Fuji Electric 6MBI75U4A-120-50 Data Sheet

Page 1
1. Outline Drawing ( Unit : mm )
6MBI75U4A-120
2. Equivalent circuit
222555,,,222666
222777,,,222888
shows theoretical dimension.
111555,,,111 666
111 222
333
444
555 666
UUU VVV WWW
222333,,,222 444
777 888
999
111000
111111 111222
111999,,,222000222111,,,222222
111333,,,111 444
MS5F6027
111777 111888
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Gate-Emitter
Gate-Emitter
)
C
3. Absolute Maximum Ratings ( at Tc= 25oC unless otherwise specified
)
o
o
C
Maximum
Ratings
1200
±20 100
75 200 150
75 150 390
+150
-40 to +125
3.5
Units
V V
A
W
o
C
N m
Items
Collector-Emitter voltage Gate-Emitter voltage
Collector current
Collector Power Dissipation 1 device Junction temperature Storage temperature Isolation voltage Screw Torque (*1) All terminals should be connected together when isolation test will be done. (*2) Two thermistor terminals should be connected together, each other terminals should be connected together
(*3) Recommendable Value : 2.5 to 3.5 Nm (M5)
between terminal and copper base (*1) between thermistor and others (*2)
and shorted to base plate when isolation test will be done.
Symbols Conditions
VCES VGES
Ic Continuous
Icp 1ms
-Ic
-Ic pulse 1ms Pc Tj Tstg
Viso AC : 1min. 2500 VAC
-Mounting (*3)
Tc=25oC Tc=80
Tc=80oC
4. Electrical characteristics ( at Tj= 25oC unless otherwise specified
Items ConditionsSymbols
Zero gate voltage collector current
leakage current
threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
Inverter
Turn-off time
Forward on voltage
Reverse recovery time Lead resistance, terminal-chip (*4)
Resistance
B value B
Thermistor
(*4) Biggest internal terminal resistance among arm.
ICES - - 1.0
IGES
VGE(th)
VCE(sat) (terminal) VCE(sat) (chip) Cies VCE=10V,VGE=0V,f=1MHz ­ton Vcc=600V - 0.32 1.20 tr Ic=75A - 0.10 tr(i) VGE=±15V - 0.03 ­toff RG=9.1Ω - tf - 0.07 0.30 VF (terminal) VF (chip) trr
R lead 4.10 - mΩ
R
VCE=1200V VGE=0V VCE=0V VGE=±20V VCE=20V Ic=75mA Ic=75A VGE=15V
IF=75A VGE=0V
IF=75A -
T=25oC T=100oC T=25/50oC
Tj=25oC Tj=125oC Tj=25oC Tj=125oC
Tj=25oC Tj=125oC Tj=25oC Tj=125oC
4.5
465 495 520
3305
Characteristics
typ.
- - 200
6.5 8.5
- 2.25 2.40
-
- 1.90 2.05
-
-
- 2.45 -
- 1.90 2.10
-
-
-
2.45
2.10 ­8 - nF
0.41 1.00
2.25 2.45
2.10 -
- 0.35
5000
3375 3450 K
max.
-
0.60
-
Units
mA
nA
V
V
us
V
us
Ω
MS5F6027
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)
5. Thermal resistance characteristics
Items Symbols Conditions Units
Thermal resistance(1device)
Contact Thermal resistance (1 device) (*5)
Rth(j-c)
Rth(c-f) with Thermal Compound
IGBT ­FWD - -
(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.
Characteristics
min. typ. max.
-
-
0.05
6. Indication on module
Logo of production
6MBI75U4A-120
75A 1200V
Lot.No. Place of manufacturing (code
7. Applicable category
This specification is applied to IGBT-Module named 6MBI75U4A-120.
0.32
0.73
-
o
C/W
8. Storage and transportation notes
Store modules in a place with few temperature changes in order to avoid condensation on the
o
C and humidity of 45 to 75% .
module surface.
Avoid exposure to corrosive gases and dust.
Avoid excessive external force on the module.
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
90%
0V
V
L
Vcc
R
G
V
GE
V
CE
Ic
GE
V
CE
Ic
0V 0A
t
r r
I
r r
Ic
90%
10%
10% 10%
t
r( i )
t
r
t
o n
V
CE
0V
90%
t
f
t
o f f
10. Packing and Labeling Display on the packing box
- Products quantity in a packing box
MS5F6027
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11. Reliabi li ty test results
High temp. 125
( 0 : 1 )
-5
Reliability Test Items
Test cate-
Test items Test methods and conditions
gories
1 Terminal Strength Pull force : 20N
(Pull test) Test time : 10±1 sec.
2 Mounting Strength Screw torque : 2.5 ~ 3.5 Nm (M5)
Test time : 10±1 sec.
3 Vibration Range of frequency : 10 ~ 500Hz
Sweeping time : 15 min. Acceleration :
100m/s Sweeping direction : Each X,Y,Z axis Test time : 6 hr. (2hr./direction)
4 Shock Maximum acceleration :
5000m/s Pulse width : 1.0msec. Direction : Each X,Y,Z axis Test time : 3 times/direction
Mechanical TestsEnvironment Tests
5 Solderabitlity Solder temp. : 235±5
Immersion time : 5±0.5sec. Test time : 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
6 Resistance to Solder temp. : 260±5
Soldering Heat Immersion time : 10±1sec.
Test time : 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
1 High Temperature Storage temp. : 125±5
Storage Test duration : 1000hr.
2 Low Temperature Storage temp. : -40±5
Storage Test duration : 1000hr.
3 Temperature Storage temp. : 85±2
Humidity Relative humidity : 85±5%
Storage Test duration : 1000hr.
4 Unsaturated Test temp. : 120±2
Pressurized Vapor Test humidity : 85±5%
Test duration : 96hr.
5 Temperature
Cycle Test temp. : Low temp. -40±5
2
Reference
norms
EIAJ ED-4701
(Aug.- 2001 edit ion)
Test Method 401
Method
Test Method 402
method
Test Method 403
Reference 1
Condition code B
2
Test Method 404 Condition code B
Test Method 303 Condition code A
Test Method 302 Condition code A
Test Method 201
Test Method 202
Test Method 103
Test code C
Test Method 103
Test code E
Test Method 105
Number
sample
of
Accept­ance number
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
( 0 : 1 )
5
( 0 : 1 )
5
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
6 Thermal Shock
±5
RT 5 ~ 35
Dwell time : High ~ RT ~ Low ~ RT
1hr. 0.5hr. 1hr. 0.5hr. Number of cycles : 100 cycles
+0
Test temp. :
High temp. 100
+5
Low temp. 0 -0℃ Used liquid : Water with ice and boiling water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles
MS5F6027
Test Method 307
method
Condition code A
5
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