Thank you for purchasing the LQFP-64P*1 header type 2 (MB2198-304) for the DSU-FR emulator.
This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198-
300)*
user system that uses a MB91460 series Fujitsu FR*
This manual describes how to use the LQFP-64P header type 2 for the DSU-FR emulator. Please read
the manual carefully before using. Please contact your Fujitsu sales or support representative for details on which production and evaluation MCU models can be used with this product.
*1 : The lead pitch of package (FPT-64P-M23) is 0.65mm and the body size is 14mm × 14mm.
*2 : Referred to as the “adapter”
*3 : Referred to as the “emulator”
*4 : Referred to as the “DSU cable”
*5 : FR is an abbreviation of FUJITSU RISC CONTROLLER and is a product of Fujitsu Limited.
■ Handling and usage
The handling and use of this product and notes regarding safety use are included in the hardware
manual of the DSU-FR family emulator.
Follow the instructions in for the use of this product.
2
to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a
■ Caution of the products described in this manual
The following precautions apply to the product described in this manual.
CAUTION
Cuts
Damage
Damage
The wrong use of a device will give an injury and may cause malfunction on customers system.
This product has parts with sharp points that are exposed. Do not touch edge of
the product with your bare hands. There is a possibility that it may be injured.
When connect the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the index mark (▲)
on the header board, otherwise the emulator system and user system might be
damaged.
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
Before using the MB2198-304, confirm that the following components are included in the box:
• LQFP-64P header board*
1
: 1
• Screws for securing the header board (M2 × 10mm, 0.4mm pitch) : 4
• Washer s: 4
• NQPACK064SB*
• HQPACK064SB140*
2
3
: 1
: 1
• Operation manual (Japanese version): 1
• Operation manual (English version, this manual): 1
*1 : The YQPACK064SB is mounted on the header board (Tokyo Eletech Corporation, referred to
as the “YQPACK”).
*2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”). This
socket is supplied with a special screwdriver and 2 guide pins. Additionally, the relatively high
reliability NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) can be used by
preparing screw holes on the user system board for mounting the socket. For more information,
contact Tokyo Eletech Corporation.
*3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, and referred to as “HQ-
PACK”). This cover includes 4 screws for securing HQPACK (M2 × 6mm, 0.4mm pitch).
This product is used as an emulator system by combining with an optional emulator, DSU cable and
adapter.
Consult a sales or support representative from Fujitsu Limited for details on the adapter and emulator
for this product.
2. Handling Precautions
■ Handling precautions
The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header
in the proper environment, observe the following points regarding its insertion and removal:
• To avoid placing stress on the NQPACK mounted on the user system during connecting the
header board.
■ Precautions when operating on the sub clock
When using this product, the evaluation MCU cannot be supplied with a sub clock from the user system.
When the evaluation MCU is operating using the sub clock, use the sub clock on the adapter.
Refer to the operation manual for the adapter for more details.
1
3. Notes on Designing
■ Notes on designing the printed circuit board for the user system
If the header board is connected to a user system, the heights of parts mounted around the
header board are restricted.
When designing the printed circuit board of the user system, consider the heights of components
within the range of the header board, as shown in Figure 1, so that the components mounted on the
user system do not interfere with the header board.
88.0mm
52.0mm
42.0mm
User
system
Header
1.6mm
Approx.
17.0mm*
Insulating plate
Approx.
13.0mm*
Adapter
150.0mm
23.0mm
10.0mm
NQPACK064SB
* : The height differs slightly depending on how the sockets are engaged.
Figure 1 Header board dimensions
2
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