Page 1
u
jitsu 3.2 T
B Flas
h Accelerato
r Car
d
User's Guide
For Product Models 7119601 and 7119603
Fujitsu 3.2 TB Flash Accelerator Card
User's Guide
For Product Models 7119601 and
7119603
C120-0067-02EN
Page 2
Preface
Preface
This document describes the Fujitsu 3.2 TB Flash Accelerator Card for product models 7119601 and
7119603, which may be mounted on the Oracle or Fujitsu SPARC M12/M10 system.
Before you read this document, we recommend reading the
M10/SPARC M10 Systems Quick Guide
Fujitsu SPARC
Fujitsu SPARC M12 and SPARC M12 are identical products.
Fujitsu M10 is sold as SPARC M10 by Fujitsu in Japan.
Fujitsu M10 and SPARC M10 are identical products.
The preface includes the following sections:
- Using the Product Safely
- Organization and Contents of This
- Related Manuals
- Text Conventions
- Warning/Importance Indications
- Document Feedback
- Revision History
M12 is sold as SPARC M12 by Fujitsu in Japan.
.
Manual
Fujitsu SPARC M12 Quick Guide
or
Fujitsu
Using the Product Safely
Handling of This Manual
This manual contains important information necessary for using this product safely. Read this manual and
the manuals described in "Related Manuals" thoroughly before using the product. In particular, before
attempting to use the product, carefully read and understand the safety precautions described in these
various manuals.
Keep this manual in
Fujitsu makes every effort to prevent injury to users and bystanders as well as property damage. Be sure to
use the product in accordance with the instructions in this manual.
Product Notice
This product is designed and manufactured for use in standard applications such as office work, personal
devices, and general industrial use. This product is not intended for special uses (nuclear-reactor control in
atomic energy facilities, aeronautic and space systems, air traffic control, operation control in mass transit
systems, life support, or
where the pertinent levels of safety are not guaranteed, or where a failure, an operational error, or some
other factor could be life-threatening or cause a physical injury (referred to below as "high-risk" use).
Customers considering the use of this product
measures in place beforehand. Moreover, they are requested to consult our sales representative before
embarking on such specialized use.
Security Export Control
Exportation/release of this document may require necessary procedures in accordance with the regulations
the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
of
a safe and convenient location for quick reference.
missile launch controls) where particularly high reliability requirements exist,
for high-risk applications must have safety-assurance
C120-0067-02ENi
Page 3
Preface
FCC Class B Notice
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the
Note
-
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions,
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try
interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/television technician for
FCC WARNING
could void the user's authority to operate the equipment.
Changes or modification not expressly approved by the party responsible for compliance
-
ICES-003 Class B Notice - Avis NMB-003, Classe B
CAN ICES-3 (B) / NMB-3 (B)
Korean Class B Notice
This equipment is home use electromagnetic wave suitability equipment and to be used mainly at home
and it can be used in all areas.
이기기는가정용전자파적합기기로서주로가정에서사용하는것을목적으로하며, 모든지역에서사용할수있습
.
니다
limits for a Class B digital device,
may cause harmful
to correct the
help.
Trademarks
-Oracle is a registered trademark of Oracle Corporation and/or its subsidiaries and affiliates in the
United States and other countries.
- SAMSUNG, PM1725a, and PM1725b are trademarks of SAMSUNG ELECTRONICS.
- Other company names and product names are the trademarks or registered trademarks of their
respective owners.
- Trademark indications (TM, (R)) are omitted for
This document shall not be reproduced or copied without the permission of Fujitsu Limited.
All Rights Reserved, Copyright (C) Fujitsu Limited 2018, 2019
some system and product names in this document.
Organization and Contents of This Manual
This document consists of the following chapters and appendixes.
Chapter 1 Overview
This chapter provides an overview of the Fujitsu 3.2 TB Flash Accelerator Card.
Chapter 2 Fujitsu 3.2 TB Flash Accelerator Card Installation
C120-0067-02ENii
Page 4
Preface
This chapter provides information on installing the Fujitsu 3.2 TB Flash Accelerator Card.
Chapter 3 Fujitsu 3.2 TB Flash Accelerator Card Settings
This chapter describes how to configure the Fujitsu 3.2 TB Flash Accelerator Card.
Appendix A Precautions and Restrictions
This appendix describes precautions and restrictions on the Fujitsu 3.2 TB Flash
Appendix B Specifications
This appendix shows the specifications of the Fujitsu 3.2 TB Flash Accelerator Card.
Appendix C Environmental Information
This appendix provides environmental information on the Fujitsu 3.2 TB Flash Accelerator Card.
Related Manuals
All documents for your server are available online at the following locations.
■
Sun Oracle software-related documents (Oracle Solaris, etc.)
http://docs.oracle.com/en/
■
Fujitsu documents
Global site
http://www.fujitsu.com/global/products/computing/servers/unix/sparc/do wnloads/manuals/
Japanese site
http://www.fujitsu.com/jp/products/computing/servers/unix/sparc/downloads/manual/
Accelerator Card.
Text Conventions
■
Abbreviation for Oracle Solaris
Oracle Solaris may be abbreviated as "OS" in this document.
■
Prompts in command examples
In command examples, the environment or privilege for the operation is distinguished by the
displayed prompt. The following table shows the relationship between prompts and environments/
privileges for operations.
Prompt Environment/Privilege for Operation
{0} ok OpenBoot PROM
XSCF> XSCF shell
$ General user shell for OS
# Superuser shell for OS
Warning/Importance Indications
This manual uses the following indications to provide warnings and indicate useful information to the user
prevent personal injury and property damage.
to
C120-0067-02ENiii
Page 5
Preface
Warning – Indicates a hazardous situation that could result in death or injury if the product is not used
properly (a potentially dangerous situation).
Caution – Indicates a hazardous situation that could result in minor or moderate personal injury
and/or property damage, such as to the product itself or the user's property, if the product is not used
properly.
Warning Indications in the Text
Warning markings are followed by warning messages. A warning message is indented on the left and right
sides to distinguish it from regular text. Furthermore, the lines immediately before and after a warning
indication are left blank.
Ask a certified service engineer or our sales representative to perform the following tasks for this
product and the optional products provided by Fujitsu. The work must not be done by the customer
under any circumstances. Otherwise, electric shock, injury, or fire may result.
- New installation/relocation of the device
- Device
inspection/repair
Document Feedback
Please inform us of any comments or requests you may have about this document by contacting us at the
following URL with the manual number, manual title, page numbers, and specific details:
■
Global site
http://www.fujitsu.com/global/contact/
■
Japanese site
http://www.fujitsu.com/jp/products/computing/servers/unix/sparc/contact/
Revision History
Edition Date Changed Location (Change
01 April 10, 2018 - First edition
02 February 26,
2019
*1 The number/title of a changed chapter/section is the one in the latest version. However, the number/title
chapter/section with an asterisk is the one in the old version.
of a
Classification) (*1)
Whole manual (added/changed) Added "PM1725b" to types of flash cards
Appendix A (added) Added "A.9 Precaution on the nvmeadm list -s Command"
Description of Change
Changed card firmware version to "GPNA5B3Q" or "GPJA0B3Q"
C120-0067-02ENiv
Page 6
Product Handling Precautions
Product Handling Precautions
Maintenance
Ask a certified service engineer or our sales representative to perform the following tasks for this
product and the optional products provided by Fujitsu. The work must not be done by the customer
under any circumstances. Otherwise, electric shock, injury, or fire may result.
- New installation/relocation of the device
- Device
Modifying or Recycling the Product
inspection/repair
Modifying this product or recycling and using a secondhand product may result in personal injury to
users and/or bystanders or damage to the product and/or other property.
Disposal or Recycling of Products at the End of Their Life Cycles
Waste must be disposed of in a professional and responsible manner in accordance with environmental
regulations. For details, please contact your nearest environmental authority or our sales representative.
Replacement Work Personnel
Only certified service engineers should perform replacement work. The work must not be done by the
customer under any circumstances.
Otherwise, electric shock, injury, or fire may result.
C120-0067-02ENv
Page 7
Contents
Contents
Preface
Product Handling Precautions
Chapter 1 Overview
………………………………………………………………………………………
……………………………………………………………
………………………………………………………
1.1 Product and Model Names
1.2 Components
1.3 Appearance
1.4 Functions
1.5 Control Driver
1.6 Operating Environment
1.7 Status Indicator LEDs
…………………………………………………………………………………
…………………………………………………………………………………
……………………………………………………………………………………
………………………………………………………………………………
………………………………………………………………
……………………………………………………………………
………………………………………………………………………
Chapter 2 Fujitsu 3.2 TB Flash Accelerator Card Installation
Chapter 3 Fujitsu 3.2 TB Flash Accelerator Card Settings
3.1 Checking the Fujitsu 3.2 TB Flash Accelerator Card
3.2 Optimizing the Fujitsu 3.2 TB Flash Accelerator Card
3.3 Checking Various Information on the Fujitsu 3.2 TB Flash Accelerator Card
……………………………………
…………………………………
…………
………
………
i
v
1
1
1
1
2
2
2
3
5
6
6
6
7
Appendix A Precautions and Restrictions
A.1 Restrictions on Oracle VM Server for SPARC
A.2 Restrictions on PHP/PPAR DR and Active Replacement
A.3 Disk Label Precaution
A.4 LBA Format Precaution
A.5 Precaution on OS Boot From FCode
A.5.1 Workaround
A.5.2 Corrective Action After Occurrence
A.6 Precaution on Installing an OS on the Fujitsu 3.2 TB Flash Accelerator Card
A.6.1 Workaround
A.6.2 Corrective Action After Occurrence
A.7 Precaution on the nvmeadm namespace -v Command
A.8 Restriction on the -n Option of the nvmeadm Command
A.9 Precaution on the nvmeadm list -s Command
A.10 Restriction on probe-nvme-all
……………………………………………………………………
……………………………………………………………………
……………………………………………………
…………………………………………………………………………………
………………………………………………………
…………………………………………………………………………………
………………………………………………………
……………………………………………………………
……………………………
…………………………………………
……………………………
………
………………………………
………………………………
…………………………………………
C120-0067-02ENvi
9
9
9
9
9
9
10
10
10
10
10
11
11
11
12
Page 8
Contents
A.11 fwupdate Command Precaution
Appendix B Specifications
B.1 Product Specifications
B.2 Physical Specifications
B.3 Environmental Specifications
B.4 Electrical Specifications
B.5 Performance Specifications
B.6 Reliability Specifications
………………………………………………
……………………………………………………………………
……………………………………………………………………
……………………………………………………………………
…………………………………………………………………
…………………………………………………………
……………………………………………………………
………………………………………………………………
Appendix C Environmental Information
C.1 Taiwan RoHS Declarations
C.2 China RoHS Declarations
C.3 For Indian e-waste Rules
………………………………………………………………
………………………………………………………………
…………………………………………………………………
………………………………
12
13
13
13
14
14
14
15
16
16
17
17
C120-0067-02ENvii
Page 9
Contents
Figure Table Contents
Figure Contents
Figure 1-1 Appearance of the Fujitsu 3.2 TB Flash Accelerator Card
Figure 1-2 Status Indicator LEDs
……………………………………………………………
……………………
2
3
C120-0067-02ENviii
Page 10
Contents
Table Contents
Table 1-1 Product and Model Names
Table 1-2 Components
Table 1-3 Operating Environment
Table 1-4 Fujitsu 3.2 TB Flash Accelerator Card Status Indicated by the Indicator LEDs
…………………………………………………………………………………………
Table B-1 Product Specifications
Table B-2 Physical Specifications
Table B-3 Environmental Specifications
Table B-4 Electrical Specifications
Table B-5 Performance Specifications
Table B-6 Reliability Specifications
Table C-1 Taiwan RoHS Declarations
Table C-2 China RoHS Declarations
…………………………………………………………………………
…………………………………………………………
……………………………………………………………
……………………………………………………………
……………………………………………………………
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1
1
3
4
13
13
14
14
14
15
16
17
C120-0067-02ENix
Page 11
Chapter 1 Overview
1.3 Appearance
Chapter 1
This chapter provides an overview of the Fujitsu 3.2 TB Flash Accelerator Card.
Overview
1.1 Product and Model Names
Table 1-1 lists the product and model names of the Fujitsu 3.2 TB Flash Accelerator Card.
Table 1-1 Product and Model Names
Item Description
Product name Fujitsu 3.2 TB Flash Accelerator Card
Model name 7119601 (ATO), 7119603 (X-option)
1.2 Components
Table 1-2 lists the components of the Fujitsu 3.2 TB Flash Accelerator Card.
Name Quantity Details
Fujitsu 3.2 TB Flash Accelerator
Card
Access to manuals for peripherals
CA92001-4965
（
Antistatic wrist strap 1
）
1.3 Appearance
Figure 1-1 shows the appearance of the Fujitsu 3.2 TB Flash Accelerator Card.
Table 1-2 Components
1 Mounted on a low-profile bracket.
1Written
leaflet containing the URL for manuals.
as a
1
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Page 12
Chapter 1 Overview
1.6 Operating Environment
Figure 1-1 Appearance of the Fujitsu 3.2 TB Flash Accelerator Card
1.4 Functions
The Fujitsu 3.2 TB Flash Accelerator Card provides the following functionality.
■
Through the adoption of the NVMe protocol, the card achieves higher-speed throughput compared
with conventional disk-based drive technologies.
■
The memory is 3.2 TB Triple Level Cell (TLC) flash. The OS recognizes it as one 3.2 TB disk.
■
System performance can improve significantly when the card is used for:
- a large-capacity read cache for databases, in combination with the Database Smart Flash Cache
function of Oracle Database Enterprise Edition
- a large-capacity read/write cache for ZFS file systems
■
The card can be used as the system boot drive.
■
Error monitoring and failure sign monitoring are possible with a standard tool of the OS.
■
The card is a suitable product for enterprises since a life of 5 DWPD x 5 years is guaranteed.
1.5 Control Driver
The nvme driver is bundled with the Oracle Solaris.
1.6 Operating Environment
Table 1-3 shows the operating environment of the Fujitsu 3.2 TB Flash Accelerator Card.
2
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Page 13
Chapter 1 Overview
1.7 Status Indicator LEDs
Table 1-3 Operating Environment
Configuration Details
Mounting server - SPARC M12-1, SPARC M12-2, SPARC M12-2S
- SPARC M10-1, SPARC M10-4, SPARC M10-4S
- PCI expansion unit
For the maximum number of mounted cards on each server, see the
M12 PCI Card Installation Guide
Installation Guide
Supported OS version Oracle Solaris
Supported XCP version - SPARC M12-1: XCP 3030 or later
- SPARC M12-2 and SPARC M12-2S: XCP 3021 or later
- SPARC M10: XCP 2320 or later
Card firmware version GPNA5B3Q or GPJA0B3Q
.
11.3 SRU 11.3.28.4.0 or later
or
the
Fujitsu SPARC
Fujitsu M10/SPARC M10 Systems PCI Card
1.7 Status Indicator LEDs
Figure 1-2 shows the indicator LEDs that indicate the status of the Fujitsu 3.2 TB Flash Accelerator Card.
Figure 1-2 Status Indicator LEDs
(1)
(2)
(3)
Table 1-4 lists the status of the Fujitsu 3.2 TB Flash Accelerator Card as shown by the indicators.
3
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Page 14
Chapter 1 Overview
1.7 Status Indicator LEDs
Table 1-4 Fujitsu 3.2 TB Flash Accelerator Card Status Indicated by the Indicator LEDs
No. Indicator LED Icon Color State Meaning
(1) Transfer Rate X8 Green On Linked up at PCIe x8
(2) Service Action Required
(3) Activity Signal ACT Green On Idle state
Off The status is either of the following:
- Linked up at PCIe x4
- No PCIe link established
Amber On An error occurred.
Off The status is either of the following:
- Operating normally
- Not powered on
Blinking I/O access in progress
Off The status is either of the following:
- Inoperable state
- Not powered on
4
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Chapter 2 Fujitsu 3.2 TB Flash Accelerator Card Installation
Chapter 2
For details on how to install the Fujitsu 3.2 TB Flash Accelerator Card, see "Maintaining the PCI Express
Cards" or "Maintaining PCIe Cards" in the following service manuals for the respective models of the
SPARC M12/SPARC M10 and the PCI expansion unit:
■
Fujitsu SPARC M12-1 Service Manual
■
Fujitsu SPARC M12-2/M12-2S Service Manual
■
Fujitsu M10-1/SPARC M10-1 Service Manual
■
Fujitsu M10-4/Fujitsu M10-4S/SPARC M10-4/SPARC M10-4S Service Manual
■
PCI Expansion Unit for Fujitsu SPARC M12 and Fujitsu M10/SPARC M10 Service Manual
Fujitsu 3.2 TB Flash Accelerator
Card Installation
C120-0067-02EN5
Page 16
Chapter 3 Fujitsu 3.2 TB Flash Accelerator Card Settings
3.2 Optimizing the Fujitsu 3.2 TB Flash Accelerator Card
Chapter 3
This chapter describes how to configure the Fujitsu 3.2 TB Flash Accelerator Card.
Fujitsu 3.2 TB Flash Accelerator
Card Settings
3.1 Checking the Fujitsu 3.2 TB Flash Accelerator Card
You can check the Fujitsu 3.2 TB Flash Accelerator Card in the same way as detecting a hard disk drive.
The command shown below is an example.
# /usr/sbin/format
Searching for disks...done
AVAILABLE DISK SELECTIONS:
2.
Specify disk (enter its number):
:
c9t1d0 <SAMSUNG-MZPLL3T2HMLS-000-GPNA-2.91TB>
/pci@8300/pci@4/pci@0/pci@1/nvme@0/disk@1
/dev/chassis/SYS/PCI#2/NVME/disk
3.2 Optimizing the Fujitsu 3.2 TB Flash Accelerator
Card
To obtain optimal performance, arrange all partitions to start on a 4 KB boundary.
In the following command example, the first sector of the partition is not aligned on a 4 KB boundary (1
sector = 512 bytes).
partition> print
Current partition table (original):
Total disk sectors available: 6251217517 + 16384 (reserved sectors)
Part
0
unassigned
1
unassigned
2
unassigned
3
unassigned
4
unassigned
5
Tag
usr
Flag
wm
wm 0 0
wm 0 0
wm 0 0
wm 0 0
wm 0 0
First Sector
34
Size
2.91TB
Last Sector
6251217550
0
0
0
0
0
6
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Chapter 3 Fujitsu 3.2 TB Flash Accelerator Card Settings
3.3 Checking Various Information on the Fujitsu 3.2 TB Flash Accelerator Card
unassigned
6
8
Note
wm 0 0
reserved
To align the first sector of the partition on a 4 KB boundary, use the format –e command to change the first
sector to an appropriate value.
-
By setting the first sector value to 256 or a value for aligning on a 128 KB boundary, you can ensure an
alignment for
wm
"256" is the setting at shipment. There is no need to change it.
a maximum block size of 128 KB.
6251217551
8.00MB
0
6251233934
3.3 Checking Various Information on the Fujitsu 3.2
TB Flash Accelerator Card
You can check various information on the Fujitsu 3.2 TB Flash Accelerator Card with the nvmeadm
command.
■
Checking the firmware version
# nvmeadm list -v
SUNW-NVME-1
PCI Vendor ID:
Serial Number:
Model Number:
Firmware Revision:
Number of Namespaces:
0x144d
S3GYNA0JA02542
SAMSUNG MZPLL3T2HMLS-00003
GPNA5B3Q
32
■
Checking SMART information
# nvmeadm getlog -h
SUNW-NVME-1
SMART/Health Information:
Critical Warning: 0
Temperature: 313 Kelvin
Available Spare: 100 percent
Available Spare Threshold: 10 percent
Percentage Used: 0 percent
Data Unit Read: 0x3d81f38 of 512k bytes.
Data Unit Written: 0x422bdab of 512k bytes.
Number of Host Read Commands: 0xf045bca
Number of Host Write Commands: 0x1027b4eb
Controller Busy Time in Minutes: 0x354
Number of Power Cycle: 0x2
Number of Power On Hours: 0x1c
Number of Unsafe Shutdown: 0x0
7
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Chapter 3 Fujitsu 3.2 TB Flash Accelerator Card Settings
3.3 Checking Various Information on the Fujitsu 3.2 TB Flash Accelerator Card
Number of Media Errors: 0x0
Number of Error Info Log Entries: 0x0
8
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Page 19
Appendix A Precautions and Restrictions
A.5 Precaution on OS Boot From FCode
Appendix A
Precautions and Restrictions
A.1 Restrictions on Oracle VM Server for SPARC
Do not use the following functions to assign the Fujitsu 3.2 TB Flash Accelerator Card to a guest domain.
■
Dynamic PCIe buses assignment function
■
Dynamic reconfiguration function for PCIe endpoint devices
■
Direct I/O function (function that assigns direct I/Os, DIOs, or PCle endpoints to domains)
A.2 Restrictions on PHP/PPAR DR and Active
Replacement
Active replacement and active addition/removal with the PCI Hot Plug (PHP) and physical partition dynamic
reconfiguration (PPAR DR) functions cannot be used.
A.3 Disk Label Precaution
Only the EFI disk label is supported because the size of the Fujitsu 3.2 TB Flash Accelerator Card is a disk
volume exceeding 2 TB.
A.4 LBA Format Precaution
The Fujitsu 3.2 TB Flash Accelerator Card supports only LBA formats with a block size of 512 bytes.
A.5 Precaution on OS Boot From FCode
On the SPARC M10, if you try to boot/reboot a logical domain after a certain amount of time has elapsed(*)
since physical partition (PPAR) power-on, the boot/reboot may fail.
This phenomenon does not occur on the SPARC M12.
9
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Page 20
Appendix A Precautions and Restrictions
A.6 Precaution on Installing an OS on the Fujitsu 3.2 TB Flash Accelerator Card
The phrase "after a certain amount of time has elapsed" has the following meaning:
Note
-
(1) The 15-minute period after the elapse of "24 days, 20 hours, 16 minutes, and 23.648
seconds" (25th day) from physical partition (PPAR) power-on
(2) The 15-minute period after the elapse of above time (1) and
"24 days, 20 hours, 31 minutes, and 23.648 seconds" (50th day, 75th day, and so on)
the elapse of a multiple of time of
A.5.1 Workaround
Apply XCP 2330 or later.
A.5.2 Corrective Action After Occurrence
If the system does not stop at the ok prompt, apply break to the target domain to stop at an ok prompt. After
minutes have passed, execute the boot command again.
15
A.6 Precaution on Installing an OS on the Fujitsu 3.2
TB Flash Accelerator Card
Installation of an OS on the Fujitsu 3.2 TB Flash Accelerator Card may cause the following message to be
output, and the card may not appear as an OS possible installation destination.
WARNING: Fail to attach: 8192 page size is not supported by the controller.
A.6.1 Workaround
To install an OS on the Fujitsu 3.2 TB Flash Accelerator Card, use an OS installation image with Oracle
Solaris 11.3 SRU 28.4 or later already applied.
You can create the OS installation image by using distro_const.
For details on creating a custom Oracle Solaris 11 installation image for Oracle Solaris 11.3,
Creating a Custom Oracle Solaris 11.3 Installation Image
A.6.2 Corrective Action After Occurrence
None
.
see the
10
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Page 21
Appendix A Precautions and Restrictions
A.9 Precaution on the nvmeadm list -s Command
A.7 Precaution on the nvmeadm namespace -v
Command
Not "1" but rather "32" appears as the namespace ID.
# nvmeadm namespace -v
SUNW-NVME-1-NAMESPACE-1
#
Namespace: 32
Block Size: 512
Capacity: 3200631791616
Metadata Size: 0
Block Device Name: /dev/rdsk/c11t1d0s2
Status: online
Nac Name: /dev/chassis/SYS/PCI#2/NVME/disk
A.8 Restriction on the -n Option of the nvmeadm
Command
When specifying each namespace individually with the nvmeadm namespace, online, or other command,
specify and execute the -a option + namespace, not the -n option + namespace ID.
The following example shows execution of nvmeadm online.
# nvmeadm online -a SUNW-NVME-1-NAMESPACE-1
A.9 Precaution on the nvmeadm list -s Command
The command displays incorrect PCIe IDs.
# nvmeadm list -s
SUNW-NVME-1
#
PCI Vendor ID:
PCI Device ID:
PCI Subsystem Vendor ID:
PCI Subsystem ID:
Oracle Part Number:
Oracle Model Number:
0x3052
0x3130
0x0405
0x1620
11
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Page 22
Appendix A Precautions and Restrictions
A.11 fwupdate Command Precaution
The actual PCIe IDs are as follows.
PCI Vendor ID:
PCI Device ID:
PCI Subsystem Vendor ID:
PCI Subsystem ID:
0x144d
0xa822
0x144d
0xa814
A.10 Restriction on probe-nvme-all
The probe-nvme-all command cannot be used.
To confirm that the Fujitsu 3.2 TB Flash Accelerator Card is recognized on the OpenBoot PROM
environment, use the show-devs command.
A.11 fwupdate Command Precaution
The fwupdate list controller command does not display "NVMe" but rather "SAS" for Type. The command
shown below is an example.
# fwupdate list controller
==================================================
CONTROLLER
==================================================
ID
BIOS Version
XML Support
---------------------------------------------------------------------------------
---------------------------------------------------------------------------------
--------
:
c1
- - - -
Type
SAS
Manufacturer
EFI Version
Samsung
Model
FCODE Version Package Version NVDATA Version
0xa822
Product Name
SAMSUNG MZPLL3T2HMLS-00003GPNA5B3Q
FW
Version
-
N/A
12
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Page 23
Appendix B Specifications
B.2 Physical Specifications
Appendix B
Specifications
B.1 Product Specifications
Table B-1 Product Specifications
Item Specifications
Capacity 3.2 TB, LBA: 6,251,233,967
Form factor Half-height half-length standard connector
Interface PCI Express Gen3 x8
NAND type SAMSUNG TLC V-NAND (V3 and V4)
Safety/Radio wave standards
Environmental standard RoHS
Compliance PCI Express Base Specification Rev. 3.0
Thermal throttling 80ºC or higher: Throttling begins (warning)
Encryption function Not supported
cUL, CE, KCC, VCCI, TUV-GS, CB, FCC, RCM, ICES
NVM Express Specification Rev. 1.2
Enterprise SSD Form Factor Ver. 1.0a
87ºC or higher: Full throttling
95ºC or higher: Shutdown
B.2 Physical Specifications
Table B-2 Physical Specifications
Item Specifications
Width 69.9 mm
Length 167.65 mm
Height 18.71 mm
Weight 310 g
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Appendix B Specifications
B.5 Performance Specifications
B.3 Environmental Specifications
Table B-3 Environmental Specifications
Item Specifications
Temperature Operating: 0 to 55ºC
Non-operating: -40 to 85ºC
Relative humidity Operating: 8 to 80% (no condensation)
Non-operating: 5 to 95% (no condensation)
Impact 1,500 G/0.5 msec
Vibration 20 G RMS (10 to 2,000 Hz)
Airflow 300 LFM@55ºC
B.4 Electrical Specifications
Table B-4 Electrical Specifications
Item Specifications
Operating voltage range 12 V (±10%)
Maximum power consumption
Read: 23 W
Write: 22 W
Idle: 8 W
B.5 Performance Specifications
Table B-5 Performance Specifications
Item Specifications
Throughput performance Sequential Read (128 KB): 6,200 MB/s
Sequential Write (128 KB): 2,600 MB/s
I/O access performance Random Read (4 KB): 1,000 KIOPS
Random Write (4 KB): 170 KIOPS
Random Read (8 KB): 750 KIOPS
Random Write (8 KB): 105 KIOPS
Latency Random Read/Write: 120/20 µs
Sequential Read/Write: 110/30 µs
Drive ready time: 2 sec
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Appendix B Specifications
B.6 Reliability Specifications
Table B-5 Performance Specifications (continued)
Item Specifications
Quality of service Read/Write (99%): 160/100 µs
Performance consistency Read/Write (99.9%): 98/84%
B.6 Reliability Specifications
Table B-6 Reliability Specifications
Item Specifications
17
Uncorrectable bit error rate 1 sector per 10
MTBF 2,000,000 hours
Life 5 years
Endurance 5 DWPD
Data retention period 3 months
Data protection at power
outage
Available
bits read
15
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Appendix C Environmental Information
C.1 Taiwan RoHS Declarations
Appendix C
Environmental Information
C.1 Taiwan RoHS Declarations
Table C-1 Taiwan RoHS Declarations
設備名稱：固態硬碟, 型號（型式）：
Equipment name
Restricted substances and its chemical symbols
單元
Unit
電子零組件
Component
電路板
PCB
錫膏
Solder Paste
主動及被動零
組件
Passive &
Active Device
次要零組件
Subsidiary parts
備考1. 〝超出
Note 1: "Exceeding 0.1 wt %" and "exceeding 0.01 wt %" indicate that the percentage content of the restricted
substance exceeds the reference percentage value of presence condition.
備考2. 〝○〞係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "○" indicates that the percentage content of the
reference value of presence.
備考3. 〝－〞係指該項限用物質為排除項目。
Note 3: The "-" indicated that the restricted substance corresponds to the exemption.
0.1 wt %
鉛
Lead
(Pb)
○○○○○ ○
○○○○○ ○
○○○○○ ○
－○○○○ ○
○○○○○ ○
〞及〝超出
汞
Mercury
(Hg)
0.01 wt %
〞係指限用物質之百分比含量超出百分比含量基準值。
Type designation (Type)
限用物質及其化學符號
鎘
Cadmium
(Cd)
restricted substance does not exceed the percentage of
3.2TB Flash Accelerator Card
六價鉻
Hexavalent
chromium
(Cr+6)
多溴聯苯
Polybrominated
biphenyls
(PBB)
多溴二苯
Polybrominated
diphenyl ethers
醚
(PBDE)
16
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Appendix C Environmental Information
C.3 For Indian e-waste Rules
C.2 China RoHS Declarations
该标
志是不是按照国际惯例
限制性使用不当管理办法办法]以及
国销售的电器电子产品环保使用期限的标识。常遵守关于该产品的安全及使用上的注意事
该
期限内(从生产日期起算不了
境污染以及对岸人体或
财产产
报
2016
年
SJ/T11364[
该产
)
品不会因产品中的有害物质泄露或突然发生的异
生重大影响。
报
1
21
月
日报公布于的确
电子电气产
电器电子产
[
品有害物质限制使用标识要求]在案中
品有害无益物质财富
变
,
而引起
Table C-2 China RoHS Declarations
有毒有害物质或元素
铬
铅
部件名称
元器件
Component
印刷电路板
PCB
锡
膏
Solder Paste
主被动元器件
Passive &
Active Device
附属品
Subsidiary parts
○: 表示该有毒有害物质在该部件所有均质在该部件所有均质材料中的含量均在
Indicates that the concentration of the hazardous substance in all homogeneous materials in the parts is below the
relevant threshold of the GB/T26572.
×:
表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
Indicates that the concentration of the hazardous substance of at least
above the relevant threshold of the GB/T26572.
Lead
(Pb)
○○○○○ ○
○○○○○ ○
○○○○○ ○
×
○○○○○ ○
汞
Mercury
(Hg)
○○○○ ○
镉
Cadmium
(Cd)
六价
Hexavalent
chromium
(Cr6+)
GB/26572
GB/26572
规
定的限量要求。
one of all homogeneous materials in the parts is
多溴联苯
Polybrominated
biphenyls
(PBB)
规
定的限量要求以下。
多溴二苯
Polybrominated
diphenyl ethers
(PBDE)
项
醚
,
在
环
C.3 For Indian e-waste Rules
■
This product does not contain 6 hazardous substances in accordance with article 16(1) in "The
e-waste (Management) Rules, 2016."
■
This symbol means that used electrical and electronic products should not be dropped in garbage bin
containing waste destined for disposal. Please dispose of this product appropriately by handling over
authorized collection center or registered dismantler or recycler. Disposing correctly will help to
to
protect human health and the environment.
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Appendix C Environmental Information
C.3 For Indian e-waste Rules
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