Page 1
Technical Manual - English
Baseboard D3081, CPUMEMR D3131,
PCIR D3082 for PRIMERGY RX900 S1
Technical Manual
Edition August 2010
Page 2
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which complies with the requirements of the standard
DIN EN ISO 9001:2008.
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www.cognitas.de
Copyright and Trademarks
Copyright © 2010 Fujitsu Technology Solutions GmbH.
All rights reserved.
Delivery subject to availability; right of technical modifications reserved.
All hardware and software names used are trademarks of their respective manufacturers.
– The contents of this manual may be revised without prior notice.
– Fujitsu assumes no liability for damages to third party copyrights or other
rights arising from the use of any information in this manual.
– No part of this manual may be reproduced in any form without the prior written
permission of Fujitsu.
Microsoft, Windows, Windows Server, and Hyper V are trademarks or registered trademarks of
Microsoft Corporation in the USA and other countries.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries
in the USA and other countries.
Page 3
D3081, D3131, D3082 (RX900 S1) Technical Manual
Before reading this manual
For your safety
This manual contains important information for safely and correctly using this
product.
Carefully read the manual before using this product. Pay particular attention to
the accompanying manual "Safety Notes and Regulations" and ensure these
safety notes are understood before using the product. Keep this manual and the
manual "Safety Notes and Regulations" in a safe place for easy reference while
using this product.
Radio interference
This product is a "Class A" ITE (Information Technology Equipment). In a
domestic environment this product may cause radio interference, in which case
the user may be required to take appropriate measures. VCCI-A
Aluminum electrolytic capacitors
The aluminum electrolytic capacitors used in the product's printed circuit board
assemblies and in the mouse and keyboard are limited-life components. Use of
these components beyond their operating life may result in electrolyte leakage
or depletion, potentially causing emission of foul odor or smoke.
As a guideline, in a normal office environment (25°C) operating life is not
expected to be reached within the maintenance support period (5 years).
However, operating life may be reached more quickly if, for example, the product
is used in a hot environment. The customer shall bear the cost of replacing
replaceable components which have exceeded their operating life. Note that
these are only guidelines, and do not constitute a guarantee of trouble-free
operation during the maintenance support period.
High safety use
This product has been designed and manufactured for general uses such as
general office use, personal use, domestic use and normal industrial use. It has
not been designed or manufactured for uses which demand an extremely high
level of safety and carry a direct and serious risk to life or body if such safety
cannot be ensured.
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Technical Manual D3081, D3131, D3082 (RX900 S1)
These uses include control of nuclear reactions in nuclear power plants,
automatic airplane flight control, air traffic control, traffic control in mass
transport systems, medical devices for life support, and missile guidance control
in weapons systems (hereafter, "high safety use"). Customers should not use
this product for high safety use unless measures are in place for ensuring the
level of safety demanded of such use. Please consult the sales staff of Fujitsu if
intending to use this product for high safety use.
Measures against momentary voltage drop
This product may be affected by a momentary voltage drop in the power supply
caused by lightning. To prevent a momentary voltage drop, use of an AC
uninterruptible power supply is recommended.
(This notice follows the guidelines of Voltage Dip Immunity of Personal
Computer issued by JEITA, the Japan Electronics and Information Technology
Industries Association.)
Technology controlled by the Foreign Exchange and Foreign Trade
Control Law of Japan
Documents produced by Fujitsu may contain technology controlled by the
Foreign Exchange and Foreign Trade Control Law of Japan. Documents which
contain such technology should not be exported from Japan or transferred to
non-residents of Japan without first obtaining authorization in accordance with
the above law.
Harmonic Current Standards
This product conforms to harmonic current standard JIS C 61000-3-2.
Only for the Japanese market:
About SATA hard disk drives
The SATA version of this server supports hard disk drives with SATA / BC-SATA
storage interfaces. Please note that the usage and operation conditions differ
depending on the type of hard disk drive used.
Please refer to the following internet address for further information on the
usage and operation conditions of each available type of hard disk drive:
http://primeserver.fujitsu.com/primergy/harddisk/
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D3081, D3131, D3082 (RX900 S1) Technical Manual
Only for the Japanese market:
I Although described in this manual, some sections do not apply to the
Japanese market. These options and routines include:
– USB Flash Module (UFM)
– CSS (Customer Self Service)
– Replacing the lithium battery
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Technical Manual D3081, D3131, D3082 (RX900 S1)
Page 7
D3081, D3131, D3082 (RX900 S1) Technical Manual
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2 Important information . . . . . . . . . . . . . . . . . . . . . 11
2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2 CE certificate of conformity . . . . . . . . . . . . . . . . . . 14
2.3 Environmental protection . . . . . . . . . . . . . . . . . . . 15
3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.2.1 CPU Memory Riser (CPUMEMR) configuration . . . . . . . . . 23
3.2.1.1 DIMM slot population order . . . . . . . . . . . . . . . . . 24
3.2.1.2 DIMM slot population rules for mixed DIMM RANK . . . . . 25
3.2.1.3 QPI topology . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2.2 Memory configuration modes . . . . . . . . . . . . . . . . . . 30
3.2.2.1 Memory mirroring . . . . . . . . . . . . . . . . . . . . . . 30
3.2.2.2 Hemisphere mode . . . . . . . . . . . . . . . . . . . . . . 33
3.2.2.3 Memory interleaving . . . . . . . . . . . . . . . . . . . . . 34
3.2.3 Memory board configuration table . . . . . . . . . . . . . . . . 34
3.3 PCIe slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.3.1 PCI interrupt assignment . . . . . . . . . . . . . . . . . . . . 37
3.3.2 PCIe slot to CPUMEMR assignment . . . . . . . . . . . . . . 37
3.3.3 Expansion card configuration table . . . . . . . . . . . . . . . 40
3.4 I/O space . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.4.1 I/O space requirements . . . . . . . . . . . . . . . . . . . . . 42
3.4.2 I/O space limitation . . . . . . . . . . . . . . . . . . . . . . . 43
3.5 Screen resolutions . . . . . . . . . . . . . . . . . . . . . . . 48
3.6 Temperature / System monitoring . . . . . . . . . . . . . . . 48
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Technical Manual D3081, D3131, D3082 (RX900 S1)
Contents
3.7 Connectors and indicators . . . . . . . . . . . . . . . . . . . 49
3.7.1 Onboard connectors and indicators . . . . . . . . . . . . . . . . 50
3.7.1.1 Baseboard D3081 . . . . . . . . . . . . . . . . . . . . . . 50
3.7.1.2 CPU Memory Riser (CPUMEMR) D3131 . . . . . . . . . . . 53
3.7.1.3 PCI Riser (PCIR) D3082 . . . . . . . . . . . . . . . . . . . 54
3.7.1.4 I/O board . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.7.2 Onboard DIP switch . . . . . . . . . . . . . . . . . . . . . . . . 55
3.7.3 External connectors and indicators . . . . . . . . . . . . . . . . 57
3.7.3.1 Baseboard D3081 . . . . . . . . . . . . . . . . . . . . . . . 57
3.7.3.2 I/O board . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4 Replacing the lithium battery . . . . . . . . . . . . . . . . . . 63
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D3081, D3131, D3082 (RX900 S1) Technical Manual 9
1 Introduction
This technical manual describes the key characteristics and the board layout of
the boards for the PRIMERGY RX900 S1 server. The basic elements of this
server are the Baseboard D3081, 4 to 8 CPU Memory Risers (CPUMEMR)
D3131, and the PCI Riser (PCIR) D3082.
For additional driver information (if available), refer to the Readme files located
on the server hard disk and on the supplied DVDs, see Installation DVD of
ServerView Suite - ServerView Software Products.
You will find detailed information about the BIOS setup in the "D3081 BIOS
Setup Utility for RX900 S1" manual.
I PRIMERGY manuals are available in PDF format on the
ServerView Suite DVD 2. The ServerView Suite DVD 2 is part of the
ServerView Suite supplied with every server.
PRIMERGY Abbreviations and Glossary can also be found on the
ServerView Suite DVD 2.
Notational conventions
The following notational conventions are used in this manual:
Text in italics indicates commands or menu items.
"Quotation marks" indicate names of chapters and terms that are being
emphasized.
Ê describes activities that must be performed in the order
shown.
V CAUTION! pay particular attention to texts marked with this symbol.
Failure to observe this warning may endanger your life,
destroy the system or lead to the loss of data.
I indicates additional information, notes and tips.
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10 Technical Manual D3081, D3131, D3082 (RX900 S1)
Introduction
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D3081, D3131, D3082 (RX900 S1) Technical Manual 11
2 Important information
In this chapter you will find essential information regarding safety when working
with your server.
V CAUTION!
With the system board installed you must open the system to access the
system board. How to access the system board of your system is
described in the appropriate maintenance manual (except for the
Japanese market).
When handling the system board, refer to the specific notes on safety in
the operating manual and/or maintenance manual for the respective
server.
2.1 Notes on safety
V CAUTION!
● The actions described in these instructions should only be performed
by authorized, qualified personnel. Equipment repairs should only be
performed by qualified staff. Any failure to observe the guidelines in
this manual, and any unauthorized openings and improper repairs
could expose the user to risks (electric shock, fire hazards) and could
also damage the equipment. Please note that any unauthorized
openings of the device will result in the invalidation of the warranty
and exclusion from all liability.
● Transport the device only in the antistatic original packaging or in
packaging that protects it from knocks and jolts.
● Only install expansions that are allowed for the system board. If you
install other expansions, you may damage the requirements and rules
governing safety and electromagnetic compatibility or your system.
Information on which system expansions are approved for installation
can be obtained from our customer service center or your sales
outlet.
● The warranty expires if the device is damaged during the installation
or replacement of system expansions.
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12 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
V CAUTION!
● Components can become very hot during operation. Ensure you do
not touch components when making extensions to the system board.
There is a danger of burns!
● Transmission lines to peripheral devices must be adequately
shielded.
● Ethernet cabling has to comply with EN 50173 and EN 50174-1/2
standards or ISO/IEC 11801 standard respectively. The minimum
requirement is a Category 5 shielded cable for 10/100 Ethernet, or
Category 5e for Gigabit Ethernet.
● Never connect or disconnect data transmission lines during a storm
(risk of lightning hazard).
Batteries
V CAUTION!
● Incorrect replacement of batteries may lead to a risk of explosion. The
batteries may only be replaced with identical batteries or with a type
recommended by the manufacturer (this information doesn’t apply to
the Japanese market).
It is essential to observe the instructions in the chapter "Replacing the
lithium battery".
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D3081, D3131, D3082 (RX900 S1) Technical Manual 13
Important information
Modules with Electrostatic-Sensitive Devices
Modules with electrostatic-sensitive devices are identified by the following
sticker:
Figure 1: ESD label
When you handle components fitted with ESDs, you must always observe the
following points:
● Switch off the system and remove the power plugs from the power outlets
before installing or removing components with ESDs.
● You must always discharge static build-up (e.g. by touching a grounded
object) before working with such components.
● Any devices or tools that are used must be free of electrostatic charge.
● Wear a suitable grounding cable that connects you to the external chassis of
the system unit.
● Always hold components with ESDs at the edges or at the points marked
green (touch points).
● Do not touch any connectors or conduction paths on an ESD.
● Place all the components on a pad which is free of electrostatic charge.
I For a detailed description of how to handle ESD components, see the
relevant European or international standards (EN 61340-5-1,
ANSI/ESD S20.20).
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14 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
Notes about boards
● During installation/deinstallation of the board, observe the specific
instructions described in the maintenance manual for the respective server.
● Shut down the server and disconnect the power plug, before you make
modifications on an installed board.
● To prevent damage to the board, the components and conductors on it,
please take great care when you insert or remove boards. Take great care
to ensure that extension boards are slotted in straight, without damaging
components or conductors on the board, or any other components, for
example EMI spring contacts.
● Be careful with the locking mechanisms (catches, centring pins etc.) when
you replace the system board or components on it, for example memory
modules or processors.
● Never use sharp objects (screw drivers) for leverage.
● Do not damage or modify internal cables or devices. Doing so may cause a
device failure, fire, or electric shock.
● Do not touch the circuitry on boards or soldered parts. Hold the metallic
areas or the edges of the circuit boards.
2.2 CE certificate of conformity
The board complies with the requirements of the EC directives
2004/108/EC regarding “Electromagnetic Compatibility” and
2006/95/EC “Low Voltage Directive”. This is indicated by the CE
marking (CE = Communauté Européenne).
Compliance was tested in a typical PRIMERGY configuration.
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D3081, D3131, D3082 (RX900 S1) Technical Manual 15
Important information
2.3 Environmental protection
Environmentally-friendly product design and development
This product has been designed in accordance with the Fujitsu standard for
"environmentally friendly product design and development". This means that
key factors such as durability, selection and labeling of materials, emissions,
packaging, ease of dismantling and recycling have been taken into account.
This saves resources and thus reduces the harm done to the environment.
Further information can be found at:
– http://ts.fujitsu.com/products/standard_servers/index.html (for the EMEA
market)
– http://primeserver.fujitsu.com/primergy/concept/ (for the Japanese market)
Energy-saving information
Devices that do not need to be constantly switched on should be switched off
until they are needed as well as during long breaks and after completion of work.
Packaging information
This packaging information doesn’t apply to the Japanese market.
Do not throw away the packaging. You may need it later for transporting the
system. If possible, the equipment should only be transported in its original
packaging.
Information on handling consumables
Please dispose of printer consumables and batteries in accordance with the
applicable national regulations.
In accordance with EU directives, batteries must not be disposed of with
unsorted domestic waste. They can be returned free of charge to the
manufacturer, dealer or an authorized agent for recycling or disposal.
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16 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
All batteries containing pollutants are marked with a symbol (a crossed-out
garbage can). They are also marked with the chemical symbol for the heavy
metal that causes them to be categorized as containing pollutants:
Cd Cadmium
Hg Mercury
Pb Lead
Labels on plastic casing parts
Please avoid sticking your own labels on plastic parts wherever possible, since
this makes it difficult to recycle them.
Returns, recycling and disposal
Please handle returns, recycling and disposal in accordance with local
regulations.
Details regarding the return and recycling of devices and consumables within
Europe can also be found in the "Returning used devices" manual, via your local
Fujitsu branch or from our recycling center in Paderborn:
Fujitsu Technology Solutions
Recycling Center
D-33106 Paderborn
Tel. +49 5251 8 18010
Fax +49 5251 8 333 18010
The device must not be disposed of with domestic waste. This
device is labeled in compliance with European directive
2002/96/EC on waste electrical and electronic equipment (WEEE).
This directive sets the framework for returning and recycling used
equipment and is valid across the EU. When returning your used
device, please use the return and collection systems available to
you. Further information can be found at
http://ts.fujitsu.com/recycling.
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D3081, D3131, D3082 (RX900 S1) Technical Manual 17
3 Features
3.1 Overview
This section provides an overview of the key characteristics for the baseboard
D3081, the CPU Memory Risers (CPUMEMRs) D3131, and the PCI Riser
(PCIR) D3082.
Processors
● Up to 8 Intel Xeon® X7500/E7500 series processors (up to 130 W); one
processor per CPUMEMR
● 4 Intel QuickPath Interconnects; up to 6,4 GT/s in each direction
● Hyper-Threading technology; except X7542 processors
● Up to 2.0 MB L2 cache and 24 MB L3 cache (Nehalem-EX)
Main memory
● Up to 128 slots for DDR3 memory modules (1333 MHz) with 2 GB, 4 GB,
8 GB, and 16 GB capacity; 16 slots per CPUMEMR
● 4 SMI links per CPU and up to 4 DDR3 DIMM memory modules per SMI link;
memory modules connected to CPU via memory buffer named Millbrook;
Intel® Scalable Memory Interconnect (SMI) link connects CPU and
Millbrook
● Maximum configuration: 2 TB memory with availability of 16 GB memory
modules
● Basic configuration: 32 GB memory; 4 CPUMEMRs with 4 memory modules
per CPUMEMR
● Maximum 32 Gbit/s band width (DDR3)
● Hardware memory scrubbing
● Single Device Data Correction (SDDC) function (Chipkill™)
● Memory interleaving function
● Memory mirroring function
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18 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Chipset devices on the baseboard
● Intel Xeon® 7500 platform:
– 4x Boxboro-EX® I/O Hubs
– Intel Southbridge ICH10R
– ServerEngines® Pilot II®
– 3x GbE dual channel LAN controller (Kawela)
– 1x 10 GbE dual channel LAN controller (Niantec)
Internal connectors
● 1x SATA connector
● 1x USB 2.0 connector
● 1x Trusted Platform Module (TPM)
● 1x USB Flash Module (UFM)
External connectors
● Front side:
– 1x video connector
– 3x USB 2.0 connectors
● Rear side:
– 2x 10 GB SFP+ System LAN connectors
– 5x 1 GB 1000Base-T System LAN connectors
– 1x 1 GB 1000Base-T Shared LAN connector
– 1x 100 MB 100Base-TX Management LAN connector
– I/O board:
– 1x serial connector
– 4x USB 2.0 connectors
– 1x video connector
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D3081, D3131, D3082 (RX900 S1) Technical Manual 19
Features
PCIe slots
● Baseboard
– 4x PCI Express 2.0 slots (x8 connector) with PCI Hot-Plug (PHP)
capability
– 4x PCI Express 2.0 slots (x8 connector) without PHP capability
– 1x PCI Express 2.0 slots (x4 connector) without PHP capability
– 1x PCI Express 2.0 slots (x8 connector) without PHP capability for a
Modular RAID controller
● PCI Riser
– 6x PCI Express 2.0 slots (x8 connector) without PHP capability
– 1x PCI Express 2.0 slots (x4) without PHP capability
Server management controller iRMC S2
The following features are integrated into iRMC S2:
● Server class Super I/O (SIO)
● Remote KVMS
● Baseboard Management Controller (BMC) including the following
functionality:
– 250MHz 32-bit ARM9 processor
–IPMI 2.0
–6x I2C SMBus
– Two 10/100 Ethernet controllers with RMII support
– LPC ROM interface
– SPI Flash interface
– USB Device
– One Serial Port
– Three UART interfaces
– DDR2 16-bit 667 MHz memory
– Chassis intrusion logic
– PWM Control and Fan Tach Monitor
– Voltage Level Monitor and Temperature Monitor
– Real-Time Clock (RTC)
– Two Watchdog Timers
– System and Clock Control
– Three Multi-Purpose Timers
– Interrupt Controller
–JTAG interface
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20 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
● Graphics controller including the following features:
– Integrated Graphics Core
– 2D hardware graphics acceleration
– DDR2 memory interface supports up to 128 MB of memory
– Supports all display resolutions up to 1600x1200 16bpp @ 75Hz
– High-speed integrated 24-bit RAMDAC
– Single-lane PCI Express host interface
LAN GbE controller Intel 82576
This controller supports the following features:
● Two connector standard IEEE 802.3 Ethernet interface for 10BASE-T,
100BASE-TX, and 1000BASE-T (802.3, 802.3u, and 802.3ab) applications.
● Serializer-Deserializer (SerDes) to support 1000BASE-SX/LX (optical fiber)
and gigabit backplane applications.
● SGMII for external PHY or SFP module.
● Management of MAC and PHY Ethernet layer functions.
● Management of PCI Express packet traffic across its transaction, link, and
physical/logical layers.
● External SPI (4-wire) serial interface to Flash EEPROM devices up to 8 MB
memory.
● NI-SI / SMBus interface to BMC
● Wake on LAN
● SR-IOV for virtulization on Intel NIC
10 GbE LAN controller Intel 82599
This controller supports the following features:
● Remote PXE boot
● iSCSI/iBOOT(SW) support as standard
● VT-c support as standard
● Adapter fault tolerance, Load Balancing and Switch fault tolerance in
combination with existing GB PCIe card is supported, based on the
functionality (SW Kit) of onboard GB LAN controllers.
● Single root I/O virtualization (SR-IOV) for virtualization on Intel NIC.
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D3081, D3131, D3082 (RX900 S1) Technical Manual 21
Features
BIOS features
● ROM based setup utility
● BIOS settings save and restore
● Local BIOS update from USB device
● SMBIOS V2.4
● Remote PXE boot support
● Remote iSCSI boot support
Environmental protection
● Battery in holder for recycling
Power management
● Sleep states S0, S1, S4, S5
● ACPI 3.0
CSS (Customer Self Service)
I This feature is not available for the japanese market.
This system board supports the CSS functionality. You will find a description of
CSS functionality in the maintenance manual of your server.
USB Flash Module
The baseboard can be equipped with a USB Flash Module (UFM). The module
can be used as optional memory for software (e.g. VMware) or as a software
dongle.
TPM
The baseboard can be equipped with a Trusted Platform Module (TPM). This
module enables programs from third party manufacturers to store key
information (e.g. drive encryption using Windows Bitlocker Drive Encryption).
The TPM is activated via the BIOS system, see the "D3081 BIOS Setup Utility
for RX900 S1" manual.
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22 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
V CAUTION!
– When using the TPM, note the program descriptions provided by the
third party manufacturers.
– You must also create a backup of the TPM content. To do this, follow
the third party manufacturer's instructions. Without this backup, if the
TPM or the baseboard is faulty you will not be able to access your
data.
– If a failure occurs, please inform your service about the TPM
activation before it takes any action, and be prepared to provide them
with your backup copies of the TPM content.
3.2 Main memory
The baseboard can be equipped with 4 to 8 CPU Memory Risers
(CPUMEMRs). Each CPUMEMR includes one processor and can be equipped
with up to 16 DIMM memory modules.The DIMM slots are suitable for 2 GB,
4 GB, 8 GB, and 16 GB DDR3 DIMM modules with 1333 MHz. Thus, the system
supports a maximum memory configuration of 2 TB with availability of 16 GB
DIMM modules.
ECC with memory scrubbing and the single-device data correction (SDDC)
function are standard. There is no support for non-ECC-DIMMs.
Basically, the memory modules of an individual CPUMEMR are assigned to the
processor installed on this CPUMEMR. However, every CPU can access the
memory modules installed on all other CPUMEMRs via the corresponding
CPUs, see figure 3.
The basic configuration includes four CPUMEMRs. This configuration can be
expanded in two steps. Each steps includes two additional CPUMEMRs. In the
4 and 6 CPUMEMR configurations, an air duct is installed in an empty slot.
Ta b le 1 shows the population order for CPUMEMRs.
Number of
CPUMEMRs
Population
order
CPUMEMR position Air duct position
4 1 #1 + #2 + #3 + #4 #6
6 2 #5 + #6 #8
8 3 #7 + #8 --
Table 1: Population order for CPUMEMRs
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D3081, D3131, D3082 (RX900 S1) Technical Manual 23
Features
3.2.1 CPU Memory Riser (CPUMEMR) configuration
The memory modules are connected to the CPU by a memory buffer named
Millbrook. There are 4 Milbrooks and 8 DDR channels available on the
CPUMEMR to accommodate up to 16 DIMM memory modules. Each Millbrook
has two DDR channels and two DIMM memory modules are connected to each
channel.
The DIMM slot number is defined as 2 characters:
● First digit ("1" or "2")
Sequence number within the same DDR3 channel
● Second digit ("A" to "H")
DDR3 channel number on an individual CPUMEMR
Example:
DIMM 1A = DIMM 0, channel 0; DIMM 1B = DIMM 0, channel 0
DIMM 2A = DIMM 1, channel 0; DIMM 2B = DIMM 1, channel 0
Ta bl e 2 shows the relation between the DIMM slot number, the Millbrook
identifier, the DDR channel number, and the DIMM memory module number
within the same DDR channel.
DIMM slot
number
Millbrook
identifier
DDR
channel
number
DIMM memory module
number within the
same DDR channel
1H C 1 0
2H C 1 1
1G C 0 0
2G C 0 1
2E D 0 1
1E D 0 0
2F D 1 1
1F D 1 0
1D A 1 0
Table 2: DIMM memory module connection on the CPUMEMR
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24 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.2.1.1 DIMM slot population order
CPUMEMRs are populated in four steps. In each step, four DIMM memory
modules are added. At least four DIMM memory modules must be installed on
CPUMEMR #1 and #2. CPUMEMRs #3 to #8 can be left empty.
Ta b le 3 shows the DIMM slot population order for an individual CPUMEMR and
figure 2 maps the population order to the location of the DIMM slots on the
CPUMEMR.
2D A 1 1
1C A 0 0
2C A 0 1
2A B 0 1
1A B 0 0
2B B 1 1
1B B 1 0
Population order DIMM position
1 1B + 1D + 1F + 1H
2 1A + 1C+ 1E + 1G
3 2B + 2D + 2F + 2H
4 2A + 2C + 2E + 2G
Table 3: DIMM memory module population order for an individual CPUMEMR
DIMM slot
number
Millbrook
identifier
DDR
channel
number
DIMM memory module
number within the
same DDR channel
Table 2: DIMM memory module connection on the CPUMEMR
Page 25
D3081, D3131, D3082 (RX900 S1) Technical Manual 25
Features
Figure 2: DIMM slot population order for an individual CPUMEMR
3.2.1.2 DIMM slot population rules for mixed DIMM RANK
Basic configuration rules for populating the two slots associated with the same
DDR3 channel are:
● The slot with the lower sequence number is populated first.
● 1RANK- and 2RANK-DIMM memory modules can be inserted in both slots.
● 4RANK-DIMM memory modules must be installed in the slot with the lower
sequence number or in both slots.
B1C
1D
1E
1F
1G
1H
1A
1B
B
2C
2D
2E
2F
2G
2H
2A
2B
#A#B
#C
#D
C
I
C
I
C
I
C
I
C
J
C
J
C
J
C
J
C
K
C
L
Page 26
26 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Ta b le 4 shows the supported DIMM configurations with mixed DIMM RANK.
DIMM# x/2 DIMM# x/1
4 Rank 4 Rank
2 Rank 4 Rank
1 Rank 4 Rank
not installed 4 Rank
2 Rank 2 Rank
1 Rank 2 Rank
not installed 2 Rank
2 Rank 1 Rank
1 Rank 1 Rank
not installed 1 Rank
not installed not installed
Table 4: Supported DIMM configurations with mixed DIMM RANK
Page 27
D3081, D3131, D3082 (RX900 S1) Technical Manual 27
Features
3.2.1.3 QPI topology
The server uses an interconnect "Intel® QuickPath Interconnect (QPI)" for the
connection between the CPUs and CPU I/O Hubs (IOH). Each CPU has 4 QPI
ports and the IOH has 2 QPI ports. Figure 3 shows the QPI topology where the
numbers (0, 1; 0, 1, 2, 3) indicate the QPI port number of the CPU/IOH.
Figure 3: QPI topology
Initially, the RX900 S1 can be configured with 4, 6, or 8 CPUMEMRs and each
CPUMEMR includes one CPU. If one of the CPUs is removed, the system uses
all of the remaining CPUs that form a consistent QPI topology. If removing one
CPU would result in an unsupported configuration, the system uses the next
supported configuration and CPUs not included in this configuration are set to
"disabled". As soon as the removed CPU has been reinstalled, the system
enables all those disabled CPUs that are needed to form the next supported
configuration.
CPU
#1
CPU
#4
CPU
#7
CPU
#5
CPU
#2
CPU
#3
CPU
#6
IOH
#1
IOH
#2
IOH
#3
IOH
#4
0
1
0
10
1
0
1
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
CPU
#8
Page 28
28 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Ta b le 5 lists the supported configurations and the transitions between
configurations if a CPU is removed. In this table, "x" indicates that a CPU
position is populated.
Figure 4 shows the transitions between QPI scenarios depending on the
position of the CPU that has been removed. Configurations with one to three
CPUs are not to be understood as minimum configurations. They may occur
due to the removal of CPUMEMRs.
Conf. Total
number
of CPUs
CPU number Transition table of removed CPU
and next conf.
123456781 2 3 4 5 6 7 8
C1-1 1 x
C1-2 1 x C1-2 C1-1
C2 2 x x C1-2 C1-1
C3 3 x x x C1-2 C1-1 C2
C4 4 x x x x C1-2 C1-1 C2 C3
C6 6 xxxxxx C1-2 C1-1C2 C4
C8 8 xxxxxxxxC1-2C1-1C2 C4 C6
Table 5: Supported CPU configurations and transitions between the configurations
Page 29
D3081, D3131, D3082 (RX900 S1) Technical Manual 29
Features
Figure 4: QPI topology transitions
CPU
#1
CPU
#4
CPU
#7
CPU
#5
CPU
#2
CPU
#3
CPU
#6
IOH
#1
IOH
#2
IOH
#3
IOH
#4
0
1
0
10
1
0
1
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
CPU
#8
CPU
#1
CPU
#4
CPU
#7
CPU
#5
CPU
#2
CPU
#3
CPU
#6
IOH
#1
IOH
#2
IOH
#3
IOH
#4
0
1
0
10
1
0
1
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
1
2
3
0
CPU
#8
CPU
#1
CPU
#4
CPU
#2
CPU
#3
IOH
#1
IOH
#2
0
10
1
1
2
3
02
3
0
1
3
0
1
2
3
0
CPU
#1
CPU
#2
CPU
#3
IOH
#1
0
1
1
2
3
0
1
3
0
1
2
3
0
2
2
C8
C6
C4
C3
CPU
#1
CPU
#2
IOH
#1
0
1
1
2
3
0
1
2
3
0
C2
CPU
#2
IOH
#1
0
1
1
2
3
0
C1-2
CPU
#1
IOH
#1
0
1
1
2
3
0
C1-1
CPU#4 empty
CPU#3 empty
CPU#3
empty
CPU#3
empty
CPU#3
empty
CPU#1
empty
CPU#2
empty
CPU#5 empty
CPU#7 or #8
empty
CPU#4 empty
CPU#5 or #6
empty
CPU#4
empty
Page 30
30 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.2.2 Memory configuration modes
The RX900 S1 supports the following memory configuration modes:
● "Memory mirroring" on page 30
● "Hemisphere mode" on page 33
● "Memory interleaving" on page 34
3.2.2.1 Memory mirroring
The mirroring mode is set by the system and depends on the CPUMEMR
configuration:
● Intra-CPU memory mirroring for a 4 CPUMEMR configuration
● Inter-CPU memory mirroring for 6 and 8 CPUMEMR configurations
In mirroring mode, the size of the memory modules must be the same within the
following groups of DIMM slots, see figure 5:
● DIMM# (1B, 1D, 1F, 1H)
● DIMM# (1A, 1C, 1E, 1G)
● DIMM# (2B, 2D, 2F, 2H)
● DIMM# (2A, 2C, 2E, 2G)
Figure 5: Grouping of DIMM slots for memory mirroring
B1C
1D
1E
1F
1G
1H
1A
1B
B
2C
2D
2E
2F
2G
2H
2A
2B
Page 31
D3081, D3131, D3082 (RX900 S1) Technical Manual 31
Features
Intra-CPU memory mirroring for a 4 CPUMEMR configuration
In a 4 CPUMEMR configuration, memory mirroring is configured within an
individual CPUMEMR. Figure 6 shows intra-CPU memory mirroring where the
memory modules 1B to 1D (light grey color) are mapped to the memory
modules 1F to 1H (green color).
Figure 6: Memory mirroring in a 4 CPUMEMR configuration
Inter-CPU memory mirroring for 6 and 8 CPUMEMR configurations
In a 6 or 8 CPUMEMR configuration, memory mirroring is configured between
pairs of CPUMEMRs. Figure 7 shows the CPUMEMR mirroring pairs (1,2),
(3,4), (5,6), (7,8) where each pair consists of a green and a light grey
CPUMEMR.
B1C
1D
1E
1F
1G
1H
1A
1B
B
2C
2D
2E
2F
2G
2H
2A
2B
Page 32
32 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Figure 7: Memory mirroring in a 6 or 8 CPUMEMR configuration
On both CPUMEMRs of the mirroring pair, the size of the DIMMs must be the
same within the following groups of memory modules, see figure 5:
● DIMM# (1B, 1D, 1F, 1H)
● DIMM# (1A, 1C, 1E, 1G)
● DIMM# (2B, 2D, 2F, 2H)
● DIMM# (2A, 2C, 2E, 2G)
Scenarios for memory mirroring interruption
If failed or disabled DIMM memory modules are detected, the impact on the
mirroring configuration is:
1. A group of DIMM memory modules is deactivated:
– 4 CPU configuration: 2 DIMM memory modules
– 6 or 8 CPU configuration: 4 DIMM memory modules
2. If the active DIMM memory modules do not form a valid mirroring
configuration due to lacking mirroring pairs, the BIOS boots without mirroring
configuration.
3. If the active DIMM memory modules form a valid mirroring configuration, the
BIOS keeps mirroring configuration with the remaining DIMM memory
modules.
Page 33
D3081, D3131, D3082 (RX900 S1) Technical Manual 33
Features
Figure 8 shows example scenarios for a 4 CPUMEMR configuration with intra-
CPUMEMR mirroring in the event of DIMM failure and/or deactivation.
Figure 8: Intra-CPUMEMR mirroring scenarios after DIMM module failure/deactivation
3.2.2.2 Hemisphere mode
The Nehalem-EX CPU has two memory-controller modes:
● 1 - 4 CPU configuration: Non-Hemisphere mode
● 5 - 8 CPU configuration: Hemisphere mode
In hemisphere mode, the address space of a CPU is subdivided into two
sections called upper and lower hemisphere. Data is distributed over these two
sections for better performance.
As hemisphere mode is used for configurations with more than 4 CPUs, an even
number of CPUs is necessary to configure memory-mirroring.
OK
OK
Disabled
OK
OK
OK
OK
OK
OK
Failed
Failed
OK
OK
OK
OK
OK
OK
Failed
OK
OK
OK
OK
OK
OK
Disabled
Disabled
OK
OK
OK
OK
Disabled
Disabled
Disabled
Failed
DIMM
failure
DIMM
disabled
Mirroring pair
Disabled
Failed
Memory mirroring
enabled
Memory mirroring
disabled
Memory mirroring
disabled
Page 34
34 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.2.2.3 Memory interleaving
In Interleaving mode, the physical memory address is decoded at a specific bit
and is sliced into several memory controllers. Interleaving mode is supported by
default.
3.2.3 Memory board configuration table
Ta b le 6 shows the DIMM slot population order and the mapping of DIMM slots
to CPUs and IOHs for 4, 6, and 8 CPUMEMRs.
CPU
No.
DIMM
slot
pop.
order
4 CPUMEMRs 6 CPUMEMRs 8 CPUMEMRs IOH
No.
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
CPU#11 x ------x ------x------#1
2 x x ----x x ----x x ---3 xxx--xxx--xxx-4 xxxxxxxxxxxx
CPU#21 x ------x ------x------#1
2 x x ----x x ----x x ---3 xxx--xxx--xxx-4 xxxxxxxxxxxx
CPU#3 0 -- -- -- -- -- -- -- -- -- -- -- -- #2
1 x -- -- -- x -- -- -- x -- -- -2 x x ----x x ----x x ---3 xxx--xxx--xxx-4 xxxxxxxxxxxx
Table 6: DIMM slot population order and mapping of DIMM slots to I/O Hubs and CPUs
Page 35
D3081, D3131, D3082 (RX900 S1) Technical Manual 35
Features
CPU#4 0 -- -- -- -- -- -- -- -- -- -- -- -- #2
1 x -- -- -- x -- -- -- x -- -- -2 xx----xx----xx---3 xxx--xxx--xxx-4 xxxxxxxxxxxx
CPU#5 0 -- -- -- -- -- -- -- -- -- -- -- -- #3
1 --------x------x -----2 --------x x ----x x ---3 --------x x x --x x x-4 --------x x x x x x xx
CPU#6 0 -- -- -- -- -- -- -- -- -- -- -- -- #3
1 --------x ------x -----2 --------x x ----x x ---3 --------x x x --x x x-4 --------x x x x x x xx
CPU#7 0 -- -- -- -- -- -- -- -- -- -- -- -- #4
1 ----------------x -----2 ----------------x x ---3 ----------------x x x-4 ----------------x x xx
CPU#8 0 -- -- -- -- -- -- -- -- -- -- -- -- #4
1 ----------------x -----2 ----------------x x ---3 ----------------x x x-4 ----------------x x xx
CPU
No.
DIMM
slot
pop.
order
4 CPUMEMRs 6 CPUMEMRs 8 CPUMEMRs IOH
No.
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
1B
1D
1F
1H
1A
1C
1E
1G
2B
2D
2F
2H
2A
2C
2E
2G
Table 6: DIMM slot population order and mapping of DIMM slots to I/O Hubs and CPUs
Page 36
36 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.3 PCIe slots
Figure 9 shows the PCIe slots (C) and (G) on the PCI Riser (A) and the
baseboard (E). The PCI Riser (PCIR) is connected to the baseboard via the
PCIR connectors (D; F). Faulty PCI cards can be detected in all PCIe slots via
the CSS indicators (B) and (H). In addition, PCI hot-plug slots are equipped with
the indicator (I).
Figure 9: PCIe slots on the PCI Riser (A) and the baseboard (E; only PCI part is shown)
12
3
46
75
C
A
C
B
C
C
C
D
C
G
C
H
C
I
C
H
C
H
C
H
C
H
C
H
C
H
C
H
C
H
C
H
C
I
C
I
C
I
#" $
!
C
E
C
F
Page 37
D3081, D3131, D3082 (RX900 S1) Technical Manual 37
Features
3.3.1 PCI interrupt assignment
The BIOS assigns the PCI interrupts automatically. Further settings are not
possible.
3.3.2 PCIe slot to CPUMEMR assignment
Figure 10 shows the assignment of PCIe slots to the 4 I/O Hubs and the 4 - 8
CPUMEMRs.
I Before adding an expansion card, check carefully whether this PCIe slot
is supported with the CPUMEMR configuration of the individual server.
Pos. Slot no. Description Hot-plug
A PCI Riser (PCIR)
C #5 PCI Express 2.0 (x4), 1/2 length, x8 connector no
C #1, #2, #3,
#4, #6, #7
PCI Express 2.0 (x8), 1/2 length, x8 connector no
E Baseboard
G 8 PCI Express 2.0 (x8), 1/2 length, x8 connector
for modular RAID controller only
no
G #9, #10,
#11, #12
PCI Express 2.0 (x8), 1/2 length, x8 connector yes
G #13, #14,
#15, #16
PCI Express 2.0 (x8), 1/2 length, x8 connector no
G #17 PCI Express 2.0 (x4), 1/2 length, x8 connector no
Page 38
38 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Figure 10: Assignment of PCIe slots to CPUMEMRs
Figure 10 lists the mapping of PCIe slots to I/O Hubs and CPUs.
CPU
#8
CPUMEMR
#8
CPU
#7
CPUMEMR
#7
IOH#4
CPUMEMR
#1
CPU
#1
CPU
#2
CPUMEMR
#2
IOH#1
CPU
#4
CPUMEMR
#4
CPU
#3
CPUMEMR
#3
IOH#2
CPU
#6
CPUMEMR
#6
CPU
#5
CPUMEMR
#5
IOH#3
PCIe
#17
PCIe
#7
PCIe
#8
PCIe
#9
PCIe
#10
PCIe
#11
PCIe
#12
PCIe
#13
PCIe
#14
PCIe
#15
PCIe
#16
PCIe
#2
PCIe
#1
PCIe
#5
PCIe
#6
PCIe
#4
PCIe
#3
Modular
RAID
Hot-plug PCI
PCIR
x8
x8x8 x8
x8
x8 x8x4
x8
x8
x8 x8 x8 x8 x8 x8 x4
Page 39
D3081, D3131, D3082 (RX900 S1) Technical Manual 39
Features
CPU population order CPU - IOH
mapping
Connected
devices
Remark
4 CPUs 6 CPUs 8 CPUs CPU
No.
IOH
No.
CPU#1 x x x #1 or #2#1 ICH10 PCIe #5 to
BMC
CPU#2 x x x BMC (VGA)
GbE#1,
GbE#2,
GbE#3,
10GbE#1
PCIe slot #8 Modular
RAID
PCIe slot #1 PCI Riser
PCIe slot #2 PCI Riser
CPU#3 x x x #3 or #4#2 PCIe slot #5 PCI Riser;
Gen2x4
CPU#4 x x x PCIe slot #3 PCI Riser
PCIe slot #4 PCI Riser
PCIe slot #6 PCI Riser
PCIe slot #7 PCI Riser
CPU#5 x x #5 or #6#3 PCIe slot #9 hot-plug
CPU#6 x x PCIe slot #10 hot-plug
PCIe slot #11 hot-plug
PCIe slot #12 hot-plug
CPU#7 x #7 or #8#4 PCIe slot #17 Gen2x4
CPU#8 x PCIe slot #13
PCIe slot #14
PCIe slot #15
PCIe slot #16
Table 7: Mapping of PCIe slots to I/O Hubs and CPUs
Page 40
40 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.3.3 Expansion card configuration table
Expansion cards require I/O space for Legacy Booting and for OS running. Due
to the limitation of I/O space, see "I/O space limitation" on page 43, the basic
rules for installing expansion cards are:
1. Begin with the installation of the SAS and SAS RAID controllers in order of
I/O space assignment order.
2. Continue with the installation of the expansion cards for LAN and FC into the
PCIe slots.
Chipset IOH#1 IOH#2
Bus scan order 3 2156478
I/O space assignment order within
the I/O Hub (IOH)
12343 21
Hot-plug nnnnnnnn
Gen2 width x8x8x8x8x8x4x8x8
Slot # 12834567
Vendor Type PCIe Max #
LSI SAS 3Gb Gen1x4 3 x x x x x x
Cougar2 Gen 2x8 1 x
SAS
RAID
(WASAT)
Gen 2x8 2 x
(*1)x (*1)
x
(*1)x (*1)
x
(*1)x (*1)
Emulex 4G-FCx1 Gen 1x8 8 x x x x x x
4G-FCx2 Gen 1x8 8 x x x x x x
8G-FCx1 Gen 2x8 8 x x x x x x
8G-FCx2 Gen 2x8 8 x x x x x x
FCoE Gen 2x8 8 x x x x x x
Intel GbEx1 Gen 1x4 8 x x x x x x
GbEx2 Gen 1x4 8 x x x x x x
GbEx4 Gen 1x4 8 (*2) (*2) x x x x
10GbEx2 Gen 2x8 8 x x x x x x
Table 8: Expansion card installation recommendation I/O Hubs IOH#1 and IOH#2
Page 41
D3081, D3131, D3082 (RX900 S1) Technical Manual 41
Features
*1) The SAS RAID controller shall not be installed in PCIe slot #1 to #7 on the
PCI Riser when a BBU is connected because of limited length of the BBU cable.
*2) The Quad LAN card consumes twice as much I/O space as a standard
expansion card because it includes a bridge within the card. If you install this
card into slot#1 or slot#2, no I/O resource will be assigned to the onboard GbE
controller.
Chipset IOH#3 IOH#4
Bus scan order 12 11 10 9 17 16 15 14 13
I/O space assigning order within
the I/O Hub (IOH)
12 12
Hot-plug yyyynnnnn
Gen2 width x8x8x8x8x8x8x8x8x4
Slot # 9 10 11 12 13 14 15 16 17
Vendor Type PCIe Max #
LSI SAS 3Gb Gen1x4 3 x x x x
Cougar2 Gen 2x8 1
SAS
RAID
(WASAT)
Gen 2x8 2 x x
Emulex4G-FCx1Gen 1x88 xxxxxxxx
4G-FCx2Gen 1x88 xxxxxxxx
8G-FCx1 Gen 2x8 8 2 2 2 2 x x x x
8G-FCx2 Gen 2x8 8 2 2 2 2 x x x x
FCoE Gen 2x8 8 2 2 2 2 x x x x
Intel GbEx1 Gen 1x48 xxxxxxxxx
GbEx2 Gen 1x48 xxxxxxxxx
GbEx4 Gen 1x48 3333xxxx
10GbEx2 Gen 2x8 8 3 3 3 3 x x x x
Table 9: Expansion card installation recommendation I/O Hubs IOH#3 and IOH#4
Page 42
42 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
3.4 I/O space
I/O space is required for the hardware itself, Legacy OPROM, EFI driver, and
OS driver, see figure 11.
Figure 11: I/O space requirement
3.4.1 I/O space requirements
Figure 11 lists the I/O space requirements where "x" indicates that I/O space is
required. Please note that I/O space assignment is only needed if Legacy LAN
Boot(PXE, iSCSI) and an LSI SAS/SAS_RAID card is used.
PCIe card
Firmware
Option
ROM
(Legacy)
EFI
Driver
BIOS
Legacy
OS
EFI-aware
OS
CSM
Firmware
Page 43
D3081, D3131, D3082 (RX900 S1) Technical Manual 43
Features
*1) WinPE does not require I/O space but some drivers require I/O space for
loading properly.
*2) When both Legacy OPROM and EFI driver are available, the BIOS loads the
EFI driver and the Legacy service is provided by the CSM module, that is the
Legacy OPROM is not loaded.
3.4.2 I/O space limitation
The I/O space is limited to 64 KB. Each PCI Bridge assigns its I/O space in
several blocks of 4 KB. ICH10 requires 1-block for Legacy support.
Auto and Disabled can be selected in the BIOS setup menu to assign I/O space
for onboard devices and for PCIe slots including slot #8 for the Modular RAID
controller. Auto is set for all onboard devices and PCIe slots by default.
Device Hardware Operating system
I/O space
is
requested
in config.
space
Option
ROM
(legacy)
EFI
driver
(EFI
native)
DOS Win
PE
(*1)
Linux
5.4
Windows
32&64bit
VM
ware
Intel
GbE
x x -- -- -- -- -- --
Intel
10GbE
x x -- -- -- -- -- --
LSI
SAS
xxxxx--xx
LSI
SAS
RAID
xxxx--x--x
Emulex FCx x (*2) -- -- -- -- -- --
Table 10: I/O space requirement
Page 44
44 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
The I/O space resource distribution to each I/O Hub depends on the number of
recognized I/O Hubs:
● 4 CPUMEMRs
There is no limitation for assigning I/O space.
● 6 or 8 CPUMEMRs
If many expansion cards are installed which require I/O space, the BIOS may
not assign I/O space for all devices. You have to enter the BIOS Setup menu
and to disable the assignment of I/O space for devices that do not need I/O
space under OS operation.
Ta b le 1 1 lists the I/O space assignment for individual CPU configurations. In the
BIOS Setup menu, you can choose from the following settings for the device per
slot:
● Auto: I/O space is assigned when the device requests for it.
● Disabled: I/O space is not assigned even if the device requests for it.
If you specify auto, the I/O space is assigned in descending order of the PCI-bus
number within each I/O Hub until no I/O space is left.
Page 45
D3081, D3131, D3082 (RX900 S1) Technical Manual 45
Features
Device /
slot
I/O
Hub
I/O space block (4 KB each) Remark
4 CPUs 6 CPUs 8 CPUs Assign
order
ICH
(Legacy,
SATA),
VGA
#1 x x x 1 This block is
mandatory for
Legacy
Support.
GbE#1 x x x 8 Do not disable
I/O space
assignment to
this device if
you use PXEboot from the
Onboard-LAN
controller as
the Intel Boot
Agent ROM
requires I/O
space.
GbE#2 x x x 7
Modular
RAID
controller
slot #8
x x x 6 Cougar2
controller
requires I/O
space for
operation.
GbE#3 x x x 5 Do not
disabled I/O
space
assignment to
this device if
you use PXEboot from
Onboard-LAN
as the Intel
Boot Agent
ROM requires
I/O space.
10GbE#1 x x x 4
Table 11: I/O space assignment for 4, 6, and 8 CPU configurations
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Features
PCIe slot #2#1 x x x 3
PCIe slot
#1
xxx2
PCIe slot #3#2 Max 8 Max 4 Max 4 4
PCIe slot
#4
3
PCIe slot
#5
5
PCIe slot
#6
2
PCIe slot
#7
1
PCIe slot #9#3 IOH #3 not
recognized
Max 4 Max 2 1
PCIe slot
#10
2
PCIe slot
#11
3
PCIe slot
#12
4
Device /
slot
I/O
Hub
I/O space block (4 KB each) Remark
4 CPUs 6 CPUs 8 CPUs Assign
order
Table 11: I/O space assignment for 4, 6, and 8 CPU configurations
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D3081, D3131, D3082 (RX900 S1) Technical Manual 47
Features
PCIe slot
#13
#4 IOH #4 not
recognized
IOH #4 not
recognized
Max 2 1
PCIe slot
#14
2
PCIe slot
#15
3
PCIe slot
#16
4
PCIe slot
#17
5
Sum Max 16 Max 16 Max 16
Device /
slot
I/O
Hub
I/O space block (4 KB each) Remark
4 CPUs 6 CPUs 8 CPUs Assign
order
Table 11: I/O space assignment for 4, 6, and 8 CPU configurations
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3.5 Screen resolutions
The screen resolution that applies to the internal graphics controller depends on
the operating system in use, see table 12.
3.6 Temperature / System monitoring
Temperature and system monitoring aims to reliably protect the hardware from
overheating and to provide information on the system state. It also prevents
unnecessary noise by reducing the fan speed.
Temperature and system monitoring is controlled by an onboard controller that
supports the following functions:
Temperature monitoring
Measuring the processor temperature and ambient temperature by way of a
temperature sensor.
Fan monitoring
The fans are monitored. Fans that are blocked, sluggish or no longer available
are detected.
Screen resolution
(pixel)
Refresh rate (Hz) No. of bits per pixel
32x400 85 4 bpp, 8 bpp
640x480 85 4 bpp, 8 bpp, 16 bpp, 32 bpp
800x600 85 4 bpp, 8 bpp, 16 bpp, 32 bpp
1024x768 75 8 bpp, 16 bpp, 32 bpp
1152x864 60 8 bpp, 16 bpp
1280x1024 60/70/75/85 16 bpp
1280x1024 60 24 bpp
1600x1200 60 8 bpp, 16 bpp
Table 12: Screen resolution of the internal graphic controller
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D3081, D3131, D3082 (RX900 S1) Technical Manual 49
Features
Fan control
The speed of the fans are regulated according to temperature. Maximum speed
will only be achieved when switching the server on and in case of a fan test.
Sensor monitoring
Any fault in, or the removal of, a temperature sensor is detected. Should this
happen, all fans monitored by this sensor run at maximum speed to ensure the
highest possible protection of the hardware.
Voltage monitoring
When the voltage exceeds or falls below the warning levels, an alert is issued.
System Event Log (SEL)
All monitored events of the system board are signalized via the Global Error
LED or CSS LED and recorded in the System Event Log. They can be retrieved
in the iRMC S2’s Web interface or via the ServerView Operations Manager.
3.7 Connectors and indicators
This section provides an overview of:
● "Onboard connectors and indicators" on page 50
● "External connectors and indicators" on page 57
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3.7.1 Onboard connectors and indicators
3.7.1.1 Baseboard D3081
Figure 12 shows the onboard connectors on the baseboard where the individual
connectors are named in table 13.
Figure 12: Onboard connectors baseboard D3081
$#! "
D
CAC
B
C
C
C
D
C
E
C
F
C
G
C
H
C
I
C
J
C
K
C
L
C
M
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D3081, D3131, D3082 (RX900 S1) Technical Manual 51
Features
Figure 13 shows the indicators on the baseboard where the individual indicators
are named in table 14.
Pos. Connector Pos. Connector
A PCI Riser H Chassis ID board
B I/O board I Operator panel
C PCIe slots on the baseboard J Power distribution board
D Trusted Platform Module
(TPM)
K Front video connector
E USB Flash Module (UFM) L Front USB connector
F FAN M SATA optical disk drive
G CPU Memory Riser
Table 13: Onboard connectors baseboard D3081
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Figure 13: Indicators on the baseboard D3081
All the indicators are only visible after the cover has been removed.
If the server has been powered off (power-plugs must be disconnected), it is
possible to indicate the faulty component by pressing the indicate CSS button
located on the PCI Riser.
Pos. Indicator Pos. Indicator
A BMC heart beat C PCI hot-plug power/fault
B POST code D PCIe CSS
Table 14: Connectors on the baseboard D3081
$#! "
C
A
C
B
C
C
C
D
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Features
3.7.1.2 CPU Memory Riser (CPUMEMR) D3131
Figure 14 shows the onboard connectors and indicators on the CPUMEMR
where the individual connectors and indicators are named in table 15.
Figure 14: Onboard connectors and indicators CPUMEMR D3131
Pos. Connector Pos. Indicator
A CPU C DIMM, CPU, CPUMEMR
CSS
BCPUMEMR
Table 15: Onboard connectors and indicators CPUMEMR D3131
B1C
1D
1E
1F
1G
1H
1A
1B
B
2C
2D
2E
2F
2G
2H
2A
2B
CPU
1B
1D
1A
1C
2B2D2A
2C
1E1G2F
2H
1F
1H
2E
2G
CPUMEMR
C
A
C
B
C
C
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Features
3.7.1.3 PCI Riser (PCIR) D3082
Figure 15 shows the onboard connectors and indicators on the PCIR where the
individual connectors and indicators are named in table 16.
Figure 15: Onboard connectors and indicators PCIR D3082
Pos. Connector Pos. Indicator
A PCIe slots C PCIe CSS
B PCIR D CSS button
Table 16: Onboard connectors and indicators PCIR D3082
12
3
46
75
C
A
C
B
C
C
C
D
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D3081, D3131, D3082 (RX900 S1) Technical Manual 55
Features
3.7.1.4 I/O board
Figure 16 shows the onboard connector on the I/O board.
Figure 16: Onboard connector on the I/0 board
3.7.2 Onboard DIP switch
Figure 17 shows the position of the DIP switch where the DIP switch settings
are named in table 17.
I Default setting: Switches 1 to 4 are set to Off.
Pos. Connector
A 1x USB connector
C
A
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Figure 17: Position of the DIP switches
I Password skip
Switch 2 is used to define whether the password is skipped at system
startup, if the password protection is enabled in the BIOS Setup (in
Security menu, the Password on boot field must be set to Enabled).
No. Function Setting Description
1-1 Not used
1-2 Password SKIP On Password skip enabled
Off Password skip disabled
1-3 BIOS Write
Protect
On BIOS can only be read
Off BIOS can both be read and
written to
1-4 CMOS clear On BIOS should clear CMOS area
Table 17: DIP switch settings
ON
1-1
1-2
1-3
1-4
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D3081, D3131, D3082 (RX900 S1) Technical Manual 57
Features
3.7.3 External connectors and indicators
3.7.3.1 Baseboard D3081
Figure 18 shows the external connectors and indicators on the baseboard
where the individual connectors and indicators are named in table 18. The LAN
indicators are explained in table 19.
Figure 18: External connectors of the baseboard D3081
Pos. Port
Nr.
Connector Pos. Indicator
A -- 1x 100 MB Management
LAN controller
(indicator description
table 19)
C Global error indicator
(orange), CSS indicator
(yellow), ID indicator (blue)
A #1 1x GB Shared LAN
controller
(indicator description
table 19)
A #2 - #6 5x GB System LAN
controller
(indicator description
table 19)
Table 18: External connectors on the baseboard D3081
C
A
C
B
C
C
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The system is equipped with one Dual 10 GB Ethernet Controller type Intel
82599. In addition, three Dual 1 GB Ethernet Controller type Intel 82576 NS
(system LAN) are installed supporting transmission rates of 10 Mbit/s,
100 Mbit/s, and (only for system LAN) 1 Gbit/s.
The 1Gb Ethernet LAN controllers support WoL functionality by means of Magic
Packet™. It is also possible to boot a system without its own boot hard disk via
LAN. PXE is supported for this.
The separate management LAN connector is used as a management interface
(iRMC S2) and is prepared for operation with the Remote Management.
Figure 19 shows the LAN indicators and table 19 explains how the LAN
indicators indicate the state of the connection and the transfer rate.
Figure 19: LAN indicators
B #7 - #8 2x 10 GB System LAN
controller
(indicator description
table 19)
Pos. Port
Nr.
Connector Pos. Indicator
Table 18: External connectors on the baseboard D3081
C
F
C
C
C
C
C
D
C
G
C
ECA
CBCACBCAC
B
CAC
B
C
A
C
B
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D3081, D3131, D3082 (RX900 S1) Technical Manual 59
Features
Pos. Indicator Function Description
A Activity LAN link/transfer
(1 GB system LAN)
Steady green signal:
LAN connection exists.
Remains dark: no LAN
connection exists.
Flashes green: LAN transfer
takes place.
B 10/100/1000 LAN speed
(1 GB system LAN)
Steady yellow signal:
LAN transfer rate of 1 Gbit/s.
Steady green signal: LAN
transfer rate of 100 Mbit/s.
Remains dark: LAN transfer
rate of 10 Mbit/s.
C 10G LAN link/transfer
(10 GB system LAN)
Steady green signal:
LAN connection exists.
Remains dark: no LAN
connection exists.
Flashes green: LAN transfer
takes place.
D 10/100/1000 LAN speed
(shared LAN)
Steady yellow signal:
LAN transfer rate of 1 Gbit/s.
Steady green signal: LAN
transfer rate of 100 Mbit/s.
Remains dark: LAN transfer
rate of 10 Mbit/s.
E Activity LAN link/transfer
(shared LAN)
Steady green signal:
LAN connection exists.
Remains dark: no LAN
connection exists.
Flashes green: LAN transfer
takes place.
Table 19: LAN indicators
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Features
F 10/100 LAN speed
(management LAN)
Steady green signal: LAN
transfer rate of 100 Mbit/s.
Remains dark: LAN transfer
rate of 10 Mbit/s.
G Activity LAN link/transfer
(management LAN)
Steady green signal:
LAN connection exists.
Remains dark: no LAN
connection exists.
Flashes green: LAN transfer
takes place.
Pos. Indicator Function Description
Table 19: LAN indicators
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D3081, D3131, D3082 (RX900 S1) Technical Manual 61
Features
3.7.3.2 I/O board
Figure 20 shows the external connectors on the I/O board where the individual
connectors and indicators are named in table 20.
Figure 20: External connectors on the I/O board
The serial connector COM1 can be used as default interface or to communicate
with the iRMC S2.
Pos. Connector
A4x USB
BSerial COM1
C Video
Table 20: External connectors on the I/O board
C
A
C
C
C
B
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Features
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D3081, D3131, D3082 (RX900 S1) Technical Manual 63
4 Replacing the lithium battery
To allow permanent saving of the system information, a lithium battery is
installed which supplies the CMOS memory with power. If the battery voltage is
too low or the battery is empty, a corresponding error message is displayed. The
lithium battery must then be replaced. The replacement procedure is explained
in the "PRIMERGY RX900 S1 Server Maintenance Manual".
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64 Technical Manual D3081, D3131, D3082 (RX900 S1)
Replacing the lithium battery
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