of those products from Japan.
F9609
FUJITSU LIMITED Printed in Japan
59
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