FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
LQFP-52P (0.65 mm pitch) HEADER BOARD
SS01-26015-1E
F2MC-8FX Family
MB2146-261
OPERATION MANUAL
PREFACE
Thank you for purchasing the LQFP-52P (0.65 mm pitch) *1 header board (model number :
MB2146-261) for the F
MB2146-261 is a header board used to connect the MCU board (model number : MB2146-301,
MB2146-303) which mounts the F
This manual explains the handling of the MB2146-261. Before using MB2146-261, be sure to read
this manual.
Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-produced MCUs and evaluation MCUs which correspond on MB2146-261.
MB2146-261 is an object about MCU with a built-in LCD controller.
*1 : The lead pitch of package (FPT-52P-M01) is 0.65 mm and the body size is 10 mm × 10 mm.
2
*2 : F
■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
MC is the abbreviation used for FUJITSU Flexible Microcontroller.
2
MC *2 -8FX family.
2
MC-8FX family evaluation MCU to a user system.
CAUTION
Cuts
Damage
Damage
The wrong use of a device will give an injury and may cause malfunction on customers system.
This product has parts with sharp points that are exposed.
Do not touch an edge of the product with your bare hands.
When connecting the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)
on the header board, otherwise the MCU board and user system might be damaged.
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
Copyright ©2006 FUJITSU LIMITED All rights reserved
ii
1. Product Outline
■ Product outline
MB2146-261 is a header board (referred to as header board) used to connect the MCU board (model
number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F
of Fujitsu 8-bit microcontrollers to a user system. To build an F
combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapter (model number : MB2146-09).
㪤㪙㪉㪈㪋㪍㪄㪇㪐
BGM adapter
Figure 1 System Configuration
2
2
MC-8FX evaluation environment,
MC-8FX family
MCU board
Header board
■ Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Name Description Remarks
2
F
MC-8FX
LQFP-52P (0.65 mm pitch)
header board
[Model number : MB2146-261]
[Model number : YQPACK052SB]
(Tokyo Eletech Corporation)
[Model number : NQPACK052SB]
(Tokyo Eletech Corporation)
[Model number : HQPACK052SB]
(Tokyo Eletech Corporation)
Name Description Remarks
Table 1 Product Cofiguration
Connector/LQFP52pin
(0.65 mm pitch) Package conversion
-
I/F between header board and NQPACK Accessory (connected)
For mounted on user system Accessory
Used when mounting mass production MCU
to NQPACK.
Accessory
Table 2 Options
BGM adapter
[Model number : MB2146-09]
MCU board
[Model number : MB2146-301, MB2146-303]
ICE unit for F
Built-in MB95FV100B-101,
MB95FV100B-103
2
MC-8FX
Built-in F
-
2
MC-8FX evaluation MCU *
* : Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies
the service conditions.
1
2. Checking the Delivered Product
Before using the MB2146-261, confirm that the following components are included
in the box:
• LQFP-52P (0.65 mm pitch) header board *
• Screws for securing header board (M2 × 10 mm, 0.4 mm pitch) : 4
• NQPACK052SB *
• HQPACK052SB *
2
3
• Operation manual (English version, this manual) : 1
*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts
YQPACK052SB.
*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied
with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK052SB-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can
be used by making an IC socket mounting hole on the user system board. For more information,
contact Tokyo Eletech Corporation.
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is
supplied with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .
3. Handling Precautions
1
: 1
: 1
: 1
The header board is precision-manufactured to improve the dimensional accuracy and to ensure a
reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct
use of the header board in the proper environment, observe the following:
• Avoid placing a stress on the NQPACK mounted on the user system board when connecting
the header board.
2
4. Notes on Designing
■ Notes on designing printed circuit board for the user system
When the header board is connected to the user system, some part mounted around the NQPACK in
the user system may be contacting the header board if the height of the part is tall. To prevent this,
design the printed circuit board for the user system so that the components do not exceed the height
shown in Figure 2. Figure 2 shows the dimension figure of the header board.
40.0 mm
㪉
㪈㪉㪇
㪈
㪚㪥㪉
㪈㪈㪐
40.0 mm
30.0 mm
㪬㪈
㪚㪥㪊
㪉
㪈㪉㪇
㪈
㪚㪥㪈
㪈㪈㪐
PCW-1-1-1PW
:MAC EIGHT
WR-120SB-VF-N1 : JAE *
WR-120SB-VF-N1 : JAE *
2
2
Approximately
1
13.0 mm *
YQPACK052SB
:Tokyo Eletech Corporation
NQPACK052SB
:Tokyo Eletech Corporation
U1: User system I/F connector
CN3: Incorrect insertion prevention socket
CN1/CN2: MCU board I/F connector
*1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged.
*2 : Japan Aviation Electronics Industry, Limited
Figure 2 Header Board Dimensions
3
■ MCU footprint design notes
Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed circuit board for the user system. Take the footprint in Figure 3 into consideration as well as the footprint of the mass production MCU when designing the printed circuit board for the user system.
To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever designing the printed circuit board.
No.1 Pin
0.65 mm
0.4 mm
2.0 mm
9.0 mm
13.0 mm
Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK
4
5. Connecting to the User System
■ Connecting
Mount the supplied NQPACK on the user system before using the MB2146-261.
1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut
linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) .
The pins of YQPACK are thin and easy to bend. Insert NQPACK after confirming that the pins
of YQPACK are not bent.
39
40
52
1
27
26
14
13
NQPACK index mark
Header board index mark
Figure 4 Index Position
2. Insert each screw for securing the header board into each of the four tapped holes on the header
board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the
screws, use the special screwdriver supplied with the NQPACK to equally tighten the four screws
in sequence. Tightening the screws too tight might result in a defective contact.
3. Connect the MCU board to the header board while being careful not to excessively force the NQ-
PACK. The MCU board can be connected to the header board only in the correct orientation as
they have an incorrect insertion prevention header socket to prevent a reverse connection. Figure
5 illustrates how the MCU board, header board, NQPACK, and user system are connected togeth-
er.
5
Connected
at shipment
MCU board
Evaluation
MCU
MCU board
Screws for securing
header board
Header board
■ Disconnection
YQPACK
NQPACK
User system
Figure 5 Connecting MCU Board/Header Board to User System
1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not
excessively forcing the junction with the NQPACK.
2. Remove all of the four screws from the header board. Pull out the header board vertically from
the NQPACK. Remove the header board slowly not excessively forcing the junction with the
NQPACK.
6
6. Mounting Mass Production MCUs
■ Mounting
To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)
(see “Figure 6”) .
1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQ-
PACK mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the
index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one
place only) .
The pins of HQPACK are thin and easy to bend. Insert NQPACK after confirming that pins of
HQPACK are not bent.
3. Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK, and then
tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with
the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight
might result in a defective contact.
Screws for securing HQPACK
■ Disconnection
HQPACK
Mass production MCU
NQPACK
User system
Figure 6 Mounting a Mass Production MCU
To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from
the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using
a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU
forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU
or break the NQPACK.
7
7. Product Specifications
■ General specifications
Table 3 lists the general specifications of the header board.
Table 3 General Specifications
Item Description
Operating temperature and storage temperature 5 °C to 35 °C (operation) , 0 °C to 40 °C (storage)
Operating humidity and storage humidity 20 % to 80 % (operation) , 20 % to 80 % (storage)
Dimensions
■ Main part
The main part of a header board is shown in Table 4.
Name Description
MCU board I/F connector
Incorrect insertion prevention socket
User target system I/F connector
■ Functional block diagram
A header board performs socket conversion between the MCU board I/F connector and YQPACK.
The header board does not contain any component such as an IC internally. Figure 7 shows the block
diagram.
Approximately 40 mm × 40 mm × 16 mm
(Height contains that of YQPACK and NQPACK)
Table 4 Main Part
120 pin, 0.5 mm pitch, 2-piece connector
(straight) × 2
[Model number : WR-120SB-VF-N1
(from Japan Aviation Electronics Industry, Limited) ]
2 pin, 2.54 mm pitch, 1-piece socket
(Straight)
[Model number : PCW-1-1-1PW (from MAC EIGHT) ]
Socket
52 pin, 0.65 mm pitch
[Model number : YQPACK052SB (from Tokyo Eletech Corporation) ]
MCU board I/F connector
User target system I/F connector
(Socket for package)
Figure 7 Functional Block Diagram
8
■ MCU board I/F connector (CN1, CN2, and CN3)
CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a
MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the
pin assignment of the MCU board I/F connector CN2 is shown in Table 6.
Table 5 Pin Assignment of the MCU Board I/F Connector CN1
Connector
Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Connector
Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Connector
Pin
Number
Evaluation
MCU Pin
Number
1 A9 PC4 41 E2 LVR3 81 P3 BSOUT
2 B9 PC1 42 E1 LVSS 82 P4 BDBMX
3 C9 PC2 43 F4 LVDREXT 83 R1 P83
4 D9 PC3 44 F3 LVDBGR 84 R2 BRSTX
5 A8 PC0 45 F2 LVDENX 85 R3 X0A
6 B8 PB4 46 F1 P22A 86 R4 RSTX
7 C8 PB5 47 - GND 87 T1 ROMS1
8 D8 PB6 48 - GND 88 T2 BSIN
9 A7 PB7 49 G4 P20A 89 T3 Vss
10 B7 PB2 50 G3 NC1 90 T4 X0
11 C7 PB0 51 G2 P21A 91 U1 BEXCK
12 D7 PB1 52 G1 P23A 92 U2 X1
13 A6 PB3 53 H4 P24A 93 U3 MOD
14 B6 PA2 54 H3 P25A 94 U4 PF2
15 C6 P95 55 H2 P26A 95 V1 X1A
16 D6 PA0 56 H1 P27A 96 V2 Vcc53
17 A5 PA3 57 J4 P24B 97 - GND
18 B5 P94 58 J3 P50 98 - GND
19 C5 P90 59 J2 P23B 99 V3 PINT0
20 D5 P91 60 J1 P51 100 V4 PSEL_EXT
21 A4 PA1 61 K1 P52 101 R5 PF1
22 A3 P93 62 K2 P55 102 T5 PF0
23 - GND 63 K3 P54 103 U5 NC2
24 - GND 64 K4 P53 104 V5 PENABLE
25 A2 CSVENX 65 L1 P70 105 R6 APBENX
26 A1 Vss 66 L2 P74 106 T6 PINT1
27 B4 P92 67 L3 P73 107 U6 PCLK
28 B3 TCLK 68 L4 P72 108 V6 PADDR0
29 B2 LVCC 69 M1 P71 109 R7 PACTIVE
30 B1 LVDIN 70 M2 P76 110 T7 PLOCK
31 C4 Cpin 71 M3 P80 111 U7 PWRITE
32 C3 Vcc51 72 M4 P77 112 V7 PADDR1
33 C2 LVDENX2 73 - GND 113 R8 PADDR2
34 C1 LVR4 74 - GND 114 T8 PADDR3
35 D4 TESTO 75 N1 P75 115 U8 PADDR4
36 D3 LVDOUT 76 N2 P82 116 V8 PADDR5
37 D2 LVR2 77 N3 PG0 117 R9 PADDR7
38 D1 BGOENX 78 N4 P84 118 T9 PRDATA0
39 E4 LVR1 79 P1 P81 119 U9 PADDR6
40 E3 LVR0 80 P2 ROMS0 120 V9 PRDATA1
Signal
name
9
Table 6 Pin Assignment of the MCU Board I/F Connector CN2
Connector
Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Connector
Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Connector
Pin
Number
Evaluation
MCU Pin
Number
1 A10 PC5 41 E17 NC4 81 P16 P34
2 B10 PD0 42 E18 SEL0 82 P15 P35
3 C10 PC6 43 F15 SEL3 83 R18 P44
4 D10 PC7 44 F16 SEL4 84 R17 P36
5 A11 PD1 45 F17 SEL1 85 R16 P31
6 B11 PD2 46 F18 P04C 86 R15 AVcc3
7 C11 PD3 47 - GND 87 T18 P40
8 D11 PD4 48 - GND 88 T17 P32
9 A12 PD5 49 G15 P06C 89 T16 AVss
10 B12 PD7 50 G16 P07C 90 T15 AVR
11 C12 P61 51 G17 P05C 91 U18 P33
12 D12 P60 52 G18 P00C 92 U17 P30
13 A13 PD6 53 H15 P01C 93 U16 AVR3
14 B13 P64 54 H16 P02C 94 U15 P15
15 C13 P66 55 H17 P03C 95 V18 AVcc
16 D13 P65 56 H18 P07A 96 V17 DA0
17 A14 P62 57 J15 P04A 97 - GND
18 B14 PE0A 58 J16 P05A 98 - GND
19 C14 PE3A 59 J17 P06A 99 V16 P14
20 D14 PE2A 60 J18 P03A 100 V15 P10
21 A15 P63 61 K18 P02A 101 R14 P16
22 A16 P67 62 K17 P07B 102 T14 DA1
23 - GND 63 K16 P01A 103 U14 P13
24 - GND 64 K15 P00A 104 V14 PWDATA7
25 A17 PE4A 65 L18 P06B 105 R13 P11
26 A18 Vcc54 66 L17 P05B 106 T13 P12
27 B15 PE1A 67 L16 P04B 107 U13 NC3
28 B16 PE5A 68 L15 P03B 108 V13 PWDATA3
29 B17 PE7A 69 M18 P02B 109 R12 PWDATA5
30 B18 PE3B 70 M17 P00B 110 T12 PWDATA6
31 C15 PE6A 71 M16 P46 111 U12 PWDATA4
32 C16 Vss 72 M15 P47 112 V12 PRDATA7
33 C17 PE2B 73 - GND 113 R11 PWDATA0
34 C18 PE7B 74 - GND 114 T11 PWDATA1
35 D15 PE1B 75 N18 P01B 115 U11 PWDATA2
36 D16 PE0B 76 N17 P43 116 V11 PRDATA6
37 D17 PE6B 77 N16 P41 117 R10 PRDATA3
38 D18 SEL2 78 N15 P42 118 T10 PRDATA4
39 E15 PE5B 79 P18 P45 119 U10 PRDATA5
40 E16 PE4B 80 P17 P37 120 V10 PRDATA2
Signal
name
10
■ User system I/F YQPACK (U1)
The pin assignment of user system I/F YQPACK in the header board is shown in Table 7.
Table 7 Pin Assignment of the User System I/F YQPACK in Header Board
Connector
Pin Number
Signal name
1 P61/S09/PPG11 27 V
2 P62/S10/TO10 28 Cpin
3 P63/S11/TO11 29 X1A
4 P64/S12/EC1 30 X0A
5 P65/S13/SCK 31 RSTX
6 P66/S14/SOT 32 P90/V3
7NC33NC
8 P67/S15/SIN 34 P91/V2
9 P14/PPG0 35 P92/V1
10 P13/TRG0/ADTG 36 P93/V0
11 P12/UCK0 37 P94/C0
12 P11/UO0 38 P95/C1
13 P10/UI0 39 PA0/COM0
14 P07/INT07/AN07 40 PA1/COM1
15 P06/INT06/AN06 41 PA2/COM2
16 P05/INT05/AN05 42 PA3/COM3
17 P04/INT04/AN04 43 PB0/S00
18 P03/INT03/AN03 44 PB1/S01
19 P02/INT02/AN02 45 PB2/S02
20 NC 46 NC
21 P01/INT01/AN01 47 PB3/S03/PPG00
22 P00/INT00/AN00 48 PB4/S04/PPG01
23 MO 49 PB5/S05/TO00
24 X0 50 PB6/S06/TO01
25 X1 51 PB7/S07/EC0
26 V
Connector
Pin Number
SS 52 P60/S08/PPG10
Signal name
CC
11
SS01-26015-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
2
F
MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-261
OPERATION MANUAL
April 2006 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited Business Promotion Dept.
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